W29EE512Q-70 [WINBOND]

64K X 8 CMOS FLASH MEMORY; 64K ×8 CMOS FLASH MEMORY
W29EE512Q-70
型号: W29EE512Q-70
厂家: WINBOND    WINBOND
描述:

64K X 8 CMOS FLASH MEMORY
64K ×8 CMOS FLASH MEMORY

闪存 存储 内存集成电路 光电二极管
文件: 总22页 (文件大小:291K)
中文:  中文翻译
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W29EE512  
´ 8 CMOS FLASH MEMORY  
64K  
GENERAL DESCRIPTION  
The W29EE512 is a 512K bit, 5-volt only CMOS flash memory organized as 64K ´ 8 bits. The device  
can be programmed and erased in-system with a standard 5V power supply. A 12-volt VPP is not  
required. The unique cell architecture of the W29EE512 results in fast program/erase operations with  
extremely low current consumption (compared to other comparable 5-volt flash memory products). The  
device can also be programmed and erased using standard EPROM programmers.  
FEATURES  
· Single 5-volt program and erase operations  
· Fast page-write operations  
· Low power consumption  
- Active current: 50 mA (max.)  
- Standby current: 100 mA (max.)  
- 128 bytes per page  
· Automatic program timing with internal VPP  
generation  
- Page program cycle: 10 mS (max.)  
- Effective byte-program cycle time: 39 mS  
- Optional software-protected data write  
· Fast chip-erase operation: 50 mS  
· Read access time: 70/90/120 nS  
· Typical page program/erase cycles: 1K/10K  
· Ten-year data retention  
· End of program detection  
- Toggle bit  
- Data polling  
· Latched address and data  
· TTL compatible I/O  
· JEDEC standard byte-wide pinouts  
· Software and hardware data protection  
· Available packages: 32-pin PLCC, TSOP and  
VSOP  
Publication Release Date: February 18, 2002  
- 1 -  
Revision A7  
W29EE512  
PIN CONFIGURATIONS  
BLOCK DIAGRAM  
VDD  
VSS  
A
A
V
C
C
#
W
E
1
N
C
N
C
N
C
1
2
5
DQ0  
4
3
2
1
32 31 30  
#CE  
.
OUTPUT  
BUFFER  
.
#OE  
5
6
29  
28  
27  
26  
25  
24  
23  
22  
21  
A14  
CONTROL  
A7  
A6  
A13  
A8  
DQ7  
#WE  
7
A5  
8
32-pin  
PLCC  
A9  
A4  
9
A11  
OE  
A3  
10  
11  
12  
13  
#
A2  
A10  
CE  
A1  
#
A0  
DQ7  
DQ0  
A0  
14 15 16 17 18 19 20  
CORE  
ARRAY  
.
DECODER  
D
Q
1
D
Q
2
G
N
D
D
Q
3
D
Q
4
D
Q
5
D
Q
6
.
A15  
1
2
3
32  
#
A10  
OE  
A11  
A9  
A8  
A13  
A14  
NC  
31  
30  
29  
28  
27  
26  
25  
#
CE  
4
5
DQ7  
DQ6  
DQ5  
DQ4  
DQ3  
GND  
DQ2  
DQ1  
DQ0  
A0  
6
7
8
WE  
#
32-pin  
TSOP  
VCC  
NC  
NC  
A15  
A12  
A7  
9
24  
23  
22  
21  
20  
19  
18  
17  
10  
11  
12  
13  
14  
15  
16  
A6  
A1  
PIN DESCRIPTION  
A5  
A2  
A3  
A4  
SYMBOL  
PIN NAME  
OE  
1
2
3
32  
#
A11  
A9  
A8  
A13  
A14  
NC  
Address Inputs  
Data Inputs/Outputs  
A0 - A15  
DQ0 - DQ7  
#CE  
A10  
#CE  
31  
30  
29  
28  
27  
26  
25  
4
5
DQ7  
DQ6  
DQ5  
DQ4  
DQ3  
GND  
DQ2  
DQ1  
DQ0  
A0  
6
7
WE  
#
Chip Enable  
Output Enable  
Write Enable  
Power Supply  
Ground  
32-pin  
VSOP  
VCC  
NC  
NC  
A15  
A12  
A7  
8
9
24  
23  
22  
2
10  
#OE  
11  
12  
13  
14  
15  
16  
20  
1
#WE  
A6  
A1  
A5  
1
A2  
A3  
VCC  
A4  
17  
GND  
NC  
No Connection  
- 2 -  
W29EE512  
FUNCTIONAL DESCRIPTION  
Read Mode  
The read operation of the W29EE512 is controlled by  
and  
, both of which have to be low for  
#OE  
#CE  
the host to obtain data from the outputs.  
is used for device selection. When  
is high, the chip  
#CE  
is de-selected and only standby power will be consumed.  
#CE  
is the output control and is used to gate  
#OE  
data from the output pins. The data bus is in high impedance state when either  
Refer to the timing waveforms for further details.  
or  
is high.  
#OE  
#CE  
Page Write Mode  
The W29EE512 is programmed on a page basis. Every page contains 128 bytes of data. If a byte of  
data within a page is to be changed, data for the entire page must be loaded into the device. Any byte  
that is not loaded will be erased to "FFh" during programming of the page.  
The write operation is initiated by forcing  
and  
low and  
high. The write procedure  
#OE  
#CE  
#WE  
consists of two steps. Step 1 is the byte-load cycle, in which the host writes to the page buffer of the  
device. Step 2 is an internal programming cycle, during which the data in the page buffers are  
simultaneously written into the memory array for non-volatile storage.  
During the byte-load cycle, the addresses are latched by the falling edge of either  
or  
,
#WE  
#CE  
, whichever occurs  
whichever occurs last. The data are latched by the rising edge of either  
or  
#CE #WE  
first. If the host loads a second byte into the page buffer within a byte-load cycle time (TBLC) of 200  
mS, after the initial byte-load cycle, the W29EE512 will stay in the page load cycle. Additional bytes can  
then be loaded consecutively. The page load cycle will be terminated and the internal programming  
cycle will start if no additional byte is loaded into the page buffer A7 to A15 specify the page address. All  
bytes that are loaded into the page buffer must have the same page address. A0 to A6 specify the byte  
address within the page. The bytes may be loaded in any order; sequential loading is not required.  
In the internal programming cycle, all data in the page buffers, i.e., 128 bytes of data, are written  
simultaneously into the memory array. Before the completion of the internal programming cycle, the  
host is free to perform other tasks such as fetching data from other locations in the system to prepare  
to write the next page.  
Software-protected Data Write  
The device provides a JEDEC-approved optional software-protected data write. Once this scheme is  
enabled, any write operation requires a series of three-byte program commands (with specific data to a  
specific address) to be performed before the data load operation. The three-byte load command  
sequence begins the page load cycle, without which the write operation will not be activated. This write  
scheme provides optimal protection against inadvertent write cycles, such as cycles triggered by noise  
during system power-up and power-down.  
The W29EE512 is shipped with the software data protection enabled. To enable the software data  
protection scheme, perform the three-byte command cycle at the beginning of a page load cycle. The  
device will then enter the software data protection mode, and any subsequent write operation must be  
preceded by the three-byte program command cycle. Once enabled, the software data protection will  
remain enabled unless the disable commands are issued. A power transition will not reset the software  
data protection feature. To reset the device to unprotected mode, a six-byte command sequence is  
required.  
Publication Release Date: February 18, 2002  
- 3 -  
Revision A7  
W29EE512  
Hardware Data Protection  
The integrity of the data stored in the W29EE512 is also hardware protected in the following ways:  
(1) Noise/Glitch Protection: A pulse of less than 15 nS in duration will not initiate a write cycle.  
#WE  
(2) VCC Power Up/Down Detection: The programming and read operation are inhibited when VCC is  
less than 2.8V.  
(3) Write Inhibit Mode: Forcing  
low,  
high, or  
high will inhibit the write operation. This  
#WE  
#OE  
#CE  
prevents inadvertent writes during power-up or power-down periods.  
Data Polling (DQ7)-Write Status Detection  
The W29EE512 includes a data polling feature to indicate the end of a programming cycle. When the  
W29EE512 is in the internal programming cycle, any attempt to read DQ7 of the last byte loaded during  
the page/byte-load cycle will receive the complement of the true data. Once the programming cycle is  
completed. DQ7 will show the true data.  
Toggle Bit (DQ6)-Write Status Detection  
In addition to data polling, the W29EE512 provides another method for determining the end of a  
program cycle. During the internal programming cycle, any consecutive attempts to read DQ6 will  
produce alternating 0's and 1's. When the programming cycle is completed, this toggling between 0's  
and 1's will stop. The device is then ready for the next operation.  
5-Volt-only Software Chip Erase  
The chip-erase mode can be initiated by a six-byte command sequence. After the command loading  
cycles, the device enters the internal chip erase mode, which is automatically timed and will be  
completed in 50 mS. The host system is not required to provide any control or timing during this  
operation.  
Product Identification  
The product ID operation outputs the manufacturer code and device code. Programming equipment  
automatically matches the device with its proper erase and programming algorithms.  
The manufacturer and device codes can be accessed by software or hardware operation. In the  
software access mode, a six-byte command sequence can be used to access the product ID. A read  
from address 0000H outputs the manufacturer code (DAh). A read from address 0001H outputs the  
device code (C8h). The product ID operation can be terminated by a three-byte command sequence.  
In the hardware access mode, access to the product ID is activated by forcing  
and  
low,  
#OE  
#CE  
high, and raising A9 to 12 volts.  
#WE  
- 4 -  
W29EE512  
TABLE OF OPERATING MODES  
Operating Mode Selection  
(Operating Range = 0 to 70° C (Ambient Temperature), VCC = 5V ±10%, VSS = 0V, VHH = 12V)  
MODE  
PINS  
#CE #OE #WE  
ADDRESS  
DQ.  
Read  
VIL  
VIL  
VIH  
X
VIL  
VIH  
X
VIH AIN  
Dout  
Write  
VIL  
X
AIN  
X
Din  
Standby  
High Z  
Write Inhibit  
VIL  
X
X
X
High Z/DOUT  
High Z/DOUT  
High Z  
X
VIH  
X
X
Output Disable  
X
VIH  
VIH  
VIL  
X
5-Volt Software Chip Erase  
Product ID  
VIL  
VIL  
VIL  
VIH  
AIN  
DIN  
Manufacturer Code  
DA (Hex)  
A0 = VIL; A1 - A15 = VIL;  
A9 = VHH  
VIL  
VIL  
VIH  
Device Code  
C8 (Hex)  
A0 = VIH; A1 - A15 = VIL;  
A9 = VHH  
Publication Release Date: February 18, 2002  
Revision A7  
- 5 -  
W29EE512  
Command Codes for Software Data Protection  
BYTE SEQUENCE  
TO ENABLE PROTECTION  
TO DISABLE PROTECTION  
ADDRESS  
DATA  
ADDRESS  
5555H  
DATA  
AAH  
55H  
0 Write  
1 Write  
2 Write  
3 Write  
4 Write  
5 Write  
5555H  
AAH  
2AAAH  
55H  
2AAAH  
5555H  
5555H  
A0H  
80H  
-
-
-
-
-
-
5555H  
AAH  
55H  
2AAAH  
5555H  
20H  
Software Data Protection Acquisition Flow  
Software Data Protection  
Enable Flow  
Software Data Protection  
Disable Flow  
Load data AA  
to  
address 5555  
Load data AA  
to  
address 5555  
Load data 55  
to  
address 2AAA  
Load data 55  
to  
address 2AAA  
Load data A0  
to  
address 5555  
Load data 80  
to  
address 5555  
Load data AA  
to  
address 5555  
Sequentially load  
up to 128 bytes  
of page data  
(Optional page-load  
operation)  
Load data 55  
to  
Pause 10 mS  
Exit  
address 2AAA  
Load data 20  
to  
address 5555  
Pause 10 mS  
Exit  
Notes for software program code:  
Data Format: DQ7 - DQ0 (Hex)  
Address Format: A14 - A0 (Hex)  
- 6 -  
W29EE512  
Command Codes for Software Chip Erase  
BYTE SEQUENCE  
0 Write  
ADDRESS  
5555H  
DATA  
AAH  
55H  
1 Write  
2AAAH  
5555H  
2 Write  
80H  
3 Write  
5555H  
AAH  
55H  
4 Write  
2AAAH  
5555H  
5 Write  
10H  
Software Chip Erase Acquisition Flow  
Load data AA  
to  
address 5555  
Load data 55  
to  
address 2AAA  
Load data 80  
to  
address 5555  
Load data AA  
to  
address 5555  
Load data 55  
to  
address 2AAA  
Load data 10  
to  
address 5555  
Pause 50 mS  
Exit  
Notes for software chip erase:  
Data Format: DQ7 - DQ0 (Hex)  
Address Format: A14 - A0 (Hex)  
Publication Release Date: February 18, 2002  
Revision A7  
- 7 -  
W29EE512  
Command Codes for Product Identification  
BYTE  
SEQUENCE  
ALTERNATE SOFTWARE (5)  
SOFTWARE PRODUCT  
IDENTIFICATION ENTRY  
SOFTWARE PRODUCT  
IDENTIFICATION EXIT  
PRODUCT IDENTIFICATION  
ENTRY  
ADDRESS  
DATA  
ADDRESS  
DATA  
ADDRESS  
DATA  
0 Write  
1 Write  
2 Write  
3 Write  
4 Write  
5 Write  
5555H  
AAH  
5555H  
2AAAH  
5555H  
5555H  
2AAAH  
5555H  
AAH  
55H  
80H  
AAH  
55H  
60H  
5555H  
AAH  
2AAAH  
55H  
2AAAH  
55H  
5555H  
90H  
5555H  
F0H  
-
-
-
-
-
-
-
-
-
-
-
-
Pause 10 mS  
Pause 10 mS  
Pause 10 mS  
Software Product Identification Acquisition Flow  
Product Identification Entry (1)  
Product Identification Mode (2,3)  
Product Identification Exit (1)  
Load data AA  
to  
address 5555  
Load data AA  
to  
address 5555  
Load data 55  
to  
address 2AAA  
Load data 80  
to  
address 5555  
Load data 55  
to  
address 2AAA  
Read address = 0  
data = DA  
Load data FO  
to  
address 5555  
Load data AA  
to  
address 5555  
Load data 55  
to  
address 2AAA  
Read address = 1  
data = C8  
Pause 10 mS  
(4)  
Load data 60  
to  
address 5555  
Normal Mode  
Pause 10  
S
m
Notes for software product identification:  
(1) Data format: DQ7 - DQ0 (Hex); address format: A14 - A0 (Hex).  
(2) A1 - A16 = VIL; manufacture code is read for A0 = VIL; device code is read for A0 = VIH.  
(3) The device does not remain in identification mode if power down.  
(4) The device returns to standard operation mode.  
(5) This product supports both the JEDEC standard 3 byte command code sequence and original 6 byte command code  
sequence. For new designs, Winbond recommends that the 3 byte command code sequence be used.  
- 8 -  
W29EE512  
DC CHARACTERISTICS  
Absolute Maximum Ratings  
PARAMETER  
RATING  
UNIT  
Power Supply Voltage to Vss Potential  
Operating Temperature  
-0.5 to +7.0  
0 to +70  
V
°C  
°C  
V
Storage Temperature  
-65 to +150  
D.C. Voltage on Any Pin to Ground Potential except A9  
Transient Voltage (¡ Õ20 nS) on Any Pin to Ground Potential  
-0.5 to VCC +1.0  
-1.0 to VCC +1.0  
-0.5 to 12.5  
V
Voltage on A9 and  
Pin to Ground Potential  
V
#OE  
Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability  
of the device.  
Operating Characteristics  
(VCC = 5.0V ±10%, VSS = 0V, TA = 0 to 70° C)  
PARAMETER  
SYM.  
TEST CONDITIONS  
LIMITS  
UNIT  
MIN. TYP. MAX.  
Power Supply  
Current  
ICC  
=
= VIL,  
= VIH,  
#WE  
-
-
50  
mA  
#CE #OE  
all I/Os open  
Address inputs = VIL/VIH, at f = 5 MHz  
= VIH, all I/Os open  
Standby Vcc Current  
(TTL Input)  
ISB1  
ISB2  
-
-
2
3
mA  
#CE  
Other inputs = VIL/VIH  
Standby Vcc Current  
(CMOS Input)  
= VCC -0.3V, all I/Os open  
#CE  
20  
100  
mA  
Other inputs = VCC -0.3V/GND  
VIN = GND to VCC  
Input Leakage  
Current  
ILI  
-
-
-
-
10  
10  
mA  
mA  
Output Leakage  
Current  
ILO  
VIN = GND to VCC  
Input Low Voltage  
Input High Voltage  
Output Low Voltage  
Output High Voltage  
VIL  
VIH  
-
-
-
-
-
-
-
-
0.8  
V
V
V
V
V
2.0  
-
-
VOL IOL = 2.1 mA  
VOH1 IOH = -0.4 mA  
0.45  
2.4  
4.2  
-
-
Output High Voltage  
CMOS  
VOH2  
IOH = -100 mA; VCC = 4.5V  
Publication Release Date: February 18, 2002  
Revision A7  
- 9 -  
W29EE512  
Power-up Timing  
PARAMETER  
SYMBOL  
TPU.READ  
TPU.WRITE  
TYPICAL  
UNIT  
mS  
Power-up to Read Operation  
Power-up to Write Operation  
100  
5
mS  
CAPACITANCE  
(VCC = 5.0V, TA = 25° C, f = 1 MHz)  
PARAMETER  
I/O Pin Capacitance  
Input Capacitance  
SYMBOL  
CI/O  
CONDITIONS  
VI/O = 0V  
MAX.  
12  
UNIT  
pF  
CIN  
VIN = 0V  
6
pF  
AC CHARACTERISTICS  
AC Test Conditions  
PARAMETER  
Input Pulse Levels  
CONDITIONS  
0V to 3V  
Input Rise/Fall Time  
Input/Output Timing Level  
Output Load  
< 5 nS  
1.5V/1.5V  
1 TTL Gate and CL = 100 pF/30 pF  
AC Test Load and Waveform  
+5V  
1.8  
Kohm  
DOUT  
(For 90 nS/120 nS)  
(For 70 nS)  
100 pF  
30 pF  
1.3Kohm  
Output  
Input  
3V  
0V  
1.5V  
1.5V  
Test Point  
Test Point  
- 10 -  
W29EE512  
Read Cycle Timing Parameters  
(VCC = 5.0V ±10%, VCC = 5.0 ±5% for 70 nS, VSS = 0V, TA = 0 to 70° C)  
PARAMETER  
SYM. W29EE512-70 W29EE512-90 W29EE512-12 UNIT  
MIN. MAX. MIN. MAX. MIN. MAX.  
Read Cycle Time  
TRC  
TCE  
70  
-
-
90  
-
-
120  
-
nS  
nS  
nS  
nS  
nS  
nS  
nS  
Chip Enable Access Time  
Address Access Time  
70  
70  
35  
25  
25  
-
90  
90  
40  
25  
25  
-
-
-
120  
120  
50  
30  
30  
-
TAA  
-
-
Output Enable Access Time  
TOE  
TCHZ  
TOHZ  
TOH  
-
-
-
High to High-Z Output  
High to High-Z Output  
-
-
-
#CE  
#OE  
-
-
-
Output Hold from Address Change  
0
0
0
Byte/Page-write Cycle Timing Parameters  
PARAMETER  
Write Cycle (Erase and Program)  
Address Setup Time  
SYMBOL  
TWC  
TAS  
MIN.  
TYP.  
MAX.  
UNIT  
mS  
nS  
nS  
nS  
nS  
nS  
nS  
nS  
nS  
nS  
nS  
nS  
mS  
-
0
-
-
-
-
-
-
-
-
-
-
-
-
-
10  
-
Address Hold Time  
TAH  
50  
0
-
and  
and  
Setup Time  
Hold Time  
TCS  
-
#WE  
#WE  
#OE  
#OE  
#CE  
#WE  
#WE  
#CE  
#CE  
TCH  
0
-
High Setup Time  
High Hold Time  
Pulse Width  
TOES  
TOEH  
TCP  
0
-
0
-
90  
90  
100  
35  
0
-
Pulse Width  
TWP  
TWPH  
TDS  
-
High Width  
-
Data Setup Time  
Data Hold Time  
-
-
TDH  
Byte Load Cycle Time  
TBLC  
-
200  
Notes: All AC timing signals observe the following guidelines for determining setup and hold times:  
(1) High level signal's reference level is VIH.  
(2) Low level signal's reference level is VIL.  
Publication Release Date: February 18, 2002  
Revision A7  
- 11 -  
W29EE512  
#DATA Polling Characteristics (1)  
PARAMETER  
SYMBOL  
TDH  
MIN.  
10  
10  
-
TYP.  
MAX.  
UNIT  
nS  
Data Hold Time  
-
-
-
-
-
-
Hold Time  
TOEH  
TOE  
nS  
#OE  
#OE  
(2)  
nS  
to Output Delay  
Write Recovery Time  
TWR  
0
-
-
nS  
Notes:  
(1) These parameters are characterized and not 100% tested.  
(2) See TOE spec in A.C. Read Cycle Timing Parameters.  
Toggle Bit Characteristics (1)  
PARAMETER  
Data Hold Time  
SYMBOL  
TDH  
MIN.  
10  
10  
-
TYP.  
MAX.  
UNIT  
nS  
-
-
-
-
-
-
Hold Time  
TOEH  
TOE  
nS  
#OE  
#OE  
#OE  
(2)  
nS  
to Output Delay  
High Pulse  
TOEHP  
TWR  
150  
0
-
-
-
-
nS  
nS  
Write Recovery Time  
Notes:  
(1) These parameters are characterized and not 100% tested.  
(2) See TOE spec in A.C. Read Cycle Timing Parameters.  
- 12 -  
W29EE512  
TIMING WAVEFORMS  
Read Cycle Timing Diagram  
T
RC  
Address A15-0  
#CE  
T
CE  
T
O
#OE  
T
OH  
V
IH  
#WE  
T
O
T
CH  
High-Z  
High-Z  
DQ7-0  
Data Valid  
Data Valid  
AA  
T
Controlled Write Cycle Timing Diagram  
#WE  
TWC  
TAS  
TAH  
Address A15-0  
#CE  
TCS  
TCH  
TOES  
TOEH  
#OE  
TWPH  
TWP  
#WE  
TDS  
DQ7-0  
Data Valid  
TDH  
Internal write starts  
Publication Release Date: February 18, 2002  
Revision A7  
- 13 -  
W29EE512  
Timing Waveforms, continued  
Controlled Write Cycle Timing Diagram  
#CE  
AS  
T
TWC  
TAH  
Address A15-0  
TCPH  
TCP  
#CE  
TOES  
TOEH  
#OE  
#WE  
TDS  
High Z  
DQ7-0  
Data Valid  
TDH  
Internal write starts  
Page Write Cycle Timing Diagram  
WC  
T
Address A15-0  
DQ7-0  
#CE  
#OE  
TBLC  
WP  
T
T
WPH  
#WE  
Byte 0  
Byte 1  
Byte 2  
Byte N-1  
Byte N  
Internal write starts  
- 14 -  
W29EE512  
Timing Waveforms, continued  
Polling Timing Diagram  
#DATA  
Address A15-0  
#WE  
#CE  
T
OEH  
#OE  
DQ7  
T
DH  
T
WR  
HIGH-Z  
T
OE  
Toggle Bit Timing Diagram  
#WE  
#CE  
T
OEH  
#OE  
T
DH  
T
OE  
T
WR  
HIGH-Z  
DQ6  
Publication Release Date: February 18, 2002  
Revision A7  
- 15 -  
W29EE512  
Timing Waveforms, continued  
Page Write Timing Diagram Software Data Protection Mode  
TWC  
Byte/page load  
Three-byte sequence for  
cycle starts  
software data protection mode  
Address A15-0  
2AAA  
5555  
A0  
5555  
DQ7-0  
#CE  
AA  
55  
#OE  
BLC  
T
TWP  
#WE  
WPH  
T
Word N  
(last word)  
Word 0  
Word N-1  
SW1  
SW2  
SW0  
Internal write starts  
Reset Software Data Protection Timing Diagram  
TWC  
Six-byte sequence for resetting  
software data protection mode  
Address A15-0  
DQ7-0  
5555  
5555  
80  
5555  
2AAA  
55  
5555  
2AAA  
AA  
55  
20  
AA  
#CE  
#OE  
#WE  
T
WP  
T
BLC  
TWPH  
SW0  
SW2  
SW3  
SW5  
SW4  
SW1  
Internal programming starts  
- 16 -  
W29EE512  
Timing Waveforms, continued  
5-Volt-only Software Chip Erase Timing Diagram  
Six-byte code for 5V-only  
software chip erase  
T
WC  
Address A15-0  
5555  
2AAA  
55  
5555  
2AAA  
55  
5555  
5555  
DQ7-0  
#CE  
80  
AA  
AA  
10  
#OE  
#WE  
T
WP  
T
BLC  
T
WPH  
SW0  
SW2  
SW3  
SW5  
SW4  
SW1  
Internal programming starts  
Publication Release Date: February 18, 2002  
Revision A7  
- 17 -  
W29EE512  
ORDERING INFORMATION  
PART NO.  
ACCESS POWER SUPPLY  
STANDBY VCC  
PACKAGE  
CYCLE  
TIME  
(nS)  
CURRENT MAX.  
(mA)  
CURRENT MAX.  
(mA)  
W29EE512P-70  
W29EE512P-90  
W29EE512P-12  
W29EE512T-70  
W29EE512T-90  
W29EE512T-12  
W29EE512Q-70  
W29EE512Q-90  
W29EE512P-70B  
W29EE512P-90B  
W29EE512P-12B  
W29EE512T-70B  
W29EE512T-90B  
W29EE512T-12B  
W29EE512Q-70B  
W29EE512Q-90B  
70  
90  
50  
50  
50  
50  
50  
50  
50  
50  
50  
50  
50  
50  
50  
50  
50  
50  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
32-pin PLCC  
1K  
32-pin PLCC  
1K  
120  
70  
32-pin PLCC  
1K  
Type one TSOP  
Type one TSOP  
Type one TSOP  
Type one VSOP  
Type one VSOP  
32-pin PLCC  
1K  
90  
1K  
120  
70  
1K  
1K  
90  
1K  
70  
10K  
10K  
10K  
10K  
10K  
10K  
10K  
10K  
90  
32-pin PLCC  
120  
70  
32-pin PLCC  
Type one TSOP  
Type one TSOP  
Type one TSOP  
Type one VSOP  
Type one VSOP  
90  
120  
70  
90  
Notes:  
1. Winbond reserves the right to make changes to its products without prior notice.  
2. Purchasers are responsible for performing appropriate quality assurance testing on products intended for use in applications  
where personal injury might occur as a consequence of product failure.  
- 18 -  
W29EE512  
HOW TO READ THE TOP MARKING  
Example: The top marking of 32L-PLCC W29EE512P-70B  
W29EE512P-70B  
2138977A-A12  
149OBRA  
1st line: winbond logo  
2nd line: the part number: W29EE512P-70B  
3rd line: the lot number  
4th line: the tracking code: 149 O B RA  
149: Packages made in ’01, week 49  
O: Assembly house ID: A means ASE, O means OSE, ... etc.  
B: IC revision; A means version A, B means version B, ... etc.  
RA: Process code  
Publication Release Date: February 18, 2002  
Revision A7  
- 19 -  
W29EE512  
PACKAGE DIMENSIONS  
32-pin PLCC  
H E  
E
4
1
32  
30  
Dimension In mm  
Min. Nom. Max. Min. Nom. Max.  
Dimension In Inches  
Symbol  
A
5
0.140  
3.56  
29  
0.020  
0.105  
0.026  
0.016  
0.008  
0.547  
0.447  
0.044  
0.490  
0.390  
0.585  
0.485  
0.50  
2.67  
1
A
A
0.110  
0.028  
0.018  
0.010  
0.550  
0.450  
0.050  
0.510  
0.410  
0.590  
0.490  
0.090  
0.115  
0.032  
0.022  
0.014  
0.553  
0.453  
0.056  
0.530  
0.430  
0.595  
0.495  
2.80  
0.71  
2.93  
0.81  
2
0.66  
1
b
b
c
D
E
e
G
G
H
H
L
y
0.41  
0.56  
0.46  
0.20  
0.35  
0.25  
D
G
D
D
H
13.89  
11.35  
1.12  
14.05  
11.51  
1.42  
13.97  
11.43  
1.27  
12.45  
9.91  
12.95  
10.41  
14.99  
12.45  
2.29  
13.46  
10.92  
15.11  
12.57  
D
E
D
21  
14.86  
12.32  
13  
E
0.075  
0.095  
0.004  
1.91  
2.41  
0.10  
14  
20  
c
°
°
°
°
10  
0
10  
0
q
Notes:  
L
1. Dimensions D & E do not include interlead flash.  
2. Dimension b does not include dambar protrusion/intrusion.  
3. Controlling dimension: Inches.  
4. General appearance spec. should be based on fina visual  
inspection sepc.  
2
1
A
A
A
e
b
q
b
1
Seating Plane  
y
G
E
32-pin TSOP  
H D  
D
Dimension In Inches  
Min. Nom. Max.  
Dimension In mm  
Symbol  
Min. Nom. Max.  
__  
__  
__  
__  
A
1.20  
0.15  
1.05  
0.23  
0.047  
0.006  
c
__  
__  
0.002  
0.037  
0.05  
0.95  
A 1  
A 2  
b
0.041  
0.009  
1.00  
0.039  
M
e
0.007 0.008  
0.17 0.20  
0.12 0.15  
E
c
0.005 0.006  
0.720 0.724  
0.17  
0.007  
0.728  
0.10(0.004)  
D
18.30 18.40 18.50  
b
0.311 0.315  
0.780 0.787  
7.90 8.00  
8.10  
E
0.319  
19.80  
__  
20.00 20.20  
0.795  
__  
HD  
e
__  
__  
0.020  
0.50  
0.016 0.020  
0.40  
__  
0.50  
0.60  
__  
L
0.024  
__  
__  
L 1  
0.031  
0.80  
__  
A
__  
0.000  
0.004  
5
0.10  
5
0.00  
1
Y
A2  
1
3
3
q
q
L
1
A
Y
L1  
Note:  
Controlling dimension: Millimeters  
- 20 -  
W29EE512  
Package Dimensions, continued  
32-pin VSOP  
H D  
D
Dimension In Inches  
Min. Nom. Max.  
Dimension In mm  
Symbol  
Min. Nom.  
Max.  
__  
__  
__  
__  
A
A
1.20  
0.15  
0.25  
0.047  
0.006  
__  
__  
A1  
0.002  
0.05  
A 1  
b
0.006 0.008  
0.484 0.488  
0.311 0.315  
0.15 0.20  
0.010  
0.492  
0.319  
M
e
D
12.30 12.40 12.50  
E
7.90 8.00  
8.10  
E
0.10(0.004)  
0.543 0.551  
13.80  
__  
14.00 14.20  
0.559  
__  
HD  
e
__  
__  
b
0.020  
0.50  
0.020 0.024  
0.50  
0.60  
__  
0.70  
L
0.028  
__  
0.004  
0.008  
5
0.20  
5
0.10  
0
Y
__  
__  
0
q
Note:  
Controlling dimension: Millimeters  
Y
q
L
Publication Release Date: February 18, 2002  
Revision A7  
- 21 -  
W29EE512  
VERSION HISTORY  
VERSION  
DATE  
PAGE  
DESCRIPTION  
A5  
Mar. 1998  
6
7
8
Add. pause 10 mS  
Add. pause 50 mS  
Correct the time from 10 mS to 10 mS  
1, 2, 18, 19 Eliminate 600 mil DIP, 450 mil SOP packages  
1, 2, 18, 20 Add 32-pin VSOP package  
A6  
A7  
Oct. 1999  
3, 11  
4
Change Byte Load Cycle Time from 150 mS to 200 mS  
Feb. 18, 2002  
Modify VCC Power Up/Down Detection in Hardware  
Data Protection  
21  
Add HOW TO READ THE TOP MARKING  
Headquarters  
Winbond Electronics Corporation America Winbond Electronics (Shanghai) Ltd.  
27F, 2299 Yan An W. Rd. Shanghai,  
2727 North First Street, San Jose,  
No. 4, Creation Rd. III,  
Science-Based Industrial Park,  
Hsinchu, Taiwan  
TEL: 886-3-5770066  
FAX: 886-3-5665577  
200336 China  
CA 95134, U.S.A.  
TEL: 1-408-9436666  
FAX: 1-408-5441798  
TEL: 86-21-62365999  
FAX: 86-21-62365998  
http://www.winbond.com.tw/  
Taipei Office  
Winbond Electronics Corporation Japan  
7F Daini-ueno BLDG, 3-7-18  
Shinyokohama Kohoku-ku,  
Yokohama, 222-0033  
Winbond Electronics (H.K.) Ltd.  
Unit 9-15, 22F, Millennium City,  
No. 378 Kwun Tong Rd.,  
Kowloon, Hong Kong  
9F, No.480, Rueiguang Rd.,  
Neihu Chiu, Taipei, 114,  
Taiwan, R.O.C.  
TEL: 886-2-8177-7168  
FAX: 886-2-8751-3579  
TEL: 81-45-4781881  
FAX: 81-45-4781800  
TEL: 852-27513100  
FAX: 852-27552064  
Please note that all data and specifications are subject to change without notice.  
All the trade marks of products and companies mentioned in this data sheet belong to their respective owners.  
- 22 -  

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