WLPN505040M330LB [WALSIN]

SMD Shielded Power Inductors;


型号：	WLPN505040M330LB
厂家：	Walsin Technology
描述：	SMD Shielded Power Inductors 测试功率感应器电感器
文件：	总10页 (文件大小：278K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

WLPN505040 Series

SMD Shielded Power Inductors

*Contents in this sheet are subject to change without prior notice.

Page 1 of 10

ASC _WLPN505040 Series_V3.0

Nov. Y2017

Features

1. Close magnetic loop with magnetic resin shielded.

2. High inductance.

Applications

1. General propose power inductor in DC power system.

2. Inductor in DC/DC converter.

3. LC filter in Audio D class Amplifier.

4. Use in STB、Notebook、Radio、LCDs 、other electrical devices.

Shape and Dimension

Unit: mm

3.6

1.5

Recommended Land-Pattern

Package Size

WLPN505040

1.2±0.2

(N1R5~M100)

(M150~M470)

4.9±0.2

3.3±0.2

4.1 MAX.

4.0 MAX.

Ordering Information

5050

1R5

Product

Code

Series

Dimensions

Thickness

Tolerance

Value

Packing Code

WL:

Inductor

SMD

Shielded

Power

4.9 * 4.9 mm

4.1 mm

1R5 = 1.5uH

150 = 15.0uH

B:STD

M: ± 20%

N: ± 30%

=13” Reeled

(Embossed tape)

Inductors

Page 2 of 10

ASC _WLPN505040 Series_V3.0

Nov. Y2017

Electrical Characteristics

Rated Current (mA)

Test

Freq

(KHz)

SRF

Min.

(MHz)

Inductance

Tolerance

DCR (Ω)

±20%.

WLPN505040 Series

L (uH)

Saturation

Temperature

Rise Current

Idc2

Current

Idc1

WLPN505040N1R5LB

WLPN505040N2R2LB

WLPN505040N3R3LB

WLPN505040N4R7LB

WLPN505040M6R8LB

WLPN505040M100LB

WLPN505040M150LB

WLPN505040M220LB

WLPN505040M330LB

WLPN505040M470LB

1.5

2.2

3.3

4.7

6.8

100

0.017

0.022

0.027

0.029

0.049

0.056

0.080

0.126

0.180

0.310

6400

5000

4000

3300

2800

2300

2000

1500

1300

1100

4500

3700

3300

3100

2400

2100

1800

1400

1200

900

1. Test Frequency: 100KHz

2. Test Equipment:

Inductance: Chroma3302+1320+16502. or equivalent.

DCR: Chroma16502 or equivalent.

SRF: HP4291B or equivalent.

3. Saturation Current Idc1: The value of current causes a 30% inductance reduction from initial value.

4. Temperature rise current Idc2: The value of current causes a 40℃ temperature rise.

5. Rated Current: Either Idc1 or Idc2 whichever is smaller.

6. Operating Temperature Range:-25℃ to +125℃ (Including self-temperature rise)

7. Storage Temp. Range：-40℃ to +85℃.

8. MSL：Level 1

Structural Drawing:

Magnetic Shielded Type

1 Ferrite core.

2 Winding wire

Ni-Zn ferrite

. .Polyurethane-copper wire

3 Over-coating resin. Epoxy resin, containing ferrite powder

4 Electrode

.External electrode (substrate) Ag

External electrode (base plating) Ni-Sn

External electrode (top surface solder coating) Sn-Ag-Cu

Page 3 of 10

ASC _WLPN505040 Series_V3.0

Nov. Y2017

ELECTRICAL CURVE

Inductance vs. DC Current

100

470M

220M

100M

4R7M

2R2N

0.1

100

1.000

10.000

DC Current (m A)

Core Chipping

The appearance standard of the chipping size in top side, of bottom side ferrite core is following dimension.

1.5mmMax.

..1 Width direction (dimension a): Acceptable when a<=w/2

Nonconforming when a>w/2

Length direction (dimension b): Dimension b is not specified.

When total area of exposed wire occurring to each sides is

not greater than 50% of coating resin area, that is acceptable.

Page 4 of 10

ASC _WLPN505040 Series_V3.0

Nov. Y2017

TYPICAL RoHS REFLOW PROFILE

Page 5 of 10

ASC _WLPN505040 Series_V3.0

Nov. Y2017

Mechanical Performance /Environmental Test Performance Specifications: (WLPN505040 series)

Test Item

Standard

Test method

Resistance to

Deflection

No damage.

R230

Force

Rod

Board

Test

Sample

45±2

1.5

The test samples shall be soldered to the test board

by the reflow soldering conditions show in Table 1.

As illustrated below, apply force in the direction of the

Arrow indicating until deflection of the test board

Reaches to 2 mm.

Land dimensions

Test board size :100×40×10

Test board material l: glass epoxy-resin

Solder cream thickness:0.1

Unit: mm

Adhesion of

Terminal

Shall not come off PC

board

The test samples shall be soldered to the test board

By the reflow soldering conditions shown in Table 1.

Electrode

10 N, 5 s

Applied force:10 N to X and Y directions

Duration:5 s.

Solder cream thickness:0.1 mm

(Refer to recommended Land Pattern Dimensions

Defined in “Precaution”)

Body strength

No damage

Applied force :20 N

Duration :10 s

R0.5mm

Sample

0.6W

Page 6 of 10

ASC _WLPN505040 Series_V3.0

Nov. Y2017

Test Item

Standard

Test method

The test samples shall be soldered to the test board by

The reflow soldering conditions shown in Table 1.Then

It shall be submitted to below test conditions

Resistance to

Vibration

△L/L:within±10%

No abnormality

observed

In appearance

Frequency range 10Hz~55Hz

1.5mm(May not exceed acceleration

Total Amplitude

196 m/S²)

Sweeping Method 10Hz to 55Hz to 10 Hz for 1 min.

Time

For 2 hours on each X,Y, and Z axis.

The test sample shall be exposed to reflow oven at

230±5 deg C for 40 seconds, with peak temperature at

260±5 deg C for 5 seconds, 2 times.

Resistance to

Soldering heat

(Reflow)

△L/L:within±10%

No abnormality

observed

In appearance

Test board thickness:1.0 mm

Test board material :glass epoxy-resin

The test samples shall be dipped in flux, and then

Immersed in molten solder as shown in below table.

Flux: Methanol solution containing rosin 25%

Solder ability

At least 90% of surface

of terminal electrode is

covered by new solder.

Solder Temperature

Time

245±deg C

5±1.0 S.

Immersing Speed

25 mm/s

Temperature

Characteristics

Measurement of inductance shall be taken at temperature

Range within -25 deg C to +85 deg C.

With reference to inductance value at +20 deg C, change

Rate shall be calculated.

The test samples shall be soldered to test board

By the reflow soldering conditions shown in Table 1.

The test samples shall be placed at specified

Shown in below table in sequence.

△L/L:within±20%

No abnormality

observed

In appearance

△L/L:within±10%

No abnormality

observed

Thermal shock

In appearance

The temperature cycle shall be repeated 100 cycles.

Conditions of steps for 1 cycle

Step

Temperature

-40±3 deg C

Time(min)

30±3

Room Temp

85±2 deg C

Room Temp

3 maximum

30±3

3 maximum

Low

Temperature life

Test

△L/L:within±10%

No abnormality

observed

The test samples shall be soldered to the test board by

The reflow soldering conditions shown in Table 1.

After that, the test samples shall be placed at test

Conditions as shown in below table.

In appearance

Temperature

Time

-40±2 deg C

500 +24/-0 h

Page 7 of 10

ASC _WLPN505040 Series_V3.0

Nov. Y2017

Test Item

Standard

Test method

Loading at high △L/L:within±10%

The test samples shall be soldered to the test board by the

reflow soldering conditions shown in Table 1.

The test samples shall be placed in thermostatic oven set at

specified temperature and applied the rated current continuously

as shown in below table.

temperature life

test

No abnormality

observed in

appearance.

Temperature

Applied current

Time

85±2 deg C

Rated current

(Refer to Page 3)

500+24/-0 h

Damp heat life

test

△L/L:within±10%

No abnormality

observed

The test samples shall be soldered to the test board by the

reflow soldering conditions shown in Table 1.

The test samples shall be placed in thermostatic oven set at

specified temperature and humidity as shown in below table.

in appearance.

Temperature

Humidity

Time

60±2 deg C

90~95%RH

500+24/-0 h

Loading under

Damp heat life

test

△L/L:within±10%

No abnormality

observed

The test samples shall be soldered to the test board by the

reflow soldering conditions shown in Table 1.

The test samples shall be placed in thermostatic oven set at

specified temperature and humidity and applied the rated current

continuously as shown in below table.

in appearance.

Temperature

Humidity

60±2 deg C

90~95%RH

Rated current

(Refer to Page 3)

500+24/-0 h

Applied current

Time

Page 8 of 10

ASC _WLPN505040 Series_V3.0

Nov. Y2017

Tape & Reel Packaging Dimensions:

Dimensions

D₀

P₁

P₀

P₂

A₀

Unit：mm

Φ1.5

+0.1

-0

5.15

±0.1

5.15

±0.1

12.0

±0.3

5.5

±0.1

1.75

±0.1

8.0

±0.1

2.0

±0.1

4.0

±0.1

0.4

±0.1

4.2

±0.1

Direction of rolling

Direction of production

insertion

Position of wire

Page 9 of 10

ASC _WLPN505040 Series_V3.0

Nov. Y2017

Reel

Label position: on the opposite side of sprocket holes side of reel

Top tape strength

Peel-off strength: 0.1N~1.3N

Peel-off angle:165°~180°

Peel-off speed: 300mm/mm

Quantity per reel：1.5K pcs

Page 10 of 10

ASC _WLPN505040 Series_V3.0

Nov. Y2017

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