XBCP13111300B [VISHAY]

Fixed Resistor, Thin Film, 0.25W, 1130ohm, 0.1% +/-Tol, -100,100ppm/Cel, 0202;
XBCP13111300B
型号: XBCP13111300B
厂家: VISHAY    VISHAY
描述:

Fixed Resistor, Thin Film, 0.25W, 1130ohm, 0.1% +/-Tol, -100,100ppm/Cel, 0202

电阻器
文件: 总2页 (文件大小:212K)
中文:  中文翻译
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BCP  
Vishay Electro-Films  
Thin Film Back-Contact Resistor with Part Mark  
FEATURES  
Only one wire bond required  
Product may not  
be to scale  
Part marked - 5 digits maximum  
Smallest size: 0.022 inches square  
Resistance range: 10to 1MΩ  
Oxidized silicon substrate for good power dissipation  
Resistor material: tantalum nitride, self-passivating  
Moisture resistant  
The BCP series single-value back-contact resistor chip  
requires only one wire bond, thus saving hybrid space.  
The BCPs are part marked with resistance value allowing user the  
ability to visually determine the resistance value of the chip.  
The BCPs are manufactured using Vishay Electro-Films  
(EFI) sophisticated thin film equipment and manufacturing  
technology. The BCPs are 100% electrically tested and  
visually inspected to MIL-STD-883.  
APPLICATIONS  
Vishay EFI BCP resistor chips are widely used in hybrid packages where space is limited. The bottom connection is made by  
attaching the back of the chip to the substrate either eutectically or with conductive epoxy. The single wire bond is made to the  
notched pad on the top of the chip. (The other rectangular pad on the top of the chip is a via hole, a low-ohmic contact connecting  
the resistor to the bottom of the chip.) The die is part marked with the resistance value.  
TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES  
Tightest Standard Tolerance Available  
PROCESS CODE  
5% 2.5% 1%  
0.5% 0.2%  
0.1%  
CLASS H*  
CLASS K*  
133  
103  
± 25ppm/°C  
± 50ppm/°C  
102  
132  
101  
131  
± 100ppm/°C  
± 250ppm/°C  
100  
130  
*MIL-PRF-38534 inspection criteria  
200K  
1020501002001KΩ  
360K620K1MΩ  
STANDARD ELECTRICAL SPECIFICATIONS  
PARAMETER  
Noise, MIL-STD-202, Method 308  
100- 250kΩ  
< 100or > 251kΩ  
- 35dB typical  
- 20dB typical  
Moisture resistance, MIL-STD-202  
Method 106  
0.5% maximum R/R  
Stability, 1000 hours, + 125°C, 125mW  
Operating temperature range  
1.0% maximum R/R  
- 55°C to + 125°C  
Thermal shock, MIL-STD-202,  
Method 107, Test condition F  
0.25% maximum R/R  
High temperature exposure, + 150°C, 100 hours  
Dielectric voltage breakdown  
0.5% maximum R/R  
100V  
Insulation resistance  
1012 minimum  
75V maximum  
250mW  
Operating voltage  
DC power rating at + 70°C (derated to zero at + 175°C)  
5 x rated power short-time overload, + 25°C, 5 seconds  
0.25% maximum R/R  
VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121  
• ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988  
• SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389  
www.vishay.com  
58  
For technical questions contact: efi@vishay.com  
Document Number: 61027  
Revision: 03-Aug-04  
BCP  
Thin Film Back-Contact Resistor  
Vishay Electro-Films  
DIMENSIONS in inches  
0.005  
PART MARK  
PART MARK  
PART MARK  
PART MARK  
0.018  
0.022  
0.004  
TYPICAL RANGE  
TYPICAL RANGE  
TYPICAL RANGE  
200- 1KΩ  
TYPICAL RANGE  
30- 199Ω  
< 30Ω  
1K- 1MΩ  
SCHEMATIC  
STANDARD MARKING - 5 DIGITS  
XXXX  
Four significant digits of  
value  
X
Multiplier  
C = 0.001  
B = 0.01  
A = 0.1  
0 = 0  
BACK OF DIE  
1 = 10  
1 = 100  
3 = 1000  
MECHANICAL SPECIFICATIONS in inches  
PARAMETER  
Chip size  
0.022 x 0.022 0.002 (0.55 x 0.55 0.05mm)  
0.010 0.002 (0.254 0.05mm)  
Oxidized silicon, 10kÅ minimum SiO2  
Tantalum nitride, self-passivating  
0.005 x 0.005 (0.127 x 0.127mm)  
1
Chip thickness  
Chip substrate material  
Resistor material  
Bonding pad size  
Number of pads  
Pad material  
10kÅ minimum aluminum  
Backing  
3kÅ minimum gold  
Recommended attachment method  
Eutectic or conductive epoxy  
ORDERING INFORMATION  
Example: 100% visual, 10k, 1%, 250ppm/°C TCR, Aluminum Pads, Class H Visual inspection  
W
BCP  
PRODUCT  
FAMILY  
100  
PROCESS  
CODE  
1000  
RESISTANCE  
VALUE  
1
F
INSPECTION  
/PACKAGING  
MULTIPLIER  
CODE  
TOLERANCE  
CODE  
W = 100% visually inspected  
parts in matrix tray per  
MIL-STD-883  
X = Sample, commercial visually  
inspected parts loaded in matrix  
trays (4% AQL)  
See Process Code  
Table  
Use first 4 digits  
significant digits of the  
resistance  
B = 0.01  
A = 0.1  
0 = 1  
B = 0.1%  
C = 0.2%  
D = 0.5%  
F = 1.0%  
G = 2.0%  
H = 2.5%  
J = 5.0%  
K = 10%  
1 = 10  
2 = 100  
3 = 1000  
4 = 10000  
VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121  
• ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988  
• SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389  
Document Number: 61027  
Revision: 03-Aug-04  
For technical questions contact: efi@vishay.com  
www.vishay.com  
59  

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