WA02B [WALSIN]

Higher component and equipment reliability;


型号：	WA02B
厂家：	Walsin Technology
描述：	Higher component and equipment reliability
文件：	总7页 (文件大小：227K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Approval sheet

WA02B

±5%, ±1%

Thick film

General purpose chip resistors array

Size 0201x2 Flat Type

*Contents in this sheet are subject to change without prior notice.

ASC_WA02B_V02 Jan - 2013

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Approval sheet

FEATURE

1. Small size and light weight

2. Reduced size of final equipment

3. Lower surface mounted assembly costs

4. Higher component and equipment reliability

5. Lead free / Halogen free

APPLICATION

•

Consumer electrical equipment, PDA, Digital Cam-coder, …

EDP, Computer application

Mobile phone, Telecom

Ram module

DESCRIPTION

The resistors array is constructed in a high grade ceramic body (aluminum oxide). Internal metal electrodes are

added at each end and connected by a resistive paste that is applied to the top surface of the substrate. The

composition of the paste is adjusted to give the approximate resistance required and the value is trimmed to

within tolerance by laser cutting of this resistive layer.

The resistive layer is covered with a protective coat. Finally, the two external end terminations are added. For

ease of soldering the outer layer of these end terminations is a Tin (lead free) solder alloy.

Fig 1. Outline of chip-R array WA02B

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Approval sheet

QUICK REFERENCE DATA

Item

Series No.

General Specification

WA02B

0201x2 (0603x2)

Flat type

Size

Termination construction

Resistance Tolerance

Resistance Range

±5%, ±1% (E24 series)

±5%: 10Ω ~ 1MΩ, Jumper (< 50mΩ)

±1%: 10Ω ~ 100KΩ

10Ω ~ 29.5Ω: ≤ ± 350 ppm/°C

30Ω ~ 1MΩ: ≤ ± 200 ppm/°C

1/32 W

TCR (ppm/°C)

Max. dissipation at T_amb=70°C

Max. Operation Voltage (DC or RMS)

Max. overload voltage

12.5V

25V

Rated current for Jumper

Operation temperature

-55 ~ +125’C

Note :

This is the maximum voltage that may be continuously supplied to the resistor element, see “IEC publication

60115-8”

Max. Operation Voltage : So called RCWV (Rated Continuous Working Voltage) is determined by

RCWV = RatedPower ×Resistance Value or Max. RCWV listed above, whichever is lower.

DIMENSIONS(unit：mm)

WA02B

0.80 ± 0.10

0.60 ± 0.10

0.35 ± 0.10

0.50 typical

0.30 ± 0.10

0.15 ± 0.10

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Approval sheet

MARKING

No marking for WA02B chip resistors array

FUNCTIONAL DESCRIPTION

Product characterization

Standard values of nominal resistance are taken from the E24 series for resistors with a tolerance of ±5%,

±1%. The values of the E24 series are in accordance with “IEC publication 60063”

Derating

The power that the resistor can dissipate depends on the operating temperature; see Fig.2

Figure 2. Maximum dissipation in percentage of rated power

As a function of the ambient temperature

CONSTRUCTION

R1=R2

MOUNTING

Due to their rectangular shapes and small tolerances, Surface Mountable Resistors are suitable for handling by

automatic placement systems.

Chip placement can be on ceramic substrates and printed-circuit boards (PCBs).

Electrical connection to the circuit is by individual soldering condition.

The end terminations guarantee a reliable contact.

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Approval sheet

SOLDERING CONDITION

The robust construction of chip resistors allows

them to be completely immersed in a solder bath

of 260°C for 10 seconds. Therefore, it is possible

to mount Surface Mount Resistors on one side of

a PCB and other discrete components on the

reverse (mixed PCBs).

Surface Mount Resistors are tested for

solderability at 235°C during 2 seconds. The test

condition for no leaching is 260°C for 30 seconds.

Typical examples of soldering processes that

provide reliable joints without any damage are

given in Fig 3.

Fig 3. Infrared soldering profile for Chip Resistors array

CATALOGUE NUMBERS

The resistors have a catalogue number starting with .

WA02

Size code

WA02 : 0201

472_

Resistance code

5% E24 : significant digits

Type code

Tolerance

J : ±5%

Packaging code Termination code

: x2, Flat

T :

= Sn base

(lead free)

followed by no. of zeros and

a blank

7” 10kpcs Reel

taping

F : ±1%

P : Jumper

4.7Ω

=4R7_

=100_

=221_

=000_

10Ω

220Ω

Jumper

(“_” means a blank)

1%, E24+E96: 3 significant digits

followed by no. of zeros

100Ω

=1000

=3742

37.4KΩ

Reeled tape packaging

: 8mm width paper taping 7” reel 10,000pcs per reel,

Recommended Land Pattern Dimensions:

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Approval sheet

TEST AND REQUIREMENTS

Essentially all tests are carried out according to the schedule of IEC publication 115-8, category

LCT/UCT/56(rated temperature range : Lower Category Temperature, Upper Category Temperature; damp

heat, long term, 56 days). The testing also meets the requirements specified by EIA, EIAJ and JIS.

The tests are carried out in accordance with IEC publication 68, "Recommended basic climatic and mechanical

robustness testing procedure for electronic components" and under standard atmospheric conditions according

to IEC 60068-1, subclause 5.3. Unless otherwise specified, the following value supplied :

Temperature: 15°C to 35°C.

Relative humidity: 45% to 75%.

Air pressure: 86kPa to 106 kPa (860 mbar to 1060 mbar).

All soldering tests are performed with midly activated flux.

REQUIREMENT

TEST

PROCEDURE

Resistor

Within the specified

tolerance Refer to

“QUICK REFERENCE

DATA”

Jumper

Electrical

DC resistance values measurement

Characteristics

Temperature Coefficient of Resistance (T.C.R)

Natural resistance change per change in degree

centigrade.

JISC5201-1: 1998

N/a

R₂− R

Clause 4.8

×10⁶(ppm/°C) t₁: 20°C+5°C-1°C

(

t₂− t₁

)

R₁: Resistance at reference temperature

R₂: Resistance at test temperature

Short time overload

(S.T.O.L)

Permanent resistance change after a 5 seconds

application of a voltage 2.5 times RCWV or the

maximum overload voltage specified in the above

list, whichever is less.

∆R/R max.

±(2%+0.10Ω)

< 50mΩ

Clause 4.13

Resistance to soldering Un-mounted chips completely immersed for

heat(R.S.H)

ΔR/R max. ±(1%+0.05Ω)

10±1second in a SAC solder bath at 260℃±5ºC

no visible damage

Clause 4.18

Un-mounted chips completely immersed for

2±0.5 second in a SAC solder bath at 235℃±5℃

good tinning (>95% covered)

no visible damage

Solderability

Clause 4.17

Temperature cycling

30 minutes at -55°C±3°C, 2~3 minutes at

20°C+5°C-1°C, 30 minutes at +125 °C±3°C, 2~3

minutes at 20°C+5°C-1°C, total 5 continuous

cycles

ΔR/R max. ±(1%+0.05Ω)

no visible damage

Clause 4.19

< 50mΩ

< 100mΩ

< 50mΩ

Load life (endurance)

Clause 4.25

1000 +48/-0 hours, loaded with RCWV or Vmax

in chamber controller 70±2ºC, 1.5 hours on and

0.5 hours off

1000 +48/-0 hours, loaded with RCWV or Vmax

in humidity chamber controller at 40°C±2°C and

90~95% relative humidity, 1.5hours on and 0.5

hours off

ΔR/R max. ±(3%+0.1Ω)

no visible damage

Load life in Humidity

Clause 4.24

ΔR/R max. ±(3%+0.1Ω)

no visible damage

Adhesion

Clause 4.32

No remarkable damage or removal of

the terminations.

Pressurizing force: 5N, Test time: 10±1sec.

Bending strength

JISC5201-1: 1998

Clause 4.33

Resistors mounted on a 90mm glass epoxy resin

PCB(FR4), bending once 3mm for 10sec.

ΔR/R max. ±(1%+0.05Ω)

no visible damage

< 50mΩ

Insulation Resistance

Clause 4.6

Apply the maximum overload voltage (DC) for

1minute

R≧1GΩ

Dielectric Withstand

Voltage

Apply the maximum overload voltage (AC) for 1

minute

No breakdown or flashover

Clause 4.7

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Approval sheet

PACKAGING

Paper Tape specifications (unit: mm)

Reel dimensions

Symbol

(unit : mm)

13.0 ± 0.2

9.0 ± 0.3

Φ178.0 ± 2.0

Φ60.0 ± 1.0

Peeling force of top cover tape

Taping Qty

10,000pieces per 7” reel

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Jan - 2013

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