TTU08PPR0L5FTL [WALSIN]

Measuring instrument;


型号：	TTU08PPR0L5FTL
厂家：	Walsin Technology
描述：	Measuring instrument
文件：	总11页 (文件大小：1549K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

TTU25

ê5% , ê1%

Ultra Low TCR / High Power

Current Sensor

Size: 2512

*Contents in this sheet are subject to change without prior notice.

FEATURES

1. High Power rating in Small package size 2512 with Low TCR 50 ppm/

2. Extra low Resistance down to 0.001Ω with High Power Rating 3W

3. 170 Operating Temperature Certainly .

4.Suitable for Lead Free Soldering .

APPLICATIONS

Current sensor

Medical equipment

Measuring instrument

Communication device

Power supply

Computer

White Good

DESCRIPTION

This specification describes TTU series current sensor – Extra high power and low TCR with lead-free

terminations made by metal alloy plate.

High power (TTU25,100PPM )

Ultra Low TCR /High Power ( TTU 25, 50ppm )

Quick Reference Data

High Power

Functional code

Power

Resistance

Range

Operating

Temperature

Resistance

Tolerance

Series Size Code

TCR

( mΩ)

±1%

±5%

2512

TTU

-55 to +155

100ppm/

(6342)

Ultra Low TCR /High Power

Functional code

Power

Resistance

Range

Operating

Temperature

Resistance

Tolerance

Series Size Code

TCR

( mΩ)

1, 1.5, 2,

2.5, 3, 3.5

±1%

±5%

2512

TTU

-55 to +170

50ppm/

2.5W

4, 4.5, 5, 6

(6342)

6.5, 7, 7.5,

8, 9, 10

Note :

This is the maximum voltage that may be continuously supplied to the resistor element, see “IEC

publication 60115-8”

Max. Operation Voltage : So called RCWV (Rated Continuous Working Voltage) is determined by

RCWV = RatedPower ìResistanceValue

DIMENSIONS:(unit:mm)

2512

High Power :

Type

Resistance Range

(mΩ)

L(mm)

W(mm)

C(mm)

TTU2512

6.40±0.25

3.20±0.25

2.65±0.25

Ultra Low TCR /High Power :

Resistance Range

Type

(mΩ)

L(mm)

W(mm)

C(mm)

TTU2512

1.5

6.35±0.25

3.0±0.2

1.93±0.25

1.43±0.25

1.18±0.25

2.18±0.25

1.93±0.25

1.43±0.25

1.18±0.25

2, 2.5, 3, 3.5

4, 4.5

5, 6

6.5, 7, 7.5

8, 9, 10

Marking

2512(4 digits)

R002=2mR

FUNCTIONAL DESCRIPTION

DERATING

The power that the resistor can dissipate depends on the operating temperature; see Fig2

High Power :

Ultra Low TCR /High Power :

MOUNTING

Due to their rectangular shapes and small tolerances, Surface Mountable Resistors are suitable for

handling by automatic placement systems.

Chip placement can be on ceramic substrates and printed-circuit boards (PCBs).

Electrical connection to the circuit is by individual soldering condition.

The end terminations guarantee a reliable contact.

SOLDERING CONDITION

The robust construction of chip resistors allows them to be completely immersed in a solder bath of 260èC

for 10 seconds. Therefore, it is possible to mount Surface Mount Resistors on one side of a PCB and other

discrete components on the reverse (mixed PCBs).

Surface Mount Resistors are tested for solderability at 235èC during 2 seconds within lead-free solder bath.

The test condition for no leaching is 260èC for 30 seconds. Typical examples of soldering profile and

condition that provide reliable joints without any damage are given in Fig 3. and Table 1.

Fig. 3 Infrared soldering profile for Chip Resistors

Table 1. Infrared soldering condition for Chip Resistors

Temperature Condition

Average ramp-up rate (217èC to 260èC)

Between 150 and 200èC

> 217èC

Exposure Time

Less than 3èC/second

Between 60-120 seconds

Between 60-150 seconds

260ºC +0/-5èC

Peak Temperature

Min. 30 seconds

Time within 245èC

Ramp-down rate (Peak to 217èC)

Time from 25èC to Peak

Less than 6èC/second

No greater than 480 seconds

CATALOGUE NUMBERS

TTU

XXXX

Tolerance Packaging

code

F: 1.0%

Termination

Code

Type code

Size code

Power

Rating

TCR

Resistance

S: 3W

e.g. :

R001=1mΩ

R0L5=0.5mΩ

R3L5=3.5 mΩ

R010=10 mΩ

25: 2512

P: 100ppm

N: 50ppm

L: Sn base

(lead free)

High Power

J : 5.0%

T: 7” Taped

R: 2.5W

Q: 2W

P: 1W

& Reeled

Ultra Low TCR

/High Power

Current Sensor

Recommend Solder Pad Dimensions

2- wire pad layout

High Power :

Type

Resistance Range

(mΩ)

A(mm)

B(mm)

C(mm)

D(mm)

TTU2512

8.00

1.00

3.50

4.00

Ultra Low TCR /High Power :

TTU2512

1.5

6.8

2.04

3.04

3.54

1.54

2.04

3.04

3.54

2.38

1.88

1.63

2.63

2.38

1.88

1.63

3.4

2, 2.5, 3, 3.5

4, 4.5

5, 6

6.5, 7, 7.5

8, 9, 10

4-wire pad layout

High Power/ Ultra Low TCR

Resistance Range

Type

(mΩ)

B(mm)

C(mm)

D(mm)

E(mm)

TTU2512

1.5

2.04

3.04

3.54

1.54

2.04

3.04

3.54

2.38

1.88

1.63

2.63

2.38

1.88

1.63

1.0

1.2

2, 2.5, 3, 3.5

4, 4.5

5, 6

6.5, 7, 7.5

8, 9, 10

TEST AND REQUIREMENTS(JIS C 5201-1 : 1998)

REQUIREMENT

Resistor

TEST

PROCEDURE

DC resistance

Within the specified

tolerance

F: ±1%, G: ±5%

IEC 60115-1 / JIS C

5201-1 , Clause 4.5

Natural resistance change per change in degree centigrade.

Refer to

Temperature

(ppm/èC)

R₁: Resistance at reference temperature

R₂: Resistance at test temperature

t₁: 20°C+5°C-1°C

“ QUICK REFERENCE

DATA “

Coefficient of

Resistance(T.C.R)

IEC 60115-1 4.8.4.1

t2 : 125°C+5°C-1°C

No visible damage

<±(0.5%)

High Power series

2.5 times of rated power for 5 seconds at room temperature

Short time Overload

(S.T.O.L)

IEC60115-1 4.13

Ultra Low TCR/High Power Series :

5 times the rated power is applied to the resistor for 5 seconds and

<±(1.0%)

the change in resistance is measured after 30mins

High Power Series :

Condition B, no pre-heat of samples

No visible damage

<±(0.5%)

Resistance to soldering

heat(R.S.H)

Leadfree solder, 260 °C, 10 seconds immersion time

MIL-STD-202G-method Procedure 2 for SMD:devices fluxed and cleaned with isopropanol

210F

IEC 60115-1 4.18

Ultra Low TCR/High Power Series :

The resistor is immersed in solder bath at 260±5oC for 10±1secs

<±(1.0%)

and the resistance is measured 1hr after the test.

High Power Series:

SMD conditions:

1st step: method B, aging 4 hours at 155 °C dry heat

2nd step: lead-free solder bath at 245± 3 °C

Dipping time: 3 0.5 seconds

Solderability

good tinning (>95%

covered)

IPC/JEDEC

no visible damage

J-STD-002B test B

Ultra Low TCR/High Power Series :

The resistor is immersed in solder bath at 260±5°C for 2±0.5secs.

High Power series

-55/+155 °C

Note: Number of cycles required is 300. Devices mounted.

Maximum transfer time is 20 seconds. Dwell time is 15 minutes and

Thermal Shock

MIL-STD-202G-method

107

the change in resistance is measured after 2hrs.

<±(1.0%)

Ultra Low TCR/High Power Series :

-55/+150 C

Note: Number of cycles required is 1000. Devices mounted .

Maximum transfer time is 20 seconds. Dwell time is 15 minutes and

the change in resistance is measured after 2hrs.

Endurance

MIL-STD-202G-method 70±2ºC, 1000 hours, loaded with RCWV,,1.5 hours on and 0.5

<±(1.0%)

108

hours off

IEC 60115-1 4.25.1

High Power series

1,000 hours at 85ºC/85%R.H. no condensation on the devices,

circulating air.

Humidity(Steady State)

MIL-STD-202

Ultra Low TCR/High Power Series :

The resistor is placed in a chamber for 1000hrs at 40±2 ºC, 90~95%

RH. The rated power is applied to the resistor (duty cycle: 90mins

ON, 30mins OFF). The change in resistance is measured 60mins

after removal from test chamber.

Method 103 /

IEC 60115-1 4.24.2

High Power series

Device mounted on PCB test board as described, only 1 board

bending required

Bending : 2mm

Bending Strength

IEC60115-1 4.33

Holding time: minimum 60±1secs

<±(1.0%)

Ultra Low TCR/High Power Series :

The resistor is re-flow soldered to a test board and placed in a test

fixture. Pressure is applied to achieve bending amplitude of 3mm for

10secs. The change in resistance is measured before and during

the pressurization.

High Power series

1,000 hours at maximum operating temperature depending on

specification, unpowered

No direct impingement of forced air to the parts

Tolerances:

High Temperature

Exposure

<±(1.0%)

MIL-STD-202G-method

108

0805 and above 155 5℃

Ultra Low TCR/High Power Series :

IEC 60115-1 4.25.3

The resistor is placed in a constant temperature-humidity chamber

at 170±2oC for 1000hrs and the resistance is measured 60mins

after the end of the cycle.

High Power series :

The resistor is placed in a chamber at -55℃ and the rated

Low Temperature

Storage

<±(0.5%)

power is applied to the resistor for 1,000 hrs. The change in

resistance is measured 60min after removal from test

chamber.

Ultra Low TCR/High Power Series :

Low Temperature

Operation

The resistor is placed in a chamber at -65±2℃ and the rated power

is applied to the resistor for 24hrs. The change in resistance is

measured 60min after removal from test chamber.

<±(1.0%)

>100 MΩ

Insulation Resistance

Clause 4.6

100V DC for 1 minute.

PACKAGING

Paper Tape specifications (unit :mm)

Series No.

TTU25 /High Power (1mΩ )

TTU25 /Ultra Low TCR

6.70±0.20

6.75±0.10

3.50±0.20

3.40±0.10

12.00±0.30

12.00±0.1

5.50±0.05

1.75±0.10

Series No.

+0.1

-0.0

4.00±0.10

TTU25 /High Power (1mΩ )

Max 1.1

F1.50

+0.1

-0.0

4.00±0.10

0.81±0.10

TTU25 /Ultra Low TCR

F1.50

Reel dimensions

Symbol

(unit : mm)

13.0±0.2

9.0±0.5

F178.0±2.0

F60.0±1.0

Taping quantity :

4,000 pcs per reel with embossed Tape: TTU25 /High Power (1mΩ )

2,000 pcs per reel with embossed Tape: TTU25 /Ultra Low TCR /High Power (1mΩ~10mΩ )

TTU08PPR0L5FTL [WALSIN]

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