WLPM706630MR56LC [WALSIN]
SMD Molded Power Inductors;型号: | WLPM706630MR56LC |
厂家: | Walsin Technology |
描述: | SMD Molded Power Inductors |
文件: | 总6页 (文件大小:426K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
WLPM706630*LC Series
SMD Molded Power Inductors
*Contents in this sheet are subject to change without prior notice.
Page 1 of 6
ASC_WLPM706630 Series_V3.0
Nov. Y2017
Features
1. Shielded construction.
2. Ultra low buzz noise.
3. Low DCR/µH.
4. Handles high transient current spikes without saturation.
5. Encapsulated body offers improved environmental protection and moisture resistance.
6. Higher dielectric withstanding voltage.
7. Corrosion resistant package.
8. RoHS Compliance.
Applications
1. PDA/Notebook/Desktop/Server applications high current and low profile power supplier
2. High current POL converters.
3. Battery powered devices.
Shape and Dimension
UNIT: mm
DIM.
7.4
6.6
3.0
3.0
1.6
TOL.
max
±0.2
max
±0.3
±0.3
M1
M2
M3
M4
M5
Recommend Pattern
MARKING AND DATE CODE
Marking ex:1.0uH ꢀ1R0
Date code
XX XXꢀyear and weekly ex:1033
Page 2 of 6
ASC_WLPM706630 Series_V3.0
Nov. Y2017
Ordering Information
WL
PM
7066
30
M
R22
L
C
Product
Code
Series
Dimensions
Thickness
Tolerance
Value
Packing Code
WL:
Inductor
SMD
Molded
power
7.0 * 6.6mm
2.8mm
R22=0.22uH
1R0=1.0uH
100=10uH
L=13” Reeled
C:
M: ± 20%
(Embossed tape)
inductor.
Electrical Characteristics
WLPM706630*LC series
RDC
Maximum (mΩ)
Measuring
Tolerance Frequency
(kHz),1V
Rated
Current
Typical (A)
I sat
Typical (A)
Walsin Part Number
L(uH)
TYP.
1.9
MAX.
2.5
WLPM706630MR15LC
WLPM706630MR22LC
WLPM706630MR24LC
WLPM706630MR33LC
WLPM706630MR47LC
WLPM706630MR56LC
WLPM706630MR68LC
WLPM706630MR82LC
WLPM706630M1R0LC
WLPM706630M1R5LC
WLPM706630M2R2LC
WLPM706630M3R3LC
WLPM706630M4R7LC
WLPM706630M5R6LC
WLPM706630M6R8LC
WLPM706630M8R2LC
WLPM706630M100LC
WLPM706630M150LC
WLPM706630M220LC
0.15
0.22
0.24
0.33
0.47
0.56
0.68
0.82
1.0
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
26.0
23.0
23.0
20.0
17.5
16.5
15.5
13.0
11.0
9.0
52.0
40.0
40.0
30.0
26.0
25.5
25.0
20.0
20.0
16.0
12.0
10.0
7.0
2.5
2.8
2.5
2.8
3.5
3.9
4.0
4.2
4.7
5.0
5.0
5.5
6.7
8.0
9.0
10.0
15.0
20.0
30.0
40.0
44.0
60.0
60.0
68.0
125.0
190.0
1.5
14.0
17.0
28.0
37.0
40.0
54.0
54.0
62.0
110.0
165.0
2.2
8.0
3.3
6.0
4.7
5.5
5.6
5.5
6.0
6.8
4.5
6.5
8.2
4.5
6.0
10.0
15.0
22.0
4.0
5.5
3.5
3.0
2.0
3.5
TEST INSTRUMENT: CHROMA 16502、Zentech1320+Zentech3305
(1). Test Freq : 100KHz ,1V
(2). All test data is referenced to 25℃ ambient.
(3). Operating Temperature Range -55℃ to +125℃.
(4). Rated Current: DC current(A)that will cause an approximate△T of 40℃.
(5). I sat: DC current(A)that will cause Lo to drop approximately 30%.
(6). The part temperature(ambient +temp rise)should not exceed 125℃ under worst case operating
conditions. Circuit design, component placement, PWB trace size and thickness, airflow and other
cooling provisions all affect the part temperature Part temperature should be verified.
Page 3 of 6
ASC_WLPM706630 Series_V3.0
Nov. Y2017
RELIABILITY PERFORMANCE
Reliability Experiment For Electrical
Test Item
Test Condition
Standard Source
MIL-STD-202G
Method 103B
Test Condition B
+40℃± 2℃, humidity of 90% ± 5% (total 96 hours).
Humidity Test
1.Temperature: +125℃±2℃
2.Test time: 48±2hrs
High Temperature
Test
IEC 68-2
Test Condition B
1.Temperature: -40℃±2℃
2.Test time: 48±2hrs
Low Temperature
Test
IEC 68-2
Test Condition A
MIL-STD-202G
Method 107G
Test Condition B-
2
+125℃±5℃ (30 minutes) ~ -40 ± 5℃ (30 minutes),
temperature switch time: 5 minutes (total 50 cycles).
Thermal Shock
Life Test
MIL-STD-202G
Method 108A
Test Condition B
+70℃±5℃ (250Hours)
Reliability Experiment For Physical
Test Item
Test Condition
Standard Source
10-55-10HZ, amplitude: 1.5mm, direction: X, Y, Z axes, MIL-STD-202G
Vibration Test
each axis 2 hours (total 6 hours).
Method 201A
IR/convection reflow:Peak Temp 250±5℃ for 5Sec in
air, Through 2 Cycle. Temperature
Ramp:+1~4°C/sec; Above1 83°C, must keep 90 s - 120
s
MIL-STD-202G
Method 210F
Test Condition
(Reflow)
Solder Heat
Resistance Test
Soak in 245 ℃ solder pot of 3Sec, PAD must have
95% above coverage.
Solder Ability Test
J-STD-003B
Page 4 of 6
ASC_WLPM706630 Series_V3.0
Nov. Y2017
TYPICAL RoHS REFLOW PROFILE
Page 5 of 6
ASC_WLPM706630 Series_V3.0
Nov. Y2017
Packaging
THE FORCE FOR TEARING OFF
130 GRAMS IN THE ARROW
THICKNESS (t)
0.10 MAX
165 TO 180°
TOP COVER TAPE
EMBOSSED CAVITY
BASE TAPE
EMBOSSED CARRIER
START
END
NO COMPONENTS
160 (mm) MIN
COMPONENTS
NO COMPONENTS
MIN. 390 (mm)
MAX. 560 (mm)
COVER TAPE
USER DIRECTION OF FEED
DIMENSIONS OF CARRIER TAPE (mm)
CARRIER TAPE REELS (mm)
MATERIAL:
PLASTIC
E
2.0±0.1
4.0±0.1
+0.1-0
φ1.5
1.75±0.1
A
W
B
N
φC
P
φC
※ 10 sprocket hole pitch cumulative tolerance ±0.20
UNIT : mm
A
B
C
E
N
P
W
t
A0
6.9
B0
7.6
K0
3.4
DIM.
TOL.
330
±0.2
25.0
±0.5
13.0
16.6
±0.5
100
MIN
12.0
±0.1
16.0
±0.3
0.4
±0.5
±0.05
±0.1
±0.1
±0.1
Quantity per reel:1K pcs
Page 6 of 6
ASC_WLPM706630 Series_V3.0
Nov. Y2017
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