W55RFS27R3CH [WINBOND]
Super-Regeneration RF Receiver; SUPER -再生RF接收器
| 型号： | W55RFS27R3CH |
| 厂家： | 
WINBOND |
| 描述： | Super-Regeneration RF Receiver |
| 文件： | 总13页 (文件大小：257K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
W55RFS27R3C
Super-Regeneration RF Receiver
W55RFS27R3C
Data Sheet
Publication Release Date: May 31, 2005
- 1 -
Revision A1
W55RFS27R3C
Table of Content-
1.
GENERAL DESCRIPTION ......................................................................................................... 3
1.1
1.2
W55RFS27R3C Features............................................................................................... 3
W55RFS27R3C Pad Definition....................................................................................... 4
1.2.1
W55RFS27R3C Pad Description..................................................................................4
1.2.2
Power-On Trapping Function Description.....................................................................5
2.
3.
SYSTEM DESCRIPTION............................................................................................................ 6
2.1
2.2
W55RFS27R3C System Block Diagram ........................................................................ 6
W55RFS27R3C Functional Description ......................................................................... 7
ELECTRONIC CHARACTERISTICS.......................................................................................... 8
3.1
3.2
3.3
3.4
W55RFS27R3C Absolute Maximum Ratings................................................................. 8
W55RFS27R3C DC Characteristics............................................................................... 8
W55RFS27R3C Ordering Information............................................................................ 9
W55RFS27R3C Package Information............................................................................ 9
3.4.1
W55RFS27R3C Bonding Pad List................................................................................9
3.4.2
W55RFS27R3C Bonding Pad Diagram......................................................................10
4.
5.
DESIGN INFORMATION .......................................................................................................... 11
4.1 W55RFS27R3C Reference Design.............................................................................. 11
4.1.1
W55RFS27R3C Application Circuit ............................................................................11
REVISION HISTORY................................................................................................................ 13
- 2 -
W55RFS27R3C
1. GENERAL DESCRIPTION
The Winbond W55RFS27R3C is a fully integrated, S-R (Super-regeneration) RF receiver with full-
function baseband command decoder for R/C vehicles, toys, or wireless data communication
applications.
The W55RFS27R3C provides two input modes: uC-mode, for general-purpose, micro-controller
interfaces to the RF transmitter (the decoder is disabled); and manual-mode, for a 6-function,
baseband command decoder and RF receiver. Manual-mode is also designed with the Winbond-
patented ChannelSharedWB protocol for multi-player applications, and up to three players are allowed
simultaneously in the same frequency band. As a result, the W55RFS27T3B / W55RFS27R3C provide
a simple remote control capability for multiple players with low cost and high performance.
In addition, the W55RFS27R3C accommodates a wide range of operating voltages (2.2 ~ 5.5 V) and
supports 2- or 3-battery applications.
The associated transmitter W55RFS27T3B meets FCC/ETSI regulations for 27 MHz, 40 MHz, and 49
MHz S-R (Super-regeneration) demodulation.
1.1 W55RFS27R3C Features
y
Winbond patented ChannelSharedWB protocol enables
a
maximum of three players
simultaneously in one frequency band.
y
y
y
y
y
y
On-chip LNA provides better isolation so that receivers can work together without interference.
Enhanced receiver circuit provides higher sensitivity than traditional super-regenerative circuits.
Operating frequencies: 27 MHz to 49 MHz (depending on the oscillator frequency)
Operating voltages: 2.2 V ~ 5.5 V
(uC-mode) Receiving data rates up to 2.5 Kbps for 50% duty cycle signals
(manual-mode) R/C-toy baseband control command decoder, supporting 6 functions; Forward,
Backward, Left-turn, Right-turn, and 2 user-defined functions F1 and F2
y
y
y
(manual-mode) Frequency hopping increases receiver sensitivity
Power-down current consumption less than 1 µA
Associated transmitter W55RFS27T3B is compliant with FCC part 15 Subpart C 15.227 / ETSI 300
220-1 low-power and short-range device requirements
y
Operating temperature: 0°C ~ 70°C
Publication Release Date: May 31, 2005
- 3 -
Revision A1
W55RFS27R3C
1.2 W55RFS27R3C Pad Definition
1.2.1 W55RFS27R3C Pad Description
SYMBOL
GND
CMFB
RBIAS
RSAW
PAD NO.
I/O
Ground
I/O
A/D
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
D
FUNCTIONAL DESCRIPTION
Ground return path
Common-mode feedback capacitor connection
Resistor to adjust internal ring-oscillator frequency
Resistor to control internal saw generator
Regulated voltage output
1
2
3
4
5
I/O
I/O
VDDA
Power
Power
Ground
Power
Ground
I
VDDA
6
7
8
9
10
11
12
13
14
15
16
Regulated voltage output
LNA Ground return path
LNA power input
Filter capacitor connection
LNA Gate input
GND_LNA
VDD_LNA
SDINGD
LNAING
LNAINS
LNAOUT
OSCin
OSCout
GNDA
Resetn
I
LNA Source input
O
O
O
O
LNA output(NC)
Oscillator tank input
Oscillator tank output
Regulator ground return path
Resetn =0 reset whole circuit, internal pull-high
I/O
Receiver mode selection; should be “0” for regular
operation
ID setting(LSB) for Channel shared protocol
([ID1:ID0] = [1,1]) uC-mode
Mode
17
I
I
D
D
ID0
18
ID setting (MSB) for Channel shared protocol
([ID1:ID0] = [1,1]) uC-mode
TEST=1, reserved for chip testing, internal pull-low
(manual-mode) Decoder F1 output
(uC-mode) Set to “0”.
ID1
TEST
F1
19
20
21
I
I
D
D
D
I/O
(manual-mode) Decoder F2 output
(manual-mode) Power on trapping of Frequency
Hopping
F2
22
I/O
D
(uC-mode) $ENB (“0” to power down)
- 4 -
W55RFS27R3C
W55RFS27R3C Pad Description, continued.
SYMBOL
PAD NO.
I/O
A/D
FUNCTIONAL DESCRIPTION
(manual-mode) Decoder Right-turn output
(uC-mode) HOP_CLK (toggle every 20 ms for better
performance or fix at “0” or “1”)
R
23
I/O
D
(manual-mode) Decoder Left-turn output
(uC-mode) Set to “0”.
(manual-mode) Decoder Backward output
(uC-mode) Set to “1”.
L
B
F
24
25
26
I/O
I/O
I/O
D
D
D
(manual-mode) Decoder Forward output
(uC-mode) Set to “0”.
RXD
27
28
I/O
D
A
Receiver data output / Power on trapping of LNA
Power input
VSPLY
Power
1.2.2 Power-On Trapping Function Description
POWER-
TRAPPING PIN
NAME
TRAPPING
STATE
RECOMMENDED
USAGE
FUNCTION DESCRIPTION
1
0
1
0
1
0
Enable LNA
Disable LNA
RXD
F1*
F2
Enable LNA
Not Used
Disable (Set to “0”)
Not Used
Enable Frequency Hopping
Disable Frequency Hopping
Enable Frequency
Hopping
* Note: Currently, F1 does not support any functions, but it should be set to “0” when the W55RFS27R3C is powered on.
Publication Release Date: May 31, 2005
- 5 -
Revision A1
W55RFS27R3C
2. SYSTEM DESCRIPTION
2.1 W55RFS27R3C System Block Diagram
LNA.
Rectifier
Filter
OSCin
Power
Regulator
Oscillator
OSCout
Data Slicer
RXD
Qch
MODE0
IDx
osc
Saw Generator
RSAW
Baseband
Decoder
Power-On
Reset
RBIAS
RESETn
F
B
L
R
F1 F2
This block diagram is applicable in manual-mode. There are some differences in uC-mode.
- 6 -
W55RFS27R3C
2.2 W55RFS27R3C Functional Description
ChannelSharedWB Protocol Engine
The W55RFS27R3C / W55RFS27T3B built-in ChannelSharedWB protocol allows a maximum of three
players simultaneously in the same frequency band. Each player is distinguished by the input states of
ID1 and ID0, instead of different frequencies. This approach significantly reduces the cost and
complexity of multi-player applications.
Frequency Hopping and HOP_CLK
In manual-mode, the W55RFS27R3C can automatically toggle the center frequency very slightly to
increase the receiver sensitivity. The W55RFS27R3C stops toggling while data is being received and
resumes again afterwards. This is called frequency hopping, and it is available in manual-mode.
Frequency hopping is enabled and disabled by the F2 pin, whose value is trapped during power-on. In
uC-mode, toggling is controlled manually using HOP_CLK (R pin, pin 23), and it is effectively disabled
by fixing the value of HOP_CLK at either “0” or “1”.
RF Receiver
The W55RFS27R3C has been implemented using an enhanced "Super-Regenerative" receiving
architecture. The resulting high sensitivity and high noise immunity is suitable for getting higher RF
receiving performance in very noisy environments. In addition, the on-chip LNA provides isolation from
other receivers, which is important in multi-player applications.
Power Regulator
The W55RFS27R3C built-in power regulator provides stable operating performance for operating
voltages from 2.2 to 5.5 V, a very wide range of voltages suitable for 2- or 3-battery R/C toys or R/C
vehicles.
Baseband Control Function Decoder
The W55RFS27R3C has a built-in, 6-function baseband control function decoder for R/C toys. The six
functions include Forward; Backward; Left-turn; Right-turn, and two user-defined functions F1 and F2.
Publication Release Date: May 31, 2005
- 7 -
Revision A1
W55RFS27R3C
3. ELECTRONIC CHARACTERISTICS
3.1 W55RFS27R3C Absolute Maximum Ratings
PARAMETER
Supply Voltage to Ground Potential
Applied Input/Output Voltage
Power Dissipation (Ta = 70°C)
Ambient Operating Temperature
Storage Temperature
RATING
UNIT
V
- 0.3 to 6.5
- 0.3 to 6.5
150
V
mW
°C
0 to 70
-40 to 85
°C
Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability
of the device.
3.2 W55RFS27R3C DC Characteristics
(VDD-VSS = 3 V, Ta = 25°C; unless otherwise specified)
PARAMETER
Power Supply
SYM.
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Operating Voltage
Operating Current
VDD
IOP
2.2
-
-
-
5.5
4
V
mA
VDD=5.5V
VDD=5.5V , ENB= 0
Stand-by Current
ISBY
-
-
2
µA
(uC-mode)
Digital Input/Output Pin
Input High Voltage
Input Low Voltage
VIH
VIL
0.8*VDD
VSS
-
-
VDD
0.1*VDD
V
V
F,B,L,R,F1,F2 Output High
IOH
IOL
IOH
IOL
VOH=0.7 * VDD
VOL=0.3 * VDD
VOH=0.7 * VDD
VOL=0.3 * VDD
-
-
-
-
6
6
2
2
-
-
-
-
mA
mA
mA
mA
Source Current
F,B,L,R,F1,F2 Output Low
Sink Current
RXD Output High Source
Current
RXD Output Low Sink
Current
Oscillator
Operation Frequency
Quench frequency
Baseband Decoder Section
Modulation Duty Cycle
FOSC
FQCH
27
170
-
49.8
250
MHz
KHz
200
MDYT
RDTT
30
-
50
70
-
%
50% Duty-cycle
Received Data Rate
2.5
Kbps
Manchester Code
- 8 -
W55RFS27R3C
3.3 W55RFS27R3C Ordering Information
The W55RFS27R3C is available in two types of packages: Dice form and Wafer form.
PART NUMBER
W55RFS27R3C(H)
W55RFS27R3C(W)
PACKAGE
Dice form
Wafer form
REMARKS
3.4 W55RFS27R3C Package Information
3.4.1 W55RFS27R3C Bonding Pad List
Window : (xl = -1228.000, yl = -625.000),(xh = 1228.000, yh = 625.000)
Windows size : Width = 2456.000, length = 1250.000
===========================================================================
PAD NO
PAD NAME
PIN NO(DIP28)
X
Y
---------------------------------------------------------------------------
1
2
* GND
CMFB
* 1
2
-33.015
-385.965
540.000
540.000
3
RBIAS
3
-492.965
540.000
4
5
RSAW
VDDA:
4
5
-599.965
-709.365
540.000
540.000
6
VDDA:
GND_LNA
VDD_LNA
SDINGD
LNAING
LNAINS
LNAOUT
OSCin
OSCout
GNDA
5
6
7
8
9
-821.165
-1143.000
-1143.000
-1143.000
-1143.000
-1143.000
-1143.000
-815.090
-685.215
-575.165
-148.690
-41.690
540.000
532.375
420.975
308.495
174.685
-46.460
-525.320
-540.000
-540.000
-540.000
-540.000
-540.000
-540.000
-540.000
-540.000
-540.000
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
10
11
12
13
14
15
16
17
18
19
20
resetn
MODE
ID0
65.310
ID1
172.310
TEST
279.310
F1
389.910
------------------------------21(GND) -------------------------------------
Publication Release Date: May 31, 2005
- 9 -
Revision A1
W55RFS27R3C
22
23
24
25
26
27
28
F2
22
23
24
25
26
27
28
770.310
655.860
541.410
426.960
312.510
196.535
78.385
540.000
540.000
540.000
540.000
540.000
540.000
540.000
R
L
B
F
RXD
VSPLY
(*: Bonding Sequence start from GND (Pin1))
3.4.2 W55RFS27R3C Bonding Pad Diagram
12
11
15
14
13
21 20 19 18 17 16
W55RFS27R3C
10
22 23 24 25 26 27 28
*1
2
3
4
5
6
7
- 10 -
W55RFS27R3C
4. DESIGN INFORMATION
4.1 W55RFS27R3C Reference Design
4.1.1 W55RFS27R3C Application Circuit
1
2
3
4
5
6
VSPLY
C1
RXD3
CON3
RXD
C2
CON1
+
10uF
C4
10uF
15nF
C25
D
C
B
A
D
C
B
A
VSPLY
R5
R8
-BAT+
CON2
10k
47nF
R2
F3
R4
0
F
B
L
CON3
330
F
1
1
1
1
1
1
2
2
2
2
2
2
VSPLY
R3
LED
LED
LED
LED
LED
VSPLY
VSPLY
VSPLY
VSPLY
R6
C10
F
330
B
B3
CON3
10uF
C9
R9
C3
330
L
68nF
B
15nF
C8
L3
R10
330
R
CON3
R
ANT
R11
ANTENNA
U1
GND
L
F2
330
GND1
28 VSPLY
F2
F1
VSPLY
R-3
CMFB
2
27 RXD
1uF
CMFB
RXD
F
CON3
RBIAS 3
RSAW 4
26
25
24
23
F
RBIAS
R12
B
L
R
F1
RSAW
B
330
VDDA 5
VDDA
L
LNA_GND6
LNA_VDD7
R
GND_LNA
VDD_LNA
SDINGD
LNA_ING
LNA_INS
LNAOUT
OSCin
R
LED
F23
ANT1
SMA
22 F2
oL2
F2
C11
SDINGD
LNAING
8
9
21
1.2uH
NA
F1
CON3
20 F1
15nf
C24
LNAINS 10
LNAOUT11
OSCin12
OSCou1t3
14
19 TEST
18 ID1
17 ID0
16 MODE
15 resetn
TEST
ID1
ID0
MODE
resetn
VSPLY
VSPLY
R14
10k
15nf
OSCout
GNDA
W55RFS27R3C
F2
GNDA
F13
CON3
R15
10k
oL0
1
1.5uH
2
1
F1
2
VSPLY
VSPLY
VSPLY
resetn
BUTTOM
VSPLY
C13
20pF
ID0
CON3
ID1
TEST
CON3
MODE
CON3
C12
CON3
27pF
Output/Input Pin: F B L R - - Jump switch VSPLY or GND
Output/Power on trapping: RXD F1 F2
Power Pin: VSPLY GND
Input Pin: ID0 ID1- - switch VSPLY or GND
MODE - - switch VSPLY or GND
Title
CPU mode Power down: F2
W55RFS27R3C APPLICATION CIRCUIT
Size
B
Date:
File:
Number
Revision
TEST - - Jump switch VSPLY or GND
Test Pin : RXD
RF Pin: ANT
8-Jul-2004
Sheet of
Drawn By:
C:\temp\BACKUP~22.DDB
1
2
3
4
5
6
Publication Release Date: May 31, 2005
Revision A1
- 11 -
W55RFS27R3C
W55RFS27R3C Application Schematic BOM:
Item Qty Reference
--------------------------------------------------------------------------------------------------------------------------
Part
1.
2.
3.
4.
5.
6.
7.
8.
1
1
1
1
2
1
3
4
1
1
1
1
5
1
1
1
0
R2
oL2
oL0
C8
1.2uH
1.5uH
1uF
10k
10k
10uF
15nF
20pF
27pF
47nF
68nF
330
R8 R14
R15
C1 C2 C10
C4 C9 C11 C24
C13
C12
C25
C3
9.
10.
11.
12.
13.
14.
15.
16.
R4 R6 R9 10 R11
330
R12
ANT
U1
ANTENNA
W55RFS27R3C
- 12 -
W55RFS27R3C
5. REVISION HISTORY
VERSION
DATE
PAGE
DESCRIPTION
A0
2004/7/8
-
Preliminary version A0
Released version A1(Revised by Brand) and
Important Notice
A1
2005/5/31
-
Important Notice
Winbond products are not designed, intended, authorized or warranted for use as components
in systems or equipment intended for surgical implantation, atomic energy control instruments,
airplane or spaceship instruments, transportation instruments, traffic signal instruments,
combustion control instruments, or for other applications intended to support or sustain life.
Further more, Winbond products are not intended for applications wherein failure of Winbond
products could result or lead to a situation wherein personal injury, death or severe property
or environmental damage could occur.
Winbond customers using or selling these products for use in such applications do so at their
own risk and agree to fully indemnify Winbond for any damages resulting from such improper
use or sales.
Headquarters
Winbond Electronics Corporation America Winbond Electronics (Shanghai) Ltd.
27F, 2299 Yan An W. Rd. Shanghai,
200336 China
2727 North First Street, San Jose,
CA 95134, U.S.A.
No. 4, Creation Rd. III,
Science-Based Industrial Park,
Hsinchu, Taiwan
TEL: 1-408-9436666
TEL: 86-21-62365999
FAX: 86-21-62365998
TEL: 886-3-5770066
FAX: 1-408-5441798
FAX: 886-3-5665577
http://www.winbond.com.tw/
Taipei Office
Winbond Electronics Corporation Japan
7F Daini-ueno BLDG, 3-7-18
Shinyokohama Kohoku-ku,
Yokohama, 222-0033
Winbond Electronics (H.K.) Ltd.
Unit 9-15, 22F, Millennium City,
No. 378 Kwun Tong Rd.,
Kowloon, Hong Kong
9F, No.480, Rueiguang Rd.,
Neihu District, Taipei, 114,
Taiwan, R.O.C.
TEL: 886-2-8177-7168
FAX: 886-2-8751-3579
TEL: 81-45-4781881
TEL: 852-27513100
FAX: 81-45-4781800
FAX: 852-27552064
Please note that all data and specifications are subject to change without notice.
All the trade marks of products and companies mentioned in this data sheet belong to their respective owners.
Publication Release Date: May 31, 2005
Revision A1
- 13 -
相关型号：
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