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S252N100K602CT

更新时间：2024-10-29 23:15:41

品牌：WALSIN

描述：High reliability and stability

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S252N100K602CT 概述

High reliability and stability

S252N100K602CT 数据手册

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Multilayer Ceramic Capacitors

Approval Sheet

MULTILAYER CERAMIC CAPACITORS

Safety Certified X1/Y2, S2 Series

1808 to 2220 Sizes

NP0 & X7R Dielectrics

Halogen Free & RoHS Compliance

*Contents in this sheet are subject to change without prior notice.

Page 1 of 11

ASC Safety Certified X1/Y2_(S2)_010X_AS

May. 2019

Multilayer Ceramic Capacitors

Approval Sheet

1. DESCRIPTION

WTC’s SAFETY CERTIFIED CAPACITORS are designed for surge or lightning immunity in modem facsimile and

other equipments. The capacitors of series S2 are class X1/Y2 compliant respectively.

The green type capacitors in S2 and S3 series are manufactured by using environmentally friendly materials without

lead or cadmium.

The terminations are composed of plated nickel and pure tin to feature the superior leaching resistance during

soldering.

2. FEATURES

3. APPLICATIONS

a. High reliability and stability.

b. Small size and high capacitance

c. RoHS compliant

a. Modem.

b. Facsimile.

c. Telephone.

d. Other electronic equipment for lighting or surge

protection and isolation

d. Safety standard approval by

EN 60384-14 : 2013

IEC 60384-14 : 2013

UL 60384-14 (Ed 2.0)

e. Certificate number:

TUV: R50195920, TUV: R50381780

UL: E182369

f. HALOGEN compliant.

4. HOW TO ORDER

100

502

Series

Size

Dielectric

Capacitance

Tolerance

Rated voltage

Termination

Packaging

S2=X1/Y2

Safety

42=1808 (4520) N=NP0

43=1812 (4532) B=X7R

52=2211 (5728)

Two significant

Two significant digits C=Cu/Ni/Sn

T=7” reeled

D= ±0.5pF

digits followed by F= ±1.0% followed by no. of

G=13” reeled

G= ±2.0%

J= ±5.0%

K= ±10%

M= ±20%

Certified

no. of zeros. And R

is in place of

zeros. And R is in

place of decimal

point.

55=2220 (5750)

decimal point.

eg.:

502: 5000V

0R5=0.5pF

1R0=1.0pF

100=10x10⁰

=10pF

Impulse Voltage

602: 6000V

Impulse Voltage

Page 2 of 11

ASC Safety Certified X1/Y2_(S2)_010X_AS

May. 2019

Multilayer Ceramic Capacitors

Approval Sheet

5. EXTERNAL DIMENSIONS & STRUCTURE

Size

Inch (mm)

(mm)

L (mm)

W (mm)

T (mm)

M_B(mm)

1808 (4520) 4.50 +0.5/-0.3 2.03±0.25

1812 (4532) 4.50 +0.5/-0.3 3.20±0.40

≥3.5

0.50±0.25

1.25±0.10 (D)

1.40±0.15 (F)

1.60±0.20 (G)

2.00±0.20 (K)

2.50±0.30 (M)

2.80±0.30 (U)

≥3.5

≥4.0

0.50±0.25

0.60±0.30

M_B

2211 (5728)

2220 (5750)

5.70±0.40

2.80±0.30

5.00±0.40

Fig. 1 The outline of MLCC

# Reflow soldering only is recommended.

6. GENERAL ELECTRICAL DATA

Dielectric

Size

NP0

X7R

1808, 1812, 2211

3pF to 680pF

1808, 1812, 2211, 2220

100pF to 4700pF

Capacitance

Cap.<10pF: D (±0.5pF)

Capacitance tolerance

Cap.≥10pF: F (±1%), G (±2%), J (±5%),

J (±5%), K (±10%), M (±20%)

K (±10%), M (±20%)

Rated voltage (WVAC)

250Vac

Cap<30pF: Q≥400+20C

Cap≥30pF: Q≥1000

Q/ DF(Tan δ)

DF≤2.5%

Insulation resistance at Ur

Peak impulse voltage

Operating temperature

Capacitance characteristic

Termination

≥10GΩ

5000V ~ 6000V

-55 to +125°C

±30ppm/°C

±15%

Ni/Sn (lead-free termination)

TUV: R50195920, TUV: R50381780, UL: E182369

EN 60384-14 : 2013, IEC 60384-14 : 2013, UL 60384-14 (Ed 2.0)

Certified number

Test standard

* NP0: Apply 1.0±0.2Vrms, 1.0MHz±10% for Cap≤1000pF and 1.0±0.2Vrms, 1.0kHz±10% for Cap>1000pF, at 25°C ambient temperature.

* X7R: Apply 1.0±0.2Vrms, 1.0kHz±10%, at 25°C ambie nt temperature.

7. PACKAGE DIMENSION AND QUANTITY

Plastic tape

Size

Thickness (mm)/Symbol

7” reel

13” reel

1.40±0.15

1.60±0.20

2.00±0.20

1.25±0.10

1.60±0.20

2.00±0.20

2.50±0.30

1.60±0.20

2.00±0.20

2.50±0.30

2.80±0.30

2.00±0.20

2.50±0.30

1808 (4520)

1812 (4532)

0.5k

2211 (5728)

2220 (5750)

0.5k

Unit: pieces

Page 3 of 11

ASC Safety Certified X1/Y2_(S2)_010X_AS

May. 2019

Multilayer Ceramic Capacitors

Approval Sheet

8. CAPACITANCE RANGE

DIELECTRIC

SIZE

NP0

1808

1812

5000

2211

6000

PEAK IMPULSE VOLTAGE

TUV

60384

Certificated

3.0pF (3R0)

IEC60384-14 60384 IEC60384-14 60384 IEC60384-14 60384 IEC60384-14

3.3pF (3R3)

3.9pF (3R9)

4.0pF (4R0)

4.7pF (4R7)

5.0pF (5R0)

5.6pF (5R6)

6.0pF (6R0)

6.8pF (6R8)

7.0pF (7R0)

8.0pF (8R0)

8.2pF (8R2)

9.0pF (9R0)

10pF (100)

12pF (120)

15pF (150)

18pF (180)

22pF (220)

27pF (270)

33pF (330)

39pF (390)

47pF (470)

56pF (560)

68pF (680)

82pF (820)

100pF (101)

120pF (121)

130pF (131)

150pF (151)

160pF (161)

180pF (181)

220pF (221)

270pF (271)

300pF (301)

330pF (331)

390pF (391)

470pF (471)

560pF (561)

680pF (681)

720pF (721)

1. The letter in cell is expressed the symbol of product thickness.

2. For more information about products with special capacitance or other data, please contact WTC local representative.

Page 4 of 11

ASC Safety Certified X1/Y2_(S2)_010X_AS

May. 2019

Multilayer Ceramic Capacitors

Approval Sheet

DIELECTRIC

SIZE

X7R

1808

1812

2211

2220

PEAK IMPULSE VOLTAGE

5000

TUV

IEC60384-14

60384

TUV

Certificated

IEC60384-14 60384 IEC60384-14 60384 IEC60384-14 60384

100pF (101)

120pF (121)

130pF (131)

150pF (151)

160pF (161)

180pF (181)

220pF (221)

270pF (271)

300pF (301)

330pF (331)

390pF (391)

470pF (471)

560pF (561)

680pF (681)

720pF (721)

820pF (821)

1,000pF (102)

1,200pF (122)

1,500pF (152)

1,800pF (182)

2,200pF (222)

2,700pF (272)

3,300pF (332)

3,900pF (392)

4,700pF (472)

1. The letter in cell is expressed the symbol of product thickness.

2. For more information about products with special capacitance or other data, please contact WTC local representative.

Page 5 of 11

ASC Safety Certified X1/Y2_(S2)_010X_AS

May. 2019

Multilayer Ceramic Capacitors

Approval Sheet

9. RELIABILITY TEST CONDITIONS AND REQUIREMENTS

Standard

Method

No.

Item

Test Condition

Requirements

1. Visual

IEC 60384-1

* No remarkable defect.

examination 4.1

and

* Dimensions to confirm to individual specification

sheet.

Dimensions

2. Capacitance IEC 60384-1 * Class I : (C0G)

* Capacitance is within specified tolerance.

* C_Rmeans rated capacitance for conform to the E6

series of preferred values given in IEC 60063.

4.2.2

Cap.≤1000pF, 1.0±0.2Vrms, 1MHz±10%.

Cap.>1000pF, 1.0±0.2Vrms, 1KHz±10%.

3. D.F.

IEC 60384-1

* Class II : (X7R)

1.0±0.2Vrms, 1KHz±10%.

(Dissipation 4.2.3

Factor)

Dielectric

Q/D.F.

Remark

Q≥1000

Cap.≥30pF

Cap.<30pF

Tangent

loos angle

Class I (C0G)

Q≥400+20C

Class II (X7R) D.F.≤2.5%

4. Temperature IEC

Coefficient 60384-21/22

4.6

With no electrical load.

T.C.

C0G(NP0)

X7R

Capacitance Change

Within ±30ppm/℃

Within ±15%

T.C.

Operating Temp

-55~125°C at 25°C

C0G(NP0)

X7R

5. Voltage proof IEC 60384-14 * To apply voltage :

* No evidence of damage or flash over during

test.

(Dielectric

Strength)

4.2.1

X Capacitor : 1075Vdc (4.3U_R).

Y Capacitor : 1500Vac.

* Duration : 60 sec.

* The charge current shall not exceed 0.05A.

* The voltage shall be raised from the near zero to

the test voltage a rate not exceeding

150V(r.m.s.)/sec.

6. Insulation

IEC

Dielectric

Requirements

Rated

Vol.(V)

>500

Apply

Voltage Current Time

500Vdc ≤50mA 60 sec.

Charge Charge

Resistance 60384-21/22

≥100GΩ or RxC≥1000Ω-F,

whichever is smaller

≥10GΩ or RxC≥500Ω-F,

whichever is smaller

4.5.3

Class I (C0G)

Class II (X7R)

7. Solderability IEC

* Solder temperature: 235±5°C(0201~1210).

* 75% min. coverage of all metalized area.

60384-21/22 * Solder temperature: 245±5°C(1808~2225).

4.10 * Dipping time : 2±0.5 sec.

8. Resistance IEC 60384-14 * Solder temperature : 260±5°C.

Dielectric I.R.

Class I

Cap. Change

Q/D.F.

to Soldering 4.4

* Dipping time : 10±1 sec.

Within ±2.5% or

≥1GΩ ±0.25pF, whichever

Heat

IEC

60384-21/22

4.9

* Preheating : 120 to 150°C for 1 minute before

immerse the capacitor in a eutectic solder.

* Measurement to be made after keeping at room

temperature for 24±2 hrs.

≤100% of

initial

requireme

(C0G)

is larger

Class II

(X7R)

≥1GΩ Within ±7.5%

9. Temperature IEC

* Conduct the five cycles according to the

temperatures and time.

Cycle

60384-21/22

4.11

Step

Temp.(°C)

Time(min.)

30±3

Cap. Change Q/D.F.

Within ±2.5%

Dielectric I.R.

Class I

Min. operating

temp. +0/-3

≤1.0(Q) ×

or ±0.25pF,

whichever is

larger

Room temp.

2~3

initial

requirement

To meet

(C0G)

initial

Max.operating

temp. +3/-0

30±3

require

ment

≤1.5(D.F.) ×

Within ±7.5% initial

requirement

Class II

(X7R)

Room temp.

2~3

* Measurement to be made after keeping at room

temperature for 24±2 hrs.

Page 6 of 11

ASC Safety Certified X1/Y2_(S2)_010X_AS

May. 2019

Multilayer Ceramic Capacitors

Standard

Approval Sheet

No.

Item

Test Condition

Requirements

* No remarkable damage.

Method

10. Humidity

IEC 60384-14 * Test temp. : 40±2°C.

(Damp Heat) 4.12

Steady State

* Humidity : 90~95% RH.

* Test time : 500 +24/-0hrs.

* Applied voltage : 250Vac.

* Measurement to be made after keeping at room

temp. for 24±2 hrs (Class I) and 48±4 hrs (Class

II).

Dielectr

I.R.

Cap. Change

Within ±3.0% or

±2pF, whichever ≤0.25%

is larger

Q/D.F.

Class I

(C0G)

≥1GΩ or

RxC≥

25Ω-F,

whichever

≤2.0(D.F.)

× initial

requireme

Class II

(X7R)

Within ±15%

smaller

11. Passive

Flammability 4.17

IEC 60384-14 * Volume sample: 21.56 mm³

* Flame exposure time: 5 sec Max.

* Capacitor didn’t burn at all.

IEC 60384-1 * Category of flammability : C.

4.38

12. Active

IEC

* The capacitors applied UR (250Vac). Then each * The cheese cloth shall not burn with a flame.

sample shall be subjected to 20 discharges from a

tank capacitor, charge to a voltage that, when

Flammability 60384-21/22

4.18

discharged, plase Ui 2500V for X1Y2 across the

capacitor under test. The interval between

successive discharges shall be 5 sec.

13. High

IEC 60384-14 * Impulse Voltage :

* Appearance :

Temperature 4.14

Load

Each individual capacitor shall be subjected to a Vp No mechanical damage.

= 5.0KV (X1Y2 Class Impulse 5KV) & Vp = 6.0KV * Cap. change :

(Endurance)

(X1Y2 Class Impulse 6KV) impulse for three times C0G within ±5% or ±0.5pF, whichever is larger.

before applied to endurance test.

* Test temp. : 125±3°C.

X7R within ±20%.

* D.F. value :

* Test time: 1000 +48/-0 hrs.

* Applied voltage :

C0G≤0.25%.

X7R≤5.0%.

X capacitor: 1.25UR (312.5Vac).

Y capacitor: 1.70UR (425Vac).

* I.R.≥1GΩ.

* Dielectric strength satisfies the specified initial

Once every hour the voltage shall be increased to value.

1000Vrms for 0.1 sec.

* Measurement to be made after keeping at room

temp. for 24±2 hrs (Class I) and 48±4 hrs (Class

II).

14. Resistance IEC

* Capacitors mounted on a substrate. The board

shall be bent 1mm with a rate of 1mm/sec.

* No remarkable damage.

to Flexure of 60384-21/22

Dielectric

Cap. Change

Substrate

4.8

Class I

(C0G)

Class II

(X7R)

Within ±3.0% or ±2pF, whichever is

larger

R = 230

Within ±12.5%

(This capacitance change means the change of

capacitance under specified flexure of substrate

from the capacitance measured before the test)

1mm

45±1

Page 7 of 11

ASC Safety Certified X1/Y2_(S2)_010X_AS

May. 2019

Multilayer Ceramic Capacitors

Standard

Approval Sheet

No.

Item

Test Condition

Requirements

* No remarkable damage or removal of the

Method

15. Adhesive

IEC

Strength of 60384-21/22 * Capacitors mounted on a substrate. A force of 10N terminations.

Termination 4.15 applied perpendicular to the place of substrate

IEC 60384-1 and parallel the line joining the center of

4.13 terminations for 10±1 sec.

16. Vibration

IEC 60384-1 * Reflow solder the capacitors on P. C. Board before * No remarkable damage.

4.17

test.

* Cap. change and Q/D.F. : To meet initial spec.

* Vibration frequency : 10~55 Hz/min.

* Total amplitude : 1.5mm.

* Repeat the conditions for 2 hours each in 3

perpendicular directions.

17. Impulse

Voltage

IEC

60384-14

4.13

* X1 : 4.0KV

* Y2 : 5.0KV.

* Number of impulse : 24 max.

* There shall be no permanent breakdown or

flashover.

Page 8 of 11

ASC Safety Certified X1/Y2_(S2)_010X_AS

May. 2019

Multilayer Ceramic Capacitors

Approval Sheet

EMBOSSED TAPE DIMENSIONS

Fig. 2 The dimension of plastic tape

Fig. 3 The dimension of reel

Size

1808

1.25±0.10

1812

1.25±0.10

2211

1.60±0.20

2220

Chip

2.50±0.30

2.80±0.30

1.40±0.15

1.60±0.20

<2.50

2.00±0.20

1.60±0.20

2.00±0.20

<3.90

2.50±0.30

2.00±0.20

2.50±0.30

Thickness

2.00±0.20

<2.50

<3.90

<5.30

<3.30

<5.80

<6.50

<5.80

<6.50

A₀

B₀

<5.30

<6.50

0.25±0.10

<2.50

0.25±0.10

<2.50

0.25±0.10

<2.50

0.25±0.10

<3.50

0.30±0.10

<2.50

0.30±0.10

<3.50

0.30±0.10

<2.50

0.30±0.10

<3.50

K₀

12.0±0.30

4.00±0.10

40.0±0.20

4.00±0.10

2.00±0.10

12.0±0.30

4.00±0.10

40.0±0.20

4.00±0.10

2.00±0.10

12.0±0.30

4.00±0.10

12.0±0.30

4.00±0.10

12.0±0.30

4.00±0.10

40.0±0.20

8.00±0.10

2.00±0.10

12.0±0.30

4.00±0.10

40.0±0.20

8.00±0.10

2.00±0.10

12.0±0.30

4.00±0.10

12.0±0.30

4.00±0.10

P₀

40.00±0.20 40.00±0.20

10xP₀

P₁

8.00±0.10

2.00±0.10

8.00±0.10

2.00±0.10

8.00±0.10

2.00±0.10

8.00±0.10

2.00±0.10

P₂

1.50+0.10/-0 1.50+0.10/-0 1.50+0.10/-0 1.50+0.10/-0 1.50+0.10/-0 1.50+0.10/-0 1.50+0.10/-0 1.50+0.10/-0

D₀

D₁

1.50±0.10

1.75±0.10

5.50±0.10

1.50±0.10

1.75±0.10

5.50±0.10

1.50±0.10

1.75±0.10

5.50±0.10

1.50±0.10

1.75±0.10

5.50±0.10

1.50±0.10

1.75±0.10

5.50±0.10

1.50±0.10

1.75±0.10

5.50±0.10

1.50±0.10

1.75±0.10

5.50±0.10

1.50±0.10

1.75±0.10

5.50±0.10

Size

1808, 1812, 2211, 2220

Reel size

7”

13”

W₁

13.0+0.5/-0.2

12.4+2.0/-0

178.0±1.0

13.0+0.5/-0.2

12.4+2.0/-0

330.0±1.0

100±1.0

60.0+1.0/-0

Page 9 of 11

ASC Safety Certified X1/Y2_(S2)_010X_AS

May. 2019

Multilayer Ceramic Capacitors

Approval Sheet

APPLICATION NOTES

◙ Storage

To prevent the damage of solderability of terminations, the following storage conditions are recommended:

Indoors under 5 ~ 40°C and 20% ~ 70% RH.

No harmful gases containing sulfuric acid, ammonia, hydrogen sulfide or chlorine.

Packaging should not be opened until the capacitors are required for use. If opened, the pack should be

re-sealed as soon as is practicable. Taped product should be stored out of direct sunlight, which might

promote deterioration in tape or adhesion performance. The product is recommended to be used within 12

months after shipment and checked the solderability before use.

◙ Handling

Chip capacitors are dense, hard, brittle, and abrasive materials. They are liable to suffer mechanical

damage, in the form of cracks or chips. Chip Capacitors should be handled with care to avoid contamination

or damage. To use vacuum or plastic tweezers to pick up or plastic tweezers is recommended for manual

placement. Tape and reeled packages are suitable for automatic pick and placement machine.

◙ Preheat

In order to minimize the risk of thermal shock during soldering, a carefully controlled preheat is required.

The rate of preheat should not exceed 3°C per secon d.

◙ Soldering

Use middy activated rosin RA and RMA fluxes do not use activated flux. The amount of solder in each

solder joint should be controlled to prevent the damage of chip capacitors caused by the stress between

solder, chips, and substrate.

a.) Hand soldering :

Fig. 4.1 Hand Soldering Profile

Chip Size

≤1206

Pre-Heat temp.

≥150°C

∆T

Max. soldering iron temp.

≤150°C

≤130°C

≤350°C

≤280°C

1210~2225

≥150°C

* Soldering iron tip diameter ≤1.0 mm and wattage max. 20W.

* The Capacitors shall be pre-heated and that the temperature gradient between the devices and the tip of the

soldering iron.

* The required amount of solder shall be melted on the soldering tip.

* The tip of iron should not contact the ceramic body directly.

* The Capacitors shall be cooled gradually at room temperature after soldering.

* Forced air cooling is not allowed.

Page 10 of 11

ASC Safety Certified X1/Y2_(S2)_010X_AS

May. 2019

Multilayer Ceramic Capacitors

Approval Sheet

b.) Reflow soldering :

Fig. 4.2 Reflow soldering profile

For Sn/Ag/Cu Series solder paste (Pb-Free)

◙ Cooling

After soldering, cool the chips and the substrate gradually to room temperature. Natural cooling in air is

recommended to minimize stress in the solder joint.

◙ Cleaning

All flux residues must be removed by using suitable electronic-grade vapor-cleaning solvents to eliminate

contamination that could cause electrolytic surface corrosion. Good results can be obtained by using

ultrasonic cleaning of the solvent. The choice of the proper system is depends upon many factors such as

component mix, flux, and solder paste and assembly method. The ability of the cleaning system to remove

flux residues and contamination from under the chips is very important.

Page 11 of 11

ASC Safety Certified X1/Y2_(S2)_010X_AS

May. 2019

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