RFBLN1608070F58Q1C [WALSIN]

LTE Band Application;
RFBLN1608070F58Q1C
型号: RFBLN1608070F58Q1C
厂家: Walsin Technology    Walsin Technology
描述:

LTE Band Application

LTE
文件: 总7页 (文件大小:499K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Approval sheet  
RFBLN Series – 1608(0603)- RoHS Compliance  
MULTILAYER CERAMIC BALUN TRANSFORMER  
Halogens Free Product  
LTE Band Application  
P/N: RFBLN1608070F58Q1C  
*Contents in this sheet are subject to change without prior notice.  
Page 1 of 7  
ASC_RFBLN1608070F58Q1C_V01  
Feb. 2015  
Approval sheet  
FEATURES  
1.  
2.  
3.  
4.  
Miniature footprint: 1.6 X 0.8X 0.6 mm3  
Low insertion loss which can reduce power consumption  
Low in-band amplitude and phase imbalance enhances system performance  
LTCC process  
APPLICATIONS  
1.  
LTE Band application  
CONSTRUCTION  
Top view  
P6  
P5  
P4  
PIN  
Connection  
PIN  
Connection  
Unbalance Port  
Balance Port  
1
4
GND or DC  
feed + RF GND  
GND  
NC  
2
3
5
6
Balance Port  
P1  
P2  
P3  
DIMENSIONS  
Figure  
Symbol  
Dimension (mm)  
1.60 ± 0.15  
0.80 ± 0.15  
0.60 ± 0.10  
0.175 ± 0.15  
0.25 ± 0.15  
0.25 ± 0.15  
0.50 ± 0.15  
0.20 ± 0.15  
L
W
T
A
B
C
D
E
Top view  
Bottom view  
Side view  
Page 2 of 7  
ASC_RFBLN1608070F58Q1C_V01  
Feb. 2015  
Approval sheet  
ELECTRICAL CHARACTERISTICS  
RFBLN1608070F58Q1C  
Specification  
Frequency Range  
VSWR  
673 ~ 2700 MHz  
2.45 max.  
2.0 dB max.  
50  
Insertion Loss  
Unbalanced Port Impedance  
Balanced Port Impedance  
100 Ω  
Phase Difference  
180°± 20°  
2.0 dB max.  
-40~85℃  
Amplitude Difference  
Operating temperature Range  
Moisture sensitivity levels  
MSL is LEVEL 1 (Refer to : IPC/JEDEC J-STD-020)  
Typical Electrical Chart  
SOLDER LAND PATTERN  
Figure  
Unit : mm  
Line width to be designed to match 50 Ω characteristic impedance, depending on PCB material and thickness.  
Page 3 of 7  
ASC_RFBLN1608070F58Q1C_V01  
Feb. 2015  
Approval sheet  
RELIABILITY TEST  
Test condition / Test method  
Test item  
Specification  
Solderability  
At least 95% of a surface of each terminal  
*Solder bath temperature235 ± 5°C  
JIS C 0050-4.6  
JESD22-B102D  
electrode must be covered by fresh solder.  
*Immersion time2 ± 0.5 sec  
SolderSn3Ag0.5Cu for lead-free  
*Solder bath temperature260 ± 5°C  
*Leaching immersion time30 ± 0.5 sec  
Solder : SN63A  
Leaching  
Loss of metallization on the edges of each  
electrode shall not exceed 25%.  
(Resistance to  
dissolution of  
metallization)  
IEC 60068-2-58  
Resistance to soldering  
heat  
*Preheating temperature120~150,  
1 minute.  
No mechanical damage.  
Electrical specification shall satisfy the  
descriptions in electrical characteristics under  
the operational temperature range within -40  
~ 85°C.  
JIS C 0050-5.4  
*Solder temperature270±5°C  
*Immersion time10±1 sec  
SolderSn3Ag0.5Cu for lead-free  
Loss of metallization on the edges of each  
electrode shall not exceed 25%.  
Measurement to be made after keeping at  
room temperature for 24±2 hrs  
Drop Test  
*Height75 cm  
No mechanical damage.  
JIS C 0044  
Electrical specification shall satisfy the  
descriptions in electrical characteristics under  
the operational temperature range within -40  
~ 85°C.  
*Test SurfaceRigid surface of concrete or  
Customer’s specification.  
steel.  
*Times6 surfaces for each units2 times  
for each side.  
Vibration  
*Frequency10Hz~55Hz~10Hz(1min)  
No mechanical damage.  
JIS C 0040  
Electrical specification shall satisfy the  
descriptions in electrical characteristics under  
the operational temperature range within -40  
~ 85°C.  
*Total amplitude1.5mm  
*Test times6hrs.(Two hrs each in three  
mutually perpendicular directions)  
Adhesive Strength  
of Termination  
*Pressurizing force  
No remarkable damage or removal of the  
termination.  
5N(0603)10N(>0603)  
JIS C 0051- 7.4.3  
*Test time10±1 sec  
Bending test  
The middle part of substrate shall be  
pressurized by means of the pressurizing rod  
at a rate of about 1 mm/s per second until the  
deflection becomes 1mm/s and then pressure  
shall be maintained for 5±1 sec.  
No mechanical damage.  
JIS C 0051- 7.4.1  
Electrical specification shall satisfy the  
descriptions in electrical characteristics under  
the operational temperature range within -40  
~ 85°C.  
Measurement to be made after keeping at  
room temperature for 24±2 hours  
Page 4 of 7  
ASC_RFBLN1608070F58Q1C_V01  
Feb. 2015  
Approval sheet  
Temperature cycle  
JIS C 0025  
1. 30±3 minutes at -40°C±3°C,  
2. 10~15 minutes at room temperature,  
3. 30±3 minutes at +85°C±3°C,  
No mechanical damage.  
Electrical specification shall satisfy the  
descriptions in electrical characteristics  
under the operational temperature range  
within -40 ~ 85°C.  
4. 10~15 minutes at room temperature,  
Total 100 continuous cycles  
Measurement to be made after keeping at  
room temperature for 24±2 hrs  
High temperature  
JIS C 0021  
*Temperature85°C±2°C  
No mechanical damage.  
Electrical specification shall satisfy the  
descriptions in electrical characteristics under  
the operational temperature range within -40  
~ 85°C.  
*Test duration1000+24/-0 hours  
Measurement to be made after keeping at  
room temperature for 24±2 hrs  
Humidity  
*Humidity90% to 95% R.H.  
*Temperature40±2°C  
*Time1000+24/-0 hrs.  
No mechanical damage.  
(steady conditions)  
JIS C 0022  
Electrical specification shall satisfy the  
descriptions in electrical characteristics under  
the operational temperature range within -40  
~ 85°C.  
Measurement to be made after keeping at  
room temperature for 24±2 hrs  
500hrs measuring the first data then  
1000hrs data  
Low temperature  
JIS C 0020  
*Temperature-40°C±2°C  
No mechanical damage.  
Electrical specification shall satisfy the  
descriptions in electrical characteristics under  
the operational temperature range within -40  
~ 85°C.  
*Test duration1000+24/-0 hours  
Measurement to be made after keeping at  
room temperature for 24±2 hrs  
Page 5 of 7  
ASC_RFBLN1608070F58Q1C_V01  
Feb. 2015  
Approval sheet  
SOLDERING CONDITION  
Typical examples of soldering processes that provide reliable joints without any damage are given in Fig 2,  
Fig 2. Infrared soldering profile  
ORDERING CODE  
RF  
BLN  
160807  
0
F
58Q1C  
Specification  
Design Code  
Walsin  
RF device  
Product Code  
BLN : BALUN  
Dimension code  
Unit of dimension  
0 : 0.1 mm  
Application  
Per 2 digits of Length,  
Width, Thickness :  
F : 673 ~ 2700 MHz  
1 : 1.0 mm  
e.g. :  
160807 =  
Length 16,  
Width 08,  
Thickness07  
Minimum Ordering Quantity: 4000 pcs per reel.  
PACKAGING  
Paper Tape specifications (unit :mm)  
Index  
Ao  
Bo  
T
W
ΦD  
Dimension (mm)  
Index  
1.55 + 0.05  
Po  
0.975± 0.05  
E
1.76 ±0.05  
F
0.75± 0.10  
P1  
8.0 ± 0.10  
P2  
Dimension (mm)  
1.75 ± 0.10  
3.50 ± 0.05  
4.00 ± 0.10  
4.00 ± 0.10  
2.00 ± 0.05  
Page 6 of 7  
ASC_RFBLN1608070F58Q1C_V01  
Feb. 2015  
Approval sheet  
Reel dimensions  
B
A
C
Index  
A
B
C
Φ178.0  
Φ60.0  
Φ13.0  
Dimension (mm)  
Taping Quantity: 4000 pieces per 7” reel  
CAUTION OF HANDLING  
Limitation of Applications  
Please contact us before using our products for the applications listed below which require especially high reliability for  
the prevention of defects, which might directly cause damage to the third party’s life, body or property.  
(1) Aircraft equipment  
(2) Aerospace equipment  
(3) Undersea equipment  
(4) Medical equipment  
(5) Disaster prevention / crime prevention equipment  
(6) Traffic signal equipment  
(7) Transportation equipment (vehicles, trains, ships, etc.)  
(8) Applications of similar complexity and /or reliability requirements to the applications listed in the above.  
Storage condition  
(1) Products should be used in 6 months from the day of WALSIN outgoing inspection, which can be  
confirmed.  
(2) Storage environment condition.  
¢
¢
¢
¢
Products should be storage in the warehouse on the following conditions.  
Temperature  
Humidity  
: -10 to +40℃  
: 30 to 70% relative humidity  
Don’t keep products in corrosive gases such as sulfur. Chlorine gas or acid or it may cause oxidization of  
electrode, resulting in poor solderability.  
¢
¢
¢
Products should be storage on the palette for the prevention of the influence from humidity, dust and son on.  
Products should be storage in the warehouse without heat shock, vibration, direct sunlight and so on.  
Products should be storage under the airtight packaged condition.  
Page 7 of 7  
ASC_RFBLN1608070F58Q1C_V01  
Feb. 2015  

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