WMF128K8-90FEM5A [WEDC]
128Kx8 MONOLITHIC FLASH, SMD 5962-96690; 128Kx8单片闪存， SMD 5962-96690
| 型号： | WMF128K8-90FEM5A |
| 厂家： | 
WHITE ELECTRONIC DESIGNS CORPORATION |
| 描述： | 128Kx8 MONOLITHIC FLASH, SMD 5962-96690 |
| 文件： | 总14页 (文件大小：458K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
WMF128K8-XXX5
White Electronic Designs
128Kx8 MONOLITHIC FLASH, SMD 5962-96690
FEATURES
ꢀ
ꢀ
Organized as 128Kx8
ꢀ
Access Times of 50*, 60, 70, 90, 120, 150ns
Packaging
Commercial, Industrial and Military Temperature
Ranges
ꢀ
• 32 lead, Hermetic Ceramic, 0.400" SOJ (Package
101)
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
5 Volt Programming. 5V 10ꢀ Supply.
Low Power CMOS
• 32 pin, Hermetic Ceramic, 0.600" DIP (Package
300)
Embedded Erase and Program Algorithms
TTL Compatible Inputs and CMOS Outputs
• 32 lead, Flatpack (Package 220)
• 32 lead, Formed Flatpack (Package 221)
Page Program Operation and Internal Program
Control Time.
• 32 pin, Rectangular Ceramic Leadless Chip
Carrier (Package 601)
This product is subject to change without notice.
ꢀ
ꢀ
100,000 Erase/Program Cycles Minimum
Sector Erase Architecture
Note: For programming information refer to Flash Programming 1M5 Application Note.
• 8 equal size sectors of 16KBytes each
* The access time of 50ns is available in Industrial and Commercial temperature ranges
only.
• Any combination of sectors can be concurrently
erased. Also supports full chip erase
Pin Configuration For WMF128K8-XXX5
Pin Configuration For WMF128K8-XCLX5
32 DIP
32 CSOJ
32 Flatpack
32 CLCC
Top View
Top View
NC
A16
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
I/O1
I/O2
1
32
VCC
2
3
4
5
31 WE#
30 NC
29 A14
28 A13
27 A8
4 3 2 1 32 31 30
5
6
7
8
29
28
27
26
25
24
23
22
21
A7
A6
A5
A4
A3
A2
A1
A0
A14
A13
A8
6
7
26 A9
8
9
25 A11
24 OE#
23 A10
22 CS#
21 I/O7
20 I/O6
19 I/O5
18 I/O4
17 I/O3
A9
9
A11
OE#
A10
CS#
I/O7
10
11
12
13
14
15
16
10
11
12
13
I/O0
14 15 16 17 18 19 20
V
SS
Pin Description
A0-16
Address Inputs
Data Input/Output
Chip Select
Output Enable
Write Enable
+5.0V Power
Ground
I/O0-7
CS#
OE#
WE#
VCC
VSS
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
April 2001
Rev. 5
1
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WMF128K8-XXX5
White Electronic Designs
ABSOLUTE MAXIMUM RATINGS (1)
RECOMMENDED OPERATING CONDITIONS
Parameter
Operating Temperature
Supply Voltage (VCC
Signal Voltage Range (any pin except A9) (2)
Storage Temperature Range
Lead Temperature (soldering, 10 seconds)
Data Retention Mil Temp
Endurance (write/erase cycles) (Mil Temp)
A9 Voltage for sector protect (VID) (3)
NOTES:
1. Stresses above the absolute maximum rating may cause permanent damage to the
device. Extended operation at the maximum levels may degrade performance and
affect reliability.
2. Minimum DC voltage on input or I/O pins is -0.5V. During voltage transitions, inputs
may overshoot VSS to -2.0 V for periods of up to 20ns. Maximum DC voltage on
output and I/O pins is VCC + 0.5V. During voltage transitions, outputs may overshoot
to Vcc + 2.0 V for periods of up to 20ns.
3. Minimum DC input voltage on A9 pin is -0.5V. During voltage transitions, A9 may
overshoot Vss to -2V for periods of up to 20ns. Maximum DC input voltage on A9 is
+13.5V which may overshoot to 14.0 V for periods up to 20ns.
Unit
°C
V
V
°C
Parameter
Supply Voltage
Symbol
VCC
VIH
VIL
TA
Min
4.5
2.0
-0.5
-55
-40
11.5
Max
5.5
VCC + 0.5
+0.8
+125
+85
12.5
Unit
V
V
-55 to +125
-2.0 to +7.0
-2.0 to +7.0
-65 to +150
+300
)
Input High Voltage
Input Low Voltage
Operating Temp. (Mil.)
Operating Temp. (Ind.)
A9 Voltage for Sector Protect
V
°C
°C
V
°C
TA
VID
10
years
cycles
V
10,000 min
-2.0 to +14.0
CAPACITANCE
TA = +25°C
Parameter
Symbol
CAD
COE
CWE
CCS
CI/O
Conditions
Max Unit
Address Input capacitance
Output Enable capacitance
Write Enable capacitance
Chip Select capacitance
Data I/O capacitance
VI/O = 0 V, f = 1.0 MHz 15 pF
VIN = 0 V, f = 1.0 MHz 15 pF
VIN = 0 V, f = 1.0 MHz 15 pF
VIN = 0 V, f = 1.0 MHz 15 pF
VI/O = 0 V, f = 1.0 MHz 15 pF
This parameter is guaranteed by design but not tested.
DC CHARACTERISTICS — CMOS COMPATIBLE
VCC = 5.0V, VSS = 0V, -55°C ≤ TA ≤ +125°C
Parameter
Symbol
ILI
ILO
ICC1
ICC2
ICC3
VOL
VOH1
VOH2
VLKO
Conditions
Min
Max
10
10
35
50
Unit
µA
µA
mA
mA
mA
V
V
V
V
Input Leakage Current
Output Leakage Current
VCC Active Current for Read (1)
VCC Active Current for Program or Erase (2)
VCC Standby Current
Output Low Voltage
Output High Voltage
Output High Voltage
Low VCC Lock-Out Voltage
VCC = 5.5, VIN = GND to VCC
VCC = 5.5, VIN = GND to VCC
CS# = VIL, OE# = VIH
CS# = VIL, OE# = VIH
VCC = 5.5, CS# = VIH, f = 5MHz
IOL = 8.0 mA, VCC = 4.5
IOH = -2.5 mA, VCC = 4.5
IOH = -100 µA, VCC = 4.5
1.6
0.45
0.85 x VCC
VCC - 0.4
3.2
NOTES:
1. The ICC current listed includes both the DC operating current and the frequency dependent component (at 5 MHz).
The frequency component typically is less than 2 mA/MHz, with OE# at VIH
.
2.
ICC active while Embedded Algorithm (program or erase) is in progress.
3. DC test conditions: VIL = 0.3V, VIH = VCC - 0.3V
AC TEST CONDITIONS
AC TEST CIRCUIT
IOL
Parameter
Typ
Unit
Current Source
Input Pulse Levels
Input Rise and Fall
VIL = 0, VIH = 3.0
V
ns
V
5
Input and Output Reference Level
Output Timing Reference Level
1.5
1.5
D.U.T.
VZ 1.5V
(Bipolar Supply)
V
Ceff = 50 pf
Notes:
VZ is programmable from -2V to +7V.
IOL & IOH programmable from 0 to 16mA.
Tester Impedance Z0 = 75 Ω.
VZ is typically the midpoint of VOH and VOL.
IOH
IOL & IOH are adjusted to simulate a typical resistive load circuit.
ATE tester includes jig capacitance.
Current Source
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
April 2001
Rev. 5
2
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WMF128K8-XXX5
White Electronic Designs
AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS, WE# CONTROLLED
VCC = 5.0V, VSS = 0V, -55°C ≤ TA ≤ +125°C
-50
-60
-70
-90
-120
-150
Parameter
Symbol
Unit
Min Max Min Max Min Max Min Max Min Max Min Max
Write Cycle Time
tAVAV tWC
tELWL tCS
tWLWH tWP
tAVWH tAS
tDVWH tDS
tWHDX tDH
tWHAX tAH
tWHEH tCH
tWHWL tWPH
50
0
25
0
25
0
40
0
20
14
2.2
0
60
0
30
0
30
0
45
0
20
14
2.2
0
70
0
35
0
30
0
45
0
20
14
2.2
0
90
0
45
0
45
0
45
0
20
14
2.2
0
120
0
50
0
50
0
50
0
20
14
2.2
0
150
0
50
0
50
0
50
0
20
14
2.2
0
ns
ns
ns
ns
ns
ns
ns
ns
Chip Select Setup Time
Write Enable Pulse Width
Address Setup Time
Data Setup Time
Data Hold Time
Address Hold Time
Chip Select Hold Time
Write Enable Pulse Width High
Duration of Byte Programming Operation (min) tWHWH1
Sector Erase Time
Read Recovery Time before Write
ns
µs
tWHWH2
tGHWL
60
60
60
60
60
60 sec
ms
VCC Set-up Time
tVCS
50
50
50
50
50
50
µs
Chip Programming Time
Output Enable Setup Time
Output Enable Hold Time (1)
12.5
12.5
12.5
12.5
12.5
12.5 sec
ns
tOES
tOEH
0
10
0
10
0
10
0
10
0
10
0
10
ns
NOTES:
1. For Toggle and Data# Polling.
AC CHARACTERISTICS – READ ONLY OPERATIONS
VCC = 5.0V, VSS = 0V, -55°C ≤ TA ≤ +125°C
-50
-60
-70
-90
-120
-150
Unit
Parameter
Symbol
Min Max Min Max Min Max Min Max Min Max Min Max
Read Cycle Time
Address Access Time
Chip Select Access Time
OE# to Output Valid
Chip Select to Output High Z (1)
OE# High to Output High Z (1)
tAVAV tRC
tAVQV tACC
tELQV tCE
tGLQV tOE
tEHQZ tDF
tGHQZ tDF
tAXQX tOH
50
60
70
90
120
150
ns
150 ns
150 ns
55 ns
35 ns
35 ns
ns
50
50
25
20
20
60
60
30
20
20
70
70
35
20
20
90
90
40
25
25
120
120
50
30
30
Output Hold from Address, CS# or OE#
Change, whichever is First
0
0
0
0
0
0
NOTES:
1. Guaranteed by design, but not tested
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
April 2001
Rev. 5
3
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WMF128K8-XXX5
White Electronic Designs
AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS,CS# CONTROLLED
VCC = 5.0V, VSS = 0V, -55°C ≤ TA ≤ +125°C
-50
-60
-70
-90
-120
-150
Parameter
Symbol
Unit
Min Max Min Max Min Max Min Max Min Max Min Max
Write Cycle Time
50
0
60
0
70
0
90
0
120
0
150
0
ns
ns
tAVAV tWC
tWLEL tWS
tELEH tCP
tAVEL tAS
tDVEH tDS
tEHDX tDH
tELAX tAH
tEHWH tWH
tEHEL tCPH
tWHWH1
WE# Setup Time
CS# Pulse Width
25
0
30
0
35
0
45
0
50
0
50
0
ns
Address Setup Time
Data Setup Time
ns
25
0
30
0
30
0
45
0
50
0
50
0
ns
Data Hold Time
ns
Address Hold Time
40
0
45
0
45
0
45
0
50
0
50
0
ns
WE# Hold from WE# High
CS# Pulse Width High
Duration of Programming Operation
Duration of Erase Operation
Read Recovery before Write
Chip Programming Time
ns
20
14
2.2
0
20
14
2.2
0
20
14
2.2
0
20
14
2.2
0
20
14
2.2
0
20
14
2.2
0
ns
µs
sec
ns
60
60
60
60
60
60
tWHWH2
tGHEL
12.5
12.5
12.5
12.5
12.5
12.5
sec
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
April 2001
Rev. 5
4
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WMF128K8-XXX5
White Electronic Designs
AC WAVEFORMS FOR READ OPERATIONS
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
April 2001
Rev. 5
5
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WMF128K8-XXX5
White Electronic Designs
WRITE/ERASE/PROGRAM OPERATION, WE# CONTROLLED
NOTES:
1. PA is the address of the memory location to be programmed.
2. PD is the data to be programmed at byte address.
3. D7# is the output of the complement of the data written to each chip.
4.
DOUT is the output of the data written to the device.
5. Figure indicates last two bus cycles of four bus cycle sequence.
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
April 2001
Rev. 5
6
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WMF128K8-XXX5
White Electronic Designs
AC WAVEFORMS CHIP/SECTOR ERASE OPERATIONS
NOTE:
1. SA is the sector address for Sector Erase.
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
April 2001
Rev. 5
7
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WMF128K8-XXX5
White Electronic Designs
AC WAVEFORMS FOR DATA# POLLING DURING EMBEDDED ALGORITHM OPERATIONS
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
April 2001
Rev. 5
8
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WMF128K8-XXX5
White Electronic Designs
ALTERNATE CS# CONTROLLED PROGRAMMING OPERATION TIMINGS
NOTES:
1. PA represents the address of the memory location to be programmed.
2. PD represents the data to be programmed at byte address.
3. D7# is the output of the complement of the data written to each chip.
4. DOUT is the output of the data written to the device.
5. Figure indicates the last two bus cycles of a four bus cycle sequence.
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
April 2001
Rev. 5
9
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WMF128K8-XXX5
White Electronic Designs
PACKAGE 101: 32 LEAD, CERAMIC SOJ
21.1 (0.830) 0.25 (0.010)
3.96 (0.156) MAX
0.89 (0.035)
Radius TYP
0.2 (0.008)
0.05 (0.002)
11.3 (0.442)
0.30 (0.012)
9.55 (0.376) 0.25 (0.010)
1.27 (0.050) 0.25 (0.010)
PIN 1 IDENTIFIER
1.27 (0.050) TYP
19.1 (0.750) TYP
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
PACKAGE 220: 32 LEAD, CERAMIC FLATPACK
20.83 (0.820)
0.25 (0.010)
PIN 1
2.60 (0.102) MAX
IDENTIFIER
10.41 (0.410)
0.13 (0.005)
10.16 (0.400)
0.51 (0.020)
0.43 (0.017)
0.05 (0.002)
1.27 (0.050) TYP
19.05 (0.750) TYP
0.127 (0.005)
+ 0.05 (0.002)
– 0.025 (0.001)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
April 2001
Rev. 5
10
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WMF128K8-XXX5
White Electronic Designs
PACKAGE 221: 32 LEAD, FORMED CERAMIC FLATPACK
3.35 (0.132)
MAX
20.83 (0.820)
0.25 (0.010)
0.15 (0.006)
TYP
1.27 (0.050) TYP
10.41 (0.410)
0.13 (0.005)
13.47 (0.530)
0.13 (0.005)
+
+
0.43 (0.017)
1.27 (0.050) TYP
19.05 (0.750) TYP
0.63 (0.025) TYP
0°/ -4°
0.05 (0.002)
1.52 (0.060) TYP
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
PACKAGE 300: 32 PIN, CERAMIC DIP, SINGLE CAVITY SIDE BRAZED
42.4 (1.670) 0.4 (0.016)
15.04 (0.592)
0.3 (0.012)
4.34 (0.171) 0.79 (0.031)
3.2 (0.125) MIN
PIN 1 IDENTIFIER
0.25 (0.010)
0.05 (0.002)
0.84 (0.033)
0.4 (0.014)
15.25 (0.600)
0.25 (0.010)
2.5 (0.100)
TYP
1.27 (0.050)
0.1 (0.005)
0.46 (0.018)
0.05 (0.002)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
April 2001
Rev. 5
11
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WMF128K8-XXX5
White Electronic Designs
PACKAGE 601: 32 PIN, RECTANGULAR CERAMIC LEADLESS CHIP CARRIER
7.62 (0.300) TYP
3.81
(0.150) TYP
5.08
(0.200)
TYP
0.56 (0.022)
0.71 (0.028)
10.16
(0.400)
TYP
PIN 1
0.38 (0.015) x 45°
PIN 1 IDENTIFIER
11.25 (0.443)
11.60 (0.457)
1.63 (0.064)
2.54 (0.100)
13.79 (0.543)
14.15 (0.557)
1.02 (0.040) x 45°
3 PLACES
32PinCLCCpkgdim.eps
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
April 2001
Rev. 5
12
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WMF128K8-XXX5
White Electronic Designs
ORDERING INFORMATION
W M F 128K8 - XXX X X 5 X
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
VPP PROGRAMMING VOLTAGE
5 = 5V
DEVICE GRADE:
Q = MIL-STD-883 Compliant
M = Military Screened
= Industrial
-55°C to +125°C
I
-40°C to +85°C
0°C to +70°C
C = Commercial
PACKAGE TYPE:
DE = 32 Lead Ceramic SOJ (Package 101)
C = 32 Pin Ceramic DIP (Package 300)
FE = 32 Lead Ceramic Flatpack (Package 220)
FF = 32 Lead Formed Ceramic Flatpack (Package 221)
CL = 32 Pin rectangular Ceramic Leadless Chip Carrier (Package 601)
ACCESS TIME (ns)
ORGANIZATION, 128K x 8
Flash
MONOLITHIC
WHITE ELECTRONIC DESIGNS CORP.
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
April 2001
Rev. 5
13
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WMF128K8-XXX5
White Electronic Designs
DEVICE TYPE
SECTOR SIZE
SPEED
150ns
120ns
90ns
PACKAGE
SMD NO.
128K x 8 Flash Monolithic
128K x 8 Flash Monolithic
128K x 8 Flash Monolithic
128K x 8 Flash Monolithic
128K x 8 Flash Monolithic
16KByte
16KByte
16KByte
16KByte
16KByte
32 pin DIP (C)
32 pin DIP (C)
32 pin DIP (C)
32 pin DIP (C)
32 pin DIP (C)
5962-96690 01HYX
5962-96690 02HYX
5962-96690 03HYX
5962-96690 04HYX
5962-96690 05HYX
70ns
60ns
128K x 8 Flash Monolithic
128K x 8 Flash Monolithic
128K x 8 Flash Monolithic
128K x 8 Flash Monolithic
128K x 8 Flash Monolithic
16KByte
16KByte
16KByte
16KByte
16KByte
150ns
120ns
90ns
32 lead SOJ (DE)
32 lead SOJ (DE)
32 lead SOJ (DE)
32 lead SOJ (DE)
32 lead SOJ (DE)
5962-96690 01HXX
5962-96690 02HXX
5962-96690 03HXX
5962-96690 04HXX
5962-96690 05HXX
70ns
60ns
128K x 8 Flash Monolithic
128K x 8 Flash Monolithic
128K x 8 Flash Monolithic
128K x 8 Flash Monolithic
128K x 8 Flash Monolithic
16KByte
16KByte
16KByte
16KByte
16KByte
150ns
120ns
90ns
32 lead Flatpack (FE)
32 lead Flatpack (FE)
32 lead Flatpack (FE)
32 lead Flatpack (FE)
32 lead Flatpack (FE)
5962-96690 01HTX
5962-96690 02HTX
5962-96690 03HTX
5962-96690 04HTX
5962-96690 05HTX
70ns
60ns
128K x 8 Flash Monolithic
128K x 8 Flash Monolithic
128K x 8 Flash Monolithic
128K x 8 Flash Monolithic
128K x 8 Flash Monolithic
16KByte
16KByte
16KByte
16KByte
16KByte
150ns
120ns
90ns
32 lead Formed Flatpack (FF)
32 lead Formed Flatpack (FF)
32 lead Formed Flatpack (FF)
32 lead Formed Flatpack (FF)
32 lead Formed Flatpack (FF)
5962-96690 01HUX
5962-96690 02HUX
5962-96690 03HUX
5962-96690 04HUX
5962-96690 05HUX
70ns
60ns
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
April 2001
Rev. 5
14
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
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