概述
数据手册TTL08JUR010FTL 概述
High Power Thin Film Current Sensor
TTL08JUR010FTL 数据手册
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PDF下载TTL02、TTL04、TTL06、TTL08
±1% , ±0.5%
High Power Thin Film Current Sensor
(RoHS Compliant 、Halogen Free)
Size:0201、 0402、0603、0805
FEATURES
1. Extra high power rating and low TCR.
2. Extra low resistance and high precision.
3. High component and equipment reliability
4. Low resistances applied to current sensing
5. RoHS compliant & Halogen Free.
6. Suitable for lead free soldering.
APPLICATIONS
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Current sensor
Medical equipment
Measuring instrument
Communication device
Power supply
Computer
DESCRIPTION
This specification describes TTL series current sensor – Extra high power and low TCR with lead-free
terminations made by metal film or metal foil with substrate.
Quick Reference Data
Functional code
Power(W)
Resistance
Range
Resistance
Tolerance
Series
Size
TCR
( ppm/℃)
mΩ
H
I
J
K
M
P
Q
%
0201
(0603)
TTL
TTL
TTL
TTL
TTL
TTL
TTL
TTL
TTL
1/8 1/5 1/4 1/3
5~20 mΩ
±1%(F)
U：±350
Q：±150
P：±100
Q：±150
O：±75
O：±75
Q：±150
O：±75
O：±75
0402
(1005)
1/4 1/3 1/2
1/4 1/3 1/2
1/5 1/4 1/3 1/2
1/4 1/3 1/2
1/4 1/3 1/2
1/4 1/3 1/2
1/4 1/3 1/2
1/4 1/3 1/2
2.5 mΩ
5~20 mΩ
2 ~4 mΩ
5 ~9 mΩ
10 ~20 mΩ
2~4 mΩ
±1%(F)
±1%(F)
±1%(F)
±1%(F)
0402
(1005)
0603
(1608)
0603
(1608)
0603
(1608)
±0.5%(D)
±1%(F)
0805
(2012)
±1%(F)
±1%(F)
0805
(2012)
5~9 mΩ
0805
(2012)
±0.5%(D)
±1%(F)
10~20 mΩ
Note :
1.
This is the maximum voltage that may be continuously supplied to the resistor element, see “IEC publication
60115-8”
2.
Max. Operation Voltage : So called RCWV (Rated Continuous Working Voltage) is determined by
RCWV = Rated Power ×Resistance Value
DIMENSIONS:(unit:mm)
0201/0402 Series
Resistance Range(mΩ)
Type
L(mm)
W(mm)
H(mm)
I1(mm)
TTL02HU
TTL02IU
5~20
0.60±0.03
0.31±0.04
Max:0.30
0.14±0.16
TTL02JU
TTL02KU
TTL04JQ
TTL04KQ
2.5
1.00±0.10
1.00±0.10
0.55±0.10
0.55±0.10
Max:0.35
Max:0.35
0.25±0.10
0.25±0.10
TTL04MQ
TTL04JP
TTL04KP
TTL04MP
5~20
TTL02HU(IU、JU、KU) 、TTL04JQ(KQ、MQ) 、TTL04JP(KP、MP) Series
Marking(No mark)
0603 series
Resistance Range(mΩ)
Type
L(mm)
W(mm)
H(mm)
I1(mm)
2
1.60±0.25
0.80±0.25
0.40±0.25
0.45±0.20
0.35±0.20
0.30±0.20
0.50±0.20
0.40±0.20
TTL06IR
TTL06JR
TTL06KR
TTL06MR
2.5~3
4
1.60±0.25
1.60±0.25
1.60±0.20
1.60±0.20
0.80±0.25
0.80±0.25
0.90±0.20
0.90±0.20
0.40±0.25
0.40±0.25
0.65±0.20
0.65±0.20
TTL06JO
TTL06KO
TTL06MO
5~14
15~20
TTL 06IR(JR、KR、MR)_(2~4mΩ)
Marking(No mark)
TTL06 JO (KO、MO)_(5~14mΩ)；TTL06 JO (KO、MO)_(15~20mΩ)
Mark (3digits)
(010=10 mΩ)
0805 series
Resistance Range(mΩ)
Type
L(mm)
W(mm)
H(mm)
I1(mm)
TTL08JQ
TTL08KQ
TTL08MQ
0.30±0.25
0.65±0.25
2~4
2.00±0.25
1.25±0.25
TTL08JO
TTL08KO
TTL08MO
5~9
2.03±0.20
2.03±0.20
1.27±0.20
1.27±0.20
0.65±0.20
0.65±0.20
0.55±0.20
0.50±0.20
10~20
TTL08 JQ(KQ、MQ)_(2~4 mΩ)
Marking(No mark)
TTL08 JO(KO、MO) _(5~9mΩ)、TTL08 JO(KO、MO) _(10~20mΩ)
Mark (3digits)
(010=10 mΩ)
FUNCTIONAL DESCRIPTION
Product characterization
Power rating is based on continuous full load operation at rated ambient temperature of 70 ºC. For resistors operated at
ambient temp. in excess of 70 ºC, the maximum load shall be derated in accordance with the following curve.
The power that the resistor can dissipate depends on the operating temperature; see Fig.1&Fig2
Temperature range of size 0201: -55°C to +125°C (Fi g.1)
Temperature range of size 0402 to 0805: -55°C to +1 55°C (Fig.2)
MOUNTING
Due to their rectangular shapes and small tolerances, Surface Mountable Resistors are suitable for
handling by automatic placement systems.
Chip placement can be on ceramic substrates and printed-circuit boards (PCBs).
Electrical connection to the circuit is by individual soldering condition.
The end terminations guarantee a reliable contact.
SOLDERING CONDITION
The robust construction of chip resistors allows them to be completely immersed in a solder bath of 260°C
for 10 seconds. Therefore, it is possible to mount Surface Mount Resistors on one side of a PCB and other
discrete components on the reverse (mixed PCBs).
Surface Mount Resistors are tested for solderability at 235°C during 2 seconds within lead-free solder bath.
The test condition for no leaching is 260°C for 30 seconds. Typical examples of soldering profile and
condition that provide reliable joints without any damage are given in Fig 3. and Table 1.
Fig. 3 Infrared soldering profile for Chip Resistors
Table 1. Infrared soldering condition for Chip Resistors
Temperature Condition
Average ramp-up rate (217°C to 260°C)
Between 150 and 200°C
> 217°C
Exposure Time
Less than 3°C/second
Between 60-120 seconds
Between 60-150 seconds
260ºC +0/-5°C
Peak Temperature
Min. 30 seconds
Time within 245°C
Ramp-down rate (Peak to 217°C)
Time from 25°C to Peak
Less than 6°C/second
No greater than 480 seconds
CATALOGUE NUMBERS
TTL
06
P
O
XXXX
F
T
L
Type code
Size code
Power Rating
TCR
Resistance
Tolerance Packaging Termination
code
code
Low
02:0201
04:0402
06:0603
08:0805
M:1/2 W
K:1/3 W
J: 1/4W
I:1/5W
N:50 ppm/℃
O:75ppm/℃
P:100 ppm/℃
Q:150 ppm/℃
R:200 ppm/℃
U:350 ppm/℃
e.q
D: ±0.5%
F: ±1%
T:7” Taped
Reeled
L:Sn Base
Resistance
R003=3mΩ
R010=10mΩ
R2L5=2.5mΩ
(Lead free)
H:1/8 W
Recommend Solder Pad Dimensions
Dimensions of solder Pad :
Type
Resistance Range
A(mm)
0.65
1.60
3.20
3.20
3.60
3.60
B(mm)
C(mm)
D(mm)
TTL02
TTL04
TTL06
TTL06
TTL08
TTL08
5~20mΩ
0.25
0.40
0.50
0.60
0.50
0.80
0.20
0.6
0.33
0.60
0.92
0.92
1.44
1.44
2.5~20 mΩ
2~4 mΩ
1.35
1.30
1.55
1.40
5~20mΩ
2~4 mΩ
5~20 mΩ
TEST AND REQUIREMENTS(JIS C 5201-1 : 1998)
REQUIREMENT
TEST
PROCEDURE
Resistor
DC resistance
IEC 60115-1 / JIS
C 5201-1 , Clause
4.5
D: ±0.5%,F: ±1%,
Within the specified tolerance
Natural resistance change per change in degree centigrade.
R2
−
R1
×
106
R
(
t2
−
t1
)
1
Temperature
Coefficient of
Resistance(T.C.R)
(ppm/°C)
Refer to
R1 : Resistance at reference temperature
R2 : Resistance at test temperature
t1 : 20°C+5°C-1°C
“ QUICK REFERENCE DATA “
t2 : 125°C+5°C-1°C
Short time overload
(S.T.O.L)
No visible damage
5 times of rated power for 5 seconds at room temperature
±(1.0%+0.0005Ω)
IEC60115-1 4.13
Resistance to
soldering heat(R.S.H)
Condition B, no pre-heat of samples
No visible damage
±(0.5%+0.0005 )
MIL-STD-202G-
method 210F
Lead free solder, 260 °C, 10 seconds immersion time
Procedure 2 for SMD: devices fluxed and cleaned with
isopropanol
IEC 60115-1 4.18
SMD conditions:
Solderability
1st step: method B, aging 4 hours at 155 °C dry heat
2nd step: leadfree solder bath at 245± 3 °C
good tinning (>95% covered)
no visible damage
IPC/JEDEC
Dipping time: 3± 0.5 seconds
J-STD-002B test B
Thermal Shock
MIL-STD-202G-
method 107
-55/+125 °C
Note: Number of cycles required is 300. Devices mounted
Maximum transfer time is 20 seconds. Dwell time is 15
minutes. Air – Air
±(1.0%+0.0005Ω)
Endurance
MIL-STD-202G-
method 108
70±2ºC, 1000 hours, loaded with RCWV,1.5 hours on and 0.5
hours off
±(2.0%+0.0005Ω)
±(1.0%+0.0005Ω)
IEC 60115-1 4.25.1
Device mounted on PCB test board as described, only 1 board
bending required
Bending for
Bending Strength
IEC60115-1 4.33
0201: 3mm
0402 and above: 2mm
Holding time: minimum 60 seconds
1,000 hours at maximum operating temperature depending on
specification, unpowered
No direct impingement of forced air to the parts
Tolerances:
High Temperature
Exposure
±(1.0%+0.0005Ω)
MIL-STD-202G-
method 108
0201: 125± 3℃
0402 and above 155± 3℃
IEC 60115-1 4.25.3
Each temperature / humidity cycle is defined at 8 hours
(method 106F), 3 cycles / 24 hours for 10d with 25 °C / 65 °C
95% R.H, without steps 7a & 7b, unpowered
Moisture Resistance
MIL-STD-202G-
method 106
± (0.5%+0.0005 Ω)
±(1.0%+0.0005Ω)
Parts mounted on test-boards, without condensation on parts
Measurement at 24± 2 hours after test conclusion
Bias Humidity
MIL-STD-202
1,000 hours at 85ºC/85%R.H. 10% of operating power, no
condensation on the devices, circulating air.
Method 103
PACKAGING
Paper Tape specifications (unit :mm)
Series No.
TTL02
A
B
W
F
E
0.70±0.10
1.250±0.20
1.90±0.20
2.40±0.20
0.40±0.10
0.75±0.20
1.10±0.20
1.65±0.20
8.00±0.30
8.00±0.30
8.00±0.30
8.00±0.30
3.50±0.10
3.50±0.10
3.50±0.20
3.50±0.20
1.75±0.10
1.75±0.10
1.75±0.10
1.75±0.10
TTL04
TTL06
TTL08
Series No.
P1
P0
T
ΦD
+0.1
2.00±0.10
4.00±0.10
TTL02
Max 0.5
Φ1.50
Φ1.50
Φ1.50
Φ1.50
−0.0
+0.1
−0.0
2.00±0.10
4.00±0.10
4.00±0.10
4.00±0.10
4.00±0.10
4.00±0.10
TTL04
TTL06
TTL08
Max 0.6
Max 1.0
Max 1.1
+0.1
−0.0
+0.1
−0.0
Reel dimensions
Symbol
A
B
C
(unit : mm)
(unit : mm)
(unit : mm)
(unit : mm)
9.0±0.5
Φ178.0±5.0
Φ60.0±2.0
Taping quantity
-
-
-
Chip resistors 5,000 pcs per reel ( TTL08, TTL06 )
Chip resistors 10,000 pcs per reel ( TTL04 )
Chip resistors 15,000 pcs per reel ( TTL02 )
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