HH21N100F501CG

更新时间:2024-10-29 23:00:26
品牌:WALSIN
描述:High Q and low ESR performance at high frequency

HH21N100F501CG 概述

High Q and low ESR performance at high frequency

HH21N100F501CG 数据手册

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Multilayer Ceramic Capacitors  
Approval Sheet  
MULTILAYER CERAMIC CAPACITORS  
High Q / Low ESR Series (HH)  
0201 to 0805 Sizes  
NP0 Dielectric  
Halogen Free & RoHS Compliance  
*Contents in this sheet are subject to change without prior notice.  
Page 1 of 11  
ASC_ HQ_Low ESR_(HH)_006V_AS  
Dec. 2018  
Multilayer Ceramic Capacitors  
Approval Sheet  
1. INTRODUCTION  
MLCC consists of a conducting material and electrodes. To manufacture a chip-type SMT and achieve  
miniaturization, high density and high efficiency, ceramic condensers are used.  
WTC HH series MLCC is used at high frequencies generally have a small temperature coefficient of capacitance,  
typical within the ±30ppm/°C required for NP0 (C0G) classification and have excellent conductivity internal electrode.  
Thus, WTC HH series MLCC will be with the feature of low ESR and high Q characteristics.  
2. FEATURES  
3. APPLICATIONS  
a. High Q and low ESR performance at high frequency.  
b. Quality improvement of telephone calls for low  
power loss and better performance.  
a. Mobile telecommunication: Mobile phone, WLAN.  
b. RF module: Power amplifier, VCO.  
c. Tuners.  
4. HOW TO ORDER  
HH  
15  
N
100  
G
500  
C
T
Series  
Size  
Dielectric  
Capacitance  
Tolerance  
Rated voltage  
Termination  
Packaging  
HH=High Q/ 03=0201 (0603)  
N=NP0  
Two significant  
A=±0.05pF Two significant  
C=Cu/Ni/Sn  
T=7” reeled  
G=13” reeled  
Low ESR  
15=0402 (1005)  
18=0603 (1608)  
21=0805 (2012)  
(C0G)  
digits followed by B=±0.1pF digits followed by  
no. of zeros. And C=±0.25pF no. of zeros. And  
R is in place of  
decimal point.  
D=±0.5pF R is in place of  
F=±1%  
G=±2%  
J=±5%  
decimal point.  
eg.:  
100=10 VDC  
160=16 VDC  
250=25 VDC  
500=50 VDC  
101=100 VDC  
201=200 VDC  
251=250 VDC  
501=500 VDC  
631=630 VDC  
R47=0.47pF  
0R5=0.5pF  
1R0=1.0pF  
100=10x100  
=10pF  
Page 2 of 11  
ASC_ HQ_Low ESR_(HH)_006V_AS  
Dec. 2018  
Multilayer Ceramic Capacitors  
Approval Sheet  
5. EXTERNAL DIMENSIONS  
Size  
L
L (mm)  
W (mm)  
T (mm)/Symbol Remark  
MB (mm)  
Inch (mm)  
T
0.6±0.03  
0.3±0.03  
0.3±0.03  
L
#
#
0.15±0.05  
0201 (0603)  
W
0.25  
0402 (1005)  
0603 (1608)  
1.00±0.05  
1.60±0.10  
0.50±0.05  
0.80±0.10  
0.50±0.05  
0.80±0.07  
N
+0.05/-0.10  
MB  
MB  
S
X
Fig. 1 The outline of MLCC  
0.40±0.15  
0.50±0.20  
1.60  
+0.15/-0.10  
0.80  
+0.15/-0.10  
0.80  
+0.15/-0.10  
0.60±0.10  
0.80±0.10  
1.25±0.10  
A
B
D
0805 (2012)  
2.00±0.15  
1.25±0.10  
#
# Reflow soldering only is recommended.  
6. GENERAL ELECTRICAL DATA  
Dielectric  
Size  
NP0  
0201, 0402, 0603, 0805  
Capacitance*  
0.1pF to 3300pF  
#1  
Cap5pF : A (±0.05pF), B (±0.1pF), C (±0.25pF)  
5pF<Cap<10pF: C (±0.25pF), D (±0.5pF)  
Cap10pF: F (±1%), G (±2%), J (±5%)  
Capacitance tolerance  
Rated voltage (WVDC)  
Q*  
10V, 16V, 25V, 50V, 100V, 200V, 250V, 500V, 630V  
Cap<30pF: Q400+20C  
Cap30pF: Q1000  
Insulation resistance at Ur  
Operating temperature  
Capacitance change  
Termination  
10Gor RxC100-F whichever is smaller.  
-55 to +125°C  
±30ppm  
Ni/Sn (lead-free termination)  
#1: NP0, 0.1pF product only provide B tolerance  
* Measured at the conditions of 25°C ambient temper ature and 30~70% related humidity.  
Apply 1.0±0.2Vrms, 1.0MHz±10% for Cap1000pF and 1.0±0.2Vrms, 1.0kHz±10% for Cap>1000pF.  
7. PACKAGING DIMENSION AND QUANTITY  
Paper tape  
Plastic tape  
Size  
Thickness (mm)/Symbol  
7” reel  
15,000  
10,000  
13” reel  
70,000  
50,000  
7” reel  
13” reel  
0.30±0.03  
0.50±0.05  
L
0201  
0402  
-
-
-
-
N
S
X
A
B
D
0.80±0.07  
0603  
4,000  
15,000  
-
-
-
0.80 +0.15/-0.10  
0.60±0.10  
4,000  
-
15,000  
-
-
0805  
0.80±0.10  
1.25±0.10  
3,000  
10,000  
Unit: pieces  
Page 3 of 11  
ASC_ HQ_Low ESR_(HH)_006V_AS  
Dec. 2018  
Multilayer Ceramic Capacitors  
Approval Sheet  
8. CAPACITANCE RANGE  
DIELECTRIC  
NP0  
25  
SIZE  
0201  
0402  
25 50 100 16  
0603  
50  
0805  
Rated Voltage  
0.1pF (0R1)  
0.2pF (0R2)  
0.3pF (0R3)  
0.4pF (0R4)  
0.5pF (0R5)  
0.6pF (0R6)  
0.7pF (0R7)  
0.8pF (0R8)  
0.9pF (0R9)  
1.0pF (1R0)  
1.2pF (1R2)  
1.5pF (1R5)  
1.8pF (1R8)  
2.2pF (2R2)  
2.7pF (2R7)  
3.3pF (3R3)  
3.9pF (3R9)  
4.7pF (4R7)  
5.6pF (5R6)  
6.8pF (6R8)  
8.2pF (8R2)  
10pF (100)  
12pF (120)  
15pF (150)  
18pF (180)  
22pF (220)  
27pF (270)  
33pF (330)  
39pF (390)  
47pF (470)  
56pF (560)  
68pF (680)  
82pF (820)  
100pF (101)  
120pF (121)  
150pF (151)  
180pF (181)  
220pF (221)  
270pF (271)  
330pF (331)  
390pF (391)  
470pF (471)  
560pF (561)  
680pF (681)  
820pF (821)  
1,000pF (102)  
1,200pF (122)  
1,500pF (152)  
1,800pF (182)  
2,200pF (222)  
2,700pF (272)  
3,300pF (332)  
10  
16  
25  
50  
16  
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
100 200 50 100 200 250 500 630  
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
X
X
X
X
X
X
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
X
X
X
X
X
X
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
X
X
X
X
X
X
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
D
D
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
D
D
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
D
D
D
D
D
D
D
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
D
D
D
D
D
D
D
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
D
D
D
D
D
D
D
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
D
D
D
D
D
D
D
1. The letter in cell is expressed the symbol of product thickness.  
2. For more information about products with special capacitance or other data, please contact WTC local representative.  
Page 4 of 11  
ASC_ HQ_Low ESR_(HH)_006V_AS  
Dec. 2018  
Multilayer Ceramic Capacitors  
Approval Sheet  
9. ELECTRICAL CHARACTERISTICS  
ESR vs Frequency 0201  
1 pF  
1.000  
0.100  
0.010  
4.7 pF  
10 pF  
33 pF  
100  
1000  
10000  
Freq(MHz)  
Fig. 2 ESR vs. Frequency (0201 size)  
Fig. 3 ESR vs. Frequency (0402 size)  
Q vs Frequency 0201  
1 pF  
10000  
1000  
100  
10  
4.7 pF  
10 pF  
33 pF  
1
100  
1000  
10000  
Freq(MHz)  
Fig. 4 Q vs. Frequency (0201 size)  
Fig. 5 Q vs. Frequency (0402 size)  
Z vs Frequency 0201  
1 pF  
1000.0  
100.0  
10.0  
4.7 pF  
10 pF  
33 pF  
1.0  
100  
1000  
10000  
Freq(MHz)  
Fig. 6 Impedance vs. Frequency. (0201 size)  
Fig. 7 Impedance vs. Frequency (0402 size)  
Page 5 of 11  
ASC_ HQ_Low ESR_(HH)_006V_AS  
Dec. 2018  
Multilayer Ceramic Capacitors  
Approval Sheet  
ESR vs Frequency 0805  
1 pF  
1.000  
0.100  
0.010  
4.7 pF  
10 pF  
100 pF  
100  
1000  
10000  
Freq(MHz)  
Fig. 8 ESR vs. Frequency (0603 size)  
Fig. 9 ESR vs. Frequency (0805 size)  
Q vs Frequency 0805  
1 pF  
10000  
4.7 pF  
1000  
100  
10  
10 pF  
100 pF  
1
100  
1000  
10000  
Freq(MHz)  
Fig. 10 Q vs. Frequency (0603 size)  
Fig. 11 Q vs. Frequency (0805 size)  
Z vs Frequency 0805  
1 pF  
1000.0  
100.0  
10.0  
1.0  
4.7 pF  
10 pF  
100 pF  
0.1  
100  
1000  
10000  
Freq(MHz)  
Fig.12 Impedance vs. Frequency. (0603 size)  
Fig.13 Impedance vs. Frequency (0805 size)  
Fig.14 Self resonance frequency vs. Capacitance  
Page 6 of 11  
ASC_ HQ_Low ESR_(HH)_006V_AS  
Dec. 2018  
Multilayer Ceramic Capacitors  
Approval Sheet  
10. RELIABILITY TEST CONDITIONS AND REQUIREMENTS  
No.  
Item  
Test Conditions  
Requirements  
1. Visual and  
Mechanical  
---  
* No remarkable defect.  
* Dimensions to conform to individual specification sheet.  
2. Capacitance  
3. Q/ D.F.  
(Dissipation  
Factor)  
Cap1000pF, 1.0±0.2Vrms, 1MHz±10%  
Cap>1000pF, 1.0±0.2Vrms, 1KHz±10%  
At 25°C ambient temperature.  
* Shall not exceed the limits given in the detailed spec.  
* NP0: Cap30pF, Q1000; Cap<30pF, Q400+20C  
4. Dielectric  
Strength  
* To apply voltage: ( 100V ) 250% of rated voltage.  
* Duration: 1 to 5 sec.  
* No evidence of damage or flash over during test.  
* Charge and discharge current less than 50mA.  
* To apply voltage:  
200V~300V  
2 times VDC  
500V~999V  
1.5 times VDC  
* Cut-off, set at 10mA  
* TEST= 15 sec.  
* RAMP=0  
5. Insulation  
Resistance  
Rated voltage:<200V  
10GΩ  
To apply rated voltage for max. 120 sec.  
Rated voltage:200~630V  
10Gor RxC100-F whichever is smaller  
* Capacitance change: within ±30ppm/°C  
To apply rated voltage (500V max.) for 60 sec.  
With no electrical load.  
6. Temperature  
Coefficient  
Operating temperature: -55~125°C at 25°C  
7. Adhesive  
Strength of  
Termination  
8. Vibration  
Resistance  
* Pressurizing force  
* No remarkable damage or removal of the terminations.  
2N (0201) and 5N (0603) and 10N (>0603)  
* Test time: 10±1 sec.  
* Vibration frequency: 10~55 Hz/min.  
* Total amplitude: 1.5mm  
* No remarkable damage.  
* Cap change and Q/D.F.: To meet initial spec.  
* Test time: 6 hrs. (Two hrs each in three mutually  
perpendicular directions.)  
* Cap./DF(Q) Measurement to be made after de-aging at  
150°C for 1hr then set for 24±2 hrs at room temp.  
* Solder temperature: 235±5°C  
9. Solderability  
95% min. coverage of all metalized area.  
* Dipping time: 2±0.5 sec.  
10. Bending Test * The middle part of substrate shall be pressurized by means * No remarkable damage.  
of the pressurizing rod at a rate of about 1 mm per second until * Cap change: within ±5.0% or ±0.5pF whichever is larger.  
the deflection becomes 1 mm and then the pressure shall be  
maintained for 5±1 sec.  
(This capacitance change means the change of capacitance under  
specified flexure of substrate from the capacitance measured before  
the test.)  
* Measurement to be made after keeping at room temp. for  
24±2 hrs.  
11. Resistance to * Solder temperature: 260±5°C  
Soldering Heat * Dipping time: 10±1 sec  
* Preheating: 120 to 150°C for 1 minute before imme rse the  
* No remarkable damage.  
* Cap change: within ±2.5% or ±0.25pF whichever is larger.  
* Q/D.F., I.R. and dielectric strength: To meet initial requirements.  
* 25% max. leaching on each edge.  
capacitor in a eutectic solder.  
* Cap. / DF(Q) / I.R. Measurement to be made after de-aging  
at 150°C for 1hr then set for 24±2 hrs at room temp .  
Page 7 of 11  
ASC_ HQ_Low ESR_(HH)_006V_AS  
Dec. 2018  
Multilayer Ceramic Capacitors  
Approval Sheet  
No.  
Item  
Test Condition  
Requirements  
* Conduct the five cycles according to the temperatures and  
time.  
12. Temperature  
Cycle  
* No remarkable damage.  
* Cap changewithin ±2.5or ±0.25pF whichever is larger.  
Step  
Temp. (°C)  
Min. operating temp. +0/-3  
Room temp.  
Time (min.)  
30±3  
* Q/D.F., I.R. and dielectric strength: To meet initial requirements.  
1
2
3
4
2~3  
Max. operating temp. +3/-0  
Room temp.  
30±3  
2~3  
* Cap. / DF(Q) / I.R. Measurement to be made after de-aging  
at 150°C for 1hr then set for 24±2 hrs at room temp .  
13. Humidity  
(Damp Heat)  
Steady State  
* Test temp.: 40±2°C  
* No remarkable damage.  
* Humidity: 90~95% RH  
* Cap change: within ±5.0% or ±0.5pF whichever is larger.  
* Q/D.F. value:  
* Test time: 500+24/-0hrs.  
* Cap. / DF(Q) / I.R. Measurement to be made after de-aging  
at 150°C for 1hr then set for 24±2 hrs at room temp .  
NP0: Cap30pF, Q350; 10pFCap<30pF, Q275+2.5C  
Cap<10pF; Q200+10C  
* I.R.: 1Gor RxC50-F whichever is smaller.  
* No remarkable damage.  
14. Humidity  
(Damp Heat)  
Load  
* Test temp.: 40±2°C  
* Humidity: 90~95%RH  
* Cap change: within ±7.5% or ±0.75pF whichever is larger.  
* Q/D.F. value:  
* Test time: 500+24/-0 hrs.  
* To apply voltagerated voltage (Max. 500V)  
NP0: Cap30pF, Q200; Cap<30pF, Q100+10/3C  
* Cap. / DF(Q) / I.R. Measurement to be made after de-aging * I.R.: 500Mor RxC25-F whichever is smaller.  
at 150°C for 1hr then set for 24±2 hrs at room temp .  
15. High  
Temperature  
Load  
* Test temp.:  
* No remarkable damage.  
NP0: 125±3°C  
* Cap change: within ±3.0% or ±0.3pF whichever is larger.  
* Q/D.F. value:  
* To apply voltage:  
(Endurance)  
(1) <500V: 200% of rated voltage.  
(2) 500V: 150% of rated voltage.  
(3) 630V: 120% of rated voltage.  
* Test time: 1000+24/-0 hrs.  
NP0: Cap30pF, Q350  
10pFCap<30pF, Q275+2.5C  
Cap<10pF, Q200+10C  
* I.R.: 1Gor RxC50-F whichever is smaller.  
* Cap. / DF(Q) / I.R. Measurement to be made after de-aging  
at 150°C for 1hr then set for 24±2 hrs at room temp .  
Page 8 of 11  
ASC_ HQ_Low ESR_(HH)_006V_AS  
Dec. 2018  
Multilayer Ceramic Capacitors  
Approval Sheet  
APPENDIXES  
Tape & reel dimensions  
Fig. 15 The dimension of paper tape  
Fig. 16 The dimension of plastic tape  
Size  
0201  
0402  
0603  
S, X  
0805  
B
Thickness  
L
N
A
C, D, I  
0.40  
0.70  
1.05  
1.50  
1.50  
< 1.80  
A0  
B0  
T
+/-0.10  
+/-0.20  
+/-0.30  
+/-0.20  
+/-0.20  
0.70  
+/-0.10  
1.20  
+/-0.20  
1.80  
+/-0.30  
2.30  
+/-0.20  
2.30  
+/-0.20  
< 2.70  
0.23  
+/-0.1  
0.55  
0.80  
1.20  
1.15  
1.20  
-
-
-
-
-
< 2.50  
K0  
W
8.00  
+/-0.30  
8.00  
+/-0.30  
8.00  
+/-0.30  
8.00  
+/-0.30  
8.00  
+/-0.30  
8.00  
+/-0.30  
4.00  
+/-0.10  
4.00  
+/-0.10  
4.00  
+/-0.10  
4.00  
+/-0.10  
4.00  
+/-0.10  
4.00  
+/-0.10  
P0  
40.00  
40.00  
40.00  
40.00  
40.00  
40.00  
10xP0  
P1  
+/-0.10  
+/-0.10  
+/-0.20  
+/-0.20  
+/-0.20  
+/-0.20  
2.00  
+/-0.05  
2.00  
+/-0.05  
4.00  
+/-0.10  
4.00  
+/-0.10  
4.00  
+/-0.10  
4.00  
+/-0.10  
2.00  
+/-0.05  
2.00  
+/-0.05  
2.00  
+/-0.05  
2.00  
+/-0.05  
2.00  
+/-0.05  
2.00  
+/-0.05  
P2  
1.50  
1.50  
1.50  
1.50  
1.50  
1.50  
D0  
D1  
E
+0.1/-0  
+0.1/-0  
+0.1/-0  
+0.1/-0  
+0.1/-0  
+0.1/-0  
1.00  
+/-0.10  
1.75  
+/-0.10  
-
-
-
-
-
1.75  
+/-0.10  
1.75  
+/-0.10  
1.75  
+/-0.10  
1.75  
+/-0.10  
1.75  
+/-0.10  
3.50  
+/-0.05  
3.50  
+/-0.05  
3.50  
+/-0.05  
3.50  
+/-0.05  
3.50  
+/-0.05  
3.50  
+/-0.05  
F
Size  
0201, 0402, 0603, 0805  
10”  
Reel size  
7”  
13”  
C
W1  
A
13.0+0.5/-0.2  
8.4+1.5/-0  
178.0±1.0  
60.0+1.0/-0  
13.0+0.5/-0.2  
8.4+1.5/-0  
13.0+0.5/-0.2  
8.4+1.5/-0  
330.0±1.0  
100±1.0  
250.0±1.0  
N
100.0±1.0  
Fig. 17 The dimension of reel  
Page 9 of 11  
ASC_ HQ_Low ESR_(HH)_006V_AS  
Dec. 2018  
Multilayer Ceramic Capacitors  
Approval Sheet  
Example of customer label  
a. Customer name  
b. WTC order series and item number  
c. Customer P/O  
d. Customer P/N  
e. Description of product  
f. Quantity  
g. Bar code including quantity & WTC P/N or customer  
h. WTC P/N  
i. Shipping date  
j. Order bar code including series and item numbers  
k. Serial number of label  
*Customized label is available upon request  
Constructions  
No.  
1
2
3
4
5
Name  
NP0  
Ceramic material  
Inner electrode  
CaZrO3 based  
Ni  
Cu  
Ni  
Inner layer  
Termination  
Middle layer  
Outer layer  
Sn  
Fig. 18 The construction of MLCC  
Storage and handling conditions  
(1) To store products at 5 to 40°C ambient temperature and 20 to 70%. related humidity conditions.  
(2) The product is recommended to be used within one year after shipment. Check solderability in case of shelf life  
extension is needed.  
Cautions:  
a. The corrosive gas reacts on the terminal electrodes of capacitors, and results in the poor solderability.  
Do not store the capacitors in the ambience of corrosive gas (e.g., hydrogen sulfide, sulfur dioxide,  
chlorine, ammonia gas etc.)  
b. In corrosive atmosphere, solderability might be degraded, and silver migration might occur to cause low  
reliability.  
c. Due to the dewing by rapid humidity change, or the photochemical change of the terminal electrode by  
direct sunlight, the solderability and electrical performance may deteriorate. Do not store capacitors under  
direct sunlight or dewing condition. To store products on the shelf and avoid exposure to moisture.  
.
Page 10 of 11  
ASC_ HQ_Low ESR_(HH)_006V_AS  
Dec. 2018  
Multilayer Ceramic Capacitors  
Approval Sheet  
Recommended soldering conditions  
The lead-free termination MLCCs are not only to be used on SMT against lead-free solder paste, but also suitable  
against lead-containing solder paste. If the optimized solder joint is requested, increasing soldering time, temperature and  
concentration of N2 within oven are recommended.  
Fig. 19 Recommended reflow soldering profile for SMT process  
with SnAgCu series solder paste.  
Fig. 20 Recommended wave soldering profile for SMT process  
with SnAgCu series solder.  
Page 11 of 11  
ASC_ HQ_Low ESR_(HH)_006V_AS  
Dec. 2018  

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