UF15N1R0B250CT [WALSIN]

Microwave MLCC with Narrow-Tolerance;


型号：	UF15N1R0B250CT
厂家：	Walsin Technology
描述：	Microwave MLCC with Narrow-Tolerance
文件：	总8页 (文件大小：2542K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Multilayer Ceramic Capacitors

Approval Sheet

MULTILAYER CERAMIC CAPACITORS

Microwave MLCC with Narrow-Tolerance (UF)

0402 Size (25V & 50V)

NP0 Dielectric

Halogen Free & RoHS Compliance

*Contents in this sheet are subject to change without prior notice.

Page 1 of 8

ASC_Microwave_with_Narrow_Tol_(UF)

Jul. 2019

Multilayer Ceramic Capacitors

Approval Sheet

1. INTRODUCTION

MLCC consists of a conducting material and electrodes. To manufacture a chip-type SMT and achieve

miniaturization, high density and high efficiency, ceramic condensers are used.

WTC UF series MLCC is used at high frequencies generally have a small temperature coefficient of capacitance,

typical within the ±30ppm/°C required for NP0 (C0G) classification, Ultra-narrow tolerance of capacitance and have

excellent conductivity internal electrode. Thus, WTC UF series MLCC will be with the feature of low ESR and high Q

characteristics.

2. FEATURES

3. APPLICATIONS

a. High Q and low ESR performance at high frequency.

a. Telecommunication products & equipments: Mobile

b. Ultra low capacitance to 0.05pF.

phone, WLAN, Base station.

c. Can offer ultra-narrow tolerance to ±0.02pF.

d. Quality improvement of telephone calls for low

power loss and better performance.

b. RF module: Power amplifier, VCO.

c. Tuners.

4. HOW TO ORDER

R05

250

Series

Size

Dielectric

Capacitance

Tolerance

Rated voltage

Termination

Packaging

UF= Microwave 15=0402 (1005) N=NP0

MLCC with

Two significant

P=±0.02pF Two significant

C=Cu/Ni/Sn

T=7” reeled

digits followed by Q=±0.03pF digits followed by

no. of zeros. And A=±0.05pF no. of zeros. And

G= 13” reeled

narrow-tolerance

R is in place of

decimal point.

B=±0.1pF R is in place of

decimal point.

eg.:

250=25 VDC

500=50 VDC

R05=0.05pF

0R5=0.5pF

1R0=1.0pF

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Jul. 2019

Multilayer Ceramic Capacitors

Approval Sheet

5. EXTERNAL DIMENSIONS

Size

L (mm)

W (mm)

T (mm)/Symbol Remark

0.50±0.05

M_B(mm)

Inch (mm)

0402 (1005)

1.00±0.05

0.50±0.05

0.25+0.05/-0.10

# Reflow soldering only is recommended.

M_B

Fig. 1 The outline of MLCC

6. GENERAL ELECTRICAL DATA

Dielectric

NP0

Size

0402

Capacitance*

0.05pF to 3pF

P (±0.02pF ), Q (±0.03pF), A (±0.05pF ), B (±0.1pF)

Capacitance tolerance

Rated voltage (WVDC)

Q**

25V, 50V

Q≥400+20C

Insulation resistance at Ur

Operating temperature

Capacitance change

Termination

≥10GΩ or RxC≥100Ω-F whichever is smaller.

-55 to +125°C

±30ppm/°C

Ni/Sn (lead-free termination)

** Measured at the conditions of 25°C ambient tempe rature and 30~70% related humidity.

Apply 1.0±0.2Vrms, 1.0MHz±10%

7. PACKAGING DIMENSION AND QUANTITY

Paper tape

Size

Thickness (mm)/Symbol

7” reel

13” reel

50,000

0402 (1005)

0.50±0.05

10,000

Unit: pieces

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ASC_Microwave_with_Narrow_Tol_(UF)

Jul. 2019

Multilayer Ceramic Capacitors

Approval Sheet

8. CAPACITANCE RANGE

DIELECTRIC

SIZE

NP0

0402

Tolerance

RATED VOLTAGE (VDC)

0.05pF (R05)

0.1pF (0R1)

0.2pF (0R2)

0.3pF (0R3)

0.4pF (0R4)

0.5pF (0R5)

0.6pF (0R6)

0.7pF (0R7)

0.8pF (0R8)

0.9pF (0R9)

1.0pF (1R0)

1.1pF (1R1)

1.2pF (1R2)

1.3pF (1R3)

1.5pF (1R5)

1.6pF (1R6)

1.8pF (1R8)

2.0pF (2R0)

2.2pF (2R2)

2.4pF (2R4)

2.7pF (2R7)

3.0pF (3R0)

P, Q, A

A, B

1. The letter in cell is expressed the symbol of product thickness.

2. For more information about products with special capacitance or other data, please contact WTC local representative.

Page 4 of 8

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Multilayer Ceramic Capacitors

Approval Sheet

9. RELIABILITY TEST CONDITIONS AND REQUIREMENTS

No.

Item

Test Conditions

Requirements

1. Visual and

Mechanical

---

* No remarkable defect.

* Dimensions to conform to individual specification sheet.

2. Capacitance

3. Q/ D.F.

(Dissipation

Factor)

1.0±0.2Vrms, 1MHz±10%

* Shall not exceed the limits given in the detailed spec.

At 25°C ambient temperature.

* 0402/25V~50V: Q≥400+20C

*To apply voltage: 250% of rated voltage.

*Duration: 1 to 5 sec.

4. Dielectric

Strength

* No evidence of damage or flash over during test.

*Charge & discharge current less than 50mA.

5. Insulation

Resistance

To apply rated voltage for max. 120 sec.

≥10GΩ or RxC≥100Ω-F whichever is smaller

6. Temperature

Coefficient

With no electrical load.

* Capacitance change: within ±30ppm/°C;

Operating temperature: -55~125°C at 25°C

7. Adhesive

Strength of

Termination

8. Vibration

Resistance

* Pressurizing force：

* No remarkable damage or removal of the terminations.

0402 to 0603: 5N

* Test time: 10±1 sec.

* Vibration frequency: 10~55 Hz/min.

* Total amplitude: 1.5mm

* No remarkable damage.

* Cap change and Q/D.F.: To meet initial spec.

* Test time: 6 hrs. (Two hrs each in three mutually

perpendicular directions.)

*Cap./DF(Q) Measurement to be made after de-aging at 150°C

for 1hr then set for 24±2 hrs at room temp.

* Solder temperature: 235±5°C

* Dipping time: 2±0.5 sec.

9. Solderability

95% min. coverage of all metalized area.

10. Bending Test * The middle part of substrate shall be pressurized by means * No remarkable damage.

of the pressurizing rod at a rate of about 1 mm per second until * Cap change: within ±5.0% or ±0.5pF whichever is larger.

the deflection becomes 1 mm and then the pressure shall be

maintained for 5±1 sec.

(This capacitance change means the change of capacitance under

specified flexure of substrate from the capacitance measured before

the test.)

* Measurement to be made after keeping at room temp. for

24±2 hrs.

11. Resistance to * Solder temperature: 260±5°C

Soldering Heat * Dipping time: 10±1 sec

* Preheating: 120 to 150°C for 1 minute before imme rse the

* No remarkable damage.

* Cap change: within ±2.5% or ±0.25pF whichever is larger.

* Q/D.F., I.R. and dielectric strength: To meet initial requirements.

* 25% max. leaching on each edge.

capacitor in a eutectic solder.

*Cap. / DF(Q) / I.R. Measurement to be made after de-aging at

150°C for 1hr then set for 24±2 hrs at room temp.

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Multilayer Ceramic Capacitors

Approval Sheet

No.

Item

Test Condition

Requirements

12. Temperature

Cycle

* Conduct the five cycles according to the temperatures and

time.

* No remarkable damage.

* Cap change：within ±2.5％ or ±0.25pF whichever is larger.

Step

Temp. (°C)

Min. operating temp. +0/-3

Room temp.

Time (min.)

30±3

* Q/D.F., I.R. and dielectric strength: To meet initial requirements.

2~3

Max. operating temp. +3/-0

Room temp.

30±3

2~3

* Cap. / DF(Q) / I.R. Measurement to be made after de-aging at

150°C for 1hr then set for 24±2 hrs at room temp.

* Test temp.: 40±2°C

13. Humidity

(Damp Heat)

Steady State

* No remarkable damage.

* Humidity: 90~95% RH

* Cap change: within ±5.0% or ±0.5pF whichever is larger.

* Q/D.F. value: Q≥200+10C

* Test time: 500+24/-0hrs.

* Cap. / DF(Q) / I.R. Measurement to be made after de-aging at

150°C for 1hr then set for 24±2 hrs at room temp.

* Test temp.: 40±2°C

* I.R.: ≥1GΩ.

14. Humidity

(Damp Heat)

Load

* No remarkable damage.

* Humidity: 90~95%RH

* Cap change: within ±7.5% or ±0.75pF whichever is larger.

* Q/D.F. value: Q≥100+10/3C

* Test time: 500+24/-0 hrs.

* To apply voltage：rated voltage

* I.R.: ≥500MΩ.

* Cap. / DF(Q) / I.R. Measurement to be made after de-aging at

150°C for 1hr then set for 24±2 hrs at room temp.

* Test temp.: 125±3°C

15. High

Temperature

Load

* No remarkable damage.

* To apply voltage: 200% of rated voltage.

* Test time: 2000+24/-0 hrs.

* Cap change: within ±3.0% or ±0.3pF whichever is larger.

* Q/D.F. value: Q≥200+10C

(Endurance)

* Cap. / DF(Q) / I.R. Measurement to be made after de-aging at * I.R.: ≥1GΩ.

150°C for 1hr then set for 24±2 hrs at room temp

The ESR should be measured at room temperature and tested

at frequency 1±0.1 GHz.

16. ESR

0402

0.1pF≤Cap≤1pF:< 350mΩ/pF

1pF<Cap≤5pF:< 300mΩ

5pF<Cap≤100pF:< 250mΩ

Page 6 of 8

ASC_Microwave_with_Narrow_Tol_(UF)

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Multilayer Ceramic Capacitors

Approval Sheet

APPENDIXES

◙ Tape & reel dimensions

Size

0402

Thickness

0.70

A₀

B₀

+/-0.20

1.20

+/-0.20

≦0.80

K₀

8.00

+/-0.30

4.00

+/-0.10

P₀

Fig. 2 The dimension of paper tape

40.00

10xP₀

P₁

+/-0.10

2.00

+/-0.05

2.00

+/-0.05

P₂

1.50

D₀

D₁

+0.1/-0

1.75

+/-0.10

3.50

+/-0.05

Size

0402

Reel size

7”

13”

W₁

13.0+0.5/-0.2

8.4+1.5/-0

13.0+0.5/-0.2

8.4+1.5/-0

330.0±1.0

100±1.0

178.0±1.0

Fig. 3 The dimension of reel

60.0+1.0/-0

◙ Example of customer label

a. Customer name

b. WTC order series and item number

c. Customer P/O

d. Customer P/N

e. Description of product

f. Quantity

g. Bar code including quantity & WTC P/N or customer

h. WTC P/N

i. Shipping date

j. Order bar code including series and item numbers

k. Serial number of label

*Customized label is available upon request

Page 7 of 8

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Multilayer Ceramic Capacitors

Approval Sheet

◙ Constructions

No.

Name

NP0

Ceramic material

Inner electrode

Hi-Q dielectric ceramic

Inner layer

Termination

Middle layer

Outer layer

Sn (Matt)

Fig. 4 The construction of MLCC

◙ Storage and handling conditions

(1) To store products at 5 to 40°C ambient temperature and 20 to 70%. related humidity conditions.

(2) The product is recommended to be used within one year after shipment. Check solderability in case of shelf life

extension is needed.

Cautions:

a. The corrosive gas reacts on the terminal electrodes of capacitors, and results in the poor solderability.

Do not store the capacitors in the ambience of corrosive gas (e.g., hydrogen sulfide, sulfur dioxide,

chlorine, ammonia gas etc.)

b. In corrosive atmosphere, solderability might be degraded, and silver migration might occur to cause low

reliability.

c. Due to the dewing by rapid humidity change, or the photochemical change of the terminal electrode by

direct sunlight,the solderability and electrical performance may deteriorate. Do not store capacitors under

direct sunlight or dewing condition. To store products on the shelf and avoid exposure to moisture.

◙ Recommended soldering conditions

The lead-free termination MLCCs are not only to be used on SMT against lead-free solder paste, but also suitable

against lead-containing solder paste. If the optimized solder joint is requested, increasing soldering time, temperature and

concentration of N₂within oven are recommended.

Fig. 5 Recommended reflow soldering profile for SMT process

with SnAgCu series solder paste.

Page 8 of 8

ASC_Microwave_with_Narrow_Tol_(UF)

Jul. 2019

UF15N1R0B250CT [WALSIN]

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