WLFI2012Z0M100TB [WALSIN]
Ferrite Chip Inductors;
| 型号： | WLFI2012Z0M100TB |
| 厂家： | 
Walsin Technology |
| 描述： | Ferrite Chip Inductors |
| 文件： | 总7页 (文件大小：1181K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Approval Sheet
WLFI2012
Ferrite Chip Inductors
*Contents in this sheet are subject to change without prior notice.
Page 1 of 7
ASC_ WLFI2012 Series
SEP - 2017
Approval Sheet
FEATURES
1.
2.
3.
General purpose chip ferrite power inductor for high integration electronics device.
Ceramic structure provides high reliability、high productivity.
RoHS compliance.
APPLICATIONS
1. EMI solution for I/O ports.
2. RF choke for DC power supplying to LNA or external antenna.
SHAPE and DIMENSION
Chip Size
A
B
2.00±0.20
1.25±0.20
C
0.85±0.20
1.25±0.20
D
0.50±0.30
Units: mm
Ordering Information
WL
FI
2012
Z0
M
R22
T
B
Product
Code
Series
Dimensions
Series
extension
Tolerance
Value
Packing
Code
FI : Ferrite
WL:
Inductor
2.0 * 1.2 mm
Z0 :STD
R22 = 0.22 uH
2R2 = 2.2 uH
100 = 10 uH
T = 7"
B:STD
M: ±20%
Chip Inductor
2012 :EIA 0805
Paper Tape
P = 7”
Plastic Tape
Page 2 of 7
ASC_ WLFI2012 Series
SEP - 2017
Approval Sheet
Electrical Characteristics
● WLFI2012 series
Thickness
Rated
DC
SRF
(MHz)
min.
Inductance
(uH)
Test Frequency
(MHz)
C size
Current
Walsin Part Number
Tolerance
Q
Resistance
(mm)
(Ω) max.
(mA) max.
300
300
300
250
250
250
250
250
250
250
200
200
150
150
50
WLFI2012Z0M47NTB
WLFI2012Z0M68NTB
WLFI2012Z0M82NTB
WLFI2012Z0MR10TB
WLFI2012Z0MR12TB
WLFI2012Z0MR15TB
WLFI2012Z0MR18TB
WLFI2012Z0MR22TB
WLFI2012Z0MR27TB
WLFI2012Z0MR33TB
WLFI2012Z0MR39TB
WLFI2012Z0MR47PB
WLFI2012Z0MR56PB
WLFI2012Z0MR68PB
WLFI2012Z0M1R0TB
WLFI2012Z0M1R5TB
WLFI2012Z0M1R8TB
WLFI2012Z0M2R2TB
WLFI2012Z0M2R7PB
WLFI2012Z0M3R3PB
WLFI2012Z0M4R7PB
WLFI2012Z0M100PB
0.85±0.20
0.85±0.20
0.85±0.20
0.85±0.20
0.85±0.20
0.85±0.20
0.85±0.20
0.85±0.20
0.85±0.20
0.85±0.20
0.85±0.20
1.25±0.20
1.25±0.20
1.25±0.20
0.85±0.20
0.85±0.20
0.85±0.20
0.85±0.20
1.25±0.20
1.25±0.20
1.25±0.20
1.25±0.20
0.047
0.068
0.082
0.10
0.12
0.15
0.18
0.22
0.27
0.33
0.39
0.47
0.56
0.68
1.0
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
15
15
15
20
20
20
20
20
20
20
25
25
25
25
45
45
45
45
45
45
45
45
60mV / 50M
60mV / 50M
60mV / 50M
60mV / 25M
60mV / 25M
60mV / 25M
60mV / 25M
60mV / 25M
60mV / 25M
60mV / 25M
60mV / 25M
60mV / 25M
60mV / 25M
60mV / 25M
60mV / 10M
60mV / 10M
60mV / 10M
60mV / 10M
60mV / 10M
60mV / 10M
60mV / 10M
60mV / 2M
320
280
255
235
220
200
185
170
150
145
135
125
115
105
75
0.20
0.20
0.20
0.30
0.30
0.40
0.40
0.50
0.50
0.55
0.65
0.65
0.75
0.80
0.40
0.50
0.60
0.65
0.75
0.80
1.00
1.15
1.5
60
50
1.8
55
50
2.2
50
30
2.7
45
30
3.3
41
30
4.7
35
30
10.0
24
15
NOTE :TOLERANCE M= ±20%
Characteristic Curve
Q - Frequency
Inductance - Current
Page 3 of 7
ASC_ WLFI2012 Series
SEP - 2017
Approval Sheet
Test condition & Requirements
Item
Performance
Test Condition
-40~+105℃
(Including self-temperature rise)
Operating Temperature
--
For long storage conditions, please see the
Application Notice
Transportation
Storage Temperature
-40~+105℃
(on board)
Impedance (Z)
Inductance (Ls)
Q Factor
Agilent4291
Agilent E4991
Agilent4287
Agilent16192
Agilent 4338
Refer to standard electrical characteristics list
DC Resistance
DC Power Supply
Over Rated Current requirements, there will
be some risk
Rated Current
1. Applied the allowed DC current.
2. Temperature measured by digital surface
thermometer.
Rated Current < 1A ∆T 20℃Max
Temperature Rise Test
Rated Current
≧ 1A ∆T 40℃Max
Preheat: 150℃,60sec.
Solder: Sn99.5%-Cu0.5%
Solder temperature: 260±5℃
Flux for lead free: Rosin. 9.5%
Temperature ramp/immersion and immersion
rate: 25±6 mm/s
Appearance：No damage.
Dip time: 10±1sec.
Impedance：within±15% of initial value
Inductance：within±10% of initial value
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not exceed the specification value
Depth: completely cover the termination.
Resistance to Soldering
Heat
Preheating Dipping Natural cooling
260°C
150°C
60
10±1.0
second
second
Preheat: 150℃,60sec.
Preheating Dipping Natural cooling
Solder: Sn99.5%-Cu0.5%
More than 95% of the terminal
245°C
Solder temperature: 245±5℃
Flux for lead free: Rosin. 9.5%
Depth: completely cover the termination.
Dip time: 4±1sec.
Solderability
electrode should be covered
150°C
60
4±1
with solder.
second
second
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC J-STD-020D Classification
Reflow Profiles)
Appearance：No damage.
Component mounted on a PCB apply a force
Impedance：within±15% of initial value
Inductance：within±10% of initial value
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not
exceed the specification value
(>0805:1kg <=0805:0.5kg)to the side of
a
Terminal strength
device being tested. This force shall be
applied for 60 +1 seconds. Also the force
shall be applied gradually as not to shock the
component being tested.
Shall be mounted on a FR4 substrate of the
following dimensions:>=0805:40x100x1.2mm
<0805:40x100x0.8mm
Bending depth:>=0805:1.2mm
<0805:0.8mm
Appearance：No damage.
Impedance：within±10% of initial value
Inductance：within±10% of initial value
Q：Shall not exceed the specification value.
Bending
Duration of 10 sec for a min.
RDC：within ±15% of initial value and shall not exceed the specification value
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC J-STD-020D Classification
Reflow Profiles)
Oscillation Frequency: 10～2K～10Hz for 20
minutes
Appearance：No damage.
Impedance：within±15% of initial value
Inductance：within±10% of initial value
Vibration Test
Equipment： Vibration checker
Total Amplitude:1.52mm±10%
Testing Time : 12 hours(20 minutes, 12 cycles
each of 3 orientations)。
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not exceed the specification value
Page 4 of 7
ASC_ WLFI2012 Series
SEP - 2017
Approval Sheet
Test condition:
Peak
Normal
Velocity
Appearance：No damage.
Impedance：within±15% of initial value
Inductance：within±10% of initial value
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not exceed the specification value
Type
Value
(g’s)
duration Wave form change
(D) (ms)
0.5
(Vi)ft/sec
15.4
Shock
SMD
Lead
1,500
100
Half-sine
Half-sine
6
12.3
Item
Performance
Test Condition
Preconditioning: Run through IR reflow
for 2 times.( IPC/JEDEC J-STD-020D
Classification Reflow Profiles)
Temperature: 125±2℃(bead),
85±2℃(inductor)
Applied current: rated current.
Duration: 1000±12hrs.
Measured at room temperature after
placing for 24±2 hrs.
Life test
Appearance: no damage.
Impedance: within±15%of initial value.
Inductance: within±10%of initial value.
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not exceed the specification value
Preconditioning: Run through IR reflow
for 2 times.( IPC/JEDEC J-STD-020D
Classification Reflow Profiles)
Humidity: 85±2%R.H.
Temperature: 85±2℃.
Load Humidity
Duration: 1000hrs Min. with 100% rated
current.
Measured at room temperature after
placing for 24±2 hrs.
Preconditioning: Run through IR reflow
for 2 times.( IPC/JEDEC J-STD-020D
Classification Reflow Profiles)
Condition for 1 cycle
Appearance: no damage.
Step1: -40±2℃ 30±5 min.
Impedance: within±15%of initial value.
Inductance: within±10%of initial value.
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not exceed the specification value
Step2: 25±2℃
≦0.5min
Thermal shock
Step3: +105±2℃ 30±5min.
Number of cycles: 500
Measured at room temperature after
placing for 24±2 hrs.
Chip Inductor Only
Test Voltage:100±10%V for 30Sec.
IR>1GΩ
Insulation Resistance
Derating
6A
5A
4A
3A
**Derating Curve
6
5
4
3
2
1
0
For the ferrite chip bead which withstanding current over 1.5A, as the
operating temperature over 85℃, the derating current information is
necessary to consider with. For the detail derating of current, please
refer to the Derated Current vs. Operating Temperature curve.
2A
1.5A
1A
85
125
Environment Temperature+
△
Temperature(°C)
Soldering and Mounting
L (mm)
G (mm)
H (mm)
WLFI2012
3.00
1.00
1.00
Page 5 of 7
ASC_ WLFI2012 Series
SEP - 2017
Approval Sheet
Soldering
Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering cannot be
avoided, the preferred technique is the utilization of hot air soldering tools.
Note.
If wave soldering is used ,there will be some risk.
Re-flow soldering temperatures below 240 degrees, there will be non-wetting risk
Lead Free Solder re-flow
Recommended temperature profiles for lead free re-flow soldering in Figure 1. (Refered to J-STD-020C)
Soldering Iron:
Products attachment with a soldering iron is discouraged due to the inherent process control limitations. If a soldering iron must be
employed the following precautions are recommended. for Iron Soldering in Figure 2.
‧Preheat circuit and products to 150℃
‧350℃ tip temperature (max)
‧Never contact the ceramic with the iron tip ‧Use a 20 watt soldering iron with tip diameter of 1.0mm
‧1.0mm tip diameter (max)
‧Limit soldering time to 4~5sec.
Packaging Specification
■
Material of taping is paper
0
P
:4±0.1
t
Size
Bo(mm) Ao(mm) Ko(mm) P(mm)
t(mm)
060303 0.70±0.06 0.40±0.06 0.45max 2.0±0.05 0.45max
100505 1.12±0.03 0.62±0.03 0.60±0.03 2.0±0.05 0.60±0.03
P
A0
Ko
2
0
:4±0.1
P
:2±0.1
P
t
Size
160808
Bo(mm)
Ao(mm)
Ko(mm)
P(mm)
4.0±0.10
4.0±0.10
t(mm)
1.80±0.05 0.96+0.05/-0.03 0.95±0.05
0.95±0.05
0.95±0.05
201209
2.10±0.05
1.30±0.05
0.95±0.05
A0
P
Ko
■
Material of taping is plastic
2
P
:2±0.05
Po:4±0.1
t
A
Size
Bo(mm) Ao(mm) Ko(mm) P(mm)
t(mm) D1(mm)
201212 2.10±0.10 1.28±0.10 1.28±0.10 4.0±0.10 0.22±0.05 1.0±0.10
321611 3.35±0.10 1.75±0.10 1.25±0.10 4.0±0.10 0.23±0.05 1.0±0.10
322513 3.42±0.10 2.77±0.10 1.55±0.10 4.0±0.10 0.22±0.05 1.0±0.10
321609 3.40±0.10 1.77±0.10 1.04±0.10 4.0±0.10 0.22±0.05 1.0±0.10
P
Ko
A
Ao
SECTION A-A
Page 6 of 7
ASC_ WLFI2012 Series
SEP - 2017
Approval Sheet
F
The force for tearing off cover tape is 15 to 60 grams in the arrow
direction under the following conditions
165°to180°
Top cover tape
Room
Temp.
(℃)
Room
Humidity
(%)
Tearing
Speed
mm/min
Room atm
(hPa)
Base tape
5~35
45~85
860~1060
300
Products meet IPC/JEDEC J-STD-020D standard-MSL, level 1.
Quantity per reel ：Thickness C size (mm) - 0.85mm, 4k pcs / reel；1.25mm, 2k pcs / reel
Page 7 of 7
ASC_ WLFI2012 Series
SEP - 2017
相关型号：
©2020 ICPDF网 联系我们和版权申明