WF512K32-120G1TC5 [WEDC]
Flash Module, 512KX32, 120ns, CQFP68, 23.90 MM, CERAMIC, LQFP-68;
| 型号： | WF512K32-120G1TC5 |
| 厂家： | 
WHITE ELECTRONIC DESIGNS CORPORATION |
| 描述： | Flash Module, 512KX32, 120ns, CQFP68, 23.90 MM, CERAMIC, LQFP-68 |
| 文件： | 总16页 (文件大小：355K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
WF512K32-XXX5
White Electronic Designs
512Kx32 5V FLASH MODULE, SMD 5962-94612
FEATURES
n
Organized as 512Kx32
n
Access Times of 60, 70, 90, 120, 150ns
n
Commercial, Industrial and Military Temperature
Ranges
n
Packaging
n
n
n
n
n
5 Volt Programmingꢀ 5V ± 10% Supplyꢀ
Low Power CMOS, 6ꢀ5mA Standby
66 pin, PGA Type, 1ꢀ075" square, Hermetic
Ceramic HIP (Package 400(1))ꢀ
68 lead, 40mm, Low Capacitance Hermetic
CQFP (Package 501)1
Embedded Erase and Program Algorithms
TTL Compatible Inputs and CMOS Outputs
68 lead, 40mm, Low Profile 3ꢀ5mm (0ꢀ140"),
CQFP (Package 502)1
Built-in Decoupling Caps for Low Noise Opera
tion
68 lead, 22ꢀ4mm (0ꢀ880") Low Profile CQFP
(G2U) 3ꢀ5mm (0ꢀ140") high, (Package 510)1
n
n
Page Program Operation and Internal Program
Control Time
68 lead, 23ꢀ9mm (0ꢀ940") Low Profile CQFP
(G1U)1 3ꢀ5mm (0ꢀ140") high, (Package 519)
Weight
WF512K32 - XG2UX5 - 8 grams typical
WF512K32 - XH1X5 - 13 grams typical
WF512K32N - XG4X51 - 20 grams typical
WF512K32 - XG4TX51 - 20 grams typical
WF512K32 - XG1UX51 - 5 grams typical
WF512K32 - XG1TX5 - 5 grams typical
WF512K32-XG2LX5 - 8 grams typical
68 lead, 23ꢀ9mm (0ꢀ940") Low Profile
CQFP (G1T), 4ꢀ06mm (0ꢀ160") high,
Package (524)
68 lead, 22ꢀ4mm (0ꢀ880") CQFP (G2L)
5ꢀ08mm (0ꢀ200") high, Package (528)
n
n
100,000 Erase/Program Cycles Minimum
Sector Architecture
Note 1: Package Not Recommended for New Design
See Flash Programming Application Note 4M5 for algorithmsꢀ
8 equal size sectors of 64KBytes each
Any combination of sectors can be concur
rently erasedꢀ Also supports full chip erase
PIN DESCRIPTION
FIGꢀ 1 PIN CONFIGURATION FOR WF512K32N-XH1X5
TOP VIEW
I/O0-31
A0-18
WE1-4
CS1-4
OE
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
VCC
GND
NC
Not Connected
BLOCK DIAGRAM
WE3 CS3
WE4 CS4
WE1 CS1
WE2 CS2
OE
18
A
0
-
512K x 8
512K x 8
512K x 8
512K x 8
8
8
8
8
I/O16-23
I/O24-31
I/O0-7
I/O8-15
August2003Revꢀ6
1
White Electronic Designs Corporation (602) 437-1520 wwwꢀwhiteedcꢀcom
WF512K32-XXX5
White Electronic Designs
FIGꢀ 2 PIN CONFIGURATION FOR WF512K32F-XG4X51 (LOW CAPACITANCE) AND WF512K32-XG4TX51
TOP VIEW
PIN DESCRIPTION
I/O0-31 Data Inputs/Outputs
A0-18 Address Inputs
9
8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61
WE
Write Enable
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
I/O16
I/O17
I/O18
I/O19
I/O20
I/O21
I/O22
I/O23
GND
I/O24
I/O25
I/O26
I/O27
I/O28
I/O29
I/O30
I/O31
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
0
1
2
3
4
5
6
7
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
CS1-4 Chip Selects
OE
Output Enable
Power Supply
Ground
VCC
GND
NC
GND
I/O
8
9
Not Connected
I/O
I/O10
I/O11
I/O12
I/O13
I/O14
I/O15
BLOCK DIAGRAM
CS 2
CS 3
CS4
CS1
WE
OE
0-18
A
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
512K x 8
512K x 8
512K x 8
512K x 8
8
8
8
8
I/O16-23
I/O24-31
I/O0-7
I/O8-15
Note 1: Package not recommended for new designs
FIGꢀ 3 PIN CONFIGURATION FOR WF512K32-XG2UX5, WF512K32-XG2LX5, WF512K32-XG1TX5 AND
WF512K32-XG1UX51
TOP VIEW
PIN DESCRIPTION
I/O0-31 Data Inputs/Outputs
9
8
7
6
5
4
3
2
1
68 67 66 65 64 63 62 61
60
A0-18 Address Inputs
WE1-4 Write Enables
CS1-4 Chip Selects
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
0
1
2
3
4
5
6
7
I/O16
I/O17
I/O18
I/O19
I/O20
I/O21
I/O22
I/O23
GND
I/O24
I/O25
I/O26
I/O27
I/O28
I/O29
I/O30
I/O31
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
OE
Output Enable
Power Supply
Ground
VCC
GND
GND
I/O
8
9
I/O
I/O10
I/O11
I/O12
I/O13
I/O14
I/O15
BLOCK DIAGRAM
WE
WE
WE
4 CS4
2 CS 2
WE3
1 CS 1
CS3
OE
0-18
A
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
512K x 8
512K x 8
512K x 8
512K x 8
8
8
8
8
I/O16-23
I/O24-31
I/O0-7
I/O8-15
White Electronic Designs Corporation (602) 437-1520 wwwꢀwhiteedcꢀcom
2
WF512K32-XXX5
White Electronic Designs
CAPACITANCE
ABSOLUTE MAXIMUM RATINGS (1)
(TA = +25°C)
Parameter
Unit
Parameter
Symbol
ConditionsMax
Unit
Operating Temperature
-55 to +125
-2.0 to +7.0
°C
V
Supply Voltage Range (VCC)
OE capacitance
COE
CWE
V
V
IN = 0 V, f = 1.0 MHz 50
pF
pF
Signal voltage range (any pin except A9) (2) -2.0 to +7.0
V
WE1-4 capacitance
HIP (PGA)
CQFPG4T
IN = 0 V, f = 1.0 MHz
20
Storage Temperature Range
-65 to +150
+300
°C
°C
50
15
Lead Temperature (soldering, 10 seconds)
Data Retention (Mil Temp)
CQFPG2U/G1U/G1T/G2L
20 years
CS1-4 capacitance
CCS
CI/O
CAD
V
IN = 0 V, f = 1.0 MHz 20
pF
pF
pF
Endurance - write/erase cycles (Mil Temp)
100,000 cycles min.
-2.0 to +14.0
DataI/Ocapacitance
Addressinputcapacitance
V
I/O = 0 V, f = 1.0 MHz 20
IN = 0 V, f = 1.0 MHz 50
A9 Voltage for sector protect (VID) (3)
NOTES:
V
V
1ꢀ Stresses above the absolute maximum rating may cause permanent
damage to the deviceꢀ Extended operation at the maximum levels
may degrade performance and affect reliabilityꢀ
2ꢀ Minimum DC voltage on input or I/O pins is -0ꢀ5Vꢀ During voltage
transitions,inputs may overshoot Vss to -2ꢀ0 V for periods of up
to 20nsꢀ Maximum DC voltage on output and I/O pins is Vcc +
0ꢀ5Vꢀ During voltage transitions, outputs may overshoot to Vcc +
2ꢀ0 V for periods of up to 20nsꢀ
3ꢀ Minimum DC input voltage on A9 pin is -0ꢀ5Vꢀ During voltage
transitions, A9 may overshoot Vss to -2V for periods of up to
20nsꢀ Maximum DC input voltage on A9 is +13ꢀ5V which may
overshoot to 14ꢀ0 V for periods up to 20nsꢀ
This parameter is guaranteed by design but not testedꢀ
LOW CAPACITANCE CQFP
(TA = +25°C)
Parameter
Symbol
ConditionsMax Unit
VIN = 0 V, f = 1.0 MHz 32
VIN = 0 V, f = 1.0 MHz 32
VIN = 0 V, f = 1.0 MHz 15
OE capacitance
COE
CWE
CCS
pF
CQFP G4 capacitance
CS1-4 capacitance
Data I/O capacitance
pF
pF
pF
CI/O VI/O = 0 V, f = 1.0 MHz 15
Address input capacitance
CAD VIN = 0 V, f = 1.0 MHz 32
pF
RECOMMENDED OPERATING CONDITIONS
This parameter is guaranteed by design but not testedꢀ
Parameter
Symbol
Min
Max
Unit
SupplyVoltage
VCC
VIH
VIL
TA
4.5
2.0
5.5
VCC + 0.5
+0.8
V
V
InputHighVoltage
InputLowVoltage
-0.5
-55
-40
11.5
V
OperatingTemp.(Mil.)
OperatingTemp.(Ind.)
A9 VoltageforSectorProtect
+125
+85
°C
°C
V
TA
VID
12.5
DC CHARACTERISTICS - CMOS COMPATIBLE
(VCC = 5ꢀ0V, VSS = 0V, TA = -55°C TO +125°C)
Parameter
Symbol
ConditionsMin
Max
Unit
InputLeakageCurrent
ILI
ILOx32
ICC1
VCC = 5.5, VIN = GND or VCC
VCC = 5.5, VIN = GND or VCC
CS=VIL, OE=VIH, f=5MHz
CS=VIL,OE=VIH
10
10
µA
µA
OutputLeakageCurrent
VCC ActiveCurrentforRead(1)
190
240
mA
mA
VCC ActiveCurrentforProgramorErase(2)
ICC2
VCC Standby Current
VCC Static Current
Output Low Voltage
ICC4
ICC3
VOL
VCC = 5.5, CS = VIH, f=5MHz
VCC =5.5, CS =VIH
6.5
0.6
mA
mA
V
IOL = 8.0 mA, VCC = 4.5
0.45
Output High Voltage
VOH1
VLKO
IOH = 2.5 mA, VCC = 4.5
0.85 X VCC
3.2
V
V
Low VCC Lock-Out Voltage
4.2
DC test conditions: VIL = 0ꢀ3V, VIH = VCC - 0ꢀ3V
NOTES:
1ꢀ The ICC current listed includes both the DC operating current and the frequency dependent component (at 5 MHz)ꢀ The frequency
component typically is less than2
mA/MHz, with OE at VIHꢀ
2ꢀ ICC active while Embedded Algorithm (program or erase) is in progressꢀ
3
White Electronic Designs Corporation (602) 437-1520 wwwꢀwhiteedcꢀcom
WF512K32-XXX5
White Electronic Designs
AC CHARACTERISTICS WRITE/ERASE/PROGRAM OPERATIONS,CS CONTROLLED
(VCC = 5ꢀ0V, VSS = 0V, TA = -55°C TO +125°C)
Parameter
Symbol
-60
-70
Min
-90
Max
-120
Min
-150
Min
Unit
Min
Max
Max Min
Max
Max
Write Cycle Time
tAVAV
tWC
tWS
tCP
60
0
70
0
90
120
0
150
0
ns
ns
WriteEnableSetupTime
ChipSelectPulseWidth
AddressSetupTime
tWLEL
tELEH
0
40
0
45
0
45
50
0
50
0
ns
tAVEL
tAS
tDS
0
ns
DataSetupTime
tDVEH
40
0
45
0
45
50
0
50
0
ns
Data Hold Time
tEHDX
tDH
tAH
tCPH
0
ns
AddressHoldTime
tELAX
40
20
45
20
45
50
20
50
20
ns
ChipSelectPulseWidthHigh
DurationofByteProgrammingOperation(1)
SectorEraseTime(2)
Read Recovery Time
ChipProgrammingTime
ChipEraseTime(3)
tEHEL
20
ns
tWHWH1
tWHWH2
tGHEL
300
15
300
15
0
300
15
300
15
300
15
µs
sec
ns
0
0
0
0
11
64
11
64
11
64
11
64
11
64
sec
sec
NOTES:
1ꢀ Typical value for tWHWH1 is 7µsꢀ
2ꢀ Typical value for tWHWH2 is 1secꢀ
3ꢀ Typical value for Chip Erase Time is 8secꢀ
AC TEST CONDITIONS
Typ
FIGꢀ 4 AC TEST CIRCUIT
Parameter
Unit
InputPulseLevels
VIL = 0, VIH = 3.0
V
ns
V
InputRiseandFall
5
InputandOutputReferenceLevel
1.5
1.5
OutputTimingReferenceLevel
V
Notes:
VZ is programmable from -2V to +7Vꢀ
IOL & IOH programmable from 0 to 16mAꢀ
Tester Impedance Z0 = 75Wꢀ
VZ is typically the midpoint of VOH and VOLꢀ
IOL & IOH are adjusted to simulate a typical resistive load circuitꢀ
ATE tester includes jig capacitanceꢀ
White Electronic Designs Corporation (602) 437-1520 wwwꢀwhiteedcꢀcom
4
WF512K32-XXX5
White Electronic Designs
AC CHARACTERISTICS WRITE/ERASE/PROGRAM OPERATIONS, WE CONTROLLED
(VCC = 5ꢀ0V, TA = -55°C TO +125°C)
Parameter
Symbol
-60
-70
Max
-90
-120
Max Min Max
-150
Min Max
Unit
Min
Max
Min
Min
WF512K32-XXX5
Write Cycle Time
tAVAV
tWC
tCS
60
0
70
0
90
0
120
0
150
0
ns
ns
ChipSelectSetupTime
WriteEnablePulseWidth
AddressSetupTime
tELWL
tWLWH
tAVWH
tDVWH
tWHDX
tWP
tAS
tDS
40
0
45
0
45
0
50
0
50
0
ns
ns
DataSetupTime
40
0
45
0
45
0
50
0
50
0
ns
Data Hold Time
tDH
tAH
tWPH
ns
AddressHoldTime
t
WHAX
40
20
45
20
45
20
50
20
50
20
ns
WriteEnablePulseWidthHigh
DurationofByteProgrammingOperation(1)
SectorEraseTime(2)
tWHWL
ns
tWHWH1
tWHWH2
tGHWL
300
15
300
15
300
15
300
15
300
15
µs
sec
ns
Read Recovery Time before Write
VCC Set-upTime
0
0
0
0
0
tVCS
50
50
50
50
50
µs
sec
ns
ChipProgrammingTime
OutputEnableSetupTime
11
64
11
64
11
64
11
64
11
64
tOES
tOEH
0
0
0
0
0
OutputEnableHoldTime(4)
ChipEraseTime(3)
10
10
10
10
10
ns
sec
NOTES:
1ꢀ Typical value for tWHWH1 is 7µsꢀ
2ꢀ Typical value for tWHWH2 is 1secꢀ
3ꢀ Typical value for Chip Erase Time is 8secꢀ
4ꢀ For Toggle and Data Pollingꢀ
AC CHARACTERISTICS READ ONLY OPERATIONS
(VCC = 5ꢀ0V, TA = -55°C TO +125°C)
Parameter
Symbol
-60
Max
-70
-90
-120
-150
Unit
Min
Min
Max
Min
Max Min
Max
Min Max
Read Cycle Time
tAVAV
tRC
60
70
90
120
150
150
150
55
ns
ns
ns
ns
ns
ns
ns
AddressAccessTime
tAVQV
tELQV
tACC
tCE
60
60
30
20
20
70
70
35
20
20
90
90
35
20
20
0
120
120
50
Chip Select Access Time
OutputEnabletoOutputValid
ChipSelecttoOutputHighZ(1)
OutputEnableHightoOutputHighZ(1)
tGLQV
tEHQZ
tGHQZ
tAXQX
tOE
tDF
30
35
tDF
30
35
OutputHoldfromAddress,CSorOEChange,
whicheverisFirst
tOH
0
0
0
0
1ꢀ Guaranteed by design, but not tested
5
White Electronic Designs Corporation (602) 437-1520 wwwꢀwhiteedcꢀcom
WF512K32-XXX5
White Electronic Designs
FIGꢀ 5 AC WAVEFORMS FOR READ OPERATIONS
White Electronic Designs Corporation (602) 437-1520 wwwꢀwhiteedcꢀcom
6
WF512K32-XXX5
White Electronic Designs
FIGꢀ 6 WRITE/ERASE/PROGRAM OPERATION, WE CONTROLLED
NOTES:
1ꢀ PA is the address of the memory location to be programmedꢀ
2ꢀ PD is the data to be programmed at byte addressꢀ
3ꢀ D7 is the output of the complement of the data written to the device (for each chip)ꢀ
4ꢀ DOUT is the output of the data written to the deviceꢀ
5ꢀ Figure indicates last two bus cycles of four bus cycle sequenceꢀ
7
White Electronic Designs Corporation (602) 437-1520 wwwꢀwhiteedcꢀcom
WF512K32-XXX5
White Electronic Designs
FIGꢀ 7 AC WAVEFORMS CHIP/SECTOR ERASE OPERATIONS
NOTE:
1ꢀ SA is the sector address for Sector Eraseꢀ
White Electronic Designs Corporation (602) 437-1520 wwwꢀwhiteedcꢀcom
8
WF512K32-XXX5
White Electronic Designs
FIGꢀ 8 AC WAVEFORMS FOR DATA POLLING DURING EMBEDDED ALGORITHM OPERATIONS
9
White Electronic Designs Corporation (602) 437-1520 wwwꢀwhiteedcꢀcom
WF512K32-XXX5
White Electronic Designs
FIGꢀ 9 ALTERNATE CS CONTROLLED PROGRAMMING OPERATION TIMINGS
Notes:
1ꢀ PA represents the address of the memory location to be programmedꢀ
2ꢀ PD represents the data to be programmed at byte addressꢀ
3ꢀ D7 is the output of the complement of the data written to the device (for each chip)ꢀ
4ꢀ DOUT is the output of the data written to the deviceꢀ
5ꢀ Figure indicates the last two bus cycles of a four bus cycle sequenceꢀ
White Electronic Designs Corporation (602) 437-1520 wwwꢀwhiteedcꢀcom
10
WF512K32-XXX5
White Electronic Designs
PACKAGE 400: 66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H1)
ALL LINEAR DIMENSIONSARE MILLIMETERS AND PARENTHETICALLY IN INCHES
11
White Electronic Designs Corporation (602) 437-1520 wwwꢀwhiteedcꢀcom
WF512K32-XXX5
White Electronic Designs
PACKAGE 510: 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2U)
o
o
The White 68 lead G2U CQFP
fills the same fit and function
as the JEDEC 68 lead CQFJ or
68 PLCC. But the G2U has the
TCE and lead inspection
advantage of the CQFP form.
0.940"
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
PACKAGE 519: 68 LEAD, CERAMIC QUAD FLAT PACK, LOW PROFILE CQFP (G1U)1
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
Note 1: Package Not Recommended for New Design
White Electronic Designs Corporation (602) 437-1520 wwwꢀwhiteedcꢀcom
12
WF512K32-XXX5
White Electronic Designs
PACKAGE 524: 68 LEAD, CERAMIC QUAD FLAT PACK, LOW PROFILE CQFP (G1T)
25.27 (0.995) ± ±0.13 (0.005) SQ
4.06 (0.160) MAX
23.88 (0.940) ± ±0.25 (0.010) SQ
0.25 (0.010) MAX
0.83 (0.033)
± ±0.32 (0.013)
00/80
0.84 (0.033) REF
DETAIL A
SEE DETAIL "A"
1.27 (0.050)
0.38 (0.015) ± ±0.05 (0.002)
20.3 (0.800) REF
ALL LINEAR DIMENSIONSARE MILLIMETERS AND PARENTHETICALLY IN INCHES
PACKAGE 528: 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2L)
25.15 (0.990) – 0.25 (0.010) MAX
5.10 (0.200) MAX
22.36 (0.880) – 0.25 (0.010) MAX
0.25 (0.010) – 0.10 (0.002)
0.23 (0.009) REF
24.0 (0.946)
– 0.25 (0.010)
R 0.127
(0.005)
1.37 (0.054) MIN
0.004
2
O / 9O
0.89 (0.035)
– 1.14 (0.045)
1.27 (0.050) TYP
0.38 (0.015) – 0.05 (0.002)
20.31 (0.800) REF
0.940" TYP
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
13
White Electronic Designs Corporation (602) 437-1520 wwwꢀwhiteedcꢀcom
WF512K32-XXX5
White Electronic Designs
PACKAGE 501: 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G4)1
5.1 (0.200) MAX
39.6 (1.56) 0.38 (0.015) SQ
1.27 (0.050)
0.1 (0.005)
PIN 1 IDENTIFIER
Pin 1
12.7 (0.500)
0.5 (0.020)
4 PLACES
5.1 (0.200)
0.25 (0.010)
4 PLACES
0.25 (0.010)
0.05 (0.002)
1.27 (0.050)
TYP
0.38 (0.015)
0.08 (0.003)
68 PLACES
38 (1.50) TYP
4 PLACES
ALL LINEAR DIMENSIONSARE MILLIMETERS AND PARENTHETICALLY IN INCHES
Note 1: Package Not Recommended for New Design
PACKAGE 502: 68 LEAD, CERAMIC QUAD FLAT PACK, LOW PROFILE CQFP (G4T)1
5.1 (0.200) MAX
39.6 (1.56) 0.38 (0.015) SQ
1.27 (0.050)
0.1 (0.005)
PIN 1 IDENTIFIER
Pin 1
12.7 (0.500)
0.5 (0.020)
4 PLACES
5.1 (0.200)
0.25 (0.010)
4 PLACES
0.25 (0.010)
0.05 (0.002)
1.27 (0.050)
TYP
0.38 (0.015)
0.08 (0.003)
68 PLACES
38 (1.50) TYP
4 PLACES
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
Note 1: Package Not Recommended for New Design
White Electronic Designs Corporation (602) 437-1520 wwwꢀwhiteedcꢀcom
14
WF512K32-XXX5
White Electronic Designs
ORDERING INFORMATION
W F 512K32 X - XXX X X 5 X
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
VPP PROGRAMMINGVOLTAGE
5 = 5 V
DEVICE GRADE:
Q = MIL-STD-883 Compliant
M = Military Screened
I = Industrial
C = Commercial
-55°C to +125°C
-40°C to +85°C
0°C to +70°C
PACKAGETYPE:
H1 = 1ꢀ075" sqꢀ Ceramic Hex In Line Package, HIP (Package 400*)
G2U = 22ꢀ4mm Ceramic Quad Flat Pack, Low Profile CQFP (Package 510)
G2L = 22ꢀ4mm Ceramic Quad Flat Pack, CQFP (Package 528)
G1T = 23ꢀ9mm Low Profile CQFP (Package 524)
G1U1 = 23ꢀ9mm Ceramic Quad Flat Pack, Low Profile CQFP (Package 519)
G41 = 40 Low Profile CQFP (Package 501)
G4T1 = 40mm Low Profile CQFP (Package 502)
ACCESS TIME (ns)
IMPROVEMENTMARK
N = No Connect at pins 21 and 39 in HIP for Upgrade
ORGANIZATION, 512K x 32
User configurable as 1M x 16 or 2M x 8
FLASH
WHITE ELECTRONIC DESIGNS CORPꢀ
Note 1: Package Not Recommended for New Design
*
Call factory for PGA type (HIP) package options
15
White Electronic Designs Corporation (602) 437-1520 wwwꢀwhiteedcꢀcom
WF512K32-XXX5
White Electronic Designs
DEVICE TYPE
SPEED
PACKAGE
SMD NOꢀ
512K x 32 Flash Module
512K x 32 Flash Module
512K x 32 Flash Module
512K x 32 Flash Module
150ns
120ns
90ns
66 pin HIP (H1) 1ꢀ075" sqꢀ
66 pin HIP (H1) 1ꢀ075" sqꢀ
66 pin HIP (H1) 1ꢀ075" sqꢀ
66 pin HIP (H1) 1ꢀ075" sqꢀ
5962-94612 01H4X
5962-94612 02H4X
5962-94612 03H4X
5962-94612 04H4X
70ns
512K x 32 Flash Module
512K x 32 Flash Module
512K x 32 Flash Module
512K x 32 Flash Module
150ns
120ns
90ns
68 lead CQFP Low Profile (G4T)1
68 lead CQFP Low Profile (G4T)1
68 lead CQFP Low Profile (G4T)1
68 lead CQFP Low Profile (G4T)1
5962-94612 01HTX1
5962-94612 02HTX1
5962-94612 03HTX1
5962-94612 04HTX1
70ns
512K x 32 Flash Module
512K x 32 Flash Module
512K x 32 Flash Module
512K x 32 Flash Module
150ns
120ns
90ns
68 lead Low Capacitance
CQFP(G4)1
5962-94612 01HNX1
5962-94612 02HNX1
5962-94612 03HNX1
5962-94612 04HNX1
68 lead Low Capacitance
CQFP(G4)1
68 lead Low Capacitance
CQFP(G4)1
70ns
68 lead Low Capacitance
CQFP(G4)1
512K x 32 Flash Module
512K x 32 Flash Module
512K x 32 Flash Module
512K x 32 Flash Module
150ns
120ns
90ns
68 lead CQFP/J (G2U)
68 lead CQFP/J (G2U)
68 lead CQFP/J (G2U)
68 lead CQFP/J (G2U)
5962-94612 01HZX
5962-94612 02HZX
5962-94612 03HZX
5962-94612 04HZX
70ns
512K x 32 Flash Module
512K x 32 Flash Module
512K x 32 Flash Module
512K x 32 Flash Module
150ns
120ns
90ns
68 lead CQFP (G1U)1
68 lead CQFP (G1U)1
68 lead CQFP (G1U)1
68 lead CQFP (G1U)1
5962-94612 01H9X1
5962-94612 02H9X1
5962-94612 03H9X1
5962-94612 04H9X1
70ns
512K x 32 Flash Module
512K x 32 Flash Module
512K x 32 Flash Module
512K x 32 Flash Module
150ns
120ns
90ns
68 lead CQFP (G2L)
68 lead CQFP (G2L)
68 lead CQFP (G2L)
68 lead CQFP (G2L)
5962-94612 01HAX
5962-94612 02HAX
5962-94612 03HAX
5962-94612 04HAX
70ns
White Electronic Designs Corporation (602) 437-1520 wwwꢀwhiteedcꢀcom
16
相关型号：
©2020 ICPDF网 联系我们和版权申明