RFBPF2012080AC8Q1C [WALSIN]
High Rejection on GSM Bands;
| 型号： | RFBPF2012080AC8Q1C |
| 厂家： | 
Walsin Technology |
| 描述： | High Rejection on GSM Bands GSM |
| 文件： | 总3页 (文件大小：337K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Preliminary Product Information
LTCC Multi Layer Ceramic Band Pass Filter- 2012 (0805) size
– RFBPF2012080AC8Q1C Series
FEATURES
¢
¢
¢
¢
¢
Land Grid Array(LGA) package .
Low Insertion Loss
High Rejection on GSM Bands
High attenuation on 2nd and 3rd harmonic suppressed
LTCC process
APPLICATIONS
¢
¢
¢
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¢
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2.4GHz ISM band RF applications
Bluetooth, Wireless LAN 802.11b/g/n, HomeRF
Internet of Things (IOT), Internet of Everything (IOE) applications.
Consumer Electronics
Smart Grid & AMR Key Applications Wireless Point-of-Sale Terminals
Data Link Equipment
Personal and Home Security
Sensor network integration
Medical monitoring
Locationing
ELECTRICAL CHARACTERISTICS
Item
Frequency range
Insertion Loss
Specification
2412~2484 MHz
1.35 dB max.
2.0 max.
VSWR
50 Ω
Output Impedance
30 dB @ 804~ 828 MHz
20 dB @ 1608~1656 MHz
30 dB @ 3216~ 3312 MHz
40 dB @ 4020~ 4140 MHz
20 dB @ 4824~ 4968 MHz
20 dB @ 5628 ~ 5796 MHz
20 dB @ 6432 ~ 6624 MHz
35 dB @ 7200 ~ 7500 MHz
20 dB @ 7500 ~ 10000 MHz
Attenuation (min.)
Taping Quantity
: 2000pcs per 7” reel
Operating Temperature Range
Storage Temperature Range
: -40~ +85℃
: -10~ +40℃
Humidity
: 30 to 70% relative humidity
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PI_RFBPF2012080AC8Q1C_V01
Oct. 2014
Preliminary Product Information
TYPICAL ELECTRICAL PERFORMANCE
0
- S21
- S11
-20
-40
-60
-80
0
2
4
6
8
10
Frequency (GHz)
CONSTRUCTION
Figure
P3
PIN
1
Connection
Input
Top view
2
GND
P4
P2
3
Output
GND
P1
4
DIMENSIONS
Figure
Symbol
Dimension (mm)
L
W
T
2.00 ± 0.15
1.25 ± 0.10
0.80 ± 0.10
0.15 ± 0.10
0.40 ± 0.10
0.30 ± 0.10
0.30 ± 0.10
0.15 ± 0.10
0.95 ± 0.10
0.30 ± 0.10
Top view
A
B
C
D
E
F
Side view
Side view
Bottom view
G
H
0.35 ± 0.10
Page 2 of 3
PI_RFBPF2012080AC8Q1C_V01
Oct. 2014
Preliminary Product Information
SOLDER LAND PATTERN
Figure
Unit : mm
Line width to be designed to match 50 Ω characteristic impedance, depending on PCB material and thickness.
CONTACT INFORMATION
For more information, please contact with
Walsin Technology Corporation.
Tel : 886-3-475-8711
Fax : 886-3-475-5197
E mail : info@passivecomponent.com
Web Site : http://www.passivecomponent.com
Specification subject to change without prior notice
Page 3 of 3
PI_RFBPF2012080AC8Q1C_V01
Oct. 2014
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