TTL25QNR010FTL [WALSIN]
High Power Thin Film Current Sensor;
| 型号： | TTL25QNR010FTL |
| 厂家： | 
Walsin Technology |
| 描述： | High Power Thin Film Current Sensor |
| 文件： | 总12页 (文件大小：3791K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TTL12、TTL25
±1% , ±0.5%
High Power Thin Film Current Sensor
(RoHS Compliant 、Halogen Free)
Size: 1206、2512
FEATURES
1. Extra high power rating and low TCR.
2. Extra low resistance and high precision.
3. High component and equipment reliability
4. Low resistances applied to current sensing
5. RoHS compliant & Halogen Free.
6. Suitable for lead free soldering.
APPLICATIONS
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Current sensor
Medical equipment
Measuring instrument
Communication device
Power supply
Computer
DESCRIPTION
This specification describes TTL series current sensor – Extra high power and low TCR with lead-free
terminations made by metal film or metal foil with substrate.
Quick Reference Data
Functional code
Power(W)
Resistance
Range
Resistance
Tolerance
TCR
Series
TTL
Size
( ppm/℃)
mΩ
M
P
Q
%
1206
(3216)
1/2
1
1~4 m
5~9 m
Ω
Ω
±1%(F)
O
：
±75
1206
(3216)
TTL
TTL
TTL
TTL
1/2
1
1
1
1
±1%(F)
N
N
：
：
±50
±50
1206
(3216)
±0.5%(D)
±1%(F)
10~100 m
Ω
1206
(3216)
±0.5%(D)
±1%(F)
5~100 m
Ω
P
：
：
±100
±100
2512
(6432)
2
2
2~9 m
Ω
±1%(F)
P
P
N
：
±50
2512
(6432)
±0.5%(D)
±1%(F)
TTL
1
10~100 mΩ
：
±100
Note :
1.
This is the maximum voltage that may be continuously supplied to the resistor element, see “IEC publication
60115-8”
2.
Max. Operation Voltage : So called RCWV (Rated Continuous Working Voltage) is determined by
RCWV = Rated Power ×Resistance Value
DIMENSIONS:(unit:mm)
1206 Series
Resistance Range(mΩ)
Type
L(mm)
W(mm)
H(mm)
I1(mm)
TTL12PO
TTL12MO
0.40±0.25
1.25±0.30
1.05±0.30
0.80±0.30
0.60±0.30
0.60±0.30
0.68±0.30
0.68±0.30
1
3.20±0.25
1.60±0.25
TTL12PO
TTL12MO
0.40±0.25
0.40±0.25
0.40±0.25
0.40±0.25
0.65±0.20
0.65±0.20
2
3
3.20±0.25
3.20±0.25
3.20±0.25
3.20±0.25
3.30±0.20
3.30±0.20
1.60±0.25
1.60±0.25
1.60±0.25
1.60±0.25
1.70±0.20
1.70±0.20
TTL12PO
TTL12MO
TTL12PO
TTL12MO
4
TTL12PN
TTL12MN
5~9
5~100
10~100
TTL12PP
TTL12MP
TTL12PN
TTL12MN
TTL12 PO(MO)_(1~4mΩ)；TTL12 PN(MN)_(5~9mΩ)
TTL12 PP(MP)_(5~100 mΩ)；TTL12 PN(MN)_(10~100 mΩ)
Mark (4digits)
(R010=10 mΩ)
2512 Series
Resistance Range(mΩ)
Type
L(mm)
W(mm)
H(mm)
I1(mm)
TTL25QP
TTL25PP
0.65±0.20
2.80±0.30
2.60±0.30
1.05±0.30
2
6.40±0.30
3.20±0.30
TTL25QP
TTL25PP
0.65±0.20
0.65±0.20
3
6.40±0.30
6.40±0.30
3.20±0.30
3.20±0.30
TTL25QP
TTL25PP
4~9
TTL25QP
TTL25PP
TTL25QN
TTL25PN
0.65±0.20
1.05±0.30
10~100
6.40±0.30
3.20±0.30
TTL25QP(PP)_ (2~100 mΩ)
、TTL25QN(PN)_ (10~100 mΩ)
Mark (4digits)
(R010=10 mΩ)
FUNCTIONAL DESCRIPTION
Product characterization
Power rating is based on continuous full load operation at rated ambient temperature of 70 ºC. For resistors operated at
ambient temp. in excess of 70 ºC, the maximum load shall be derated in accordance with the following curve.
The power that the resistor can dissipate depends on the operating temperature; see Fig.1&Fig2
Temperature range of size 1206 to 2512: -55°C to +1 55°C (Fig.2)
MOUNTING
Due to their rectangular shapes and small tolerances, Surface Mountable Resistors are suitable for
handling by automatic placement systems.
Chip placement can be on ceramic substrates and printed-circuit boards (PCBs).
Electrical connection to the circuit is by individual soldering condition.
The end terminations guarantee a reliable contact.
SOLDERING CONDITION
The robust construction of chip resistors allows them to be completely immersed in a solder bath of 260°C
for 10 seconds. Therefore, it is possible to mount Surface Mount Resistors on one side of a PCB and other
discrete components on the reverse (mixed PCBs).
Surface Mount Resistors are tested for solderability at 235
°C during 2 seconds within lead-free solder bath.
The test condition for no leaching is 260 C for 30 seconds. Typical examples of soldering profile and
°
condition that provide reliable joints without any damage are given in Fig 3. and Table 1.
Fig. 3 Infrared soldering profile for Chip Resistors
Table 1. Infrared soldering condition for Chip Resistors
Temperature Condition
Average ramp-up rate (217 C to 260
Between 150 and 200
> 217
Peak Temperature
Time within 245
Ramp-down rate (Peak to 217
Time from 25 C to Peak
Exposure Time
Less than 3 C/second
°
°C)
°
Between 60-120 seconds
Between 60-150 seconds
°C
°C
260ºC +0/-5
Min. 30 seconds
Less than 6 C/second
No greater than 480 seconds
°C
°C
°C)
°
°
CATALOGUE NUMBERS
TTL
12
P
O
XXXX
F
T
L
Type code
Size code
Power Rating
TCR
Resistance
Tolerance Packaging Termination
code
code
Low
12:1206
25:2512
Q:2 W
N:50 ppm/℃
O:75ppm/℃
P:100 ppm/℃
e.q
D: ±0.5%
F: ±1%
T:7” Taped
Reeled
L:Sn Base
Resistance
P:1 W
R003=3mΩ
R010=10mΩ
R2L5=2.5mΩ
(Lead free)
M:1/2 W
Recommend Solder Pad Dimensions
Dimensions of solder Pad :
Type
Resistance Range
A(mm)
4.80
4.80
4.80
9.30
9.30
9.30
B(mm)
C(mm)
D(mm)
TTL12
TTL12
TTL12
TTL25
TTL25
TTL25
0.50
0.60
1.20
0.6
2.15
2.10
1.80
4.35
4.20
3.10
1.84
1.84
1.84
3.57
3.57
3.57
1
2
m
m
Ω
Ω
m
3~100
Ω
Ω
2
3
m
m
Ω
Ω
m
0.9
3.1
4~100
TEST AND REQUIREMENTS(JIS C 5201-1 : 1998)
REQUIREMENT
TEST
PROCEDURE
Resistor
DC resistance
IEC 60115-1 / JIS
C 5201-1 , Clause
4.5
D: ±0.5%,F: ±1%,
Within the specified tolerance
Natural resistance change per change in degree centigrade.
R2
−
R1
×
106
R
(
t2
−
t1
)
1
Temperature
Coefficient of
Resistance(T.C.R)
(ppm/°C)
Refer to
R1 : Resistance at reference temperature
R2 : Resistance at test temperature
t1 : 20°C+5°C-1°C
“ QUICK REFERENCE DATA “
t2 : 125°C+5°C-1°C
Short time overload
(S.T.O.L)
No visible damage
2.5 times of rated power for 5 seconds at room temperature
±(1.0%+0.0005Ω)
IEC60115-1 4.13
Resistance to
soldering heat(R.S.H)
Condition B, no pre-heat of samples
No visible damage
MIL-STD-202G-
method 210F
Through reflow, 275± 3 °C, 20±1 seconds
±(1.0%+0.0005Ω)
IEC 60115-1 4.18
Solderability
SMD conditions:
Dip into leadfree solder bath at 245± 3 °C
good tinning (>95% covered)
no visible damage
IPC/JEDEC
Dipping time: 3± 0.5 seconds
J-STD-002B test B
Thermal Shock
MIL-STD-202G-
method 107
-55°C 30min → Room Temp. 3min → +125 °C 30min→ Room
±(1.0%+0.0005Ω)
Temp. 3min
Number of cycles required is 100 time.
Endurance
MIL-STD-202G-
method 108
70±2ºC, 1000 hours, loaded with RCWV,1.5 hours on and 0.5
hours off
±(2.0%+0.0005Ω)
±(1.0%+0.0005Ω)
IEC 60115-1 4.25.1
Device mounted on PCB test board as described, only 1 board
bending required
Bending for
Bending Strength
IEC60115-1 4.33
0201: 3mm
0402 and above: 2mm
Holding time: minimum 60 seconds
1,000 hours at maximum operating temperature depending on
specification, unpowered
No direct impingement of forced air to the parts
Tolerances:
High Temperature
Exposure
±(1.0%+0.0005Ω)
± (2.0%+0.0005 Ω)
MIL-STD-202G-
method 108
0201: 125± 3℃
0402 and above 155± 3℃
IEC 60115-1 4.25.3
Moisture Load Life
The test environment is 60 °C /95% R.H .
Test waveform is RCWV at 90 minute on, without power is 30
minute off.
Test time is continuous 1000 hours.
Low Temp. Storage
MIL-STD-202G-
method 108
1,000 hours at minimum operating temperature depending on
specification, unpowered
No direct impingement of forced air to the parts
Tolerances:
±(1.0%+0.0005Ω)
± (1.0%+0.0005 Ω)
Any package size -55± 3°C
IEC 60115-1 4.25.3
Peak value: A=100 g’s
Mechanical Shock
Duration: 11 ms
Velocity shock= 5 time
IEC60115-1 4.21
PACKAGING
Paper Tape specifications (unit :mm)
Series No.
TTL12
A
B
W
F
E
3.65±0.20
6.75±0.20
2.05±0.20
3.40±0.20
8.00±0.30
12.00±0.30
3.50±0.20
5.50±0.10
1.75±0.10
1.75±0.10
TTL25
Series No.
P1
P0
T
ΦD
+0.1
4.00±0.10
4.00±0.10
TTL12
Max 1.1
Φ1.50
−0.0
+0.1
−0.0
4.00±0.10
4.00±0.10
TTL25
Max 1.2
Φ1.50
Reel dimensions
Symbol
A
B
C
(unit : mm)
(unit : mm)
(unit : mm)
(unit : mm)
9.0±0.5
Φ178.0±5.0
Φ60.0±2.0
Taping quantity
-
-
Chip resistors 4,000 pcs per reel ( TTL25)
Chip resistors 5,000 pcs per reel ( TTL12)
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