5962-8751419YC [XICOR]
8K X 8 EEPROM 5V, 300 ns, CQCC32, CERAMIC, LCC-32;
| 型号： | 5962-8751419YC |
| 厂家： | 
XICOR INC. |
| 描述： | 8K X 8 EEPROM 5V, 300 ns, CQCC32, CERAMIC, LCC-32 可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器 内存集成电路 |
| 文件： | 总26页 (文件大小：194K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
REVISIONS
LTR
A
DESCRIPTION
DATE (YR-MO-DA)
89-08-07
APPROVED
M. A. Frye
Add case outline letter U. Add vendor CAGE number 60395 to
drawing. Editorial changes throughout.
B
C
D
E
Add device type 28 to drawing. Editorial changes throughout.
Add software data protect to drawing. Updated boilerplate.
Changes in accordance with NOR 5962-R409-97
93-01-05
97-04-06
97-08-12
04-06-04
M. A. Frye
Raymond Monnin
Raymond Monnin
Raymond Monnin
Editorial correction to page 1, correction of number of pages. Figure
1 redrawn with 32 leads vs 44 leads and dimension table corrected.
ksr
THE ORIGINAL FIRST PAGE OF THE DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
E
E
E
E
E
E
E
21
E
E
22
E
E
23
E
SHEET
15
16
17
18
19
20
REV STATUS
OF SHEETS
PMIC N/A
REV
E
4
E
5
E
6
E
7
E
8
E
9
E
E
E
E
E
SHEET
1
2
3
10
11
12
13
14
PREPARED BY
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
Kenneth Rice
CHECKED BY
STANDARD
Charles Reusing
APPROVED BY
MICROCIRCUIT
DRAWING
Michael A. Frye
MICROCIRCUIT, MEMORY,
DIGITAL, CMOS 8K X 8-BIT
EEPROM, MONOLITHIC SILICON
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
DRAWING APPROVAL DATE
88-07-01
REVISION LEVEL
E
AMSC N/A
SIZE
A
CAGE CODE
5962-87514
67268
SHEET
1 OF 23
DSCC FORM 2233
APR 97
5962-E141-04
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN shall be as shown in the following example:
5962-87514
01
│
X
│
│
│
X
│
│
│
│
│
│
│
│
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish per
MIL-PRF-38535
appendix A
1.2.1 Device type(s). The device type(s) shall identify the circuit function as follows:
Generic
number
Access
time
Write
speed
Write
mode
End of write
indicator
Device type
Circuit function
Endurance
01
02
03
04
05
06
07
08
09
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
(see 6.4) (8K X 8 EEPROM)
350 ns
300 ns
250 ns
200 ns
250 ns
350 ns
300 ns
250 ns
200 ns
120 ns
90 ns
10 ms byte/page
10 ms byte/page
10 ms byte/page
10 ms byte/page
10 ms byte/page
DATA polling 10,000 cycles
DATA polling 10,000 cycles
DATA polling 10,000 cycles
DATA polling 10,000 cycles
DATA polling 100,000 cycles
DATA polling 10,000 cycles
DATA polling 10,000 cycles
DATA polling 10,000 cycles
DATA polling 10,000 cycles
DATA polling 10,000 cycles
DATA polling 10,000 cycles
DATA polling 10,000 cycles
2 ms
2 ms
2 ms
2 ms
2 ms
2 ms
2 ms
1 ms
1 ms
1 ms
1 ms
1 ms
1 ms
1 ms
1 ms
1 ms
1 ms
byte/page
byte/page
byte/page
byte/page
byte/page
byte/page
byte/page
byte
byte
byte
byte
byte
70 ns
350 ns
300 ns
250 ns
200 ns
150 ns
350 ns
300 ns
250 ns
200 ns
150 ns
350 ns
300 ns
250 ns
200 ns
250 ns
200 ns
RDY/BUSY
RDY/BUSY
RDY/BUSY
RDY/BUSY
RDY/BUSY
10,000 cycles
10,000 cycles
10,000 cycles
10,000 cycles
10,000 cycles
byte
byte
byte
byte
DATA polling 10,000 cycles
DATA polling 10,000 cycles
DATA polling 10,000 cycles
DATA polling 10,000 cycles
DATA polling 10,000 cycles
byte
10 ms byte/page
10 ms byte/page
10 ms byte/page
10 ms byte/page
10 ms byte/page
200 µs byte
RDY/BUSY
RDY/BUSY
RDY/BUSY
RDY/BUSY
RDY/BUSY
RDY/BUSY
10,000 cycles
10,000 cycles
10,000 cycles
10,000 cycles
100,000 cycles
10,000 cycles
1.2.2 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter
Descriptive designator
Terminals
Package style
U
X
Y
Z
See figure 1
GDIP1-T28 or CDIP2-T28
CQCC1-N32
32
28
32
28
"J" leaded cerquad package
Dual-in-line
Rectangular leadless chip carrier
Flat pack
CDFP4-F28
SIZE
STANDARD
5962-87514
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
SHEET
E
2
DSCC FORM 2234
APR 97
1.3 Absolute maximum ratings. 1/
Supply voltage range (VCC) ...................................................................... -0.3 V dc to +6.25 V dc
Storage temperature range...................................................................... -65°C to +150°C
Maximum power dissipation (PD).............................................................. 1.0 W
Lead temperature (soldering, 10 seconds) .............................................. +300°C
Junction temperature (TJ) 2/.................................................................... +175°C
Thermal resistance, junction-to-case (ΘJC) .............................................. See MIL-STD-1835
Input voltage range (VIL, VIH).................................................................... -0.3 V dc to +6.25 V dc
Data retention........................................................................................... 10 years (minimum)
Endurance:
Device types 01 through 04, 06 through 26, and 28 ............................. 10,000 cycles/byte (minimum)
Device types 05 and 27.......................................................................... 100,000 cycles/byte (minimum)
Chip clear voltage (VH)............................................................................. 13.0 V dc
1.4 Recommended operating conditions. 1/
Supply voltage range (VCC) ...................................................................... +4.5 V dc to +5.5 V dc
Case operating temperature range (TC)................................................... -55°C to +125°C
Input voltage, low range (VIL) ................................................................... -0.1 V dc to +0.8 V dc
Input voltage, high range (VIH) ................................................................. +2.0 V dc to VCC +0.3 V dc
Chip clear voltage range (VH)................................................................... 12 V dc to 13 V dc
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in
the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 -- Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883
-
Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -- List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or www.dodssp.daps.mil or from
the Standardization Document Order Desk, 700 Robins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
1/ All voltages are referenced to VSS (ground).
2/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in
accordance with method 5004 of MIL-STD-883.
SIZE
STANDARD
5962-87514
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
E
SHEET
3
DSCC FORM 2234
APR 97
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-
PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying
activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan
may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device.
These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-
PRF-38535 is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as
specified in MIL-PRF-38535, appendix A and herein.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Truth table for unprogrammed devices. The truth table for unprogrammed devices shall be as specified on figure 3.
3.2.3.1 Programmed devices. The truth table for programmed devices shall be as specified by an attached altered item
drawing.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics
are as specified in table I and shall apply over the full (case or ambient) operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the
manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator
shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device
class M shall be in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in
compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification
mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used.
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to
listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-
38535, appendix A and the requirements herein.
3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided
with each lot of microcircuits delivered to this drawing.
3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing.
3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's
facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the
reviewer.
3.10 Processing EEPROMS. All testing requirements and quality assurance provisions herein shall be satisfied by the
manufacturer prior to delivery.
SIZE
STANDARD
5962-87514
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
E
SHEET
4
DSCC FORM 2234
APR 97
3.10.1 Erasure of EEPROMS. When specified, devices shall be erased in accordance with the procedures and
characteristics specified in 4.4.1. Devices shall be shipped in the erased (logic "1's) and verified state unless otherwise
specified.
3.10.2 Programmability of EEPROMS. When specified, devices shall be programmed to the specified pattern using the
procedures and characteristics specified in 4.4.
3.10.3 Verification of erasure or programmability of EEPROMS. When specified, devices shall be verified as either
programmed to the specified pattern or erased. As a minimum, verification shall consist of reading the device in accordance
with the procedures and characteristics specified in 4.4.2. Any bit that does not verify to be in the proper state shall constitute
a device failure, and shall be removed from the lot.
3.12 Endurance. A reprogrammability test shall be completed as part of the vendor's reliability monitors. This
reprogrammability test shall be done for initial characterization and after any design or process changes which may affect the
reprogrammability of the device. The methods and procedures may be vendor specific, but shall guarantee the number of
program/erase endurance cycles listed in section 1.3 herein over the full military temperature range. The vendor's procedure
shall be kept under document control and shall be made available upon request of the acquiring or preparing activity, along
with test data.
3.13 Data retention. A data retention stress test shall be completed as part of the vendor's reliability monitors. This test
shall be done for initial characterization and after any design or process change, which may affect data retention. The
methods and procedures may be vendor specific, but shall guarantee the number of years listed in section 1.3 herein over the
full military temperature range. The vendor's procedure shall be kept under document control and shall be made available
upon request of the acquiring or preparing activity, along with test data.
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix
A.
4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices
prior to quality conformance inspection. The following additional criteria shall apply:
a. Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition D. The test circuit shall be maintained by the manufacturer under document revision level control
and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method
1015 of MIL-STD-883.
(2) TA = +125°C, minimum.
(3) Devices shall be burned-in containing a checkerboard pattern or equivalent.
b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
tests prior to burn-in are optional at the discretion of the manufacturer.
4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of
MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply.
4.3.1 Group A inspection.
a. Tests shall be as specified in table II herein.
b. Subgroups 5 and 6 in table I, method 5005 of MIL-STD-883 shall be omitted.
c. Subgroup 4 (CI and CO measurements) shall be measured only for the initial test and after process or design changes
which may affect capacitance. Sample size is 15 devices with no failures, and all input and output terminals tested.
d. Subgroups 7 and 8 shall include verification of the truth table.
SIZE
STANDARD
5962-87514
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
E
SHEET
5
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics.
│
│
│
│
│
│
│
│
│
Test
│Symbol │
│
│
Conditions 1/ 2/
│ Group A │ Device
│subgroups│ type
│
Limits
│ Unit
│
│
│ -55°C < TC <+125°C
│VSS = 0 V 4.5 V < VCC < 5.5 V
│
│
│
│ unless otherwise specified
│
│
│ Min
│ Max
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│ICC
│
│
│
│
│
│
│
│
│ 60
│
│
│ 80
│
│
Supply current
(active)
│CE = OE = VIL, WE = VIH
│All I/O's = open
│Inputs = VCC = 5.5 V
│
│
│ 1,2,3
│
│
│
│
│01-05,
│23-27
│
│06-12
│
│ mA
│
│
│
│
│
│
│
│13-22,28 │
│ 45
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│ICC1
│
│
│
│
│
│
│
│
│ 3
│
│
│
│
Supply current
(TTL standby)
│CE = VIH, OE = VIL
│All I/O's = open
│ 1,2,3
│
│ All
│
│ mA
│
│
│Inputs = X
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
Supply current
(CMOS standby)
│ICC2
│
│
│CE = VCC -0.3 V
│All I/O's = open
│Inputs = VIL to VCC -0.3 V
│ 1,2,3
│
│
│01-12,
│23-27
│
│250
│
│
│ µA
│
│
│
│
│
│13-22,28 │
│150
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
Input leakage
(high)
│IIH
│
│
│VIN = 5.5 V
│
│
│ 1,2,3
│
│
│ All
│
│
│-10
│
│
│ 10
│
│
│ µA
│
│
Input leakage
(low)
│IIL
│
│
│VIN = 0.1 V
│
│
│ 1,2,3
│
│
│ All
│
│
│-10
│
│
│ 10
│
│
│ µA
│
│
Output leakage 3/
(high)
│IOHZ
│
│VOUT = 5.5 V, CE = VIH
│ 1,2,3
│ All
│-10
│ 10
│ µA
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
Output leakage 3/
(low)
│IOLZ
│
│VOUT = 0.1 V, CE = VIH
│ 1,2,3
│ All
│-10
│ 10
│ µA
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
Input voltage
low
│VIL
│
│
│
│
│
│ 1,2,3
│
│
│ All
│
│
│ -0.1
│
│
│ 0.8
│
│
│ V
│
│
Input voltage
high
│VIH
│
│
│
│
│
│ 1,2,3
│
│
│ All
│
│
│ 2.0
│
│
│VCC+0.3 │ V
│
│
│
│
Output voltage
low
│VOL
│
│IOL = 2.1 mA, VIH = 2.0 V
│VCC = 4.5 V, VIL = 0.8 V
│
│
│IOH = -400 µA, VIH = 2.0 V
│VCC = 4.5 V, VIL = 0.8 V
│
│ 1,2,3
│ All
│
│ 0.45
│ V
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
Output voltage
high
│VOH
│
│
│ 1,2,3
│
│
│ All
│
│
│ 2.4
│
│
│ V
│
│
See footnotes at end of table.
SIZE
STANDARD
5962-87514
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
E
SHEET
6
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
│
│
│
│
│
│
│
│
│
Test
│Symbol │
│
│
│
│
│CI
│
│
│
Conditions 1/ 2/
│ Group A │ Device
│subgroups│ type
Limits
│ Unit
│
│
│
│
│ pF
│
│
│
│ -55°C < TC <+125°C
│VSS = 0 V 4.5 V < VCC < 5.5 V
│ unless otherwise specified
│
│VI = 0 V, VCC = 5.0 V
│TA = +25ºC, f = 1 MHz
│See 4.3.1c
│
│VO = 0 V, VCC = 5.0 V
│TA = +25ºC, f = 1 MHz
│See 4.3.1c
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│ All
│
│
│
│ All
│
│ Min
│
│
│
│
│
│
│
│ Max
│
│ 10
│
│
│
│ 10
│
Input
capacitance 4/ 5/
4
4
Output
capacitance 4/ 5/
│CO
│
│
│ pF
│
│
│
│
│
│
│
│
│
│
│
Functional tests
│
│See 4.3.1d
│ 7,8A,8B │ All
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
Read cycle time 6/
│tAVAV │See figure 4
│ 9,10,11 │01,06,13, │350
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│350
│
│
│300
│
│
│250
│
│
│
│200
│
│
│150
│120
│ 90
│ 70
│ ns
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│ ns
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│tAVQV
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│18,23
│
│02,07,14, │300
│19,24
│
│
│
│
│
│03,05,08, │250
│15,20,25, │
│27
│
│
│
│04,09,16, │200
│21,26,28 │
│
│17,22,
│
│10
│
│11
│
│12
│
│
│150
│
│120
│
│ 90
│
│ 70
│
Address access
time
│ 9,10,11 │01,06,13, │
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│18,23
│
│02,07,14, │
│19,24
│
│
│
│
│
│03,05,08, │
│15,20,25, │
│27
│
│
│
│04,09,16, │
│21,26,28 │
│
│17,22
│10
│11
│12
│
│
│
│
│
│
│
│
│
See footnotes at end of table.
SIZE
STANDARD
5962-87514
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
E
SHEET
7
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
│
│
│
│
│
│
│
│
│
Test
│Symbol │
Conditions 1/ 2/
│ Group A │ Device
│subgroups│ type
│
│
│
Limits
│ Unit
│
│
│
│
│
│
│
│
│ -55°C < TC <+125°C
│VSS = 0 V 4.5 V < VCC < 5.5 V
│ unless otherwise specified
│
│
│
│
│
│ Min
│
│ Max
│
Chip enable
access time
│tELQV │See figure 4
│ 9,10,11 │01,06,13, │
│350
│
│
│300
│
│
│250
│
│
│
│200
│
│
│150
│
│120
│
│ 90
│
│ 70
│
│100
│
│
│
│ 50
│
│
│
│
│
│ 80
│
│
│
│
│ 55
│
│
│
│
│
│
│ ns
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│18,23
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│02,07,14, │
│19,24
│
│03,05,08, │
│15,20,25, │
│27
│
│04,09,16, │
│21,26,28 │
│
│17,22
│
│10
│
│11
│
│12
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│ ns
│
│
│
│
│
│ ns
│
│
│
│ ns
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│ 10
│
│
│
│
│
│
│
│
│
│
│
│
Output enable
access time
│tOLQV
│
│ 9,10,11 │01-05,
│
│
│
│
│
│13-22,
│23-28
│
│06-12,
│
│
│
│
│
Chip enable to 5/
output in
low Z
│tELQX
│
│ 9,10,11 │ All
│
│
│
│
│
│
│
│
Chip disable to 5/
output in
high Z
│tEHQZ
│
│
│ 9,10,11 │01-08,
│
│
│
│
│
│
│
│
│13-15,
│18-20,
│23-27
│
│09-12,16, │
│17,21,22, │
│
│
│
│
│
│
│
│
│
│
│
│
│ ns
│
│
│28
│
│
│
Output enable to 5/
output in low Z
│tOLQX
│
│
│ 9,10,11 │ All
│ 10
│
│
│
│
│
│
See footnotes at end of table.
SIZE
STANDARD
5962-87514
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
E
SHEET
8
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
│
│
│
│
│
│
│
│
│
│
│
Test
│Symbol
│
│
Conditions 1/ 2/
-55°C < TC <+125°C
│ Group A │ Device
│subgroups│ type
Limits
│ Unit
│
│
│ VSS = 0 V 4.5 V < VCC < 5.5 V │
│
│
│
│
│
│
│
│
│
unless otherwise specified
│
│
│
│ Min
│ Max
│
│
│ 80
│
│
│
│
│ 55
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
Output disable
to output in
high Z
│tOHQZ
│
│See figure 4
│
│
│
│
│
│
│ 9,10,11 │01-08,
│ ns
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│13-15,
│18-20,
│23-27
│
│09-12,16, │
│17,21,22, │
│
│
│
│
│
│
│
5/
│
│
│28
│
│
│
│
│
Output hold from 6/
address change
│tAVQX
│
│ 9,10,11 │ All
│ 0
│
│
│ ns
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
CE to power up 5/
│tpu
│
│
│ 9,10,11 │ All
│
│250
│ ns
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
CE to power down 5/ │tpd
│
│ 9,10,11 │ All
│
│ 50
│ ns
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
Write cycle time
│tWHWL1
│
│ 9,10,11 │01-05,
│
│ 10
│ ms
│tEHEL1
│
│
│
│
│
│See figures 5 and 6
│
│
│
│
│
│
│
│
│
│
│
│23-27
│06-12
│13-22
│
│28
│
│
│
│
│
│
│
│
│ 2.0
│ 1.0
│
│ 0.2
│
│
│
│
│
│
│
Address setup 6/
time
│tAVEL
│See figures 5, 6, and 7
│ 9,10,11 │ All
│ 20
│
│
│ ns
│tAVWL
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
Address hold 6/
time
│tELAX
│ 9,10,11 │ All
│150
│
│
│ ns
│tWLAX
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
Write setup time 6/
Write hold time 6/
│tWLEL
│ 9,10,11 │ All
│ 0
│
│
│ ns
│tELWL
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│tWHEH
│
│
│ 9,10,11 │ All
│ 0
│
│
│
│ ns
│
│
│
│
│
│
│
│
See footnotes at end of table.
SIZE
STANDARD
5962-87514
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
E
SHEET
9
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
│
│
│
│
│
│
│
│
│
│
Test
│Symbol
│
│
Conditions 1/ 2/
│ Group A │ Device
│subgroups│ type
│
│
│
│
Limits
│ Unit
│
│
│ -55°C < TC <+125°C
│VSS = 0 V 4.5 V < VCC < 5.5 V
│ unless otherwise specified
│
│
│
│
│
│
│
│
│ Min
│
│
│ Max
│
│
│
│
│
│
│
OE setup time 6/
│tOHEL
│See figures 5, 6, or 7
│ 9,10,11 │ All
│ 20
│
│ ns
│tOHWL
│as applicable
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
OE hold time
│tWHOL
│
│ 9,10,11 │ All
│ 20
│
│ ns
│
│
│
│
│
│
│
│
│
│
│
│
│
│
WE pulse width 6/
│tELEH
│
│ 9,10,11 │ All
│150
│
│ ns
│tWLWH
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
Data setup time 6/
│tDVEH
│
│ 9,10,11 │ All
│ 50
│
│
│ ns
│tDVWH
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
Data hold time 6/
Byte load cycle
│tEHDX
│tWHDX
│
│
│tEHEL2
│tWHWL2
│
│
│
│ 9,10,11 │ All
│ 10
│
│
│ ns
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│See figures 5 or 6
│ 9,10,11 │ All
│ 0.2
│
│
│
│ 2
│
│
│
│ µs
│
│
│
│
│
│
│
│
│
│
│
│
Last byte loaded 6/
to data polling
│tWHEL
│See figure 5
│ 9,10,11 │06-12,
│
│200
│
│ ns
│
│
│
│
│
│18-22
│
│
│
│
│
│
│
│
│
│
│
│
│
│
CE setup time 6/
│tELWL
│See figure 5
│ 9,10,11 │ All
│ 1
│
│
│ µs
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
Output setup 6/
time
│tOVHWL
│See figure 8
│ 9,10,11 │ All
│ 1
│
│
│ µs
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
CE hold time 6/
OE hold time 6/
Erase time 6/
│tEHWH
│See figure 6
│ 9,10,11 │ All
│ 1
│
│
│ µs
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│ µs
│
│ 1
│
│
│
│200
│
│
│tWHOH
│See figure 8, configuration
│A or B
│
│
│
│
│
│ 9,10,11 │ All
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│tOHAV
│
│
│ 9,10,11 │01-05,
│
│
│
│ ms
│
│
│
│
│23-27
│
See footnotes at end of table.
SIZE
STANDARD
5962-87514
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
E
SHEET
10
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
│
│
│
│
│
│
│
│
│
│
Test
│Symbol
│
│
Conditions 1/ 2/
│ Group A │ Device
│subgroups│ type
│
│
│
│
Limits
│ Unit
│
│
│ -55°C < TC <+125°C
│VSS = 0 V 4.5 V < VCC < 5.5 V
│ unless otherwise specified
│
│
│
│
│
│
│
│
│ Min
│
│
│ Max
│
│
│
│
│
│
│
Chip erase time 6/
High voltage 6/
│tWLWH2
│
│See figure 8, configuration
│A or B
│
│
│
│ 9,10,11 │01-05,
│150
│
│
│
│
│
│
│
│ 13
│
│
│ ns
│
│
│ ms
│
│ V
│
│
│
│
│23-27
│
│06-22,28 │ 10
│
│
6/
│
│
│VH
│
│
│
│
│ 9,10,11 │ All
│ 12
│
│
│
│
│
│
│
│
│
│
Time to device
busy
│tEHRL
│tWHRL
│
│See figures 6 and 7
│ 9,10,11 │13-17,28 │
│ 50
│100
│
│ ns
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│23-27
│
│
│
│
│
│
│
│
│
│
Write cycle time
RDY/BUSY
│tELRH
│tWLRH
│
│ 9,10,11 │13-17,28 │
│ 1
│ 10
│
│
│ 1
│
│ ms
│
│
│
│23-27
│
│
│
│
│
│
│
│
│
Maximum time to 6/
valid data after
WE/CE low
│tWLDV
│tELDV
│
│ 9,10,11 │13-22,28 │
│ µs
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
1/ DC and read mode.
2/ Equivalent ac test conditions:
Device types: 01 through 09 and 13 through 28.
Output load: 1 TTL gate and C1 = 100 pF,
Input rise and fall times < 10 ns.
Input pulse levels: 0.4 V and 2.4 V.
Timing measurements reference levels:
Inputs 1 V and 2 V.
Device types: 10 through 12.
Output load: 1 TTL gate and C1 = 30 pF.
Input rise and fall times < 5 ns.
Input pulse levels: 0.4 V and 2.4 V.
Inputs 1 V and 2 V.
Outputs 0.8 V and 2 V.
Outputs 0.8 V and 2 V.
3/ Connect all address inputs and OE to VIH and measure IOLZ and IOHZ with the output under test connected to VOUT
4/ All pins not being tested are to be open.
.
5/ Tested initially and after any design or process changes that affect that parameter, and therefore guaranteed to the limits
specified in table I.
6/ Tested by application of specified timing signals and conditions, see footnote 2/.
SIZE
STANDARD
5962-87514
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
E
SHEET
11
DSCC FORM 2234
APR 97
Case U
FIGURE 1. Case outline.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-87514
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
E
SHEET
12
DSCC FORM 2234
APR 97
Case U
Dimensions
Ltr
Inches
Millimeters
Min Max
Min
Max
.167
.140
3.56
4.24
A
.073
.027
.006
.485
.445
.390
.585
.545
.490
.103
.045
.010
.495
.465
.430
.595
.565
.530
1.85
2.62
A1
A2
c
0.69
1.14
0.15
0.25
12.32
11.30
9.91
12.57
11.81
10.92
15.11
14.35
13.46
D
D1
D2
E
14.86
13.84
12.45
1.27 TYP
0.43
E1
E2
e
.050 TYP
.017
.026
.021
.032
0.53
0.81
b
0.66
b1
N
32
NOTES:
1. Controlling dimensions are inches, metric provided for convenience.
2. Dimensions D1 and E1 do not include glass protrusion. Glass protrusion to be .010 inch (0.25 mm) maximum.
3. All dimensions and tolerances include lead trim offset and lead finish.
FIGURE 1. Case outline - Continued.
SIZE
STANDARD
5962-87514
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
E
SHEET
13
DSCC FORM 2234
APR 97
Device types
Case outlines
01 through 28
X and Z U and Y
Terminal symbol
Terminal
number
1
2
NC (See note)
NC
A12
A7
NC (See note)
3
A12
A7
4
A6
5
A5
A6
6
A4
A5
7
A3
A4
8
A2
A3
9
A1
A2
10
11
12
13
14
15
16
17
18
19
20
A0
A1
I/O0
I/O1
I/O2
GND
I/O3
I/O4
I/O5
I/O6
I/O7
A0
NC
I/O0
I/O1
I/O2
GND
NC
I/O3
I/O4
I/O5
CE
A10
21
22
I/O6
I/O7
OE
A11
23
CE
A10
24
25
A9
A8
OE
NC
A11
26
27
NC
WE
VCC
---
28
29
30
31
A9
A8
---
NC
---
WE
VCC
32
---
FIGURE 2. Terminal connections.
SIZE
STANDARD
5962-87514
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
E
SHEET
14
DSCC FORM 2234
APR 97
Mode
I/O
Device types
CE
OE
WE
Read
VIL
VIL
VIL
X
VIL
VH
VIH
VIL
X
VIH
VIL
VIL
X
DOUT
X
All
All
All
All
All
All
Chip clear
Byte write
Write inhibit
Write inhibit
Standby
Data in
High Z/DOUT
High Z/DOUT
High Z
X
VIH
X
VIH
X
FIGURE 3. Truth table.
NOTES:
1. VCC shall be applied simultaneously or after WE and removed simultaneously or before WE .
2. See footnote 2 of table I.
FIGURE 4. Read cycle timing.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-87514
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
E
SHEET
15
DSCC FORM 2234
APR 97
NOTES:
1. See footnote 2 of table I.
2. Program verify equivalent to the read mode.
3. Page load is 1 to 64 bytes of data for device types 01 through 12, and 23 through 27.
4. WE is noise protected. Less than 20 ns write pulse will not activate a write cycle.
5. WE and CE both must be active to initiate a write cycle; therefore, the sequence of
WE or CE (e.g., for WE or CE controlled write) is verified interchangeable without
duplicate testing.
FIGURE 5. Page write programming waveforms.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-87514
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
E
SHEET
16
DSCC FORM 2234
APR 97
NOTES:
1. See footnote 2 of table I.
2. Program verify equivalent to the read mode.
3. WE and CE both must be active to initiate a write cycle; therefore, the sequence of
WE and CE (e.g., for WE or CE controlled write) is verified interchangeable without
duplicate testing.
FIGURE 6. CE _controlled byte write programming waveforms.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-87514
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
E
SHEET
17
DSCC FORM 2234
APR 97
NOTES:
1. See footnote 2 of table I.
2. Program verify equivalent to the read mode.
3. WE and CE both must be active to initiate a write cycle; therefore, the sequence of
WE and CE (e.g., for WE or CE controlled write) is verified interchangeable without
duplicate testing.
FIGURE 7. WE controlled byte write programming waveforms.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-87514
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
E
SHEET
18
DSCC FORM 2234
APR 97
FIGURE 8. Chip clear waveforms.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-87514
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
E
SHEET
19
DSCC FORM 2234
APR 97
NOTES:
1. Set software data protection timings are referenced to WE or CE inputs, whichever is last to go low, and the
WE or CE inputs, whichever is first to go high.
2. The command sequence must conform to the page write timing.
3. The command sequence and subsequent data must conform to the page write timing.
FIGURE 9. Set software data protect and software protected write algorithm (device types 01- 05 and 08 - 12).
SIZE
STANDARD
5962-87514
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
E
SHEET
20
DSCC FORM 2234
APR 97
NOTES:
1. Reset software data protection timings are referenced to WE or CE inputs, whichever is last to go low,
and the WE or CE inputs, whichever is first to go high.
2. The command sequence must conform to the page write timing.
FIGURE 10. Reset software data protect algorithm (device types 01- 05 and 08 - 12).
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-87514
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
E
SHEET
21
DSCC FORM 2234
APR 97
TABLE II. Electrical test requirements.
Subgroups 1/ 2/
MIL-STD-883 test requirements
(in accordance with
MIL-STD-883, method
5005, table I)
Interim electrical parameters
(method 5004)
1, 7, 9,
or
2, 8A, 10
Final electrical test parameters
(method 5004)
1*, 2, 3, 7*, 8,
9, 10, 11 3/
1, 2, 3, 4**, 7,
8, 9, 10, 11 4/ 5/
1, 2, 3, 7,
Group A test requirements
(method 5005)
Groups C and D end-point electrical
parameters (method 5005)
8, 9, 10, 11
1/ Any or all subgroups may be combined when using multifunction testers.
2/ For all electrical tests, the device shall be programmed to the data pattern specified.
3/ (*) Indicates PDA applies to subgroups 1 and 7.
4/ Subgroups 7 and 8 shall consist of writing and reading the data pattern specified
in accordance with the limits of table I subgroups 9, 10, and 11.
5/ (**) Indicates that subgroup 4 will only be performed during initial qualification and after design
or process changes (see 4.3.1c).
4.3.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table IIA herein.
The following additional criteria shall apply.
a. End-point electrical parameters shall be as specified in table II herein.
b. Steady-state life test conditions, method 1005 of MIL-STD-883.
(1) Test condition D. The test circuit shall be maintained by the manufacturer under document revision level control
and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method
1005 of MIL-STD-883.
(2) TA = +125°C, minimum.
(3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
4.3.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein.
4.4 Programming procedure. The following procedure shall be followed when programming (Write) is performed. The
waveforms and timing relationships shown on figure 5 (per appropriate device type) and the conditions specified in table I shall
be adhered to. Information is introduced by selectively programming a TTL low or TTL high on each I/O of the address desired.
Functionality shall be verified at all temperatures (group A, subgroups 7 and 8) by programming all bytes of each device and
verifying the pattern used.
4.4.1 Erasing procedure. There are two forms of erasure, chip and byte, whereby all bits or the address selected will be
erased to a TTL high.
a. Chip erase is performed in accordance with the waveforms and timing relationships shown on figure 8 (in accordance
with appropriate device type) and the conditions specified in table I.
b. Byte erase is performed in accordance with the waveforms and timing relationships shown on figure 5 (in accordance
with appropriate device type) and the conditions specified in table I.
4.4.2 Read mode operation. The waveforms and timing relationships shown on figure 4 and the conditions specified in table I
shall be applied when reading the device. Pattern verification utilizes the read mode.
SIZE
STANDARD
5962-87514
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
E
SHEET
22
DSCC FORM 2234
APR 97
4.4.3 RDY/BUSY. While the write operation is in progress, the RDY/BUSY output is at a TTL low. An internal timer times
out the required byte write time and at the end of this time, the device signals the RDY/BUSY pin to a TTL high. The
RDY/BUSY pin is an open drain output and a typical 3 kΩ pull-up resistor to VCC is required. The pull-up resistor value is
dependent on the number of OR-tied RDY/BUSY pins (applies to device types 13 through 17 and 23 through 28).
4.4.4 Set software data protection. Device types 01-05 and 08-12 software data protection offers a method of preventing
inadvertent writes. These devices are placed in protected state by writing a series of instructions (see figure 9) to the device.
Once protected, writing to the device may only be performed by executing the same sequence of instructions appended with
either a byte write operation or page write operation. The waveforms and timing relationships shown on figures 4 - 8 and the
test conditions and limits specified in table I shall apply.
4.4.4.1 Reset software data protection. Device types 01-05 and 08-12 protection feature is reset by writing a series of
instructions (see figure 10) to the device. The waveforms and timing relationships shown on figures 4 - 8 and the test
conditions and limits specified in table I shall apply.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-
prepared specification or drawing.
6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for
the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.
6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system
application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be
used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FSC
5962) should contact DSCC-VA, telephone (614) 692-0544.
6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43216-5000, or telephone
(614) 692-0547.
6.6 Approved sources of supply. Approved sources of supply are listed in MIL-HDBK-103. The vendors listed in MIL-
HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted
by DSCC-VA.
SIZE
STANDARD
5962-87514
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
E
SHEET
23
DSCC FORM 2234
APR 97
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 04-06-04
Approved sources of supply for SMD 5962-87514 are listed below for immediate acquisition information only and shall be
added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include
the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has
been submitted to and accepted by DSCC-VA. This information bulletin is superseded by the next dated revision of MIL-
HDBK-103 and QML-38535.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
2/
Vendor
similar
PIN 3/
5962-8751401XA
5962-8751401YA
5962-8751401ZC
5962-8751402XA
5962-8751402YA
5962-8751402ZC
5962-8751403XA
5962-8751403YA
5962-8751403ZC
5962-8751404XA
5962-8751404YA
5962-8751404ZC
5962-8751405XA
5962-8751405YA
5962-8751405ZC
5962-8751406XA
5962-8751406UA
5962-8751406YA
5962-8751407XA
5962-8751407UA
5962-8751407YA
5962-8751408XA
5962-8751408UA
5962-8751408YA
5962-8751409XA
5962-8751409UA
5962-8751409YA
5962-8751410XA
5962-8751410UA
5962-8751410YA
5962-8751411XA
5962-8751411UA
5962-8751411YA
5962-8751412XA
5962-8751412UA
5962-8751412YA
5962-8751413XA
5962-8751413UA
5962-8751413YA
5962-8751413ZA
5962-8751414XA
X28C64DMB-35
2/
X28C64EMB-35
2/
X28C64FMB-35
2/
X28C64DMB-30
2/
X28C64EMB-30
2/
X28C64FMB-30
2/
X28C64DMB-25
2/
X28C64EMB-25
2/
X28C64FMB-25
2/
X28C64DMB-20
2/
X28C64EMB-20
2/
X28C64FMB-20
2/
X28C64DMB-25
2/
X28C64EMB-25
2/
X28C64FMB-25
2/
AT28PC64-35DM/883
AT28PC64-35KM/883
AT28PC64-35LM/883
AT28PC64-30DM/883
AT28PC64-30KM/883
AT28PC64-30LM/883
AT28C64B-25DM/883
AT28PC64-25KM/883
AT28PC64-25LM/883
AT28C64B-20DM/883
AT28PC64-20KM/883
AT28PC64-20LM/883
AT28HC64B-12DM/883
AT28HC64L-12KM/883
AT28HC64L-12LM/883
AT28HC64B-90DM/883
AT28HC64L-90KM/883
AT28HC64L-90LM/883
AT28HC64B-70DM/883
AT28HC64L-70KM/883
AT28HC64L-70LM/883
AT28C64-35DM/883
AT28C64-35KM/883
AT28C64-35LM/883
AT28C64-35FM/883
AT28C64-30DM/883
2/
2/
2/
2/
2/
2/
2/
2/
2/
2/
2/
2/
2/
2/
2/
2/
2/
2/
2/
2/
2/
2/
2/
2/
2/
See footnotes at end of table.
1 of 3
STANDARDIZED MILITARY DRAWING SOURCE APPROVAL BULLETIN - Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
2/
Vendor
similar
PIN 3/
5962-8751414UA
5962-8751414YA
5962-8751415XA
5962-8751415UA
5962-8751415YA
5962-8751415ZA
5962-8751416XA
5962-8751416UA
5962-8751416YA
5962-8751417XA
5962-8751417UA
5962-8751417YA
5962-8751418XA
5962-8751418UA
5962-8751418YA
5962-8751419XA
5962-8751419UA
5962-8751419YA
5962-8751420XA
5962-8751420UA
5962-8751420YA
5962-8751420ZA
5962-8751421XA
5962-8751421UA
5962-8751421YA
5962-8751422XA
5962-8751422UA
5962-8751422YA
5962-8751423XA
5962-8751423YA
5962-8751423ZA
5962-8751424XA
5962-8751424YA
5962-8751424ZA
5962-8751425XA
5962-8751425YA
5962-8751425ZA
AT28C64-30KM/883
AT28C64-30LM/883
AT28C64-25DM/883
AT28C64-25KM/883
AT28C64-25LM/883
AT28C64-25FM/883
AT28C64-20DM/883
AT28C64-20KM/883
AT28C64-20LM/883
AT28C64-15DM/883
AT28C64-15KM/883
AT28C64-15LM/883
AT28C64X-35DM/883
AT28C64X-35KM/883
AT28C64X-35LM/883
AT28C64X-30DM/883
AT28C64X-30KM/883
AT28C64X-30LM/883
AT28C64X-25DM/883
AT28C64X-25KM/883
AT28C64X-25LM/883
AT28C64X-25FM/883
AT28C64X-20DM/883
AT28C64X-20KM/883
AT28C64X-20LM/883
AT28C64X-15DM/883
AT28C64X-15KM/883
AT28C64X-15LM/883
DM28C65-350/B
2/
2/
2/
2/
2/
2/
2/
2/
2/
2/
2/
2/
2/
2/
2/
2/
2/
2/
2/
2/
2/
2/
2/
2/
2/
2/
2/
2/
2/
LM28C65-350/B
2/
FM28C65-350/B
2/
DM28C65-300/B
2/
LM28C65-300/B
2/
FM28C65-300/B
2/
DM28C65-250/B
2/
LM28C65-250/B
2/
FM28C65-250/B
2 of 3
STANDARDIZED MILITARY DRAWING SOURCE APPROVAL BULLETIN - Continued.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 3/
5962-8751426XA
5962-8751426YA
5962-8751426ZA
5962-8751427XA
5962-8751427YA
5962-8751427ZA
5962-8751428XA
5962-8751428YA
2/
2/
2/
2/
2/
2/
2/
2/
DM28C65-200/B
LM28C65-200/B
FM28C65-200/B
DM55C65-250/B
LM55C65-250/B
FM55C65-250/B
AT28C64F-20DM/883
AT28C64F-20LM/883
1/ The lead finish shown for each PIN representing a hermetic
package is the most readily available from the manufacturer
listed for that part. If the desired lead finish is not listed contact
the vendor to determine its availability.
2/ Not available from an approved source.
3/ Caution. Do not use this number for item acquisition. Items acquired
to this number may not satisfy the performance requirements of this drawing.
The information contained herein is disseminated for convenience
only and the Government assumes no liability whatsoever for any
inaccuracies in this information bulletin.
3 of 3
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