W7MG1M32SVX120BNI [WEDC]
8MB/4MB (2x1Mx32 / 1Mx32) MirrorBitTM 3.0V, Boot Sector Flash Memory Module; 8MB / 4MB （ 2x1Mx32 / 1Mx32 ） MirrorBitTM 3.0V ，引导扇区闪存模块
| 型号： | W7MG1M32SVX120BNI |
| 厂家： | 
WHITE ELECTRONIC DESIGNS CORPORATION |
| 描述： | 8MB/4MB (2x1Mx32 / 1Mx32) MirrorBitTM 3.0V, Boot Sector Flash Memory Module |
| 文件： | 总10页 (文件大小：170K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
W7MG1M32SVx-BN
W7MG21M32SVx-BN
PRELIMINARY*
White Electronic Designs
8MB/4MB (2x1Mx32 / 1Mx32) MirrorBit™ 3.0V, Boot Sector
Flash Memory Module
ꢀ
Top boot block configurations
• Bottom boot block optional. Contact WEDC.
Embedded Erase Algorithms
• Automatically preprograms and erases the chip
or any combination of sectors
Embedded Program Algorithms
DESCRIPTION
The W7MG1M32SVx-BN and W7MG21M32SVx-BN are
organized as one and two banks of 1Mx32 respectively.
The modules are based onAMDs MirrorBit™AM29LV160M
- 1Mx16 or S29AL016M (optional) Flash device in TSOP
packages which are mounted on an FR4 substrate.
ꢀ
ꢀ
Both modules offer access times between 70 and 120ns
allowing for operation of high-speed microprocessors
without wait states.
• Automatically programs and verifies data at
specified address
Data Polling and Toggle Bit feature for detection of
program or erase cycle completion
ꢀ
ꢀ
FEATURES
Low Power Dissipation
ꢀ
ꢀ
ꢀ
ꢀ
1Mx32 and 2x1Mx32 Densities
Based on AMD - AM29LV160M Flash Device
Spansion™ - S29AL016M (optional)
High Performance
• 30mA per Device Active Current
• 10µA per Device CMOS Standby Current
Single 3.3V 10ꢀ Supply
CMOS and TTL Compatible Inputs and Outputs
Commercial and industrial operating temperature
range
• BNC = 0°C to 70°C Commercial
• BNI = -40°C to 85°C Industrial
Package
ꢀ
ꢀ
ꢀ
• Access time as fast as 70ns
• 0.7s typical sector erase time
3V for read, erase, and program operations
Flexible, Sector Architecture
ꢀ
ꢀ
ꢀ
• One 16Kbyte, two 8Kbyte, one 32Kbyte and
thirty-one 64Kbyte sectors.
• 80 Pin SIMM (JEDEC) Standard
• Any combination of sectors can be erased
• Also supports full chip erase
* This product is under development, is not qualified or characterized and is subject to
change without notice.
FIG. 1 – BLOCK DIAGRAMS
W7MG1M32SVx-BN: 1Mx32 80 PIN SIMM
W7MG21M32SVx-BN: 2x1Mx32 80 PIN SIMM
WE2#
WE2#
1Mx16
WE#
1Mx16
WE#
DQ0-15
Addr
DQ16-31
DQ0-15
DQ16-31
DQ0-15
CE#
CE# 0-19
CE#
CE# 0-19
Addr
1Mx16
WE#
WE0#
CE0#
DQ0-15
Addr
WE0#
CE0#
CE#
CE# 0-19
1Mx16
WE#
1Mx16
WE#
DQ0-15
DQ0-15
DQ0-15
CE#
CE# 0-19
Addr
CE#
CE# 0-19
Addr
1Mx16
WE#
DQ0-15
CE#
CE# 0-19
Addr
CE1#
OE#
Addr 0-19
OE#
Addr 0-19
May 2004
Rev. 2
1
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
W7MG1M32SVx-BN
W7MG21M32SVx-BN
PRELIMINARY
White Electronic Designs
FIGURE 2 – DECOUPLING CAPACITORS ARE PROVIDED FOR IMPROVED NOISE IMMUNITY.
VCC
C1
.1 µF
C2
.1 µF
C3
.1 µF
C4
.1 µF
C5
.1 µF
C6
.1 µF
C7
.1 µF
C8
.1 µF
Notes:
Unless otherwise specified.
1. Population Configuration for 1M x 32 Version
Part Number Configuration
W7MG1M32SVxxxBNX 1M x 32
2. Population Configuration for 2 x 1M x 32 Version
Component
1M x 8
Part Number
Configuration
Component
1M x 8
W7MG21M32SVxxxBNX 2 x 1M x 32
xx = Speed: 70, 90, 120ns
X = Temerature Range
Please refer to part number matrix pg. 8 or 9
May 2004
Rev. 2
2
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
W7MG1M32SVx-BN
W7MG21M32SVx-BN
PRELIMINARY
White Electronic Designs
FIGURE 3 – W7MG1M32SVxxxBNX & W7MG21M32SVxxxBNX PIN CONFIGURATION
Pin
1
Symbol
GND
VCC
Pin
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
Symbol
CE3
CE2
CE1
CE0
GND
DQ29
DQ30
DQ31
WE2#
NC
Pin
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
Symbol
A11
A10
A9
Pin
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
Symbol
DQ9
DQ8
DQ7
DQ6
DQ5
DQ4
DQ3
DQ2
DQ1
DQ0
NC
2
3
NC
4
OE#
A8
5
WE0#
NC
A7
6
A6
7
NC*
A5
8
DQ16
DQ17
DQ18
DQ19
DQ20
DQ21
DQ22
DQ23
DQ24
DQ25
DQ26
DQ27
DQ28
A4
9
A3
10
11
12
13
14
15
16
17
18
19
20
A2
NC
A1
NC
A0
VCC
A19
NC
PD1
PD2
PD3
PD4
PD5
PD6
PD7
GND
A18
GND
DQ15
DQ14
DQ13
DQ12
DQ11
DQ10
A17
A16
A15
A14
A13
A12
Notes:
Unless otherwise specified.
1. Population Configuration for 1M x 32 Version
PIN NAMES
Part Number
Configuration
Component
1M x 8
A0 - A19
Address
Data Input/Output
Chip Enable
W7MG1M32SVxxxBNX 1M x 32
2. Population Configuration for 2 x 1M x 32 Version
DQ0 - DQ31
CE1#, CE2#
WE0#, WE2#
OE#
Part Number
Configuration
Component
1M x 8
W7MG21M32SVxxxBNX 2 x 1M x 32
Write Enable
Output Enable
Power Supply
No Connection
Presence Detect
Ground
xx = Speed: 70, 90, 120ns
X = Temerature Range
Please refer to part number matrix pg. 8 or 9
VCC
NC
NC* = Pin 7 can offer custom module options. For optional "Reset" or
"Ready Busy." Contact WEDC.
PD
GND
May 2004
Rev. 2
3
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
W7MG1M32SVx-BN
W7MG21M32SVx-BN
PRELIMINARY
White Electronic Designs
PRESENCE DETECT TRUTH TABLE
Module Organization
1M x 32
PD1
1
PD2
0
PD3
1
PD4
0
2 x 1M x 32
0
1
0
0
MODULE SPEED IDENTIFICATION PRESENCE DETECT PIN
Speed
70 ns
PD5
PD6
PD7
0
1
0
0
1
1
1
0
0
90 ns
120 ns
LEGEND: 0 = Connected to GND
1 = Open circuit (no connection)
CAPACITANCE
f = 1.0MHZ, VIN = VCC or VSS
1Meg
2x1Meg
Parameter
Symbol
Unit
Max
35
Max
70
Address Lines
Data lines
CA
CDQ
CC
pF
pF
pF
pF
15
30
Chip & Write Enable Lines
Output Enable lines
15
30
CG
35
70
May 2004
Rev. 2
4
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
W7MG1M32SVx-BN
W7MG21M32SVx-BN
PRELIMINARY
White Electronic Designs
ABSOLUTE MAXIMUM RATINGS
OPERATING RANGES
Commercial (C) Devices
Storage Temperature
Plastic Packages .................................–65°C to +150°C
Ambient Temperature (TA) ........................0°C to +70°C
Industrial (I) Devices
Ambient Temperature (TA) ....................–40°C to +85°C
Ambient Temperature
with Power Applied...............................–65°C to +125°C
Voltage with Respect to Ground
V
CC Supply Voltages
VCC (Note 1) ...................................... –0.5 V to +4.0 V
V
CC for all devices .................................... 2.7 V to 3.6 V
A9, OE#, and RESET# (Note 2) ...... –0.5 V to +12.5 V
All other pins (Note 1) .................. –0.5 V to VCC+0.5 V
Output Short Circuit Current (Note 3) .................200 mA
Operating ranges define those limits between which the functionality of the device is
guaranteed.
Notes:
1.
Minimum DC voltage on input or I/O pins is –0.5 V. During voltage transitions,
input or I/O pins may overshoot VSS to –2.0 V for periods of up to 20 ns. See
Figure 7. Maximum DC voltage on input or I/O pins is VCC +0.5 V. During voltage
transitions, input or I/O pins may overshoot to VCC +2.0 V for periods up to 20
ns. See Figure 8.
2.
3.
Minimum DC input voltage on pins A9, OE#, and RESET# is -0.5 V. During
voltage transitions, A9, OE#, and RESET# may overshoot VSS to –2.0 V for
periods of up to 20 ns. See Figure 7. Maximum DC input voltage on pin A9 is
+12.5 V which may overshoot to 14.0 V for periods up to 20 ns.
No more than one output may be shorted to ground at a time. Duration of the
short circuit should not be greater than one second.
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent
damage to the device. This is a stress rating only; functional operation of the device at
these or any other conditions above those indicated in the operational sections of this
data sheet is not implied. Exposure of the device to absolute maximum rating conditions
for extended periods may affect device reliability.
May 2004
Rev. 2
5
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
W7MG1M32SVx-BN
W7MG21M32SVx-BN
PRELIMINARY
White Electronic Designs
ORDERING INFORMATION FOR W7MG1M32SVx
COMMERCIAL
Part Number
Speed (ns)
Package
346
346
TA Commercial Range
0°C to +70°C
Height*
W7MG1M32SVx70BNC
W7MG1M32SVx90BNC
W7MG1M32SVx120BNC
70
90
120
21.59 (0.850")
21.59 (0.850")
21.59 (0.850")
0°C to +70°C
0°C to +70°C
346
INDUSTRIAL
Part Number
Speed (ns)
Package
346
346
TA Industrial Range
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
Height*
W7MG1M32SVx70BNI
W7MG1M32SVx90BNI
W7MG1M32SVx120BNI
70
90
120
21.59 (0.850")
21.59 (0.850")
21.59 (0.850")
346
PACKAGE NO. 346: 80 PIN SIMM (JEDEC)
118.24
(4.655) MAX.
3.05
(0.120)
MAX
111.35
(4.384)
21.59
R1 R3
J3
(0.850)
J1
MAX
6.35
10.16
153
(0.400)
(0.250)
1.27
6.35 (0.250)
1.57 (0.062) R
(0.050) TYP
3.18
(0.125)
MIN
105.41
(4.150)
1.57
(0.062) R
55.68
57.02
(2.245)
(2.192)
* ALL DIMENSIONS ARE IN MILLIMETERS AND (INCHES)
May 2004
Rev. 2
6
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
W7MG1M32SVx-BN
W7MG21M32SVx-BN
PRELIMINARY
White Electronic Designs
ORDERING INFORMATION FOR W7MG21M32SVx
COMMERCIAL
Part Number
Speed (ns)
Package
361
361
TA Commercial Range
0°C to +70°C
Height*
W7MG21M32SVx70BNC
W7MG21M32SVx90BNC
W7MG21M32SVx120BNC
70
90
120
21.59 (0.850")
21.59 (0.850")
21.59 (0.850")
0°C to +70°C
0°C to +70°C
361
INDUSTRIAL
Part Number
Speed (ns)
Package
361
361
TA Industrial Range
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
Height*
W7MG21M32SVx70BNI
W7MG21M32SVx90BNI
W7MG21M32SVx120BNI
70
90
120
21.59 (0.850")
21.59 (0.850")
21.59 (0.850")
361
PACKAGE NO. 361: 80 PIN SIMM (JEDEC)
118.24
(4.655) MAX.
4.32
(0.170)
MAX
111.35
(4.384)
21.59
R1 R3
J3
(0.850)
J1
MAX
6.35
10.16
153
(0.400)
(0.250)
1.27
6.35 (0.250)
1.57 (0.062) R
(0.050) TYP
3.18 5.72
105.41
(4.150)
1.57
(0.125) (0.225)
MIN MIN
(0.062) R
55.68
57.02
(2.245)
(2.192)
* ALL DIMENSIONS ARE IN MILLIMETERS AND (INCHES)
May 2004
Rev. 2
7
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
W7MG1M32SVx-BN
W7MG21M32SVx-BN
PRELIMINARY
White Electronic Designs
FLASH PART NUMBER MATRIX
W 7 M G 1M 32 S V X XX BN X
White Electronics Design
Flash
MirrorBit™
FR4 with gold contacts
Module Address depth: 1M
Module Bus width: x32
Component width: x16
Voltage: 3.3V
T = Top / B = Bottom Boot Block
Speed: 70, 90, 120
Package: 80 Pin SIMM
Temperature range:
C = 0˚C to 70˚C Commercial
I = -40˚C to 85˚C Industrial
May 2004
Rev. 2
8
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
W7MG1M32SVx-BN
W7MG21M32SVx-BN
PRELIMINARY
White Electronic Designs
FLASH PART NUMBER MATRIX
W 7 M G 2 1M 32 S V X XX BN X
White Electronics Design
Flash
MirrorBit™
FR4 with gold contacts
Bank
Module Address depth: 1M
Module Bus width: x32
Component width: x16
Voltage: 3.3V
T = Top / B = Bottom Boot Block
Speed: 70, 90, 120
Package: 80 Pin SIMM
Temperature range:
C = 0˚C to 70˚C Commercial
I = -40˚C to 85˚C Industrial
May 2004
Rev. 2
9
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
W7MG1M32SVx-BN
W7MG21M32SVx-BN
PRELIMINARY
White Electronic Designs
Document Title
8MB/4MB (2x1Mx32 / 1Mx32) CMOS, MirrorBit™ 3.0V, Boot Sector Flash Memory
Revision History
Rev #
History
Release Date Status
Rev 0
Rev 1
Rev. 2
Created
5-04
6-04
6-04
Advanced
Advanced
Preliminary
Added T/B (top or bottom boot block option)
Changed status from advanced to preliminary
May 2004
Rev. 2
10
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
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