WLPN303010M220PB [WALSIN]

SMD Molded Power Choke Inductors;


型号：	WLPN303010M220PB
厂家：	Walsin Technology
描述：	SMD Molded Power Choke Inductors 测试功率感应器电感器
文件：	总9页 (文件大小：284K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

WLPN303010 Series

SMD Molded Power Choke Inductors

*Contents in this sheet are subject to change without prior notice.

Page 1 of 9

ASC_WLPN303010 Series_V4.0

Nov. Y2017

Features

1. Close magnetic loop with magnetic resin shielded.

2. Low profile, High inductance.

Applications

1. General propose power inductor in DC power system.

2. Inductor in DC/DC converter.

3. Low profile for portable and wearable device.

4. LC filter in Audio D class Amplifier

Shape and Dimension

Unit: mm

Polarity mark

Ordering Information

3030

1R2

Product

Code

Series

Dimensions

Thickness

Tolerance

Value

Packing Code

WL:

Inductor

Shielded

SMD

Power

3.0 * 3.0 mm

1.0 mm

1R2 = 1.2uH

100 = 10uH

P=7” Reeled

(Embossed Tape)

B:STD

M: ± 20%

N: ± 30%

Inductors

Page 2 of 9

ASC_WLPN303010 Series_V4.0

Nov. Y2017

Electrical Characteristics

Rated Current

(mA) Max

Test

Freq

(KHz)

DCR

WLPN303010

SRF

Inductance

Tolerance

(uH)

(Ω ± 20%)

Saturation

Temperature

Rise Current

Idc2

Series

(MHz)Min

Current

Idc1

WLPN303010N1R2PB

WLPN303010N1R5PB

WLPN303010M2R2PB

WLPN303010M3R3PB

WLPN303010M4R7PB

WLPN303010M6R8PB

WLPN303010M100PB

WLPN303010M150PB

WLPN303010M220PB

1.2

1.5

2.2

3.3

4.7

6.8

0.065

0.075

0.083

0.130

0.170

0.250

0.350

0.550

0.770

120

1700

1440

1300

1000

850

1480

1370

1300

1030

900

100

700

745

600

620

450

480

380

410

1. Test Frequency: 100KHz.

2. Test Equipment:

Inductance: Chroma3302+1320+16502 or equivalent.

DCR: Chroma16502 or equivalent.

SRF: HP4291B or equivalent.

3. Saturation Current Idc1: The value of current causes a 30% inductance reduction from initial value.

4. Temperature rise current Idc2: The value of current causes a 40℃temperature rise.

5. Rated Current: Either Idc1 or Idc2 whichever is smaller.

6. Operating Temperature Range:-25℃ to +120℃ (Including self-temperature rise).

7. Storage Temp. Range：-40℃ to +85℃.

8. MSL：Level 1.

Structural Drawing

1 Ferrite core ：Ni-Zn ferrite.

2 Winding wire：Polyurethane-copper wire.

3 Over-coating resin：Epoxy resin, containing ferrite powder.

4 Electrode：External electrode (substrate)

Ni-Sn

External electrode (base plating)

External electrode (top surface solder coating) Sn-Ag-Cu

Page 3 of 9

ASC_WLPN303010 Series_V4.0

Nov. Y2017

Characteristic Curve

Inductance vs. DC Current

100

220M

100M

4R7M

2R2M

0.1

100

1.000

10.000

DC Current (m A)

Core Chipping:

The appearance standard of the chipping size in top side, of bottom side ferrite core is following dimension.

0.6mmMax.

Page 4 of 9

ASC_WLPN303010 Series_V4.0

Nov. Y2017

Exposed wire tolerance limit of coating resin part on product side

Size of exposed wire occurring to coating resin is specified below.

..1 Width direction (dimension a): Acceptable when a<=w/2

Nonconforming when a>w/2

Length direction (dimension b): Dimension b is not specified.

When total area of exposed wire occurring to each sides is

not greater than 50% of coating resin area, that is acceptable.

Reflow Profile Chart (Reference):

*Temperature on

surface of circuit board

2.2

(Table 1)

The products may be exposed to reflow soldering process of above profile up to two times.

Page 5 of 9

ASC_WLPN303010 Series_V4.0

Nov. Y2017

Mechanical Performance /Environmental Test Performance Specifications: (WLPN303010 series)

No.

Item

Test condition

Requirements

Resistance to

Deflection.

No damage.

The test samples shall be soldered to the test board by the reflow

soldering conditions show in Table 1.

As illustrated below, apply force in the direction of the Arrow indicating

until deflection of the test board Reaches to 2 mm.

Force

R230

Rod

Board

Test

Sample

45±2

1.5

Land dimensions

Unit: mm

Test board size :100×40×10

Test board material l: glass epoxy-resin

Solder cream thickness:0.1

Adhesion of

Terminal

Electrode.

Shall not come off

PC board.

The test samples shall be soldered to the test board by the reflow

soldering conditions shown in Table 1.

10 N, 5 s

Applied force: 10 N to X and Y directions Duration: 5 s.

Solder cream thickness:0.1 mm.

(Refer to recommended Land Pattern Dimensions Defined in

“Precaution”)

Body strength.

No damage.

Applied force :20 N.

Duration :10 s.

R0.5mm

Sample

0.6W

Resistance to

Vibration.

△L/L:within±10%

No abnormality

observed In

The test samples shall be soldered to the test board by the

reflow soldering conditions shown in Table 1.Then It shall be

submitted to below test conditions.

appearance.

Frequency range

10Hz~55Hz

Total Amplitude 1.5mm(May not exceed acceleration 196 m/S2)

Sweeping Method

Time

10Hz to 55Hz to 10 Hz for 1 min.

For 2 hours on each X, Y, and Z axis.

Resistance to

Soldering heat

(Reflow).

The test sample shall be exposed to reflow oven at 230±5 deg C for

40 seconds, with peak temperature at 260±5 deg C for 5 seconds, 2

times.

△L/L:within±10%

No abnormality

observed In

appearance

Test board thickness: 1.0 mm.

Test board material: Glass epoxy-resin.

Page 6 of 9

ASC_WLPN303010 Series_V4.0

Nov. Y2017

Solder ability.

At least 90% of

surface of terminal

electrode is

covered by new

solder.

The test samples shall be dipped in flux, and then Immersed in

molten solder as shown in below table.

Flux: Methanol solution containing rosin 25%.

Solder Temperature

Time

245±deg C

5±1.0 S.

Immersing Speed

25 mm/s

Temperature

Characteristics.

△L/L:within±20%

No abnormality

observed in

Measurement of inductance shall be taken at temperature range within

-25 deg C to +85 deg C.

With reference to inductance value at +20 deg C, change rate shall be

calculated.

appearance.

Thermal shock.

△L/L:within±10%

No abnormality

observed in

The test samples shall be soldered to test board by the reflow

soldering conditions shown in Table 1.

The test samples shall be placed at specified shown in below table in

sequence.

appearance.

The temperature cycle shall be repeated 100 cycles.

Conditions of steps for 1 cycle.

Step

Temperature

-40±3 deg C

Time(min)

30±3

Room Temp

85±2 deg C

Room Temp

3 maximum

30±3

3 maximum

Low

Temperature life

Test.

△L/L:within±10%

No abnormality

observed in

The test samples shall be soldered to the test board by the reflow

soldering conditions shown in Table 1.

After that, the test samples shall be placed at test conditions as shown

in below table.

appearance.

Temperature

Time

-40±2 deg C

500 +24/-0 h

Loading at high

temperature life

test.

△L/L:within±10%

No abnormality

observed in

The test samples shall be soldered to the test board by the reflow

soldering conditions shown in Table 1.

The test samples shall be placed in thermostatic oven set at specified

temperature and applied the rated current continuously as shown in

below table.

appearance.

Temperature

Applied current

Time

85±2 deg C

Rated current

(Refer to Page 3)

500+24/-0 h

Damp heat life

test.

The test samples shall be soldered to the test board by the reflow

soldering conditions shown in Table 1.

The test samples shall be placed in thermostatic oven set at specified

temperature and humidity as shown in below table.

△L/L:within±10%

No abnormality

observed in

appearance.

Temperature

Humidity

Time

60±2 deg C

90~95%RH

500+24/-0 h

Loading under

Damp heat life

test.

The test samples shall be soldered to the test board by the reflow

soldering conditions shown in Table 1.

The test samples shall be placed in thermostatic oven set at specified

temperature and humidity and applied the rated current continuously

as shown in below table.

△L/L:within±10%

No abnormality

observed in

appearance.

Temperature

60±2 deg C

Humidity

90~95%RH

Applied current

Time

Rated current (Refer to Page 3)

500+24/-0 h

Page 7 of 9

ASC_WLPN303010 Series_V4.0

Nov. Y2017

Tape & Reel Packaging Dimensions:

Dimensions

Unit：mm

D₀

P₁

P₀

A₀

+0.1

-0

1.5

3.2

0.1

3.2

0.1

8.0

0.2

3.5

1.75

0.1

4.0

0.1

2.0

0.05

4.0

0.1

0.3

1.4

±0.1

0.1

0.05

Direction of rolling

Direction of production

insertion

Position of wire

Page 8 of 9

ASC_WLPN303010 Series_V4.0

Nov. Y2017

Reel

¡í

Label position:on the opposite sie of sprocket holes side of reel

Top tape strength

Peel-off strength: 0.1N~0.7N

Peel-off angle:165 ~180

Peel-off speed: 300mm/mm

Quantity per reel：2K pcs

Page 9 of 9

ASC_WLPN303010 Series_V4.0

Nov. Y2017

相关型号：