X24640 [XICOR]

400KHz 2-Wire Serial E 2 PROM with Block Lock; 400kHz的2线串行é 2 PROM与锁座
X24640
型号: X24640
厂家: XICOR INC.    XICOR INC.
描述:

400KHz 2-Wire Serial E 2 PROM with Block Lock
400kHz的2线串行é 2 PROM与锁座

可编程只读存储器
文件: 总17页 (文件大小:87K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
64K  
8K x 8 Bit  
X24640  
400KHz 2-Wire Serial E2PROM with Block LockTM  
FEATURES  
DESCRIPTION  
2
Save Critical Data with Programmable  
Block Lock Protection  
—Block Lock (0, 1/4, 1/2, or all of E PROM Array)  
The X24640 is a CMOS Serial E PROM, internally  
organized 8K x 8. The device features a serial inter-  
face and software protocol allowing operation on a  
simple two wire bus. The bus operates at 400 KHz all  
the way down to 1.8V.  
2
—Software Program Protection  
—Programmable Hardware Write Protect  
In Circuit Programmable ROM Mode  
400KHz 2-Wire Serial Interfac  
—Schmitt Trigger Input Noise Suppression  
—Output Slope Control for Ground Bounce  
Noise Elimination  
Longer Battery Life With Lower Power  
—Active Read Current Less Than 1mA  
—Active Program Current Less Than 3mA  
—Standby Current Less Than 1µA  
1.8V to 3.6V, 2.5V to 5.5V and 4.5V to 5.5V  
Power Supply Versions  
Three device select inputs (S –S ) allow up to eight  
devices to share a common two wire bus.  
0
2
A Write Protect Register at the highest address loca-  
tion, FFFFh, provides three write protection features:  
Software Write Protect, Block Lock Protect, and  
Programmable Hardware Write Protect. The Software  
Write Protect feature prevents any nonvolatile writes to  
the device until the WEL bit in the Write Protect  
Register is set. The Block Lock Protection feature  
gives the user four array block protect options, set by  
programming two bits in the Write Protect Register.  
The Programmable Hardware Write Protect feature  
allows the user to install the device with WP tied to  
32 Word Page Write Mode  
—Minimizes Total Write Time Per Word  
Internally Organized 8K x 8  
Bidirectional Data Transfer Protocol  
Self-Timed Write Cycle  
V
, program and Block Lock the desired portions of  
CC  
the memory array in circuit, and then enable the In  
Circuit Programmable ROM Mode by programming the  
WPEN bit in the Write Protect Register. After this, the  
Block Locked portions of the array, including the Write  
Protect Register itself, are permanently protected from  
being erased.  
—Typical Write Cycle Time of 5ms  
High Reliability  
—Endurance: 100,000 Cycles  
—Data Retention: 100Years  
8-Lead SOIC  
20-Lead TSSOP  
8-Lead PDIP  
FUNCTIONAL DIAGRAM  
DATA REGISTER  
Y DECODE LOGIC  
SERIAL E2PROM DATA  
AND ADDRESS (SDA)  
COMMAND  
DECODE  
AND  
CONTROL  
LOGIC  
SERIAL E2PROM  
SCL  
ARRAY  
PAGE  
8K x 8  
DECODE  
LOGIC  
2K x 8  
BLOCK LOCK AND  
WRITE PROTECT  
CONTROL LOGIC  
2K x 8  
4K x 8  
S2  
DEVICE  
SELECT  
LOGIC  
WRITE  
PROTECT  
REGISTER  
S1  
S0  
WRITE VOLTAGE  
CONTROL  
WP  
7038 FM 01  
Xicor, 1995, 1996 Patents Pending  
7038-1.2 4/25/97 T0/C2/D0 SH  
Characteristics subject to change without notice  
1
X24640  
2
Xicor E PROMs are designed and tested for applica-  
PIN NAMES  
Symbol  
tions requiring extended endurance. Inherent data  
retention is greater than 100 years.  
Description  
S0, S1, S2  
Device Select Inputs  
PIN DESCRIPTIONS  
Serial Clock (SCL)  
SDA  
SCL  
WP  
Serial Data  
Serial Clock  
Write Protect  
Ground  
The SCL input is used to clock all data into and out of  
the device.  
VSS  
Serial Data (SDA)  
VCC  
NC  
Supply Voltage  
No Connect  
SDA is a bidirectional pin used to transfer data into  
and out of the device. It is an open drain output and  
may be wire-ORed with any number of open drain or  
open collector outputs.  
7038 FM T01  
PIN CONFIGURATION  
An open drain output requires the use of a pull-up  
resistor. For selecting typical values, refer to the Pull-  
up resistor selection graph at the end of this data  
sheet.  
Not to scale  
8-Lead PDIP/SOIC  
S
S
S
1
2
8
7
V
0
1
2
Device Select (S , S , S )  
CC  
0
1
2
WP  
The device select inputs (S , S , S ) are used to set  
* .197”  
X24640  
0
1
2
3
4
6
5
SCL  
SDA  
the first three bits of the 8-bit slave address. This  
allows up to eight devices to share a common bus.  
These inputs can be static or actively driven. If used  
V
SS  
* .244”  
statically they must be tied to V or V  
as appro-  
SS  
CC  
priate. If actively driven, they must be driven with  
CMOS levels (driven to V or V ).  
20-Lead TSSOP  
CC  
SS  
20  
NC  
1
NC  
Write Protect (WP)  
19  
S
2
V
0
CC  
The Write Protect input controls the Hardware Write  
Protect feature. When held LOW, Hardware Write  
Protection is disabled. When this input is held HIGH,  
and the WPEN bit in the Write Protect Register is set  
HIGH, the Write Protect Register is protected,  
preventing changes to the Block Lock Protection and  
WPEN bits.  
3
18  
S
WP  
1
17  
4
NC  
NC  
NC  
NC  
5
16  
NC  
0.300"  
Max  
X24640  
6
15  
NC  
14  
S
7
SCL  
SDA  
NC  
2
8
13  
V
SS  
NC  
NC  
12  
9
10  
11  
NC  
0.252"  
7038 FM 02  
* SOIC Measurement  
2
X24640  
DEVICE OPERATION  
Clock and Data Conventions  
Data states on the SDA line can change only during  
SCL LOW. SDA state changes during SCL HIGH are  
reserved for indicating start and stop conditions. Refer  
to Figures 1 and 2.  
The device supports a bidirectional bus oriented  
protocol. The protocol defines any device that sends  
data onto the bus as a transmitter, and the receiving  
device as the receiver. The device controlling the  
transfer is a master and the device being controlled is  
the slave. The master will always initiate data trans-  
fers, and provide the clock for both transmit and  
receive operations. Therefore, the device will be  
considered a slave in all applications.  
Start Condition  
All commands are preceded by the start condition,  
which is a HIGH to LOW transition of SDA when SCL  
is HIGH. The device continuously monitors the SDA  
and SCL lines for the start condition and will not  
respond to any command until this condition has been  
met.  
Figure 1. Data Validity  
SCL  
SDA  
DATA STABLE  
DATA  
CHANGE  
7038 FM 03  
Figure 2. Definition of Start and Stop  
SCL  
SDA  
STARTBIT  
STOP BIT  
7038 FM 04  
3
X24640  
Stop Condition  
The device will respond with an acknowledge after  
recognition of a start condition and its slave address. If  
both the device and a write operation have been  
selected, the device will respond with an acknowledge  
after the receipt of each subsequent 8-bit word.  
All communications must be terminated by a stop  
condition, which is a LOW to HIGH transition of SDA  
when SCL is HIGH. The stop condition is also used to  
place the device into the standby power mode after a  
read sequence. A stop condition can only be issued  
after the transmitting device has released the bus.  
In the read mode the device will transmit eight bits of  
data, release the SDA line and monitor the line for an  
acknowledge. If an acknowledge is detected and no  
stop condition is generated by the master, the device  
will continue to transmit data. If an acknowledge is not  
detected, the device will terminate further data trans-  
missions. The master must then issue a stop condition  
to return the device to the standby power mode and  
place the device into a known state.  
Acknowledge  
Acknowledge is a software convention used to indicate  
successful data transfer. The transmitting device,  
either master or slave, will release the bus after trans-  
mitting eight bits. During the ninth clock cycle the  
receiver will pull the SDA line LOW to acknowledge  
that it received the eight bits of data. Refer to Figure 3.  
Figure 3. Acknowledge Response From Receiver  
SCL FROM  
MASTER  
1
8
9
DATA OUTPUT  
FROM  
TRANSMITTER  
DATA  
OUTPUT  
FROM  
RECEIVER  
START  
ACKNOWLEDGE  
7038 FM 05  
4
X24640  
DEVICE ADDRESSING  
device select input pins. If the compare is not successful,  
no acknowledge is output during the ninth clock cycle  
and the device returns to the standby mode.  
Following a start condition, the master must output the  
address of the slave it is accessing. The first four bits  
of the Slave Address Byte are the device type identifier  
bits. These must equal “1010”. The next 3 bits are the  
The word address is either supplied by the master or  
obtained from an internal counter, depending on the  
operation. The master must supply the two Word  
Address Bytes as shown in figure 4.  
device select bits S , S , and S . This allows up to 8  
0
1
2
devices to share a single bus. These bits are  
compared to the S , S , and S device select input  
0
1
2
2
The internal organization of the E array is 256 pages by  
pins. The last bit of the Slave Address Byte defines the  
operation to be performed. When the R/W bit is a one,  
then a read operation is selected. When it is zero then  
a write operation is selected. Refer to figure 4. After  
loading the Slave Address Byte from the SDA bus, the  
device compares the device type bits with the value  
“1010” and the device select bits with the status of the  
32 bytes per page. The page address is partially  
contained in the Word Address Byte 1 and partially in  
bits 7 through 5 of the Word Address Byte 0. The byte  
address is contained in bits 4 through 0 of the Word  
Address Byte 0. See figure 4.  
Figure 4. Device Addressing  
DEVICE TYPE  
IDENTIFIER  
DEVICE  
SELECT  
1
0
1
0
S
2
S
S
R/W  
1
0
SLAVE ADDRESS BYTE  
HIGH ORDER WORD ADDRESS  
0
0
0
A12 A11 A10 A9  
A8  
X24640WORD ADDRESS BYTE 1  
LOW ORDER WORD ADDRESS  
A7  
A6  
A4 A3  
A2 A1  
A0  
A5  
WORD ADDRESS BYTE 0  
D7 D6 D5  
D4 D3  
D2 D1 D0  
DATA BYTE  
7038 FM 06  
5
X24640  
WRITE OPERATIONS  
Byte Write  
master can transmit up to thirty-one more words. The  
device will respond with an acknowledge after the  
receipt of each word, and then the byte address is  
internally incremented by one. The page address  
remains constant. When the counter reaches the end  
of the page, it “rolls over” and goes back to the first  
byte of the current page. This means that the master  
can write 32 words to the page beginning at any byte.  
If the master begins writing at byte 16, and loads 32  
words, then the first 16 words are written to bytes 16  
through 31, and the last 16 words are written to bytes  
0 through 15. Afterwards, the address counter would  
point to byte 16. If the master writes more than 32  
words, then the previously loaded data is overwritten  
by the new data, one byte at a time.  
For a write operation, the device requires the Slave  
Address Byte, the Word Address Byte 1, and the Word  
Address Byte 0, which gives the master access to any  
one of the words in the array. Upon receipt of the Word  
Address Byte 0, the device responds with an acknowl-  
edge, and waits for the first eight bits of data. After  
receiving the 8 bits of the data byte, the device again  
responds with an acknowledge. The master then  
terminates the transfer by generating a stop condition,  
at which time the device begins the internal write cycle  
to the nonvolatile memory. While the internal write  
cycle is in progress the device inputs are disabled  
and the device will not respond to any requests from  
the master. The SDA pin is at high impedance. See  
figure 5.  
The master terminates the data byte loading by  
issuing a stop condition, which causes the device to  
begin the nonvolatile write cycle. As with the byte write  
operation, all inputs are disabled until completion of  
the internal write cycle. Refer to figure 6 for the  
address, acknowledge, and data transfer sequence.  
Page Write  
The device is capable of a thirty-two byte page write  
operation. It is initiated in the same manner as the byte  
write operation; but instead of terminating the write  
operation after the first data word is transferred, the  
Figure 5. Byte Write Sequence  
S
SIGNALS  
FROMTHE  
MASTER  
S
T
A
R
T
WORDADDRESS WORD ADDRESS  
BYTE 1  
SLAVE  
ADDRESS  
T
O
P
BYTE 0  
DATA  
SDA BUS  
S 1 0 1 0  
0
P
A
C
K
A
C
K
A
C
K
A
C
K
SIGNALS  
FROMTHE  
SLAVE  
7038 FM 07  
Figure 6. Page Write Sequence  
(0n31)  
S
SIGNALS  
FROMTHE  
MASTER  
T
A
R
T
WORD ADDRESS WORDADDRESS  
BYTE 1  
DATA  
(0)  
DATA  
(n)  
SLAVE  
ADDRESS  
S
T
O
P
BYTE 0  
SDA BUS  
1 0 1 0  
S
0
P
A
C
K
A
C
K
A
C
K
A
C
K
A
C
K
SIGNALS  
FROMTHE  
SLAVE  
7038 FM 08  
6
X24640  
READ OPERATIONS  
Acknowledge Polling  
The maximum write cycle time can be significantly  
reduced using Acknowledge Polling. To initiate  
Acknowledge Polling, the master issues a start condi-  
tion followed by the Slave Address Byte for a write or  
read operation. If the device is still busy with the  
internal write cycle, then no ACK will be returned. If the  
device has completed the internal write operation, an  
ACK will be returned and the host can then proceed  
with the read or write operation. Refer to figure 7.  
Read operations are initiated in the same manner as  
write operations with the exception that the R/W bit of  
the Slave Address Byte is set to one. There are three  
basic read operations: Current Address Reads,  
Random Reads, and Sequential Reads.  
Current Address Read  
Internally, the device contains an address counter that  
maintains the address of the last word read or written  
incremented by one. After a read operation from the  
last address in the array, the counter will “roll over” to  
the first address in the array. After a write operation to  
the last address in a given page, the counter will “roll  
over” to the first address on the same page.  
Figure 7. Acknowledge Polling Sequence  
BYTE LOAD COMPLETED  
BY ISSUING STOP.  
ENTER ACK POLLING  
Upon receipt of the Slave Address Byte with the R/W  
bit set to one, the device issues an acknowledge and  
then transmits the eight bits of the Data Byte. The  
master terminates the read operation when it does not  
respond with an acknowledge during the ninth clock  
and then issues a stop condition. Refer to figure 8 for  
the address, acknowledge, and data transfer  
sequence.  
ISSUE  
START  
ISSUE SLAVE  
ADDRESS BYTE  
ISSUE STOP  
(READ OR WRITE)  
It should be noted that the ninth clock cycle of the read  
operation is not a “don’t care.” To terminate a read  
operation, the master must either issue a stop condi-  
tion during the ninth cycle or hold SDA HIGH during  
the ninth clock cycle and then issue a stop condition.  
ACK  
RETURNED?  
NO  
YES  
HIGH  
VOLTAGE  
CYCLE COMPLETE.  
CONTINUE  
Figure 8. Current Address Read Sequence  
NO  
S
SEQUENCE?  
SIGNALS  
FROM THE  
MASTER  
T
A
R
T
S
T
O
P
SLAVE  
ADDRESS  
YES  
SDA BUS  
S 1 0 1 0  
1
P
CONTINUE NORMAL  
READ OR WRITE  
COMMAND SEQUENCE  
A
C
K
ISSUE STOP  
SIGNALS  
FROM THE  
SLAVE  
DATA  
7038 FM 10  
PROCEED  
7038 FM 09  
7
X24640  
Random Read  
The next Current Address Read operation will read  
from the newly loaded address.  
Random read operation allows the master to access  
any memory location in the array. Prior to issuing the  
Slave Address Byte with the R/W bit set to one, the  
master must first perform a “Dummy” write operation.  
The master issues the start condition and the Slave  
Address Byte with the R/W bit low, receives an  
acknowledge, then issues the Word Address Byte 1,  
receives another acknowledge, then issues the Word  
Address Byte 0. After the device acknowledges receipt  
of the Word Address Byte 0, the master issues another  
start condition and the Slave Address Byte with the  
R/W bit set to one. This is followed by an acknowledge  
and then eight bits of data from the device. The master  
terminates the read operation by not responding with  
an acknowledge and then issuing a stop condition.  
Refer to figure 9 for the address, acknowledge, and  
data transfer sequence.  
Sequential Read  
Sequential reads can be initiated as either a current  
address read or random read. The first Data Byte is  
transmitted as with the other modes; however, the  
master now responds with an acknowledge, indicating  
it requires additional data. The device continues to  
output data for each acknowledge received. The  
master terminates the read operation by not  
responding with an acknowledge and then issuing a  
stop condition.  
The data output is sequential, with the data from address  
n followed by the data from address n + 1. The address  
counter for read operations increments through all byte  
addresses, allowing the entire memory contents to be  
read during one operation. At the end of the address  
space the counter “rolls over” to address 0000h and the  
device continues to output data for each acknowledge  
received. Refer to figure 10 for the acknowledge and  
data transfer sequence.  
The device will perform a similar operation called “Set  
Current Address” if a stop is issued instead of the  
second start shown in figure 9. The device will go into  
standby mode after the stop and all bus activity will be  
ignored until a start is detected. The effect of this oper-  
ation is that the new address is loaded into the  
address counter, but no data is output by the device.  
Figure 9. Random Read Sequence  
S
S
SIGNALS  
FROMTHE  
MASTER  
T
A
R
T
A
R
WORDADDRESS WORD ADDRESS  
SLAVE  
ADDRESS  
S
T
O
P
SLAVE  
ADDRESS  
BYTE 1  
BYTE 0  
T
T
1
SDA BUS  
S 1 0 1 0  
0
S
P
A
C
K
A
C
K
A
C
K
A
C
K
SIGNALS  
FROMTHE  
SLAVE  
DATA  
7038 FM 11  
Figure 10. Sequential Read Sequence  
SIGNALS  
FROM THE  
MASTER  
A
C
K
A
C
K
A
C
K
S
T
O
P
SLAVE  
ADDRESS  
SDA BUS  
1
P
A
C
K
SIGNALS  
FROM THE  
SLAVE  
DATA  
(1)  
DATA  
(2)  
DATA  
(n–1)  
DATA  
(n)  
(n is any integer greater than 1)  
7038 FM 12  
8
X24640  
WRITE PROTECT REGISTER (WPR)  
Writing to the Write Protect Register  
WPEN: Write Protect Enable Bit (Nonvolatile)  
The Write Protect (WP) pin and the Write Protect  
Enable (WPEN) bit in the Write Protect Register  
control the Programmable Hardware Write Protection  
feature. Hardware Write Protection is enabled when  
the WP pin is HIGH and the WPEN bit is HIGH, and  
disabled when either the WP pin is LOW or the WPEN  
bit is LOW. Figure 12 defines the write protect status  
for each combination of WPEN and WP. When the  
chip is Hardware Write Protected, nonvolatile writes  
are disabled to the Write Protect Register, including  
the Block Lock Protect bits and the WPEN bit itself, as  
well as to the Block Lock protected sections in the  
memory array. Only the sections of the memory array  
that are not Block Lock protected, and the volatile bits  
WEL and RWEL, can be written.  
The Write Protect Register can only be modified by  
performing a “Byte Write” operation directly to the  
address FFFFh as described below.  
The Data Byte must contain zeroes where indicated in  
the procedural descriptions below; otherwise the oper-  
ation will not be performed. Only one Data Byte is  
allowed for each register write operation. The part will  
not acknowledge any data bytes after the first byte is  
entered. The user then has to issue a stop to initiate  
the nonvolatile write cycle that writes BL0, BL1, and  
WPEN to the nonvolatile bits. A stop must also be  
issued after volatile register write operations to put the  
device into Standby.  
In Circuit Programmable ROM Mode  
The state of the Write Protect Register can be read by  
performing a random byte read at FFFFh at any time.  
The part will reset itself after the first byte is read. The  
master should supply a stop condition to be consistent  
with the protocol, but a stop is not required to end this  
operation. After the read, the address counter contains  
0000h.  
Note that when the WPEN bit is write protected, it  
cannot be changed back to a LOW state; so write  
protection is enabled as long as the WP pin is held  
HIGH. Thus an In Circuit Programmable ROM function  
can be implemented by hardwiring the WP pin to V  
,
CC  
writing to and Block Locking the desired portion of the  
array to be ROM, and then programming the WPEN bit  
HIGH.  
Write Protect Register: WPR (ADDR = FFFF )  
h
7
6
5
4
3
2
1
0
Unused Bit Positions  
Bits 0, 5 & 6 are not used. All writes to the WPR must  
have zeros in these bit positions. The data byte output  
during a WPR read will contain zeros in these bits.  
WPEN  
0
0
BL1 BL0 RWEL WEL  
0
WEL: Write Enable Latch (Volatile)  
Writing to the WEL and RWEL bits  
0 = Write Enable Latch reset, writes disabled.  
WEL and RWEL are volatile latches that power up in  
the LOW (disabled) state. While the WEL bit is LOW,  
writes to any address other than FFFFh will be ignored  
(no acknowledge will be issued after the Data Byte).  
The WEL bit is set by writing 00000010 to address  
FFFFh. Once set, WEL remains HIGH until either it is  
reset to 0 (by writing 00000000 to FFFFh) or until the  
part powers up again. Writes to WEL and RWEL do  
not cause a nonvolatile write cycle, so the device is  
ready for the next operation immediately after the stop  
condition.  
1 = Write Enable Latch set, writes enabled.  
RWEL: Register Write Enable Latch (Volatile)  
0 = Register Write Enable Latch reset, writes to the  
Write Protect Register disabled.  
1 = Register Write Enable Latch set, writes to the Write  
Protect Register enabled.  
BL0, BL1: Block Lock Protect Bits (Nonvolatile)  
The Block Lock Protect Bits, BL0 and BL1, determine  
which blocks of the array are protected. A write to a  
protected block of memory is ignored, but will receive  
an acknowledge. The master must issue a stop to put  
the part into standby, just as it would for a valid write;  
but the stop will not initiate an internal nonvolatile write  
cycle. See figure 11.  
The RWEL bit controls writes to the Block Lock Protect  
bits, BL0 and BL1, and the WPEN bit. If RWEL is 0  
then no writes can be performed on BL0, BL1, or  
WPEN. RWEL is reset when the device powers up or  
after any nonvolatile write, including writes to the Block  
Lock Protect bits, WPEN bit, or any bytes in the  
memory array. When RWEL is set, WEL cannot be  
9
X24640  
reset, nor can RWEL and WEL be reset in one write  
operation. RWEL can be reset by writing 00000010 to  
FFFFh; but this is the same operation as in step 3  
described below, and will result in programing BL0,  
BL1, and WPEN.  
step 2. RWEL is reset to zero in step 3 so that user is  
required to perform steps 2 and 3 to make another  
change. RWEL must be 0 in step 3. If the RWEL bit in  
the data byte for step 3 is a one, then no changes are  
made to the Write Protect Register and the device  
remains at step 2.  
Writing to the BL and WPEN Bits  
The WP pin must be LOW or the WPEN bit must be  
LOW before a nonvolatile register write operation is  
initiated. Otherwise, the write operation will abort and  
the device will go into standby mode after the master  
issues the stop condition in step 3.  
A 3 step sequence is required to change the nonvola-  
tile Block Lock Protect or Write Protect Enable bits:  
1) Set WEL=1, Write 00000010 to address FFFFh  
(Volatile Write Cycle.)  
2) Set RWEL=1, Write 00000110 to address FFFFh  
(Volatile Write Cycle.)  
Step 3 is a nonvolatile write operation, requiring t  
to  
WC  
complete (acknowledge polling may be used to reduce  
this time requirement). It should be noted that step 3  
MUST end with a stop condition. If a start condition is  
issued during or at the end of step 3 (instead of a stop  
condition) the device will abort the nonvolatile register  
write and remain at step 2. If the operation is aborted  
with a start condition, the master must issue a stop to  
put the device into standby mode.  
3) Set BL1, BL0, and/or WPEN bits, Write u00xy010 to  
address FFFFh, where u=WPEN, x=BL1, and y=BL0.  
(Nonvolatile Write Cycle.)  
The three step sequence was created to make it diffi-  
cult to change the contents of the Write Protect  
Register accidentally. If WEL was set to one by a  
previous register write operation, the user may start at  
Figure 11. Block Lock Protect Bits and Protected Addresses  
BL1  
BL0  
Protected Addresses  
None  
Array Location  
0
0
1
1
0
1
0
1
No Protect  
Upper 1/4  
Upper 1/2  
Full Array  
1800h - 1FFFh  
1000h - 1FFFh  
0000h - 1FFFh  
7038 FRM T02  
Figure 12. WP Pin and WPEN Bit Functionality  
Memory Array Not  
Memory Array Block  
Lock Protected  
WPEN  
Bit  
WP  
WPEN  
Block Lock Bits  
Lock Block Protected  
0
X
1
X
0
1
Writable  
Writable  
Writable  
Protected  
Protected  
Protected  
Unprotected  
Unprotected  
Protected  
Unprotected  
Unprotected  
Protected  
7038 FRM T03  
10  
X24640  
ABSOLUTE MAXIMUM RATINGS*  
*COMMENT  
Temperature under Bias  
Stresses above those listed under “Absolute Maximum  
Ratings” may cause permanent damage to the device.  
This is a stress rating only and the functional operation  
of the device at these or any other conditions above  
those indicated in the operational sections of this  
specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may  
affect device reliability.  
X24640.......................................–65°C to +135°C  
Storage Temperature........................–65°C to +150°C  
Voltage on any Pin with  
Respect to V ....................................1V to +7V  
SS  
D.C. Output Current ..............................................5mA  
Lead Temperature  
(Soldering, 10 seconds) ..............................300°C  
RECOMMENDED OPERATING CONDITIONS  
Supply Voltage  
X24640  
Limits  
Temperature  
Commercial  
Industrial  
Min.  
0°C  
Max.  
+70°C  
+85°C  
4.5V to 5.5V  
2.5V to 5.5V  
1.8V to 3.6V  
X24640–2.5  
X24640–1.8  
–40°C  
7038 FRM T04  
7038 FRM T05  
D.C. OPERATING CHARACTERISTICS  
Limits  
Symbol  
Parameter  
Min.  
Max.  
Units  
Test Conditions  
ICC1  
VCC Supply Current (Read)  
1
3
mA SCL = VCC X 0.1/VCC X 0.9 Levels  
@ 400KHz, SDA = Open, All Other  
ICC2  
VCC Supply Current (Write)  
VCC Standby Current  
mA  
Inputs = V or VCC – 0.3V  
SS  
(1)  
5
µA  
µA  
SCL = SDA = VCC, All Other  
ISB1  
Inputs = V or VCC – 0.3V,  
SS  
VCC = 5V ± 10%  
(1)  
VCC Standby Current  
1
SCL = SDA = VCC, All Other  
ISB2  
Inputs = V or VCC – 0.3V,  
SS  
VCC = 2.5V  
ILI  
Input Leakage Current  
Output Leakage Current  
Input LOW Voltage  
10  
10  
µA  
µA  
V
V
IN = V to VCC  
SS  
ILO  
VOUT = V to VCC  
SS  
(2)  
–0.5  
VCC x 0.3  
VCC + 0.5  
0.4  
VlL  
(2)  
Input HIGH Voltage  
Output LOW Voltage  
VCC x 0.7  
V
VIH  
VOL  
V
V
IOL = 3mA  
(3)  
Hysteresis of Schmitt  
Trigger Inputs  
VCC x 0.05  
Vhys  
7038 FRM T06  
CAPACITANCE T = +25°C, f = 1MHz, V = 5V  
A
CC  
Symbol  
Parameter  
Max.  
Units  
Test Conditions  
(3)  
Input/Output Capacitance (SDA)  
8
pF  
VI/O = 0V  
CI/O  
(3)  
Input Capacitance (S0, S1, S2, SCL, WP)  
6
pF  
VIN = 0V  
CIN  
7038 FRM T07  
Notes: (1) Must perform a stop command prior to measurement.  
(2) V min. and V max. are for reference only and are not 100% tested.  
IL  
IH  
(3) This parameter is periodically sampled and not 100% tested.  
11  
X24640  
EQUIVALENT A.C. LOAD CIRCUIT  
A.C. CONDITIONS OF TEST  
Input Pulse Levels  
VCC x 0.1 to VCC x 0.9  
5V  
Input Rise and  
Fall Times  
10ns  
1.53KΩ  
Input and Output  
Timing Levels  
OUTPUT  
VCC X 0.5  
7038 FRM T08  
100pF  
7038 FM 13  
A.C. OPERATING CHARACTERISTICS (Over the recommended operating conditions, unless otherwise specified.)  
Read & Write Cycle Limits  
Symbol  
Parameter  
SCL Clock Frequency  
Min.  
Max.  
Units  
fSCL  
0
400  
KHz  
tI  
Noise Suppression Time  
50  
ns  
Constant at SCL, SDA Inputs  
tAA  
SCL LOW to SDA Data Out Valid  
0.1  
1.2  
0.9  
µs  
µs  
tBUF  
Time the Bus Must Be Free Before a  
New Transmission Can Start  
tHD:STA  
tLOW  
Start Condition Hold Time  
Clock LOW Period  
0.6  
1.2  
0.6  
0.6  
µs  
µs  
µs  
µs  
tHIGH  
Clock HIGH Period  
tSU:STA  
Start Condition Setup Time  
(for a Repeated Start Condition)  
tHD:DAT  
tSU:DAT  
tR  
Data In Hold Time  
0
µs  
ns  
ns  
ns  
µs  
ns  
Data In Setup Time  
100  
SDA and SCL Rise Time  
SDA and SCL Fall Time  
Stop Condition Setup Time  
Data Out Hold Time  
Output Fall Time  
300  
300  
tF  
tSU:STO  
tDH  
0.6  
50  
300  
(5)  
tOF  
20+0.1Cb  
7038 FRM T09  
(4)  
POWER-UP TIMING  
Symbol  
Parameter  
Max.  
Units  
tPUR  
Power-up to Read Operation  
1
5
ms  
tPUW  
Power-up to Write Operation  
ms  
7038 FRM T10  
Notes: (4) t  
and t  
are the delays required from the time V is stable until the specified operation can be initiated.These parameters  
PUW CC  
PUR  
are periodically sampled and not 100% tested.  
12  
X24640  
Bus Timing  
t
t
t
t
HIGH  
LOW  
R
F
SCL  
t
t
t
t
t
SU:STA  
HD:STA  
HD:DAT  
SU:DAT  
SU:STO  
SDAIN  
t
t
t
AA  
DH  
BUF  
SDAOUT  
7038 FM 14  
Write Cycle Limits  
Symbol  
(5)  
Parameter  
Min.  
Typ.  
Max.  
Units  
ms  
(6)  
tWC  
Write Cycle Time  
5
10  
7038 FRM T11  
Notes: (5) Typical values are for T = 25°C and nominal supply voltage (5V).  
A
(6) t  
is the minimum cycle time to be allowed from the system perspective unless polling techniques are used. It is the maximum  
WR  
time the device requires to automatically complete the internal write operation.  
The write cycle time is the time from a valid stop condition of a write sequence to the end of the internal erase/  
program cycle. During the write cycle, the X24640 bus interface circuits are disabled, SDA is allowed to remain  
HIGH, and the device does not respond to its slave address.  
Bus Timing  
SCL  
ACK  
SDA  
8th BIT  
WORD n  
t
WC  
STOP  
CONDITION  
START  
CONDITION  
7038 FM 15  
Guidelines for Calculating Typical Values of  
Bus Pull-Up Resistors  
SYMBOL TABLE  
WAVEFORM  
INPUTS  
OUTPUTS  
120  
V
Must be  
steady  
Will be  
steady  
CC MAX  
R
=
=1.8KΩ  
MIN  
I
100  
80  
OL MIN  
t
R
May change  
from Low to  
High  
Will change  
from Low to  
High  
R
=
MAX  
C
BUS  
MAX.  
60  
40  
20  
0
RESISTANCE  
May change  
from High to  
Low  
Will change  
from High to  
Low  
MIN.  
Don’t Care:  
Changes  
Allowed  
Changing:  
State Not  
Known  
RESISTANCE  
20 40 60 80  
0
100 120  
N/A  
Center Line  
is High  
Impedance  
BUS CAPACITANCE (pF)  
7038 FM 16  
7038 FM 17  
13  
X24640  
PACKAGING INFORMATION  
8-LEAD PLASTIC SMALL OUTLINE GULL WING PACKAGE TYPE S  
0.150 (3.80)  
0.158 (4.00)  
0.228 (5.80)  
0.244 (6.20)  
PIN 1 INDEX  
PIN 1  
0.014 (0.35)  
0.019 (0.49)  
0.188 (4.78)  
0.197 (5.00)  
(4X) 7°  
0.053 (1.35)  
0.069 (1.75)  
0.004 (0.19)  
0.010 (0.25)  
0.050 (1.27)  
0.010 (0.25)  
0.020 (0.50)  
0.050" TYPICAL  
X 45°  
0.050"  
TYPICAL  
0° – 8°  
0.0075 (0.19)  
0.010 (0.25)  
0.250"  
0.016 (0.410)  
0.037 (0.937)  
0.030"  
TYPICAL  
8 PLACES  
FOOTPRINT  
NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)  
7038 FM 19  
14  
X24640  
PACKAGING INFORMATION  
20-LEAD PLASTIC, TSSOP PACKAGE TYPE V  
.025 (.65) BSC  
.169 (4.3)  
.177 (4.5)  
.252 (6.4) BSC  
.252 (6.4)  
.260 (6.6)  
.047 (1.20)  
.0075 (.19)  
.0118 (.30)  
.002 (.05)  
.006 (.15)  
.010 (.25)  
Gage Plane  
0° – 8°  
Seating Plane  
.019 (.50)  
.029 (.75)  
DetailA (20X)  
.031 (.80)  
.041 (1.05)  
See Detail “A”  
NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)  
15  
X24640  
PACKAGING INFORMATION  
8-LEAD PLASTIC DUAL IN-LINE PACKAGETYPE P  
0.430 (10.92)  
0.360 (9.14)  
0.260 (6.60)  
0.240 (6.10)  
PIN 1 INDEX  
PIN 1  
0.060 (1.52)  
0.300  
(7.62) REF.  
0.020 (0.51)  
HALF SHOULDER WIDTH ON  
ALL END PINS OPTIONAL  
0.145 (3.68)  
0.128 (3.25)  
SEATING  
PLANE  
0.025 (0.64)  
0.015 (0.38)  
0.150 (3.81)  
0.125 (3.18)  
0.065 (1.65)  
0.045 (1.14)  
0.110 (2.79)  
0.090 (2.29)  
0.020 (0.51)  
0.016 (0.41)  
0.325 (8.25)  
0.300 (7.62)  
0.015 (0.38)  
MAX.  
0°  
TYP 0.010 (0.25)  
.
15°  
NOTE:  
1. ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)  
2. PACKAGE DIMENSIONS EXCLUDE MOLDING FLASH  
7040 FM 18  
16  
X24640  
ORDERING INFORMATION  
X24640  
X
X
-X  
V
Range  
CC  
Device  
Blank = 5V ±10%  
2.5 = 2.5V to 5.5V  
1.8 = 1.8V to 3.6V  
Temperature Range  
Blank = 0°C to +70°C  
I = –40°C to +85°C  
Package  
X24640  
S8 = 8-Lead SOIC  
V20 = 20-Lead TSSOP  
P = 8-Lead PDIP  
Part Mark Convention  
X24640  
X
X
Blank = 8-Lead SOIC  
V = 20-Lead TSSOP  
P = 8-Lead PDIP  
Blank = 4.5V to 5.5V, 0°C to +70°C  
I = 4.5V to 5.5V, –40°C to +85°C  
AE = 2.5V to 5.5V, 0°C to +70°C  
AF = 2.5V to 5.5V, –40°C to +85°C  
AG = 1.8V to 3.6V, 0°C to +70°C  
AH = 1.8V to 3.6V, –40°C to +85°C  
LIMITED WARRANTY  
Devices sold by Xicor, Inc. are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. Xicor, Inc.  
makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the  
described devices from patent infringement. Xicor, Inc. makes no warranty of merchantability or fitness for any purpose. Xicor, Inc. reserves the  
right to discontinue production and change specifications and prices at any time and without notice.  
Xicor, Inc. assumes no responsibility for the use of any circuitry other than circuitry embodied in a Xicor, Inc. product. No other circuits, patents,  
licenses are implied.  
U.S. PATENTS  
Xicor products are covered by one or more of the following U.S. Patents: 4,263,664; 4,274,012; 4,300,212; 4,314,265; 4,326,134; 4,393,481;  
4,404,475; 4,450,402; 4,486,769; 4,488,060; 4,520,461; 4,533,846; 4,599,706; 4,617,652; 4,668,932; 4,752,912; 4,829, 482; 4,874, 967;  
4,883, 976. Foreign patents and additional patents pending.  
LIFE RELATED POLICY  
In situations where semiconductor component failure may endanger life, system designers using this product should design the system with  
appropriate error detection and correction, redundancy and back-up features to prevent such an occurence.  
Xicor's products are not authorized for use in critical components in life support devices or systems.  
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain  
life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably  
expected to result in a significant injury to the user.  
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or system, or to affect its safety or effectiveness.  
17  

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