W29GL032CL7B [WINBOND]
32M-BIT 3.0-VOLT PARALLEL FLASH MEMORY WITH PAGE MODE; 配页模式32M - BIT 3.0伏并行闪存
| 型号： | W29GL032CL7B |
| 厂家： | 
WINBOND |
| 描述： | 32M-BIT 3.0-VOLT PARALLEL FLASH MEMORY WITH PAGE MODE |
| 文件： | 总66页 (文件大小：1313K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
W29GL032C
32M-BIT
3.0-VOLT PARALLEL FLASH MEMORY WITH
PAGE MODE
Publication Release Date: October 18, 2011
Preliminary - Revision E
BLANK
W29GL032C
Table of Contents
1
2
3
4
5
6
GENERAL DESCRIPTION ......................................................................................................... 1
FEATURES ................................................................................................................................. 1
PIN CONFIGURATIONS............................................................................................................. 2
BLOCK DIAGRAM ...................................................................................................................... 3
PIN DESCRIPTION..................................................................................................................... 3
ARRAY ARCHITECTURE........................................................................................................... 4
6.1
6.2
6.3
H/L Sector Address Table............................................................................................... 4
Top Sector Address Table.............................................................................................. 4
Bottom Sector Address Table......................................................................................... 4
7
FUNCTIONAL DESCRIPTION.................................................................................................... 5
7.1
7.2
Device Bus Operation..................................................................................................... 5
Instruction Definitions...................................................................................................... 6
7.2.1 Reading Array Data ..........................................................................................................6
7.2.2 Page Mode Read..............................................................................................................6
7.2.3 Device Reset Operation....................................................................................................7
7.2.4 Standby Mode...................................................................................................................7
7.2.5 Output Disable Mode ........................................................................................................7
7.2.6 Write Operation.................................................................................................................7
7.2.7 Byte/Word Selection .........................................................................................................8
7.2.8 Automatic Programming of the Memory Array ..................................................................8
7.2.9 Erasing the Memory Array ................................................................................................9
7.2.10 Erase Suspend/Resume ...............................................................................................10
7.2.11 Sector Erase Resume...................................................................................................10
7.2.12 Program Suspend/Resume...........................................................................................11
7.2.13 Program Resume..........................................................................................................11
7.2.14 Programming Operation................................................................................................11
7.2.15 Buffer Write Abort .........................................................................................................12
7.2.16 Accelerated Programming Operation............................................................................12
7.2.17 Automatic Select Bus Operation ...................................................................................12
7.2.18 Automatic Select Operations.........................................................................................13
7.2.19 Automatic Select Instruction Sequence ........................................................................13
7.2.20 Enhanced Variable IO (EVIO) Control ..........................................................................14
7.2.21 Hardware Data Protection Options ...............................................................................14
7.2.22 Inherent Data Protection ...............................................................................................14
7.2.23 Power Supply Decoupling.............................................................................................14
Enhanced Sector Protect/Un-protect............................................................................ 15
7.3.1 Lock Register..................................................................................................................16
7.3.2 Individual (Non-Volatile) Protection Mode.......................................................................17
Security Sector Flash Memory Region ......................................................................... 20
7.4.1 Factory Locked: Security Sector Programmed and Protected at factory.........................20
7.4.2 Customer Lockable: Security Sector Not Programmed or Protected ..............................20
Instruction Definition Tables ......................................................................................... 21
7.3
7.4
7.5
Publication Release Date: October 18, 2011
i
Preliminary - Revision E
W29GL032C
7.6
Common Flash Memory Interface (CFI) Mode............................................................. 25
7.6.1 Query Instruction and Common Flash memory Interface (CFI) Mode.............................25
8
ELECTRICAL CHARACTERISTICS......................................................................................... 29
8.1
8.2
8.3
8.4
Absolute Maximum Stress Ratings............................................................................... 29
Operating Temperature and Voltage ............................................................................ 29
DC Characteristics........................................................................................................ 30
Switching Test Circuits.................................................................................................. 31
8.4.1 Switching Test Waveform ...............................................................................................31
AC Characteristics ........................................................................................................ 32
8.5.1 Instruction Write Operation .............................................................................................33
8.5.2 Read / Reset Operation ..................................................................................................34
8.5.3 Erase/Program Operation ...............................................................................................36
8.5.4 Write Operation Status....................................................................................................45
8.5.5 WORD/BYTE CONFIGURATION (#BYTE).....................................................................49
8.5.6 DEEP POWER DOWN MODE........................................................................................51
8.5.7 WRITE BUFFER PROGRAM..........................................................................................51
Recommended Operating Conditions........................................................................... 52
8.6.1 At Device Power-up ........................................................................................................52
Erase and Programming Performance ......................................................................... 53
Data Retention.............................................................................................................. 53
Latch-up Characteristics............................................................................................... 53
8.5
8.6
8.7
8.8
8.9
8.10 Pin Capacitance............................................................................................................ 53
PACKAGE DIMENSIONS......................................................................................................... 54
9
9.1
9.2
9.3
9.4
TSOP 48-pin 12x20mm ................................................................................................ 54
TSOP 56-pin 14x20mm ................................................................................................ 55
Low-Profile Fine-Pitch Ball Grid Array, 64-ball 11x13mm (LFBGA64)......................... 56
Thin & Fine-Pitch Ball Grid Array, 6x8 mm2, pitch: 0.8 mm, ∅=0.4mm (TFBGA48) .... 57
10
11
ORDERING INFORMATION..................................................................................................... 58
10.1 Ordering Part Number Definitions................................................................................. 58
10.2 Valid Part Numbers and Top Side Marking .................................................................. 59
HISTORY .................................................................................................................................. 60
List of Figures
Figure 3-1
Figure 3-2
Figure 3-3
Figure 3-4
Figure 4-1
Figure 7-1
Figure 7-2
Figure 7-3
Figure 8-1
Figure 8-2
Figure 8-3
Figure 8-4
Figure 8-5
LFBGA64 TOP VIEW (FACE DOWN)........................................................................... 2
56-PIN STANDARD TSOP (TOP VIEW)........................................................................ 2
TFBGA48 TOP VIEW (FACE DOWN)............................................................................ 2
48-PIN STANDARD TSOP (TOP VIEW)........................................................................ 2
Block Diagram................................................................................................................. 3
Enhanced Sector Protect/Un-protect IPB Program Algorithm...................................... 15
Lock Register Program Algorithm................................................................................. 16
IPB Program Algorithm................................................................................................. 18
Maximum Negative Overshoot ..................................................................................... 29
Maximum Positive Overshoot....................................................................................... 29
Switch Test Circuit ........................................................................................................ 31
Switching Test Waveform............................................................................................. 31
Instruction Write Operation Waveform.......................................................................... 33
ii
W29GL032C
Figure 8-6
Figure 8-7
Figure 8-8
Figure 8-9
Figure 8-10
Figure 8-11
Figure 8-12
Figure 8-13
Figure 8-14
Figure 8-15
Figure 8-16
Figure 8-17
Figure 8-18
Figure 8-19
Figure 8-20
Figure 8-21
Figure 8-22
Figure 8-23
Figure 8-24
Figure 8-25
Figure 8-26
Figure 8-27
Figure 9-1
Figure 9-2
Figure 9-3
Figure 9-4
Figure 10-1
Read Timing Waveform................................................................................................ 34
#RESET Timing Waveform........................................................................................... 35
Automatic Chip Erase Timing Waveform...................................................................... 36
Automatic Chip Erase Algorithm Flowchart.................................................................. 37
Automatic Sector Erase Timing Waveform................................................................... 38
Automatic Sector Erase Algorithm Flowchart............................................................... 39
Erase Suspend/Resume Flowchart .............................................................................. 40
Automatic Program Timing Waveform.......................................................................... 41
Accelerated Program Timing Waveform....................................................................... 41
CE# Controlled Write Timing Waveform....................................................................... 42
Automatic Programming Algorithm Flowchart .............................................................. 43
Silicon ID Read Timing Waveform................................................................................ 44
Data# Polling Timing Waveform (During Automatic Algorithms).................................. 45
Status Polling for Word Programming/Erase................................................................ 46
Status Polling for Write Buffer Program Flowchart....................................................... 47
Toggling Bit Timing Waveform (During Automatic Algorithms) .................................... 48
Toggle Bit Algorithm...................................................................................................... 49
#BYTE Timing Waveform For Read operations ........................................................... 50
Page Read Timing Waveform....................................................................................... 50
Deep Power Down mode Waveform ............................................................................ 51
Write Buffer Program Flowchart ................................................................................... 51
AC Timing at Device Power-Up.................................................................................... 52
TSOP 48-pin 12x20mm ................................................................................................ 54
TSOP 56-pin 14x20mm ................................................................................................ 55
LFBGA 64-ball 11x13mm ............................................................................................. 56
TFBGA 48-Ball 6x8mm................................................................................................. 57
Ordering Part Numbering.............................................................................................. 58
List of Tables
Table 5-1
Table 6-1
Table 6-2
Table 6-3
Table 7-1
Table 7-2
Table 7-3
Table 7-4
Table 7-5
Table 7-6
Table 7-7
Table 7-8
Table 7-9
Table 7-10
Table 7-11
Table 7-12
Table 7-13
Table 7-14
Table 7-15
Table 7-16
Table 7-17
Table 7-18
Table 7-19
Pin Description................................................................................................................ 3
High/Low Sector Table.................................................................................................... 4
Top Boot Sector Table.................................................................................................... 4
Bottom Boot Sector Table............................................................................................... 4
Device Bus Operation..................................................................................................... 5
Device Bus Operation (continue).................................................................................... 5
Polling During Embedded Program Operation ............................................................... 8
Polling During Embedded Sector Erase Operation ........................................................ 9
Polling During Embedded Chip Erase Operation ......................................................... 10
Polling During Embedded Erase Suspend ................................................................... 10
Polling During Embedded Program Suspend............................................................... 11
Polling Buffer Write Abort Flag ..................................................................................... 12
Auto Select for MFR/Device ID/Secure Silicon/Sector Protect Read.......................... 13
Lock Register Bits......................................................................................................... 16
Sector Protection Status Table..................................................................................... 19
Factory Locked: Security Sector................................................................................... 20
ID Reads, Sector Verify, and Security Sector Entry/Exit .............................................. 21
Program, Write Buffer, CFI, Erase and Suspend ......................................................... 22
Deep Power Down........................................................................................................ 22
Lock Register and Global Non-Volatile......................................................................... 23
IPB Functions............................................................................................................... 23
Volatile DPB Functions................................................................................................. 24
CFI Mode: ID Data Values............................................................................................ 25
Publication Release Date: October 18, 2011
iii
Preliminary - Revision E
W29GL032C
Table 7-20
Table 7-21
Table 7-22
Table 8-1
Table 8-2
Table 8-3
Table 8-4
Table 8-5
Table 8-6
Table 8-7
Table 8-8
Table 8-9
Table 8-10
Table 8-11
Table 8-12
Table 8-13
Table 10-1
Table 11-1
CFI Mode: System Interface Data Values .................................................................... 26
CFI Mode: Device Geometry Data Values.................................................................... 27
CFI mode: Primary Vendor-Specific Extended Query Data Values ............................. 28
Absolute Maximum Stress Ratings............................................................................... 29
Operating Temperature and Voltage ............................................................................ 29
DC Characteristics........................................................................................................ 30
Test Specification.......................................................................................................... 31
AC Characteristics ........................................................................................................ 33
AC Characteristics #RESET and RY/#BY .................................................................... 34
AC Characteristics Word/Byte Configuration (#BYTE)................................................. 49
AC Characteristics for Deep Power Down.................................................................... 51
AC Characteristics at Device Power Up....................................................................... 52
AC Characteristics for Erase and Programming Performance..................................... 53
Data Retention.............................................................................................................. 53
Latch-up Characteristics............................................................................................... 53
Pin Capacitance............................................................................................................ 53
Valid Part Numbers and Markings................................................................................ 59
Revision History............................................................................................................ 60
iv
W29GL032C
1
GENERAL DESCRIPTION
The W29GL032C Parallel Flash memory provides a storage solution for embedded system
applications that require better performance, lower power consumption and higher density. This device
has a random access speed of 70ns and a fast page access speed of 25ns, as well as significantly
faster program and erase times than the products comparable on the market today. The W29GL032C
also offers special features such as Compatible Manufacturer ID that makes the device industry
standard compatible without the need to change firmware.
2
FEATURES
•
•
32k-Word/64k-Byte uniform sector
architecture
– Total 64 uniform sectors
– Total 63 uniform sectors + eight 4k-
Word/8k-Byte sectors
•
Faster Erase and Program time
– Erase is 1.5x faster than industry
standard
– Program is 2x faster than industry
standard
– Allows for improved production
throughput and faster field updates
16-Word/32-Byte write buffer
– Reduces total program time for
multiple-word updates
•
•
CFI (Common Flash Interface) support
•
•
8-Word/16-Byte page read buffer
Single 3V Read/Program/Erase (2.7 -
3.6V)
Secured Silicon Sector area
– Programmed and locked by the
customer or during production.
– 128-word/256-byte sector for
permanent, safe identification using an
8-word/16-byte random electronic
serial number.
•
Enhanced Variable IO control
– All input levels (address, control, and
DQ) and output levels are determined
by voltage on the EVIO input. EVIO
ranges from 1.65 to VCC
•
#WP/ACC Input
– Accelerates programming time (when
VHH is applied) for greater throughput
during system production
– Protects first or last sector regardless
of sector protection settings
•
•
Enhanced Sector Protect using
Dynamic and Individual mechanisms
Polling/Toggling methods are used to
detect the status of program and erase
operation
•
•
•
Hardware reset input (#reset) resets
device
•
•
Suspend and resume commands used
for program and erase operations
Ready/#Busy output (RY/#BY) detects
completion of program or erase cycle
More than 100,000 erase/program
cycles
Packages
– Uniform Sector (H/L)
56-pin TSOP
64-ball LFBGA
– Boot Sector (T/B)
48-pin TSOP
•
•
•
•
•
More than 20-year data retention
Low power consumption
Deep power down mode
Wide temperature ranges
48-ball TFBGA
64-ball LFBGA
Compatible manufacturer ID for drop-in
replacement
– No firmware change is required
Publication Release Date: October 18, 2011
Preliminary - Revision E
1
W29GL032C
3
PIN CONFIGURATIONS
Figure 3-3
TFBGA48 TOP VIEW
(FACE DOWN)
Figure 3-1
LFBGA64 TOP VIEW
(FACE DOWN)
NC
NC
1
2
3
4
5
6
7
8
9
56 NC
55 NC
54 A16
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
A15
A14
A13
A12
A11
A10
A9
A8
A19
48
47
46
45
44
43
42
41
A16
#BYTE
VSS
DQ15/A-
DQ7
DQ14
DQ6
A15
A14
A13
A12
A11
A10
A9
53 #BYTE
52 VSS
51 DQ15/A-1
50 DQ7
49 DQ14
48 DQ6
47 DQ13
46 DQ5
45 DQ12
44 DQ4
43 VCC
42 DQ11
41 DQ3
40 DQ10
39 DQ2
38 DQ9
37 DQ1
36 DQ8
35 DQ0
34 #OE
33 VSS
32 #CE
31 A0
DQ13
40 DQ5
A20
39 DQ12
38 DQ4
37 VCC
36 DQ11
35 DQ3
34 DQ10
33 DQ2
32 DQ9
31 DQ1
30 DQ8
29 DQ0
A8 10
A19 11
A20 12
#WE 13
#RESET 14
NC 15
#WP/ACC 16
RY/#BY 17
A18 18
A17 19
A7 20
#WE
#RESET
NC
#WP/ACC
RY/#BY
A18
A17
A7
A6
A5
A4
#OE
VSS
28
27
A3 22
23
A1 24
A2
26 #CE
A0
25
A6 21
A5 22
A4 23
A3 24
A2 25
A1 26
Figure 3-4
48-PIN STANDARD TSOP
(TOP VIEW)
NC 27
30 NC
NC 28
29 EVIO
Figure 3-2
56-PIN STANDARD TSOP
(TOP VIEW)
2
W29GL032C
4
BLOCK DIAGRAM
VCC
EVIO
VSS
DQ0
#CE
#OE
.
.
.
.
#WE
.
OUTPUT
BUFFER
.
.
RY/#BY
#BYTE
#RESET
#WP/ACC
CONTROL
.
.
.
.
.
.
.
DQ15/A-1
DQ15/A-1
A0
.
.
.
.
.
.
.
.
.
.
DECODER
MAIN ARRAY
.
.
.
.
.
.
.
.
.
.
.
.
A20
Figure 4-1
Block Diagram
5 PIN DESCRIPTION
SYMBOL
PIN NAME
A0-A20
Address Inputs
DQ0-DQ14
DQ15/A-1
Data Inputs/Outputs
Word mode DQ15 is Data Input/Output
Byte mode A-1 is Address Input
#CE
#OE
Chip Enable
Output Enable
#WE
Write Enable
#WP/ACC
#BYTE
#RESET
RY/#BY
VCC
Hardware Write Protect/ Acceleration Pin
Byte Enable
Hardware Reset
Ready/Busy Status
Power Supply
Enhanced Variable IO Supply (No connect for top/bottom LFBGA64 configurations)
EVIO
VSS
Ground
NC
No Connection
Table 5-1
Pin Description
Publication Release Date: October 18, 2011
Preliminary - Revision E
3
W29GL032C
6
ARRAY ARCHITECTURE
6.1 H/L Sector Address Table
Sector Address
A20-A15
Sector Size
(KByte/KWord)
X8
X16
Start / Finish
Sector
Start / Finish
SA00
SA01
.
000000
000001
.
64/32
64/32
.
000000h
00FFFFh
01FFFFh
.
000000h 007FFFh
008000h 00FFFFh
010000h
.
.
.
SA62
SA63
Table 6-1
111110
111111
High/Low Sector Table
64/32
64/32
3E0000h 3EFFFFh 1F0000h 1F7FFFh
3F0000h 3FFFFFh 1F8000h 1FFFFFh
Note: The address range is [A20:A-1] in byte mode (#BYTE = VIL) or [A20:A0] in word mode (#BYTE = VIH)
6.2 Top Sector Address Table
Sector Address
A20-A12
Sector Size
(KByte/KWord)
X8
X16
Start / Finish
Sector
Start / Finish
SA00
SA01
.
000000xxx
000001xxx
.
64/32
64/32
.
000000h
00FFFFh
01FFFFh
.
000000h
007FFFh
010000h
.
008000h 00FFFFh
.
.
SA62
SA63
.
111110xxx
111111000
.
64/32
8/4
3E0000h 3EFFFFh 1F0000h 1F7FFFh
3F0000h
.
3F1FFFh 1F8000h 1F8FFFh
.
.
.
.
SA70
Table 6-2
111111111
8/4
3FE000h 3FFFFFh 1FF000h 1FFFFFh
Top Boot Sector Table
Note: The address range is [A20:A-1] in byte mode (#BYTE = VIL) or [A20:A0] in word mode (#BYTE = VIH)
6.3 Bottom Sector Address Table
Sector Address
A20-A12
Sector Size
(KByte/KWord)
X8
X16
Start / Finish
Sector
Start / Finish
SA00
.
000000000
.
8/4
.
000000h
001FFFh
000000h 000FFFh
.
.
.
.
SA07
SA08
.
000000111
000001xxx
.
8/4
64/32
.
00E000h 00FFFFh 007000h 007FFFh
010000h
.
01FFFFh 008000h 00FFFFh
.
.
.
SA70
Table 6-3
111111xxx
64/32
3F0000h 3FFFFFh 1F8000h 1FFFFFh
Bottom Boot Sector Table
Note: The address range is [A20:A-1] in byte mode (#BYTE = VIL) or [A20:A0] in word mode (#BYTE = VIH)
4
W29GL032C
7
FUNCTIONAL DESCRIPTION
7.1 Device Bus Operation
#BYTE
Data I/O
DQ[7:0]
Mode Select #Reset
#CE
#WE #OE Address(4)
VIL
VIH #WP/ACC
Data I/O DQ[15:8]
High-
Z
Device Reset
L
X
X
X
H
X
X
H
X
X
X
High-Z
High-Z
High-Z
High-Z
High-Z
High-Z
L/H
H
Standby
Mode
High-
Z
VCC±0.3V VCC±0.3V
Output
Disable
High-
Z
H
L
L/H
L/H
Read Mode
Write
H
H
L
L
H
L
L
AIN
AIN
DOUT
DIN
DOUT
DIN Note(1,2)
DQ[14:8]=High-
Z
H
Accelerated
Program
DQ15=A-1
H
L
L
H
AIN
DIN
DIN
VHH
Table 7-1
Notes:
Device Bus Operation
1. For High/Low configuration, either the first or last sector was protected if #WP/ACC=VIL.
For Top/Bottom Boot configuration, either the top or bottom two sectors are protected if #WP/ACC=VIL.
2. When #WP/ACC = VIH, the protection conditions of the outmost sector depends on previous protection conditions.
Refer to the enhanced protect feature.
3. DQ[15:0] are input (DIN) or output (DOUT) pins according to the requests of instruction sequence, sector protection,
or data polling algorithm.
4. In Word Mode (Byte#=VIH), the addresses are A20 to A0. In Byte Mode (Byte#=VIL), the addresses are A20 to A-1
(DQ15),.
Control Inputs
#CE #WE #OE
DQ[7:0]
T/B H/L BYTE WORD
DQ[15:8]
A20 A11
~12 ~10
A8
~7
A5 A3
~4 ~2
Description
A9
A6
A1 A0
Read Silicon ID MFR
Code
L
H
L
X
X
VHH
X
L
X
L
L
L
01
X
00
Cycle 1
Cycle 2
L
L
H
H
L
L
X
X
X
X
VHH
VHH
X
X
L
L
X
X
L
H
L
H
H
L
7E
1A 1D
X
X
22
22
01(T)
00(B)
Cycle 3
L
L
H
H
L
L
X
X
X
VHH
VHH
X
X
L
L
X
X
H
L
H
H
H
L
00
X
X
22
X
Sector Lock Status
Verification(1)
SA
01/00
Secure Sector (H) (2)
Secure Sector (L) (2)
L
L
H
H
L
L
X
X
X
X
VHH
VHH
X
X
L
L
X
X
L
L
H
H
H
H
9A/1A
8A/0A
X
X
X
X
Table 7-2
Notes:
Device Bus Operation (continue)
1. Sector unprotected code:00h. Sector protected code:01h.
2. Factory locked code: #WP protects high address sector: 9Ah. #WP protects low address sector: 8Ah. Factory
unlocked code: #WP protects high address sector: 1Ah. #WP protects low address sector: 0Ah
Publication Release Date: October 18, 2011
5
Preliminary - Revision E
W29GL032C
7.2
Instruction Definitions
The device operation can be initiated by writing specific address and data commands or sequences
into the instruction register. The device will be reset to reading array data when writing incorrect
address and data values or writing them in the improper sequence.
The addresses will be latched on the falling edge of #WE or #CE, whichever happens later; while the
data will be latched on the rising edge of #WE or #CE, whichever happens first. Please refer to timing
waveforms.
7.2.1 Reading Array Data
The default state after power up or a reset operation is the Read mode.
To execute a read operation, the chip is enabled by setting #CE and #OE active and #WE high. At the
same time, the required address or status register location is provided on the address lines. The
system reads the addressed location contents on the Data IO pins after the tCE and tOE timing
requirements have been met. Output data will not be accessible on the Data IO pins if either the
device or it’s outputs are not enabled by #CE or #OE being High, and the outputs will remain in a tri-
state condition.
When the device completes an embedded memory operation (i.e., Program, automatic Chip Erase or
Sector Erase) successfully, it will return to the Read mode and from any address in the memory array
the data can be read. However, If the embedded operation fails to complete, by verifying the status
register bit DQ5 (exceeds time limit flag) going high during the operations, at this time system should
execute a Reset operation causing the device to return to Read mode.
Some operating states require a reset operation to return to Read mode such as:
•
Time-out condition during a program or erase failed condition, indicated by the status register
bit DQ5 going High during the operation. Failure during either of these states will prevent the
device from automatically returning to Read mode.
•
During device Auto Select mode or CFI mode, a reset operation is required to terminate their
operation.
In the above two situations, the device will not return to the Read mode unless a reset operation is
executed (either hardware reset or software reset instruction) or the system will not be able to read
array data.
The device will enter Erase-Suspended Read mode if the device receives an Erase Suspend
instruction while in the Sector Erase state. The erase operation will pause (after a time delay not
exceeding 20µs) prior to entering Erase-Suspend Read mode. At this time data can be programmed
or read from any sector that is not being erased. Another way to verify device status is to read the
addresses inside the sectors being erased. This will only provide the contents of the status register.
Program operation during Erase-Suspend Read mode of valid sector(s) will automatically return to the
Erase-Suspend Read mode upon successful completion of the program operation.
An Erase Resume instruction must be executed to exit the Erase-Suspended Read mode, at which
time suspended erase operations will resume. Erase operation will resume where it left off and
continue until successful completion unless another Erase Suspend instruction is received.
7.2.2 Page Mode Read
The Page Mode Read has page sizes of 16 bytes or 8 words. The higher addresses A[20:3] accesses
the desired page. To access a particular word or byte in a page, it is selected by A[2:0] for word mode
and A[2:0,A-1] for byte mode. Page mode can be turned on by keeping “page-read address” constant
and changing the “intra-read page” addresses. The page access time is tAA or tCE, followed by tPA for
the page read time. When #CE toggles, access time is tAA or tCE.
6
W29GL032C
7.2.3 Device Reset Operation
Pulling the #RESET pin Low for a period equal to or greater than tRP will return the device to Read
mode. If the device is performing a program or erase operation, the reset operation will take at most a
period of tREADY1 before the device returns to Read mode. The RY/#BY pin will remain Low (Busy
Status) until the device returns to Read mode.
Note, the device draws larger current if the #RESET pin is held at voltages greater that GND+0.3V
and less than or equal to VIL. When the #RESET pin is held a GND±0.3V, the device only consumes
Reset (ICC5) current.
It is recommended to tie the system reset signal to the #RESET pin of the flash memory. This allows
the device to be reset with the system and puts it in a state where the system can immediately begin
reading boot code from it.
Executing the Reset instruction will reset the device back to the Read mode in the following situations:
•
•
•
•
During an erase instruction sequence, before the full instruction set is completed.
Sector erase time-out period
Erase failed, while DQ5 is High.
During program instruction sequence, before the full instruction set is completed, including the
erase-suspended program instruction.
•
•
•
•
Program failed, while DQ5 is High as well as the erase-suspended program failure.
Auto-select mode
CFI mode
The user must issue a reset instruction to reset the device back to the Read mode when the
device is in Auto-Select mode or CFI mode, or when there is a program or erase failure (DQ5
is High).
•
When the device is performing a Programming (not program fail) or Erasing (Not erase fail)
function, the device will ignore reset commands.
7.2.4 Standby Mode
Standby mode is entered when both #RESET and #CE are driven to VCC ±300mV (inactive state).
(Note, if both pins are not within the EVIO ±0.3V, but at VIH, standby current will be greater.) At this
time output pins are placed in the high impedance state regardless of the state of the #WE or #OE
pins and the device will draw minimal standby current (ICC4). If the device is deselected during erase
or program operation, the device will draw active current until the operation is completed.
7.2.5 Output Disable Mode
The #OE pin controls the state of the Data IO pins. If #OE is driven High (VIH), all Data IO pins will
remain at high impedance and if driven Low, the Data IO pins will drive data ( #OE has no affect on
the RY/BY# output pin).
7.2.6 Write Operation
To execute a write operation, Chip Enable (#CE) pin is driven Low and the Output Enable (#OE) is
pulled high to disable the Data IO pins to a high impedance state. The desired address and data
should be present on the appropriate pins. Addresses are latched on the falling edge of either #WE or
#CE and Data is latched on the rising edge or either #CE or #WE. To see an example, please refer to
timing diagrams in Figure 8-5 and Figure 8-15. If an invalid write instruction, not defined in this
datasheet is written to the device, it may put the device in an undefined state.
Publication Release Date: October 18, 2011
7
Preliminary - Revision E
W29GL032C
7.2.7 Byte/Word Selection
To choose between the Byte or Word mode, the #BYTE input pin is used to select how the data is
input/output on the Data IO pins and the organization of the array data. If the #BYTE pin is driven
High, Word mode will be selected and all 16 Data IO pins will be active. If the #BYTE is pulled Low,
Byte mode will be active and only Data IO DQ[7:0] will be active. The remaining Data IO pins
(DQ[14:8]) will be in a high impedance state and DQ15 becomes the A-1 address input pin.
7.2.8 Automatic Programming of the Memory Array
To program the memory array in Byte or Word mode, refer to the Instruction Definition Tables for
correct cycle defined instructions that include the 2 unlocking instruction cycles, the A0h program cycle
instruction and subsequent cycles containing the specified address location and the byte or word
desired data content, followed by the start of the embedded algorithm to automatically program the
array.
Once the program instruction sequence has been executed, the internal state machine commences
execution of the algorithms and timing necessary for programming and cell verification. Included in this
operation is generating suitable program pulses, checking cell threshold voltage (VT) margins, and if
any cells do not pass verification or have acceptable margins, repetitive program pulse sequence will
be cycled again. The internal process mechanisms will protect cells that do pass margin and
verification tests from being over-programmed by prohibiting further program pulses to passing cells
as failing cells continue to be run through the internal programming sequence until the pass.
This feature allows the user to only perform the auto-programming sequence once and the device
state machine takes care of the program and verification process.
Array bits during programming can only change a bit status of “1” (erase state) to a “0” (programmed
state). It is not possible to do the reverse with a programming operation. This can only be done by first
performing an erase operation. Keep in mind, the internal write verification only checks and detects
errors in cases where a “1” is not successfully programmed to “0”.
During the embedded programming algorithm process any commands written to the device will be
ignored, except hardware reset or program suspend instruction. Hardware reset will terminate the
program operation after a period of time, not to exceed 10µs. If in the case a Program Suspend was
executed, the device will enter the programs suspend read mode. When the embedded program
algorithm is completed or the program is terminated by a hardware reset, the device will return to
Read mode.
The user can check for completion by reading the following bits in the status register, once the
embedded program operation has started:
Status
DQ7
DQ7#
DQ7#
DQ6
Toggling
Toggling
DQ5
0
1
DQ1
0
N/A
RY/#BY1
0
0
In progress
Exceeded time
limit
Table 7-3
Note:
Polling During Embedded Program Operation
1. RY/#BY is an open drain output pin and should be connected to VCC through a high value pull-up resistor.
8
W29GL032C
7.2.9 Erasing the Memory Array
Sector Erase and Chip Erase are the two possible types of erase operations executed on the memory
array. Sector Erase operation erases one or more selected sectors and this can be simultaneous. Chip
Erase operation erases the entire memory array, except for any protected sectors.
7.2.9.1
Sector Erase
The sector erase operation returns all selected sectors in memory to the “1” state, effectively clearing
all data. This action requires six instruction cycles to commence the erase operation. The unlock
sequence is the first two cycles, followed by the configuration cycle, the fourth and fifth are
also ”unlock cycles”, and the Sector Erase instruction is the sixth cycle. An internal 50µs time-out
counter is started once the sector erase instruction sequence has been completed. During this time,
additional sector addresses and Sector Erase commands may be issued, thus allowing for multiple
sectors to be selected and erased simultaneously. Once the 50µs time-out counter has reached its
limit, no additional command instructions will be accepted and the embedded sector erase algorithm
will commence.
Note, that the 50µs time-out counter restarts after every sector erase instruction sequence. The device
will abort and return to Read mode, if any instruction other than Sector Erase or Erase Suspend is
attempted during the time-out period.
Once the embedded sector erase algorithm begins, all instructions except Erase Suspend or
Hardware Reset will be ignored. The hardware reset will abort the erase operation and return the
device to the Read mode.
The embedded sector erase algorithm status can be verified by the following:
Status
DQ7
DQ6
DQ5
DQ31
DQ2
RY/#BY2
Time-out period
In progress
0
0
0
Toggling
Toggling
Toggling
0
0
1
0
1
1
Toggling
Toggling
Toggling
0
0
0
Exceeded time limit
Table 7-4
Note:
Polling During Embedded Sector Erase Operation
1. The DQ3 status bit is the 50µs time-out indicator. When DQ3=0, the 50µs time-out counter has not yet reached zero
and the new Sector Erase instruction maybe issued to specify the address of another sector to be erased. When
DQ3=1, the 50µs time-out counter has expired and the Sector Erase operation has already begun. Erase Suspend is
the only valid instruction that maybe issued once the embedded erase operation is underway.
2. RY/#BY is an open drain output pin and should be connected to VCC through a high value pull-up resistor.
3. When an attempt is made to erase only protected sector(s), the erase operation will abort thus preventing any data
changes in the protected sector(s). DQ7 will output “0” and DQ6 will toggle briefly (100µs or less) before aborting and
returning the device to Read mode. If unprotected sectors are also specified, however, they will be erased normally
and the protected sector(s) will remain unchanged.
4. DQ2 is a localized indicator showing a specified sector is undergoing erase operation or not. DQ2 toggles when user
reads at the addresses where the sectors are actively being erased (in erase mode) or to be erased (in erase
suspend mode).
Publication Release Date: October 18, 2011
9
Preliminary - Revision E
W29GL032C
7.2.9.2
Chip Erase
The Chip Erase operation returns all memory locations containing a bit state of “0” to the “1” state,
effectively clearing all data. This action requires six instruction cycles to commence the erase
operation. The unlock sequence is the first two cycles, followed by the configuration cycle, the fourth
and fifth are also ”unlock cycles”, and the sixth cycle initiates the chip erase operation.
Once the chip erase algorithm begins, no other instruction will be accepted. However, if a hardware
reset is executed or the operating voltage is below acceptable levels, the chip erase operation will be
terminated and automatically returns to Read mode.
The embedded chip erase algorithm status can be verified by the following:
Status
DQ7
DQ6
DQ5
DQ2
RY/#BY1
In progress
0
0
Toggling
Toggling
0
1
Toggling
Toggling
0
0
Exceeded time limit
Table 7-5
Note:
Polling During Embedded Chip Erase Operation
1. RY/#BY is an open drain pin and should be connected to VCC through a high value pull-up resistor.
7.2.10 Erase Suspend/Resume
If there is a sector erase operation in progress, an Erase Suspend instruction is the only valid
instruction that may be issued. Once the Erase Suspend instruction is executed during the 50µs time-
out period following a Sector Erase instruction, the time-out period will terminate right away and the
device will enter Erase-Suspend Read mode. If an Erase Suspend instruction is executed after the
sector erase operation has started, the device will not enter Erase-Suspended Read mode until
approximately 20µs (5µs typical) time has elapsed. To determine the device has entered the Erase-
Suspend Read mode, use DQ6, DQ7 and RY/#BY status to verify the state of the device.
Once the device has entered Erase-Suspended Read mode, it is possible to read or program any
sector(s) except those being erased by the erase operation. Only the contents of the status register is
present when attempting to read a sector that has been scheduled to erase or be programmed when
in the suspend mode. A resume instruction must be executed and recommend checking DQ6 toggle
bit status, before issuing another erase instruction.
The status register bits can be verified to determine the current status of the device:
Status
DQ7 DQ6 DQ5DQ3 DQ2 DQ1RY/#BY
Erase suspend read in erase suspended sector
Erase suspend read in non-erase suspended sector
Erase suspend program in non-erase suspended sector DQ7# Toggle
Table 7-6 Polling During Embedded Erase Suspend
1
No toggle 0 N/A Toggle N/A
Data Data DataData Data Data
N/A N/A N/A
1
1
0
0
Instruction sets such as read silicon ID, sector protect verify, program, CFI query and erase resume
can also be executed during Erase-Suspend mode, except sector and chip erase.
7.2.11 Sector Erase Resume
Only in the Erase-Suspended Read mode can the Sector Erase Resume instruction be a valid
command. Once erase resumes, another Erase Suspend instruction can be executed, but allow a
400µs interval between Erase Resume and the next Erase Suspend instruction.
10
W29GL032C
7.2.12 Program Suspend/Resume
Once a program operation is in progress, a Program Suspend is the only valid instruction that maybe
executed. Verifying if the device has entered the Program-Suspend Read mode after executing the
Program-Suspend instruction, can be done by checking the RY/#BY and DQ6. Programming should
halt within 15µs maximum (5µs typical).
Any sector(s) can be read except those being program suspended. Trying to read a sector being
program suspended is invalid. Before another program operation can be executed, a Resume
instruction must be performed and DQ6 toggling bit status has to be verified. Use the status register
bits shown in the following table to determine the current state of the device:
Status
DQ7 DQ6 DQ5 DQ3 DQ2 DQ1 RY/#BY
Program suspend read in program suspended sector
Invalid
1
1
Program suspend read in non-program suspended sector Data Data Data Data Data Data
Table 7-7 Polling During Embedded Program Suspend
Instruction sets such as read silicon ID, sector protect verify, program, CFI query can also be executed
during Program/Erase-Suspend mode.
7.2.13 Program Resume
The program Resume instruction is valid only when the device is in Program-Suspended mode. Once
the program resumes, another Program Suspend instruction can be executed. Insure there is at least
a 5µs interval between Program Resume and the next Suspend instruction.
7.2.14 Programming Operation
Write Buffer Programming Operation, programs 32-bytes or 16-words in a two step programming
operation. To begin execution of the Write Buffer Programming, start with the first two unlock cycles,
the third cycle writes the programming Sector Address destination followed by the Write Buffer Load
Instruction (25h). The fourth cycle repeats the Sector Address, while the write data is the number of
intended word locations to be written minus one. (Example, if the number of word locations to be
written is 9, then the value would be 8h.) The 5th cycle is the first starting address/data set. This will be
the first pair to be programmed and consequentially, sets the “write-buffer-page” address. Repeat
Cycle 5 format for each additional address/data sets to be written to the buffer. Keep in mind all sets
must remain within the write buffer page address range. If not, operation will ABORT.
The “write-buffer-page” is selected by choosing address A[20:5].
The second step will be to program the contents of the write buffer page. This is done with one cycle,
containing the sector address that was used in step one and the “Write to Buffer Program Confirm”
instruction (29h).
Standard suspend/resume commands can be used during the operation of the write-buffer. Also, once
the write buffer programming operation is finished, it’ll return to the normal READ mode.
Write buffer programming can be conducted in any sequence. However the CFI functions, autoselect,
Secured Silicon sector are not functional when program operation is in progress. Multiple write buffer
programming operations on the same write buffer address range without intervention erase is
accessible. Any bit in a write buffer address range cannot be programmed from 0 back to 1.
Publication Release Date: October 18, 2011
11
Preliminary - Revision E
W29GL032C
7.2.15 Buffer Write Abort
Write Buffer Programming Sequence will ABORT, if the following condition takes place:
•
•
•
•
The word count minus one loaded is bigger than the page buffer size (32) during, “Number of
Locations to Program.”
Sector Address written is not the same as the one specified during the Write-Buffer-Load
instruction.
If the Address/Data set is not inside the Write Buffer Page range which was set during cycle
5’s first initial write-buffer-page select address/data set.
No “Program Confirm Instruction” after the assigned number of “data load” cycles.
After Write Buffer Abort, the status register will be DQ1=1, DQ7 = DATA# (last address loaded),
DQ6=toggle, DQ5=0. This status represents a Write Buffer Programming Operation was ABORTED. A
Write-to-Buffer-Abort Reset instruction sequence has to be written to reset the device back to the read
array mode.
DQ1 is the bit for Buffer Write Abort. When DQ1=1, the device will abort from buffer write operation
and go back to read status register shown in the following table:
Status
DQ7
DQ7#
DQ7#
DQ7#
DQ6
DQ5 DQ3 DQ2 DQ1
RY/#BY
Buffer Write Busy
Buffer Write Abort
Buffer Write Exceeded Time Limit
Toggle
Toggle
Toggle
0
0
1
N/A
N/A
N/A
N/A
N/A
N/A
0
1
0
0
0
0
Table 7-8
Polling Buffer Write Abort Flag
7.2.16 Accelerated Programming Operation
The device will enter the Accelerated Programming mode by applying high voltage (VHH) to the
#WP/ACC pin. Accelerated Programming mode allows the system to skip the normal unlock
sequences instruction and program byte/word locations directly. The current drawn from the #WP/ACC
pin during accelerated programming is no more than IACC1. Important Note: Do not exceed 10
accelerated programs per sector. (#WP/ACC should not be held at VHH for any other function except
for programming or damage to the device may occur.)
7.2.17 Automatic Select Bus Operation
There are basically two methods to access Automatic Selection Operations; Automatic Select
Instructions through software commands and High Voltage applied to A9. See Automatic Select
Instruction Sequence later on in this section for details of equivalent instruction operations that do not
require the use of VHH. The following five bus operations require A9 to be raised to VHH.
7.2.17.1 Sector Lock Status Verification
To verify the protected state of any sector using bus operations, execute a Read Operation with VHH
applied to A9, the sector address present on address pins A[20:12], address pins A6, A3, A2, and A0
held Low, and address pins A1 held High. If DQ0 is Low, the sector is considered not protected, and if
DQ0 is High, the sector is considered to be protected.
7.2.17.2 Read Silicon Manufacturer ID Code
Winbond’s 29GL family of Parallel Flash memories feature an Industry Standard compatible
Manufacturer ID code of 01h. To verify the Silicon Manufacturer ID code, execute a Read Operation
with VHH applied to the A9 pin and address pins A6, A3, A2, A1 and A0 are held Low. The ID code
can then be read on data bits DQ[7:0].
12
W29GL032C
7.2.17.3 Read Silicon Device ID Code
To verify the Silicon Device ID Codes, execute a Read Operation with VHH applied to the A9 pin and
address pins A6, A3, A2, A1, and A0 have several bit combinations to return the Winbond Device ID
codes of 7Eh, 21h or 01h, which is shown on the data bits DQ[7:0]. See Table 7-2.
7.2.17.4 Read Indicator Bit DQ7 for Security Sector High and Low Address
To verify that the Security Sector has been factory locked, execute a Read Operation with VHH applied
to A9, address pins A6, A3, and A2 are held Low, and address pins A1 and A0 are held High. If the
Security Sector has been factory locked, the code 9Ah(Highest Address Sector) or 8Ah(Lowest
Address Sector) will be shown on the data bits DQ[7:0]. Otherwise, the factory unlocked code of
1Ah(H)/0A(L) will be shown.
7.2.18 Automatic Select Operations
The Automatic Select instruction show in Table 7-13 can be executed if the device is in one of the
following modes; Read, Program Suspended, Erase-Suspended Read, or CFI. At which time the user
can issue (two unlock cycles followed by the Automatic Select instruction 90h) to enter Automatic
Select mode. Once in the Automatic Select mode, the user can query the Manufacturer ID, Device ID,
Security Sector locked status, or Sector protected status multiple times without executing the unlock
cycles and a Automatic Select instruction (90h) again.
Once in Automatic Select mode, executing a Reset instruction (F0h) will return the device back to the
valid mode from which it left when the Automatic Select mode was first executed.
Another way previously mentioned to enter Automatic Select mode is to use one of the bus operation
shown Table 7-2 in Device Bus Operation. Once the high voltage (VHH) is removed from the A9 pin,
the device will return back to the valid mode from which it left when the Automatic Select mode was
first executed.
7.2.19 Automatic Select Instruction Sequence
Accessing the manufacturer ID, device ID, and verifying whether or not secured silicon is locked and
whether or not a sector protected is the purpose of Automatic Select mode. There are four instruction
cycles that comprise the Automatic Select mode. The first two cycles are write unlock commands,
followed by the Automatic Select instruction (90h). The fourth cycle is a read cycle, and the user may
read at any address any number of times without entering another instruction sequence. To exit the
Automatic Select mode and back to read array, the Reset instruction is necessary. No other
instructions are allowed except the Reset Instruction once Automatic Select mode has been selected.
Refer to the following table for more detailed information.
Address
X00
Data (hex)
01
Representation
Word
Byte
Word
Byte
Word
Byte
Manufacturer ID
H/L
T/B
X00
01
X01/0E/0F
X02/1C/1E
X01/0E/0F
X02/1C/1E
227E/221D/2201
7E/1D/01
227E/221A/2201(T)/2200(B)
7E/1A/01(T)/00(B)
9A/1A(H)
Device ID
Word
Byte
X03
X06
Factory locked/unlocked
Factory locked/unlocked
8A/0A(L)
9A/1A(H)
8A/0A(L)
Secure Silicon
Word (Sector address) X02
Byte Sector address) X04
00/01
00/01
Unprotected/protected
Unprotected/protected
Sector Protect Verify
Table 7-9
Auto Select for MFR/Device ID/Secure Silicon/Sector Protect Read
Publication Release Date: October 18, 2011
Preliminary - Revision E
13
W29GL032C
7.2.20 Enhanced Variable IO (EVIO) Control
The Enhanced Variable IO (EVIO) control allows the host system to set the voltage levels that the
device generates and tolerates on all inputs and outputs (address, control, and DQ signals). EVIO
range is 1.65 to VCC.
For example, a EVIO of 1.65-3.6 volts allows for I/O at the 1.8 or 3 volt levels, driving and receiving
signals to and from other 1.8 or 3 V devices on the same data bus.
7.2.21 Hardware Data Protection Options
Hardware Data Protection is the second of the two main sector protections offered by the W29GL032.
7.2.21.1 #WP/ACC Option
By setting the #WP/ACC pin to VIL, the highest or lowest sector (device specific) is protected from all
erase/program operations. If #WP/ACC is set High, the highest and Lowest sector revert back to the
previous protected/unprotected state.
Note: The max input load current can increase, if #WP/ACC pin is at VIH when the device is put into
standby mode.
7.2.21.2 VCC Write Protect
This device will not accept any write instructions when VCC is less that VWPT (VCC Write Protect
Threshold)). This prevents data from inadvertently being altered during power-up, power-down, a
temporary power loss or to the low level of VCC. If VCC is lower that VWPT, the device automatically
resets itself and will ignore write cycles until VCC is greater than VWPT. Once VCC rises above VWPT,
insure that the proper signals are on the control pins to avoid unexpected program or erase operations.
7.2.21.3 Write Pulse “Glitch” Protection
Pulses less than 5ns are viewed as glitches for control signals #CE, #WE, and #OE and will not be
considered for valid write cycles.
7.2.21.4 Power-up Write Inhibit
The device ignores the first instruction on the rising edge of #WE, if upon powering up the device,
#WE and #CE are set at VIL and #OE is set at VIH.
7.2.21.5 Logical Inhibit
A write cycle is ignored when either #CE is at VIH, #WE is at VIH, or #OE is at VIL. A valid write cycle
requires both #CE and #WE are at VIL with #OE at VIH.
7.2.22 Inherent Data Protection
The device built-in mechanism will reset to Read mode during power up to avoid accidental erasure or
programming.
7.2.22.1 Instruction Completion
Invalid instruction sets will result in the memory returning to read mode. Only upon a successful
completion of a valid instruction set will the device begin its erase or program operation..
7.2.22.2 Power-up Sequence
The device is placed in Read mode, during power-up sequence.
7.2.23 Power Supply Decoupling
To reduce noise effects, a 0.1µF capacitor is recommended to be connected between VCC and GND.
14
W29GL032C
7.3 Enhanced Sector Protect/Un-protect
This device is set from the factory in the Individual Protection mode of the Enhanced Sector Protect
scheme. The user can disable or enable the programming or erasing operation to any individual sector
or whole chip. The figure below helps describe an overview of these methods.
The device defaults to the Individual mode and all sectors are unprotected when shipped from the
factory.
The following flow chart shows the detailed algorithm of Enhanced Sector Protect:
Start
Individual Protection
Mode
(Default)
IPB=0
Set IPB
IPB lock Bit locked
All IPB not changeable
Lock Bit
IPB=1
IPB Lock bit Unlocked
IPB is Changeable
Dynamic Write Protect bit
(DPB)
Sector Array
Individual Protect bit
(IPB)
DPB=0 Sector Protect
IPB=0 Sector Protect
DPB=1 Sector Unprotect
IPB=1 Sector Unprotect
SA 0
SA 1
SA 2
DPB 0
DPB 1
DPB 2
IPB 0
IPB 1
IPB 2
.
.
.
.
.
.
.
.
.
.
.
.
SA + n
DPB + n
IPB + n
Figure 7-1
Enhanced Sector Protect/Un-protect IPB Program Algorithm
Publication Release Date: October 18, 2011
Preliminary - Revision E
15
W29GL032C
7.3.1 Lock Register
User can choose Secured Silicon Sector Protection Bit for security sector protection method via setting
the Lock Register bit, DQ0. Lock Register is a 16-bit one time programmable register. Once
programmed DQ0, will be locked in that mode permanently.
Once the Instruction Set Entry instruction sequence for the Lock Register Bits is issued, all sectors
read and write functions are disabled until Lock Register Exit sequence has been executed.
The memory sectors and extended memory sector protection is configured using the Lock Register.
DQ[15:1]
Don’t Care
DQ0
Secured Silicon Sector Protection Bit
Table 7-10
Lock Register Bits
Start
Write Data AAh, Address 555h
Write Data 55h, Address2AAh
Write Data 40h, Address 555h
Write Data A0h, Address don’t care
Write Program Data, Address don’t care
Data # Polling Algorithm
Lock Register instruction set entry
Lock Register data program
YES
Done
NO
Pass
NO
DQ5=1
YES
Fail
Exit lock Register instruction
Reset instruction
Figure 7-2
Lock Register Program Algorithm
16
W29GL032C
7.3.2 Individual (Non-Volatile) Protection Mode
7.3.2.1
Individual Protection Bits (IPB)
The Individual Protection Bit (IPB) is a nonvolatile bit, one bit per sector, with endurance equal to that
of the Flash memory array. Before erasing, IPB preprogramming and verification is managed by the
device, so no monitoring is necessary.
The Individual Protection Bits are set sector by sector by the IPB program instruction. Once a IPB is
set to “0”, the linked sector is protected, blocking any program and/or erase functions on that sector.
The IPB cannot be erased individually, but executing the “All IPB Erase” instruction will erase all IPB
simultaneously. Read and write functions are disabled when IPB programming is going on for all
sectors until this mode exits.
In case one of the protected sectors need to be unprotected, first, the IPB Lock Bit must be set to “1”
by performing one of the following: power-cycle the device or perform a hardware reset. Second, an
“All IPB Erase instruction needs to be performed. Third, Individual Protection Bits need to be set once
again to reflect the desired settings and finally, the IPB Lock Bit needs to be set once again which
locks the Individual Protection Bits and the device functions normally once again.
Executing an IPB Read instruction to the device is required to verify the programming state of the IPB
for any given sector. Refer to the IPB Program Algorithm flow chart below for details.
Note that
•
While IPB Lock Bit is set, Program and/or erase instructions will not be executed and times
out without programming and/or erasing the IPB.
•
For best protection results, it is recommended to execute the IPB Lock Bit Set instruction early
on in the boot code. Also, protect the boot code by holding WP#/ACC = VIL. Note that the IPB
and DPB bits perform the same when WP#/ACC = VHH, and when WP#/ACC =VIH.
•
While in the IPB command mode, read within that sector will bring the IPB status back for that
sector. All Read must be executed by the read mode.
•
Issuing the IPB Instruction Set Exit will reset the device to normal read mode enabling reads
and writes for the array.
7.3.2.2
Dynamic Protection Bits (DPB)
Dynamic Protection allows the software applications to easily protect sectors against unintentional
changes, although, the protection can be readily disabled when changes are needed.
All Dynamic Protection Bits (DPB) are individually linked to their associated sectors and these volatile
bits can be modified individually (set or cleared). The DPB provide protection schemes for only
unprotected sectors that have their associated IPB cleared. To change a DPB, the “DPB Instruction
Set Entry” must be executed first and then either the DPB Set (programmed to “0”) or DPB Clear
(erased to “1”) commands have to be executed. This places each sector in the protected or
unprotected state separately. To exit the DPB mode, execute the “DPB Instruction Set Exit” instruction.
Note that
•
When the parts are first shipped, the IPB are cleared (erased to “1”) and upon power up or
reset, the DPB can be set or cleared.
Publication Release Date: October 18, 2011
17
Preliminary - Revision E
W29GL032C
IPB instruction set entry
Program IPB
Read DQ[7:0] twice
NO
DQ6=Toggle?
YES
NO
DQ5=1?
Wait 500µs
YES
Read DQ[7:0] twice
NO
NO
DQ6=Toggle?
YES
Read DQ[7:0] twice
DQ0=
‘1’ (Erase) or
‘0’ (Program)
YES
Pass
Program Fail Write Reset CMD
IPB instruction set Exit
Figure 7-3
IPB Program Algorithm
Note:
1. IPB program/erase status polling flowchart: Check DQ6 toggle, when DQ6 stop toggle, the read status is 00h/01h
(00h for program and 01h for erase, otherwise the status is “fail’ and “exit”.
7.3.2.3
Individual Protection Bit Lock Bit
The Individual Protection Bit Lock Bit (IPBLK) is a global lock bit to control all IPB states. It is a
singular volatile bit. If the IPBLK is set (“0”), all IPB are locked and all sectors are protected or
unprotected according to their individual IPB. When IPBLK=1 (cleared), all IPB are unlocked and
allowed to be set or cleared.
To clear the IPB Lock Bit, a hardware reset or a power-up cycle must be executed.
.
18
W29GL032C
Sector Protection Status
Sector Status
DPB
clear
clear
clear
clear
set
IPBLK
clear
clear
set
IPB
clear
set
Unprotect, DPB and IPB are changeable
Protect, DPB and IPB are changeable
Unprotect, DPB is changeable
clear
set
set
Protect, DPB is changeable
clear
clear
set
clear
set
Protect, DPB and IPB are changeable
Protect, DPB and IPB are changeable
Protect, DPB is changeable
set
set
clear
set
set
set
Protect, DPB is changeable
Table 7-11
Sector Protection Status Table
Publication Release Date: October 18, 2011
Preliminary - Revision E
19
W29GL032C
7.4 Security Sector Flash Memory Region
An extra memory space length of 128 words is used as the Security Sector Region which can be
factory locked or customer lockable. To enquire about the lock status of the device, the customer can
issue a Security Sector Protect Verify or Security Sector Factory Protect Verify using Automatic Select
Address 03h and DQ7.
The security sector region is unprotected when shipped from factory and the security silicon indicator
bit (DQ7) is set to "0" for a customer lockable device. The security sector region is protected when
shipped from factory and the security silicon sector indicator bit is set to "1" for a factory-locked device.
7.4.1 Factory Locked: Security Sector Programmed and Protected at factory
In a factory locked device, the Security Sector is permanently locked prior to factory shipment The
ESN occupies addresses 00000h to 00007h in word mode for all configurations since the device has a
16-byte (8-word) ESN(Electronic Serial Number) in the security region.
Security Silicon Sector
Address Range
Standard Factory
Locked
Express Flash Factory Customer
Locked
Lockable
ESN or Determined by
Customer
000000h-000007h
ESN
Determined by
Customer
000008h-00007Fh
Inaccessible
Determined by Customer
Table 7-12
Factory Locked: Security Sector
7.4.2 Customer Lockable: Security Sector Not Programmed or Protected
Important Notice; Once the security silicon sector is protected (Lock Register OTP DQ0 = “0”, Security
Sector indicator DQ7 bit=”0”), there is no way to unprotect the security silicon sector and the contents
of the memory region can no longer be programmed.
Once the security silicon is locked and verified, an Exit Security Sector Region instruction must be
executed to get back to the Read Array mode. A power cycle, or a hardware reset will also return the
device to read array mode.
This region can act as extra memory space when this security feature is not utilized. It is important to
note, the security sector region is a One Time Programmable (OTP) region. You can overwrite a
WORD, but you cannot change the state of a programmed cell.
20
W29GL032C
7.5 Instruction Definition Tables
1st Bus
Cycle
2nd Bus
Cycle
3rd Bus
Cycle
5th Bus
Cycle
6th Bus Cycle
4th Bus Cycle
Instruction
ADD DATA ADD DATA ADD DATA ADD
WORD Add Data
BYTE Add Data
DATA ADD DATA ADD DATA
Read Mode
WORD XXX
BYTE XXX
F0
F0
Reset Mode
Silicon ID
Device ID
WORD 555
BYTE AAA
WORD 555
BYTE AAA
AA
AA
AA
AA
2AA
555
2AA
555
55
55
55
55
555
AAA
555
90
90
90
90
X00
X00
X01
X02
01
01
ID1
ID1
X0E
X1C
ID2
ID2
X0F
X1E
ID3
ID3
AAA
9A/1A(H)
8A/0A(L)
WORD 555
BYTE AAA
AA
AA
2AA
555
55
55
555
90
90
X03
X06
Factory Protect
Verify
9A/1A(H)
8A/0A(L)
AAA
WORD 555
BYTE AAA
WORD 555
BYTE AAA
WORD 555
BYTE AAA
AA
AA
AA
AA
AA
AA
2AA
555
2AA
555
2AA
555
55
55
55
55
55
55
555
AAA
555
90 (SA)X02 00/01
Sector Protect
Verify
90 (SA)X04 00/01
88
88
Security Sector
Region
AAA
555
90
90
XXX
XXX
00
00
Exit Security Sector
AAA
Table 7-13
ID Reads, Sector Verify, and Security Sector Entry/Exit
Publication Release Date: October 18, 2011
Preliminary - Revision E
21
W29GL032C
1st Bus
Cycle
2nd Bus
Cycle
3rd Bus
Cycle
4th Bus
Cycle
5th Bus
Cycle
6th Bus Cycle
Instruction
ADD DATA ADD DATA ADD DATA ADD DATA ADD DATA ADD DATA
WORD 555
BYTE AAA
WORD 555
BYTE AAA
AA
AA
AA
AA
2AA
555
2AA
555
55
55
55
55
555
AAA
SA
A0
A0
25
25
F0
F0
Add Data
Add Data
Program
SA
SA
N-1
N-1
WA
WA
WD
WD
WBL
WBL
WD
WD
Write to Buffer Program
SA
555
AAA
WORD 555
BYTE AAA
WORD SA
BYTE SA
WORD 555
BYTE AAA
WORD 555
BYTE AAA
WORD 55
BYTE AA
WORD XXX
BYTE XXX
WORD XXX
BYTE XXX
AA
AA
29
2AA
555
55
55
Write to Buffer Program
Abort Reset
Write to Buffer Program
Confirm
29
AA
AA
AA
AA
98
2AA
555
2AA
555
55
55
55
55
555
AAA
555
80
80
80
80
555
AAA
555
AA
AA
AA
AA
2AA
555
2AA
555
55
55
55
55
555
AAA
SA
10
10
30
30
Chip Erase
Sector Erase
AAA
AAA
SA
CFI Read
98
B0
B0
30
Program/Erase Suspend
Program/Erase Resume
30
Table 7-14
Program, Write Buffer, CFI, Erase and Suspend
WA=WRITE ADDRESS, WD=WRITE DATA, SA=SECTOR ADDRESS, N-1=WORD COUNT, WBL=WRITEBUFFER LOCATION, ID1/ID2/ID3: REFER TO Table 7-2 FOR
DETAIL ID.
1st Bus Cycle 2nd Bus Cycle 3rd Bus Cycle 4th Bus Cycle 5th Bus Cycle
Instruction
ADD DATA ADD
DATA
ADD DATA ADD DATA ADD DATA
WORD 555
AA
2AA
555
55
XXX
XXX
B9
B9
ENTER
BYTE AAA
WORD XXX
BYTE XXX
AA
AB
AB
55
EXIT
Table 7-15
Deep Power Down
22
W29GL032C
1st Bus Cycle 2nd Bus Cycle 3rd Bus Cycle 4th Bus Cycle 5th Bus Cycle
Instruction
ADD DATA ADD
DATA
ADD DATA ADD DATA ADD DATA
Lock Register
Instruction Set
Entry
WORD 555
AA
2AA
55
555
40
40
BYTE AAA
WORD XXX
BYTE XXX
AA
A0
A0
555
XXX
XXX
55
AAA
DATA
DATA
Program
Read
WORD XXX
BYTE XXX
WORD XXX
BYTE XXX
WORD 555
BYTE AAA
WORD XXX
BYTE XXX
WORD XXX
BYTE XXX
WORD SA
DATA
DATA
90
XXX
XXX
2AA
555
SA
00
00
55
55
00
00
30
30
Lock Register
Instruction Exit
90
AA
555
C0
C0
IPB Instruction Set
Entry
AA
AAA
A0
IPB Program
All IPB Erase
A0
SA
80
00
80
00
00/01
00/01
IPB Status Read
BYTE
SA
Table 7-16
Lock Register and Global Non-Volatile
1st Bus Cycle 2nd Bus Cycle 3rd Bus Cycle 4th Bus Cycle 5th Bus Cycle
Instruction
ADD DATA ADD
DATA
ADD DATA ADD DATA ADD DATA
WORD XXX
BYTE XXX
90
90
XXX
XXX
00
IPB Instruction Set
Exit
00
WORD 555
BYTE AAA
AA
AA
2AA
555
55
55
00
00
555
50
50
IPB Instruction Set
Entry
AAA
WORD XXX
BYTE XXX
WORD XXX
BYTE XXX
WORD XXX
BYTE XXX
A0
A0
XXX
XXX
IPB Lock Set
00/01
00/01
90
IPB Lock Status
Read
XXX
XXX
00
00
IPB Lock Instruction
Set Exit
90
Table 7-17
IPB Functions
Publication Release Date: October 18, 2011
Preliminary - Revision E
23
W29GL032C
1st Bus Cycle 2nd Bus Cycle 3rd Bus Cycle 4th Bus Cycle 5th Bus Cycle
Instruction
ADD DATA ADD
DATA
55
ADD DATA ADD DATA ADD DATA
WORD 555
BYTE AAA
WORD XXX
BYTE XXX
WORD XXX
BYTE XXX
WORD SA
AA
AA
2AA
555
SA
555
E0
E0
DPB Instruction Set
Entry
55
AAA
A0
00
DPB Set
DPB Clear
A0
SA
00
A0
SA
01
A0
SA
01
00/01
00/01
90
DPB Status READ
BYTE
SA
WORD XXX
BYTE XXX
XXX
XXX
00
00
DPB Instruction Set
Exit
90
Table 7-18
Volatile DPB Functions
Notes:
1. It is not recommended to use any other code that is not in the instruction definition table which can potentially enter
the hidden mode.
2. For the IPB Lock and DPB Status Read "00" represents lock (protect), "01" represents unlock (unprotect).
24
W29GL032C
7.6
Common Flash Memory Interface (CFI) Mode
7.6.1 Query Instruction and Common Flash memory Interface (CFI) Mode
Through Common Flash Interface(CFI) operations it is possible to access the operating characteristics,
structure and vendor specific information, such as identifying information, memory size, byte/word
configuration, operating voltages and timing information of this device. From the Read array mode
writing CFI Read instruction 98h to the address "55h"/"AAh" (Word/Byte, respectively), the device will
gain access to the CFI Query Mode. Once in the CFI mode data can be read using the addresses
given in Table 7-19 thru 7-22.
A reset instruction must be executed to exit CFI mode and the device will return to read array mode.
CFI mode: Identification Data Values (All Values in these tables are hexadecimal)
Address
(Word Mode)
Address
(Byte Mode)
Description
Data
10h
11h
12h
13h
14h
15h
16h
17h
18h
19h
1Ah
0051h
0052h
0059h
0002h
0000h
0040h
0000h
0000h
0000h
0000h
0000h
20h
22h
24h
26h
28h
2Ah
2Ch
2Eh
30h
32h
34h
Query-unique ASII string “QRY”
Primary vendor instruction set and control interface ID code
Address for primary algorithm extended query table
Alternate vendor instruction set and control interface ID code
Address for alternate algorithm extended query table
Table 7-19
CFI Mode: ID Data Values
Publication Release Date: October 18, 2011
Preliminary - Revision E
25
W29GL032C
CFI mode: System Interface Data Values
Description
Address
(Word Mode)
Address
(Byte Mode)
Data
VCC supply minimum program/erase voltage
VCC supply maximum program/erase voltage
VPP supply minimum program/erase voltage
VPP supply maximum program/erase voltage
Typical timeout per single word/byte write, 2n µs
1Bh
1Ch
1Dh
1Eh
1Fh
0027h
0036h
0000h
0000h
0003h
36h
38h
3Ah
3Ch
3Eh
Typical timeout for maximum-size buffer write, 2n µs (00h,
not support)
20h
0004h
40h
Typical timeout per individual block erase, 2n ms
Typical timeout for full chip erase, 2n ms (00h, not support)
Maximum timeout for word/byte write, 2n times typical
Maximum timeout for buffer write, 2n times typical
21h
22h
23h
24h
0008h
000Eh
0003h
0005h
42h
44h
46h
48h
Maximum timeout per individual block erase, 2n times
typical
Maximum timeout for chip erase, 2n times typical (00h, not
support)
25h
26h
0003h
0003h
4Ah
4Ch
Table 7-20
CFI Mode: System Interface Data Values
26
W29GL032C
CFI mode: Device Geometry Data Values
Description
Address
(Word Mode)
Address
Data
(Byte Mode)
4Eh
Device size = 2n in number of bytes (16h=32Mb)
27h
28h
29h
2Ah
2Bh
0016h
0002h
0000h
0005h
0000h
Flash device interface description (02=asynchronous
x8/x16)
Maximum number of bytes in buffer write = 2n (00h, not
support)
50h
52h
54h
56h
Number of erase regions within device
H/L = 01h:uniform
2Ch
00xxh
58h
T/B = 02h:boot)
Index for Erase Bank Area 1:
2Dh
2Eh
2Fh
30h
31h
32h
33h
34h
35h
36h
37h
38h
39h
3Ah
3Bh
3Ch
00xxh
0000h
00xxh
00xxh
00xxh
0000h
0000h
00xxh
0000h
0000h
0000h
0000h
0000h
0000h
0000h
0000h
5Ah
5Ch
5Eh
60h
62h
64h
66h
68h
6Ah
6Ch
6Eh
70h
72h
74h
76h
78h
[2E,2D] = # of same-size sectors in region 1-1
[30, 2F] = sector size in multiples of 256K-bytes
T/B = 0007, 0000, 0020, 0000
H/L = 003F, 0000, 0000, 0001
Index for Erase Bank Area 2
T/B = 003E, 0000, 0000, 0001
H/L = 0000, 0000, 0000, 0000
Index for Erase Bank Area 3
Index for Erase Bank Area 4
Table 7-21
CFI Mode: Device Geometry Data Values
Publication Release Date: October 18, 2011
Preliminary - Revision E
27
W29GL032C
CFI mode: Primary Vendor-Specific Extended Query Data Values
Address
(Word Mode)
Address
(Byte Mode)
Description
Data
40h
0050h
0052h
0049h
0031h
0033h
000Ch
0002h
0001h
0000h
0008h
0000h
0000h
80h
82h
84h
86h
88h
8Ah
8Ch
8Eh
90h
92h
94h
96h
Query - Primary extended table, unique ASCII string, PRI
41h
42h
Major version number, ASCII
43h
Minor version number, ASCII
44h
Unlock recognizes address (0= recognize, 1= don't recognize)
Erase suspend (2= to both read and program)
Sector protect (N= # of sectors/group)
Temporary sector unprotect (1=supported)
Sector protect/Chip unprotect scheme
Simultaneous R/W operation (0=not supported)
Burst mode (0=not supported)
45h
46h
47h
48h
49h
4Ah
4Bh
Page mode (0=not supported, 01 = 4 word page, 02 = 8 word
page)
4Ch
4Dh
4Eh
0002h
0095h
00A5h
98h
9Ah
9Ch
Minimum ACC(acceleration) supply (0= not supported),
[D7:D4] for volt, [D3:D0] for 100mV
Maximum ACC(acceleration) supply (0= not supported),
[D7:D4] for volt, [D3:D0] for 100mV
WP# Protection
02=Bottom boot sectors #WP Protect
03=Top boot sectors #WP Protected
04=Uniform sectors bottom #WP protect
05=Uniform sectors top #WP protect
4Fh
50h
00xxh
0001h
9Eh
A0h
Program Suspend (0=not supported, 1=supported)
Table 7-22
CFI mode: Primary Vendor-Specific Extended Query Data Values
28
W29GL032C
8
ELECTRICAL CHARACTERISTICS(1)
8.1 Absolute Maximum Stress Ratings
Surrounding Temperature with Bias
Storage Temperature
-65°C to +125°C
-65°C to +150°C
-0.5V to +4.0V
-0.5V to +4.0V
-0.5V to +10.5V
-0.5V to VCC +0.5V
200 mA
VCC Voltage Range
EVIO Voltage Range
A9, #WP/ACC Voltage Range
Other Pins Voltage Range
Output Short Circuit Current (less than one second)
Table 8-1
Absolute Maximum Stress Ratings
8.2 Operating Temperature and Voltage
Industrial (I) Grade Surrounding Temperature (TA)
Full VCC Range Supply Voltage
-40°C to +85°C
+2.7V to 3.6V
+3.0V to 3.6V
1.65V to VCC
Regulated VCC Range Supply Voltage
EVIO Range Supply Voltage
Table 8-2
Operating Temperature and Voltage
NOTE:
1. Specification for the W29GL032C is preliminary. See preliminary designation at the end of this document.
2. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the
device. This is stress rating only and functional operational sections of this specification are not implied. Exposure to
absolute maximum rating conditions for extended period may affect reliability.
3. Specifications contained within the following tables are subject to change.
4. During voltage transitions, all pins may overshoot VSS to -2.0V and VCC to +2.0V for periods up to 20ns, see below
Figure.
20ns
20ns
20ns
Vss
Vcc +2.0V
Vcc
Vss -2.0V
20ns
20ns
20ns
Figure 8-1
Maximum Negative Overshoot Figure 8-2
Maximum Positive Overshoot
Publication Release Date: October 18, 2011
Preliminary - Revision E
29
W29GL032C
8.3 DC Characteristics
DESCRIPTION
SYMBOL
Conditions
MIN
TYP. MAX Unit
Others
WP#/ACC
A9=10.5V
±2.0
±5.0
35
µA
µA
µA
µA
Input Leak
ILI
A9 Leak
Output Leak
ILIT
ILO
±1.0
#CE=VIL, #OE=VIH,
VCC=VCCmax:f=1MHz
#CE=VIL, #OE=VIH,
VCC=VCCmax:f=5MHz
#CE=VIL, #OE=VIH,
VCC=VCCmax:f=10MHz,
#CE=VIL, #OE=VIH,
VCC=VCCmax:f=10MHz
6
20
30
55
15
25
mA
mA
mA
mA
mA
Read Current
ICC1
ICC2
20
45
7
VCC Page Read
Current
#CE=VIL, #OE=VIH,
VCC=VCCmax:f=33MHz,
15
EVIO Non-active
Current
Write Current
IIO
0.2
20
10
30
mA
mA
ICC3
#CE=VIL, #OE=VIH, VCC=VCCmax
VCC=VCCmax, EVIO=VCC, #OE=VIH,
(#CE, #RESET)=VSS ±0.3V, VIL=
(VSS+0.3V/-0.1V)
VCC=VCCmax, #RESET enabled,
other pins disabled
VCC=VCCmax, VIH=VCC ±0.3,
VIL=VSS +(0.3v/-0.1v),
#WP/ACC=VIH
Standby Current
ICC4
ICC5
ICC6
IDPD
IACC1
10
10
10
1
20
20
20
5
µA
µA
µA
µA
mA
Reset Current
Sleep Mode Current
VCC deep power down
current
Accelerated Pgm
Current, WP#/ACC,
pin(Word/Byte)
Accelerated Pgm
Current, VCC pin,
(Word/Byte)
Input Low Voltage
Input High Voltage
#CE=VIL, #OE=VIH
#CE=VIL, #OE=VIH
5
10
IACC2
20
30
mA
V
VIL
VIH
-0.1
0.7xEVIO
0.3xEVIO
EVIO+0.3 V
Very High Voltage for
Auto Select/
VHH
9.5
10.5
Accelerated Program
Output Low Voltage
Output High Voltage
VCC Write Protect
Threshold
VOL
VOH
IOL=100µA
IOH=-100µA
0.45
2.5
V
V
0.85xEVIO
2.3
VWPT
V
Table 8-3
Note:
DC Characteristics
1. Sleep mode enable the lower power when address remain stable for tAA+30ns
30
W29GL032C
8.4 Switching Test Circuits
3.3V
2.7KΩ
DEVICE UNDER
TEST
CL
6.2KΩ
Figure 8-3
Switch Test Circuit
Test Condition
All Speeds
Unit
Output Load
1TTL gate
Output Load Capacitance
Rise/Fall Times
Input Pulse levels
30
5
0.0 - EVIO
pF
ns
V
Input timing measurement reference level (If EVIO<VCC, the reference level
is 0.5 EVIO)
Output timing measurement reference levels
0.5EVIO
0.5EVIO
V
V
Table 8-4
8.4.1 Switching Test Waveform
VIO
Test Specification
E
E
VIO / 2
E
VIO / 2
Test Points
0.0V
OUTPUT
INPUT
Figure 8-4
Switching Test Waveform
Publication Release Date: October 18, 2011
Preliminary - Revision E
31
W29GL032C
8.5 AC Characteristics
Description
Symbol
VCC=2.7V~3.6V
ALT
STD Min Typ Max Units
EVIO=VCC
EVIO=1.65V to VCC
EVIO=VCC
EVIO=1.65V to VCC
EVIO=VCC
EVIO=1.65V to VCC
EVIO=VCC
EVIO=1.65V to VCC
EVIO=VCC
EVIO=1.65V to VCC
70 ns
80 ns
25 ns
30 ns
70 ns
80 ns
25 ns
35 ns
ns
Valid Data Output after Address
Page Access Time
tACC
tAA
tPACC
tPA
tCE
tOE
tRC
Valid data output after #CE low
Valid data output after #OE low
Read Period Time
70
80
ns
Data Output High Impedance after #OE high
Data Output High Impedance after #CE high
Output Hold Time from the earliest rising edge of address,
#CE, #OE
tDF
tDF
20 ns
20 ns
ns
tOH
0
Write Period Time
Command write period time
Address Setup Time
Address Setup Time to #OE low during Toggle Bit Polling
Address Hold Time
Address Hold Time from #CE or #OE High during Toggle Bit
Polling
tWC
tCWC
tAS
tASO
tAH
70
70
0
15
45
ns
ns
ns
ns
ns
ns
tAHT
0
Data Setup Time
Data Hold Time
VCC Setup Time
Chip enable Setup Time
Chip enable Hold Time
Output enable Setup Time
Read
tDS
tDH
tVCS
tCS
tCH
tOES
tOEH
30
0
35
0
0
0
ns
ns
µs
ns
ns
ns
ns
ns
0
10
Output enable Hold Time
Toggle & Data#
Polling
#WE Setup Time
#WE Hold Time
tWS
tWH
0
0
ns
ns
#CE Pulse Width
#CE Pulse With High
#WE Pulse Width
#WE Pulse Width High
tCP
tCEPW 35
ns
ns
ns
ns
tCPH tCEPWH 30
tWP
35
30
tWPH
EVIO=VCC
EVIO=1.65V to VCC
Read Recover Time before Write (#OE High to #WE Low)
Read Recover Time before Write (#OE High to #CE Low)
16-Word Write Buffer Program Operation
70 ns
80 ns
ns
Program/Erase active time by RY/#BY
tBUSY
tGHWL
tGHEL
tWHWH1
0
0
ns
µs
96
6
Effective Write Buffer Program
Operation
Accelerated Effective Write Buffer
Operation
Word
tWHWH1
tWHWH1
µs
µs
Per Word
4.8
Program Operation
Program Operation
ACC 16-Word Program Operation
Byte
Word
tWHWH1
tWHWH1
tWHWH1
6
6
77
200 µs
200 µs
µs
32
W29GL032C
Symbol
VCC=2.7V~3.6V
Description
ALT
STD Min Typ Max Units
Sector Erase Operation
Sector Erase Timeout
Release from Deep Power Down mode
tWHWH2
tSEA
tRDP 100
0.15
2
Sec
50 µs
200 µs
Table 8-5
AC Characteristics
8.5.1 Instruction Write Operation
t
CWC
V
IH
IL
#CE
V
t
CS
t
CH
V
IH
IL
#WE
#OE
V
t
OES
tWPH
t
WP
V
IH
IL
V
V
IH
IL
Addresses
VALID ADDRESS
V
t
AH
t
AS
t
DH
t
DS
V
IH
IL
Data
DATA IN
V
Figure 8-5
Instruction Write Operation Waveform
Publication Release Date: October 18, 2011
Preliminary - Revision E
33
W29GL032C
8.5.2 Read / Reset Operation
t
CE
VIH
#CE
VIL
VIH
#WE
#OE
V
IL
t
DF
t
OEH
t
OE
VIH
VIL
t
OH
t
AA
t
RC
VIH
ADD Valid
Addresses
Outputs
V
IL
HIGH Z
HIGH Z
VOH
DATA Valid
VOL
Figure 8-6
Read Timing Waveform
8.5.2.1
AC Characteristics
Description
Symbol Setup Speed Unit
#RESET Pulse Width (During Automatic Algorithm)
tRP1
tRP2
tRH
MIN
MIN
MIN
MIN
MIN
10 µs
500 ns
200 ns
#RESET Pulse Width (NOT During Automatic Algorithm)
#RESET High Time Before Read
RY/#BY Recovery Time (to #CE, #OE goes low)
RY/#BY Recovery Time (to #WE goes low)
tRB1
tRB2
0
ns
50 ns
20 µs
500 ns
#RESET Low (During Automatic Algorithm) to Read or Write
#RESET Low (Not During Automatic Algorithm) to Read or Write
tREADY1 MAX
tREADY2 MAX
Table 8-6
AC Characteristics #RESET and RY/#BY
34
W29GL032C
t
RB1
#CE, #OE
#WE
t
RB2
t
READY1
RY/#BY
#RESET
t
RP
1
Reset Timing during Automatic Algorithms
#CE, #OE
RY/#BY
t
RH
#RESET
t
RP
2
t
READY
2
Reset Timing NOT during Automatic Algorithms
Figure 8-7
#RESET Timing Waveform
Publication Release Date: October 18, 2011
Preliminary - Revision E
35
W29GL032C
8.5.3 Erase/Program Operation
#CE
tCH
tWHWH2
tWP
#WE
#OE
tWPH
t
CS
tGHWL
Last 2 Erase Command Cycles
Read Status
tWC
t
AH
t
AS
2AAh
555h
Valid Address
V. Add
Address
tDS
In
tDH
Progress Complete
55h
10h
Data
tBUSY
tRB
RY/#BY
Figure 8-8
Automatic Chip Erase Timing Waveform
36
W29GL032C
START
Write Data AAh Address 555h
Write Data 55h Address 2AAh
Write Data 80h Address 555h
Write Data AAh Address 555h
Write Data 55h Address 2AAh
Write Data 10h Address 555h
Data# Polling Algorithm or
Toggle Bit Algorithm
No
Data = FFh?
Yes
Auto Chip Erase Completed
Figure 8-9
Automatic Chip Erase Algorithm Flowchart
Publication Release Date: October 18, 2011
Preliminary - Revision E
37
W29GL032C
Read Status
#CE
t
CH
t
WHWH2
t
WP
#WE
t
CS
t
WPH
t
GHWL
#OE
Address
Data
t
SEA
Last 2 Erase Command Cycle
t
WC
t
AS
Sector
ADD 0
Sector
ADD 1
Sector
ADD n
2AAh
Valid Address
V. ADD.
t
AH
t
DS tDH
In
Completed
Progress
55h
30h
30h
30h
t
BUSY
t
RB
RY/#BY
Figure 8-10
Automatic Sector Erase Timing Waveform
38
W29GL032C
START
Write Data AAh Address 555h
Write Data 55h Address 2AAh
Write Data 80h Address 555h
Write Data AAh Address 555h
Write Data 55h Address 2AAh
Write Data 30h Sector Address
Last
Sector to
Erase
NO
YES
Data# Polling Algorithm or Toggle Bit Algorithm
NO
Data=FFh
YES
Auto Sector Erase
Completed
Figure 8-11
Automatic Sector Erase Algorithm Flowchart
Publication Release Date: October 18, 2011
Preliminary - Revision E
39
W29GL032C
START
Write Data B0h
ERASE SUSPEND
Toggle Bit
checking DQ6
not toggled
NO
YES
Read Array or
Program
Reading or
Programming
End
NO
YES
Write Data 30h
ERASE RESUME
Continue Erase
Another
Erase
NO
Suspend?
YES
Figure 8-12
Erase Suspend/Resume Flowchart
40
W29GL032C
#CE
t
CH
t
WHWH1
t
WP
#WE
t
CS
t
WPH
t
GHWL
#OE
Last 2 Program Command Cycles
AS
Last 2 Read Status Cycles
t
tAH
555h
Program Address
Valid Address
V. Add
Address
t
DS
t
DH
A0h
PData
Status DOUT
Data
t
BUSY
t
RB
RY/#BY
Figure 8-13
Automatic Program Timing Waveform
(9.5V ~ 10.5V)
VHH
#WP/ACC
VIL or VIH
VIL or VIH
250ns
250ns
Figure 8-14
Accelerated Program Timing Waveform
Publication Release Date: October 18, 2011
Preliminary - Revision E
41
W29GL032C
Figure 8-15
CE# Controlled Write Timing Waveform
42
W29GL032C
START
Write Data AAh Address 555h
Write Data 55h Address 2AAh
Write Data A0h Address 555h
Write Program Data/Address
Data# Polling Algorithm
or
Next Address
Toggle Bit Algorithm
NO
Read Again Data:
Program Data?
YES
NO
Last Word to be
Programmed
YES
Auto Program Completed
Figure 8-16
Automatic Programming Algorithm Flowchart
Publication Release Date: October 18, 2011
Preliminary - Revision E
43
W29GL032C
VCC
3V
V
HH
IH
V
A9
A0
V
IL
V
IH
V
IL
t
AA
tAA
t
AA
tAA
V
V
IH
A1
A2
V
IL
IH
V
IL
V
IH
ADD
V
IL
V
IH
#CE
V
IL
tCE
V
IH
#WE
V
IL
tOE
V
IH
tDF
#OE
V
IL
tOH
tOH
tOH
tOH
V
OH
OL
DQ
[15:0]
DATA OUT
DATA OUT
DATA OUT
DATA OUT
V
Manufacturer ID
Device ID
Cycle 1
Device ID
Cycle 2
Device ID
Cycle 3
Figure 8-17
Silicon ID Read Timing Waveform
44
W29GL032C
8.5.4 Write Operation Status
tCE
#CE
#WE
#OE
tCH
tOE
tOEH
tDF
tRC
Address
VALID ADDRESS
VALID ADDRESS
t
AA
tOH
High Z
Status Data
Status Data
DQ7
Complement
Complement
VALID DATA
True
True
High Z
DQ[6-0]
VALID DATA
tBUSY
RY/#BY
Figure 8-18
Data# Polling Timing Waveform (During Automatic Algorithms)
Publication Release Date: October 18, 2011
Preliminary - Revision E
45
W29GL032C
Start
Read DQ[7:0] at Valid Address (1)
NO
DQ7=Data#?
YES
DQ5=1?
YES
Read DQ[7:0] at Valid Address
NO
DQ7=Data#?(2)
YES
Fail
Pass
Figure 8-19
Status Polling for Word Programming/Erase
Notes:
1. 1. For programming, valid address means program address. For erasing, valid address means erase sectors address.
2. 2. DQ7 should be rechecked even DQ5="1" because DQ7 may change simultaneously with DQ5.
46
W29GL032C
START
Read DQ[7:0] at Last
Write Address(1)
NO
DQ7=Data#?
YES
DQ1=1?
Only for Write Buffer
Program
YES
NO
NO
DQ5=1?
YES
Read DQ[7:0] at Last
Write Address(1)
NO
DQ7=Data#?(2)
YES
Fail
Write Buffer
Abort
Pass
Figure 8-20
Status Polling for Write Buffer Program Flowchart
Notes:
1. For programming, valid address means program address.
2. For erasing, valid address means erase sectors address.
3. DQ7 should be rechecked even DQ5="1" because DQ7 may change simultaneously with DQ5.
Publication Release Date: October 18, 2011
Preliminary - Revision E
47
W29GL032C
tCE
#CE
tCH
#WE
#OE
tOE
tOEH
t
AHT
t
ASO
VALID ADDRESS
AA
VALID ADDRESS
VALID ADDRESS
VALID ADDRESS
Address
DQ6&2
t
t
DF
tOH
VALID STATUS
(First Read)
VALID STATUS
(Second Read)
VALID STATUS
(Stop Toggling)
VALID STATUS
tBUSY
RY/#BY
Figure 8-21
Toggling Bit Timing Waveform (During Automatic Algorithms)
48
W29GL032C
START
Read DQ[7:0] Twice(1)
NO
DQ6 Toggle?
YES
NO
DQ5=1?
YES
Read DQ[7:0] Twice
NO
DQ6 Toggle?
YES
Program/Erase Fail
Write Reset CMD
Program/Erase
Completed
Figure 8-22
Toggle Bit Algorithm
Notes:
1. Read toggle bit twice to determine whether or not it is toggling.
2. Recheck toggle bit because it may stop toggling as DQ5 changes to "1".
8.5.5 WORD/BYTE CONFIGURATION (#BYTE)
Description
Symbol
tELFL/tELFH
tFLQZ
Test Setup
MAX.
All Speed options
Unit
ns
#CE to #BYTE from L/H
#BYTE from L to Output Hiz
#BYTE from H to Output Active
5
Max.
30
70
ns
tFHQV
Min.
ns
Table 8-7
AC Characteristics Word/Byte Configuration (#BYTE)
Publication Release Date: October 18, 2011
Preliminary - Revision E
49
W29GL032C
#CE
#OE
tELFH
#BYTE
DOUT
DQ[14:0]
DOUT
DQ[7:0]
DQ[14:0]
DOUT
DQ15
DQ15/A-1
VALID ADDRESS
tFHQV
Figure 8-23
#BYTE Timing Waveform For Read operations
ADD[22:3]
VALID ADDRESS
ADD[2:0], A-1
Word, Byte
1st ADD
2nd ADD
3rd ADD
t
AA
tPA
tPA
DATA 1
DATA 2
DATA 3
DATA[15:0]
#CE/#OE
Figure 8-24
Page Read Timing Waveform
50
W29GL032C
8.5.6 DEEP POWER DOWN MODE
Description
SYMBOL
tRDP
TYP.
100µs
10µs
MAX
200µs
20µs
#WE High to release from Deep Power Down Mode
#WE High to Deep Power Down Mode
tDP
Table 8-8
AC Characteristics for Deep Power Down
#CE
#WE
tDP
tRDP
55h
2AAh
XXh
XXh (Don’t Care)
Address
Data
AAh
55h
B9h
B9h
Standby mode
Deep Power Down mode Standby mode
Figure 8-25
Deep Power Down mode Waveform
8.5.7 WRITE BUFFER PROGRAM
Write CMD: DATA=29h, ADD=SA
Write CMD: DATA=AAh, ADD=555h
Write CMD: DATA=55h, ADD=2AAh
Write CMD: DATA=25h, ADD=SA
Write CMD: DATA=PWC, ADD=SA
Polling Status
YES
PASS?
NO
Write CMD: DATA=PGM DATA,
ADD=PGM ADD
Return to Read mode
NO
FAIL?
YES
YES
Write a different Sector Address
to cause Abort
Want to Abort?
NO
PWC=PWC-1
YES
YES
Write Buffer Abort?
NO
NO
PWC=0?
Write Abort Reset CMD
to return to Read mode
Write Reset CMD
to return to Read mode
SA
= Sector Address of the Page to be Programmed
PWC = Program Word Count
Figure 8-26
Write Buffer Program Flowchart
Publication Release Date: October 18, 2011
Preliminary - Revision E
51
W29GL032C
8.6 Recommended Operating Conditions
8.6.1 At Device Power-up
AC timing illustrated in Figure A is recommended for the supply voltages and the control signals at
device power-up. If the timing in the figure is ignored, the device may not operate correctly.
V
CC(min)
GND
VCC
tVCS
tVR
tCE
tF
tR
V
IH
IL
#CE
V
V
IH
IL
#WE
V
tF
tOE
tR
V
IH
IL
#OE
V
t
AA
tR or tF
tR or tF
V
IH
IL
VALID ADDRESS
ADDRESS
DATA
V
V
OH
OL
High Z
Valid Data
Out
V
V
IH
IL
#WP/ACC
V
Figure 8-27
AC Timing at Device Power-Up
Description
SYMBOL
MIN
MAX
500,000
20
UNIT
µs/V
µs/V
µs/V
µs
VCC Rise Time
tVR
tR
20
Input Signal Rise Time
Input Signal Fall Time
VCC Setup Time
tF
20
tVCS
35
Table 8-9
AC Characteristics at Device Power Up
52
W29GL032C
8.7 Erase and Programming Performance
PARAMETER
LIMITS
TYP(1)
19.2
.15
UNITS
MAX(2)
MIN
Chip Erase Time
64
2
Sec
Sec
Sec
µs
Sector Erase Time
Chip Programming Time
Word Programming Time
Total Write Buffer Time
ACC Total Write Buffer Time
Erase/Program Cycles
12
56
28
6
96
µs
77
µs
100,000
Cycles
Table 8-10
Notes:
AC Characteristics for Erase and Programming Performance
1. Typical program and erase times assume the following conditions: 25°C, 3.0V VCC. Programming specifications
assume checkerboard data pattern.
2. Maximum values are measured at VCC = 3.0 V, worst case temperature. Maximum values are valid up to and
including 100,000 program/erase cycles.
3. Erase/Program cycles comply with JEDEC JESD-47E & A117A standard.
4. Exclude 00h program before erase operation.
8.8 Data Retention
PARAMETER
Data Retention
Table 8-11
CONDITION
MIN
MAX
UNIT
55°C
20
Years
Data Retention
8.9 Latch-up Characteristics
PARAMETER
MIN
-1.0V
-1.0V
MAX
Input Voltage different with GND on #WP/ACC and A9 pins
Input Voltage difference with GND on all normal input pins
VCC Current
10.5V
1.5xVCC
+100mA
-100mA
All pins included except VCC. Test condition is VCC=3.0V, one pin per test.
Table 8-12 Latch-up Characteristics
8.10 Pin Capacitance
DESCRIPTION
PARAMETER
CIN2
TEST SET
VIN=0
TYP.
7.5
8.5
6
MAX
9
UNIT
pF
Control Pin Capacitance
Output Capacitance
Input Capacitance
COUT
VOUT=0
VIN=0
12
pF
CIN
7.5
pF
Table 8-13
Pin Capacitance
Publication Release Date: October 18, 2011
Preliminary - Revision E
53
W29GL032C
9
PACKAGE DIMENSIONS
9.1 TSOP 48-pin 12x20mm
1
48
e
E
b
c
D
HD
A2
A1
A
θ
L
Y
L1
MILLIMETER
INCH
NOM.
-
Symbol
MIN.
-
NOM.
-
-
MAX.
1.20
-
1.05
18.5
20.2
12.1
0.27
0.21
-
MIN.
-
MAX.
0.047
-
0.041
0.728
0.795
0.476
0.011
0.008
-
A
A1
A2
D
HD
E
b
c
e
L
0.05
0.95
18.3
19.8
11.9
0.17
0.10
-
0.002
0.037
0.720
0.780
0.468
0.007
0.004
-
-
1.00
18.4
20.0
12.0
0.22
-
0.50
0.60
0.80
-
0.039
0.724
0.787
0.472
0.009
-
0.020
0.024
0.031
-
0.50
-
-
0.70
-
0.10
5
0.020
-
-
0.028
-
0.004
5
L1
Y
θ
0
-
0
-
Figure 9-1
TSOP 48-pin 12x20mm
54
W29GL032C
9.2 TSOP 56-pin 14x20mm
D
D1
0.10
C
b
1
56
PIN 1
IDENTIFIER
E
e
28
29
BOTTOM EJECTOR PIN
CAVITY # MARK
A
A2
R
WITH PLATING
b
L1
θ
A1
L
c1
c
0.80 REF
BASE
METAL
b1
Dimension in MM
MIN NOM MAX MIN
Dimension Inch
Symbol
NOM
MAX
A
A1
A2
b
b1
c
c1
D
D1
E
L
L1
e
R
θ
-
-
1.2
-
-
-
0.047
0.006
0.05
0.95
0.17
0.17
0.10
0.10
-
1.00
0.22
0.20
-
0.15 0.002
1.05 0.037 0.039 0.041
0.27 0.007 0.009 0.011
0.23 0.007 0.008 0.009
0.21 0.004
0.16 0.004 0.005 0.006
0.787 BSC
-
0.008
0.13
20.00 BSC
18.40 BSC
14.00 BSC
0.60
0.25 BSC
0.5 BSC
-
0.724 BSC
0.551 BSC
0.50
0.70 0.020 0.024 0.028
0.010 BSC
0.020 BSC
0.08
0°
0.35 0.003
8° 0°
-
-
0.008
8°
-
Figure 9-2
TSOP 56-pin 14x20mm
Publication Release Date: October 18, 2011
Preliminary - Revision E
55
W29GL032C
9.3 Low-Profile Fine-Pitch Ball Grid Array, 64-ball 11x13mm (LFBGA64)
D1
eD
D
A
0.07
C
(2X)
H G F E D C B A
8
7
6
5
4
3
2
1
SE
E
eE
E1
Øb
PIN A1
CORNER
B
0.07
PIN A1
CORNER
SD
TOP VIEW
(2X)
BOTTOM VIEW
// 0.25
C
C
A2
A
A1
C
0.15
64X Øb
M
M
Ø 0.20
Ø 0.10
C
C
A B
SIDE VIEW
DIMENSION (MM)
SYMBOL
NOTE
MIN
NOM
MAX
A
A1
A2
D
-
-
1.40
-
-
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
0.40
0.60
13.00 BSC
11.00 BSC
7.00 BSC
7.00 BSC
64
E
BODY SIZE
D1
E1
n
MATRIX FOOTPRINT
MATRIX FOOTPRINT
BALL COUNT
Øb
eE
eD
SD/SE
0.5
0.6
0.7
BALL DIAMETER
BALL PITCH
BALL PITCH
1.00 BSC
1.00 BSC
0.50 BSC
NONE
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
Figure 9-3
LFBGA 64-ball 11x13mm
56
W29GL032C
9.4 Thin & Fine-Pitch Ball Grid Array, 6x8 mm2, ball pitch: 0.8 mm, ∅=0.4mm
(TFBGA48)
0.20
//
C
A
E1
A1 INDEX
e
A1 INDEX
A1
A
A
B
C
D
6
5
4
3
2
1
E
F
G
H
SE
Øb(48x PLACES)
E
A2
B
M
0.15
0.08
C A B
0.12 C
M
0.15 (4X)
C
Note: Ball land:0.45mm. Ball opening:0.35mm. PCB ball land suggest <=0.35mm
DIMENSION (MM)
DIMENSION (INCH)
SYMBOL
MIN
NOM
-
0.32
MAX
MIN
-
0.011
-
NOM
-
0.013
MAX
A
A1
A2
b
-
1.20
0.37
-
0.047
0.015
-
0.27
-
0.79
0.031
0.35
7.90
0.40
8.00
0.45
8.10
0.014
0.311
0.016
0.315
0.018
0.319
D
D1
E
5.60 BSC
6.00
0.220 BSC
0.236
5.90
6.10
0.232
0.240
E1
SE
SD
e
4.00 BSC
0.400 TYP
0.400 TYP
0.80 BSC
0.157 BSC
0.016 TYP
0.016 TYP
0.031 BSC
Figure 9-4
TFBGA 48-Ball 6x8mm
Publication Release Date: October 18, 2011
Preliminary - Revision E
57
W29GL032C
10 ORDERING INFORMATION
10.1 Ordering Part Number Definitions
W 29GL 032 C H 7 T
Winbond Standard Product
W: Winbond
Product Family
29GL: 3V
Density
032:
32Mb
Product Version
C: 90nm
Sector Type
H: EVIO=VCC=2.7~3.6V, Uniform sector, highest address sector protected
EVIO=1.65V to VCC(2.7~3.6V),Uniform sector, highest address sector protected
L: EVIO=VCC=2.7~3.6V,Uniform sector, lowest address sector protected
EVIO=1.65V to VCC(2.7~3.6V),Uniform sector, lowest address sector protected
T: Top boot sector, top two addressed sectors protected
B: Bottom boot sector, bottom two addressed sectors protected
Access Time
7: 70ns
Packages
S: TSOP-48, Industrial (-40°C~+85°C) and Green (RoHS Compliant)
T: TSOP-56, Industrial (-40°C~+85°C) and Green (RoHS Compliant)
A: TFBGA-48, Industrial (-40°C~+85°C) and Green (RoHS Compliant)
B: LFBGA-64, Industrial (-40°C~+85°C) and Green (RoHS Compliant)
Figure 10-1
Ordering Part Numbering
Notes:
1. Winbond reserves the right to make changes to its products without prior notice.
2. Contact Winbond Sales for Secured Sector Lock Options.
58
W29GL032C
10.2 Valid Part Numbers and Top Side Marking
The following table provides the valid part numbers for the W29GL032C Parallel Flash Memory.
Please contact Winbond for specific availability by density and package type. Winbond Parallel
memories use a 12-digit Product Number for ordering.
PACKAGE TYPE DENSITY
PRODUCT NUMBER
W29GL032CT7S
W29GL032CB7S
W29GL032CT7A
W29GL032CB7A
W29GL032CH7T
W29GL032CL7T
W29GL032CT7B
W29GL032CB7B
W29GL032CH7B
W29GL032CL7B
TOP SIDE MARKING
W29GL032CT7S
W29GL032CB7S
W29GL032CT7A
W29GL032CB7A
W29GL032CH7T
W29GL032CL7T
W29GL032CT7B
W29GL032CB7B
W29GL032CH7B
W29GL032CL7B
32Mb
32Mb
32Mb
32Mb
32Mb
32Mb
32Mb
32Mb
32Mb
32Mb
TSOP-48
TSOP-48
TFBGA48
TFBGA48
TSOP-56
TSOP-56
LFBGA64
LFBGA64
LFBGA64
LFBGA64
Table 10-1
Valid Part Numbers and Markings
Publication Release Date: October 18, 2011
Preliminary - Revision E
59
W29GL032C
11 HISTORY
VERSION
DATE
PAGE
DESCRIPTION
A
09-21-2010
-
5
Preliminary
Change Device ID H/L to 0
32
Updated tWC
32&52
32&42
32
32
49
Updated tVCS
Update tGHEL Description & Waveform.
Deleted Effective Write Buffer Program (Byte)
Updated Program Operation (Word/Byte) tWHWH1
Updated tFHQV parameter value.
B
01-19-2011
57
Updated Part Number Ordering Definitions
C
D
02-16-2011
05-31-2011
57
12
54
Added TFBGA48 Drawing
VHH vs. ACC PGM warning
Correct TSOP missing E parameter
Correct Parameter Category tRC & Cycling
Corrected miss labeled ball on TFBGA48 diagram
Section 7.4.2 1st Paragraph removed ‘erase’
Section 7.4.2 3rd Paragraph Add OTP statement.
tCWC added definition to Table 8.5
tWHWH1 & tWHWH2 moved parameter to Typ.
Sector Erase time 1 to 2Sec Max
32 & 53
2
20
E
10-18-2011
32
32 & 33
33 & 53
Table 11-1
Revision History
Preliminary Designation
The “Preliminary” designation on a Winbond datasheet indicates that the product is not full
characterized. The specifications are subject to change and are not guaranteed. Winbond or an
authorized sales representative should be consulted for current information before using this product.
Trademarks
Winbond is a trademark of Winbond Electronics Corporation. All other marks are the property of their
respective owner.
Important Notice
Winbond products are not designed, intended, authorized or warranted for use as components in
systems or equipment intended for surgical implantation, atomic energy control instruments, airplane
or spaceship instruments, transportation instruments, traffic signal instruments, combustion control
instruments, or for other applications intended to support or sustain life. Furthermore, Winbond
products are not intended for applications wherein failure of Winbond products could result or lead to a
situation where in personal injury, death or severe property or environmental damage could occur.
Winbond customers using or selling these products for use in such applications do so at their own risk
and agree to fully indemnify Winbond for any damages resulting from such improper use or sales.
Information in this document is provided solely in connection with Winbond products. Winbond
reserves the right to make changes, corrections, modifications or improvements to this document and
the products and services described herein at any time, without notice.
60
相关型号：
W29GL032CL7S
32M-BIT 3.0-VOLT PARALLEL FLASH MEMORY WITH PAGE MODEWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
WINBOND
W29GL032CL7T
32M-BIT 3.0-VOLT PARALLEL FLASH MEMORY WITH PAGE MODEWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
WINBOND
W29GL032CLAT
Flash, 2MX16, 90ns, PDSO56, 14 X 20 MM, GREEN, TSOP-56Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
WINBOND
W29GL032CT7A
32M-BIT 3.0-VOLT PARALLEL FLASH MEMORY WITH PAGE MODEWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
WINBOND
W29GL032CT7B
32M-BIT 3.0-VOLT PARALLEL FLASH MEMORY WITH PAGE MODEWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
WINBOND
W29GL032CT7S
32M-BIT 3.0-VOLT PARALLEL FLASH MEMORY WITH PAGE MODEWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
WINBOND
W29GL032CT7T
32M-BIT 3.0-VOLT PARALLEL FLASH MEMORY WITH PAGE MODEWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
WINBOND
W29GL032CTBB
Flash, 2MX16, 90ns, PBGA64, 11 X 13 MM, GREEN, LFBGA-64Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
WINBOND
W29GL032CTBS
Flash, 2MX16, 90ns, PDSO48, 12 X 20 MM, GREEN, TSOP-48Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
WINBOND
W29GL032CTJS
Flash, 2MX16, 90ns, PDSO48, 12 X 20 MM, GREEN, TSOP-48Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
WINBOND
W29GL032C_13
32M-BIT 3.0-VOLT PARALLEL FLASH MEMORY WITH PAGE MODEWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
WINBOND
W29GL064C
64M-BIT 3.0-VOLT PARALLEL FLASH MEMORY WITH PAGE MODEWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
WINBOND
©2020 ICPDF网 联系我们和版权申明