I1760SY [WINBOND]
Speech Synthesizer With RCDG, 120s, PDSO28, 0.300 INCH, LEAD FREE, PLASTIC, SOIC-28;型号: | I1760SY |
厂家: | WINBOND |
描述: | Speech Synthesizer With RCDG, 120s, PDSO28, 0.300 INCH, LEAD FREE, PLASTIC, SOIC-28 CD 光电二极管 商用集成电路 |
文件: | 总24页 (文件大小:351K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
PRELIMINARY
ISD1700
Series
Multi-Message
Single-Chip
Voice Record & Playback Devices
Publication Release Date: January 23, 2007
Revision 1.3-S2
ISD1700 SERIES
TABLE OF CONTENTS
1
2
3
4
5
6
GENERAL DESCRIPTION..............................................................................................................3
FEATURES......................................................................................................................................4
BLOCK DIAGRAM...........................................................................................................................5
PINOUT CONFIGURATION............................................................................................................6
PIN DESCRIPTION .........................................................................................................................7
MODES OF OPERATIONS.............................................................................................................8
6.1 Standalone (Push-Button) Mode .............................................................................................8
6.2 SPI Mode .................................................................................................................................8
7
TIMING DIAGRAMS........................................................................................................................8
7.1 Standalone Operation..............................................................................................................8
7.2 SPI Operation.........................................................................................................................12
8
9
ABSOLUTE MAXIMUM RATINGS................................................................................................13
8.1 Operating Conditions .............................................................................................................13
ELECTRICAL CHARACTERISTICS .............................................................................................14
9.1 DC Parameters ......................................................................................................................14
9.2 AC Parameters.......................................................................................................................15
10 TYPICAL APPLICATION CIRCUITS.............................................................................................16
10.1 Good Audio Design Practices................................................................................................18
11 PACKAGING .................................................................................................................................19
11.1 28-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type 1 - IQC....................19
11.2 28-Lead 300-Mil Plastic Small Outline Integrated Circuit (SOIC)..........................................20
11.3 28-Lead 600-Mil Plastic Dual Inline Package (PDIP) ............................................................21
11.4 Die Information.......................................................................................................................21
12 ORDERING INFORMATION.........................................................................................................22
13 VERSION HISTORY......................................................................................................................23
- 2 -
ISD1700 SERIES
1 GENERAL DESCRIPTION
The Winbond® ISD1700 ChipCorder® Series is a high quality, fully integrated, single-chip multi-
message voice record and playback device ideally suited to a variety of electronic systems. The
message duration is user selectable in ranges from 26 seconds to 120 seconds, depending on the
specific device. The sampling frequency of each device can also be adjusted from 4 kHz to 12 kHz
with an external resistor, giving the user greater flexibility in duration versus recording quality for each
application. Operating voltage spans a range from 2.4 V to 5.5 V to ensure that the ISD1700 devices
are optimized for a wide range of battery or line-powered applications.
The ISD1700 is designed for operation in either standalone or microcontroller (SPI) mode. The device
incorporates a proprietary message management system that allows the chip to self-manage address
locations for multiple messages. This unique feature provides sophisticated messaging flexibility in a
simple push-button environment. The devices include an on-chip oscillator (with external resistor
control), microphone preamplifier with Automatic Gain Control (AGC), an auxiliary analog input, anti-
aliasing filter, Multi-Level Storage (MLS) array, smoothing filter, volume control, Pulse Width
Modulation (PWM) Class D speaker driver, and current/voltage output.
The ISD1700 devices also support an optional “vAlert” (voiceAlert) feature that can be used as a new
message indicator. With vAlert, the device flashes an external LED to indicate that a new message is
present. Besides, four special sound effects are reserved for audio confirmation of operations, such as
“Start Record”, “Stop Record”, “Erase”, “Forward”, “Global Erase”, and etc.
Recordings are stored into on-chip Flash memory, providing zero-power message storage. This unique
single-chip solution is made possible through Winbond’s patented Multi-Level Storage (MLS)
technology. Audio data are stored directly in solid-state memory without digital compression, providing
superior quality voice and music reproduction.
Voice signals can be fed into the chip through two independent paths: a differential microphone input
and a single-ended analog input. For outputs, the ISD1700 provides a Pulse Width Modulation (PWM)
Class D speaker driver and a separate analog output simultaneously. The PWM can directly drive a
standard 8Ω speaker or typical buzzer, while the separate analog output can be configured as a
single-ended current or voltage output to drive an external amplifier.
While in Standalone mode, the ISD1700 devices automatically enter into power down mode for power
conservation after an operation is completed.
In the SPI mode, the user has full control via the serial interface in operating the device. This includes
random access to any location inside the memory array by specifying the start address and end
address of operations. SPI mode also allows access to the Analog Path Configuration (APC) register.
This register allows flexible configuration of audio paths, inputs, outputs and mixing. The APC default
configuration for standalone mode can also be modified by storing the APC data into a non-volatile
register (NVCFG) that is loaded at initialization. Utilizing the capabilities of ISD1700 Series, designers
have the control and flexibility to implement voice functionality into the high-end products.
Notice: The specifications are subject to change without notice. Please contact Winbond Sales Offices or
Representatives to verify current or future specifications. Also refer to the website for any related application notes.
Publication Release Date: January 23, 2007
- 3 -
Revision 1.3-S2
ISD1700 SERIES
2 FEATURES
y
Integrated message management systems for single-chip, push-button applications
o
o
o
REC : level-trigger for recording
PLAY : edge-trigger for individual message or level-trigger for looping playback sequentially
ERASE : edge-triggered erase for first or last message or level-triggered erase for all messages
FWD : edge-trigger to advance to the next message or fast message scan during the playback
VOL : 8 levels output volume control
o
o
o
: ready or busy status indication
RDY INT
o
RESET : return to the default state
o Automatic power-down after each operation cycle
y
Selectable sampling frequency controlled by an external oscillator resistor
Sampling Frequency
Rosc
12 kHz
8 kHz
6.4 kHz
5.3 kHz
4 kHz
y
Selectable
message
53 kΩ
80 kΩ
100 kΩ
120 kΩ
160 kΩ
duration
o A wide range selection from 20 secs to 480 secs pending upon sampling frequency chosen
Sample Freq. ISD1730 ISD1740 ISD1750 ISD1760 ISD1790 ISD17120 ISD17150 ISD17180 ISD17210 ISD17240
20 secs
30 secs
37 secs
45 secs
60 secs
26 secs
40 secs
50 secs
60 secs
33 secs
50 secs
62 secs
75 secs
40 secs
60 secs
60 secs
80 secs 100 secs 120 secs 140 secs 160 secs
12 kHz
8 kHz
90 secs 120 secs 150 secs 180 secs 210 secs 240 secs
75 secs 112 secs 150 secs 187 secs 225 secs 262 secs 300 secs
90 secs 135 secs 181 secs 226 secs 271 secs 317 secs 362 secs
6.4 kHz
5.3 kHz
4 kHz
80 secs 100 secs 120 secs 180 secs 240 secs 300 secs 360 secs 420 secs 480 secs
y
y
Message and operation indicators
o Four customizable Sound Effects (SEs) for audible indication
o Optional vAlert (voiceAlert) to indicate the presence of new messages
o LED: stay on during recording, blink during playback, forward and erase operations
Dual operating modes
o Standalone mode:
Integrated message management techniques
Automatic power-down after each operation cycle
o SPI mode:
Fully user selectable and controllable options via APC register and various SPI commands
y
y
y
Two individual input channels
o MIC+/MIC-: differential microphone inputs with AGC (Automatic Gain Control)
o AnaIn: single-ended auxiliary analog input for recording or feed-through
Dual output channels
o Differential PWM Class D speaker outputs directly drives an 8 Ω speaker or a typical buzzer
o Configurable AUD (current) or AUX (voltage) single-ended output drives external audio amplifier
ChipCorder standard features
o High-quality, natural voice and audio reproduction
o 2.4V to 5.5V operating voltage
o 100-year message retention (typical)
o 100,000 record cycles (typical)
- 4 -
ISD1700 SERIES
y
Temperature options:
o
o
Commercial: 0°C to +50°C (die); 0°C to +70°C (packaged units)
Industrial: -40°C to +85°C (packaged units)
y
y
Packaging types: available in die, PDIP, SOIC and TSOP
Package option: Lead-free packaged units
3 BLOCK DIAGRAM
Internal
Clock
Sampling
Clock
Timing
ROSC
AnaIn
AnaIn
AUD /
Amp
AUX
Amp
Anti-
Aliasing
Filter
Nonvolatile
Multi-Level Storage
Array
SP+
Smoothing
Filter
Volume
Amp
Control
MIC+
AGC
SP-
Amp
MIC-
Automatic
Gain Control
AGC
SPI Interface
Device Control
Power Conditioning
VSSA
V
VCCP
VSSD VCCD
SSP1 VSSP2
VCCA
REC PLAY ERASE FWD
RESET VOL INT/RDY LED SS SCLK MOSI MISO
FT
Publication Release Date: January 23, 2007
Revision 1.3-S2
- 5 -
ISD1700 SERIES
4 PINOUT CONFIGURATION
Refer to Design Guide for details before performing any design or PCB layout.
VCCD
VSSD
INT / RDY
FWD
LED
RESET
MISO
ERASE
MOSI
REC
SCLK
PLAY
FT
SS
ISD1700
VSSA
VCCA
ROSC
AnaIn
MIC+
VOL
AGC
MIC-
VSSP2
AUD / AUX
VSSP1
SP-
VCCP
Sp+
SOIC / PDIP
VSSA
SS
SCLK
MOSI
MISO
AnaIn
MIC+
MIC-
VSSP2
RESET
LED
SP-
VCCP
VCCD
ISD1700
Sp+
VSSP1
VSSD
INT / RDY
FWD
AUD/AUX
AGC
ERASE
REC
VOL
ROSC
PLAY
FT
VCCA
TSOP
- 6 -
ISD1700 SERIES
5 PIN DESCRIPTION
Refer to Design Guide for details before performing any design or PCB layout.
PIN NAME
VCCD
FUNCTIONS
Digital Power Supply: Power supply for digital circuitry.
LED: An LED output.
LED
RESET: When active, the device enters into a known state.
RESET
MISO
Master In Slave Out: Data is shifted out on the falling edge of SCLK.
When the SPI is inactive ( SS = high), it’s tri-state.
MOSI
SCLK
Master Out Slave In: Data input of the SPI interface when ISD1700 is a
slave. Data is latched into the device on the rising edge of SCLK.
Serial Clock: Clock of the SPI interface.
Slave Select: Selects as a slave device and enables the SPI interface.
SS
VSSA
Analog Ground: Ground path for analog circuitry.
AnaIn
MIC+
MIC-
AnaIn: Auxiliary analog input to the device for recording or feed-through.
MIC+: Non-inverting input of the differential microphone signal.
MIC-: Inverting input of the differential microphone signal.
VSSP2
SP-
Ground: Ground path for negative PWM speaker drive.
SP-: The negative Class D PWM speaker output.
VCCP
Power Supply for PWM Speaker Driver: Power for PWM speaker drive.
SP+: The positive Class D PWM speaker output.
SP+
VSSP1
AUD/AUX
Ground: Ground path for positive PWM speaker drive.
Auxiliary Output: Either an AUD (current) or AUX (voltage) output.
Automatic Gain Control (AGC): The AGC adjusts the gain of the
microphone preamplifier circuitry.
AGC
Volume: This control has 8 levels of volume adjustment.
VOL
ROSC
Oscillator Resistor: A resistor determines the sample frequency of the
device, which sets the duration.
VCCA
Analog Power Supply. Power supply for analog circuitry.
Feed-through: Enable the feed-through path for AnaIn signal to the
outputs.
FT
Playback: Plays the recorded message individually, or plays messages
sequential in a looping mode.
PLAY
Record: When active, starts recording message.
REC
Erase: When active, can erase individual message or do global erase.
Forward: Advances to the next message from the current location.
An open drain output. Can review ready or interrupt status.
ERASE
FWD
RDY INT
VSSD
Digital Ground: Ground path for digital circuitry
Publication Release Date: January 23, 2007
- 7 -
Revision 1.3-S2
ISD1700 SERIES
6 MODES OF OPERATIONS
The ISD1700 Series can operate in either Standalone (Push-Button) or microcontroller (SPI) mode.
6.1 STANDALONE (PUSH-BUTTON) MODE
One can utilize the REC , PLAY , FT , FWD , ERASE , VOL or RESET control to initiate a
desired operation. As completed, the device automatically enters into the power-down state.
6.2 SPI MODE
In SPI mode, control of the device is achieved through the 4-wire serial interface via SPI
commands.
For technical details, please refer to the design guide.
7 TIMING DIAGRAMS
The following estimated timing diagrams are not in proper scale.
7.1 BASIC OPERATION
Tr
Tf
REC
RDY
TDeb
TSc1
TSet1
TRU
TRD
TER
LED
Mic+/-,
AnaIn
Figure 12.1: Record Operation with No Sound Effect
- 8 -
ISD1700 SERIES
> TDeb
Tr
Tf
TDeb
PLAY
RDY
TDeb
TRDTSet1
TSc1TSc2 TRU TLH
TCyc
LED
Sp+, Sp-
Figure 12.2: Start and Stop Playback Operation
> TDeb
Tr
Tf
ERASE
RDY
TDeb
TRD
TSc2
TSc2 TE
TSc1
TLS2
LED
Figure 12.3: Single Erase Operation with No Sound Effect
Publication Release Date: January 23, 2007
Revision 1.3-S2
- 9 -
ISD1700 SERIES
> TDeb
Tr
Tf
FWD
RDY
TDeb
TRD
TSc2
TLS1 or TLS2
TSc1
LED
Figure 12.4: Forward Operation with No Sound Effect
Tr
ERASE
TDeb
Tf
TRD
RDY
T
)
GE2
TLS4 or TSE4
3x(TLS1 or TSE1
TGE1 or (TE + TLS2 or TSE2)
TSc2
TSc1
LED
Sp+, Sp-
Note: If SEs are recorded, then Sp+/- will have output.
Figure 12.5: Global Erase Operation with or without Sound Effects
- 10 -
ISD1700 SERIES
Tr
Tf
RESET
TReset
TSet2
Device returns to Power Down state
RDY
LED
Figure 12.6: Reset Operation
> TDeb
Tr
Tf
PLAY
TDeb
TRD
RDY
TSc1TSc2 TRU TLH
TCyc
LED
AUD
TRU
TRD
Figure 12.7: Playback Operation with ramp up and ramp down effect at AUD output
Publication Release Date: January 23, 2007
Revision 1.3-S2
- 11 -
ISD1700 SERIES
7.2 SPI OPERATION
TSSmin
TSSH
SS
TSCKlow
TSSS
TSCKhi
SCLK
MOSI
TDIS
TDIH
LSB
MSB
TPD
TDF
(TRISTATE)
MISO
LSB
MSB
Figure 12.8: SPI Operation
PARAMETER
SS Setup Time
SYMBOL
TSSS
MIN
TYP
MAX
UNITS
500
nsec
TSSH
500
nsec
SS Hold Time
Data in Setup Time
Data in Hold Time
Output Delay
TDIS
TDIH
TPD
200
200
nsec
nsec
nsec
nsec
µsec
500
500
Output Delay to HighZ
TDF
TSSmin
1
SS HIGH
SCLK High Time
SCLK Low Time
CLK Frequency
TSCKhi
TSCKlow
F0
400
400
nsec
nsec
KHz
1,000
Power-Up Delay [1]
TPUD
50
msec
[1]
Notes:
The value shown is based upon 8 kHz sampling frequency. Delay increases proportionally for
slower sampling frequency.
- 12 -
ISD1700 SERIES
8 ABSOLUTE MAXIMUM RATINGS
ABSOLUTE MAXIMUM RATINGS (DIE) [1]
CONDITIONS
VALUES
Junction temperature
1500C
-650C to +1500C
Storage temperature range
Voltage Applied to any pads
(VSS - 0.3V) to (VCC + 0.3V)
-0.3V to +7.0V
Power supply voltage to ground potential
ABSOLUTE MAXIMUM RATINGS (PACKAGED PARTS) [1]
CONDITIONS
VALUES
Junction temperature
1500C
-650C to +1500C
Storage temperature range
Voltage Applied to any pins
(VSS - 0.3V) to (VCC + 0.3V)
(VSS – 1.0V) to (VCC + 1.0V)
-0.3V to +7.0V
Voltage applied to any pin (Input current limited to +/-20 mA)
Power supply voltage to ground potential
[1]
Stresses above those listed may cause permanent damage to the device. Exposure to the absolute
maximum ratings may affect device reliability. Functional operation is not implied at these conditions.
8.1
OPERATING CONDITIONS
OPERATING CONDITIONS (DIE)
CONDITIONS
Operating temperature range
VALUES
0°C to +50°C
Supply voltage (VCC) [1]
Ground voltage (VSS) [2]
Input voltage (VCC) [1]
+2.4 V to +5.5 V
0 V
0 V to 5.5 V
Voltage applied to any pins
(VSS –0.3 V) to (VCC +0.3 V)
OPERATING CONDITIONS (PACKAGED PARTS)
CONDITIONS VALUES
-40°C to +85°C
Operating temperature range (Case temperature)
Supply voltage (VDD) [1]
+2.4V to +5.5V
0V
Ground voltage (VSS) [2]
Input voltage (VDD) [1]
0V to 5.5V
Voltage applied to any pins
(VSS –0.3V) to (VDD +0.3V)
[1]
V
= VCCA = VCCD= VCCP
CC
[2]
V
SS
= VSSA = VSSD = VSSP1 VSSP2
Publication Release Date: January 23, 2007
Revision 1.3-S2
- 13 -
ISD1700 SERIES
9 ELECTRICAL CHARACTERISTICS
9.1 DC PARAMETERS
PARAMETER
Supply Voltage
SYMBOL
VDD
MIN
2.4
TYP [1]
MAX
5.5
UNITS
V
CONDITIONS
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage
Record Current
Playback Current
Erase Current
Standby Current
Input Leakage Current
Input Current Low
VIL
VIH
VOL
VOH
IDD_Record
IDD_Playback
IDD_Erase
ISB
VSS-0.3
0.7xVDD
VSS-0.3
0.7xVDD
0.3xVDD
VDD
0.3xVDD
VDD
V
V
V
V
IOL = 4.0 mA[2]
IOH = -1.6 mA[2]
VDD = 5.5 V, No load,
20
20
20
1
mA
mA
mA
µA
µA
µA
kꢀ
kꢀ
mV
V
Sampling freq = 12 kHz
[3] [4]
10
±1
-10
IILPD1
Force VDD
IILPD2
-3
Force VSS , others at Vcc
Power-up AGC
When active
Preamp Input Impedance RMIC+,RMIC-
7
42
AnaIn Input Impedance
MIC Differential Input
AnaIn Input Voltage
RAnaIn
VIN1
VIN2
15
6
300
1
40
Peak-to-Peak[5]
Peak-to-Peak
Gain from MIC to SP+/-
AMSP
dB
VIN = 15~300 mV, AGC =
4.7 µF, VCC = 2.4V~5.5V
Speaker Output Load
AUX Output Load
Speaker Output Power
RSPK
RAux
Pout
8
5
ꢀ
kꢀ
Across both Speaker pins
When active
1Vp-p,
1 kHz sine
wave at
AnaIn. RSPK
= 8 ꢀ.
670
313
117
49
mW
mW
mW
mW
V
VDD = 5.5 V
VDD = 4.4 V
VDD= 3 V
VDD= 2.4 V
Speaker Output Voltage
VOUT1
VDD
RSPK = 8ꢀ (Speaker),
Typical buzzer
AUX Output Swing
AUX Output DC Level
AUD
VOUT2
VOUT3
IAUD
1
V
V
mA
dB
Peak-to-Peak
When active
VDD =4.5 V, REXT= 390 ꢀ
8 steps of 4dB each
reference to output
1.2
-3.0
0 to -28
Volume Output
AVol
Total Harmonic Distortion THD
1
%
15 mV p-p 1 kHz sine
wave, Cmessage
weighted
[1]
Notes:
Conditions: VCC = 4.5V, 8 kHz sampling frequency and TA = 25°C, unless otherwise stated.
LED output during Record operation.
[2]
[3]
VCCA, VCCD and VCCP are connected together. VSSA, VSSP1, VSSP2 and VSSD are connected together.
[4]
[5]
REC , PLAY , FT , FWD , ERASE , VOL and RESET must be at VCCD
.
Balanced input signal applied between MIC+ and MIC- as shown in the applications example. Single-ended MIC+ or
MIC- input is recommended no more than 150 mV p-p.
- 14 -
ISD1700 SERIES
9.2 AC PARAMETERS
CHARACTERISTIC
Sampling Frequency [2]
Duration [3]
SYMBOL
FS
MIN
TYP [1]
MAX
UNITS
kHz
CONDITIONS
[2] [4]
[3]
4
12
Refer to
duration
table
TDur
sec
Rising Time
Tr
100
100
nsec
nsec
msec
msec
msec
Falling Time
Tf
[4]
Debounce Time
Ramp Up Time
Ramp Down Time
TDeb
TRU
TRD
TSc1
192/FS
128/FS
128/FS
Initial Scan Time after
power is applied
DRN/8/FS
msec DRN= device row# [4]
Initial Scan Time from PD TSc2
state
DRN/16/FS msec After a PB operation
is run [4]
[4]
End Recording Time
LED High Time
TER
TLH
32/FS
msec
msec
[4]
0.5K/FS
LED Flash Time for SE1 TLS1
LED Flash Time for SE2 TLS2
LED Flash Time for SE3 TLS3
LED Flash Time for SE4 TLS4
SE1 Recorded Duration TSE1
SE2 Recorded Duration TSE2
SE3 Recorded Duration TSE3
SE4 Recorded Duration TSE4
3.5K/FS
7.5K/FS
sec SE1 not recorded [5]
sec SE2 not recorded [5]
sec SE3 not recorded [5]
sec SE4 not recorded [5]
11.5K/FS
15.5K/FS
[4] [5]
4K/FS
4K/FS
4K/FS
4K/FS
sec
[4] [5]
sec
[4] [5]
sec
[4] [5]
sec
Erase Time
TE
10MRN/FS
34/FS
sec
sec
MRN=message row # [4]
[4] [5]
Global Erase Wait Time TGE1
20K/FS
Global Erase Time
RESET Pulse
TGE2
TReset
TSet1
TSet2
TLErr
TCyc
sec
1
1
All Fs [4]
μsec
msec
msec
msec
Hz
[4]
Settle Time
128/FS
64/FS
27.5K/FS
4
[4]
Settle Time after Reset
LED Error Time
[4] [5]
LED Cycle frequency
Pending upon FS
Notes: [1] Typical values: VCC = 4.5 V, FS = 8 kHz and @ TA = 25°C, unless otherwise stated.
[2] Characterization data shows that sampling frequency resolution is ±5 percent across temperature and voltage
ranges.
[3] Characterization data shows that duration resolution is ±5 percent across temperature and voltage ranges.
[4] Vcc=2.4 V~5.5V
[5] K = 1024
Publication Release Date: January 23, 2007
- 15 -
Revision 1.3-S2
ISD1700 SERIES
10 TYPICAL APPLICATION CIRCUITS
The following typical applications examples on ISD1700 Series are for references only. They make no
representation or warranty that such applications shall be suitable for the use specified. Each design
has to be optimized in its own system for the best performance on voice quality, current consumption,
functionalities and etc.
The below notes apply to the following applications examples:
*
These capacitors may be needed in order to optimize for the best voice quality, which is also dependent
upon the layout of the PCB. Depending on system requirements, they can be 10 μF, 4.7 μF or other values.
Please refer to the applications notes or consult Winbond for layout advice.
** It is important to have a separate path for each ground and power back to the related terminals to minimize
the noise. Also, the power supplies should be decoupled as close to the device as possible.
Example #1: Recording using microphone input via push-button controls
Reset
3
24
REC
RESET
LED
23
25
0.1μF
PLAY
ERASE
D1
vAlert
1 KΩ
2
26
Gnd
Vcc
FWD
**
VCCD
**
VCCA
VCCD
VCCP
19
22
1
VOL
FT
VCCD
VSSD
0.1μF
*
28
VCCA
21
8
VCCA
VSSA
VCC
*
μ
0.1
F
7
6
SS
VCCP
14
16
VCCP
SCLK
MOSI
MISO
4.7 KΩ
*
5
4
*
VSSP1
μ
0.1 F
ISD1700
μ
0.1
F
12
VSSP2
μ
4.7
F
4.7 KΩ
15
13
Speaker
or Buzzer
10
11
VCC
SP+
SP-
MIC+
MIC -
μ
0.1
F
Speaker
μ
0.1
F
17
27
AUD
AUX
AUD/AUX
INT/RDY
8050C
9
4.7 K
Ω
AnaIn
VCCD
100 KΩ
Optional
390Ω
Rosc ***
20
18
0.1μ F
ROSC
AGC
Optional: based upon the applications
μ
4.7
F
*** At 8kHz sampling freq, Rosc = 80 K
: Digital ground;
: Analog ground;
: Ground for SP+;
: Ground for SP-
- 16 -
ISD1700 SERIES
Example #2: Recording using AnaIn input via push-button controls
Reset
3
24
REC
RESET
23
PLAY
0.1 F
μ
vAlert
25
ERASE
D1
1 KΩ
2
26
LED
FWD
Vcc
Gnd
19
22
**
VCCD
**
VOL
FT
VCCA
1
VCCD
VSSD
VCCD
VCCP
0.1μF
*
28
VCCA
21
8
VCCA
VSSA
7
6
SS
*
μ
0.1
F
VCCP
SCLK
MOSI
MISO
14
VCCP
5
4
ISD1700
*
*
VSSP1 16
μ
0.1
F
μ
0.1
F
12
VSSP2
10
11
15
13
Speaker
or Buzzer
MIC+
MIC -
AnaIn
VCC
SP+
SP-
Speaker
0.1μF
9
AUD
AUX
17
27
AUD/AUX
INT/RDY
8050C
VCCD
100 KΩ
Optional
Rosc ***
20
18
390
Ω
ROSC
AGC
0.1μ F
μ
4.7
F
Optional: based upon the applications
*** At 8kHz sampling freq, Rosc = 80 K
: Digital ground;
: Analog ground;
: Ground for SP+; : Ground for SP-
Publication Release Date: January 23, 2007
Revision 1.3-S2
- 17 -
ISD1700 SERIES
Example #3: Connecting the SPI Interface to a microcontroller
Reset
3
2
24
23
25
REC
RESET
PLAY
ERASE
0.1μF
vAlert
D1
1 KΩ
LED
26
FWD
Vcc
Gnd
**
VCCD
**
19
22
VCCA
VCCD
VCCP
VOL
FT
1
VCCD
VSSD
0.1
μ
F
*
28
VCCA
21
8
VCCA
VSSA
7
6
*
μ
0.1
F
SS
VCCP
SCLK
MOSI
MISO
14
16
VCCP
To uC
SPI
5
4
*
ISD1700
*
VSSP1
μ
0.1
F
μ
0.1
F
12
VSSP2
15
13
10
11
Speaker
or Buzzer
VCC
SP+
SP-
MIC+
MIC -
Speaker
AUD
AUX
17
27
0.1μF
9
AUD/AUX
INT/RDY
8050C
AnaIn
VCCD
100 KΩ
Optional
Rosc ***
390
Ω
20
18
F
ROSC
AGC
0.1μ F
μ
4.7
Optional: based upon the applications
*** At 8kHz sampling freq, Rosc = 80 K
: Digital ground;
: Analog ground;
: Ground for SP+;
: Ground for SP-
10.1
GOOD AUDIO DESIGN PRACTICES
To ensure the highest quality of voice reproduction, it is important to follow good audio design
practices in layout and power supply decoupling. See recommendations from below links or other
Application Notes in our websites.
Design Considerations for ISD1700 Family
AN-CC1002 Design Considerations for ISD1700 Family.pdf
Good Audio Design Practices
http://www.winbond-usa.com/products/isd_products/chipcorder/applicationinfo/apin11.pdf
Single-Chip Board Layout Diagrams
http://www.winbond-usa.com/products/isd_products/chipcorder/applicationinfo/apin12.pdf
- 18 -
ISD1700 SERIES
11 PACKAGING
11.1 28-LEAD 8X13.4MM PLASTIC THIN SMALL OUTLINE PACKAGE (TSOP) TYPE 1 - IQC
HD
D
c
e
E
b
θ
A
A
1
L
Y
2
A
L
1
Dimension in Inches Dimension in mm
Symbol
Max.
1.20
Min. Nom. Max. Min. Nom.
0.047
A
0.006
0.041
0.05
0.002
0.035
0.15
1
A
0.95
0.17
0.040
1.00
0.20
2
A
1.05
0.27
0.007 0.008 0.011
b
c
D
E
0.10
0.004
0.461
0.008
0.465 0.469
0.15
11.80
8.00
0.21
0.006
11.70
11.90
0.311 0.315 0.319
0.520 0.528 0.536
7.90
8.10
13.60
13.40
13.20
D
H
0.022
0.020 0.024 0.028
0.031
0.55
0.60
0.80
e
L
L
0.50
0.70
1
0.000
0
0.10
5
0.004
5
0.00
0
Y
3
3
θ
Publication Release Date: January 23, 2007
Revision 1.3-S2
- 19 -
ISD1700 SERIES
11.2 28-LEAD 300-MIL PLASTIC SMALL OUTLINE INTEGRATED CIRCUIT (SOIC)
28
26 25
23 22 21 20 19 18 17
15
16
27
24
1
2
3
4
5
6 7
9 10 11 12 13 14
8
A
G
C
B
D
F
E
H
Plastic Small Outline Integrated Circuit (SOIC) Dimensions
INCHES
Nom
MILLIMETERS
Min
Max
0.711
0.104
0.299
0.0115
0.019
Min
17.81
2.46
Nom
17.93
2.56
7.52
0.22
0.41
1.27
10.31
0.81
Max
18.06
2.64
7.59
0.29
0.48
A
B
C
D
E
F
0.701
0.097
0.292
0.005
0.014
0.706
0.101
0.296
0.009
0.016
0.050
0.406
0.032
7.42
0.127
0.35
G
H
0.400
0.024
0.410
0.040
10.16
0.61
10.41
1.02
Lead coplanarity to be within 0.004 inches.
Note:
- 20 -
ISD1700 SERIES
11.3 28-LEAD 600-MIL PLASTIC DUAL INLINE PACKAGE (PDIP)
Plastic Dual Inline Package (PDIP) (P) Dimensions
INCHES
MILLIMETERS
Min
1.445
Nom
1.450
0.150
0.070
Max
1.455
Min
36.70
Nom
36.83
3.81
Max
36.96
A
B1
B2
C1
C2
D
0.065
0.600
0.530
0.075
0.625
0.550
0.19
1.65
15.24
13.46
1.78
1.91
15.88
13.97
4.83
0.540
13.72
D1
E
F
G
H
J
S
0
0.015
0.125
0.015
0.055
0.38
3.18
0.38
1.40
0.135
0.022
0.065
3.43
0.56
1.65
0.018
0.060
0.100
0.010
0.075
0.46
1.52
2.54
0.25
1.91
0.008
0.070
0°
0.012
0.080
15°
0.20
1.78
0°
0.30
2.03
15°
11.4 DIE INFORMATION
For die info, please contact the local Winbond Sales Representatives.
Publication Release Date: January 23, 2007
Revision 1.3-S2
- 21 -
ISD1700 SERIES
12 ORDERING INFORMATION
Product Number Descriptor Key
I17xxxxxxxxx
Special Features Field:
Product Name:
Blank = None
I = ISD
01
= vAlert
Product Series:
Tape & Reel:
17 = 1700
Blank = None
Duration:
R
= Tape & Reel
30 : 20 – 60 secs
40 : 26 – 80 secs
50 : 33 – 100 secs
60 : 40 – 120 secs
90 : 60 – 180 secs
120 : 80 – 240 secs
150 : 100 – 300 secs
180 : 120 – 360 secs
210 : 140 – 420 secs
240 : 160 – 480 secs
Temperature:
I
=
Industrial (-40°C to +85°C)
Blank = Commercial
•
•
Die (0°C to +50°C)
Package (0°C to +70°C)
Package Type:
X
E
S
=
=
=
Die
Lead-Free:
= Lead-Free
Thin Small Outline Package (TSOP)
Y
Small Outline Integrated Circuit
(SOIC) Package
P
=
Plastic Dual Inline Package (PDIP)
When ordering ISD1700 devices, please refer to the above ordering scheme. Contact the local Winbond
Sales Representatives for any questions and the availability.
For the latest product information, please contact the Winbond Sales/Rep or
access Winbond’s worldwide web site at http://www.winbond-usa.com
- 22 -
ISD1700 SERIES
13 VERSION HISTORY
VERSION
1.3-S
DATE
DESCRIPTION
Initial version
Sep 2006
Nov 2006
Jan 2007
1.3-S1
1.3-S2
Revise Pinout Configuration & Pin Description sections
Revise Rosc resistor value
Revise Selectable Message Duration section
Update standby current, sampling frequency & duration parameters
Publication Release Date: January 23, 2007
- 23 -
Revision 1.3-S2
ISD1700 SERIES
Winbond products are not designed, intended, authorized or warranted for use as components in systems or equipment
intended for surgical implantation, atomic energy control instruments, airplane or spaceship instruments, transportation
instruments, traffic signal instruments, combustion control instruments, or for other applications intended to support or
sustain life. Furthermore, Winbond products are not intended for applications wherein failure of Winbond products could
result or lead to a situation wherein personal injury, death or severe property or environmental damage could occur.
Winbond customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify Winbond for any damages resulting from such improper use or sales.
The contents of this document are provided only as a guide for the applications of Winbond products. Winbond makes no
representation or warranties with respect to the accuracy or completeness of the contents of this publication and
reserves the right to discontinue or make changes to specifications and product descriptions at any time without notice.
No license, whether express or implied, to any intellectual property or other right of Winbond or others is granted by this
publication. Except as set forth in Winbond's Standard Terms and Conditions of Sale, Winbond assumes no liability
whatsoever and disclaims any express or implied warranty of merchantability, fitness for a particular purpose or
infringement of any Intellectual property.
The contents of this document are provided “AS IS”, and Winbond assumes no liability whatsoever and disclaims any
express or implied warranty of merchantability, fitness for a particular purpose or infringement of any Intellectual
property. In no event, shall Winbond be liable for any damages whatsoever (including, without limitation, damages for
loss of profits, business interruption, loss of information) arising out of the use of or inability to use the contents of this
documents, even if Winbond has been advised of the possibility of such damages.
Application examples and alternative uses of any integrated circuit contained in this publication are for illustration only
and Winbond makes no representation or warranty that such applications shall be suitable for the use specified.
The 100-year retention and 100K record cycle projections are based upon accelerated reliability tests, as published in
the Winbond Reliability Report, and are neither warranted nor guaranteed by Winbond. This product incorporates
SuperFlash®.
This datasheet and any future addendum to this datasheet is(are) the complete and controlling ISD® ChipCorder®
product specifications. In the event any inconsistencies exist between the information in this and other product
documentation, or in the event that other product documentation contains information in addition to the information in
this, the information contained herein supersedes and governs such other information in its entirety. This datasheet is
subject to change without notice.
Copyright© 2005, Winbond Electronics Corporation. All rights reserved. ChipCorder® and ISD® are trademarks of
Winbond Electronics Corporation. SuperFlash® is the trademark of Silicon Storage Technology, Inc. All other trademarks
are properties of their respective owners.
- 24 -
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