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元器件品牌
MS-7
[WINBOND]
华邦公司给微星做的一款电源管理和复位的芯片;
元器件型号：
MS-7
生产厂家：
WINBOND
描述和应用：
华邦公司给微星做的一款电源管理和复位的芯片
PDF文件：
总17页 (文件大小：146K)
下载文档：
下载PDF数据表文档文件
型号参数：MS-7参数
查看货源
MS-7-140
High-Speed Interconnect Technology
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156
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0
ETC2
MS-7-140-Y
High-Speed Interconnect Technology
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156
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0
ETC2
MS716603030
30CKT EBBI VT IDT RECPT MS716603030
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18
MOLEX
MS716603040
IDT RECEPTACLE MS716603040
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156
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16
MOLEX
MS716603050
50 CKT .025 RC EBBI RECEP MS716603050
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156
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13
MOLEX
MS716603060
60CKT EBBI VT IDT RECPT MS716603060
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156
-
13
MOLEX
MS-71660-3068
EBBI 50D VT RCPT IDT 68CKT
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16
MOLEX
MS-71660-3080
EBBI 50D VT RCPT IDT 80CKT
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30
MOLEX
MS7200L
256 x 9, 512 x 9, 1K x 9 CMOS FIFO
Warning
: Undefined variable $rtag in
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on line
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92
MOSEL
MS7201-A2
PRESSURE SENSOR DIE (0-1 BAR) FOR HARSH ENVIRONMENT
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36
INTERSEMA
MS7201AL
256 x 9, 512 x 9, 1K x 9 CMOS FIFO
Warning
: Undefined variable $rtag in
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on line
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23
MOSEL
MS7202-A2
PRESSURE SENSOR DIE (0-2 BAR) FOR HARSH ENVIRONMENT
Warning
: Undefined variable $rtag in
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on line
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36
INTERSEMA
MS7202AL
256 x 9, 512 x 9, 1K x 9 CMOS FIFO
Warning
: Undefined variable $rtag in
/www/wwwroot/www.icpdf.com/pdf/pdf/index.php
on line
156
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28
MOSEL
MS7204-A2
PRESSURE SENSOR DIE (0-4 BAR) FOR HARSH ENVIRONMENT
Warning
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27
INTERSEMA
MS7207-A2
PRESSURE SENSOR DIE (0-7 BAR) FOR HARSH ENVIRONMENT
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59
INTERSEMA
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