WLBD0603K2U330TP [WALSIN]

Monolithic inorganic material construction;


型号：	WLBD0603K2U330TP
厂家：	Walsin Technology
描述：	Monolithic inorganic material construction
文件：	总12页 (文件大小：2716K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Approval Sheet

WLBD0603

Chip Bead P SERIES

*Contents in this sheet are subject to change without prior notice.

Page 1 of 12

ASC_ WLBD0603 P Series_V1.0

JUL – 2018

Approval Sheet

FEATURES

Monolithic inorganic material construction.

Closed magnetic circuit avoids crosstalk.

S.M.T. type.

Suitable for reflow soldering.

Shapes and dimensions follow E.I.A. spec.

Available in various sizes.

Excellent solder ability and heat resistance.

High reliability.

100% Lead(Pb) & Halogen- Free and RoHS compliant.

SHAPE and DIMENSION

Chip Size

0.60±0.03

0.30±0.03

0.1~0.2

Units: mm

Ordering Information

0603

300

Product

Code

Series

Dimensions

Series

extension

Tolerance

Value

Packing

Code

WL:

Inductor

BD: Chip

Bead.

0.6 * 0.3 mm

Refer to

characteristic

300 =30 OHM

301 =300 OHM

102 =1000OHM

T = 7"

P:General

U: ê25%

0603 :EIA 0201

Paper Tape

Page 2 of 12

ASC_ WLBD0603 P Series_V1.0

JUL – 2018

Approval Sheet

PART NUMBER AND CHARACTERISTICS TABLE

WLBD0603 series

Rated Current

(mA) max.

Impedance (Ω)

+/-25%

DC Resistance

Test Frequency

(MHz)

Walsin Part Number

(

) max.

100

0.065

0.07

0.40

0.45

0.65

1.20

1.15

500

200

150

200

WLBD0603K2U220TP

WLBD0603K2U330TP

WLBD0603K2U800TP

WLBD0603K2U121TP

WLBD0603K2U241TP

WLBD0603K2U601TP

WLBD0603K2U102TP

120

240

600

1000

Rated Current

(mA) max.

Impedance (Ω)

+/-25%

DC Resistance

Test Frequency

(MHz)

Walsin Part Number

(

) max.

0.25

0.40

0.80

1.05

1.20

100

200

100

WLBD0603B1U600TP

WLBD0603B1U121TP

WLBD0603B1U241TP

WLBD0603B1U471TP

WLBD0603B1U601TP

120

240

470

600

100

Rated Current

Impedance (Ω)

+/-25%

DC Resistance

Test Frequency

(MHz)

Walsin Part Number

(

) max.

0.25

0.45

0.55

0.70

1.00

1.30

1.50

(mA) max.

100

200

150

100

WLBD0603H1U100TP

WLBD0603H1U220TP

WLBD0603H1U330TP

WLBD0603H1U471TP

WLBD0603H1U561TP

WLBD0603H1U800TP

WLBD0603H1U121TP

120

Page 3 of 12

ASC_ WLBD0603 P Series_V1.0

JUL – 2018

Approval Sheet

RELIABILITY AND TEST CONDITION

Test item

Test Condition

Performance

Operating

-40~+125 (Including self-temperature rise)

-40~+125

Temperature

Transportation

Storage

Temperature

For long storage conditions, please see the

Application Notice

Impedance (Z)

Agilent4291

Agilent E4991

Agilent4287

Agilent16192

Inductance (Ls)

Q Factor

Refer to standard electrical characteristics list

DC Resistance

Agilent 4338

DC Power Supply

Rated Current

Over Rated Current requirements, there will be

some risk

Rated Current < 1A ΔT 20 Max

Rated Current 1A ΔT 40 Max

Applied the allowed DC current.

Temperature measured by digital surface

thermometer.

Temperature Rise

Test

Preheat: 150 ,60sec.

Solder: Sn99.5%-Cu0.5%

Solder temperature: 260±5

Flux for lead free: Rosin. 9.5%

Temperature ramp/immersion and immersion rate:

25±6 mm/s

Appearance No damage.

Impedance within±15% of initial value

RDC within ±15% of initial value and shall not

exceed the specification value

Resistance to

Soldering Heat

Dip time: 10±1sec.

Depth: completely cover the termination.

Preheating Dipping Natural cooling

260°C

150°C

10±1.0

second

More than 95% of the terminal electrode

should be covered with solder.

Preheat: 150 ,60sec.

Solder: Sn99.5%-Cu0.5%

Solder temperature: 245±5

Flux for lead free: Rosin. 9.5%

Depth: completely cover the termination.

Dip time: 4±1sec.

Preheating Dipping Natural cooling

245°C

Solderability

150°C

4±1

second

Appearance No damage.

Impedance within±15% of initial value.

RDC within ±15% of initial value and shall not

exceed the specification value

Preconditioning: Run through IR reflow for 2

times.( IPC/JEDEC J-STD-020D Classification

Reflow Profiles)

Component mounted on a PCB apply a force

(>0805:1kg <=0805:0.5kg)to the side of a device

being tested. This force shall be applied for 60 +1

seconds. Also the force shall be applied gradually

as not to shock the component being tested.

Terminal strength

Page 4 of 12

ASC_ WLBD0603 P Series_V1.0

JUL – 2018

Approval Sheet

Performance

Test item

Test Condition

Shall be mounted on a FR4 substrate of the

following dimensions:>=0805:40x100x1.2mm

<0805:40x100x0.8mm

Bending depth:>=0805:1.2mm

<0805:0.8mm

Appearance No damage.

impedance within±10% of initial value

RDC within ±15% of initial value and shall not

exceed the specification value

Bending

Duration of 10 sec for a min

Preconditioning: Run through IR reflow for 2

times.( IPC/JEDEC J-STD-020D Classification

Reflow Profiles)

Oscillation Frequency: 10 2K 10Hz for 20

minutes

Equipment Vibration checker

Total Amplitude:1.52mm±10%

Testing Time : 12 hours(20 minutes, 12 cycles each

of 3 orientations)

Appearance No damage.

Impedance within±15% of initial value

RDC within ±15% of initial value and shall not

exceed the specification value

Vibration Test

Peak

Type Value

(g’s)

Normal

duration Wave form

(D) (ms)

Velocity

change

(Vi)ft/sec

15.4

Appearance No damage.

Impedance within±15% of initial value

RDC within ±15% of initial value and shall not

exceed the specification value

Shock

SMD

Lead

1,500

100

0.5

Half-sine

12.3

Preconditioning: Run through IR reflow for 2

times.( IPC/JEDEC J-STD-020D Classification

Reflow Profiles)

Temperature: 125±2 (bead),

Life test

85±2 (inductor)

Applied current: rated current.

Duration: 1000±12hrs.

Measured at room temperature after placing for

24±2 hrs.

Appearance: no damage.

Impedance: within±15%of initial value.

RDC within ±15% of initial value and shall not

exceed the specification value

Preconditioning: Run through IR reflow for 2

times.( IPC/JEDEC J-STD-020D Classification

Reflow Profiles)

Humidity: 85±2%R.H.

Load Humidity

Temperature: 85±2

Duration: 1000hrs Min. with 100% rated current.

Measured at room temperature after placing for

24±2 hrs.

Preconditioning: Run through IR reflow for 2

times.( IPC/JEDEC J-STD-020D Classification

Reflow Profiles)

Condition for 1 cycle

Appearance: no damage.

Step1: -40±2

Step2: 25±2

Step3: +125±2

30±5 min.

0.5min

30±5min.(Bead)

Impedance: within±15%of initial value..

RDC within ±15% of initial value and shall not

exceed the specification value

Thermal shock

Number of cycles: 500

Measured at room temperature after placing for

24±2 hrs.

Insulation

Resistance

Chip Inductor Only

Test Voltage:100±10%V for 30 Sec.

IR>1GΩ

Page 5 of 12

ASC_ WLBD0603 P Series_V1.0

JUL – 2018

Approval Sheet

Derating

Derating Curve

For the ferrite chip bead whichwithstanding current over 1.5A, as the

operating temperature over 85 , the derating current information is

necessary to consider with. For the detail derating of current, please

refer to the Derated Current vs. Operating Temperature curve.

1.5A

Storage Conditions

125

Storage Condition : Less than 40 and 60% RH

Environment Temperature+ Tem perature(°C)

Storage Time : 6 months Max.

Soldering and Mounting

Recommended PC Board Pattern

Chip Size

Land Patterns For Reflow Soldering

Type

A(mm)

B(mm)

C(mm)

D(mm)

E(mm)

F(mm)

G(mm)

WLBD

0.6±0.0

0.30±0.0

0.15±0.0

0603

0.35

0.30

0.40

PC board shold be designed so that products can prevent

damage from mechanical stress when warping the board.

Soldering

Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering

cannot be avoided, the preferred technique is the utilization of hot air soldering tools.

Note.

If wave soldering is used ,there will be some risk.

Re-flow soldering temperatures below 240 degrees, there will be non-wetting risk

Lead Free Solder re-flow:

Recommended temperature profiles for lead free re-flow soldering in Figure 1. (Refered to J-STD-020C)

Page 6 of 12

ASC_ WLBD0603 P Series_V1.0

JUL – 2018

Approval Sheet

Soldering Iron:

Products attachment with a soldering iron is discouraged due to the inherent process control limitations. If a soldering

iron must be employed the following precautions are recommended. for Iron Soldering in Figure 2.

Use a 20 watt soldering iron with tip

diameter of 1.0mm

Limit soldering time to 4~5sec.

Never contact the ceramic with

the iron tip

1.0mm tip diameter (max)

Preheat circuit and products to 150

350 tip temperature (max)

Reflow Soldering

Iron Soldering

PRE-HEATING

SOLDERING

NATURAL

COOLING

PRE-HEATING

SOLDERING

NATURAL

COOLING

within 4~5s

TP(260

/ 10s max.)

350

150

tp(245° C / 20~40s.)

217

Solder Volume

60~150s

200

150

60~180s

Gradual cooling

Over 60s

480s max.

TIME(sec.)

TIME( sec.)

Iron Soldering times 1 times

max

Reflow times: 3 times max

Fig.1

Upper limit

Accordingly increasing the solder volume, the mechanical

stress to product is also increased. Exceeding solder volume

may cause the failure of mechanical or electrical performance.

Solder shall be used not to be exceed as shown in right side:

Minimum fillet height = soldering thickness + 25% product

height

Recommendable

Page 7 of 12

ASC_ WLBD0603 P Series_V1.0

JUL – 2018

Approval Sheet

Packaging Specification

Reel Dimension

COVER TAPE

2.0±0.5

Type

A(mm)

B(mm)

C(mm)

D(mm)

7’’x8mm 10±1.5

50 or more

13±0.2

178±2

EMBOSSED CARRIER

TAPE AND REEL SPECIFICATIONS

Paper carrier

P :4±0.1

Size

B0(mm)

A0(mm)

0.40 0.06

K0(mm)

0.45max

P(mm)

t(mm)

2.0

0.70 0.06

0.45max

0603

0.05

The force for tearing off cover tape is 15 to 60 grams

in the arrow direction under the following conditions.

165° to180°

Topcover tape

Room Temp. Room Humidity

Room atm

(hPa)

860 ~ 1060

Tearing Speed

Mm/min

300

Base tape

(c)

(%)

45 ~ 85

5 ~ 35

Application Notice

Storage Conditions(component level)

To maintain the solder ability of terminal electrodes:

1. Temperature and humidity conditions: Less than 40 and 60% RH.

2. Recommended products should be used within 12 months from the time of delivery.

3. The packaging material should be kept where no chlorine or sulfur exists in the air.

Transportation

1.Products should be handled with care to avoid damage or contamination from perspiration

and skin oils.

2. The use of tweezers or vacuum pick up is strongly recommended for individual

components.

3. Bulk handling should ensure that abrasion and mechanical shock are minimized.

Page 8 of 12

ASC_ WLBD0603 P Series_V1.0

JUL – 2018

Approval Sheet

Impedance Frequency Characteristics(Typical)

WLBD0603K2U220TP

WLBD0603K2U330TP

WLBD0603K2U800TP

WLBD0603K2U121TP

WLBD0603K2U241TP

WLBD0603K2U601TP

Page 9 of 12

ASC_ WLBD0603 P Series_V1.0

JUL – 2018

Approval Sheet

Impedance Frequency Characteristics(Typical)

WLBD0603K2U102TP

WLBD0603K2U600TP

WLBD0603K2U241TP

WLBD0603K2U121TP

WLBD0603K2U471TP

WLBD0603K2601TP

Page 10 of 12

ASC_ WLBD0603 P Series_V1.0

JUL – 2018

Approval Sheet

Impedance Frequency Characteristics(Typical)

WLBD0603K2U100TP

WLBD0603K2U220TP

WLBD0603K2U330TP

WLBD0603K2U470TP

WLBD0603K2U560TP

WLBD0603K2U800TP

Page 11 of 12

ASC_ WLBD0603 P Series_V1.0

JUL – 2018

Approval Sheet

Impedance Frequency Characteristics(Typical)

WLBD0603K2U121TP

Page 12 of 12

ASC_ WLBD0603 P Series_V1.0

JUL – 2018

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