XC1718LPC20I [XILINX]
Configuration Memory, 18144X1, Serial, CMOS, PQCC20, PLASTIC, LCC-20;
| 型号： | XC1718LPC20I |
| 厂家： | 
XILINX, INC |
| 描述： | Configuration Memory, 18144X1, Serial, CMOS, PQCC20, PLASTIC, LCC-20 OTP只读存储器 时钟 内存集成电路 |
| 文件： | 总11页 (文件大小：78K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
0
XC1700D Family of
Serial Configuration PROMs
0
5*
November 25, 1997 (Version 1.1)
Product Specification
Features
Description
•
Extended family of one-time programmable (OTP)
bit-serial read-only memories used for storing the
configuration bitstreams of Xilinx FPGAs
The XC1700 family of serial configuration PROMs (SCPs)
provides an easy-to-use, cost-effective method for storing
Xilinx FPGA configuration bitstreams.
•
•
On-chip address counter, incremented by each rising
edge on the clock input
Simple interface to the FPGA requires only one user
I/O pin
Cascadable for storing longer or multiple bitstreams
Programmable reset polarity (active High or active Low)
for compatibility with different FPGA solutions
XC17128D or XC17256D supports XC4000 fast
configuration mode (12.5 MHz)
When the FPGA is in master serial mode, it generates a
configuration clock that drives the SCP. A short access time
after the rising clock edge, data appears on the SCP DATA
output pin that is connected to the FPGA DIN pin. The
FPGA generates the appropriate number of clock pulses to
complete the configuration. Once configured, it disables the
SCP. When the FPGA is in slave mode, the SCP and the
FPGA must both be clocked by an incoming signal.
•
•
•
Multiple devices can be concatenated by using the CEO
output to drive the CE input of the following device. The
clock inputs and the DATA outputs of all SCPs in this chain
are interconnected. All devices are compatible and can be
cascaded with other members of the family.
•
•
•
Low-power CMOS EPROM process
Available in 5 V and 3.3 V versions
Available in plastic and ceramic packages, and
commercial, industrial and military temperature ranges
Space efficient 8-pin DIP, 8-pin SOIC, 8-pin VOIC, or
20-pin surface-mount packages.
Programming support by leading programmer
manufacturers.
•
•
For device programming, the XACT development system
compiles the FPGA design file into a standard Hex format,
which is then transferred to the programmer.
V
V
PP
GND
CC
CEO
CE
RESET/
OE or
OE/
RESET
Address Counter
CLK
TC
OE
EPROM
Cell
Output
DATA
Matrix
X3185
Figure 1: Simplified Block Diagram (does not show programming circuit)
November 25, 1997 (Version 1.1)
5-11
XC1700D Family of Serial Configuration PROMs
Serial PROM Pinouts
Pin Description
Pin Name
8-Pin
20-Pin
DATA
DATA
1
2
3
4
5
6
7
8
2
4
Data output, 3-stated when either CE or OE are inactive.
During programming, the DATA pin is I/O. Note that OE can
be programmed to be either active High or active Low.
CLK
RESET/OE (OE/RESET)
6
CE
8
GND
CEO
10
14
17
20
CLK
Each rising edge on the CLK input increments the internal
address counter, if both CE and OE are active.
V
V
PP
CC
RESET/OE
Capacity
When High, this input holds the address counter reset and
3-states the DATA output. The polarity of this input pin is
programmable as either RESET/OE or OE/RESET. To
avoid confusion, this document describes the pin as
RESET/OE, although the opposite polarity is possible on all
devices. When RESET is active, the address counter is
held at zero, and the DATA output is 3-stated. The polarity
of this input is programmable. The default is active High
RESET, but the preferred option is active Low RESET,
because it can be driven by the FPGA’s INIT pin.
Device
Configuration Bits
18,144
XC1718D or L
XC1736D
36,288
XC1765D or L
65,536
XC17128D or L
XC17256D or L
131,072
262,144
XC17512L
524,288
XC1701 or L
1,048,576
The polarity of this pin is controlled in the programmer inter-
face. This input pin is easily inverted using the Xilinx HW-
130 programmer software. Third-party programmers have
different methods to invert this pin.
CE
When High, this pin disables the internal address counter,
3-states the DATA output, and forces the device into low-ICC
standby mode.
CEO
Chip Enable output, to be connected to the CE input of the
next SCP in the daisy chain. This output is Low when the
CE and OE inputs are both active AND the internal address
counter has been incremented beyond its Terminal Count
(TC) value. In other words: when the PROM has been read,
CEO will follow CE as long as OE is active. When OE goes
inactive, CEO stays High until the PROM is reset. Note that
OE can be programmed to be either active High or active
Low.
V
PP
Programming voltage. No overshoot above the specified
max voltage is permitted on this pin. For normal read oper-
ation, this pin must be connected to VCC. Failure to do so
may lead to unpredictable, temperature-dependent opera-
tion and severe problems in circuit debugging. Do not leave
VPP floating!
V
and GND
CC
VCC is positive supply pin and GND is ground pin.
5-12
November 25, 1997 (Version 1.1)
in step with the FPGA’s internal power-on-reset, which
may not be a safe assumption.
Number of Configuration Bits, Including Header
for all Xilinx FPGAs and Compatible SCP Type
•
The CE input of the lead (or only) Serial PROM is driven
by the DONE/PRGM or DONE output of the lead FPGA
device, provided that DONE/PRGM is not permanently
grounded. Otherwise, LDC can be used to drive CE, but
must then be unconditionally High during user
operation. CE can also be permanently tied Low, but
this keeps the DATA output active and causes an
unnecessary supply current of 10 mA maximum.
Device
XC3x20A/L
Configuration Bits
14,819
SCP
XC1718D
XC1736D
XC1736D
XC1765D
XC1765D
XC17128D
XC1765D
XC17128D/L
XC17128D
XC17256D
XC17256D/L
XC17256D/L
XC1701
XC3x30A/L
XC3x42A/L
XC3x64A/L
XC3x90A/L
XC3195A
22,216
30,824
46,104
64,200
94,984
XC4003E
53,984
FPGA Master Serial Mode Summary
XC4005E
95,008
XC4006E
119,840
147,552
178,144
247,968
329,312
422,176
151,960
283,424
393,623
521,880
668,184
832,528
1,014,928
1,215,368
The I/O and logic functions of the Logic Cell Array and their
associated interconnections are established by a configu-
ration program. The program is loaded either automatically
upon power up, or on command, depending on the state of
the three FPGA mode pins. In Master Mode, the FPGA
automatically loads the configuration program from an
external memory. The Serial Configuration PROM has
been designed for compatibility with the Master Serial
Mode.
XC4008E
XC4010E
XC4013E
XC4020E
XC4025E
XC1701
XC4005XL
XC4010XL
XC4013XL
XC4020XL
XC4028EX/XL
XC4036EX/XL
XC4044XL
XC4052XL
XC17256L
XC17512L
XC17512L
XC17512L
XC1701L
XC1701L
XC1701L
Upon power-up or reconfiguration, an FPGA enters the
Master Serial Mode whenever all three of the FPGA mode-
select pins are Low (M0=0, M1=0, M2=0). Data is read from
the Serial Configuration PROM sequentially on a single
data line. Synchronization is provided by the rising edge of
the temporary signal CCLK, which is generated during con-
figuration.
XC1701L +
XC17256L
XC4062XL
1,433,864
XC1701L +
XC17512L
Master Serial Mode provides a simple configuration inter-
face. Only a serial data line and two control lines are
required to configure an FPGA. Data from the Serial Con-
figuration PROM is read sequentially, accessed via the
internal address and bit counters which are incremented on
every valid rising edge of CCLK.
XC4085XL
XC5202
XC5204
XC5206
XC5210
XC5215
1,924,992
42,416
2 XC1701L
XC1765D
70,704
XC17128D
XC17128D
XC17256D
XC17256D
106,288
165,488
237,744
If the user-programmable, dual-function DIN pin on the
FPGA is used only for configuration, it must still be held at
a defined level during normal operation. The XC3000 and
XC4000 families take care of this automatically with an on-
chip default pull-up resistor. With XC2000-family devices,
the user must either configure DIN as an active output, or
provide a defined level, e.g., by using an external pull-up
resistor, if DIN is configured as an input.
Controlling Serial PROMs
Most connections between the FPGA device and the Serial
PROM are simple and self-explanatory.
•
•
•
•
The DATA output(s) of the of the Serial PROM(s) drives
the DIN input of the lead FPGA device.
The master FPGA CCLK output drives the CLK input(s)
of the Serial PROM(s).
The CEO output of a Serial PROM drives the CE input
of the next Serial PROM in a daisy chain (if any).
The RESET/OE input of all Serial PROMs is best driven
by the INIT output of the XC3000 or XC4000 lead
FPGA device. This connection assures that the Serial
PROM address counter is reset before the start of any
(re)configuration, even when a reconfiguration is
initiated by a VCC glitch. Other methods – such as
Programming the FPGA With Counters
Unchanged Upon Completion
When multiple FPGA-configurations for a single FPGA are
stored in a Serial Configuration PROM, the OE pin should
be tied Low. Upon power-up, the internal address counters
are reset and configuration begins with the first program
stored in memory. Since the OE pin is held Low, the
address counters are left unchanged after configuration is
complete. Therefore, to reprogram the FPGA with another
program, the D/P line is pulled Low and configuration
begins at the last value of the address counters.
driving RESET/OE from LDC or system reset – assume
that the Serial PROM internal power-on-reset is always
November 25, 1997 (Version 1.1)
5-13
XC1700D Family of Serial Configuration PROMs
This method fails if a user applies RESET during the FPGA
configuration process. The FPGA aborts the configuration
and then restarts a new configuration, as intended, but the
Serial PROM does not reset its address counter, since it
never saw a High level on its OE input. The new configura-
tion, therefore, reads the remaining data in the PROM and
interprets it as preamble, length count etc. Since the FPGA
is the master, it issues the necessary number of CCLK
pulses, up to 16 million (224) and D/P goes High. However,
the FPGA configuration will be completely wrong, with
potential contentions inside the FPGA and on its output
pins. This method must, therefore, never be used when
there is any chance of external reset during configuration.
caded SCPs provide additional memory. After the last bit
from the first SCP is read, the next clock signal to the SCP
asserts its CEO output Low and disables its DATA line. The
second SCP recognizes the Low level on its CE input and
enables its DATA output. See Figure 2.
After configuration is complete, the address counters of all
cascaded SCPs are reset if the FPGA RESET pin goes
Low, assuming the SCP reset polarity option has been
inverted.
To reprogram the FPGA with another program, the D/P line
goes Low and configuration begins where the address
counters had stopped. In this case, avoid contention
between DATA and the configured I/O use of DIN.
Cascading Serial Configuration PROMs
For multiple FPGAs configured as a daisy-chain, or for
future FPGAs requiring larger configuration memories, cas-
5-14
November 25, 1997 (Version 1.1)
* If Readback is
Activated, a
5-kΩ Resistor is
Required in
+5 V
*
M0 M1 PWRDWN
Series With M1
During Configuration
the 5 kΩ M2 Pull-Down
Resistor Overcomes the
Internal Pull-Up,
DOUT
OPTIONAL
Daisy-chained
FPGAs with
Different
M2
HDC
LDC
INIT
but it Allows M2 to
be User I/O.
Configurations
General-
Purpose
User I/O
Pins
•
•
•
•
•
Other
I/O Pins
OPTIONAL
XC3000
FPGA
Device
Slave FPGAs
with Identical
Configurations
+5 V
RESET
RESET
V
V
PP
CC
DATA
DATA
CLK
DIN
CCLK
D/P
Cascaded
Serial
Memory
CLK
SCP
CEO
CE
CE
INIT
OE/RESET
OE/RESET
(Low Resets the Address Pointer)
CCLK
(OUTPUT)
DIN
DOUT
(OUTPUT)
X5090
Figure 2: Master Serial Mode. The one-time-programmable Serial Configuration PROM supports automatic loading of
configuration programs. Multiple devices can be cascaded to support additional FPGA. An early D/P inhibits the
PROM data output one CCLK cycle before the FPGA I/Os become active.
November 25, 1997 (Version 1.1)
5-15
XC1700D Family of Serial Configuration PROMs
Standby Mode
The PROM enters a low-power standby mode whenever
CE is asserted High. The output remains in a high imped-
ance state regardless of the state of the OE input.
Programming the XC1700 Family
Serial PROMs
The devices can be programmed on programmers supplied
by Xilinx or qualified third-party vendors. The user must
ensure that the appropriate programming algorithm and the
latest version of the programmer software are used. The
wrong choice can permanently damage the device.
Table 1: Truth Table for XC1700 Control Inputs
Control Inputs
Outputs
Internal Address
RESET
Inactive
CE
Low
DATA
active
3-state
3-state
3-state
3-state
CEO
High
Low
High
High
High
Icc
active
reduced
active
if address < TC: increment
if address > TC: don’t change
Held reset
Active
Inactive
Active
Low
High
High
Not changing
standby
standby
Held reset
Notes: 1. The XC1700 RESET input has programmable polarity
2. TC = Terminal Count = highest address value. TC+1 = address 0.
5-16
November 25, 1997 (Version 1.1)
XC1718D, XC1736D, XC1765D, XC17128D and XC17256D
Absolute Maximum Ratings
Symbol
Description
Supply voltage relative to GND
Units
V
VCC
VPP
VIN
-0.5 to +7.0
-0.5 to +12.5
-0.5 to VCC +0.5
-0.5 to VCC +0.5
-65 to +150
+260
Supply voltage relative to GND
V
Input voltage relative to GND
V
VTS
Voltage applied to 3-state output
Storage temperature (ambient)
V
TSTG
TSOL
°C
°C
Maximum soldering temperature (10 s @ 1/16 in.)
Note:
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those listed under
Operating Conditions is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time may
affect device reliability.
Operating Conditions
Symbol
Description
Commercial
Industrial
Min
4.75
4.50
4.50
Max
5.25
5.50
5.50
Units
VCC
Supply voltage relative to GND 0°C to +70°C junction
Supply voltage relative to GND -40°C to +85°C junction
Supply voltage relative to GND -55°C to +125°C case
V
V
V
Military
DC Characteristics Over Operating Condition
Symbol
VIH
Description
Min
Max
Units
V
High-level input voltage
Low-level input voltage
2.0
0
VCC
0.8
VIL
V
VOH
VOL
VOH
VOL
VOH
VOL
ICCA
ICCS
High-level output voltage (IOH = -4 mA)
Low-level output voltage (IOL = +4 mA)
High-level output voltage (IOH = -4 mA)
Low-level output voltage (IOL = +4 mA)
High-level output voltage (IOH = -4 mA)
Low-level output voltage (IOL = +4 mA)
Supply current, active mode
Commercial
Industrial
Military
3.86
V
0.32
0.37
V
3.76
3.7
V
V
V
0.4
10.0
50.0
1.5
V
mA
µA
mA
µA
Supply current, standby mode, XC17128D, XC17256D
Supply current, standby mode, XC1718D, XC1736D, XC1765D
Input or output leakage current
IL
-10.0
10.0
Note: During normal read operation V must be connected to V
PP
CC
November 25, 1997 (Version 1.1)
5-17
XC1700D Family of Serial Configuration PROMs
XC1718L, XC1765L, XC17128L and XC17256L
Absolute Maximum Ratings
Symbol
Description
Supply voltage relative to GND
Units
V
VCC
VPP
VIN
-0.5 to +6.0
-0.5 to +12.5
-0.5 to VCC +0.5
-0.5 to VCC +0.5
-65 to +150
+260
Supply voltage relative to GND
V
Input voltage with respect to GND
Voltage applied to 3-state output
Storage temperature (ambient)
V
VTS
V
TSTG
TSOL
°C
°C
Maximum soldering temperature (10 s @ 1/16 in.)
Note: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating
Conditions is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time may affect device
reliability.
Operating Conditions
Symbol
Description
Min
Max
Units
VCC
Commercial
Supply voltage relative to GND 0°C to +70°C junction
3.0
3.6
V
DC Characteristics Over Operating Condition
Symbol
VIH
Description
Min
Max
Units
V
High-level input voltage
Low-level input voltage
2.0
0
VCC
0.8
VIL
V
VOH
VOL
ICCA
ICCS
High-level output voltage (IOH = -4 mA)
Low-level output voltage (IOL = +4 mA)
Supply current, active mode
2.4
V
0.4
5.0
V
mA
Supply current, standby mode, XC1718L, XC1765L
Supply current, standby mode, XC17128L, XC17265L
1.5
50.0
mA
µA
IL
Input or output leakage current
-10.0
10.0
µA
Note: During normal read operation V must be connected to V
PP
CC
5-18
November 25, 1997 (Version 1.1)
AC Characteristics Over Operating Condition
CE
9
10
9
T
T
T
HCE
SCE
SCE
RESET/OE
T
11
HOE
T
8
LC
7
T
HC
6
T
CYC
CLK
3
4
T
OE
1
5
T
DF
T
T
CAC
OH
T
2
CE
DATA
4
T
OH
X2634
XC1718D
XC1736D
XC1765D
XC1718L
XC1765L
XC17128D
XC17256D
XC17128L
XC17256L
Symbol
Description
Units
Min
Max
Min
Max
Min
Max
25
45
Min
Max
30
60
1
2
3
4
5
6
7
8
9
TOE
TCE
OE to Data Delay
CE to Data Delay
45
60
45
60
ns
ns
ns
ns
ns
ns
ns
ns
ns
TCAC CLK to Data Delay
TOH
TDF
TCYC Clock Periods
TLC
150
200
50
60
Data Hold From CE, OE, or CLK
CE or OE to Data Float Delay2
0
0
0
0
50
50
50
50
200
100
100
25
400
100
100
40
80
20
20
20
100
25
25
CLK Low Time3
CLK High Time3
THC
TSCE CE Setup Time to CLK (to guarantee
proper counting)
25
10 THCE CE Hold Time to CLK (to guarantee
proper counting)
11 THOE OE Hold Time (guarantees counters are 100
0
0
0
0
ns
ns
100
20
25
reset)
Notes: 1. AC test load = 50 pF
2. Float delays are measured with minimum tester ac load and maximum dc load.
3. Guaranteed by design, not tested.
4. All AC parameters are measured with V = 0.0 V and V = 3.0 V.
IL
IH
November 25, 1997 (Version 1.1)
5-19
XC1700D Family of Serial Configuration PROMs
AC Characteristics Over Operating Condition (continued)
RESET/OE
CE
CLK
T
12
CDF
Last Bit
First Bit
DATA
CEO
T
13
T
OOE
OCK
15
T
T
OCE
14
14
OCE
X3183
XC1718D
XC1736D
XC1765D
XC1718L
XC1765L
XC17128D
XC17256D
XC17128L
XC17256L
Symbol
Description
Units
Min
Max
Min
Max
Min
Max
Min
Max
50
30
35
30
12 TCDF CLK to Data Float Delay2
13 TOCK CLK to CEO Delay
14 TOCE CE to CEO Delay
50
65
45
40
50
65
45
40
50
30
35
30
ns
ns
ns
ns
15 TOOE RESET/OE to CEO Delay
Notes: 1. AC test load = 50 pF
2. Float delays are measured with minimum tester ac load and maximum dc load.
3. Guaranteed by design, not tested.
4. All AC parameters are measured with V = 0.0 V and V = 3.0 V.
IL
IH
5-20
November 25, 1997 (Version 1.1)
Ordering Information
XC1736D PC20 C
Device Number
Operating Range/Processing
XC1718D
XC1718L
C = Commercial (0° to +70°C)
I
= Industrial (–40° to +85°C)
Package Type
PD8 = 8-Pin Plastic DIP
DD8 = 8-Pin CerDIP
SO8 = 8-Pin Plastic Small-Outline Package
VO8 = 8-Pin Plastic Small-Outline Thin Package
PC20 = 20-Pin Plastic Leaded Chip Carrier
XC1736D
XC1765D
XC1765L
XC17128D
XC17128L
XC17256D
XC17256L
M = Military (–55° to +125°C)
B = Military (–55° to +125°C)
MIL-STD-883 Level B compliant
Valid Ordering Combinations
XC17128DPD8C
XC17128DVO8C
XC17128DPC20C
XC17128DPD8I
XC17128DVO8I
XC17128DPC20I
XC17128DDD8M
XC1718DPD8C
XC1718DSO8C
XC1718DVO8C
XC1718DPC20C
XC1718DPD8I
XC1718DSO8I
XC1718DVO8I
XC1718DPC20I
XC17256DPD8C
XC17256DVO8C
XC17256DPC20C
XC17256DPD8I
XC17256DVO8I
XC17256DPC20I
XC17256DDD8M
XC17256DDD8B
XC1736DPD8C
XC1765DPD8C
XC1765DSO8C
XC1765DVO8C
XC1765DPC20C
XC1765DPD8I
XC1765DSO8I
XC1765DVO8I
XC1765DPC20I
XC1765DDD8M
XC1765DDD8B
XC1765LPD8C
XC1765LSO8C
XC1765LVO8C
XC1765LPC20C
XC1765LPD8I
XC1765LSO8I
XC1765LVO8I
XC1765LPC20I
XC1736DSO8C
XC1736DVO8C
XC1736DPC20C
XC1736DPD8I
XC1736DSO8I
XC1736DVO8I
XC1736DPC20I
XC1736DDD8M
XC17128LPD8C
XC17128LVO8C
XC17128LPC20C
XC17128LPD8I
XC17128LVO8I
XC17128LPC20I
XC1718LPD8C
XC1718LSO8C
XC1718LVO8C
XC1718LPC20C
XC1718LPD8I
XC1718LSO8I
XC1718LVO8I
XC1718LPC20I
XC17256LPD8C
XC17256LVO8C
XC17256LPC20C
XC17256LPD8I
XC17256LVO8I
XC17256LPC20I
Marking Information
Due to the small size of the serial PROM package, the complete ordering part number cannot be marked on the package.
The XC prefix is deleted and the package code is simplified. Device marking is as follows.
1736D
P
C
Device Number
Operating Range/Processing
XC1718D
XC1718L
XC1736D
XC1765D
XC1765L
XC17128D
XC17128L
XC17256D
XC17256L
C = Commercial (0° to +70°C)
Package Type
I
= Industrial (–40° to +85°C)
M = Military (–55° to +125°C)
B = Military (–55° to +125°C)
MIL-STD-883 Level B compliant
P
D
S
V
J
= 8-Pin Plastic DIP
= 8-Pin CerDIP
= 8-Pin Plastic Small-Outline Package
= 8-Pin Plastic Small-Outline Thin Package
= 20-Pin Plastic Leaded Chip Carrier
November 25, 1997 (Version 1.1)
5-21
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