TTL08PPR2L5DTL

更新时间:2024-10-29 23:00:29
品牌:WALSIN
描述:High Power Thin Film Current Sensor

TTL08PPR2L5DTL 概述

High Power Thin Film Current Sensor

TTL08PPR2L5DTL 数据手册

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TTL02, TTL04, TTL06, TTL08, TTL12,  
TTL20, TTL25  
5% , 1% , 0.5%  
High Power Thin Film Current Sensor  
Size:0201,0402,0603,0805,1206,2010,2512  
*Contents in this sheet are subject to change without prior notice.  
FEATURES  
1. Extra high power rating and low TCR.  
2. Extra low resistance and high precision.  
3. High component and equipment reliability  
4. Low resistances applied to current sensing  
5. RoHS compliant & Halogen Free.  
6. Suitable for lead free soldering.  
APPLICATIONS  
Current sensor  
Medical equipment  
Measuring instrument  
Communication device  
Power supply  
Computer  
DESCRIPTION  
This specification describes TTL series current sensor – Extra high power and low TCR with lead-free  
terminations made by metal film with substrate.  
Quick Reference Data  
Functional code  
Power  
Resistance Resistance  
Series Size Code  
Range  
Tolerance  
TCR  
G
H
I
J
K
M
P
Q
0201  
(0603)  
350ppm/  
150ppm/  
75ppm/  
75ppm/  
75ppm/  
5~20m  
2.5~20m  
5~20m  
5~20m  
5~20m  
1/10W 1/8W 1/5W 1/4W 1/3W  
0402  
(1005)  
1/8W 1/5W 1/4W 1/3W 1/2W  
1/5W 1/4W 1/3W 1/2W  
1/4W 1/3W 1/2W  
0603  
(1608)  
±0.5%  
0805  
(2012)  
(>10m  
)
TTL  
±1%  
1206  
(3216)  
1/4W 1/3W 1/2W 1W  
±5%  
50ppm/  
75ppm/  
100ppm/  
2010  
(5025)  
5~20m  
5~20m  
1W  
2W  
2W  
50ppm/  
75ppm/  
100ppm/  
2512  
(6342)  
1W  
Note :  
1.  
This is the maximum voltage that may be continuously supplied to the resistor element, see “IEC publication  
60115-8”  
2.  
Max. Operation Voltage : So called RCWV (Rated Continuous Working Voltage) is determined by  
RCWV RatedPower ResistanceValue  
Operating Temperature Range  
3.  
0201/0402 : -55°C to +125°C  
0603/0805/1206/2010/2512 : -55°C to +170°C  
DIMENSIONS:(unit:mm)  
Type  
Resistance Range  
L(mm)  
W(mm)  
H(mm)  
I1(mm)  
0.60±0.03  
1.00±0.10  
1.60±0.20  
2.03±0.25  
3.20±0.25  
5.08±0.25  
6.35±0.25  
0.31±0.04  
0.55±0.10  
0.76±0.25  
1.27±0.25  
1.60±0.25  
2.54±0.25  
3.18±0.25  
Max:0.30  
Max:0.35  
0.56±0.25  
0.56±0.25  
0.64±0.25  
0.64±0.25  
0.64±0.25  
0.14±0.16  
0.25±0.10  
0.38±0.25  
0.38±0.25  
0.51±0.25  
0.51±0.25  
0.76±0.25  
5~20m  
2.5~20m  
5~20m  
5~20m  
5~20m  
5~20m  
5~20m  
TTL02  
TTL04  
TTL06  
TTL08  
TTL12  
TTL20  
TTL25  
0201/0402  
0603/0805/1206/2010/2512  
Marking  
0201/0402(No Marking)  
0603/0805(3 digits)  
020=20m  
1206/2010/2512(4 digits)  
R020=20m  
FUNCTIONAL DESCRIPTION  
Product characterization  
Standard values of nominal resistance are taken from the E96 & E24 series for resistors with a tolerance of  
5.0%,1.0%. The values of the E24/E96 series are in accordance with “IEC publication 60063”.  
DERATING  
The power that the resistor can dissipate depends on the operating temperature; see Fig.1&Fig2  
0201/0402 Range: -55°C to +125°C (Fig.1)  
0603 to 2512 Range: -55°C to +170°C (Fig.2)  
MOUNTING  
Due to their rectangular shapes and small tolerances, Surface Mountable Resistors are suitable for  
handling by automatic placement systems.  
Chip placement can be on ceramic substrates and printed-circuit boards (PCBs).  
Electrical connection to the circuit is by individual soldering condition.  
The end terminations guarantee a reliable contact.  
SOLDERING CONDITION  
The robust construction of chip resistors allows them to be completely immersed in a solder bath of 260C  
for 10 seconds. Therefore, it is possible to mount Surface Mount Resistors on one side of a PCB and other  
discrete components on the reverse (mixed PCBs).  
Surface Mount Resistors are tested for solderability at 235C during 2 seconds within lead-free solder bath.  
The test condition for no leaching is 260C for 30 seconds. Typical examples of soldering profile and  
condition that provide reliable joints without any damage are given in Fig 3. and Table 1.  
Fig. 3 Infrared soldering profile for Chip Resistors  
Table 1. Infrared soldering condition for Chip Resistors  
Temperature Condition  
Average ramp-up rate (217C to 260C)  
Between 150 and 200C  
> 217C  
Exposure Time  
Less than 3C/second  
Between 60-120 seconds  
Between 60-150 seconds  
260ºC +0/-5C  
Peak Temperature  
Min. 30 seconds  
Time within 245C  
Ramp-down rate (Peak to 217C)  
Time from 25C to Peak  
Less than 6C/second  
No greater than 480 seconds  
CATALOGUE NUMBERS  
TTL  
02  
Q
N
XXXX  
F
T
L
Tolerance  
Packaging  
code  
Termination  
Code  
Type code  
Size code  
02: 0201  
04: 0402  
06: 0603  
08: 0805  
12: 1206  
20: 2010  
25: 2512  
Power Rating  
Q:2W  
TCR  
N:50ppm/  
O:75ppm/  
P:100ppm/  
Q:150ppm/  
R:200ppm/  
U:350ppm/  
Resistance  
e.g. :  
Low  
Resistance  
D: 0.5%  
F: 1.0%  
J : 5.0%  
R020 = 20mΩ  
R005 = 5mΩ  
R2L5 =2.5mΩ  
P:1W  
L: Sn base  
(lead-free)  
T: 7Taped &  
Reeled  
M:1/2W  
K:1/3W  
J:1/4W  
I:1/5W  
H:1/8W  
G:1/10W  
Recommend Solder Pad Dimensions  
Type  
Resistance Range  
5~20m  
A(mm)  
1.00  
2.00  
2.52  
2.54  
3.90  
6.10  
7.36  
B(mm)  
0.30  
0.40  
0.50  
0.50  
0.76  
3.30  
4.06  
C(mm)  
D(mm)  
TTL02  
TTL04  
TTL06  
TTL08  
TTL12  
TTL20  
TTL25  
0.35  
0.80  
1.01  
1.02  
1.57  
1.40  
1.65  
0.40  
0.60  
1.01  
1.27  
1.78  
3.05  
3.68  
2.5~20m  
5~20m  
5~20m  
5~20m  
5~20m  
5~20m  
TEST AND REQUIREMENTS(JIS C 5201-1 : 1998)  
REQUIREMENT  
Resistor  
TEST  
PROCEDURE  
D: ±0.5%,F: ±1%, G: ±5%  
DC resistance  
IEC 60115-1 / JIS  
C 5201-1 , Clause  
4.5  
Within the specified tolerance  
Temperature  
Coefficient of  
Natural resistance change per change in degree Refer to  
centigrade.  
“ QUICK REFERENCE DATA “  
Resistance(T.C.R)  
(ppm/ C)  
R1 : Resistance at reference temperature  
R2 : Resistance at test temperature  
t1 : 20°C+5°C-1°C  
t2 : 125°C+5°C-1°C  
5 times of rated power for 5 seconds at room temperature No visible damage  
±(1.0%+0.0005Ω)  
Short time overload  
(S.T.O.L)  
IEC60115-1 4.13  
Resistance to  
soldering  
heat(R.S.H)  
MIL-STD-202G-  
method 210F  
IEC 60115-1 4.18  
Condition B, no pre-heat of samples  
No visible damage  
Leadfree solder, 260 °C, 10 seconds immersion time  
±(0.5%+0.0005Ω)  
Procedure 2 for SMD: devices fluxed and cleaned with  
isopropanol  
SMD conditions:  
1st step: method B, aging 4 hours at 155 °C dry heat  
2nd step: leadfree solder bath at 245± 3 °C  
Solderability  
good tinning (>95% covered)  
IPC/JEDEC  
no visible damage  
J-STD-002B test B  
Dipping time: 3± 0.5 seconds  
Thermal Shock  
MIL-STD-202G-  
method 107  
-55/+125 °C  
±(1.0%+0.0005Ω)  
Note: Number of cycles required is 300. Devices mounted  
Maximum transfer time is 20 seconds. Dwell time is 15  
minutes. Air – Air  
Endurance  
MIL-STD-202G-  
method 108  
70±2ºC, 1000 hours, loaded with RCWV,,1.5 hours on ±(1.0%+0.0005Ω)  
and 0.5 hours off  
IEC 60115-1 4.25.1  
1,000 hours at 85ºC/85%R.H. 10% of operating power,  
±(1.0%+0.0005Ω)  
Bias Humidity  
MIL-STD-202  
no condensation on the devices, circulating air.  
Method 103  
Device mounted on PCB test board as described, only 1  
±(1.0%+0.0005Ω)  
Bending Strength  
IEC60115-1 4.33  
board bending required  
Bending for  
0201: 3mm  
0402 and above: 2mm  
Holding time: minimum 60 seconds  
High Temperature  
Exposure  
MIL-STD-202G-  
1,000 hours at maximum operating temperature  
±(1.0%+0.0005Ω)  
depending on specification, unpowered  
No direct impingement of forced air to the parts  
Tolerances:  
method 108  
0201/0402 125± 3  
IEC 60115-1 4.25.3  
0603 and above 170± 3  
Moisture Resistance Each temperature / humidity cycle is defined at 8 hours ± (0.5%+0.0005 Ω)  
MIL-STD-202G-  
method 106  
(method 106F), 3 cycles / 24 hours for 10d with 25 °C / 65  
°C 95% R.H, without steps 7a & 7b, unpowered  
Parts mounted on test-boards, without condensation on  
parts  
Measurement at 24± 2 hours after test conclusion  
PACKAGING  
Paper Tape specifications (unit: mm)  
Series No.  
TTL02  
TTL04  
TTL06  
TTL08  
TTL12  
TTL20  
TTL25  
A
B
W
F
E
0.720±0.05  
1.20±0.10  
1.90±0.20  
2.40±0.20  
3.60±0.20  
5.50±0.20  
6.90±0.20  
0.42±0.05  
0.7±0.10  
1.10±0.20  
1.65±0.20  
2.00±0.20  
2.80±0.20  
3.60±0.20  
8.00±0.30  
8.00±0.30  
8.00±0.30  
8.00±0.30  
8.00±0.30  
12.00±0.30  
12.00±0.30  
3.50±0.05  
3.50±0.05  
3.50±0.20  
3.50±0.20  
3.50±0.20  
5.50±0.10  
5.50±0.10  
1.75±0.10  
1.75±0.10  
1.75±0.10  
1.75±0.10  
1.75±0.10  
1.75±0.10  
1.75±0.10  
Series No.  
P1  
P0  
T
D  
0.1  
0.0  
2.00±0.10  
4.00±0.10  
0.4±0.05  
TTL02  
1.50  
0.1  
2.00±0.10  
4.00±0.10  
4.00±0.10  
4.00±0.10  
4.00±0.10  
4.00±0.10  
4.00±0.10  
4.00±0.10  
4.00±0.10  
4.00±0.10  
4.00±0.10  
4.00±0.10  
0.40±0.05  
0.65±0.05  
Max. 1.0  
Max. 1.0  
Max 1.2  
Max 1.2  
TTL04  
TTL06  
TTL08  
TTL12  
TTL20  
TTL25  
1.50  
0.0  
0.1  
0.0  
1.50  
0.1  
0.0  
1.50  
0.1  
0.0  
1.50  
0.1  
0.0  
1.50  
0.1  
0.0  
1.50  
Reel Dimensions:  
C
B
A
D
Symbol  
(unit : mm)  
A
B
C
D
13.0±0.2  
9.0±0.5  
178.0±2.0  
60.0±1.0  
Taping Quantity  
-
-
-
-
Chip resistors 4,000 pcs per reel ( TTL25, TTL20 )  
Chip resistors 5,000 pcs per reel ( TTL12, TTL08, TTL06 )  
Chip resistors 10,000 pcs per reel ( TTL04 )  
Chip resistors 15,000 pcs per reel ( TTL02 )  

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