ISD4003-08MPYD [WINBOND]
Speech Synthesizer With RCDG, 480s, CMOS, PDIP28, 0.600 INCH, LEAD FREE, PLASTIC, DIP-28;型号: | ISD4003-08MPYD |
厂家: | WINBOND |
描述: | Speech Synthesizer With RCDG, 480s, CMOS, PDIP28, 0.600 INCH, LEAD FREE, PLASTIC, DIP-28 CD 光电二极管 |
文件: | 总38页 (文件大小:392K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
ISD4003 SERIES
SINGLE-CHIP, MULTIPLE-MESSAGES
VOICE RECORD/PLAYBACK DEVICES
4-, 5-, 6-, AND 8-MINUTE DURATION
Publication Release Date: October 26, 2005
Revision 1.2
- 1 -
ISD4003 SERIES
1. GENERAL DESCRIPTION
The ISD4003 ChipCorder® series provides high-quality, 3-volt, single-chip record/playback solutions
for 4- to 8-minute messaging applications ideally for cellular phones and other portable products. The
CMOS-based devices include an on-chip oscillator, anti-aliasing filter, smoothing filter, AutoMute®
feature, audio amplifier, and high density multilevel Flash memory array. The ISD4003 series is
designed to be used in a microprocessor- or microcontroller-based system. Address and control are
accomplished through a Serial Peripheral Interface (SPI) or Microwire Serial Interface to minimize pin
count.
Recordings are stored into the on-chip Flash memory cells, providing zero-power message storage.
This unique single-chip solution utilizes Winbond’s patented multilevel storage technology. Voice and
audio signals are directly stored onto memory array in their natural form, providing high-quality voice
reproduction.
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ISD4003 SERIES
2. FEATURES
• Single-chip voice record/playback solution
• Single 3 volt supply
• Low-power consumption
Operating current:
-
-
I
I
CC_Play = 15 mA (typical)
CC_Rec = 25 mA (typical)
Standby current:
CC_Standby = 1 µA (typical)
-
I
• Duration: 4, 5, 6, and 8 minutes
• High-quality, natural voice/audio reproduction
• AutoMute feature provides background noise attenuation
• No algorithm development required
• Microcontroller SPI or Microwire™ Serial Interface
• Fully addressable to handle multiple messages
• Non-volatile message storage
• 100K record cycles (typical)
• 100-year message retention (typical)
• On-chip oscillator
• Power-down feature to reduce power consumption
• Available in die form, PDIP, SOIC, and TSOP
• Packaged types: Leaded and Lead-Free
• Temperature:
-
-
-
-
Commercial (die): 0°C to +50°C
Commercial (packaged units): 0°C to +70°C
Extended (packaged units): -20°C to +70°C
Industrial (packaged units): -40°C to +85°C
Publication Release Date: October 26, 2005
Revision 1.2
- 3 -
ISD4003 SERIES
3. BLOCK DIAGRAM
Internal Clock
Timing
XCLK
Sampling Clock
ANA IN-
Amp
5-Pole Active
Antialiasing Filter
Analog Transceivers
ANA IN+
1920K Cell
Nonvolatile
Multilevel Storage
Array
5-Pole Active
Smoothing Filter
AutoMuteTM
Feature
Amp
AUDOUT
Power Conditioning
Device Control
VCCA VSSA VSSA VSSA VSSD VCCD
SCLK SS MOSI MISO INT RAC
AM CAP
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ISD4003 SERIES
4. TABLE OF CONTENTS
1. GENERAL DESCRIPTION.................................................................................................................. 2
2. FEATURES ......................................................................................................................................... 3
3. BLOCK DIAGRAM .............................................................................................................................. 4
4. TABLE OF CONTENTS ...................................................................................................................... 5
5. PIN CONFIGURATION ....................................................................................................................... 6
6. PIN DESCRIPTION............................................................................................................................. 7
7. FUNCTIONAL DESCRIPTION.......................................................................................................... 12
7.1. Detailed Description.................................................................................................................... 12
7.2. Serial Peripheral Interface (SPI) Description.............................................................................. 13
7.2.1. OPCODES ........................................................................................................................... 14
7.2.2. SPI Diagrams....................................................................................................................... 15
7.2.3. SPI Control and Output Registers........................................................................................ 16
8. TIMING DIAGRAMS.......................................................................................................................... 18
9. ABSOLUTE MAXIMUM RATINGS.................................................................................................... 20
9.1. Operating Conditions.................................................................................................................. 21
10. ELECTRICAL CHARACTERISTICS............................................................................................... 22
10.1. Parameters For Packaged Parts .............................................................................................. 22
10.2. Parameters For Die .................................................................................................................. 25
10.3. SPI AC Parameters .................................................................................................................. 26
11. TYPICAL APPLICATION CIRCUIT................................................................................................. 27
12. PACKAGING AND DIE INFORMATION......................................................................................... 30
12.1. 28-Lead 300-Mil Plastic Small Outline IC (SOIC)..................................................................... 30
12.2. 28-Lead 600-Mil Plastic Dual Inline Package (PDIP)............................................................... 31
12.3. 28-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type 1 - IQC ...................... 32
12.4. 28-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type 1................................ 33
12.5. Die Information ......................................................................................................................... 34
13. ORDERING INFORMATION........................................................................................................... 36
14. VERSION HISTORY ....................................................................................................................... 37
Publication Release Date: October 26, 2005
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Revision 1.2
ISD4003 SERIES
5. PIN CONFIGURATION
1
2
3
4
28
27
26
25
SS
SCLK
VCCD
XCLK
INT
MOSI
MISO
VSSD
5
6
7
24
23
22
NC
NC
NC
RAC
VSSA
NC
ISD4003
8
9
21
20
19
NC
NC
NC
NC
NC
NC
10
11
12
18
17
VSSA
VSSA
VCCA
ANA IN+
13
14
16
15
AUD OUT
AM CAP
ANA IN-
NC
SOIC / PDIP
VSSA
NC
1
2
3
4
5
6
7
8
28
27
26
25
24
23
22
21
20
19
18
17
16
15
RAC
NC
VCCA
NC
NC
ANA IN+
ANA IN-
NC
INT
XCLK
VCCD
AM CAP
NC
ISD4003
TSOP
SCLK
SS
AUD OUT
9
MOSI
NC
10
11
12
13
14
VSSA
MISO
VSSD
VSSA
NC
NC
NC
NC
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ISD4003 SERIES
6. PIN DESCRIPTION
PIN NAME
PIN NO.
FUNCTION
SOIC /
PDIP
TSOP
1
9
Slave Select: This input, when LOW, will select the
SS
ISD4003 device.
MOSI
2
10
Master Out Slave IN: This is the serial input to the
ISD4003 device when it is configured as slave. The master
microcontroller places data on the MOSI line one half-cycle
before the rising edge of SCLK for clocking into the device.
MISO
3
11
Master In Slave Out: This is the serial output (open drain)
of the ISD4003 device. This output goes into a high-
impedance state if the device is not selected.
VSSA / VSSD
11, 12,
23 / 4
1, 17, 18 /
12
Ground: The ISD4003 series utilizes separate analog and
digital ground busses. The analog ground (VSSA) pins
should be tied together as close as possible and connected
through a low-impedance path to power supply ground.
The digital ground (VSSD) pin should be connected through
a separate low-impedance path to power supply ground.
These ground paths should be large enough to ensure that
the impedance between the VSSA pins and the VSSD pin is
less than 3 Ω. The backside of the die is connected to VSS
through the substrate. For chip-on-board design, the die
attach area must be connected to VSS or left floating.
NC
5-10, 15,
19-22
3, 4, 13-
16, 19, 21,
23, 27, 28
Not connected
AUD OUT [1]
13
20
Audio Output: This pin provides an audio output of the
stored data and is recommended be AC coupled. It is
capable of driving a 5 KΩ impedance REXT
.
[1]
The AUD OUT pin is always at 1.2 volts when the device is powered up. When in playback, the output buffer
connected to this pin can drive a load as small as 5 KΩ. When in record, a built-in resistor connects AUD OUT to
the internal 1.2-volt analog ground supply. This resistor is approximately 850 KΩ, but will vary somewhat
according to the sample rate of the device. This relatively high impedance allows this pin to be connected to an
audio bus without loading it down.
Publication Release Date: October 26, 2005
- 7 -
Revision 1.2
ISD4003 SERIES
PIN NAME
PIN NO.
FUNCTION
SOIC /
TSOP
PDIP
AM CAP
14
22
AutoMute™ Feature: The AutoMute feature only applies
for playback operation and helps to minimize noise (with 6
dB of attenuation) when there is no signal (i.e. during
periods of silence). A 1 µF capacitor to ground is
recommended to connect to the AM CAP pin.
This capacitor becomes a part of an internal peak detector
which senses the signal amplitude. This peak level is
compared to an internally set threshold to determine the
AutoMute trip point. For large signals, the AutoMute
attenuation is set to 0 dB automatically but 6 dB of
attenuation occurs for silence. The 1 µF capacitor also
affects the rate at which the AutoMute feature changes with
the signal amplitude (or the attack time).
The AutoMute feature can be disabled by connecting the
AM CAP pin directly to VCCA..
ANA IN-
16
24
Inverting Analog Input: This pin transfers the signal into
the device during recording via differential-input mode.
In this differential-input mode, a 16 mVp-p maximum input
signal should be capacitively coupled to ANA IN- for
optimal signal quality, as shown in Figure 1: ANA IN
Modes. This capacitor value should be equal to that used
on ANA IN+ pin. The input impedance at ANA IN- is
normally 56 KΩ.
In the single-ended mode, ANA IN- should be capacitively
coupled to VSSA through a capacitor equal to that used on
the ANA IN+ pin.
ANA IN+
17
25
Non-Inverting Analog Input: This pin is the non-inverting
analog input that transfers the signal to the device for
recording. The analog input amplifier can be driven single
ended or differentially.
In the single-ended input mode, a 32 mVp-p (peak-to-peak)
maximum signal should be capacitively connected to this
pin for optimal signal quality. The external capacitor
associated with ANA IN+ together with the 3 KΩ input
impedance are selected to give cutoff at the low frequency
end of the voice passband.
In the differential-input mode, the maximum input signal at
ANA IN+ should be 16 mVp-p capacitively coupled for
optimal signal quality. The circuit connections for the two
modes are shown in Figure 1.
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ISD4003 SERIES
PIN NAME
PIN NO.
FUNCTION
SOIC /
TSOP
PDIP
VCCA / VCCD
18 / 27
26 / 7
Supply Voltage: To minimize noises, the analog and digital
circuits in the ISD4003 devices use separate power
busses. These +3V busses are brought out to separate
pins and should be tied together as close to the supply as
possible. In addition, these supplies should be decoupled
as close to the package as possible.
RAC
24
2
Row Address Clock: This is an open drain output that
provides the signal of a ROW with a 200 ms period for 8
KHz sampling frequency. (This represents a single row of
memory.) This signal stays HIGH for 175 ms and stays
LOW for 25 ms when it reaches the end of a row.
The RAC pin stays HIGH for 109.37 µsec and stays LOW
for 15.63 µsec in Message Cueing mode (see Message
Cueing section for detailed description). Refer to the AC
Parameters table for RAC timing information at other
sample rates.
When a record command is first initiated, the RAC pin
remains HIGH for an extra TRACL period. This is due to the
need of loading the internal sample and hold circuits in the
device. This pin can be used for message management
techniques.
A pull-up resistor is required to connect this pin to other
device.
25
5
Interrupt: This is an open drain output pin. This pin goes
LOW and stays LOW when an Overflow (OVF) or End of
Message (EOM) marker is detected. Each operation that
ends with an EOM or OVF will generate an interrupt. The
interrupt will be cleared the next time an SPI cycle is
initiated. The interrupt status can also be read by an RINT
instruction.
INT
A pull-up resistor is required to connect this pin to other
device.
Overflow Flag (OVF) – The Overflow flag indicates that the
end of memory has been reached during a record or
playback operation.
End of Message (EOM) – The End of Message flag is set
only during playback operation when an EOM is found.
There are eight EOM flag position options per row.
Publication Release Date: October 26, 2005
- 9 -
Revision 1.2
ISD4003 SERIES
PIN NAME
PIN NO.
FUNCTION
SOIC /
TSOP
PDIP
XCLK
26
6
External Clock Input: The pin has an internal pull-down
device. The ISD4003 series is configured at the factory with
an internal sampling clock frequency centered to ±1
percent of specification. The frequency is then maintained
to a variation of ±2.25 percent over the entire commercial
temperature and operating voltage ranges. The internal
clock has a –6/+4 percent tolerance over the extended
temperature, industrial temperature and voltage ranges. A
regulated power supply is recommended for industrial
temperature range parts. If greater precision is required,
the device can be clocked through the XCLK pin as follows:
Part Number
ISD4003-04M
ISD4003-05M
ISD4003-06M
ISD4003-08M
Sample Rate
Required Clock
8.0 kHz
1024 kHz
6.4 kHz
819.2 kHz
682.7 kHz
512 kHz
5.3 kHz
4.0 kHz
These recommended clock rates should not be varied
because the anti-aliasing and smoothing filters are fixed.
Otherwise, aliasing problems can occur if the sample rate
differs from the one recommended. The duty cycle on the
input clock is not critical, as the clock is immediately
divided by two. If the XCLK is not used, this input must
be connected to ground.
SCLK
28
8
Serial Clock: This is the input clock to the ISD4003 device.
It is generated by the master device (typically
microcontoller) and is used to synchronize the data transfer
in and out of the device through the MOSI and MISO lines,
respectively. Data is latched into the ISD4003 on the rising
edge of SCLK and shifted out of the device on the falling
edge of SCLK.
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ISD4003 SERIES
Internal to the device
53K
Ω
0.1
0.1
F
F
ANA IN+
ANA IN-
3K
Ω
µ
µ
Signal
32m Vp-p
-
To Filter
+
3K
Ω
53K
Ω
1.2V
Single-Ended Input Mode
Internal to the device
53K
Ω
0.1
0.1
F
F
ANA IN+
ANA IN-
3K
Ω
µ
µ
Input Signal
Input Signal
16m Vp-p
16m Vp-p
-
To Filter
+
°
180
3K
Ω
53K
Ω
1.2V
Differential Input Mode
FIGURE 1: ISD4003 SERIES ANA IN MODES
TRAC
(200 ms)
RAC
25 ms
TRACL
FIGURE 2: RAC TIMING WAVEFORM DURING NORMAL OPERATION
(example of 8KHz sampling rate)
Publication Release Date: October 26, 2005
Revision 1.2
- 11 -
ISD4003 SERIES
7. FUNCTIONAL DESCRIPTION
7.1. DETAILED DESCRIPTION
Audio Quality
The Winbond’s ISD4003 ChipCorder® series is offered at 8.0, 6.4, 5.3 and 4.0 kHz sampling
frequencies, allowing the user a choice of speech quality options. Increasing the sampling frequency
will produce better sound quality, but affects duration. Please refer to Table 1: Product Summary for
details.
Analog speech samples are stored directly into on-chip non-volatile memory without the digitization
and compression associated with other solutions. Direct analog storage provides higher quality
reproduction of voice, music, tones, and sound effects than other solid-state solutions.
Duration
The ISD4003 Series is a single-chip solution with 4-, 5-, 6-, and 8-minute duration.
TABLE 1: PRODUCT SUMMARY OF ISD4003 SERIES
Part Number
Duration
Sample Rate
Typical Filter Pass
(Minutes)
(kHz)
Band (kHz) *
ISD4003-04M
ISD4003-05M
ISD4003-06M
ISD4003-08M
4
5
6
8
8.0
6.4
5.3
4.0
3.4
2.7
2.3
1.7
* This is the –3dB point. This parameter is not checked during production testing and may vary due to process
variations and other factors. Therefore, the customer should not rely upon this value for testing purposes.
Flash Storage
The ISD4003 series utilizes on-chip Flash memory, providing zero-power message storage. The
message is retained for up to 100 years typically without power. In addition, the device can be re-
recorded typically over 100,000 times.
Memory Architecture
The ISD4003 series contains a total of 1,920K Flash memory cells, which is organized as 1,200 rows
of 1,600 cells each.
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ISD4003 SERIES
Microcontroller Interface
A four-wire (SCLK, MOSI, MISO & SS ) SPI interface is provided for controlling and addressing
functions. The ISD4003 is configured to operate as a peripheral slave device, with a microcontroller-
based SPI bus interface. Read and write operations are controlled through this SPI interface. An
interrupt signal (INT ) and internal read only Status Register are provided for handshake purposes.
Programming
The ISD4003 series is also ideal for playback-only applications, where single- or multiple-messages
playback is controlled through the SPI port. Once the desired message configuration is created,
duplicates can easily be generated via a programmer.
7.2. SERIAL PERIPHERAL INTERFACE (SPI) DESCRIPTION
The ISD4003 series operates via SPI serial interface with the following protocol.
First, the data transfer protocol assumes that the microcontroller’s SPI shift registers are clocked on
the falling edge of the SCLK. However, for the ISD4003, the protocols are as follows:
1. All serial data transfers begin with the falling edge of SS pin.
2. SS is held LOW during all serial communications and held HIGH between instructions.
3. Data is clocked in on the rising edge of the SCLK signal and clocked out on the falling edge of
the SCLK signal, with LSB first.
4. Playback and record operations are initiated when the device is enabled by asserting the SS
pin LOW, shifting in an opcode and an address data to the ISD4003 device (refer to the
Opcode Summary in the following page).
5. The opcodes contain <11 address bits> and <5 control bits>.
6. Each operation that ends with an EOM or Overflow will generate an interrupt. The Interrupt
will be cleared the next time a SPI cycle is initiated.
7. As Interrupt data is shifted out of the MISO pin, control and address data are simultaneously
shifted into the MOSI pin. Care should be taken such that the data shifted in is compatible
with current system operation. Because it is possible to read an interrupt data and start a new
operation within the same SPI cycle.
8. An operation begins with the RUN bit set and ends with the RUN bit reset.
9. All operations begin after the rising edge of SS .
Publication Release Date: October 26, 2005
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Revision 1.2
ISD4003 SERIES
7.2.1. OPCODES
The available Opcodes are summarized as follows:
TABLE 2: OPCODE SUMMARY
Instructions
OpCodes
Descriptions
Address (11 bits) Control bits (5 bits)
<A0 – A10>
C0 C1 C2 C3 C4
POWERUP
<XXXXXXXXXXX>
0
0
1
0
0
Power-Up: Device will be ready for an operation after
TPUD
.
SETPLAY
PLAY
SETREC
REC
<A0 – A10>
<XXXXXXXXXXX>
<A0 – A10>
0
0
0
0
0
1
0
1
1
1
1
1
1
1
0
0
1
1
1
1
Initiates playback from address <A0-A10>.
Playback from the current address (until EOM or OVF).
Initiates a record operation from address <A0-A10>.
Records from current address until OVF is reached or
Stop command is sent.
<XXXXXXXXXXX>
SETMC
MC [1]
<A0 – A10>
1
1
0
1
1
1
1
1
1
1
Initiates Message Cueing (MC) from address <A0-
A10>.
Performs a Message Cueing from current location.
Proceeds to the end of message (EOM) or enters OVF
condition if no more messages are present.
<XXXXXXXXXXX>
STOP
<XXXXXXXXXXX>
0
X
1
1
1
0
X
X
0
0
Stops the current operation.
Stops the current operation and enters into standby
(power-down) mode.
STOPPWRDN <XXXXXXXXXXX>
RINT [2]
<XXXXXXXXXXX>
0
1
1
X
0
Read Interrupt status bits: Overflow and EOM.
Notes:
C0 = Message cueing
C1 = Ignore address bit
C2 = Master power control
C3 = Record or playback operation
C4 = Enable or disable an operation
[1] Message Cueing can be selected only at the beginning of a playback operation.
[2]
As the Interrupt data is shifted out of the ISD4003, control and address data are being shifted in. Care should
be taken such that the data shifted in is compatible with current system operation. It is possible to read interrupt
data and start a new operation at the same time. See Figures 5 - 8 for references.
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ISD4003 SERIES
7.2.2. SPI Diagrams
MOSI
Input Shift Register
(Loaded to Row Counter
A0-A10
only if IAB = 0)
Select Logic
Row Counter
P0-P10
OVF EOM
MISO
Output Shift Register
FIGURE 3: SPI INTERFACE SIMPLIFIED BLOCK DIAGRAM
The following diagram describes the SPI port and the control bits associated with it.
MISO
MOSI
OVF EOM P0
P1
A3
P2
A4
P3
A5
P4
A6
P5
A7
P6
A8
P7
P8
P9 P10
0
0
0
LSB
MSB
A0
A1
A2
A9 A10 C0
C1
C2
C3
C4
Message Cueing (MC)
Ignore Address Bit (IAB)
Power Up (PU)
Play/Record (P/R)
RUN
FIGURE 4: SPI PORT
Publication Release Date: October 26, 2005
Revision 1.2
- 15 -
ISD4003 SERIES
7.2.3. SPI Control and Output Registers
The SPI control register provides control of individual function such as play, record, message cueing,
power-up, power-down, start, stop and ignore address pointer operations.
TABLE 3: SPI CONTROL REGISTERS
Control Bit
C0
Control Register
MC
Bit
Device Function
Message Cueing function
=
=
1
0
Enable Message Cueing
Disable Message Cueing
Ignore Address bit
C1
C2
IAB [1]
PU
=
=
1
0
Ignore input address register (A0-A10)
Use the input address register (A0-A10)
Power Up
=
=
1
0
Power-Up
Power-Down
P/R
C3
C4
Playback or Record
Play
Record
=
=
1
0
RUN
Enable or Disable an operation
=
=
1
0
Start
Stop
Address Bits A0-A10
Input address register
TABLE 4: SPI OUTPUT REGISTERS
Output Bits Description
OVF
Overflow
EOM
End-of-Message
P0-P10
Output of the row pointer register
[1]
When IAB (Ignore Address Bit) is set to 0, a playback or record operation starts from address (A0-A10). For
consecutive playback or record, IAB should be changed to a 1 before the end of that row (see RAC timing).
Otherwise the ISD4003 will repeat the operation from the same row address. For memory management, the Row
Address Clock (RAC) signal and IAB can be used to move around the memory segments.
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ISD4003 SERIES
Message Cueing
Message cueing (MC) allows the user to skip through messages, without knowing the actual physical
location of the messages. It will stop when an EOM marker is reached. Then, the internal address
counter will point to the next message. Also, it will enter into OVF condition when it reaches the end of
memory. In this mode, the messages are skipped 1,600 times faster than the normal playback
mode.
Power-Up Sequence
The ISD4003 will be ready for an operation after power-up command is sent and followed by the TPUD
timing (25 ms for 8 KHz sampling rate). Refer to the AC timing table for other TPUD values with respect
to different sampling rates.
The following sequences are recommended for optimized Record and Playback operations.
Record Mode
1. Send POWERUP command.
2. Wait TPUD (power-up delay).
3. Send POWERUP command.
4. Wait 2 x TPUD (power-up delay).
5. a). Send SETREC command with address xx, or
b). Send REC command (recording from current location).
6. Send STOP command to stop recording.
7. Wait TSTOP/PAUSE.
For 3 & 4), please refer to Apps Brief 39A: recorded pop elimination in the ISD4000 series.
For 5.a), the device will start recording at address xx and will generate an interrupt when an overflow
(end of memory array) is reached, if no STOP command is sent before that. Then, it will automatic
stop recording operation.
Playback Mode
1. Send POWERUP command
2. Wait TPUD (power-up delay)
3. a). Send SETPLAY command with address xx, or
b). Send PLAY command (playback from current location).
4. a). Send STOP command to halt the playback operation, or
b). Wait for playback operation to stop automatically, when an EOM or OVF is reached.
5. Wait TSTOP/PAUSE.
For 3.a), the device will start playback at address xx and it will generate an interrupt when an EOM or
OVF is reached. It will then stop playback operation.
Publication Release Date: October 26, 2005
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Revision 1.2
ISD4003 SERIES
8. TIMING DIAGRAMS
TSSH
SS
TSSmin
TSCKhi
TSSS
SCLK
MOSI
TDIH
TSCKlow
TDIS
TPD
TPD
TDF
(TRISTATE)
LSB
MISO
FIGURE 5: TIMING DIAGRAM
SS
SCLK
LSB
A8
A9
A10
C0
C1
C2
C3
C4
MOSI
LSB
OVF
EOM
P0
P1
P2
P3
P4
P5
MISO
FIGURE 6: 8-BIT COMMAND FORMAT
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ISD4003 SERIES
SS
SCLK
MOSI
LSB
A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 C0 C1 C2 C3 C4
LSB
OVF EOM P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 P10
X
X
X
MISO
FIGURE 7: 16-BIT COMMAND FORMAT
SS
SCLK
MOSI
Stop
Play/Record
Data
Data
MISO
TSTOP/PAUSE
(Rec)
ANA IN
TSTOP/PAUSE
(Play)
ANA OUT
FIGURE 8: PLAYBACK/RECORD AND STOP CYCLE
Publication Release Date: October 26, 2005
Revision 1.2
- 19 -
ISD4003 SERIES
9. ABSOLUTE MAXIMUM RATINGS
TABLE 5: ABSOLUTE MAXIMUM RATINGS (PACKAGED PARTS)
CONDITIONS
Junction temperature
VALUES
150°C
Storage temperature range
-65°C to +150°C
Voltage applied to any pin
(VSS –0.3V) to (VCC +0.3V)
(VSS –1.0V) to (VCC +1.0V)
(VSS –1.0V) to 5.5V
Voltage applied to any pin (Input current limited to ±20mA)
Voltage applied to MOSI, SCLK, and SS pins
(Input current limited to ±20mA)
Lead temperature (soldering – 10 seconds)
VCC – VSS
300°C
-0.3V to +7.0V
TABLE 6: ABSOLUTE MAXIMUM RATINGS (DIE)
CONDITIONS
VALUES
150°C
Junction temperature
Storage temperature range
Voltage applied to any pad
-65°C to +150°C
(VSS –0.3V) to (VCC +0.3V)
(VSS –1.0V) to (VCC +1.0V)
(VSS –1.0V) to 5.5V
Voltage applied to any pad (Input current limited to ±20 mA)
Voltage applied to MOSI, SCLK, and SS pins
(Input current limited to ±20mA)
VCC – VSS
-0.3V to +7.0V
Note: Stresses above those listed may cause permanent damage to the device. Exposure to the absolute
maximum ratings may affect device reliability and performance. Functional operation is not implied at these
conditions.
- 20 -
ISD4003 SERIES
9.1. OPERATING CONDITIONS
TABLE 7: OPERATING CONDITIONS (PACKAGED PARTS)
CONDITIONS
VALUES
0°C to +70°C
-20°C to +70°C
-40°C to +85°C
+2.7V to +3.3V
0V
Commercial operating temperature range (Case temperature)
Extended operating temperature (Case temperature)
Industrial operating temperature (Case temperature)
Supply voltage (VCC) [1]
Ground voltage (VSS) [2]
TABLE 8: OPERATING CONDITIONS (DIE)
CONDITIONS
Commercial operating temperature range
Supply voltage (VCC) [1]
Ground voltage (VSS) [2]
VALUES
0°C to +50°C
+2.7V to +3.3V
0V
[1]
V
V
= VCCA = VCCD
= VSSA = VSSD
CC
[2]
SS
Publication Release Date: October 26, 2005
Revision 1.2
- 21 -
ISD4003 SERIES
10. ELECTRICAL CHARACTERISTICS
10.1. PARAMETERS FOR PACKAGED PARTS
TABLE 9: DC PARAMETERS
PARAMETERS
Input Low Voltage
SYMBOLS
MIN[2]
TYP[1]
MAX[2]
UNITS
CONDITIONS
VIL
VCC x 0.2
V
V
V
V
Input High Voltage
Output Low Voltage
VIH
VCC x 0.8
VOL
VOL1
0.4
0.4
IOL = 10 µA
IOL = 1 mA
RAC, INT Output Low
Voltage
Output High Voltage
VCC Current (Operating)
- Playback
VOH
ICC
VCC - 0.4
V
IOH = -10 µA
15
25
1
30
40
10
mA
mA
µA
REXT = ∞ [3]
- Record
REXT = ∞ [3]
[3] [4]
VCC Current (Standby)
Input Leakage Current
ISB
IIL
µA
±1
MISO Tristate Current
IHZ
1
10
µA
KΩ
KΩ
KΩ
dB
Output Load Impedance
ANA IN+ Input Resistance
ANA IN- Input Resistance
REXT
RANA IN+
RANA IN-
5
2.2
40
3.0
56
23
3.8
71
32 mVpp 1 KHz
sinewave input [5]
ANA IN+ or ANA IN- to AUD AARP
OUT Gain
Notes:
[1]
Typical values @ TA = 25°C and VCC = 3.0V.
All Min/Max limits are guaranteed by Winbond via electronical testing or characterization. Not all
specifications are 100 percent tested.
[2]
[3]
VCCA and VCCD connected together.
[4]
[5]
SS = VCCA = VCCD, XCLK = MOSI = VSSA = VSSA and all other pins floating.
Measured with AutoMute feature disabled.
- 22 -
ISD4003 SERIES
TABLE 10: AC PARAMETERS (Packaged Parts)
CHARACTERISTIC
SYMBOLS
MIN[2]
TYP[1]
MAX[2]
UNITS
CONDITIONS
Sampling Frequency
FS
[5]
[5]
[5]
[5]
ISD4003-04M
ISD4003-05M
ISD4003-06M
ISD4003-08M
8.0
6.4
5.3
4.0
KHz
KHz
KHz
KHz
Filter Pass Band
FCF
ISD4003-04M
ISD4003-05M
ISD4003-06M
ISD4003-08M
3.4
2.7
2.3
1.7
KHz
KHz
KHz
KHz
3 dB Roll-Off Point[3][7]
3 dB Roll-Off Point[3][7]
3 dB Roll-Off Point[3][7]
3 dB Roll-Off Point[3][7]
Record Duration
TREC
[6]
[6]
[6]
[6]
ISD4003-04M
ISD4003-05M
ISD4003-06M
ISD4003-08M
4
5
6
8
min
min
min
min
Playback Duration
TPLAY
[6]
[6]
[6]
[6]
ISD4003-04M
ISD4003-05M
ISD4003-06M
ISD4003-08M
4
5
6
8
min
min
min
min
Power-Up Delay
TPUD
ISD4003-04M
ISD4003-05M
25
31.25
37.5
50
msec
msec
msec
msec
ISD4003-06M
ISD4003-08M
Stop or Pause in Record or Play
ISD4003-04M
TSTOP or TPAUSE
50
62.5
75
msec
msec
msec
msec
ISD4003-05M
ISD4003-06M
ISD4003-08M
100
RAC Clock Period
ISD4003-04M
TRAC
[10]
[10]
[10]
[10]
200
250
300
400
msec
msec
msec
msec
ISD4003-05M
ISD4003-06M
ISD4003-08M
RAC Clock Low Time
ISD4003-04M
TRACL
25
31.25
37.5
50
msec
msec
msec
msec
ISD4003-05M
ISD4003-06M
ISD4003-08M
RAC Clock Period in Message
Cueing Mode
TRACM
ISD4003-04M
125
156.3
187.5
250
µsec
µsec
µsec
µsec
ISD4003-05M
ISD4003-06M
ISD4003-08M
RAC Clock Low Time in
Message Cueing Mode
ISD4003-04M
TRACML
15.63
19.53
23.44
31.25
µsec
µsec
µsec
µsec
ISD4003-05M
ISD4003-06M
ISD4003-08M
Total Harmonic Distortion
ANA IN Input Voltage
THD
VIN
1
2
%
32 mVpp 1 KHz
sinewave input [11]
32
mV
Peak-to-Peak [4] [8] [9]
Publication Release Date: October 26, 2005
Revision 1.2
- 23 -
ISD4003 SERIES
Notes:
[1]
Typical values @ TA = 25°C, VCC = 3.0V and timing measurement at 50%.
[2]
All Min/Max limits are guaranteed by Winbond via electrical testing or characterization. Not all
specifications are 100 percent tested.
[3]
[4]
Low-frequency cutoff depends upon the value of external capacitors (see Pin Descriptions)
Single-ended input mode. In the differential input mode, VIN maximum for ANA IN+ and ANA IN- is 16
mVp-p.
[5]
[6]
[7]
Sampling Frequency can vary as much as ±2.25 percent over the commercial temperature and voltage
ranges, and –6/+4 percent over the extended temperature, industrial temperature and voltage ranges.
For greater stability, an external clock can be utilized (see Pin Descriptions)
Playback and Record Duration can vary as much as ±2.25 percent over the commercial temperature and
voltage ranges, and –6/+4 percent over the extended temperature, industrial temperature and voltage
ranges. For greater stability, an external clock can be utilized (see Pin Descriptions)
Filter specification applies to the antialiasing filter and the smoothing filter. Therefore, from input to
output, expect a 6 dB drop by nature of passing through both filters.
The typical output voltage will be approximately 450 mVp-p with VIN at 32 mVp-p.
For optimal signal quality, this maximum limit is recommended.
When a record command is sent, TRAC = TRAC + TRACL on the first row address.
Measured with AutoMute feature disabled.
[8]
[9]
[10]
[11]
- 24 -
ISD4003 SERIES
10.2. PARAMETERS FOR DIE
TABLE 11: DC PARAMETERS
PARAMETERS [6]
SYMBOLS
MIN[2]
TYP[1]
MAX[2]
UNITS
CONDITIONS
Input Low Voltage
VIL
VCC x 0.2
V
V
V
V
Input High Voltage
Output Low Voltage
VIH
VCC x 0.8
VOL
VOL1
0.4
0.4
IOL = 10 µA
IOL = 1 mA
IOH = -10 µA
REXT = ∞ [3]
RAC, INT Output Low
Voltage
Output High Voltage
Operating Current
-Playback
VOH
ICC
VCC - 0.4
V
15
25
1
30
40
10
2
mA
mA
µA
%
-Record
REXT = ∞ [3]
[3] [4]
Standby Current
Total Harmonic Distortion
ISB
THD
1
32 mVpp 1 KHz
sinewave input [5]
32 mVpp 1 KHz
ANA IN+ or ANA IN- to AUD AARP
OUT Gain
23
dB
sinewave input [5]
Notes:
[1]
Typical values @ TA = 25°C and VCC = 3.0V. Sampling Frequency can vary as much as ±2.25 percent
over the commercial temperature and voltage ranges
[2]
All Min/Max limits are guaranteed by Winbond via electrical testing or characterization. Not all
specifications are 100 percent tested.
VCCA and VCCD connected together.
[3]
[4]
SS = VCCA = VCCD, XCLK = MOSI = VSSA = VSSA and all other pins floating.
Measured with AutoMute feature disabled.
The test coverage for die is limited to room temperature testing. The test conditions may differ from that
of packaged parts.
[5]
[6]
Publication Release Date: October 26, 2005
- 25 -
Revision 1.2
ISD4003 SERIES
10.3. SPI AC PARAMETERS
PARAMETER
TABLE 12: AC PARAMETERS[1]
SYMBOL
MIN
TYP
MAX
UNITS
CONDITIONS
TSSS
500
nsec
SS Setup Time
TSSH
500
nsec
SS Hold Time
Data in Setup Time
Data in Hold Time
Output Delay
TDIS
TDIH
TPD
200
200
nsec
nsec
nsec
nsec
µsec
500
500
Output Delay to HighZ [2]
TDF
TSSmin
1
SS HIGH
SCLK High Time
SCLK Low Time
CLK Frequency
TSCKhi
TSCKlow
F0
400
400
nsec
nsec
KHz
1,000
Notes:
[1]
Typical values @ TA = 25°C, VCC = 3.0V and timing measurement at 50%.
Tri-state test condition.
[2]
VCC
6.32K
Ω
MISO
10.91K
Ω
50pF (Includes scope and fixture capacitance)
- 26 -
ISD4003 SERIES
11. TYPICAL APPLICATION CIRCUIT
These application examples are for illustration purposes only. Winbond makes no representation or
warranty that such application will be suitable for production.
Make sure all bypass capacitors are as close as possible to the package.
C9
C8
15-30 pF
15-25 pF
VCC
U2
U1
VCCD
VSSD
39
38
29
30
31
32
33
34
3
2
28
1
27
4
OCS1
OCS2
PD0/RDI
MISO
MOSI
SCLK
SS
R7
µ
C2 0.22
F
F
Ω
10 K
PD1/TD0
PD2/MISO
PD3/MOSI
PD4/SCK
PD5/SS
C1
47
1
2
RESET
IRQ
F
µ
18
23
12
11
13
VCCA
VSSA
VSSA
VSSA
µ
C3 0.22
37
35
28
27
26
25
24
23
22
21
TCAP
PC0
PC1
PC2
PC3
PC4
PC5
C4
C11
1 µF
µ
0.1
F
J1
16
3
2
4
5
1
ANA IN- AUD OUT
ISD4003
LINE OUT
C10
TCMP
R2
1M
µ
F17
0.1
ANA IN+
VCC
R1
10K
68HC705C8PPC6
24
25
PC7
RAC
14
AM CAP
R4
R3 100
100K POT
12
13
14
15
16
17
18
19
PB0
PB1
PB2
PB3
PB4
PB5
PB6
PB7
INT
1
R6
3
C5
Ω
47 K
1µF
2
U3
11
10
9
26
PA0
PA1
PA2
PA3
PA4
PA5
PA6
PA7
PD7
XCLK
13
11
-IN
GAIN-OUT
V01
J4
3
2
4
5
1
10
14
+IN
EXT
8
SPEAKER
15
12
V02
VDD
PDIP / SOIC
VCC
5
BYPASS
7
6
6
7
HP-IN1
HP-IN2
C6
C7
µ
1
F
1
4
8
9
GND
GND
GND
GND
GND
µ
F
.1
5
4
3
2
HPSENSE
R5
Ω
47 K
SHUTDOWN
16
LM4860M
FIGURE 9: APPLICATION EXAMPLE USING SPI
Publication Release Date: October 26, 2005
Revision 1.2
- 27 -
ISD4003 SERIES
VCC
U2
U1
3
22
27
4
MISO
VCCD
D3
23
24
GND
µ
C2 0.22
F
F
2
28
1
21
20
19
MOSI
SCLK
SS
D2
D1
D0
VSSD
C1
47
F
µ
28
27
26
G3
G2
G1
18
23
VCCA
VSSA
RESET
C3 0.22µ
12
11
VSSA
VSSA
INT 25
3
C4
SI
SK
G7
SO
C9
µ
1
F
µ
0.1
F
J1
16
13
2
4
1
3
2
4
5
1
ANA IN-
AUD OUT
VCC
COP 820C
LINE OUT
ISD4003
6
VCC
R2
1M
C8
µ
0.1
L7
L6
L5
L4
F 17
24
18
17
16
ANA IN+
RAC
R1
10K
R7
R4
R3 100
Ω
3.3 K
14
100K POT
AM CAP
1
3
5
7
8
15
CLI
10
C5
2
U3
14
13
L3
L2
L1
L0
25
26
1µ F
INT
13
11
-IN
GAIN-OUT
V01
11
J4
3
2
4
5
1
10
14
+IN
C10
82 pF
EXT
SPEAKER
9
12
11
12
13
VCC
XCLK
VCC
15
12
V02
VDD
5
10
BYPASS
6
7
HP-IN1
HP-IN2
C6
R6
4.7 K
C7
.1
µ
1
F
R5
4.7 K
Ω
1
4
8
9
GND
GND
GND
GND
GND
µ
F
Ω
3
2
HPSENSE
PDIP / SOIC
SHUTDOWN
16
LM4860M
FIGURE 10: APPLICATION EXAMPLE USING MICROWIRE
- 28 -
ISD4003 SERIES
VCC
U2
U1
3
22
27
4
MISO
VCCD
D3
23
24
GND
µ
C2 0.22
F
F
2
28
1
21
20
19
MOSI
SCLK
SS
D2
D1
D0
VSSD
C1
47
F
µ
28
27
26
G3
G2
G1
18
23
VCCA
VSSA
RESET
C3 0.22µ
12
11
VSSA
VSSA
INT 25
3
C4
SI
SK
G7
SO
C9
µ
1
F
µ
0.1
F
J1
16
13
2
4
1
3
2
4
5
1
ANA IN-
AUD OUT
VCC
COP 820C
LINE OUT
ISD4003
6
VCC
R2
1M
C8
µ
0.1
L7
L6
L5
L4
F 17
24
18
17
16
ANA IN+
RAC
R1
10K
R7
R4
R3 100
Ω
3.3 K
14
100K POT
AM CAP
1
3
5
7
8
15
CLI
10
C5
2
U3
14
13
L3
L2
L1
L0
25
26
1µ F
INT
13
11
-IN
GAIN-OUT
V01
11
J4
3
2
4
5
1
10
14
+IN
C10
82 pF
EXT
SPEAKER
9
12
11
12
13
VCC
XCLK
VCC
15
12
V02
VDD
5
10
BYPASS
6
7
HP-IN1
HP-IN2
C6
R6
4.7 K
C7
.1
µ
1
F
R5
4.7 K
Ω
1
4
8
9
GND
GND
GND
GND
GND
µ
F
Ω
3
2
HPSENSE
PDIP / SOIC
SHUTDOWN
16
LM4860M
FIGURE 11: APPLICATION EXAMPLE USING SPI PORT ON MICROCONTROLLER
Publication Release Date: October 26, 2005
Revision 1.2
- 29 -
ISD4003 SERIES
12. PACKAGING AND DIE INFORMATION
12.1. 28-LEAD 300-MIL PLASTIC SMALL OUTLINE IC (SOIC)
28
1
26 25
3 4
23 22 21 20 19 18 17
15
16
27
2
24
5
6
7
9 10 11 12 13 14
8
A
G
C
B
D
F
E
H
INCHES
Nom
MILLIMETERS
Nom
Min
Max
0.711
0.104
0.299
0.0115
0.019
Min
Max
18.06
2.64
7.59
0.29
0.48
A
B
C
D
E
F
0.701
0.097
0.292
0.005
0.014
0.706
0.101
0.296
0.009
0.016
0.050
0.406
0.032
17.81
2.46
7.42
0.127
0.35
17.93
2.56
7.52
0.22
0.41
1.27
10.31
0.81
G
H
0.400
0.024
0.410
0.040
10.16
0.61
10.41
1.02
Note: Lead coplanarity to be within 0.004 inches.
- 30 -
ISD4003 SERIES
12.2. 28-LEAD 600-MIL PLASTIC DUAL INLINE PACKAGE (PDIP)
INCHES
MILLIMETERS
Min
Nom
1.450
0.150
0.070
Max
Min
Nom
36.83
3.81
Max
A
B1
B2
C1
C2
D
1.445
1.455
36.70
36.96
0.065
0.600
0.530
0.075
0.625
0.550
0.19
1.65
15.24
13.46
1.78
1.91
15.88
13.97
4.83
0.540
13.72
D1
E
F
G
H
J
S
q
0.015
0.125
0.015
0.055
0.38
3.18
0.38
1.40
0.135
0.022
0.065
3.43
0.56
1.62
0.018
0.060
0.100
0.010
0.075
0.46
1.52
2.54
0.25
1.91
0.008
0.070
0°
0.012
0.080
15°
0.20
1.78
0°
0.30
2.03
15°
Publication Release Date: October 26, 2005
Revision 1.2
- 31 -
ISD4003 SERIES
12.3. 28-LEAD 8X13.4MM PLASTIC THIN SMALL OUTLINE PACKAGE (TSOP) TYPE 1 - IQC
HD
D
c
e
E
b
θ
A
A
1 A
2
L
Y
L
1
Dimension in Inches Dimension in mm
Symbol
Max.
1.20
Min. Nom. Max. Min. Nom.
0.047
A
0.006
0.041
0.05
0.002
0.035
0.15
1
A
0.040
0.95
0.17
1.00
0.20
2
A
1.05
0.27
0.007 0.008 0.011
b
0.10
0.004
0.461
0.008
0.465 0.469
0.15
11.80
8.00
0.21
11.90
0.006
c
11.70
D
E
0.311 0.315 0.319
0.520 0.528 0.536
0.022
8.10
7.90
13.60
13.40
13.20
D
H
0.55
0.60
0.80
e
L
0.50
0.70
0.020
0.028
0.024
0.031
1
L
0.000
0
0.00
0
0.10
5
0.004
5
Y
3
3
θ
- 32 -
ISD4003 SERIES
12.4. 28-LEAD 8X13.4MM PLASTIC THIN SMALL OUTLINE PACKAGE (TSOP) TYPE 1
1
28
2
27
3
2
6
25
4
F
5
24
6
23
7
22
8
21
20
9
1
9
10
18
11
17
12
16
13
15
14
I
INCHES
Nom
MILLIMETERS
Nom
Min
Max
Min
Max
13.60
11.90
8.10
0.15
0.27
A
B
C
D
E
F
G
H
I
0.520
0.461
0.311
0.002
0.007
0.528
0.465
0.315
0.535
0.469
0.319
0.006
0.011
13.20
11.70
7.90
0.05
0.17
13.40
11.80
8.00
0.009
0.0217
0.039
3°
0.22
0.55
1.00
3°
0.037
0°
0.041
6°
0.95
0°
1.05
6°
0.020
0.004
0.022
0.028
0.008
0.50
0.10
0.55
0.70
0.21
J
Note: Lead coplanarity to be within 0.004 inches.
Publication Release Date: October 26, 2005
Revision 1.2
- 33 -
ISD4003 SERIES
12.5. DIE INFORMATION
ISD4003 Series
o
Die Dimensions (with scribe line) [1]
VCCD
MOSI
MISO
SCLK
SS
X: 166.6 ± 1 mils
Y: 274.9 ± 1 mils
VSSD
VSSD
INT
RAC
VCCD
XCLK
VSSA
o
o
Die Thickness [2]
11.5 ± 0.5 mils
Pad Opening
Single pad: 90 x 90 microns
Double pad: 180 x 90 microns
ISD4003
≈
≈
[3]
[3]
VSSA
VCCA
AUD OUT
AM CAP
ANA IN-
ANA IN+
[3]
[3]
VSSA
VCCA
VSSA
Notes:
[1]
The backside of die is internally connected to VSS. It MUST NOT be connected to any other potential or
damage may occur.
[2]
[3]
Die thickness is subject to change, please contact Winbond as this thickness may change in the future.
Double bond is recommended if treated as one pad.
- 34 -
ISD4003 SERIES
ISD4003 SERIES PAD COORDINATIONS
(with respect to die center)
Pad
Pad Description
Analog Ground
X Axis (µm)
1885.2
Y Axis (µm)
3273.7
VSSA
RAC
Row Address Clock
Interrupt
1483.8
794.8
3273.7
3273.7
INT
XCLK
VCCD
VCCD
SCLK
External Clock Input
Digital Power Supply
Digital Power Supply
Slave Clock
564.8
384.9
169.5
-14.7
3273.7
3273.7
3273.7
3273.7
3273.7
Slave Select
-198.1
SS
MOSI
MISO
VSSD
VSSD
Master Out Slave In
Master In Slave Out
Digital Ground
Digital Ground
Analog Ground
Analog Ground
Analog Ground
Audio Output
AutoMute
Inverting Analog Input
Noninverting Analog Input
Analog Power Supply
Analog Power Supply
-1063.7
-1325.6
-1665.3
-1836.9
-1943.1
-1853.1
-1599.9
281.9
3273.7
3273.7
3273.7
3273.7
-3272.4
-3272.4
-3272.4
-3272.4
-3272.4
-3272.4
-3272.4
-3272.4
-3272.4
[1]
VSSA
VSSA
VSSA
[1]
AUD OUT
AM CAP
ANA IN-
ANA IN+
577.3
1449.3
1603.5
1853.7
1943.7
[1]
VCCA
VCCA
[1]
Note:
[1]
Double bond recommended if treated as one pad.
Publication Release Date: October 26, 2005
Revision 1.2
- 35 -
ISD4003 SERIES
13. ORDERING INFORMATION
ISD4003-
Product Family :
ISD4000 Family
Special Temperature Field :
Blank = Commercial Package (0°C to + 70°C)
or Commercial Die (0°C to + 50°C)
Product Series :
D
I
=
=
Extended (-20°C to + 70°C)
Industrial (-40°C to + 85°C)
03
=
Third Series (4-8 min)
Duration :
Leaded or Lead-Free Type:
Blank = Leaded
04M
05M
06M
08M
=
=
=
=
4 minutes
5 minutes
6 minutes
8 minutes
Y
= Lead-Free
Packaged Units / Die :
X
P
S
E
=
=
=
=
Die
28-Lead 600-mil Plastic Dual Inline Package (PDIP)
28-Lead 300-mil Plastic Small Outline Package (SOIC)
28-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type 1
When ordering the devices, please refer to the following valid ordering numbers. For the shaded part
numbers, please contact the local Winbond Sales Representatives for availability information.
Type Duration
Package
Die
4 Minutes
Part #
5 Minutes
Part #
6 Minutes
Part # Order #
8 Minutes
Part #
Order #
I4304X
I4304P
I4304S
I4304SI
I4304E
Order #
I4305X
I4305P
I4305S
I4305SI
I4305E
Order #
I4308X
I4308P
I4308S
ISD4003-04MX
ISD4003-04MP
ISD4003-04MS
ISD4003-04MSI
ISD4003-04ME
ISD4003-04MED
ISD4003-04MEI
ISD4003-04MPY
ISD4003-04MSY
ISD4003-05MX
ISD4003-05MP
ISD4003-05MS
ISD4003-05MSI
ISD4003-05ME
ISD4003-06MX I4306X
ISD4003-06MP I4306P
ISD4003-06MS I4306S
ISD4003-06MSI I4306SI
ISD4003-06ME I4306E
ISD4003-08MX
ISD4003-08MP
ISD4003-08MS
PDIP
SOIC
ISD4003-08MSI I4308SI
ISD4003-08ME I4308E
TSOP
I4304ED ISD4003-05MED I4305ED ISD4003-06MED I4306ED
I4304EI ISD4003-05MEI I4305EI ISD4003-06MEI I4306EI
ISD4003-08MED I4308ED
ISD4003-08MEI I4308EI
ISD4003-08MPY I4308PY
ISD4003-08MSY I4308SY
I4304PY ISD4003-05MPY
I4304SY ISD4003-05MSY
I4305PY ISD4003-06MP I4306PY
I4305SY ISD4003-06MS I4306SY
PDIP
SOIC
ISD4003-04MSYI I4304SYI ISD4003-05MSYI I4305SYI ISD4003-06MSI I4306SYI ISD4003-08MSYI I4308SYI
ISD4003-04MEY I4304EY ISD4003-05MEY I4305EY ISD4003-06ME I4306EY ISD4003-08MEY I4308EY
ISD4003-04MEYI I4304EYI ISD4003-05MEYI I4305EYI ISD4003-06MEI I4306EYI ISD4003-08MEYI I4308EYI
TSOP
For the latest product information, access Winbond worldwide website at http://www.winbond-usa.com
- 36 -
ISD4003 SERIES
14. VERSION HISTORY
VERSION
DATE
DESCRIPTION
0
June 2000 Initial version
1.0
Jan. 2004 Reformat the document.
Add note for typical filter pass band.
Add memory architecture description.
Remove all CSP info.
Revise RAC timing parameter for MC.
Revise AutoMute: playback only.
Revise SPI, opcodes sections, record & playback steps.
Rename TRACLO to TRACL
.
Revise AARP parameter.
Revise DC & AC parameters tables for die.
Revise die: (x,y) coordinates.
Figures 9-11: revise VCCA and VCCD pin #.
Revise Ordering Information.
1.1
1.2
Apr. 2005
Oct. 2005
Add lead-free parts.
Revise the Ordering information.
Update disclaim section.
Revise Packaging information.
Publication Release Date: October 26, 2005
Revision 1.2
- 37 -
ISD4003 SERIES
Winbond products are not designed, intended, authorized or warranted for use as components in systems or equipment
intended for surgical implantation, atomic energy control instruments, airplane or spaceship instruments, transportation
instruments, traffic signal instruments, combustion control instruments, or for other applications intended to support or
sustain life. Furthermore, Winbond products are not intended for applications wherein failure of Winbond products could
result or lead to a situation wherein personal injury, death or severe property or environmental damage could occur.
Winbond customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify Winbond for any damages resulting from such improper use or sales.
The contents of this document are provided only as a guide for the applications of Winbond products. Winbond makes no
representation or warranties with respect to the accuracy or completeness of the contents of this publication and
reserves the right to discontinue or make changes to specifications and product descriptions at any time without notice.
No license, whether express or implied, to any intellectual property or other right of Winbond or others is granted by this
publication. Except as set forth in Winbond's Standard Terms and Conditions of Sale, Winbond assumes no liability
whatsoever and disclaims any express or implied warranty of merchantability, fitness for a particular purpose or
infringement of any Intellectual property.
The contents of this document are provided “AS IS”, and Winbond assumes no liability whatsoever and disclaims any
express or implied warranty of merchantability, fitness for a particular purpose or infringement of any Intellectual
property. In no event, shall Winbond be liable for any damages whatsoever (including, without limitation, damages for
loss of profits, business interruption, loss of information) arising out of the use of or inability to use the contents of this
documents, even if Winbond has been advised of the possibility of such damages.
Application examples and alternative uses of any integrated circuit contained in this publication are for illustration only
and Winbond makes no representation or warranty that such applications shall be suitable for the use specified.
The 100-year retention and 10K record cycle projections are based upon accelerated reliability tests, as published in the
Winbond Reliability Report, and are neither warranted nor guaranteed by Winbond. This product incorporates
SuperFlash®.
Information contained in this ISD® ChipCorder® datasheet supersedes all data for the ISD ChipCorder products
published by ISD® prior to August, 1998.
This datasheet and any future addendum to this datasheet is(are) the complete and controlling ISD® ChipCorder®
product specifications. In the event any inconsistencies exist between the information in this and other product
documentation, or in the event that other product documentation contains information in addition to the information in
this, the information contained herein supersedes and governs such other information in its entirety. This datasheet is
subject to change without notice.
Copyright© 2005, Winbond Electronics Corporation. All rights reserved. ChipCorder® and ISD® are trademarks of
Winbond Electronics Corporation. SuperFlash® is the trademark of Silicon Storage Technology, Inc. All other trademarks
are properties of their respective owners.
Headquarters
Winbond Electronics Corporation America
Winbond Electronics (Shanghai) Ltd.
No. 4, Creation Rd. III
Science-Based Industrial Park,
Hsinchu, Taiwan
2727 North First Street, San Jose,
CA 95134, U.S.A.
27F, 299 Yan An W. Rd. Shanghai,
200336 China
TEL: 1-408-9436666
TEL: 86-21-62365999
FAX: 86-21-62356998
TEL: 886-3-5770066
FAX: 1-408-5441797
FAX: 886-3-5665577
http://www.winbond-usa.com/
http://www.winbond.com.tw/
Taipei Office
Winbond Electronics Corporation Japan
Winbond Electronics (H.K.) Ltd.
9F, No. 480, Pueiguang Rd.
Neihu District
7F Daini-ueno BLDG. 3-7-18
Shinyokohama Kohokuku,
Yokohama, 222-0033
TEL: 81-45-4781881
Unit 9-15, 22F, Millennium City,
No. 378 Kwun Tong Rd.,
Kowloon, Hong Kong
Taipei, 114 Taiwan
TEL: 886-2-81777168
FAX: 886-2-87153579
TEL: 852-27513100
FAX: 81-45-4781800
FAX: 852-27552064
Please note that all data and specifications are subject to change without notice.
All the trademarks of products and companies mentioned in this datasheet belong to their respective owners.
- 38 -
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