W55412A [WINBOND]
VOICE PROM (256K OTP); VOICE PROM ( 256K OTP )![W55412A](http://pdffile.icpdf.com/pdf1/p00097/img/icpdf/W55412A_518354_icpdf.jpg)
型号: | W55412A |
厂家: | ![]() |
描述: | VOICE PROM (256K OTP) |
文件: | 总5页 (文件大小:50K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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W55412A
VOICE PROM (256K OTP)
GENERAL DESCRIPTION
The W55412A is a 256K ´ 1 bit one-time programmable (OTP) ROM. The W55412A is designed for
easy cascading with Winbond speech ICs to emulate sounds and functions. The W55412A data ROM
allows synthesis of messages of up to 12 seconds in duration (not including repetition or silence).
FEATURES
· Provides RDP, WRP, and DATA pins to cascade with Winbond speech ICs
· Data and address are processed in serial form
· Suitable for low pin count applications (8-pin DIP)
· Low power consumption:
- Operating: 3 mA (max.)
- Standby: 1mA (max.)
· Programming voltage (VPP): 12 to 12.5V
· Operating voltage range: 3 to 5V
· Organized as 256K ´ 1 bit
· Data access time: 500 nS (max.)
PIN CONFIGURATION
MODE/PGM/CLK
V
PP
8
7
6
5
1
2
3
4
V
DD
MCLK/PREDATA
V
SS
RDP
WRP
DATA
Publication Release Date: May 1996
Revision A2
- 1 -
W55412A
PIN DESCRIPTION
NO.
PIN NAME
I/O
DESCRIPTION
Program/Erase/Repair
Logic input
Logic input
Read
1
2
3
4
5
6
7
8
VPP
MCLK/PREDATA
VSS
I
NC
NC
I/O
I
Negative power supply
Write clock pulse line
Bidirectional data line
Read clock pulse line
Positive voltage supply
NC
Negative power supply
No use
WRP
I/O
DATA
I/O
No use
RDP
I
I
I
No use
VDD
Positive voltage supply
Logic input
MODE/PGM/CLK
BLOCK DIAGRAM
V
SS
V
V
DD
PP MODE/PGM/CLK
MCLK/PREDATA
RDP
WRP
DATA
8
Input
Redundant
Array
I/O Control/Address Counter/Register
Buffer
8
9
Mux
9
8
512
1 to 8
Core
Array
Y-DEC/
Mux
Decoder
SenAMP
SenAMP
X-DEC
DeMux
8
8
Mux
DeMux/Output
Buffer
FUNCTIONAL DESCRIPTION
Voice data are written to the W55412A using the Winbond writer and the Winbond Coding System.
The voice data must be converted to *.obj form before being written to the W55412A.
- 2 -
W55412A
The W55412A's read function allows data stored on the chip to be accessed by an OTP demo board
cascaded with a Winbond PowerSpeech body.
The DATA pin is a bidirectional pin used for address input and data output. The MODE/PGM/CLK,
VPP, and MCLK/PREDATA pins are used to program or erase the chip, not used in the normal read
mode.
ABSOLUTE MAXIMUM RATINGS
SYMBOL
VDD
RATING
-0.5 to +7.0
UNIT
V
NOTES
1, 2
3, 2
3, 2
4
VIN
VSS -0.5 to VDD +0.5
VSS -0.5 to VDD +0.5
0 to 70
V
VOUT
TOPR
PD
V
°C
mW
200
5
Notes:
1. Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of
the device.
2. All voltages are referenced to VSS.
3. VIN and VOUT refer to pins WRP, RDP, DATA, and MCLK/PREDATA.
4. TOPR: Operating temperature for commercial market.
5. PD: Maximum power dissipation without output load.
DC CHARACTERISTICS
(VDD = 4.5 V, VSS = 0 V, TA = 0 to 70° C)
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
CONDITIONS
VDD = 4.5V
Power Supply Voltage
Standby Current
VDD
ISB
IDD
II
2.4V
4.5V
5.0V
1 mA
3 mA
0.2 mA
-
-
-
-
-
-
-
-
No Load
Operating Current
-
-
Input Current (WRP, RDP)
-
-
Output Current
(DATA)
Drive
Sink
IO
VDATA = 4.2 V
VDATA = 0.3 V
-250 mA
250 mA
-
Publication Release Date: May 1996
Revision A2
- 3 -
W55412A
AC CHARACTERISTICS
(VDD = 4.5 V, TA = 0 to 70° C)
PARAMETER
Data Setup Time
SYMBOL
TDS
MIN.
TYP.
MAX.
UNIT
mS
-
0
-
-
-
-
-
1
Data Hold Time
TDH
-
mS
Output Enable to Data Valid
Output Data Hold Time
Write End to Read Setup Time
TOE
-
500
nS
TOH
100
2
-
-
nS
TWRS
mS
Note: TDS, TDH, TOE, TOH, and TWRS are shown below:
1
2
17
18
WRP
T
WRS
T
DS
T
DH
1
2
N
RDP
T
OE
A0
T
OH
A17
A16
D0
D1
A1
DN-1
DATA
TYPICAL APPLICATION CIRCUIT
VDD
VDD
VDD
W528X
TG1
TG2
WRP
DATA
TG3
RDP
NC
TG4
LED1
STPB
STPA
NC
W55412A
NC
NC
VPP
MD/P/CLK
VDD
NC
NC
MC/PDATA
VSS
SPK
VSS
OSC
VDD
RDP
DATA
WRP
1.2M ohm
- 4 -
W55412A
Winbond Electronics (H.K.) Ltd.
Winbond Electronics North America Corp.
Headquarters
Rm. 803, World Trade Square, Tower II, Winbond Memory Lab.
123 Hoi Bun Rd., Kwun Tong,
No. 4, Creation Rd. III,
Science-Based Industrial Park,
Hsinchu, Taiwan
TEL: 886-3-5770066
FAX: 886-3-5792697
Winbond Microelectronics Corp.
Kowloon, Hong Kong
TEL: 852-27516023
FAX: 852-27552064
Winbond Systems Lab.
2730 Orchard Parkway, San Jose,
CA 95134, U.S.A.
TEL: 1-408-9436666
FAX: 1-408-9436668
http://www.winbond.com.tw/
Voice & Fax-on-demand: 886-2-7197006
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.,
Taipei, Taiwan
TEL: 886-2-7190505
FAX: 886-2-7197502
Note: All data and specifications are subject to change without notice.
Publication Release Date: May 1996
Revision A2
- 5 -
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