W29C020CT90B [WINBOND]
256K X 8 CMOS FLASH MEMORY; 256K ×8 CMOS FLASH MEMORY型号: | W29C020CT90B |
厂家: | WINBOND |
描述: | 256K X 8 CMOS FLASH MEMORY |
文件: | 总21页 (文件大小:194K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
W29C020C
256K ´ 8 CMOS FLASH MEMORY
GENERAL DESCRIPTION
´
The W29C020C is a 2-megabit, 5-volt only CMOS flash memory organized as 256K 8 bits. The
device can be written (erased and programmed) in-system with a standard 5V power supply. A 12-volt
PP
V
is not required. The unique cell architecture of the W29C020C results in fast write
(erase/program) operations with extremely low current consumption compared to other comparable 5-
volt flash memory products. The device can also be written (erased and programmed) by using
standard EPROM programmers.
FEATURES
·
·
· Single 5-volt write (erase and program)
operations
Software and hardware data protection
Low power consumption
· Fast page-write operations
- Active current: 25 mA (typ.)
-
-
128 bytes per page
-
m
Standby current: 20 A (typ.)
Page write (erase/program) cycle: 10 mS
(max.)
· Automatic write (erase/program) timing with
internal V generation
PP
-
Effective byte-write (erase/program) cycle
· End of write (erase/program) detection
m
time: 39 S
-
-
Toggle bit
-
Optional software-protected data write
Data polling
· Fast chip-erase operation: 50 mS
· Two 8 KB boot blocks with lockout
· Whole chip cycling: 10K (typ.)
· Read access time: 70/90/120 nS
· Twenty-year data retention
· Latched address and data
· All inputs and outputs directly TTL compatible
· JEDEC standard byte-wide pinouts
· Available packages: 32-pin 600 mil DIP, 32-pin
TSOP, and 32-pin PLCC
Publication Release Date: April 2000
- 1 -
Revision A2
W29C020C
PIN CONFIGURATIONS
BLOCK DIAGRAM
V
DD
32
31
30
29
28
27
1
2
3
VDD
WE
NC
A16
A15
A12
A7
VSS
A17
A14
4
5
CE
OE
WE
DQ0
.
.
A13
6
OUTPUT
BUFFER
A6
A8
CONTROL
7
26
25
24
23
22
21
20
19
A9
A5
32-pin
DIP
8
A11
A4
A3
A2
A1
DQ7
9
OE
10
A10
11
12
13
CE
DQ7
A0
DQ0
DQ1
DQ2
GND
8K Byte Boot Block (Optional)
DQ6
DQ5
DQ4
DQ3
A0
.
14
15
16
18
17
CORE
ARRAY
.
.
DECODER
A
1
2
A
1
6
V
D
D
/
W
E
A
1
7
A
1
5
8K Byte Boot Block (Optional)
N
C
A17
3
4
2
1
32 31 30
5
6
7
8
9
29
28
27
26
25
24
23
22
21
A14
A7
A6
A5
A4
A3
A2
A1
A0
A13
A8
32-pin
PLCC
A9
A11
10
11
12
13
OE
A10
CE
DQ7
DQ0
PIN DESCRIPTION
14 15 16 17 18
19 20
D
Q
1
D
Q
2
G
N
D
D
Q
4
D
Q
3
D
Q
5
D
Q
6
SYMBOL
PIN NAME
Address Inputs
Data Inputs/Outputs
-
A0 A17
1
2
3
4
5
32
OE
A10
A11
A9
A8
A13
A14
A17
-
DQ0 DQ7
31
30
29
28
27
26
25
CE
DQ7
DQ6
DQ5
Chip Enable
Output Enable
Write Enable
Power Supply
Ground
CE
OE
WE
6
7
8
DQ4
DQ3
GND
DQ2
DQ1
DQ0
A0
A1
A2
A3
WE
VDD
NC
A16
32-pin
TSOP
9
10
24
23
22
21
20
19
18
17
11
12
13
14
15
16
A15
A12
A7
A6
A5
DD
V
A4
GND
NC
No Connection
- 2 -
W29C020C
FUNCTIONAL DESCRIPTION
Read Mode
CE
OE
, both of which have to be low for
The read operation of the W29C020C is controlled by
and
CE
CE
the host to obtain data from the outputs.
is used for device selection. When
is high, the chip
is the output control and is used to gate
OE
is de-selected and only standby power will be consumed.
CE
OE
is high.
data from the output pins. The data bus is in high impedance state when either
Refer to the read cycle timing waveforms for further details.
or
Page Write Mode
The W29C020C is written (erased/programmed) on a page basis. Every page contains 128 bytes of
data. If a byte of data within a page is to be changed, data for the entire page must be loaded into the
device. Any byte that is not loaded will be erased to "FF hex" during the write operation of the page.
CE
WE
OE
low and high. The write procedure
The write operation is initiated by forcing
and
consists of two steps. Step 1 is the byte-load cycle, in which the host writes to the page buffer of the
device.
Step 2 is an internal write (erase/program) cycle, during which the data in the page buffers are
simultaneously written into the memory array for non-volatile storage.
CE
WE
,
During the byte-load cycle, the addresses are latched by the falling edge of either
or
CE WE
whichever occurs last. The data are latched by the rising edge of either
or
, whichever
BLC
occurs first. If the host loads a second byte into the page buffer within a byte-load cycle time (T
) of
200 mS after the initial byte-load cycle, the W29C020C will stay in the page load cycle. Additional
bytes can then be loaded consecutively. The page load cycle will be terminated and the internal write
(erase/program) cycle will start if no additional byte is loaded into the page buffer A7 to A17 specify
the page address. All bytes that are loaded into the page buffer must have the same page address.
A0 to A6 specify the byte address within the page. The bytes may be loaded in any order; sequential
loading is not required.
In the internal write cycle, all data in the page buffers, i.e., 128 bytes of data, are written
simultaneously into the memory array. Before the completion of the internal write cycle, the host is
free to perform other tasks such as fetching data from other locations in the system to prepare to
write the next page.
Software-protected Data Write
The device provides a JEDEC-approved optional software-protected data write. Once this scheme is
enabled, any write operation requires a three-byte command sequence (with specific data to a
specific address) to be performed before the data load operation. The three-byte load command
sequence begins the page load cycle, without which the write operation will not be activated. This
write scheme provides optimal protection against inadvertent write cycles, such as cycles triggered by
noise during system power-up and power-down.
The W29C020C is shipped with the software data protection enabled. To enable the software data
protection scheme, perform the three-byte command cycle at the beginning of a page load cycle. The
device will then enter the software data protection mode, and any subsequent write operation must be
preceded by the three-byte command sequence cycle. Once enabled, the software data protection
will remain enabled unless the disable commands are issued. A power transition will not reset the
software data protection feature. To reset the device to unprotected mode, a six-byte command
Publication Release Date: April 2000
- 3 -
Revision A2
W29C020C
sequence is required. For information about specific codes, see the Command Codes for Software
Data Protection in the Table of Operating Modes. For information about timing waveforms, see the
timing diagrams below.
Hardware Data Protection
The integrity of the data stored in the W29C020C is also hardware protected in the following ways:
WE
(1) Noise/Glitch Protection: A
pulse of less than 15 nS in duration will not initiate a write cycle.
DD
DD
(2) V Power Up/Down Detection: The write operation is inhibited when V is less than 2.5V.
OE
CE
WE
high will inhibit the write operation. This
(3) Write Inhibit Mode: Forcing
low,
high, or
prevents inadvertent writes during power-up or power-down periods.
DD
DD
(4) V power-on delay: When V reaches its sense level, the device will automatically timeout for
5 mS before any write (erase/program) operation.
Chip Erase Modes
The entire device can be erased by using a six-byte software command code. See the Software Chip
Erase Timing Diagram.
Boot Block Operation
There are two boot blocks (8K bytes each) in this device, which can be used to store boot code. One
of them is located in the first 8K bytes and the other is located in the last 8K bytes of the memory.
The first 8K or last 8K of the memory can be set as a boot block by using a seven-byte command
sequence.
See Command Codes for Boot Block Lockout Enable for the specific code. Once this feature is set
the data for the designated block cannot be erased or programmed (programming lockout); other
memory locations can be changed by the regular programming method. Once the boot block
programming lockout feature is activated, the chip erase function will be disabled. In order to detect
whether the boot block feature is set on the two 8K blocks, users can perform a six-byte command
sequence: enter the product identification mode (see Command Codes for Identification/Boot Block
Lockout Detection for specific code), and then read from address "00002 hex" (for the first 8K bytes)
or "3FFF2 hex" (for the last 8K bytes). If the output data is "FF hex," the boot block programming
lockout feature is activated; if the output data is "FE hex," the lockout feature is deactivated and the
block can be programmed.
To return to normal operation, perform a three-byte command sequence to exit the identification
mode. For the specific code, see Command Codes for Identification/Boot Block Lockout Detection.
Data Polling (DQ7)- Write Status Detection
The W29C020C includes a data polling feature to indicate the end of a write cycle. When the
W29C020C is in the internal write cycle, any attempt to read DQ7 from the last byte loaded during the
page/byte-load cycle will receive the complement of the true data. Once the write cycle is completed.
DQ7 will show the true data. See the OE Polling Timing Diagram.
- 4 -
W29C020C
Toggle Bit (DQ6)- Write Status Detection
In addition to data polling, the W29C020C provides another method for determining the end of a write
cycle. During the internal write cycle, any consecutive attempts to read DQ6 will produce alternating
0's and 1's. When the write cycle is completed, this toggling between 0's and 1's will stop. The device
is then ready for the next operation. See Toggle Bit Timing Diagram.
Product Identification
The product ID operation outputs the manufacturer code and device code. The programming
equipment automatically matches the device with its proper erase and programming algorithms.
The manufacturer and device codes can be accessed through software or by hardware operation. In
the software access mode, a six-byte command sequence can be used to access the product ID. A
read from address "00000 hex" outputs the manufacturer code "DA hex." A read from address "00001
hex" outputs the device code "45 hex." The product ID operation can be terminated by a three-byte
command sequence.
CE
OE
WE
low,
In the hardware access mode, access to the product ID is activated by forcing
high, and raising A9 to 12 volts.
and
TABLE OF OPERATING MODES
Operating Mode Selection
Operating Range: 0 to 70 C (Ambient Temperature), VDD = 5V 10%, VSS = 0V, VHH = 12V
°
±
MODE
PINS
ADDRESS
DQ.
CE OE WE
IL
IL
IH
IN
IN
Read
V
V
V
V
A
A
X
X
X
X
A
Dout
IL
IH
IL
V
Write
V
Din
IH
Standby
V
X
X
High Z
IL
V
OUT
Write Inhibit
X
X
High Z/D
High Z/D
High Z
IH
V
OUT
X
X
X
IH
Output Disable
V
V
X
IL
IH
IL
V
IN
IN
D
5-Volt Software Chip
Erase
V
V
V
IL
IL
IL
V
IH
Product ID
V
V
Manufacturer Code DA
(Hex)
IL
IL
-
A0 = V ; A1 A17 = V ;
A9 = V
HH
IL
V
IH
Device Code
45 (Hex)
IH
IL
-
A0 = V ; A1 A17 = V ;
A9 = V
HH
Publication Release Date: April 2000
Revision A2
- 5 -
W29C020C
Command Codes for Software Data Protection
BYTE SEQUENCE
TO ENABLE PROTECTION
TO DISABLE PROTECTION
ADDRESS
5555H
DATA
ADDRESS
5555H
DATA
AAH
55H
0 Write
1 Write
2 Write
3 Write
4 Write
5 Write
AAH
55H
A0H
2AAAH
5555H
2AAAH
5555H
5555H
2AAAH
5555H
80H
-
-
-
-
-
-
AAH
55H
20H
Software Data Protection Acquisition Flow
Software Data Protection
Enable Flow
Software Data Protection
Disable Flow
Load data AA
to
address 5555
Load data AA
to
address 5555
Load data 55
to
address 2AAA
Load data 55
to
address 2AAA
Load data A0
to
address 5555
Load data 80
to
address 5555
Load data AA
to
address 5555
Sequentially load
up to 128 bytes
of page data
(Optional page-load
operation)
Load data 55
to
Pause 10 mS
Exit
address 2AAA
Load data 20
to
address 5555
Pause 10 mS
Exit
Notes for software program code:
Data Format: DQ7 DQ0 (Hex)
-
Address Format: A14 A0 (Hex)
-
- 6 -
W29C020C
Command Codes for Software Chip Erase
BYTE SEQUENCE
0 Write
ADDRESS
DATA
AAH
55H
5555H
2AAAH
5555H
5555H
2AAAH
5555H
1 Write
2 Write
80H
3 Write
AAH
55H
4 Write
5 Write
10H
Software Chip Erase Acquisition Flow
Load data AA
to
address 5555
Load data 55
to
address 2AAA
Load data 80
to
address 5555
Load data AA
to
address 5555
Load data 55
to
address 2AAA
Load data 10
to
address 5555
Pause 50 mS
Exit
Notes for software chip erase:
Data Format: DQ7 DQ0 (Hex)
-
Address Format: A14 A0 (Hex)
-
Publication Release Date: April 2000
Revision A2
- 7 -
W29C020C
Command Codes for Product Identification and Boot Block Lockout Detection
BYTE
SEQUENCE
ALTERNATE PRODUCT (7)
IDENTIFICATION/BOOT BLOCK
LOCKOUT DETECTION ENTRY
SOFTWARE PRODUCT
IDENTIFICATION/BOOT BLOCK
LOCKOUT DETECTION ENTRY
SOFTWARE PRODUCT
IDENTIFICATION/BOOT BLOCK
LOCKOUT DETECTION EXIT
ADDRESS
DATA
ADDRESS
5555H
DATA
AAH
55H
ADDRESS
DATA
0 Write
1 Write
2 Write
3 Write
4 Write
5 Write
5555
AA
55
90
-
5555H
AAH
2AAA
2AAAH
5555H
2AAAH
55H
5555
80H
5555H
F0H
-
-
-
5555H
AAH
55H
-
-
-
-
-
-
-
2AAAH
5555H
-
60H
m
S
m
S
m
S
Pause 10
Pause 10
Pause 10
Software Product Identification and Boot Block Lockout Detection Acquisition Flow
Product
Product
Identification
Entry (1)
Product
Identification
Exit (1)
Identification
and Boot Block
Lockout Detection
Mode (3)
Load data AA
to
address 5555
(2)
(2)
(4)
(5)
Load data 55
to
Load data AA
Read address = 00000
data = DA
to
address 5555
address 2AAA
Load data 80
to
address 5555
Load data 55
to
address 2AAA
Read address = 00001
data = 45
Load data AA
to
address 5555
Load data F0
to
address 5555
Read address = 00002
data = FF/FE
Load data 55
to
address 2AAA
Read address = 3FFF2
data = FF/FE
m
S
Pause 10
(6)
Load data 60
to
address 5555
Normal Mode
Pause 10
m
Notes for software product identification/boot block lockout detection:
-
-
(1) Data Format: DQ7 DQ0 (Hex); Address Format: A14 A0 (Hex)
-
(2) A1 A16 = VIL; manufacture code is read for A0 = VIL; device code is read for A0 = VIH.
(3) The device does not remain in identification and boot block (address 0002 Hex/3FFF2 Hex respond to first 8K/last 8K) lockout detection mode if
power down.
(4), (5) If the output data is "FF Hex," the boot block programming lockout feature is activated; if the output data "FE Hex," the lockout feature is
inactivated and the block can be programmed.
(6) The device returns to standard operation mode.
(7) This product supports both the JEDEC standard 3 byte command code sequence and original 6 byte command code sequence. For new
designs, Winbond recommends that the 3 byte command code sequence be used.
- 8 -
W29C020C
Command Codes for Boot Block Lockout Enable
BYTE SEQUENCE
BOOT BLOCK LOCKOUT FEATURE SET ON
FIRST 8K ADDRESS BOOT BLOCK
BOOT BLOCK LOCKOUT FEATURE SET
ON LAST 8K ADDRESS BOOT BLOCK
ADDRESS
5555H
DATA
AAH
55H
80H
AAH
55H
40H
00H
ADDRESS
5555H
DATA
AAH
55H
0 Write
1 Write
2 Write
3 Write
4 Write
5 Write
6 Write
2AAAH
5555H
2AAAH
5555H
80H
5555H
5555H
AAH
55H
2AAAH
5555H
2AAAH
5555H
40H
00000H
3FFFFH
FFH
Pause 10
S
m
Pause 10 S
m
Boot Block Lockout Enable Acquisition Flow
Boot Block Lockout
Feature Set on First 8K
Address Boot Block
Boot Block Lockout
Feature Set on Last 8K
Address Boot Block
Load data AA
to
address 5555
Load data AA
to
address 5555
Load data 55
to
address 2AAA
Load data 55
to
address 2AAA
Load data 80
to
address 5555
Load data 80
to
address 5555
Load data AA
to
address 5555
Load data AA
to
address 5555
Load data 55
to
address 2AAA
Load data 55
to
address 2AAA
Load data 40
to
address 5555
Load data 40
to
address 5555
Load data 00
to
address 00000
Load data FF
to
address 3FFFF
Pause 10 mS
Pause 10 mS
Notes for boot block lockout enable:
1. Data Format: DQ7 DQ0 (Hex)
-
2. Address Format: A14 A0 (Hex)
-
3. If you have any questions about this commend sequence, please contact the local distributor or Winbond Electronics Corp.
Publication Release Date: April 2000
- 9 -
Revision A2
W29C020C
DC CHARACTERISTICS
Absolute Maximum Ratings
PARAMETER
RATING
UNIT
SS
Power Supply Voltage to V Potential
-0.5 to +7.0
0 to +70
V
Operating Temperature
°
C
Storage Temperature
-65 to +150
°
C
DD
D.C. Voltage on Any Pin to Ground Potential Except A9
Transient Voltage (<20 nS ) on Any Pin to Ground Potential
-0.5 to V +1.0
V
DD
-1.0 to V +1.0
V
V
-0.5 to 12.5
OE
Voltage on A9 and
Pin to Ground Potential
Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the
device.
Operating Characteristics
DD
SS
A
(V = 5.0V 10 , V = 0V, T = 0 to 70 C)
±
%
°
PARAMETER
SYM.
TEST CONDITIONS
LIMITS
UNIT
MIN.
TYP.
MAX.
CC
I
-
-
50
mA
CE OE
WE
= V ,
Power Supply Current
IL
= V ,
IH
=
all DQs open
IL IH
Address inputs = V /V ,
at f = 5 MHz
SB
I
I
1
-
-
2
3
mA
DD
CE
Standby V Current
IH
= V , all DQs open
(TTL input)
IL IH
Other inputs = V /V
SB
2
20
100
m
A
DD
CE
Standby V Current
DD
= V -0.3V, all DQs
open
(CMOS input)
LI
IN
DD
DD
I
I
V
V
= GND to V
-
-
-
-
-
-
-
-
-
10
10
0.8
-
m
A
Input Leakage Current
Output Leakage Current
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage
LO
IL
IN
= GND to V
m
A
V
V
V
V
V
-
V
-
IH
2.0
-
V
V
V
V
-
OL
OL
OH
OH
I
I
I
= 2.0 mA
0.45
-
OH1
OH2
2.4
4.2
m
= -400 A
-
CC
= -100 mA; V = 4.5V
Output High Voltage
CMOS
- 10 -
W29C020C
Power-up Timing
PARAMETER
SYMBOL
TYPICAL
UNIT
PU
Power-up to Read Operation
Power-up to Write Operation
T
. READ
100
5
m
S
PU
T
. WRITE
mS
CAPACITANCE
(VDD = 5.0V, TA = 25 C, f = 1 MHz)
°
PARAMETER
DQ Pin Capacitance
Input Pin Capacitance
SYMBOL
CONDITIONS
MAX.
12
UNIT
pF
DQ
C
DQ
V
= 0V
IN
C
IN
V
= 0V
6
pF
AC CHARACTERISTICS
AC Test Conditions
(VDD = 5.0V 10 for 90 nS and 120 nS; VDD = 5.0V 5% for 70 nS)
±
%
±
PARAMETER
CONDITIONS
Input Pulse Levels
Input Rise/Fall Time
Input/Output Timing Level
Output Load
0V to 3V
<5 nS
1.5V/1.5V
L
1 TTL Gate and C = 100 pF for 90/120 nS
L
C = 30 pF for 70 nS
AC Test Load and Waveform
+5V
1.8K
W
DOUT
100 pF for 90/120 nS
30 pF for 70 nS
(Including Jig and Scope)
1.3K
W
Input
Output
3V
1.5V
1.5V
0V
Test Point
Test Point
Publication Release Date: April 2000
Revision A2
- 11 -
W29C020C
AC Characteristics, continued
Read Cycle Timing Parameters
(VDD = 5.0V 10 for 90 nS and 120 nS; VDD = 5.0V 5% for 70 nS, VSS = 0V, TA = 0 to 70 C)
±
%
±
°
W29C020C-70 W29C020C-90 W29C020C-12
MIN. MAX. MIN. MAX. MIN. MAX.
PARAMETER
SYM.
UNIT
RC
Read Cycle Time
T
70
-
-
90
-
-
120
-
nS
nS
nS
nS
nS
CE
Chip Enable Access Time
Address Access Time
Output Enable Access Time
T
T
T
T
70
70
35
25
90
90
40
25
-
-
-
-
120
120
50
AA
-
-
OE
CHZ
-
-
-
-
30
CE
OE
High to High-Z Output
High to High-Z Output
OHZ
OH
T
T
-
25
-
-
25
-
-
30
-
nS
nS
Output Hold from Address change
0
0
0
Byte/Page-write Cycle Timing Parameters
PARAMETER
Write Cycle (erase and program)
Address Setup Time
SYMBOL
MIN.
TYP.
MAX.
UNIT
WC
T
-
0
-
-
-
-
10
-
mS
nS
nS
nS
AS
T
AH
T
Address Hold Time
50
0
-
CS
T
-
WE
WE
OE
OE
CE
CE
CE
and
and
Setup Time
Hold Time
CH
T
0
0
-
-
-
-
-
-
-
-
-
-
-
-
nS
nS
nS
nS
nS
nS
OES
T
High Setup Time
High Hold Time
Pulse Width
OEH
T
0
CP
T
70
70
100
WP
T
WE
WE
Pulse Width
WPH
T
High Width
DS
Data Setup Time
Data Hold Time
T
50
0
-
-
-
-
-
nS
nS
DH
T
BLC
T
Byte Load Cycle Time
-
200
m
S
Note: All AC timing signals observe the following guideline for determining setup and hold times:
Reference level is VIH for high-level signal and VIL for low-level signal.
- 12 -
W29C020C
AC Characteristics, continued
(1)
DATA
Polling Characteristics
PARAMETER
SYMBOL
MIN.
10
TYP.
MAX.
UNIT
nS
DH
T
Data Hold Time
-
-
-
-
OEH
T
10
nS
OE
OE
Hold Time
(2)
OE
T
-
-
-
-
-
nS
nS
to Output Delay
WR
T
Write Recovery Time
0
Notes:
(1) These parameters are characterized and not 100% tested.
OE
.
(2) See T spec in A.C. Read Cycle Timing Parameters
(1)
Toggle Bit Characteristics
PARAMETER
Data Hold Time
SYMBOL
MIN.
10
TYP.
MAX.
UNIT
nS
DH
T
-
-
-
-
OEH
T
10
nS
OE
OE
OE
Hold Time
(2)
OE
T
T
T
-
150
0
-
-
-
-
-
-
nS
nS
nS
to Output Delay
High Pulse
OEHP
WR
Write Recovery Time
Notes:
(1) These parameters are characterized and not 100% tested.
(2) See TOE spec in A.C. Read Cycle Timing Parameters.
TIMING WAVEFORMS
Read Cycle Timing Diagram
T
RC
Address A17-0
T
CE
CE
T
OE
OE
T
OHZ
V
IH
WE
T
OH
T
CHZ
High-Z
High-Z
DQ7-0
Data Valid
Data Valid
AA
T
Publication Release Date: April 2000
Revision A2
- 13 -
W29C020C
Timing Waveforms, continued
WE
Controlled Write Cycle Timing Diagram
TWC
TAS
TAH
Address A17-0
CE
TCS
TCH
TOEH
TOES
OE
TWP
TWPH
WE
TDS
DQ7-0
Data Valid
TDH
Internal write starts
CE Controlled Write Cycle Timing Diagram
AS
T
TWC
TAH
Address A17-0
TWPH
TCP
CE
TOES
TOEH
OE
TCS
CH
T
WE
TDS
High Z
DQ7-0
Data Valid
TDH
Internal Write Starts
- 14 -
W29C020C
Timing Waveforms, continued
Page Write Cycle Timing Diagram
TWC
Address A17-0
DQ7-0
CE
OE
TBLC
TWPH
WP
T
WE
Byte 0
Byte 1
Byte 2
Byte N-1
Internal Write Start
Byte N
DATA
Polling Timing Diagram
Address A15-0
WE
CE
TOEH
OE
TDH
TWR
HIGH-Z
DQ7
TOE
Publication Release Date: April 2000
Revision A2
- 15 -
W29C020C
Timing Waveforms, continued
Toggle Bit Timing Diagram
WE
CE
TOEH
OE
TDH
TOE
TWR
HIGH-Z
DQ6
Page Write Timing Diagram Software Data Protection Mode
TWC
Byte/page load
Three-byte sequence for
cycle starts
software data protection mode
Address A15-0
2AAA
5555
5555
DQ7-0
CE
AA
55
A0
OE
TBLC
TWP
WE
TWPH
Word N
(last word)
Word 0
Word N-1
SW1
SW2
SW0
Internal write starts
- 16 -
W29C020C
Timing Waveforms, continued
Reset Software Data Protection Timing Diagram
Six-byte sequence for resetting
software data protection mode
TWC
Address A15-0
5555
80
5555
5555
2AAA
55
5555
AA
2AAA
DQ7-0
CE
AA
55
20
OE
TWP
TBLC
WE
TWPH
SW0
SW2
SW3
SW5
SW4
SW1
Internal programming starts
Software Chip Erase Timing Diagram
Six-byte code for 5V-only software
chip erase
TWC
Address A15-0
5555
80
5555
5555
2AAA
55
5555
AA
2AAA
55
DQ7-0
CE
AA
10
OE
TWP
TBLC
WE
TWPH
SW0
SW2
SW3
SW5
SW4
SW1
Internal erasing starts
Publication Release Date: April 2000
Revision A2
- 17 -
W29C020C
ORDERING INFORMATION
PART NO.
ACCESS
TIME
POWER
STANDBY
PACKAGE
CYCLING
SUPPLY CURRENT VDD CURRENT
(nS)
MAX. (mA)
MAX. ( A)
m
W29C020C-70B
W29C020C-90B
W29C020C-12B
W29C020CT70B
W29C020CT90B
W29C020CT12B
W29C020CP70B
W29C020CP90B
W29C020CP12B
70
90
50
50
50
50
50
50
50
50
50
100
100
100
100
100
100
100
100
100
600 mil DIP
10K
10K
10K
10K
10K
10K
10K
10K
10K
600 mil DIP
120
70
600 mil DIP
Type one TSOP
Type one TSOP
Type one TSOP
32-pin PLCC
32-pin PLCC
32-pin PLCC
90
120
70
90
120
Notes:
1. Winbond reserves the right to make changes to its products without prior notice.
2. Purchasers are responsible for performing appropriate quality assurance testing on products intended for use in
applications where personal injury might occur as a consequence of product failure.
- 18 -
W29C020C
PACKAGE DIMENSIONS
32-pin P-DIP
Dimension in mm
Dimension in inches
Symbol
A
Nom.
Nom.
Min.
Max. Min.
0.210
Max.
5.33
0.010
0.150
0.25
A
A
B
B
c
1
0.155 0.160
3.81
3.94
0.46
1.27
0.25
4.06
0.56
1.37
0.36
2
0.016 0.018 0.022 0.41
0.050
1.22
0.20
0.048
0.008
0.054
1
0.010 0.014
1.650 1.660
D
17
32
41.91 42.16
D
E
E
e
15.49
14.10
2.79
0.610
0.555
0.110
15.24
0.590 0.600
14.99
13.84 13.97
0.545
0.090 0.100
0.550
1
1
2.29
3.05
0
2.54
3.30
E1
0.120
0
0.140
15
0.130
3.56
15
L
a
17.02
2.16
0.630 0.650 0.670 16.00 16.51
0.085
A
e
S
16
1
Notes:
E
S
1.Dimensions D Max. & S include mold flash or
tie bar burrs.
c
2.Dimension E1 does not include interlead flash.
2
A
A
L
A1
Base Plane
3.Dimensions D & E1 include mold mismatch and
.
are determined at the mold parting line.
4.Dimension B1 does not include dambar
protrusion/intrusion.
Seating Plane
5.Controlling dimension: Inches.
6.General appearance spec. should be based on
final visual inspection spec.
B
B
1
e
eA
a
1
32-pin TSOP
H D
Dimension in Inches
Min. Nom. Max.
Dimension in mm
Max.
Symbol
Min. Nom.
D
__
__
__
__
A
1.20
0.15
1.05
0.23
c
0.047
0.006
__
__
0.002
0.037
0.05
0.95
A 1
A 2
b
0.041
0.009
1.00
0.20
0.15
0.039
M
e
0.007 0.008
0.17
0.12
E
c
D
E
0.005 0.006
0.720 0.724
0.17
0.007
0.728
0.10(0.004)
18.30 18.40 18.50
b
0.311 0.315
0.780 0.787
7.90
8.00
8.10
0.319
19.80
__
20.00 20.20
0.795
__
HD
e
__
__
0.020
0.50
0.016 0.020
0.40
__
0.50
0.60
__
0.024
__
L
__
0.031
0.80
__
L
1
A
__
0.10
5
0.000
0.004
5
0.00
1
Y
A2
1
3
3
q
q
L
1
A
Y
L1
Note:
Controlling dimension: Millimeters
Publication Release Date: April 2000
Revision A2
- 19 -
W29C020C
Package Dimensions, continued
32-pin PLCC
HE
E
4
1
32
30
Dimension in Inches
Min. Nom. Max.
0.140
Dimension in mm
Symbol
A
Min. Nom. Max.
5
29
3.56
0.020
0.50
1
A
0.105
0.026
0.110
0.028
0.018
0.010
0.115
0.032
2.67
0.66
2.80
0.71
0.46
0.25
2.93
0.81
A2
b
b
c
1
0.016
0.008
0.022
0.014
0.41
0.20
0.56
0.35
G
D
D
D
H
0.547
0.447
0.044
0.553
0.453
0.056
13.89
11.35
1.12
14.05
11.51
1.42
0.550
0.450
0.050
0.510
0.410
0.590
0.490
0.090
13.97
11.43
1.27
D
E
e
12.95
0.490
0.390
0.530
0.430
12.45
9.91
13.46
10.92
D
G
G
H
H E
L
y
10.41
14.99
12.45
2.29
E
D
21
13
0.585
0.485
0.595
0.495
14.86
12.32
15.11
12.57
0.075
0.095
0.004
1.91
2.41
0.10
14
c
20
°
°
°
°
0
0
10
10
q
Notes:
L
A
A
2
1
A
1. Dimensions D & E do not include interlead flash.
2. Dimension b1 does not include dambar protrusion/intrusion.
3. Controlling dimension: Inches.
4. General appearance spec. should be based on final
visual inspection sepc.
q
e
b
b
1
Seating Plane
y
E
G
- 20 -
W29C020C
VERSION HISTORY
VERSION
DATE
PAGE
DESCRIPTION
A1
A2
May 1999
Apr. 2000
-
Initial Issued
Change Byte Load Cycle Time from 150 mS to 200 mS
12
Winbond Electronics (H.K.) Ltd.
Winbond Electronics North America Corp.
Winbond Memory Lab.
Winbond Microelectronics Corp.
Winbond Systems Lab.
2727 N. First Street, San Jose,
CA 95134, U.S.A.
Headquarters
Rm. 803, World Trade Square, Tower II,
123 Hoi Bun Rd., Kwun Tong,
Kowloon, Hong Kong
TEL: 852-27513100
FAX: 852-27552064
No. 4, Creation Rd. III,
Science-Based Industrial Park,
Hsinchu, Taiwan
TEL: 886-3-5770066
FAX: 886-3-5796096
http://www.winbond.com.tw/
TEL: 408-9436666
FAX: 408-5441798
Voice & Fax-on-demand: 886-2-7197006
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.,
Taipei, Taiwan
TEL: 886-2-7190505
FAX: 886-2-7197502
Note: All data and specifications are subject to change without notice.
Publication Release Date: April 2000
Revision A2
- 21 -
相关型号:
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