WLFM2012Z0M2R2PB [WALSIN]
Multi-Layer Power Inductors;
| 型号： | WLFM2012Z0M2R2PB |
| 厂家： | 
Walsin Technology |
| 描述： | Multi-Layer Power Inductors 测试 功率感应器 电感器 |
| 文件： | 总10页 (文件大小：1631K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Approval Sheet
WLFM2012
WLFM2520
Multi-Layer Power Inductors
*Contents in this sheet are subject to change without prior notice.
ASC_WLFM Series_V5.0 SEP - 2017
Page 1 of 10
Approval Sheet
Features
1.
2.
3.
4.
General purpose chip ferrite power inductor for high integration electronics device.
Ceramic structure provides high reliability、high productivity.
Low DC resistance with high current.
RoHS compliance.
Applications
1.
2.
3.
DC line filter, DC/DC inductor.
EMI solution for I/O ports.
RF choke for DC power supplying to LNA or external antenna.
Shape and Dimension
L
T
W
B
Unit: mm (inches)
WLFM
Series
B
L
W
T
(Min/Max)
WLFM2012
WLFM2520
2.0±0.2
2.5±0.2
1.25±0.2
2.0±0.2
1.0 max
1.0 max
0.5±0.3
0.5±0.3
Ordering Information
WL
FM
2012
Z0
M
R47
P
B
Product
Code
Series
Dimensions
Series
Extension
Tolerance
Value
Packing Code
WL:
Inductor
Multilayer
power
inductor.
2012:EIA 0805
2520:EIA 1008
Z0:STD
R47=0.47uH
2R2=2.2uH
P=7” Reeled
(Embossed tape)
B:STD
M: ± 20%
Page 2 of 10
ASC_WLFM Series_V5.0
SEP - 2017
Approval Sheet
Electrical Characteristics
● WLFM2012 series (EIA 0805)
Measuring
Tolerance Frequency
(MHz)
RDC
(Ω)
Max.
Rated
Current [A]
(max.)
Walsin Part Number
L(uH)
WLFM2012Z0MR47PB
WLFM2012Z0MR50PB
WLFM2012Z0M1R0PB
WLFM2012Z0M1R5PB
WLFM2012Z0M2R2PB
WLFM2012Z0M3R3PB
WLFM2012Z0M4R7PB
0.47
0.50
1.0
M
M
M
M
M
M
M
1
1
1
1
1
1
1
0.08
0.08
0.14
0.20
0.20
0.24
0.28
1.2
1.2
1.0
0.8
0.8
0.7
0.7
1.5
2.2
3.3
4.7
● WLFM2520 series (EIA 1008)
RDC
(Ω)
Max.
Measuring
Frequency
(MHz)
Rated
Current [A]
(max.)
Walsin Part Number
L(uH)
Tolerance
WLFM2520Z0MR47PB
WLFM2520Z0M1R0PB
WLFM2520Z0M1R5PB
WLFM2520Z0M2R2PB
0.47
1.0
1.5
2.2
M
M
M
M
1
1
1
1
0.05
0.08
0.09
0.09
1.80
1.40
1.30
1.30
WLFM2520Z0M3R3PB
WLFM2520Z0M4R7PB
3.3
4.7
M
M
1
1
0.12
0.15
1.20
1.10
TEST INSTRUMENT： HP4285A
Rated current specifies that self-heat generation is below 40℃during DC loaded.(at 20℃)
Components shall be used within operating temperature. When inductors are mounted, heat dispersion and
product surface temperature (including self heating) change much by land pattern
Therefore inductors shall be used in condition that self heating temperature is within 40℃.
Operating temp: -40℃ to +85℃
Page 3 of 10
ASC_WLFM Series_V5.0
SEP - 2017
Approval Sheet
DC Bias Current vs Inductance (Typical)：
WLFM2012 series
WLFM2520 series
Page 4 of 10
ASC_WLFM Series_V5.0
SEP - 2017
Approval Sheet
Test Condition & Requirements (WLFM2012/2520 series)
Test Item
Standard
Test method
Test sample shall be immersed into molten solder under the
conditions shown in Table 1 after immersed into flux.
After this, test samples shall be taken out and visually checked.
The speed for immersion and taking out shall be 25 mm/s.
Solderability
More than 75% of
terminal electrode shall
be covered with fresh
solder.
Table 1 (Eutectic solder)
Solder temperature
230℃±5%
Immersion time
4s±1s
Table 1 (Pb-free solder Sn/3.0Ag/0.5Cu)
Solder temperature
245℃±3%
Immersion time
4s±1s
Resistance to
soldering heat
No mechanical damage.
Remaining terminal
electrode: 70% min.
Inductance change rate:
Within±30%
Test sample shall be immersed into molten solder after immersed
into flux and preheated under the conditions shown in Table 2.
After this, test samples shall be taken out and measured after kept
at room temperature for 2 to 3 hours.(Note 1)
The speed for immersion and taking out shall be 25mm/s.
Table 2
Preheating
150 to 180℃
2 to 3min.
260℃±5℃
10s±0.5s
Resistance to soldering heat
Immersion time
Thermal shock
No mechanical damage.
Inductance change rate:
Within±30%
Steps 1 to4 shown in Table 3 as one cycle shall be repeated 5
times.
After the test, keep the test sample at a normal temperature with a
normal humidity for 2 to3 hours, then measurement shall be
conducted. (Note 1)
Table 3
0
3
Step
Temperature
-40℃± 0
Normal temp
+80℃± 3
Normal temp
Time
1
2
3
4
3
℃
30min.±3min.
2min. to 3min.
30min.±3min.
2min. to 3min.
0℃
Resistance to
humidity
No mechanical damage.
Inductance change rate:
Within±30%
Test board shall be kept in a thermo hygrostat with temperature of
40℃±2℃ and relative humidity of 90% to 95% for 500+24/-0 hours.
After the test, keep the test sample at a normal temperature with a
normal humidity for 2 to 3 hours, then measurement shall be
conducted. (Note 1)
High temperature
load life test.
No mechanical damage.
Inductance change rate:
Within±30%
Test board shall be kept in a thermostatic oven with temperature of
85℃±2℃ and the rated current shall be continuously applied for
500+24/-0 hours.
After the test, keep the test sample at a normal temperature with a
normal humidity for 2 to 3 hours, then measurement shall be
conducted. (Note 1)
Page 5 of 10
ASC_WLFM Series_V5.0
SEP - 2017
Approval Sheet
Test Item
Standard
Test method
Test sample shall be immersed into molten solder under the
conditions shown in Table 1 after immersed into flux.
After this, test samples shall be taken out and visually checked.
The speed for immersion and taking out shall be 25 mm/s.
Solderability
More than 75% of
terminal electrode shall
be covered with fresh
solder.
Table 1 (Eutectic solder)
Solder temperature
230℃±5%
Immersion time
4s±1s
Table 1 (Pb-free solder Sn/3.0Ag/0.5Cu)
Solder temperature
245℃±3%
Immersion time
4s±1s
Resistance to
soldering heat
No mechanical damage.
Remaining terminal
electrode: 70% min.
Inductance change rate:
Within±30%
Test sample shall be immersed into molten solder after immersed
into flux and preheated under the conditions shown in Table 2.
After this, test samples shall be taken out and measured after kept
at room temperature for 2 to 3 hours.(Note 1)
The speed for immersion and taking out shall be 25mm/s.
Table 2
Preheating
150 to 180℃
2 to 3min.
260℃±5℃
10s±0.5s
Resistance to soldering heat
Immersion time
Thermal shock
No mechanical damage.
Inductance change rate:
Within±30%
Steps 1 to4 shown in Table 3 as one cycle shall be repeated 5
times.
After the test, keep the test sample at a normal temperature with a
normal humidity for 2 to3 hours, then measurement shall be
conducted. (Note 1)
Table 3
0
3
Step
Temperature
-40℃± 0
Normal temp
+80℃± 3
Normal temp
Time
1
2
3
4
3
℃
30min.±3min.
2min. to 3min.
30min.±3min.
2min. to 3min.
0℃
Resistance to
humidity
No mechanical damage.
Inductance change rate:
Within±30%
Test board shall be kept in a thermo hygrostat with temperature of
40℃±2℃ and relative humidity of 90% to 95% for 500+24/-0 hours.
After the test, keep the test sample at a normal temperature with a
normal humidity for 2 to 3 hours, then measurement shall be
conducted. (Note 1)
High temperature
load life test.
No mechanical damage.
Inductance change rate:
Within±30%
Test board shall be kept in a thermostatic oven with temperature of
85℃±2℃ and the rated current shall be continuously applied for
500+24/-0 hours.
After the test, keep the test sample at a normal temperature with a
normal humidity for 2 to 3 hours, then measurement shall be
conducted. (Note 1)
(Note 1) If a question is found in the result of measurement, another measurement shall be conducted
after test samples shall be kept for 48±2 hours.
Page 6 of 10
ASC_WLFM Series_V5.0
SEP - 2017
Approval Sheet
Reflow Profile Chart (Reference)
*Temperature on
surface of circuit board
The products may be exposed to reflow soldering process of above profile up to two times.
Page 7 of 10
ASC_WLFM Series_V5.0
SEP - 2017
Approval Sheet
Packaging Specification
External Dimension of Plastics Tape
WLFM2012
WLFM2520
Page 8 of 10
ASC_WLFM Series_V5.0
SEP - 2017
Approval Sheet
Packaging
Reel
Page 9 of 10
ASC_WLFM Series_V5.0
SEP - 2017
Approval Sheet
Top tape strength
Top tape requires peeling strength of 0.1N to 0.7N in the arrow direction as shown below.
Quantity per reel
WLFM2012：3K pcs/reel
WLFM2520：3K pcs/reel
Page 10 of 10
ASC_WLFM Series_V5.0
SEP - 2017
相关型号：
©2020 ICPDF网 联系我们和版权申明