WLPN606028N1R5LB [WALSIN]

Shielded SMD Power Inductors;


型号：	WLPN606028N1R5LB
厂家：	Walsin Technology
描述：	Shielded SMD Power Inductors
文件：	总9页 (文件大小：296K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

WLPN606028 Series

Shielded SMD Power Inductors

*Contents in this sheet are subject to change without prior notice.

Page 1 of 9

ASC_WLPN606028 Series_V5.0

Nov. Y2017

Features

1. Close magnetic loop with magnetic resin shielded.

2. Low profile, High inductance.

Applications

1. General propose power inductor in DC power system.

2. Inductor in DC/DC converter.

3. Low profile for portable and wearable device.

4. LC filter in Audio D class Amplifier.

Shape and Dimension

Unit: mm

DIM.

6.0

TOL.

±0.2

MAX.

±0.2

6.0

2.8

1.35

4.0

±0.2

Ordering Information

6060

1R5

Product

Code

Series

Dimensions

Thickness

Tolerance

Value

Packing Code

WL:

Inductor

Shielded

SMD

Power

6.0 * 6.0 mm

2.8 mm

R90 = 0.9uH

1R5 = 1.5uH

100 = 10uH

L=13” Reeled

(Embossed Tape)

B:STD

M: ± 20%

N: ± 30%

Inductors

Page 2 of 9

ASC_WLPN606028 Series_V5.0

Nov. Y2017

Electrical Characteristics

Rated Current

(mA) Max

Test

Freq

(KHz)

DCR

WLPN606028

SRF

Inductance

Tolerance

(uH)

(Ω ± 30%)

Saturation

Temperature

Rise Current

Idc2

Series

(MHz)Min

Current

Idc1

WLPN606028NR90LB

WLPN606028N1R5LB

WLPN606028N2R2LB

WLPN606028N3R0LB

WLPN606028M4R7LB

WLPN606028M6R0LB

WLPN606028M100LB

WLPN606028M150LB

WLPN606028M220LB

WLPN606028M330LB

WLPN606028M470LB

WLPN606028M680LB

WLPN606028M101LB

0.9

1.5

2.2

100

0.013

0.016

0.02

6700

5100

4200

3600

2700

2500

1900

1600

1300

1100

1000

800

4600

4200

3700

3400

3000

2500

1900

1800

1400

1100

920

0.023

0.031

0.04

4.7

100

0.065

0.095

0.135

0.22

0.3

0.42

770

0.6

650

660

1. Test Frequency: 100KHz.

2. Test Equipment:

Inductance: Chroma3302+1320+16502 or equivalent.

DCR: Chroma16502 or equivalent.

SRF: HP4291B or equivalent.

3. Saturation Current Idc1: The value of current causes a 30% inductance reduction from initial value.

4. Temperature rise current Idc2: The value of current causes a 40℃temperature rise.

5. Rated Current: Either Idc1 or Idc2 whichever is smaller.

6. Operating Temperature Range:-25℃ to +125℃ (Including self-temperature rise).

7. Storage Temp. Range：-40℃ to +85℃.

8. MSL：Level 1.

Structural Drawing

1 Ferrite core ：Ni-Zn ferrite.

2 Winding wire：Polyurethane-copper wire.

3 Over-coating resin：Epoxy resin, containing ferrite powder.

4 Electrode：External electrode (substrate)

External electrode (base plating)

Ni-Sn

External electrode (top surface solder coating) Sn-Ag-Cu

Page 3 of 9

ASC_WLPN606028 Series_V5.0

Nov. Y2017

Characteristic Curve

1000

101M

100

470M

220M

100M

4R7M

2R2N

R90N

0.1

100

1.000

10.000

100.000

DC Current (mA)

Core Chipping:

The appearance standard of the chipping size in top side, of bottom side ferrite core is following dimension.

1.5mmMax.

Page 4 of 9

ASC_WLPN606028 Series_V5.0

Nov. Y2017

Exposed wire tolerance limit of coating resin part on product side

Size of exposed wire occurring to coating resin is specified below.

..1 Width direction (dimension a): Acceptable when a<=w/2

Nonconforming when a>w/2

Length direction (dimension b): Dimension b is not specified.

When total area of exposed wire occurring to each sides is

not greater than 50% of coating resin area, that is acceptable.

Reflow Profile Chart (Reference):

*Temperature on

surface of circuit board

2.2

(Table 1)

The products may be exposed to reflow soldering process of above profile up to two times.

Page 5 of 9

ASC_WLPN606028 Series_V5.0

Nov. Y2017

Mechanical Performance /Environmental Test Performance Specifications:

No.

Item

Test condition

Requirements

Resistance to

Deflection.

No damage.

The test samples shall be soldered to the test board by the reflow

soldering conditions show in Table 1.

As illustrated below, apply force in the direction of the Arrow indicating

until deflection of the test board Reaches to 2 mm.

Force

R230

Rod

Board

Test

Sample

45±2

0.8

Land dimensions

Unit: mm

Test board size :100×40×10

Test board material l: glass epoxy-resin

Solder cream thickness:0.1

Adhesion of

Terminal

Electrode.

Shall not come off

PC board

The test samples shall be soldered to the test board by the reflow

soldering conditions shown in Table 1.

10 N, 5 s

Applied force: 10 N to X and Y directions Duration: 5 s.

Solder cream thickness:0.1 mm.

(Refer to recommended Land Pattern Dimensions Defined in

“Precaution”)

Body strength.

No damage

Applied force :20 N.

Duration :10 s.

R0.5mm

Sample

0.6W

Resistance to

Vibration.

△L/L:within±10%

No abnormality

observed In

The test samples shall be soldered to the test board by the

reflow soldering conditions shown in Table 1.Then it shall be

submitted to below test conditions.

appearance

Frequency range 10Hz~55Hz

Total Amplitude

Sweeping Method 10Hz to 55Hz to 10 Hz for 1 min.

Time For 2 hours on each X, Y, and Z axis.

1.5mm(May not exceed acceleration 196 m/S2)

Resistance to

Soldering heat

(Reflow).

The test sample shall be exposed to reflow oven at 230±5 deg C for

40 seconds, with peak temperature at 260±5 deg C for 5 seconds, 2

times.

△L/L:within±10%

No abnormality

observed In

appearance

Test board thickness:1.0 mm

Test board material :glass epoxy-resin

Page 6 of 9

ASC_WLPN606028 Series_V5.0

Nov. Y2017

Solder ability.

At least 90% of

surface of terminal

electrode is

covered by new

solder.

The test samples shall be dipped in flux, and then Immersed in

molten solder as shown in below table.

Flux: Methanol solution containing rosin 25%

Solder Temperature

Time

245±deg C

5±1.0 S.

Immersing Speed

25 mm/s

Temperature

Characteristics.

△L/L:within±20%

No abnormality

observed

Measurement of inductance shall be taken at temperature range within

-25 deg C to +85 deg C.

With reference to inductance value at +20 deg C, change rate shall be

calculated.

In appearance

Thermal shock.

△L/L:within±10%

No abnormality

observed in

The test samples shall be soldered to test board by the reflow

soldering conditions shown in Table 1.

The test samples shall be placed at specified shown in below table in

sequence.

appearance.

The temperature cycle shall be repeated 100 cycles.

Conditions of steps for 1 cycle.

Step

Temperature

-40±3 deg C

Time(min)

30±3

Room Temp

85±2 deg C

Room Temp

3 maximum

30±3

3 maximum

Low

Temperature life

Test.

△L/L:within±10%

No abnormality

observed in

The test samples shall be soldered to the test board by the reflow

soldering conditions shown in Table 1.

After that, the test samples shall be placed at test conditions as shown

in below table.

appearance.

Temperature

Time

-40±2 deg C

500 +24/-0 h

Loading at high

temperature life

test.

△L/L:within±10%

No abnormality

observed in

The test samples shall be soldered to the test board by the reflow

soldering conditions shown in Table 1.

The test samples shall be placed in thermostatic oven set at specified

temperature and applied the rated current continuously as shown in

below table.

appearance.

Temperature

Applied current

Time

85±2 deg C

Rated current

(Refer to Page 3)

500+24/-0 h

Damp heat life

test.

The test samples shall be soldered to the test board by the reflow

soldering conditions shown in Table 1.

The test samples shall be placed in thermostatic oven set at specified

temperature and humidity as shown in below table.

Temperature

Humidity

Time

△L/L:within±10%

No abnormality

observed in

appearance.

60±2 deg C

90~95%RH

500+24/-0 h

Loading under

Damp heat life

test.

The test samples shall be soldered to the test board by the reflow

soldering conditions shown in Table 1.

The test samples shall be placed in thermostatic oven set at specified

temperature and humidity and applied the rated current continuously

as shown in below table.

△L/L:within±10%

No abnormality

observed in

appearance.

Temperature

60±2 deg C

Humidity

90~95%RH

Applied current

Time

Rated current (Refer to Page 3)

500+24/-0 h

Page 7 of 9

ASC_WLPN606028 Series_V5.0

Nov. Y2017

Tape & Reel Packaging Dimensions:

Dimensions

Unit: mm

D₀

P₁

P₀

P₂

A₀

+0.1

-0

1.5

6.30

0.1

6.30

0.1

12.0

0.3

5.5

0.1

1.75

8.0

0.1

2.0

0.1

4.0

0.1

0.40

3.10

±0.1

0.1

Direction of rolling

Direction of production

insertion

Position of wire

Page 8 of 9

ASC_WLPN606028 Series_V5.0

Nov. Y2017

Reel

Label position: on the opposite side of sprocket holes side of reel

Top tape strength

Peel-off strength: 0.1N~1.3N

Peel-off angle:165°~180°

Peel-off speed: 300mm/mm

Quantity per reel：2K pcs

Page 9 of 9

ASC_WLPN606028 Series_V5.0

Nov. Y2017

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