WLPH252012MR68PP [WALSIN]

SMD Molded Power Inductors;


型号：	WLPH252012MR68PP
厂家：	Walsin Technology
描述：	SMD Molded Power Inductors
文件：	总8页 (文件大小：604K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

WLPH252012_P Series

SMD Molded Power Inductors

*Contents in this sheet are subject to change without prior notice.

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ASC_WLPH252012_P Series

2019.03

Features

1. High saturation current realized by material properties and structure design

2. Low DC resistance to achieve high conversion efficiency and lower temperature rising

3. Low Profile: 2.5 mm × 2.0 mm × 1.2 mm.

4. Magnetically shielded structure to accomplish high resolution in EMC protection.

5. Halogen free, Lead Free, RoHS Compliance.

Applications

1. WLPH series is generic applied in portable DC to DC converter line.

2. Smart phone, PAD applications high current and low profile power supplier.

3. DC/DC converter

4. Thin-type power supply module,

Shape and Dimension

Code

Dimensions(mm)

2.5 ± 0.2

2.0 ± 0.2

1.2 MAX.

0.6 ±0.3

Recommend Pattern

[mm]

2.0

1.2

2.8

(Unit: mm)

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ASC_WLPH252012_P Series

2019.03

Ordering Information

2520

R24

Product

Code

Series

Dimensions

Thickness

Tolerance

Value

Packing Code

WL:

Inductor

SMD

molded

power

2.5 * 2.0mm

1.2mm

R24=0.24uH

2R2=2.20uH

P=7” Reeled

(Embossed tape)

General

M: ± 20%

inductor.

Electrical Characteristics

WLPH252012_P series

RDC

DC Resistance

(mΩ)

Isat[A]

Saturation Current

Irms[A]

Heat Rating Current

Tolerance

Walsin Part Number

L(uH)

(±%)

(Typ) Max

Typ

Max

Typ

Max

WLPH252012MR47PP

WLPH252012MR68PP

WLPH252012M1R0PP

WLPH252012M1R5PP

WLPH252012M2R2PP

WLPH252012M4R7PP

0.47

0.68

1.0

(21) 25

5.3

4.95

4.6

4.18

(29) 35

(41) 49

4.63

4.04

2.91

2.73

1.58

3.7

3.5

3.36

3.18

2.27

2.06

1.4

4.4

3.2

1.5

(64) 77

2.5

2.2

(85) 98

2.27

1.61

4.7

(196) 235

1.9

1: Customized design is available, please contact us.

2: All test referenced to 26℃ ambient

3: Inductance is measured with Agilent^®LCR meter 4285A (or equivalent) at 1MHz/1V.

4: DC resistance is measured with HIOKI^®micro-ohm meter RM3542 or equivalent.

5: Isat means that DC current will cause a 30% inductance reduction from initial value.

6: Irms means that DC current will cause coil temp. rising to 40℃ whichever is smaller.

General specifications

Temperature Specifications

Operating Temperature range

Storage Temperature range

: -40℃ to +125℃

: -50℃ to +125℃

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ASC_WLPH252012_P Series

2019.03

Electrical Properties

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ASC_WLPH252012_P Series

2019.03

Reliability Testing

Test item

Test condition

Criteria

1. More than 95 % of terminal

electrode should be covered with

new solder

1. Solder temperature : 260 ± 5℃

2. Flux : Rosin

Resistance to Solder Heat

2. No mechanical damage

3. DIP time : 10 ± 1 sec

3. Inductance value should be

within ± 20 % of the initial value

1. Reflow temperature : 245℃ It shall be

Soldered on the substrate applying

direction parallel to the substrate

2. Apply force(F) : 5 N

1. No mechanical damage

2. Soldering the products on PCB

after the pulling test force > 5 N

Adhesive Test

3. Test time : 10 sec

1. Temperature:-50 ~ 125℃ For 30

minutes each

1. No mechanical damage

2. Cycle: 500 cycles

2. Inductance should be within

Temperature Cycle

3. Measurement: At ambient temperature ±20% of the initial value

24 hours after test completion

1. Temperature: 85 ± 2℃

2. Testing time: 500 hours

1. No mechanical damage

Dry Heat Test

3. Applied current: Full rated current

2. Inductance should be within ±

4. Measurement: At ambient temperature 20% of the initial value

24 hours after test completion

1. Temperature: 60 ± 2℃

2. Humidity: 90-95 % RH

1. No mechanical damage

2. Inductance should be within

±20% of the initial value

3. Applied current: Full rated current

4. Testing time: 500 hours

Humidity Test

5. Measurement: At ambient temperature

24 hours after test completion

Page 5 of 8

ASC_WLPH252012_P Series

2019.03

Taping Package and Label Marking

Carrier tape dimensions

2.8±0.1

1.35±0.1

2.25±0.05

0.22±0.05

Taping reel dimensions

PART SIZE

(EIA SIZE)

2520 (1008)

Qty.(pcs)

BOX

3,000

reels / inner box

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ASC_WLPH252012_P Series

2019.03

Taping specifications

There shall be the portion having no product in both the head and the end of taping, and there shall be

the cover tape in the head of taping.

Label Marking

The label specified as follows shall be put on the side of reel.

(1) Part No

(2) Quantity

(3) Lot No

* Part No. And Quantity shall be marked on outer packaging.

Quantity of products in the taping package

(1)Standard quantity：3000pcs/Reel

(2)Shipping quantity is a multiple of standard quantity.

Precautions for Handling

Precaution for handling of substrate

Do not exceed to bend the board after soldering this product extremely. (reference examples)

• Mounting place must be as far as possible from the position, which is close to the break line of

board, or on the line of large holes of board.

• Do not bend extremely the board, in mounting another components.

If necessary, use back-up pin (support pin) to prevent from bending extremely.

• Do not break the board by hand. We recommend to use the machine or the jig to break it.

Precaution for soldering

Note that this product will be easily damaged by rapid heating, rapid cooling or local heating.

Do not give heat shock over 100°C in the process of soldering. We recommend to take preheating and

gradual cooling.

Recommendable reflow soldering

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ASC_WLPH252012_P Series

2019.03

Reference IPC-020c-5-1

Profile Feature

Pb free Assembly

Average Ramp Rate

(Ts max to Tp)

Preheat

3 ℃/second max

Temperature Min (Ts_min

Temperature Min (Ts_max

Time(ts_minto ts_min

)

150℃

)

200℃

)

60-180 seconds

Time maintained above:

Temperature (TL)

Time (tL)

217℃

60-150 seconds

260℃ +0/-5 ℃

Peak Temperature (T_p)

Time within 5 ℃ of actual Peak

Temperature (T_p)

20-40 seconds

Ramp-Down Rate

6 ℃/second max.

Time 25℃ to Peak Temperature

8 minutes max

Soldering gun procedure

Note the follows, in case of using solder gun for replacement.

(1)The tip temperature must be less than 280°C for the period within 3 seconds by using soldering gun under

30 W.

(2)The soldering gun tip shall not touch this product directly.

Soldering volume

Note that excess of soldering volume will easily get crack the body of this product.

Taping Package Storage Condition

Storage Temperature : 5 to 40 ℃

Relative Humidity: < 65%RH

Storage Time : 12 months max.

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ASC_WLPH252012_P Series

2019.03

相关型号：

WLPH252012_P

SMD Molded Power Inductors

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WLPH252012_S

SMD Molded Power Inductors

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