WS128K32-100H1CA [WEDC]

SRAM Module, 128KX32, 100ns, CMOS, CPGA66, 1.075 X 1.075 MM, CERAMIC, PGA-66;
WS128K32-100H1CA
型号: WS128K32-100H1CA
厂家: WHITE ELECTRONIC DESIGNS CORPORATION    WHITE ELECTRONIC DESIGNS CORPORATION
描述:

SRAM Module, 128KX32, 100ns, CMOS, CPGA66, 1.075 X 1.075 MM, CERAMIC, PGA-66

静态存储器
文件: 总9页 (文件大小:379K)
中文:  中文翻译
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WS128K32-XXX  
White Electronic Designs  
128Kx32 SRAM MODULE, SMD 5962-93187  
FEATURES  
Access Times of 70, 85, 100, 120ns  
MIL-STD-883 Compliant Devices Available  
Packaging  
5 Volt Power Supply  
Low Power CMOS  
TTL Compatible Inputs and Outputs  
Built in Decoupling Caps and Multiple Ground Pins  
for Low Noise Operation  
• 66-pin, PGA Type, 1.075 inch square, Hermetic  
Ceramic HIP (Package 400).  
• 68 lead, 40mm Low Profile CQFP, 3.56mm  
(0.140")(Package 502).  
Weight  
WS128K32-XG2UX - 8 grams typical  
WS128K32-XH1X - 13 grams typical  
WS128K32-XG4TX - 20 grams typical  
Upgradeable to 512Kx32  
• 68 lead, Hermetic CQFP (G2U), 22.4mm  
(0.880 inch) square, 4.57mm (0.140 inch) high,  
(Package 510)  
Organized as 128Kx32; User Configurable as  
256Kx16 or 512Kx8  
Commercial, Industrial and Military Temperature  
Ranges  
FIGURE 1 – PIN CONFIGURATION FOR WS128K32N-XH1X  
Top View  
Pin Description  
1
12  
23  
34  
45  
56  
I/O0-31  
A0-16  
Data Inputs/Outputs  
Address Inputs  
Write Enables  
Chip Selects  
Output Enable  
Power Supply  
Ground  
I/O  
I/O  
8
9
WE  
2
#
I/O15  
I/O24  
I/O25  
I/O26  
V
CC  
I/O31  
I/O30  
I/O29  
I/O28  
WE1-4  
#
CS2  
#
I/O14  
I/O13  
I/O12  
OE#  
NC  
CS  
4
#
#
CS1-4  
OE#  
VCC  
#
I/O10  
GND  
I/O11  
WE  
4
A14  
A16  
A11  
A0  
A7  
I/O27  
GND  
NC  
Not Connected  
A
A
A
V
10  
A12  
A4  
A5  
A6  
A1  
A2  
A3  
9
NC  
Block Diagram  
15  
CC  
WE1  
#
A13  
WE  
1
#
CS  
1
#
WE  
2
#
CS  
2
#
WE  
3
#
CS  
3
#
4 4  
WE # CS #  
OE#  
A0-16  
NC  
I/O  
I/O  
I/O  
I/O  
7
A8  
WE  
3
3
#
#
I/O23  
I/O22  
I/O21  
I/O20  
I/O  
I/O  
I/O  
0
CS  
NC  
I/O  
1
#
6
I/O16  
I/O17  
I/O18  
CS  
128K x 8  
128K x 8  
128K x 8  
128K x 8  
1
2
5
4
GND  
I/O19  
8
8
8
8
3
I/O0-7  
I/O8-15  
I/O16-23  
I/O24-31  
11  
22  
33  
44  
55  
66  
June 2004  
Rev. 4  
1
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com  
WS128K32-XXX  
White Electronic Designs  
FIGURE 2 – PIN CONFIGURATION FOR WS128K32-XG4TX  
Top View Pin Description  
I/O0-31  
A0-16  
Data Inputs/Outputs  
Address Inputs  
Write Enables  
Chip Selects  
Output Enable  
Power Supply  
Ground  
WE1-4  
#
9
8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61  
CS1-4  
OE#  
VCC  
#
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
0
1
2
3
4
5
6
7
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
60  
59  
58  
57  
56  
55  
54  
53  
52  
51  
50  
49  
48  
47  
46  
45  
44  
I/O16  
I/O17  
I/O18  
I/O19  
I/O20  
I/O21  
I/O22  
I/O23  
GND  
I/O24  
I/O25  
I/O26  
I/O27  
I/O28  
I/O29  
I/O30  
I/O31  
GND  
NC  
Not Connected  
GND  
Block Diagram  
I/O  
8
I/O  
9
CS  
1
#
CS  
2
#
CS  
3
#
4
CS #  
I/O10  
I/O11  
I/O12  
I/O13  
I/O14  
I/O15  
WE#  
OE#  
A
0-16  
128K X 8  
128K X 8  
128K X 8  
128K X 8  
2728 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43  
8
8
8
8
I/O0 - 7  
I/O8 - 15  
I/O16 - 23  
I/O24 - 31  
FIGURE 3 – PIN CONFIGURATION FOR WS128K32-XG2UX  
TOP VIEW  
PIN DESCRIPTION  
I/O0-31  
A0-16  
Data Inputs/Outputs  
Address Inputs  
Write Enables  
Chip Selects  
Output Enable  
Power Supply  
Ground  
9
8
7
6
5
4
3
2
1
68 67 66 65 64 63 62 61  
60 I/O16  
WE1-4  
#
I/O0 10  
I/O1 11  
I/O2 12  
I/O3 13  
I/O4 14  
I/O5 15  
I/O6 16  
I/O7 17  
GND 18  
I/O8 19  
I/O9 20  
I/O10 21  
I/O11 22  
I/O12 23  
I/O13 24  
I/O14 25  
I/O15 26  
59 I/O17  
58 I/O18  
57 I/O19  
56 I/O20  
55 I/O21  
54 I/O22  
53 I/O23  
52 GND  
51 I/O24  
50 I/O25  
49 I/O26  
48 I/O27  
47 I/O28  
46 I/O29  
45 I/O30  
44 I/O31  
CS1-4  
OE#  
VCC  
#
GND  
NC  
Not Connected  
BLOCK DIAGRAM  
WE  
1
#
CS  
1
#
WE  
2
#
CS  
2
#
WE  
3
#
CS  
3
#
4 4  
WE # CS #  
OE#  
A
0-16  
128K x 8  
128K x 8  
128K x 8  
128K x 8  
2728 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43  
8
8
8
8
I/O0-7  
I/O8-15  
I/O16-23  
I/O24-31  
June 2004  
Rev. 4  
2
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com  
WS128K32-XXX  
White Electronic Designs  
ABSOLUTE MAXIMUM RATINGS  
TRUTH TABLE  
Parameter  
Symbol  
TA  
TSTG  
VG  
TJ  
VCC  
Min  
-55  
-65  
-0.5  
Max  
+125  
+150  
VCC+0.5  
150  
Unit  
°C  
°C  
V
°C  
V
CS  
H
L
L
L
OE  
X
L
X
H
WE  
X
H
L
H
Mode  
Standby  
Read  
Write  
Out Disable  
Data I/O  
High Z  
Data Out  
Data In  
High Z  
Power  
Standby  
Active  
Active  
Active  
Operating Temperature  
Storage Temperature  
Signal Voltage Relative to GND  
Junction Temperature  
Supply Voltage  
-0.5  
7.0  
RECOMMENDED OPERATING CONDITIONS  
CAPACITANCE  
TA = +25°C  
Parameter  
Symbol  
VCC  
Min  
4.5  
Max  
5.5  
Unit  
V
Parameter  
Symbol  
COE  
CWE  
Conditions  
Max Unit  
Supply Voltage  
Input High Voltage  
Input Low Voltage  
OE# capacitance  
WE1-4# capacitance  
HIP (PGA)  
VIN = 0V, f = 1.0 MHz 50 pF  
VIH  
VIL  
2.2  
-0.5  
VCC + 0.3  
+0.8  
V
V
VIN = 0V, f = 1.0 MHz  
pF  
20  
50  
15  
CQFP G4T  
CQFP G2U  
CS1-4# capacitance  
CCS  
CI/O  
CAD  
VIN = 0V, f = 1.0 MHz 20 pF  
VI/O = 0V, f = 1.0 MHz 20 pF  
VIN = 0V, f = 1.0 MHz 50 pF  
Data# I/O capacitance  
Address input capacitance  
This parameter is guaranteed by design but not tested.  
DC CHARACTERISTICS  
VCC = 5.0V, VSS = 0V, -55°C TA +125°C  
Parameter  
Sym Conditions  
-70  
-85  
-100  
-120  
Units  
Min  
Max  
10  
10  
120  
20  
0.4  
Min  
Max  
10  
10  
120  
20  
0.4  
Min  
Max  
10  
10  
120  
20  
0.4  
Min  
Max  
10  
10  
120  
20  
0.4  
Input Leakage Current  
Output Leakage Current  
Operating Supply Current  
Standby Current  
Output Low Voltage  
Output High Voltage  
ILI  
ILO  
ICC  
ISB  
VOL  
VOH  
VCC = 5.5, VIN = GND to VCC  
µA  
µA  
mA  
mA  
V
CS# = VIH, OE# = VIH, VOUT = GND to VCC  
CS# = VIL, OE# = VIH, f = 5MHz, VCC = 5.5  
CS# = VIH, OE# = VIH, f = 5MHz, VCC = 5.5  
IOL = 2.1mA, VCC = 4.5  
IOH = -1.0mA, VCC = 4.5  
2.4  
2.4  
2.4  
2.4  
V
NOTE: DC test conditions: VIH = VCC -0.3V, VIL = 0.3V  
DATA RETENTION CHARACTERISTICS  
-55°C TA +125°C  
Parameter  
Sym Conditions  
-70  
-85  
-100  
-120  
Units  
Min  
Max  
Min  
Max  
Min  
Max  
Min  
Max  
Data Retention Supply Voltage  
Data Retention Current  
VDR  
CSVCC -0.2V  
2.0  
5.5  
2.0  
5.5  
2.0  
5.5  
2.0  
5.5  
V
ICCDR1 VCC = 3V  
4
4
4
4
mA  
June 2004  
Rev. 4  
3
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com  
WS128K32-XXX  
White Electronic Designs  
AC CHARACTERISTICS  
VCC = 5.0V, GND = 0V, -55°C TA +125°C  
Parameter  
Symbol  
-70  
-85  
-100  
-120  
Units  
Read Cycle  
Min  
Max  
Min  
Max  
Min  
Max  
Min  
Max  
Read Cycle Time  
Address Access Time  
tRC  
tAA  
70  
85  
100  
120  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
70  
85  
100  
120  
Output Hold from Address Change  
Chip Select Access Time  
Output Enable to Output Valid  
Chip Select to Output in Low Z  
Output Enable to Output in Low Z  
Chip Disable to Output in High Z  
Output Disable to Output in High Z  
tOH  
tACS  
tOE  
3
3
3
3
70  
35  
85  
45  
100  
50  
120  
60  
1
tCLZ  
3
0
3
0
3
0
3
0
1
tOLZ  
1
tCHZ  
25  
25  
25  
25  
35  
35  
35  
35  
1
tOHZ  
AC CHARACTERISTICS  
VCC = 5.0V, GND = 0V, -55°C TA +125°C  
Parameter  
Symbol  
-70  
-85  
-100  
-120  
Units  
Write Cycle  
Min  
70  
60  
60  
30  
50  
5
Max  
Min  
85  
75  
75  
35  
55  
5
Max  
Min  
100  
80  
80  
40  
70  
5
Max  
Min  
120  
100  
100  
50  
80  
5
Max  
Write Cycle Time  
tWC  
tCW  
tAW  
tDW  
tWP  
tAS  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Chip Select to End of Write  
Address Valid to End of Write  
Data Valid to End of Write  
Write Pulse Width  
Address Setup Time  
Address Hold Time  
Output Active from End of Write  
Write Enable to Output in High Z  
Data Hold Time  
tAH  
5
5
5
5
5
5
5
5
1
tOW  
1
tWHZ  
25  
25  
35  
35  
tDH  
0
0
0
0
1. This parameter is guaranteed by design but not tested.  
FIGURE. 4 – AC TEST CIRCUIT  
AC Test Conditions  
IOL  
Parameter  
Typ  
Unit  
Current Source  
Input Pulse Levels  
Input Rise and Fall  
Input and Output Reference Level  
Output Timing Reference Level  
Notes:  
V
IL = 0, VIH = 3.0  
V
ns  
V
5
1.5  
1.5  
V
VZ 1.5V  
(Bipolar Supply)  
D.U.T.  
Ceff = 50 pf  
V
Z is programmable from -2V to +7V.  
OL & IOH programmable from 0 to 16mA.  
Tester Impedance Z0 = 75 ý.  
Z is typically the midpoint of VOH and VOL  
OL & IOH are adjusted to simulate a typical resistive load circuit.  
ATE tester includes jig capacitance.  
I
V
.
IOH  
I
Current Source  
June 2004  
Rev. 4  
4
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com  
WS128K32-XXX  
White Electronic Designs  
FIGURE 5 – TIMING WAVEFORM - READ CYCLE  
CS#  
OE#  
READ CYCLE 2, (CS# = OE# = VIL, WE# = VIH  
)
READ CYCLE 2 (WE# = VIH  
)
FIGURE 6 – WRITE CYCLE - WE# CONTROLLED  
CS#  
WE#  
WRITE CYCLE 2, CS# CONTROLLED  
FIGURE 7 – WRITE CYCLE - CS# CONTROLLED  
WS32K32-XHX  
CS#  
WE#  
WRITE CYCLE 2, CS# CONTROLLED  
June 2004  
Rev. 4  
5
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com  
WS128K32-XXX  
White Electronic Designs  
PACKAGE 400: 66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H1)  
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES  
PACKAGE 502: 68 LEAD, CERAMIC QUAD FLAT PACK, LOW PROFILE CQFP (G4T)1  
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES  
June 2004  
Rev. 4  
6
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com  
WS128K32-XXX  
White Electronic Designs  
PACKAGE 510: 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2U)  
The White 68 lead G2U  
CQFP fills the same fit and  
function as the JEDEC 68  
lead CQFJ or 68 PLCC.  
But the G2U has the TCE  
and lead inspection advan-  
tage of the CQFP form.  
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES  
June 2004  
Rev. 4  
7
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com  
WS128K32-XXX  
White Electronic Designs  
ORDERING INFORMATION  
W S 128K 32 X - XXX X X X  
LEAD FINISH:  
Blank = Gold plated leads  
A = Solder dip leads  
DEVICE GRADE:  
Q = MIL-STD-883 Compliant  
M = Military Screened -55°C to +125°C  
I = Industrial -40°C to +85°C  
C = Commercial 0°C to +70°C  
PACKAGE TYPE:  
H1 = 1.075" sq. Ceramic Hex-In-line Package, HIP (Package 400)  
G2U = 22.4mm Ceramic Quad Flat Pack, Low Profile CQFP (Package 510)  
G4T = 40 mm Low Profile CQFP (Package 502)  
ACCESS TIME (ns)  
IMPROVEMENT MARK:  
N = No Connect at pin 8, 21, 28 and 39 in HIP for Upgrades  
ORGANIZATION, 128Kx32  
User configurable as 256Kx16 or 512Kx8  
SRAM  
WHITE ELECTRONIC DESIGNS CORPORATION  
June 2004  
Rev. 4  
8
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com  
WS128K32-XXX  
White Electronic Designs  
DEVICE TYPE  
SPEED  
PACKAGE  
SMD NO.  
128K x 32 SRAM Module  
128K x 32 SRAM Module  
128K x 32 SRAM Module  
128K x 32 SRAM Module  
120ns  
100ns  
85ns  
66 pin HIP (H1)  
66 pin HIP (H1)  
66 pin HIP (H1)  
66 pin HIP (H1)  
5962-93187 01H5X  
5962-93187 02H5X  
5962-93187 03H5X  
5962-93187 04H5X  
70ns  
128K x 32 SRAM Module  
128K x 32 SRAM Module  
128K x 32 SRAM Module  
128K x 32 SRAM Module  
120ns  
100ns  
85ns  
68 lead CQFP/J (G2U)  
68 lead CQFP/J (G2U)  
68 lead CQFP/J (G2U)  
68 lead CQFP/J (G2U)  
5962-95595 01HNX  
5962-95595 02HNX  
5962-95595 03HNX  
5962-95595 04HNX  
70ns  
128K x 32 SRAM Module  
128K x 32 SRAM Module  
128K x 32 SRAM Module  
128K x 32 SRAM Module  
120ns  
100ns  
85ns  
68 lead CQFP Low Profile (G4T)  
68 lead CQFP Low Profile (G4T)  
5962-95595 01HYX  
5962-95595 02HYX  
68 lead CQFP Low Profile (G4T) 5962-95595 03HYX  
68 lead CQFP Low Profile (G4T) 5962-95595 04HYX  
70ns  
June 2004  
Rev. 4  
9
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com  

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