TTL06KUR003FTL [WALSIN]

High Power Thin Film Current Sensor;
TTL06KUR003FTL
型号: TTL06KUR003FTL
厂家: Walsin Technology    Walsin Technology
描述:

High Power Thin Film Current Sensor

文件: 总13页 (文件大小:4221K)
中文:  中文翻译
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TTL02TTL04TTL06TTL08  
±1% , ±0.5%  
High Power Thin Film Current Sensor  
(RoHS Compliant Halogen Free)  
Size:0201040206030805  
FEATURES  
1. Extra high power rating and low TCR.  
2. Extra low resistance and high precision.  
3. High component and equipment reliability  
4. Low resistances applied to current sensing  
5. RoHS compliant & Halogen Free.  
6. Suitable for lead free soldering.  
APPLICATIONS  
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Current sensor  
Medical equipment  
Measuring instrument  
Communication device  
Power supply  
Computer  
DESCRIPTION  
This specification describes TTL series current sensor – Extra high power and low TCR with lead-free  
terminations made by metal film or metal foil with substrate.  
Quick Reference Data  
Functional code  
Power(W)  
Resistance  
Range  
Resistance  
Tolerance  
Series  
Size  
TCR  
( ppm/℃)  
mΩ  
H
I
J
K
M
P
Q
%
0201  
(0603)  
TTL  
TTL  
TTL  
TTL  
TTL  
TTL  
TTL  
TTL  
TTL  
1/8 1/5 1/4 1/3  
5~20 mΩ  
±1%(F)  
U±350  
Q±150  
P±100  
Q±150  
O±75  
O±75  
Q±150  
O±75  
O±75  
0402  
(1005)  
1/4 1/3 1/2  
1/4 1/3 1/2  
1/5 1/4 1/3 1/2  
1/4 1/3 1/2  
1/4 1/3 1/2  
1/4 1/3 1/2  
1/4 1/3 1/2  
1/4 1/3 1/2  
2.5 mΩ  
5~20 mΩ  
2 ~4 mΩ  
5 ~9 mΩ  
10 ~20 mΩ  
2~4 mΩ  
±1%(F)  
±1%(F)  
±1%(F)  
±1%(F)  
0402  
(1005)  
0603  
(1608)  
0603  
(1608)  
0603  
(1608)  
±0.5%(D)  
±1%(F)  
0805  
(2012)  
±1%(F)  
±1%(F)  
0805  
(2012)  
5~9 mΩ  
0805  
(2012)  
±0.5%(D)  
±1%(F)  
10~20 mΩ  
Note :  
1.  
This is the maximum voltage that may be continuously supplied to the resistor element, see “IEC publication  
60115-8”  
2.  
Max. Operation Voltage : So called RCWV (Rated Continuous Working Voltage) is determined by  
RCWV = Rated Power ×Resistance Value  
DIMENSIONS:(unit:mm)  
0201/0402 Series  
Resistance Range(mΩ)  
Type  
L(mm)  
W(mm)  
H(mm)  
I1(mm)  
TTL02HU  
TTL02IU  
5~20  
0.60±0.03  
0.31±0.04  
Max:0.30  
0.14±0.16  
TTL02JU  
TTL02KU  
TTL04JQ  
TTL04KQ  
2.5  
1.00±0.10  
1.00±0.10  
0.55±0.10  
0.55±0.10  
Max:0.35  
Max:0.35  
0.25±0.10  
0.25±0.10  
TTL04MQ  
TTL04JP  
TTL04KP  
TTL04MP  
5~20  
TTL02HU(IUJUKU) TTL04JQ(KQMQ) TTL04JP(KPMP) Series  
Marking(No mark)  
0603 series  
Resistance Range(mΩ)  
Type  
L(mm)  
W(mm)  
H(mm)  
I1(mm)  
2
1.60±0.25  
0.80±0.25  
0.40±0.25  
0.45±0.20  
0.35±0.20  
0.30±0.20  
0.50±0.20  
0.40±0.20  
TTL06IR  
TTL06JR  
TTL06KR  
TTL06MR  
2.5~3  
4
1.60±0.25  
1.60±0.25  
1.60±0.20  
1.60±0.20  
0.80±0.25  
0.80±0.25  
0.90±0.20  
0.90±0.20  
0.40±0.25  
0.40±0.25  
0.65±0.20  
0.65±0.20  
TTL06JO  
TTL06KO  
TTL06MO  
5~14  
15~20  
TTL 06IR(JR、KR、MR)_(2~4mΩ)  
Marking(No mark)  
TTL06 JO (KO、MO)_(5~14mΩ);TTL06 JO (KO、MO)_(15~20mΩ)  
Mark (3digits)  
(010=10 )  
0805 series  
Resistance Range(mΩ)  
Type  
L(mm)  
W(mm)  
H(mm)  
I1(mm)  
TTL08JQ  
TTL08KQ  
TTL08MQ  
0.30±0.25  
0.65±0.25  
2~4  
2.00±0.25  
1.25±0.25  
TTL08JO  
TTL08KO  
TTL08MO  
5~9  
2.03±0.20  
2.03±0.20  
1.27±0.20  
1.27±0.20  
0.65±0.20  
0.65±0.20  
0.55±0.20  
0.50±0.20  
10~20  
TTL08 JQ(KQ、MQ)_(2~4 mΩ)  
Marking(No mark)  
TTL08 JO(KO、MO) _(5~9mΩ)、TTL08 JO(KO、MO) _(10~20mΩ)  
Mark (3digits)  
(010=10 )  
FUNCTIONAL DESCRIPTION  
Product characterization  
Power rating is based on continuous full load operation at rated ambient temperature of 70 ºC. For resistors operated at  
ambient temp. in excess of 70 ºC, the maximum load shall be derated in accordance with the following curve.  
The power that the resistor can dissipate depends on the operating temperature; see Fig.1&Fig2  
Temperature range of size 0201: -55°C to +125°C (Fi g.1)  
Temperature range of size 0402 to 0805: -55°C to +1 55°C (Fig.2)  
MOUNTING  
Due to their rectangular shapes and small tolerances, Surface Mountable Resistors are suitable for  
handling by automatic placement systems.  
Chip placement can be on ceramic substrates and printed-circuit boards (PCBs).  
Electrical connection to the circuit is by individual soldering condition.  
The end terminations guarantee a reliable contact.  
SOLDERING CONDITION  
The robust construction of chip resistors allows them to be completely immersed in a solder bath of 260°C  
for 10 seconds. Therefore, it is possible to mount Surface Mount Resistors on one side of a PCB and other  
discrete components on the reverse (mixed PCBs).  
Surface Mount Resistors are tested for solderability at 235°C during 2 seconds within lead-free solder bath.  
The test condition for no leaching is 260°C for 30 seconds. Typical examples of soldering profile and  
condition that provide reliable joints without any damage are given in Fig 3. and Table 1.  
Fig. 3 Infrared soldering profile for Chip Resistors  
Table 1. Infrared soldering condition for Chip Resistors  
Temperature Condition  
Average ramp-up rate (217°C to 260°C)  
Between 150 and 200°C  
> 217°C  
Exposure Time  
Less than 3°C/second  
Between 60-120 seconds  
Between 60-150 seconds  
260ºC +0/-5°C  
Peak Temperature  
Min. 30 seconds  
Time within 245°C  
Ramp-down rate (Peak to 217°C)  
Time from 25°C to Peak  
Less than 6°C/second  
No greater than 480 seconds  
CATALOGUE NUMBERS  
TTL  
06  
P
O
XXXX  
F
T
L
Type code  
Size code  
Power Rating  
TCR  
Resistance  
Tolerance Packaging Termination  
code  
code  
Low  
02:0201  
04:0402  
06:0603  
08:0805  
M:1/2 W  
K:1/3 W  
J: 1/4W  
I:1/5W  
N:50 ppm/  
O:75ppm/℃  
P:100 ppm/℃  
Q:150 ppm/℃  
R:200 ppm/℃  
U:350 ppm/℃  
e.q  
D: ±0.5%  
F: ±1%  
T:7” Taped  
Reeled  
L:Sn Base  
Resistance  
R003=3mΩ  
R010=10mΩ  
R2L5=2.5mΩ  
(Lead free)  
H:1/8 W  
Recommend Solder Pad Dimensions  
Dimensions of solder Pad :  
Type  
Resistance Range  
A(mm)  
0.65  
1.60  
3.20  
3.20  
3.60  
3.60  
B(mm)  
C(mm)  
D(mm)  
TTL02  
TTL04  
TTL06  
TTL06  
TTL08  
TTL08  
5~20mΩ  
0.25  
0.40  
0.50  
0.60  
0.50  
0.80  
0.20  
0.6  
0.33  
0.60  
0.92  
0.92  
1.44  
1.44  
2.5~20 mΩ  
2~4 mΩ  
1.35  
1.30  
1.55  
1.40  
5~20mΩ  
2~4 mΩ  
5~20 mΩ  
TEST AND REQUIREMENTS(JIS C 5201-1 : 1998)  
REQUIREMENT  
TEST  
PROCEDURE  
Resistor  
DC resistance  
IEC 60115-1 / JIS  
C 5201-1 , Clause  
4.5  
D: ±0.5%,F: ±1%,  
Within the specified tolerance  
Natural resistance change per change in degree centigrade.  
R2  
R1  
×
106  
R
(
t2  
t1  
)
1
Temperature  
Coefficient of  
Resistance(T.C.R)  
(ppm/°C)  
Refer to  
R1 : Resistance at reference temperature  
R2 : Resistance at test temperature  
t1 : 20°C+5°C-1°C  
“ QUICK REFERENCE DATA “  
t2 : 125°C+5°C-1°C  
Short time overload  
(S.T.O.L)  
No visible damage  
5 times of rated power for 5 seconds at room temperature  
±(1.0%+0.0005)  
IEC60115-1 4.13  
Resistance to  
soldering heat(R.S.H)  
Condition B, no pre-heat of samples  
No visible damage  
±(0.5%+0.0005 )  
MIL-STD-202G-  
method 210F  
Lead free solder, 260 °C, 10 seconds immersion time  
Procedure 2 for SMD: devices fluxed and cleaned with  
isopropanol  
IEC 60115-1 4.18  
SMD conditions:  
Solderability  
1st step: method B, aging 4 hours at 155 °C dry heat  
2nd step: leadfree solder bath at 245± 3 °C  
good tinning (>95% covered)  
no visible damage  
IPC/JEDEC  
Dipping time: 3± 0.5 seconds  
J-STD-002B test B  
Thermal Shock  
MIL-STD-202G-  
method 107  
-55/+125 °C  
Note: Number of cycles required is 300. Devices mounted  
Maximum transfer time is 20 seconds. Dwell time is 15  
minutes. Air – Air  
±(1.0%+0.0005)  
Endurance  
MIL-STD-202G-  
method 108  
70±2ºC, 1000 hours, loaded with RCWV,1.5 hours on and 0.5  
hours off  
±(2.0%+0.0005)  
±(1.0%+0.0005)  
IEC 60115-1 4.25.1  
Device mounted on PCB test board as described, only 1 board  
bending required  
Bending for  
Bending Strength  
IEC60115-1 4.33  
0201: 3mm  
0402 and above: 2mm  
Holding time: minimum 60 seconds  
1,000 hours at maximum operating temperature depending on  
specification, unpowered  
No direct impingement of forced air to the parts  
Tolerances:  
High Temperature  
Exposure  
±(1.0%+0.0005)  
MIL-STD-202G-  
method 108  
0201: 125± 3  
0402 and above 155± 3℃  
IEC 60115-1 4.25.3  
Each temperature / humidity cycle is defined at 8 hours  
(method 106F), 3 cycles / 24 hours for 10d with 25 °C / 65 °C  
95% R.H, without steps 7a & 7b, unpowered  
Moisture Resistance  
MIL-STD-202G-  
method 106  
± (0.5%+0.0005 )  
±(1.0%+0.0005)  
Parts mounted on test-boards, without condensation on parts  
Measurement at 24± 2 hours after test conclusion  
Bias Humidity  
MIL-STD-202  
1,000 hours at 85ºC/85%R.H. 10% of operating power, no  
condensation on the devices, circulating air.  
Method 103  
PACKAGING  
Paper Tape specifications (unit :mm)  
Series No.  
TTL02  
A
B
W
F
E
0.70±0.10  
1.250±0.20  
1.90±0.20  
2.40±0.20  
0.40±0.10  
0.75±0.20  
1.10±0.20  
1.65±0.20  
8.00±0.30  
8.00±0.30  
8.00±0.30  
8.00±0.30  
3.50±0.10  
3.50±0.10  
3.50±0.20  
3.50±0.20  
1.75±0.10  
1.75±0.10  
1.75±0.10  
1.75±0.10  
TTL04  
TTL06  
TTL08  
Series No.  
P1  
P0  
T
ΦD  
+0.1  
2.00±0.10  
4.00±0.10  
TTL02  
Max 0.5  
Φ1.50  
Φ1.50  
Φ1.50  
Φ1.50  
0.0  
+0.1  
0.0  
2.00±0.10  
4.00±0.10  
4.00±0.10  
4.00±0.10  
4.00±0.10  
4.00±0.10  
TTL04  
TTL06  
TTL08  
Max 0.6  
Max 1.0  
Max 1.1  
+0.1  
0.0  
+0.1  
0.0  
Reel dimensions  
Symbol  
A
B
C
(unit : mm)  
(unit : mm)  
(unit : mm)  
(unit : mm)  
9.0±0.5  
Φ178.0±5.0  
Φ60.0±2.0  
Taping quantity  
-
-
-
Chip resistors 5,000 pcs per reel ( TTL08, TTL06 )  
Chip resistors 10,000 pcs per reel ( TTL04 )  
Chip resistors 15,000 pcs per reel ( TTL02 )  

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