WLPN404018M101LB [WALSIN]
Shielded SMD Power Inductors;
| 型号： | WLPN404018M101LB |
| 厂家： | 
Walsin Technology |
| 描述： | Shielded SMD Power Inductors 测试 功率感应器 电感器 |
| 文件： | 总11页 (文件大小：321K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
WLPN404018 Series
Shielded SMD Power Inductors
*Contents in this sheet are subject to change without prior notice.
Page 1 of 11
ASC_WLPN404018 Series_V4.0
Nov. Y2017
Features
1. Close magnetic loop with magnetic resin shielded.
2. Low profile, High inductance.
Applications
1. General propose power inductor in DC power system.
2. Inductor in DC/DC converter.
3. Low profile for portable and wearable device.
4. LC filter in Audio D class Amplifier.
Shape and Dimension
Unit: mm
DIM.
4.0
4.0
1.8
1.1
2.5
TOL.
±0.2
M1
M2
M3
M4
M5
±0.2
MAX.
±0.2
±0.2
Recommended Land-Pattern
2 .8
Polarity mark
Symbol
1 .2
1 .2
Ordering Information
WL
PN
4040
18
N
1R0
L
B
Product
Code
Series
Dimensions
Thickness
Tolerance
Value
Packing Code
WL:
Inductor
Shielded
SMD
Power
4.0 * 4.0 mm
1.8 mm
1R0 = 1.0uH
100 = 10uH
L=13” Reeled
(Embossed Tape)
B:STD
M: ± 20%
N: ± 30%
Inductors
Page 2 of 11
ASC_WLPN404018 Series_V4.0
Nov. Y2017
Electrical Characteristics
Rated Current
(mA) Max
DCR
WLPN404018
L
SRF
Inductance
Tolerance
Symbol
(uH)
(Ω±20%)
(MHz)Min
Series
Saturation
Temperature
Rise Current
Idc2
Current
Idc1
WLPN404018N1R0LB
WLPN404018N1R5LB
WLPN404018M2R2LB
WLPN404018M3R3LB
WLPN404018M4R7LB
WLPN404018M6R8LB
WLPN404018M100LB
WLPN404018M150LB
WLPN404018M220LB
WLPN404018M330LB
WLPN404018M470LB
WLPN404018M680LB
WLPN404018M101LB
WLPN404018M151LB
WLPN404018M221LB
1.0
1.5
2.2
3.3
4.7
6.8
10
A
B
C
E
H
I
±30%
±30%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
±20%
0.027
0.037
0.042
0.055
0.070
0.098
0.150
0.210
0.290
0.460
0.650
1.000
1.450
2.300
3.800
90
75
60
45
35
30
25
18
15
12
10
8.3
6.5
5.5
4.0
4000
3300
3000
2300
2000
1600
1300
1100
900
3200
2400
2200
2000
1700
1450
1200
850
K
M
N
P
S
T
15
22
720
33
700
550
47
600
440
68
520
320
100
150
220
V
W
X
420
280
340
220
275
170
1. Test Frequency: 100KHz
2. Test Equipment:
Inductance: Chroma3302+1320 or equivalent.
DCR: Chroma16502 or equivalent.
SRF: HP4291B or equivalent.
3. Saturation Current Idc1: The value of current causes a 30% inductance reduction from initial value.
4. Temperature rise current Idc2: The value of current causes a 40℃temperature rise.
5. Rated Current: Either Idc1 or Idc2 whichever is smaller.
6. Operating Temperature Range:-25℃ to +125℃ (Including self-temperature rise)
7. Storage Temp. Range：-40℃ to +85℃.
8. MSL：Level 1
Page 3 of 11
ASC_WLPN404018 Series_V4.0
Nov. Y2017
Structural Drawing
(Magnetic Shielded Type)
1 Ferrite core ：Ni-Zn ferrite
2 Winding wire：Polyurethane-copper wire
3 Over-coating resin：Epoxy resin, containing ferrite powder
4 Electrode：External electrode (substrate)
Ag
Ni-Sn
External electrode (base plating)
External electrode (top surface solder coating) Sn-Ag-Cu
Page 4 of 11
ASC_WLPN404018 Series_V4.0
Nov. Y2017
Characteristic Curve
Page 5 of 11
ASC_WLPN404018 Series_V4.0
Nov. Y2017
Core Chipping:
The appearance standard of the chipping size in top side, of bottom side ferrite
Core is following dimension.
W
L
W
L
1.0mmMax.
1.0mmMax.
Exposed wire tolerance limit of coating resin part on product side
Size of exposed wire occurring to coating resin is specified below.
a
..1 Width direction (dimension a): Acceptable when a<=w/2
Nonconforming when a>w/2
2
3
Length direction (dimension b): Dimension b is not specified.
When total area of exposed wire occurring to each sides is
not greater than 50% of coating resin area, that is acceptable.
b
w
Page 6 of 11
ASC_WLPN404018 Series_V4.0
Nov. Y2017
Reflow Profile Chart (Reference):
*Temperature on
surface of circuit board
(Table 1)
The products may be exposed to reflow soldering process of above profile up to two times.
Page 7 of 11
ASC_WLPN404018 Series_V4.0
Nov. Y2017
Mechanical Performance /Environmental Test Performance Specifications: (WLPN404018 series)
No.
Item
Test condition
Requirements
Resistance to
Deflection
No damage.
The test samples shall be soldered to the test board by the reflow
soldering conditions show in Table 1.
As illustrated below, apply force in the direction of the Arrow indicating
until deflection of the test board Reaches to 2 mm.
20
10
Force
R230
Rod
1
Board
Test
Sample
R5
45±2
45±2
0.8
0.8
Land dimensions
Unit: mm
Test board size :100×40×10
Test board material l: glass epoxy-resin
Solder cream thickness:0.1
Adhesion of
Terminal
Electrode
Shall not come off
PC board
The test samples shall be soldered to the test board
By the reflow soldering conditions shown in Table 1.
10 N, 5 s
2
Applied force: 10 N to X and Y directions Duration: 5 s.
Solder cream thickness:0.1 mm
(Refer to recommended Land Pattern Dimensions Defined in
“Precaution”)
Body strength
No damage
Applied force :20 N
Duration :10 s
R0.5mm
Sample
3
0.6W
Resistance to
Vibration
△L/L:within±10%
No abnormality
observed In
The test samples shall be soldered to the test board by
The reflow soldering conditions shown in Table 1.Then
It shall be submitted to below test conditions
appearance
Frequency range
10Hz~55Hz
Total Amplitude 1.5mm(May not exceed acceleration 196 m/S2)
4
5
Sweeping Method
Time
10Hz to 55Hz to 10 Hz for 1 min.
For 2 hours on each X, Y, and Z axis.
Resistance to
Soldering heat
(Reflow)
The test sample shall be exposed to reflow oven at 230±5 deg C for
40 seconds, with peak temperature at 260±5 deg C for 5 seconds, 2
times.
△L/L:within±10%
No abnormality
observed In
appearance
Test board thickness:1.0 mm
Test board material :glass epoxy-resin
Page 8 of 11
ASC_WLPN404018 Series_V4.0
Nov. Y2017
Solder ability
At least 90% of
surface of terminal
electrode is
covered by new
solder.
The test samples shall be dipped in flux, and then Immersed in
molten solder as shown in below table.
Flux: Methanol solution containing rosin 25%
Solder Temperature
Time
245±deg C
5±1.0 S.
6
7
Immersing Speed
25 mm/s
Temperature
Characteristics
△L/L:within±20%
No abnormality
observed
Measurement of inductance shall be taken at temperature
Range within -25 deg C to +85 deg C.
With reference to inductance value at +20 deg C, change
Rate shall be calculated.
In appearance
Thermal shock
△L/L:within±10%
No abnormality
observed
The test samples shall be soldered to test board
By the reflow soldering conditions shown in Table 1.
The test samples shall be placed at specified
Shown in below table in sequence.
In appearance
The temperature cycle shall be repeated 100 cycles.
Conditions of steps for 1 cycle
8
Step
1
Temperature
-40±3 deg C
Time(min)
30±3
2
3
4
Room Temp
85±2 deg C
Room Temp
3 maximum
30±3
3 maximum
Low
Temperature life
Test
△L/L:within±10%
No abnormality
observed
The test samples shall be soldered to the test board by
The reflow soldering conditions shown in Table 1.
After that, the test samples shall be placed at test
Conditions as shown in below table.
In appearance
9
Temperature
Time
-40±2 deg C
500 +24/-0 h
Loading at high
temperature life
test
△L/L:within±10%
No abnormality
observed in
The test samples shall be soldered to the test board by the reflow
soldering conditions shown in Table 1.
The test samples shall be placed in thermostatic oven set at specified
temperature and applied the rated current continuously as shown in
below table.
appearance.
10
11
Temperature
Applied current
Time
85±2 deg C
Rated current
(Refer to Page 3)
500+24/-0 h
Damp heat life
test
The test samples shall be soldered to the test board by the reflow
soldering conditions shown in Table 1.
The test samples shall be placed in thermostatic oven set at specified
temperature and humidity as shown in below table.
△L/L:within±10%
No abnormality
observed in
appearance.
Temperature
Humidity
Time
60±2 deg C
90~95%RH
500+24/-0 h
Loading under
Damp heat life
test
The test samples shall be soldered to the test board by the reflow
soldering conditions shown in Table 1.
The test samples shall be placed in thermostatic oven set at specified
temperature and humidity and applied the rated current continuously
as shown in below table.
△L/L:within±10%
No abnormality
observed in
appearance.
Temperature
60±2 deg C
12
Humidity
90~95%RH
Applied current
Time
Rated current (Refer to Page 3)
500+24/-0 h
Page 9 of 11
ASC_WLPN404018 Series_V4.0
Nov. Y2017
Tape & Reel Packaging Dimensions:
Dimensions
Unit: mm
D0
P1
P0
P
2
A0
A0
B0
W
F
E
P1
P2
P0
D
0
T
K
Φ1.5
+0.1
-0
4.3
±0.1
4.3
±0.1
12.0
±0.3
5.5
±0.1
1.75
±0.1
8.0
±0.1
2.0
±0.1
4.0
±0.1
0.3
±0.05
2.1
±0.1
Direction of rolling
Direction of production
insertion
Position of wire
Page 10 of 11
ASC_WLPN404018 Series_V4.0
Nov. Y2017
Reel
Top tape strength
Peel-off strength: 0.1N~1.3N
Peel-off angle:165°~180°
Peel-off speed: 300mm/mm
Quantity per reel：3.5K pcs (3500 pcs)
Page 11 of 11
ASC_WLPN404018 Series_V4.0
Nov. Y2017
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