WEDPS512K32-15BC [WEDC]
512Kx32 SRAM MULTI-CHIP PACKAGE; 512Kx32 SRAM多芯片封装
| 型号： | WEDPS512K32-15BC |
| 厂家： | 
WHITE ELECTRONIC DESIGNS CORPORATION |
| 描述： | 512Kx32 SRAM MULTI-CHIP PACKAGE |
| 文件： | 总7页 (文件大小：198K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
WEDPS512K32-XBX
White Electronic Designs
512Kx32 SRAM MULTI-CHIP PACKAGE
FEATURES
ꢀ
Commercial, Industrial and Military Temperature
Ranges
ꢀ
Access Times of 12, 15, 17, 20, ns
Packaging
ꢀ
ꢀ
ꢀ
ꢀ
TTL Compatible Inputs and Outputs
5V Power Supply
• 16mm x 18mm, 143 PBGA
ꢀ
Organized as 512Kx32, User Configurable as
1Mx16 or 2Mx8
Low Power CMOS
This product is subject to change without notice.
PIN CONFIGURATION FOR WEDPS512K32-XBX
TOP VIEW
1
2
3
4
5
6
7
8
9
10
11
12
A
B
C
D
E
F
G
H
J
-
A2
A3
D8
D11
GND
GND
VCC
VCC
D0
A1
A4
A0
GND
D15
D13
GND
GND
GND
VCC
VCC
VCC
D5
GND
NC
VCC
VCC
D24
D26
VCC
VCC
VCC
GND
GND
GND
D17
A18
D25
D27
VCC
VCC
VCC
GND
GND
GND
D16
D18
A10
A17
OE#
WE#4 D31
VCC
VCC
A16
A15
GND
NC
D30
D29
NC
VCC
GND
NC
D22
D21
NC
CS#2
D9
D14
D12
GND
GND
GND
VCC
VCC
VCC
D7
CS#4
VCC
VCC
VCC
VCC
GND
GND
GND
GND
WE#3 D19
GND GND
NC
GND
GND
GND
VCC
VCC
VCC
NC
A5
GND
GND
GND
GND
VCC
VCC
VCC
VCC
NC
D10
WE#2
GND
VCC
CS#1
D1
D2
WE#1
GND
D28
VCC
VCC
GND
GND
D23
D20
A13
A12
VCC
GND
GND
GND
CS#3
A14
K
L
M
D3
A6
A7
D6
A9
D4
VCC
A8
VCC
A11
VCC
BLOCK DIAGRAM
PIN DESCRIPTION
I/O0-31
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
WE#1 CS#1
WE#2 CS#2
WE#3 CS#3
WE#4 CS#4
512K x 8
A0-18
WE#1-4
CS#1-4
OE#
VCC
GND
OE#
A0-18
512K x 8
512K x 8
512K x 8
8
8
8
8
I/O16-23
I/O24-31
NC
Not Connected
I/O0-7
I/O8-15
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
November, 2003
Rev.6
1
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WEDPS512K32-XBX
White Electronic Designs
ABSOLUTE MAXIMUM RATINGS
TRUTH TABLE
Parameter
Symbol Min
Max
+125
+150
VCC+0.5
150
Unit
°C
°C
V
°C
V
CS
H
L
L
L
OE
X
L
H
X
WE
X
H
H
L
Mode
Standby
Read
Out Disable
Write
Data I/O
High Z
Data Out
High Z
Power
Standby
Active
Active
Active
Operating Temperature
Storage Temperature
Signal Voltage Relative to GND
Junction Temperature
Supply Voltage
TA
TSTG
VG
-55
-65
-0.5
TJ
Data In
VCC
-0.5
7.0
RECOMMENDED OPERATING CONDITIONS
BGA THERMAL RESISTANCE
Parameter
Supply Voltage
Input High Voltage
Input Low Voltage
Operating Temp (Mil)
Symbol Min
Max
5.5
VCC + 0.3
+0.8
Unit
V
V
V
°C
Description
Junction to Ambient (No Airflow)
Junction to Ball
Junction to Case (Top)
NOTE: Refer to Application Note "PBGA Thermal Resistance Correlation" at www.
whiteedc.com in the application notes section for modeling conditions.
Symbol
Theta JA
Theta JB
Theta JC
Max
16.5 °C/W
11.3
9.8
Unit Notes
VCC
VIH
VIL
TA
4.5
2.2
-0.5
-55
1
1
1
°C/W
°C/W
+125
CAPACITANCE
(TA = +25°C)
Parameter
OE# capacitance
WE#1-4 capacitance
CS#1-4 capacitance
Data I/O capacitance
Address input capacitance
Symbol
COE
CWE
CCS
CI/O
Conditions
Max Unit
VIN = 0 V, f = 1.0 MHz
VIN = 0 V, f = 1.0 MHz
VIN = 0 V, f = 1.0 MHz
VI/O = 0 V, f = 1.0 MHz 10
VIN = 0 V, f = 1.0 MHz 30
30
10
10
pF
pF
pF
pF
pF
CAD
This parameter is guaranteed by design but not tested.
DC CHARACTERISTICS
(VCC = 5.0V, VSS = 0V, TA = -55°C to +125°C)
Parameter
Symbol
ILI
ILO
ICC x 32
ISB
VOL
Conditions
VCC = 5.5, VIN = GND to VCC
CS# = VIH, OE# = VIH, VOUT = GND to VCC
CS# = VIL, OE# = VIH, f = 5MHz, Vcc = 5.5
CS# = VIH, OE# = VIH, f = 5MHz, Vcc = 5.5
IOL = 8mA
Min
Max
10
10
660
80
0.4
Units
µA
µA
mA
mA
V
Input Leakage Current
Output Leakage Current
Operating Supply Current x 32 Mode
Standby Current
Output Low Voltage
Output High Voltage
VOH
IOH = -4.0mA
2.4
V
NOTE: DC test conditions: VIH = VCC -0.3V, VIL = 0.3V
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
November, 2003
Rev.6
2
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WEDPS512K32-XBX
White Electronic Designs
AC CHARACTERISTICS
(VCC = 5.0V, VSS = 0V, TA = -55°C to +125°C)
Parameter
Read Cycle
-12
-15
-17
-20
Symbol
Units
Min
Max
Min
Max
Min
Max
Min
Max
Read Cycle Time
Address Access Time
Output Hold from Address Change
Chip Select Access Time
Output Enable to Output Valid
Chip Select to Output in Low Z
Output Enable to Output in Low Z
Chip Disable to Output in High Z
Output Disable to Output in High Z
1. This parameter is guaranteed by design but not tested.
tRC
tAA
12
15
17
20
ns
ns
ns
ns
ns
ns
ns
ns
ns
12
15
17
20
tOH
tACS
tOE
0
0
0
0
12
7
15
8
17
9
20
10
1
tCLZ
1
0
2
0
2
0
2
0
1
tOLZ
tCHZ
tOHZ
1
7
7
12
12
12
12
12
12
1
AC CHARACTERISTICS
(VCC = 5.0V, VSS = 0V, TA = -55°C to +125°C)
Parameter
Read Cycle
Write Cycle Time
Chip Select to End of Write
Address Valid to End of Write
Data Valid to End of Write
Write Pulse Width
Address Setup Time
Address Hold Time
-12
-15
-17
-20
Symbol
Units
Min
12
10
10
8
10
0
0
Max
Min
15
13
13
10
13
2
Max
Min
Max
Min
20
15
15
12
15
2
Max
tWC
tCW
tAW
tDW
tWP
tAS
17
15
15
11
15
2
ns
ns
ns
ns
ns
ns
ns
ns
ns
tAH
0
2
0
2
0
3
Output Active from End of Write
Write Enable to Output in High Z
Data Hold Time
tOW1
tWHZ1
tDH
2
7
8
9
11
0
0
0
0
1. This parameter is guaranteed by design but not tested.
AC TEST CIRCUIT
AC TEST CONDITIONS
Parameter
Input Pulse Levels
Typ
Unit
V
VIL = 0, VIH = 3.0
IOL
Input Rise and Fall
Input and Output Reference Level
Output Timing Reference Level
5
1.5
1.5
ns
V
V
Current Source
Notes:
V
I
VZ ≈ 1.5V
(Bipolar Supply)
D.U.T.
Z is programmable from -2V to +7V.
OL & IOH programmable from 0 to 16mA.
Tester Impedance Z0 = 75 Ω.
Z is typically the midpoint of VOH and VOL
OL & IOH are adjusted to simulate a typical resistive load circuit.
ATE tester includes jig capacitance.
Ceff = 50 pf
V
I
.
IOH
Current Source
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
November, 2003
Rev.6
3
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WEDPS512K32-XBX
White Electronic Designs
TIMING WAVEFORM - READ CYCLE
tRC
ADDRESS
CS#
tAA
tRC
ADDRESS
DATA I/O
tAA
tACS
tCLZ
tCHZ
tOH
PREVIOUS DATA VALID
READ CYCLE 1 (CS# = OE# = VIL, WE# = VIH
OE#
DATA VALID
tOE
tOHZ
DATA VALID
)
tOLZ
DATA I/O
HIGH IMPEDANCE
READ CYCLE 2 (WE# = VIH
)
WRITE CYCLE - WE# CONTROLLED
tWC
ADDRESS
tAW
tAH
tCW
CS#
tAS
tWP
WE#
tOW
tDH
tDW
tWHZ
DATA VALID
DATA I/O
WRITE CYCLE 1, WE# CONTROLLED
WRITE CYCLE - CS# CONTROLLED
tWC
ADDRESS
tAW
tAS
tAH
tCW
CS#
WE#
tWP
tDW
DATA VALID
WRITE CYCLE 2, CS# CONTROLLED
tDH
DATA I/O
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
November, 2003
Rev.6
4
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WEDPS512K32-XBX
White Electronic Designs
PACKAGE 7043: 143 BALL GRID ARRAY
BOTTOM VIEW
12 11 10
9
8
7
6
5
4
3
2
1
A
16.25 (0.640)
MAX
B
C
D
E
13.97 (0.550)
NOM
1.27
(0.050)
NOM
F
G
H
J
K
L
M
1.27 (0.050) NOM
0.61 (0.024)
NOM
13.97 (0.550)
NOM
1.93 (0.076) MAX
18.25 (0.719)
MAX
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
November, 2003
Rev.6
5
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WEDPS512K32-XBX
White Electronic Designs
ORDERING INFORMATION
WED P S 512K 32 - XX X X
WHITE ELECTRONIC DESIGNS CORP.
PLASTIC
SRAM
ORGANIZATION, 512Kx32
User configurable as 1Mx16 or 2Mx8
ACCESS TIME (ns)
PACKAGE TYPE:
B = 143 PBGA, 16mm x 18mm, 288mm2
DEVICE GRADE:
M
I
C
=
=
=
MILITARY SCREENED
INDUSTRIAL
COMMERCIAL
-55°C TO +125°C
-40°C TO 85°C
0°C TO +70°C
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
November, 2003
Rev.6
6
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WEDPS512K32-XBX
White Electronic Designs
Document Title
512K x 32 SRAM Multi-Chip Package
Revision History
Rev #
Rev 0
Rev 1
Rev 2
Rev 3
Rev 4
Rev 5
History
Initial Release
ReleaseDate
March 2002
March 2002
May 2002
May 2002
August 2002
January 2003
Status
Advanced
Advanced
Advanced
Advanced
Advanced
Final
Switch Rows and Columns header position (Pg. 1)
Switch Rows and Columns header position (Pg. 1)
Change mechanical outline to more accurate design (Pg. 1, 5)
Remove references to 25-55ns speed grades (Pg. 1, 2, 3)
Changes (Pg. 1, 2)
1.1 Add Thermal Resistance Table
1.2 Change product status to Final
Rev 6
Changes (Pg. 1, 5, 7)
1.1 Change package body height to 1.93mm Max
1.2 Add ball pitch (1.27mm) to package dimension
November 2003
Final
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
November, 2003
Rev.6
7
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
相关型号：
©2020 ICPDF网 联系我们和版权申明