WBCR00816003J [VISHAY]
Thin Film, Back-Contact Resistor; 薄膜，背接触电阻
| 型号： | WBCR00816003J |
| 厂家： | 
VISHAY |
| 描述： | Thin Film, Back-Contact Resistor |
| 文件： | 总3页 (文件大小：103K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
BCR
Vishay Electro-Films
Thin Film, Back-Contact Resistor
FEATURES
• Wire bondable
Product may not
be to scale
• Only one wire bond required
• Small size: 0.020 inches square.
• Resistance range: 10 Ω to 1 MΩ
• Oxidized silicon substrate for good power dissipation
• Resistor material: Tantalum nitride, self-passivating
• Moisture resistant
The Back Contact Resistor (BCR) series single-value
back-contact resistor chip is one of the smallest chips available.
The BCR requires only one wire bond thus saving hybrid space.
The BCRs are manufactured using Vishay Electro-Films
(EFI) sophisticated thin film equipment and manufacturing
technology. The BCRs are 100 % electrically tested and
visually inspected to MIL-STD-883.
APPLICATIONS
Vishay EFI BCR resistor chips are widely used in hybrid packages where space is limited. The bottom connection is made by
attaching the back of the chip to the substrate either eutectically or with conductive epoxy. The single wire bond is made to the
notched pad on the top of the chip. (The other rectangular pad on the top of the chip is a via hole, a low-ohmic contact connecting
the resistor to the bottom of the chip.)
TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES
Tightest Standard Tolerance Available
PROCESS CODE
2 % ꢀ %
1 % 0.2 % 0.ꢀ %
0.1 %
CLASS H*
CLASS K*
056
ꢀ2 ꢁꢁmꢂ/C
010
20 ꢁꢁmꢂ/C
002
061
100 ꢁꢁmꢂ/C
027
059
ꢀ20 ꢁꢁmꢂ/C
008
052
*MIL-PRF-38534 inspection criteria
360 kΩ
1 MΩ
6ꢀ0 kΩ
ꢀ00 kΩ
10 Ω ꢀ0 Ω 20 Ω 100 Ω ꢀ00 Ω 1 kΩ
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER
Noise, MIL-STD-ꢀ0ꢀ, Method 308
100 Ω - ꢀ20 kΩ
< 100 Ω or > ꢀ21 kΩ
- 35 dB typ.
- 20 dB typ.
Moisture resistance, MIL-STD-ꢀ0ꢀ
Method 106
0.5 % max. ΔR/R
Stability, 1000 h, + 1ꢀ2 /C, 1ꢀ2 mW
1.0 % max. ΔR/R
Oꢁerating Temꢁerature Range
- 55 °C to + 125 °C
Thermal Shock, MIL-STD-ꢀ0ꢀ,
Method 107, Test Condition F
0.25 % max. ΔR/R
High Temꢁerature Exꢁosure, + 120 /C, 100 h
Dielectric Voltage Breakdown
0.5 % max. ΔR/R
200 V
Insulation Resistance
1012 min.
Oꢁerating Voltage
75 V max.
DC Power Rating at + 70 /C (Derated to Zero at + 172 /C)
2 x Rated Power Short-Time Overload, + ꢀ2 /C, 2 s
250 mW
0.25 % max. ΔR/R
www.vishay.com
54
For technical questions, contact: efi@vishay.com
Document Number: 61023
Revision: 12-Mar-08
BCR
Thin Film, Back-Contact Resistor
Vishay Electro-Films
DIMENSIONS in inches
0.0ꢀ0
0.016
0.0ꢀ0
0.004
TYPICAL RANGE
TYPICAL RANGE
ꢀ4 Ω - ꢀꢀ0 Ω
TYPICAL RANGE
180 Ω - ꢀ.ꢀ kΩ
TYPICAL RANGE
1.6 kΩ - 1 MΩ
10 Ω - ꢀ3 Ω
Note:
• Notched shaded area represents top bonding pad. The backside of the chip constitutes the second resistor connection.
SCHEMATIC
Bond Pad
Back of Chiꢁ
MECHANICAL SPECIFICATIONS in inches
PARAMETER
Chip Size
0.020 x 0.020 0.002 (0.50 x 0.50 0.05 mm)
0.010 0.003 (0.253 0.05 mm)
Oxidized silicon, 10 kÅ minimum SiO2
Tantalum nitride, self-passivating
0.004 x 0.004 (0.100 x 0.100 mm)
1
Chip Thickness
Chip Substrate Material
Resistor Material
Bonding Pad Size
Number of Pads
Pad Material
10 kÅ minimum aluminum
Backing
3 kÅ minimum gold
Recommended Attachment Method
Eutectic or conductive epoxy
Oꢁtions: Gold bonding pads, 15 kÅ minimum thickness
Consult Applications Engineer
ORDERING INFORMATION
Example: 100 % visual, 16 kΩ, 1 %, 250 ppm/°C TCR, aluminum pads, class H visual inspection
W
BCR
PRODUCT
FAMILY
008
PROCESS
CODE
1600
RESISTANCE
VALUE
1
F
INSPECTION/
PACKAGING
MULTIPLIER
CODE
TOLERANCE
CODE
W = 100 % visually inspected
parts in matrix tray per
MIL-STD-883
X = Sample, visually inspected
parts loaded in matrix trays
(4 % AQL)
See Process Code
table
Use first 4 digits
significant digits of the
resistance
B = 0.01
A = 0.1
0 = 1
1 = 10
ꢀ = 100
3 = 1000
B = 0.1 %
C = 0.2 %
D = 0.5 %
F = 1.0 %
G = 2.0 %
H = 2.5 %
J = 5.0 %
K = 10 %
Document Number: 61023
Revision: 12-Mar-08
For technical questions, contact: efi@vishay.com
www.vishay.com
55
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 18-Jul-08
www.vishay.com
1
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