WA06W100-PTLN [WALSIN]
Higher component and equipment reliability;
| 型号： | WA06W100-PTLN |
| 厂家： | 
Walsin Technology |
| 描述： | Higher component and equipment reliability |
| 文件： | 总8页 (文件大小：245K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
WA06W_N
±5%, ±1% Convex Type
General purpose chip resistors array
Size 1506 (3816)
16p8R
Customer
:
Approval No :
Issue Date :
Customer Approval :
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WA06W_N
Version 04
OCT 2015
FEATURE
1. Small size and light weight
2. Reduced size of final equipment
3. Lower surface mounted assembly costs
4. Higher component and equipment reliability
5. RoHS compliant and Lead (Pb) free, Halogen free
APPLICATION
•
•
•
Consumer electrical equipment
EDP, Computer application
Telecom
DESCRIPTION
The resistors array is constructed in a high grade ceramic body (aluminum oxide). Internal metal electrodes are
added at each end and connected by a resistive paste that is applied to the top surface of the substrate. The
composition of the paste is adjusted to give the approximate resistance required and the value is trimmed to
within tolerance by laser cutting of this resistive layer.
The resistive layer is covered with a protective coat. Finally, the two external end terminations are added. For
ease of soldering the outer layer of these end terminations is a Tin (Pb free) solder alloy.
Fig 1. Construction of a Chip-R array WA06W_N
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WA06W_N
Version 04
OCT 2015
QUICK REFERENCE DATA
Item
Series No.
General Specification
WA06W_N
Size
1506 (0602x8)
Convex type
Termination construction
Resistance Tolerance
Resistance Range
±5%, ±1% (E24/E96 series)
10Ω ~ 100KΩ, Jumper
≤ ± 200 ppm/°C
1/16 W
TCR (ppm/°C)
Max. dissipation at Tamb=70°C
Max. Operation Voltage (DC or RMS)
Max. overload voltage
25V
50V
Climatic category (IEC 60068)
55/125/56
Note :
1.
This is the maximum voltage that may be continuously supplied to the resistor element, see “IEC publication
60115-8”
2.
Max. Operation Voltage : So called RCWV (Rated Continuous Working Voltage) is determined by
RCWV = RatedPower ×Resistance Value or Max. RCWV listed above, whichever is lower.
Dimensions ( mm )
WA06W_N
3.80 ± 0.10
1.60 ± 0.10
0.45 ± 0.10
0.30 ± 0.10
0.30 ± 0.10
0.20 ± 0.10
0.50 ± 0.10
0.30 ± 0.10
0.30 ± 0.10
0.20 ± 0.10
Min. 0.03
L
W
T
B
G
D
d
P
c
H1
H2
c
d
Marking
Each resistor is marked with a three-digit code on the protective coating to designate the nominal
resistance value of E24 series. There is no marking for resistance value of E96 series !
Example:
100 = 10Ω
101 = 100Ω
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WA06W_N
Version 04
OCT 2015
FUNCTIONAL DESCRIPTION
Product characterization
Standard values of nominal resistance are taken from the E24/E96 series for resistors with a tolerance of
±5%, ±1%. The values of the E24/E96 series are in accordance with “IEC publication 60063”
Derating
The power that the resistor can dissipate
depends on the operating temperature; see Fig.2
CONSTRUCTION
R1=R2=R3=R4=…=R8
CATALOGUE NUMBERS
The resistors have a catalogue number starting with .
WA06
Size code
W
472_
Resistance code
±5%, E24
J
Tolerance
T
L
N
Type code
Packaging code
T : 7” Reel taping
Termination
code
Customer
Code
WA06 : 0602 per
element
W
: x8, convex
: 2 significant J : ±5%
digits followed by no. of
zeros and a blank
L
= Sn base
(lead free)
N = Customized
F : ±1%
P : Jumper
10Ω
=100_
=221_
=000_
220Ω
Jumper
(“_” means a blank)
±1%, E24+E96: 3 significant
digits followed by no. of
zeros
102Ω
=1020
=3742
37.4KΩ
1.
2.
Reeled tape packaging : 8mm width paper taping 5000pcs per reel.
Bulk packaging : 5000pcs per polybag
MOUNTING
Due to their rectangular shapes and small tolerances, Surface Mountable Resistors are suitable for handling by
automatic placement systems.
Chip placement can be on ceramic substrates and printed-circuit boards (PCBs).
Electrical connection to the circuit is by individual soldering condition.
The end terminations guarantee a reliable contact.
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WA06W_N
Version 04
OCT 2015
SOLDERING CONDITION
The robust construction of chip resistors allows
them to be completely immersed in a solder bath
of 260°C for 10 seconds. Therefore, it is possible
to mount Surface Mount Resistors on one side of
a PCB and other discrete components on the
reverse (mixed PCBs).
Surface Mount Resistors are tested for
solderability at 235°C during 2 seconds.
The test condition for no leaching is 260°C
for 30 seconds. Typical examples of
soldering processes that provide reliable
joints without any damage are given in Fig 3.
Fig 3. Infrared soldering profile for Chip Resistors array
TEST AND REQUIREMENTS
Essentially all tests are carried out according to the schedule of IEC publication 115-8, category
LCT/UCT/56(rated temperature range : Lower Category Temperature, Upper Category Temperature; damp
heat, long term, 56 days). The testing also meets the requirements specified by EIA, EIAJ and JIS.
The tests are carried out in accordance with IEC publication 68, "Recommended basic climatic and mechanical
robustness testing procedure for electronic components" and under standard atmospheric conditions according
to IEC 60068-1, subclause 5.3. Unless otherwise specified, the following value supplied :
Temperature: 15°C to 35°C.
Relative humidity: 45% to 75%.
Air pressure: 86kPa to 106 kPa (860 mbar to 1060 mbar).
All soldering tests are performed with midly activated flux.
TEST CONDITION FOR JUMPER (0Ω)
Resistance: 50mΩ max.
Rated Current: 1A
Peak Current: 3A
Operating Temperature: -55 to 125°C
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WA06W_N
Version 04
OCT 2015
REQUIREMENT
Resistor
TEST
PROCEDURE
Jumper
< 50mΩ
DC resistance
DC resistance values measured at the test Within the specified tolerance
voltages specified below :
(JIS C 5202 5.1)
Resistance
Test voltage
Resistance
Test voltage
<100Ω
0.3V
<10KΩ
3.0V
<100KΩ
10V
TCR
Natural resistance change per change in degree Test temperature –
N/a
centigrade.
55~+125°C
(JIS C5202 5.2 /
IEC115-1 4.8.4.2)
≤±200ppm/°C
R2 − R
×106 (ppm/°C)
1
R
(
t2 − t1
)
1
R1 : Resistance at reference temperature
R2 : Resistance at test temperature
t1 : 25°C
Short time overload Permanent resistance change after a 5second
application of a voltage 2.5 times RCWV or the
∆R/R max. ±(2%+0.10Ω)
< 50mΩ
(JIS C 5202 5.5 /
maximum overload voltage specified in the above
IEC115-1 4.13)
list, whichever is less.
Resistance to
soldering heat
Unmounted chips 10±1 seconds, 260±5ºC
no visible damage
no visible
damage,
∆ R/R max. ±(1.0%+0.05Ω)
(JIS C 5202 6.4 /
IEC115-1 4.18)
< 50mΩ
Solderability
Termination SnPb base
:
Unmounted chips good tinning (>95% covered)
completely immersed for 2±0.5 sec. in a solder
bath at 230±5ºC
(JIS C 5202 6.5 /
IEC115-1 4.17)
no visible damage
Termination Sn base (lead free) : Unmounted chip
completely immersed in a lead free solder bath,
235°C±5°C, 2±0.5 sec
Temperature
cycling
no visible damage
no visible
damage,
1. 30 minutes at -55°C±3°C,
2. 10~15minutes at room temperature,
3. 30 minutes at +125°±3°C,
4. 10~15minutes at room temperature,
5 continuous cycles
∆R/R max. ±(1%+0.05Ω)
(JIS C 5202 7.4 /
IEC115-1 4.19)
< 50mΩ
Load life
70±2ºC, 1000 hours, loaded with RCWV or
Vmax,1.5 hours on and 0.5 hours off
10Ω~1MΩ
10Ω~1MΩ
±(3%+0.1Ω) < 50mΩ
±(3%+0.1Ω) < 50mΩ
(endurance)
(JIS C 5202 7.10/
IEC115-1 4.25.1)
Load life in
Humidity
1000 hours, at rated continuous working voltage in
humidity chamber controller at 40°C±2°C and
90~95% relative humidity, 1.5hours on and 0.5
hours off
(JIS C 5202 7.9 /
IEC115-1 4.24.2)
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WA06W_N
Version 04
OCT 2015
PACKAGING
Paper Tape specifications (unit :mm)
A
B
W
F
E
(mm)
(mm)
4.1±0.15
P1
1.9±0.15
P0
8.0±0.10
3.50±0.05
T
1.75±0.10
D
4.00±0.10
4.00±0.10
1.55±0.05
0.80±0.05
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WA06W_N
Version 04
OCT 2015
Reel dimensions
Symbol
(unit : mm)
A
B
C
D
13.0±0.2
9.0±0.3
Φ178.0±2.0
Φ60.0±1.0
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WA06W_N
Version 04
OCT 2015
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