XC2VP125-7FFG1696I [XILINX]
Field Programmable Gate Array, 13904 CLBs, 1350MHz, CMOS, PBGA1696, 1 MM PITCH, FLIP CHIP, FBGA-1696;
| 型号： | XC2VP125-7FFG1696I |
| 厂家： | 
XILINX, INC |
| 描述： | Field Programmable Gate Array, 13904 CLBs, 1350MHz, CMOS, PBGA1696, 1 MM PITCH, FLIP CHIP, FBGA-1696 时钟 栅 可编程逻辑 |
| 文件： | 总411页 (文件大小：2619K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
0
R
Virtex-II Pro™ Platform FPGAs:
Complete Data Sheet
0
0
DS083 December 10, 2003
Advance Product Specification
This document includes all four modules of the Virtex-II Pro Platform FPGA data sheet.
Module 1:
Introduction and Overview
Module 3:
DC and Switching Characteristics
DS083-1 (v3.0) December 10, 2003
8 pages
DS083-3 (v3.0) December 10, 2003
54 pages
•
•
•
•
•
•
Summary of Features
•
•
•
•
•
•
Electrical Characteristics
General Description
Architecture
Performance Characteristics
Switching Characteristics
IP Core and Reference Support
Device/Package Combinations and Maximum I/O
Ordering Information
Pin-to-Pin Output Parameter Guidelines
Pin-to-Pin Input Parameter Guidelines
DCM Timing Parameters
Module 2:
Functional Description
Module 4:
Pinout Information
DS083-2 (v3.0) December 10, 2003
50 pages
DS083-4 (v3.0) December 10, 2003
298 pages
•
Functional Description: RocketIO™ Multi-Gigabit
Transceiver
•
•
Pin Definitions
Pinout Tables
•
•
•
Functional Description: Processor Block
Functional Description: PowerPC™ 405 Core
Functional Description: FPGA
-
-
-
-
-
-
-
-
-
-
FG256 Wire-Bond Fine-Pitch BGA Package
FG456 Wire-Bond Fine-Pitch BGA Package
FG676 Wire-Bond Fine-Pitch BGA Package
FF672 Flip-Chip Fine-Pitch BGA Package
FF896 Flip-Chip Fine-Pitch BGA Package
FF1148 Flip-Chip Fine-Pitch BGA Package
FF1152 Flip-Chip Fine-Pitch BGA Package
FF1517 Flip-Chip Fine-Pitch BGA Package
FF1696 Flip-Chip Fine-Pitch BGA Package
FF1704 Flip-Chip Fine-Pitch BGA Package
-
-
-
-
-
-
-
-
-
-
-
-
Input/Output Blocks (IOBs)
Digitally Controlled Impedance (DCI)
On-Chip Differential Termination
Configurable Logic Blocks (CLBs)
3-State Buffers
CLB/Slice Configurations
18-Kb Block SelectRAM™ Resources
18-Bit x 18-Bit Multipliers
Global Clock Multiplexer Buffers
Digital Clock Manager (DCM)
Routing
Configuration
IMPORTANT NOTE: The Virtex-II Pro Platform FPGA data sheet is created and published in separate modules. This
complete version is provided for easy downloading and searching of the complete document. Page, figure, and table
numbers begin at 1 for each module, and each module has its own Revision History at the end. Use the PDF "Bookmarks"
pane for easy navigation in this volume.
© 2003 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
DS083 December 10, 2003
www.xilinx.com
Advance Product Specification
1-800-255-7778
`
0
8
R
Virtex-II Pro™ Platform FPGAs:
Introduction and Overview
0
0
DS083-1 (v3.0) December 10, 2003
Product Specification
Summary of Virtex-II Pro Features
•
High-Performance Platform FPGA Solution, Including
-
-
-
-
-
SelectRAM™+ memory hierarchy
Dedicated 18-bit x 18-bit multiplier blocks
High-performance clock management circuitry
SelectI/O™-Ultra technology
-
Up to twenty-four RocketIO™ embedded
multi-gigabit transceivers
-
Up to four IBM® PowerPC® RISC processor blocks
XCITE Digitally Controlled Impedance (DCI) I/O
•
Based on Virtex™-II Platform FPGA Technology
-
-
-
Flexible logic resources
SRAM-based in-system configuration
Active Interconnect technology
Virtex-II Pro family members and resources are shown in
Table 1.
Table 1: Virtex-II Pro FPGA Family Members
CLB (1 = 4 slices =
max 128 bits)
Block SelectRAM+
18 Kb MaxBlock
RocketIO
Transceiver Processor
PowerPC
18 X 18Bit
Max Distr Multiplier
Maximum
User
Logic
Device
XC2VP2
Blocks
Blocks
Cells(1)
Slices RAM (Kb)
Blocks
Blocks RAM (Kb) DCMs I/O Pads
4
4
8
8
8
0
1
1
2
2
2
2
2
2
4
3,168
6,768
1,408
3,008
44
94
12
12
28
216
504
4
4
204
348
XC2VP4
28
XC2VP7
11,088
20,880
30,816
43,632
53,136
74,448
99,216
125,136
4,928
154
44
44
792
4
396
XC2VP20
XC2VP30
XC2VP40
XC2VP50
XC2VP70
XC2VP100
XC2VP125
9,280
290
88
88
1,584
2,448
3,456
4,176
5,904
7,992
10,008
8
564
13,696
19,392
23,616
33,088
44,096
55,616
428
136
192
232
328
444
556
136
192
232
328
444
556
8
644
0
(2) or 12
0(2) or 16
16 or 20
606
8
804
738
8
852
1,034
1,378
1,738
8
996
0
(2) or 20
12
12
1,164
1,200
(2)
0
, 20, or 24
Notes:
1. Logic Cell = (1) 4-input LUT + (1)FF + Carry Logic
2. These devices can be ordered in a configuration without RocketIO transceivers. See Table 3 for package configurations.
RocketIO Transceiver Features
•
Full-Duplex Serial Transceiver (SERDES) Capable of
Baud Rates from 600 Mb/s to 3.125 Gb/s
•
50Ω /75Ω on-chip Selectable Transmit and Receive
Terminations
•
•
•
120 Gb/s Duplex Data Rate (24 Channels)
Monolithic Clock Synthesis and Clock Recovery (CDR)
Fibre Channel, 10G Fibre Channel, Gigabit Ethernet,
10 Gb Attachment Unit Interface (XAUI), and
Infiniband-Compliant Transceivers
•
•
•
•
•
•
•
Programmable Comma Detection
Channel Bonding Support (from 2 to 24 Channels)
Rate Matching via Insertion/Deletion Characters
Four Levels of Selectable Pre-Emphasis
Five Levels of Output Differential Voltage
Per-Channel Internal Loopback Modes
2.5V Transceiver Supply Voltage
•
•
8-, 16-, or 32-bit Selectable Internal FPGA Interface
8B/10B Encoder and Decoder (optional)
© 2003 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
DS083-1 (v3.0) December 10, 2003
www.xilinx.com
1
Product Specification
1-800-255-7778
R
General Description
-
Programmable LVCMOS sink/source current
(2 mA to 24 mA) per I/O
XCITE Digitally Controlled Impedance (DCI) I/O
PCI/ PCI-X support (1)
PowerPC RISC Block Features
•
•
•
•
•
•
•
•
Embedded 300+ MHz Harvard Architecture Block
Low Power Consumption: 0.9 mW/MHz
Five-Stage Data Path Pipeline
-
-
-
Differential signaling
Hardware Multiply/Divide Unit
·
840 Mb/s Low-Voltage Differential Signaling I/O
(LVDS) with current mode drivers
Bus LVDS I/O
HyperTransport (LDT) I/O with current driver
buffers
Thirty-Two 32-bit General Purpose Registers
16 KB Two-Way Set-Associative Instruction Cache
16 KB Two-Way Set-Associative Data Cache
Memory Management Unit (MMU)
·
·
·
Built-in DDR input and output registers
-
-
64-entry unified Translation Look-aside Buffers (TLB)
Variable page sizes (1 KB to 16 MB)
-
Proprietary high-performance SelectLink
technology for communications between Xilinx
devices
•
•
•
•
Dedicated On-Chip Memory (OCM) Interface
Supports IBM CoreConnect™ Bus Architecture
Debug and Trace Support
·
·
·
High-bandwidth data path
Double Data Rate (DDR) link
Web-based HDL generation methodology
Timer Facilities
•
•
SRAM-Based In-System Configuration
Virtex-II Pro Platform FPGA Technology
-
-
Fast SelectMAP™ configuration
Triple Data Encryption Standard (DES) security
option (bitstream encryption)
IEEE 1532 support
Partial reconfiguration
Unlimited reprogrammability
Readback capability
•
SelectRAM+ Memory Hierarchy
-
-
-
Up to 10 Mb of True Dual-Port RAM in 18 Kb block
SelectRAM+ resources
Up to 1,738 Kb of distributed SelectRAM+
resources
-
-
-
-
High-performance interfaces to external memory
Supported by Xilinx Foundation™ and Alliance
Series™ Development Systems
•
•
Arithmetic Functions
-
-
Dedicated 18-bit x 18-bit multiplier blocks
Fast look-ahead carry logic chains
-
-
Integrated VHDL and Verilog design flows
ChipScope™ Integrated Logic Analyzer
Flexible Logic Resources
•
•
0.13 µm Nine-Layer Copper Process with 90 nm
High-Speed Transistors
1.5V (VCCINT) core power supply, dedicated 2.5V
-
Up to 111,232 internal registers/latches with Clock
Enable
-
Up to 111,232 look-up tables (LUTs) or cascadable
variable (1 to 16 bits) shift registers
Wide multiplexers and wide-input function support
Horizontal cascade chain and Sum-of-Products
support
VCCAUX auxiliary and VCCO I/O power supplies
-
-
•
•
IEEE 1149.1 Compatible Boundary-Scan Logic Support
Flip-Chip and Wire-Bond Ball Grid Array (BGA)
Packages in Standard 1.00 mm Pitch
-
Internal 3-state busing
•
Each Device 100% Factory Tested
•
High-Performance Clock Management Circuitry
-
Up to twelve Digital Clock Manager (DCM) modules
General Description
·
·
·
Precise clock de-skew
Flexible frequency synthesis
High-resolution phase shifting
The Virtex-II Pro family contains platform FPGAs for
designs that are based on IP cores and customized mod-
ules. The family incorporates multi-gigabit transceivers and
PowerPC CPU blocks in Virtex-II Pro Series FPGA archi-
tecture. It empowers complete solutions for telecommunica-
tion, wireless, networking, video, and DSP applications.
-
16 global clock multiplexer buffers in all parts
•
•
Active Interconnect Technology
-
-
Fourth-generation segmented routing structure
Fast, predictable routing delay, independent of
fanout
The leading-edge 0.13 µm CMOS nine-layer copper pro-
cess and Virtex-II Pro architecture are optimized for high
performance designs in a wide range of densities. Combin-
ing a wide variety of flexible features and IP cores, the
Virtex-II Pro family enhances programmable logic design
capabilities and is a powerful alternative to mask-pro-
grammed gate arrays.
-
Deep sub-micron noise immunity benefits
SelectIO™-Ultra Technology
-
-
Up to 1,200 user I/Os
Twenty-two single-ended standards and
six differential standards
1. Refer to XAPP653 for more information.
2
www.xilinx.com
1-800-255-7778
DS083-1 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Introduction and Overview
high-bandwidth interconnection between buses, back-
planes, or other subsystems.
Architecture
Virtex-II Pro Array Overview
Multiple user instantiations in an FPGA are possible, provid-
ing up to 120 Gb/s of full-duplex raw data transfer. Each
channel can be operated at a maximum data transfer rate of
3.125 Gb/s.
Virtex-II Pro devices are user-programmable gate arrays
with various configurable elements and embedded blocks
optimized for high-density and high-performance system
designs. Virtex-II Pro devices implement the following func-
tionality:
Each RocketIO transceiver implements:
•
•
•
Serializer and deserializer (SERDES)
•
•
•
Embedded high-speed serial transceivers enable data
bit rate up to 3.125 Gb/s per channel.
Embedded IBM PowerPC 405 RISC processor blocks
provide performance of 300+ MHz.
SelectIO-Ultra blocks provide the interface between
package pins and the internal configurable logic. Most
popular and leading-edge I/O standards are supported
by the programmable IOBs.
Monolithic clock synthesis and clock recovery (CDR)
Fibre Channel, 10G Fibre Channel, Gigabit Ethernet,
XAUI, and Infiniband-compliant transceivers
8-, 16-, or 32-bit selectable FPGA interface
8B/10B encoder and decoder with bypassing option on
each channel
•
•
•
Channel bonding support (2 to 24 channels)
-
Elastic buffers for inter-chip deskewing and
channel-to-channel alignment
•
Configurable Logic Blocks (CLBs) provide functional
elements for combinatorial and synchronous logic,
including basic storage elements. BUFTs (3-state
buffers) associated with each CLB element drive
dedicated segmentable horizontal routing resources.
Block SelectRAM+ memory modules provide large
18 Kb storage elements of True Dual-Port RAM.
Embedded multiplier blocks are 18-bit x 18-bit
dedicated multipliers.
Digital Clock Manager (DCM) blocks provide
self-calibrating, fully digital solutions for clock
distribution delay compensation, clock multiplication
and division, and coarse- and fine-grained clock phase
shifting.
•
•
Receiver clock recovery tolerance of up to
75 non-transitioning bits
50Ω /75Ω on-chip selectable transmit and receive
terminations
•
•
•
•
•
•
•
•
•
Programmable comma detection
Rate matching via insertion/deletion characters
Automatic lock-to-reference function
Optional transmit and receive data inversion
Four levels of pre-emphasis support
Per-channel serial and parallel transmitter-to-receiver
internal loopback modes
•
Cyclic Redundancy Check (CRC) support
A new generation of programmable routing resources
called Active Interconnect Technology interconnects all of
these elements. The general routing matrix (GRM) is an
array of routing switches. Each programmable element is
tied to a switch matrix, allowing multiple connections to the
general routing matrix. The overall programmable intercon-
nection is hierarchical and designed to support high-speed
designs.
PowerPC 405 Processor Block
The PPC405 RISC CPU can execute instructions at a sus-
tained rate of one instruction per cycle. On-chip instruction
and data cache reduce design complexity and improve sys-
tem throughput.
The PPC405 features include:
•
PowerPC RISC CPU
All programmable elements, including the routing
resources, are controlled by values stored in static memory
cells. These values are loaded in the memory cells during
configuration and can be reloaded to change the functions
of the programmable elements.
-
Implements the PowerPC User Instruction Set
Architecture (UISA) and extensions for embedded
applications
-
-
-
Thirty-two 32-bit general purpose registers (GPRs)
Static branch prediction
Five-stage pipeline with single-cycle execution of
most instructions, including loads/stores
Virtex-II Pro Features
This section briefly describes Virtex-II Pro features. For
more details, refer to Virtex-II Pro™ Platform FPGAs: Func-
tional Description.
-
-
Unaligned and aligned load/store support to cache,
main memory, and on-chip memory
Hardware multiply/divide for faster integer
arithmetic (4-cycle multiply, 35-cycle divide)
RocketIO Multi-Gigabit Transceivers
The RocketIO Multi-Gigabit Transceiver, based on Mind-
speed’s SkyRail technology, is a flexible parallel-to-serial
and serial-to-parallel embedded transceiver used for
-
-
Enhanced string and multiple-word handling
Big/little endian operation support
DS083-1 (v3.0) December 10, 2003
www.xilinx.com
3
Product Specification
1-800-255-7778
R
Architecture
•
Storage Control
•
•
•
•
PCI compliant (66 MHz and 33 MHz) at 3.3V(2)
GTL and GTLP
HSTL (1.5V and 1.8V, Class I, II, III, and IV)
SSTL (1.8V and 2.5V, Class I and II)
-
Separate instruction and data cache units, both
two-way set-associative and non-blocking
Eight words (32 bytes) per cache line
16 KB array Instruction Cache Unit (ICU), 16 KB
array Data Cache Unit (DCU)
-
-
The DCI I/O feature automatically provides on-chip termina-
tion for each single-ended I/O standard.
-
-
-
Operand forwarding during instruction cache line fill
Copy-back or write-through DCU strategy
Doubleword instruction fetch from cache improves
branch latency
The IOB elements also support the following differential sig-
naling I/O standards:
•
•
•
•
•
LVDS and Extended LVDS (2.5V)
BLVDS (Bus LVDS)
ULVDS
LDT
LVPECL (2.5V)
•
Virtual mode memory management unit (MMU)
-
Translation of the 4 GB logical address space into
physical addresses
-
-
Software control of page replacement strategy
Supports multiple simultaneous page sizes ranging
from 1 KB to 16 MB
Two adjacent pads are used for each differential pair. Two
or four IOB blocks connect to one switch matrix to access
the routing resources.
•
•
OCM controllers provide dedicated interfaces between
Block SelectRAM+ memory and processor block
instruction and data paths for high-speed access
PowerPC timer facilities
Configurable Logic Blocks (CLBs)
CLB resources include four slices and two 3-state buffers.
Each slice is equivalent and contains:
-
-
-
-
64-bit time base
Programmable interval timer (PIT)
Fixed interval timer (FIT)
Watchdog timer (WDT)
•
•
•
•
•
•
•
Two function generators (F & G)
Two storage elements
Arithmetic logic gates
•
Debug Support
Large multiplexers
-
-
-
-
-
-
-
Internal debug mode
External debug mode
Debug Wait mode
Real Time Trace debug mode
Enhanced debug support with logical operators
Instruction trace and trace-back support
Forward or backward trace
Wide function capability
Fast carry look-ahead chain
Horizontal cascade chain (OR gate)
The function generators F & G are configurable as 4-input
look-up tables (LUTs), as 16-bit shift registers, or as 16-bit
distributed SelectRAM+ memory.
In addition, the two storage elements are either
edge-triggered D-type flip-flops or level-sensitive latches.
•
•
Two hardware interrupt levels support
Advanced power management support
Each CLB has internal fast interconnect and connects to a
switch matrix to access general routing resources.
Input/Output Blocks (IOBs)
IOBs are programmable and can be categorized as follows:
Block SelectRAM+ Memory
•
Input block with an optional single data rate (SDR) or
double data rate (DDR) register
The block SelectRAM+ memory resources are 18 Kb of
True Dual-Port RAM, programmable from 16K x 1 bit to
512 x 36 bit, in various depth and width configurations.
Each port is totally synchronous and independent, offering
three "read-during-write" modes. Block SelectRAM+ mem-
ory is cascadable to implement large embedded storage
blocks. Supported memory configurations for dual-port and
single-port modes are shown in Table 2.
•
Output block with an optional SDR or DDR register and
an optional 3-state buffer to be driven directly or
through an SDR or DDR register
•
Bidirectional block (any combination of input and
output configurations)
These registers are either edge-triggered D-type flip-flops
or level-sensitive latches.
Table 2: Dual-Port and Single-Port Configurations
IOBs support the following single-ended I/O standards:
LVTTL, LVCMOS (3.3V, 2.5V, 1.8V, and 1.5V)(1)
PCI-X compatible (133 MHz and 66 MHz) at 3.3V(2)
16K x 1 bit
8K x 2 bits
4K x 4 bits
2K x 9 bits
1K x 18 bits
512 x 36 bits
•
•
1. Refer to XAPP659 for more information.
2. Refer to XAPP653 for more information.
4
www.xilinx.com
1-800-255-7778
DS083-1 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Introduction and Overview
•
•
•
•
24 long lines
120 hex lines
40 double lines
16 direct connect lines (total in all four directions)
18 X 18 Bit Multipliers
A multiplier block is associated with each SelectRAM+
memory block. The multiplier block is a dedicated
18 x 18-bit 2s complement signed multiplier, and is opti-
mized for operations based on the block SelectRAM+ con-
tent on one port. The 18 x 18 multiplier can be used
independently of the block SelectRAM+ resource.
Read/multiply/accumulate operations and DSP filter struc-
tures are extremely efficient.
Boundary Scan
Boundary-scan instructions and associated data registers
support a standard methodology for accessing and config-
uring Virtex-II Pro devices, complying with IEEE standards
1149.1 and 1532. A system mode and a test mode are
implemented. In system mode, a Virtex-II Pro device will
continue to function while executing non-test bound-
ary-scan instructions. In test mode, boundary-scan test
instructions control the I/O pins for testing purposes. The
Virtex-II Pro Test Access Port (TAP) supports BYPASS,
PRELOAD, SAMPLE, IDCODE, and USERCODE non-test
instructions. The EXTEST, INTEST, and HIGHZ test
instructions are also supported.
Both the SelectRAM+ memory and the multiplier resource
are connected to four switch matrices to access the general
routing resources.
Global Clocking
The DCM and global clock multiplexer buffers provide a
complete solution for designing high-speed clock schemes.
Up to twelve DCM blocks are available. To generate
deskewed internal or external clocks, each DCM can be
used to eliminate clock distribution delay. The DCM also
provides 90-, 180-, and 270-degree phase-shifted versions
of its output clocks. Fine-grained phase shifting offers
high-resolution phase adjustments in increments of 1/256 of
the clock period. Very flexible frequency synthesis provides
a clock output frequency equal to a fractional or integer mul-
tiple of the input clock frequency. For exact timing parame-
ters, see Virtex-II Pro™ Platform FPGAs: DC and Switching
Characteristics.
Configuration
Virtex-II Pro devices are configured by loading the bit-
stream into internal configuration memory using one of the
following modes:
•
•
•
•
•
Slave-serial mode
Master-serial mode
Slave SelectMAP mode
Master SelectMAP mode
Boundary-Scan mode (IEEE 1532)
Virtex-II Pro devices have 16 global clock MUX buffers, with
up to eight clock nets per quadrant. Each clock MUX buffer
can select one of the two clock inputs and switch glitch-free
from one clock to the other. Each DCM can send up to four
of its clock outputs to global clock buffers on the same edge.
Any global clock pin can drive any DCM on the same edge.
A Data Encryption Standard (DES) decryptor is available
on-chip to secure the bitstreams. One or two triple-DES key
sets can be used to optionally encrypt the configuration data.
The Xilinx System Advanced Configuration Enviornment
(System ACE) family offers high-capacity and flexible solu-
tion for FPGA configuration as well as program/data stor-
age for the processor. See DS080, System ACE
CompactFlash Solution for more information.
Routing Resources
The IOB, CLB, block SelectRAM+, multiplier, and DCM ele-
ments all use the same interconnect scheme and the same
access to the global routing matrix. Timing models are
shared, greatly improving the predictability of the perfor-
mance of high-speed designs.
Readback and Integrated Logic Analyzer
Configuration data stored in Virtex-II Pro configuration
memory can be read back for verification. Along with the
configuration data, the contents of all flip-flops/latches, dis-
tributed SelectRAM+, and block SelectRAM+ memory
resources can be read back. This capability is useful for
real-time debugging.
There are a total of 16 global clock lines, with eight available
per quadrant. In addition, 24 vertical and horizontal long
lines per row or column, as well as massive secondary and
local routing resources, provide fast interconnect.
Virtex-II Pro buffered interconnects are relatively unaffected
by net fanout, and the interconnect layout is designed to
minimize crosstalk.
The Xilinx ChipScope Integrated Logic Analyzer (ILA) cores
and Integrated Bus Analyzer (IBA) cores, along with the
ChipScope Pro Analyzer software, provide a complete solu-
tion for accessing and verifying user designs within
Virtex-II Pro devices.
Horizontal and vertical routing resources for each row or
column include:
DS083-1 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
5
R
IP Core and Reference Support
IP Core and Reference Support
Virtex-II Pro Device/Package
Combinations and Maximum I/Os
Intellectual Property is part of the Platform FPGA solution.
In addition to the existing FPGA fabric cores, the list below
shows some of the currently available hardware and soft-
ware intellectual properties specially developed for
Virtex-II Pro by Xilinx. Each IP core is modular, portable,
Real-Time Operating System (RTOS) independent, and
CoreConnect compatible for ease of design migration.
Refer to www.xilinx.com/ipcenter for the latest and most
complete list of cores.
Offerings include ball grid array (BGA) packages with
1.0 mm pitch. In addition to traditional wire-bond intercon-
nects, flip-chip interconnect is used in some of the BGA
offerings. The use of flip-chip interconnect offers more I/Os
than are possible in wire-bond versions of the similar pack-
ages. Flip-chip construction offers the combination of high
pin count and excellent power dissipation.
The Virtex-II Pro device/package combination table
(Table 3) details the maximum number of user I/Os and
RocketIO transceivers for each device and package using
wire-bond or flip-chip technology.
Hardware Cores
•
•
•
•
Bus Infrastructure cores (arbiters, bridges, and more)
Memory cores (DDR, Flash, and more)
•
•
FG denotes Wirebond fine-pitch BGA (1.00 mm pitch).
FF denotes FlipChip fine-pitch BGA (1.00 mm pitch).
Peripheral cores (UART, IIC, and more)
Networking cores (ATM, Ethernet, and more)
The FF1148 and FF1696 packages have no RocketIO
transceivers bonded out. Extra SelectIO-Ultra resources
occupy available pins in these packages, resulting in a
higher user I/O count. FF1148 and FF1696 packages are
available for the XC2VP40, XC2VP50, XC2VP100, and
XC2VP125 devices only.
Software Cores
•
•
•
•
•
•
Boot code
Test code
Device drivers
Protocol stacks
RTOS integration
Customized board support package
The I/Os per package count includes all user I/Os except
the 15 control pins (CCLK, DONE, M0, M1, M2, PROG_B,
PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN,
DXP, and RSVD), VBATT, and RocketIO transceiver pins.
Table 3: Virtex-II Pro Device/Package Combinations and Maximum Number of Available I/Os
Available User I/Os / Available RocketIO Transceivers
Pitch Size
Pkg
FG256
FG456
FG676
FF672
FF896
(mm) (mm)
XC2VP2 XC2VP4 XC2VP7 XC2VP20 XC2VP30 XC2VP40 XC2VP50 XC2VP70 XC2VP100 XC2VP125
1.00 17 x 17 140 / 4 140 / 4
1.00 23 x 23 156 / 4 248 / 4 248 / 8
1.00 26 x 26
404 / 8
416 / 8
556 / 8
416 / 8
1.00 27 x 27 204 / 4 348 / 4 396 / 8
1.00 31 x 31
396 / 8
556 / 8
564 / 8
FF1152 1.00 35 x 35
FF1148 1.00 35 x 35
FF1517 1.00 40 x 40
644 / 8 692 / 12 692 / 16
804 / 0(1) 812 / 0(1)
852 / 16 964 / 16
996 / 20 1,040 / 20 1,040 / 20
1,164 / 0(1) 1,200 / 0(1)
42.5 x
FF1704 1.00
42.5
42.5 x
FF1696 1.00
42.5
Notes:
1. The RocketIO transceivers in devices in the FF1148 and FF1696 packages are not bonded out to the package pins.
2. Consult Xilinx for package options supporting 24 RocketIO transceivers.
6
www.xilinx.com
DS083-1 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Introduction and Overview
Maximum Performance
Maximum RocketIO transceiver and PowerPC processor block performance varies, depending on the package style and
speed grade. See Table 4 for details. Virtex-II Pro™ Platform FPGAs: DC and Switching Characteristics contains the rest of
the FPGA fabric performance parameters.
Table 4: Maximum RocketIO Transceiver and Processor Block Performance
Speed Grade
-7
2.5
-6
2.5
-5
Units
Gb/s
Gb/s
MHz
RocketIO Transceiver Wirebond (FG)
RocketIO Transceiver FlipChip (FF)
PowerPC Processor Block
2.0
2.0
300
3.125
400
3.125
350
Virtex-II Pro Ordering Information
Virtex-II Pro ordering information is shown in Figure 1.
Example: XC2VP7-7FG456C
Device Type
Temperature Range:
C = Commercial (Tj = 0˚C to +85˚C)
I = Industrial (Tj = -40˚C to +100˚C)
Speed Grade
(-5, -6, -7)
Number of Pins
Package Type
DS083_02_052902
Figure 1: Virtex-II Pro Ordering Information
Revision History
This section records the change history for this module of the data sheet.
Date
Version
1.0
Revision
01/31/02
06/13/02
09/03/02
09/27/02
11/20/02
01/20/03
Initial Xilinx release.
2.0
New Virtex-II Pro family members. New timing parameters per speedsfile v1.62.
Updates to Table 1 and Table 3. Processor Block information added to Table 4.
In Table 1, correct max number of XC2VP30 I/Os to 644.
2.1
2.2
2.3
Add bullet items for 3.3V I/O features.
2.4
•
•
In Table 3, add FG676 package option for XC2VP20, XC2VP30, and XC2VP40.
Remove FF1517 package option for XC2VP40.
03/24/03
2.4.1
•
•
Correct number of single-ended I/O standards from 19 to 22.
Correct minimum RocketIO serial speed from 622 Mbps to 600 Mbps.
08/25/03
12/10/03
2.4.2
3.0
•
Add footnote referring to XAPP659 to callout for 3.3V I/O standards on page 4.
•
XC2VP2 through XC2VP70 speed grades -5, -6, and -7, and XC2VP100 speed grades
-5 and -6, are released to Production status.
DS083-1 (v3.0) December 10, 2003
www.xilinx.com
7
Product Specification
1-800-255-7778
R
Virtex-II Pro Data Sheet
Virtex-II Pro Data Sheet
The Virtex-II Pro Data Sheet contains the following modules:
•
Virtex-II Pro™ Platform FPGAs: Introduction and
Overview (Module 1)
Virtex-II Pro™ Platform FPGAs: Functional Description
(Module 2)
•
•
Virtex-II Pro™ Platform FPGAs: DC and Switching
Characteristics (Module 3)
Virtex-II Pro™ Platform FPGAs: Pinout Information
(Module 4)
•
8
www.xilinx.com
DS083-1 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
0
50
R
Virtex-II Pro™ Platform FPGAs:
Functional Description
0
0
DS083-2 (v3.0) December 10, 2003
Product Specification
Virtex-II Pro Array Functional Description
Processor Reference Guide and the PowerPC 405 Pro-
cessor Block Reference Guide. For detailed RocketIO
transceiver digital/ analog design considerations, refer to
RocketIO Transceiver User Guide. For a detailed descrip-
tion of the FPGA fabric (CLB, IOB, DCM, etc.), refer to the
Virtex-II Pro Platform FPGA User Guide.
RocketIO™
DCM
Multi-Gigabit Transceiver
All of the documents above, as well as a complete listing
and description of Xilinx-developed Intellectual Property
cores for Virtex-II Pro, are available on the Xilinx website at
www.xilinx.com/virtex2pro.
CLB
CLB
Virtex-II Pro Compared to Virtex-II Devices
CLB
Virtex-II Pro devices are built on the Virtex-II FPGA archi-
tecture. Most FPGA features are identical to Virtex-II
devices. Differences are described below:
CLB
Configurable
Logic
•
The Virtex-II Pro FPGA family is the first to incorporate
embedded PPC405 cores and RocketIO MGTs.
VCCAUX, the auxiliary supply voltage, is 2.5V instead of
•
DS083-1_01_010802
SelectIO™-Ultra
3.3V as for Virtex-II devices. Advanced processing at
0.13 µm has resulted in a smaller die, faster speed,
and lower power consumption.
Virtex-II Pro devices are neither bitstream-compatible nor
pin-compatible with Virtex-II devices. However, Virtex-II
designs can be compiled into Virtex-II Pro devices.
SSTL3, AGP-2X/AGP, LVPECL_33, LVDS_33, and
LVDSEXT_33 standards are not supported.
The open-drain output pin TDO does not have an
internal pull-up resistor.
Figure 1: Virtex-II Pro Generic Architecture Overview
This module describes the following Virtex-II Pro functional
components, as shown in Figure 1:
•
•
Embedded RocketIO™ Multi-Gigabit Transceiver
(MGT)
Processor block with embedded IBM® PowerPC™ 405
RISC CPU core (PPC405) and integration circuitry.
FPGA fabric based on Virtex-II architecture.
•
•
•
•
For a description of PPC405 embedded core programming
models and internal core operations, refer to the PowerPC
3.125 Gb/s per channel. This includes specific baud rates
used by various standards as listed in Table 1.
Functional Description: RocketIO
Multi-Gigabit Transceiver (MGT)
This section summarizes the features of the RocketIO
multi-gigabit transceiver. For an in-depth discussion of the
RocketIO MGT, including digital and analog design consid-
erations, refer to the RocketIO Transceiver User Guide.
Table 1: Protocols Supported by RocketIO
Transceiver
Channels
(Lanes)
I/O Baud Rate Reference Clock
Protocol
(Gb/s)
Rate (MHz)
1.06
53
Fibre Channel
1
2.12
3.1875(1)
106
Overview
159.375
62.5
The embedded RocketIO multi-gigabit transceiver is based
on Mindspeed’s SkyRail™ technology. Up to twenty-four
transceivers are available. The transceiver is designed to
operate at any baud rate in the range of 622 Mb/s to
Gigabit Ethernet
10Gbit Ethernet
Infiniband
1
4
1.25
3.125
2.5
156.25
125
1, 4, 12
© 2003 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
DS083-2 (v3.0) December 10, 2003
www.xilinx.com
1
Product Specification
1-800-255-7778
R
Functional Description: RocketIO Multi-Gigabit Transceiver (MGT)
Table 1: Protocols Supported by RocketIO
Transceiver
The RocketIO transceiver consists of the Physical Media
Attachment (PMA) and Physical Coding Sublayer (PCS).
The PMA contains the serializer and deserializer. The PCS
contains the bypassable 8B/10B encoder/ decoder, elastic
buffers, and Cyclic Redundancy Check (CRC) units. The
encoder and decoder handle the 8B/10B coding scheme.
The elastic buffers support the clock correction (rate match-
ing) and channel bonding features. The CRC units perform
CRC generation and checking.
Channels
(Lanes)
I/O Baud Rate Reference Clock
Protocol
Aurora
(Gb/s)
Rate (MHz)
42.00 – 156.25
up to 156.25
1, 2, 3, 4, ... 0.840 – 3.125
1, 2, 3, 4, ... up to 3.125
Custom Protocol
Notes:
1. Virtex-II Pro MGT can support the 10G Fibre Channel data rates of
3.1875 Gb/s across 6" of standard FR-4 PCB and one connector
-12
(Molex 74441 or equivalent) with a bit error rate of 10 or better.
Figure 2 shows a high-level block diagram of the RocketIO
transceiver and its FPGA interface signals.
The serial bit rate need not be configured in the transceiver,
as the operating frequency is implied by the received data
and reference clock applied.
2
www.xilinx.com
1-800-255-7778
DS083-2 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Functional Description
PACKAGE
PINS
MULTI-GIGABIT TRANSCEIVER CORE
FPGA FABRIC
AVCCAUXRX
VTRX
Power Down
POWERDOWN
2.5V RX
RXRECCLK
RXPOLARITY
Termination Supply RX
RXREALIGN
RXCOMMADET
ENPCOMMAALIGN
ENMCOMMAALIGN
CRC
Check
RXCHECKINGCRC
RXCRCERR
RXDATA[15:0]
RXDATA[31:16]
RXP
RXN
RX
Elastic
Buffer
RXNOTINTABLE[3:0]
RXDISPERR[3:0]
RXCHARISK[3:0]
RXCHARISCOMMA[3:0]
RXRUNDISP[3:0]
Comma
Detect
Realign
Deserializer
8B/10B
Decoder
RXBUFSTATUS[1:0]
ENCHANSYNC
CHBONDDONE
CHBONDI[3:0]
CHBONDO[3:0]
Channel Bonding
and
Clock Correction
RXLOSSOFSYNC
RXCLKCORCNT
Clock
Manager
TXBUFERR
TXFORCECRCERR
TXDATA[15:0]
TXDATA[31:16]
TX
FIFO
8B/10B
Encoder
TXBYPASS8B10B[3:0]
TXCHARISK[3:0]
CRC
TXP
TXN
TXCHARDISPMODE[3:0]
TXCHARDISPVAL[3:0]
Serializer
Output
Polarity
TXKERR[3:0]
TXRUNDISP[3:0]
TXPOLARITY
TXINHIBIT
LOOPBACK[1:0]
TXRESET
RXRESET
REFCLK
REFCLK2
REFCLKSEL
BREFCLK
BREFCLK2
RXUSRCLK
RXUSRCLK2
GNDA
AVCCAUXTX
VTTX
TX/RX GND
2.5V TX
Termination Supply TX
TXUSRCLK
TXUSRCLK2
DS083-2_04_090402
Figure 2: RocketIO Transceiver Block Diagram
DS083-2 (v3.0) December 10, 2003
www.xilinx.com
3
Product Specification
1-800-255-7778
R
Functional Description: RocketIO Multi-Gigabit Transceiver (MGT)
as standard data. If the K-character input is High, and a
user applies other than one of the twelve possible
combinations, TXKERR indicates the error.
Clock Synthesizer
Synchronous serial data reception is facilitated by a
clock/data recovery circuit. This circuit uses a fully mono-
lithic Phase Lock Loop (PLL), which does not require any
external components. The clock/data recovery circuit
extracts both phase and frequency from the incoming data
stream. The recovered clock is presented on output
RXRECCLK at 1/20 of the serial received data rate.
Disparity Control
The 8B/10B encoder is initialized with a negative running
disparity. Unique control allows forcing the current running
disparity state.
TXRUNDISP signals its current running disparity. This may
be useful in those cases where there is a need to manipu-
late the initial running disparity value.
The gigabit transceiver multiplies the reference frequency
provided on the reference clock input (REFCLK) by 20. The
multiplication of the clock is achieved by using a fully mono-
lithic PLL that does not require any external components.
Bits TXCHARDISPMODE and TXCHARDISPVAL control
the generation of running disparity before each byte.
No fixed phase relationship is assumed between REFCLK,
RXRECCLK, and/or any other clock that is not tied to either
of these clocks. When the 4-byte or 1-byte receiver data
path is used, RXUSRCLK and RXUSRCLK2 have different
frequencies, and each edge of the slower clock is aligned to
a falling edge of the faster clock. The same relationships
apply to TXUSRCLK and TXUSRCLK2.
For example, the transceiver can generate the sequence
K28.5+ K28.5+ K28.5– K28.5–
or
K28.5– K28.5– K28.5+ K28.5+
by specifying inverted running disparity for the second and
fourth bytes.
Transmit FIFO
Clock and Data Recovery
Proper operation of the circuit is only possible if the FPGA
clock (TXUSRCLK) is frequency-locked to the reference
clock (REFCLK). Phase variations up to one clock cycle are
allowable. The FIFO has a depth of four. Overflow or under-
flow conditions are detected and signaled at the interface.
Bypassing of this FIFO is programmable.
The clock/data recovery (CDR) circuits will lock to the refer-
ence clock automatically if the data is not present. For
proper operation, the frequency of the reference clock must
be within 100 ppm of the nominal frequency.
It is critical to keep power supply noise low in order to mini-
mize common and differential noise modes into the
clock/data recovery circuitry. Refer to the RocketIO Trans-
ceiver User Guide for more details.
Serializer
The multi-gigabit transceiver multiplies the reference fre-
quency provided on the reference clock input (REFCLK) by
20. Clock multiplication is achieved by using a fully mono-
lithic PLL requiring no external components. Data is con-
verted from parallel to serial format and transmitted on the
TXP and TXN differential outputs.
Transmitter
FPGA Transmit Interface
The FPGA can send either one, two, or four characters of
data to the transmitter. Each character can be either 8 bits
or 10 bits wide. If 8-bit data is applied, the additional inputs
become control signals for the 8B/10B encoder. When the
8B/10B encoder is bypassed, the 10-bit character order is
generated as follows:
The electrical connection of TXP and TXN can be inter-
changed through configuration. This option can be con-
trolled by an input (TXPOLARITY) at the FPGA transmitter
interface. This facilitates recovery from situations where
printed circuit board traces have been reversed.
TXCHARDISPMODE[0]
TXCHARDISPVAL[0]
(first bit transmitted)
Transmit Termination
TXDATA[7:0]
(last bit transmitted is TXDATA[0])
On-chip termination is provided at the transmitter, eliminat-
ing the need for external termination. Programmable
options exist for 50Ω (default) and 75Ω termination.
8B/10B Encoder
A bypassable 8B/10B encoder is included. The encoder
uses the same 256 data characters and 12 control charac-
ters that are used for Gigabit Ethernet, Fibre Channel, and
InfiniBand.
Pre-Emphasis Circuit and Swing Control
Four selectable levels of pre-emphasis (10% [default], 20%,
25%, and 33%) are available. Optimizing this setting allows
the transceiver to drive various distances of PCB or cable at
the maximum baud rate.
The encoder accepts 8 bits of data along with a K-character
signal for a total of 9 bits per character applied, and
generates a 10 bit character for transmission. If the
K-character signal is High, the data is encoded into one of
the twelve possible K-characters available in the 8B/10B
code. If the K-character input is Low, the 8 bits are encoded
The programmable output swing control can adjust the dif-
ferential output level between 400 mV and 800 mV in four
increments of 100 mV.
4
www.xilinx.com
1-800-255-7778
DS083-2 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Functional Description
8B/10B table but has an incorrect disparity. An out-of-band
error is the reception of a 10-bit character that does not
exist within the 8B/10B table. It is possible to obtain an
out-of-band error without having a disparity error. The
proper disparity is always computed for both legal and ille-
gal characters. The current running disparity is available at
the RXRUNDISP signal.
Receiver
Deserializer
The RocketIO transceiver accepts serial differential data on
its RXP and RXN inputs. The clock/data recovery circuit
extracts the clock and retimes incoming data to this clock. It
uses a fully monolithic PLL requiring no external compo-
nents. The clock/data recovery circuitry extracts both phase
and frequency from the incoming data stream. The recov-
ered clock is presented on output RXRECCLK at 1/20 of the
received serial data rate.
The 8B/10B decoder performs a unique operation if
out-of-band data is detected. If out-of-band data is
detected, the decoder signals the error and passes the ille-
gal 10-bits through and places them on the outputs. This
can be used for debugging purposes if desired.
The decoder also signals the reception of one of the 12
valid K-characters. In addition, a programmable comma
detect is included. The comma detect signal registers a
comma on the receipt of any comma+, comma–, or both.
Since the comma is defined as a 7-bit character, this
includes several out-of-band characters. Another option
allows the decoder to detect only the three defined commas
(K28.1, K28.5, and K28.7) as comma+, comma–, or both. In
total, there are six possible options, three for valid commas
and three for "any comma."
The receiver is capable of handling either transition-rich
8B/10B streams or scrambled streams, and can withstand a
string of up to 75 non-transitioning bits without an error.
Word alignment is dependent on the state of comma detect
bits. If comma detect is enabled, the transceiver recognizes
up to two 10-bit preprogrammed characters. Upon detection
of the character or characters, the comma detect output is
driven high and the data is synchronously aligned. If a
comma is detected and the data is aligned, no further align-
ment alteration takes place. If a comma is received and
realignment is necessary, the data is realigned and an indi-
cation is given at the receiver interface. The realignment
indicator is a distinct output.
Note that all bytes (1, 2, or 4) at the RX FPGA interface
each have their own individual 8B/10B indicators (K-char-
acter, disparity error, out-of-band error, current running dis-
parity, and comma detect).
The transceiver continuously monitors the data for the pres-
ence of the 10-bit character(s). Upon each occurrence of a
10-bit character, the data is checked for word alignment. If
comma detect is disabled, the data is not aligned to any par-
ticular pattern. The programmable option allows a user to
align data on comma+, comma–, both, or a unique
user-defined and programmed sequence.
Loopback
In order to facilitate testing without having the need to either
apply patterns or measure data at GHz rates, two program-
mable loop-back features are available.
The receiver can be configured to reverse the RXP and
RXN inputs. This can be useful in the event that printed cir-
cuit board traces have been reversed.
One option, serial loopback, places the gigabit transceiver
into a state where transmit data is directly fed back to the
receiver. An important point to note is that the feedback
path is at the output pads of the transmitter. This tests the
entirety of the transmitter and receiver.
Receiver Termination
On-chip termination is provided at the receiver, eliminating
the need for external termination. The receiver includes pro-
grammable on-chip termination circuitry for 50Ω (default) or
75Ω impedance.
The second option, parallel loopback, checks the digital cir-
cuitry. When parallel loopback is enabled, the serial loop-
back path is disabled. However, the transmitter outputs
remain active, and data can be transmitted. If TXINHIBIT is
asserted, TXP is forced to 0 until TXINHIBIT is de-asserted.
8B/10B Decoder
An optional 8B/10B decoder is included. A programmable
option allows the decoder to be bypassed. When the
8B/10B decoder is bypassed, the 10-bit character order is,
for example,
Elastic and Transmitter Buffers
Both the transmitter and the receiver include buffers
(FIFOs) in the datapath. This section gives the reasons for
including the buffers and outlines their operation.
RXCHARISK[0]
RXRUNDISP[0]
RXDATA[7:0]
(first bit received)
Receiver Buffer
(last bit received is RXDATA[0])
The receiver buffer is required for two reasons:
The decoder uses the same table that is used for Gigabit
Ethernet, Fibre Channel, and InfiniBand. In addition to
decoding all data and K-characters, the decoder has sev-
eral extra features. The decoder separately detects both
“disparity errors” and “out-of-band” errors. A disparity error
is the reception of 10-bit character that exists within the
•
Clock correction to accommodate the slight difference
in frequency between the recovered clock RXRECCLK
and the internal FPGA user clock RXUSRCLK
Channel bonding to allow realignment of the input
stream to ensure proper alignment of data being read
through multiple transceivers
•
DS083-2 (v3.0) December 10, 2003
www.xilinx.com
5
Product Specification
1-800-255-7778
R
Functional Description: RocketIO Multi-Gigabit Transceiver (MGT)
The receiver uses an elastic buffer, where "elastic" refers to
the ability to modify the read pointer for clock correction and
channel bonding.
rects for this by incrementing the read pointer to skip over a
removable byte sequence that need not appear in the final
FPGA fabric byte stream. This is shown in the bottom
buffer, Figure 3, where the solid read pointer increments to
the value represented by the dashed pointer. This acceler-
ates the emptying of the buffer, preventing its overflow. The
transceiver design will skip a single byte sequence when
Clock Correction
Clock RXRECCLK (the recovered clock) reflects the data
rate of the incoming data. Clock RXUSRCLK defines the
rate at which the FPGA fabric consumes the data. Ideally,
these rates are identical. However, since the clocks typi-
cally have different sources, one of the clocks will be faster
than the other. The receiver buffer accommodates this dif-
ference between the clock rates. See Figure 3.
necessary to partially empty
a
buffer. If attribute
CLK_COR_REPEAT_WAIT is 0, the transceiver may also
skip two consecutive removable byte sequences in one
step to further empty the buffer when necessary.
These operations require the clock correction logic to rec-
ognize a byte sequence that can be freely repeated or omit-
ted in the incoming data stream. This sequence is generally
an IDLE sequence, or other sequence comprised of special
values that occur in the gaps separating packets of mean-
ingful data. These gaps are required to occur sufficiently
often to facilitate the timely execution of clock correction.
Read
Write
RXUSRCLK
RXRECCLK
"Nominal" condition: buffer half-full
Write
Read
Channel Bonding
Some gigabit I/O standards such as Infiniband specify the
use of multiple transceivers in parallel for even higher data
rates. Words of data are split into bytes, with each byte sent
over a separate channel (transceiver). See Figure 4.
Buffer less than half -full (emptying)
Repeatable sequence
Read
Write
Buffer more than half-full (filling up)
In Transmitters:
Removable sequence
DS083-2_15_100901
Full word SSSS sent over four channels, one byte per channel
Figure 3: Clock Correction in Receiver
Channel (lane) 0
Channel (lane) 1
Channel (lane) 2
Channel (lane) 3
P Q R S T
P Q R S T
P Q R S T
P Q R S T
Nominally, the buffer is always half full. This is shown in the
top buffer, Figure 3, where the shaded area represents buff-
ered data not yet read. Received data is inserted via the
write pointer under control of RXRECCLK. The FPGA fabric
reads data via the read pointer under control of RXUSR-
CLK. The half full/half empty condition of the buffer gives a
cushion for the differing clock rates. This operation contin-
ues indefinitely, regardless of whether or not "meaningful"
data is being received. When there is no meaningful data to
be received, the incoming data will consist of IDLE charac-
ters or other padding.
In Receivers:
Read
RXUSRCLK
Read
RXUSRCLK
P Q R S T
P Q R S T
P Q R S T
P Q R S T
P Q R S T
P Q R S T
P Q R S T
If RXUSRCLK is faster than RXRECCLK, the buffer
becomes more empty over time. The clock correction logic
corrects for this by decrementing the read pointer to reread
a repeatable byte sequence. This is shown in the middle
buffer, Figure 3, where the solid read pointer decrements to
the value represented by the dashed pointer. By decre-
menting the read pointer instead of incrementing it in the
usual fashion, the buffer is partially refilled. The transceiver
design will repeat a single repeatable byte sequence when
necessary to refill a buffer. If the byte sequence length is
P Q R S T
Before channel bonding
After channel bonding
DS083-2_16_010202
Figure 4: Channel Bonding (Alignment)
The top half of the figure shows the transmission of words
split across four transceivers (channels or lanes). PPPP,
QQQQ, RRRR, SSSS, and TTTT represent words sent
over the four channels.
greater
than
one,
and
if
attribute
CLK_COR_REPEAT_WAIT is 0, then the transceiver may
repeat the same sequence multiple times until the buffer is
refilled to the desired extent.
The bottom-left portion of Figure 4 shows the initial situation
in the FPGA’s receivers at the other end of the four chan-
nels. Due to variations in transmission delay—especially if
the channels are routed through repeaters—the FPGA fab-
Similarly, if RXUSRCLK is slower than RXRECCLK, the
buffer will fill up over time. The clock correction logic cor-
6
www.xilinx.com
1-800-255-7778
DS083-2 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Functional Description
ric might not correctly assemble the bytes into complete
words. The bottom-left illustration shows the incorrect
assembly of data words PQPP, QRQQ, RSRR, and so
forth.
Each of the primitives in Table 2 defines default values for
the configuration attributes, allowing some number of them
to be modified by the user. Refer to the RocketIO Trans-
ceiver User Guide for more details.
To support correction of this misalignment, the data stream
includes special byte sequences that define corresponding
points in the several channels. In the bottom half of
Figure 4, the shaded "P" bytes represent these special
characters. Each receiver recognizes the "P" channel bond-
ing character, and remembers its location in the buffer. At
some point, one transceiver designated as the master
instructs all the transceivers to align to the channel bonding
character "P" (or to some location relative to the channel
bonding character).
After this operation, words transmitted to the FPGA fabric
are properly aligned: RRRR, SSSS, TTTT, and so forth, as
shown in the bottom-right portion of Figure 4. To ensure
that the channels remain properly aligned following the
channel bonding operation, the master transceiver must
also control the clock correction operations described in the
previous section for all channel-bonded transceivers.
Table 2: Supported RocketIO Transceiver Protocol
Primitives
GT_CUSTOM
Fully customizable by user
GT_FIBRE_CHAN_1 Fibre Channel, 1-byte data path
GT_FIBRE_CHAN_2 Fibre Channel, 2-byte data path
GT_FIBRE_CHAN_4 Fibre Channel, 4-byte data path
GT_ETHERNET_1
GT_ETHERNET_2
GT_ETHERNET_4
GT_XAUI_1
Gigabit Ethernet, 1-byte data path
Gigabit Ethernet, 2-byte data path
Gigabit Ethernet, 4-byte data path
10-gigabit Ethernet, 1-byte data path
10-gigabit Ethernet, 2-byte data path
10-gigabit Ethernet, 4-byte data path
Infiniband, 1-byte data path
Infiniband, 2-byte data path
Infiniband, 4-byte data path
1-byte data path
GT_XAUI_2
GT_XAUI_4
GT_INFINIBAND_1
GT_INFINIBAND_2
GT_INFINIBAND_4
GT_AURORA_1(1)
GT_AURORA_2(1)
GT_AURORA_4(1)
Notes:
Transmitter Buffer
The transmitter's buffer write pointer (TXUSRCLK) is fre-
quency-locked to its read pointer (REFCLK). Therefore,
clock correction and channel bonding are not required. The
purpose of the transmitter's buffer is to accommodate a
phase difference between TXUSRCLK and REFCLK. A
simple FIFO suffices for this purpose. A FIFO depth of four
will permit reliable operation with simple detection of over-
flow or underflow, which could occur if the clocks are not
frequency-locked.
2-byte data path
4-byte data path
1. For more information on the Aurora protocol, visit
http://www.xilinx.com.
Reset
CRC
The receiver and transmitter have their own synchronous
reset inputs. The transmitter reset recenters the transmis-
sion FIFO, and resets all transmitter registers and the
8B/10B decoder. The receiver reset recenters the receiver
elastic buffer, and resets all receiver registers and the
8B/10B encoder. Neither reset has any effect on the PLLs.
The RocketIO transceiver CRC logic supports the 32-bit
invariant CRC calculation used by Infiniband, FibreChan-
nel, and Gigabit Ethernet.
On the transmitter side, the CRC logic recognizes where
the CRC bytes should be inserted and replaces four place-
holder bytes at the tail of a data packet with the computed
CRC. For Gigabit Ethernet and FibreChannel, transmitter
CRC may adjust certain trailing bytes to generate the
required running disparity at the end of the packet.
Power
All RocketIO transceivers in the FPGA, whether instantiated
in the design or not, must be connected to power and
ground. Unused transceivers can be powered by any 2.5V
source, and passive filtering is not required.
On the receiver side, the CRC logic verifies the received
CRC value, supporting the same standards as above.
The CRC logic also supports a user mode, with a simple
data packet stucture beginning and ending with
user-defined SOP and EOP characters.
Power Down
The Power Down module is controlled by the transceiver’s
POWERDOWN input pin. The Power Down pin on the
FPGA package has no effect on the transceiver.
Configuration
Power Sequencing
This section outlines functions that can be selected or con-
trolled by configuration. Xilinx implementation software sup-
ports 16 transceiver primitives, as shown in Table 2.
DS083-2 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
7
R
Functional Description: Processor Block
consumption. Specially designed interface logic integrates
the core with the surrounding CLBs, block RAMs, and gen-
eral routing resources. Up to four Processor Blocks can be
available in a single Virtex-II Pro device.
Functional Description: Processor Block
This section briefly describes the interfaces and compo-
nents of the Processor Block. The subsequent section,
Functional Description: Embedded PowerPC 405 Core
beginning on page 10, offers a summary of major PPC405
core features. For an in-depth discussion on both the Pro-
cessor Block and PPC405, see tthe PowerPC Processor
Reference Guide and the PowerPC 405 Processor Block
Reference Guide available on the Xilinx website at
http://www.xilinx.com.
The embedded PPC405 core implements the PowerPC
User Instruction Set Architecture (UISA), user-level regis-
ters, programming model, data types, and addressing
modes for 32-bit fixed-point operations. 64-bit operations,
auxiliary processor operations, and floating-point opera-
tions are trapped and can be emulated in software.
Most of the PPC405 core features are compatible with the
specifications for the PowerPC Virtual Environment
Processor Block Overview
Figure 5 shows the internal architecture of the Processor
Block.
Architecture
(VEA)
and
Operating
Environment
Architecture (OEA). They also provide a number of
optimizations and extensions to the lower layers of the
PowerPC Architecture. The full architecture of the PPC405
is defined by the PowerPC Embedded Environment and
PowerPC UISA documentation, available from IBM.
CPU-FPGA Interfaces
On-Chip Memory (OCM) Controllers
Introduction
The OCM controllers serve as dedicated interfaces
between the block RAMs in the FPGA fabric (see 18 Kb
Block SelectRAM+ Resources, page 35) and OCM signals
available on the embedded PPC405 core. The OCM signals
on the PPC405 core are designed to provide very quick
access to a fixed amount of instruction and data memory
space. The OCM controller provides an interface to both the
64-bit Instruction-Side Block RAM (ISBRAM) and the 32-bit
Data-Side Block RAM (DSBRAM). The designer can
choose to implement:
•
•
•
•
ISBRAM only
DSBRAM only
Both ISBRAM and DSBRAM
No ISBRAM and no DSBRAM
One of OCM’s primary advantages is that it guarantees a
fixed latency of execution for a higher level of determinism.
Additionally, it reduces cache pollution and thrashing, since
the cache remains available for caching code from other
memory resources.
Interface Logic
Processor Block = CPU Core + Interface Logic + CPU-FPGA Interface
DS083-2_03a_060701
Figure 5: Processor Block Architecture
Typical applications for DSOCM include scratch-pad mem-
ory, as well as use of the dual-port feature of block RAM to
enable bidirectional data transfer between processor and
FPGA. Typical applications for ISOCM include storage of
interrupt service routines.
Within the Virtex-II Pro Processor Block, there are four
components:
•
•
•
•
Embedded IBM PowerPC 405-D5 RISC CPU core
On-Chip Memory (OCM) controllers and interfaces
Clock/control interface logic
Functional Features
CPU-FPGA Interfaces
Common Features
•
Separate Instruction and Data memory interface
between processor core and BRAMs in FPGA
Dedicated interface to Device Control Register (DCR)
bus for ISOCM and DSOCM
Embedded PowerPC 405 RISC Core
The PowerPC 405D5 core is a 0.13 µm implementation of
the IBM PowerPC 405D4 core. The advanced process
technology enables the embedded PowerPC 405 (PPC405)
core to operate at 300+ MHz while maintaining low power
•
8
www.xilinx.com
DS083-2 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Functional Description
•
•
Single-cycle and multi-cycle mode option for I-side and
D-side interfaces
Single cycle = one CPU clock cycle;
multi-cycle = minimum of two and maximum of eight
CPU clock cycles
FPGA configurable DCR addresses within DSOCM
and ISOCM.
Independent 16 MB logical memory space available
within PPC405 memory map for each of the DSOCM
and ISOCM. The number of block RAMs in the device
might limit the maximum amount of OCM supported.
Maximum of 64K and 128K bytes addressable from
DSOCM and ISOCM interfaces, respectively, using
address outputs from OCM directly without additional
decoding logic.
CPU-FPGA Interfaces
All Processor Block user pins link up with the general FPGA
routing resources through the CPU-FPGA interface. There-
fore processor signals have the same routability as other
non-Processor Block user signals. Longlines and hex lines
travel across the Processor Block both vertically and hori-
zontally, allowing signals to route through the Processor
Block.
•
•
Processor Local Bus (PLB) Interfaces
The PPC405 core accesses high-speed system resources
through PLB interfaces on the instruction and data cache
controllers. The PLB interfaces provide separate 32-bit
address/64-bit data buses for the instruction and data sides.
•
The cache controllers are both PLB masters. PLB arbiters
are implemented in the FPGA fabric and are available as
soft IP cores.
Data-Side OCM (DSOCM)
•
•
•
32-bit Data Read bus and 32-bit Data Write bus
Byte write access to DSBRAM support
Second port of dual port DSBRAM is available to
read/write from an FPGA interface
Device Control Register (DCR) Bus Interface
The device control register (DCR) bus has 10 bits of
address space for components external to the PPC405
core. Using the DCR bus to manage status and configura-
tion registers reduces PLB traffic and improves system
integrity. System resources on the DCR bus are protected
or isolated from wayward code since the DCR bus is not
part of the system memory map.
•
•
•
22-bit address to DSBRAM port
8-bit DCR Registers: DSCNTL, DSARC
Three alternatives to write into DSBRAM: BRAM
initialization, CPU, FPGA H/W using second port
Instruction-Side OCM (ISOCM)
External Interrupt Controller (EIC) Interface
The ISOCM interface contains a 64-bit read only port, for
instruction fetches, and a 32-bit write only port, to initialize
or test the ISBRAM. When implementing the read only port,
the user must deassert the write port inputs. The preferred
method of initializing the ISBRAM is through the configura-
tion bitstream.
Two level-sensitive user interrupt pins (critical and non-crit-
ical) are available. They can be either driven by user
defined logic or Xilinx soft interrupt controller IP core outside
the Processor Block.
Clock/Power Management (CPM) Interface
•
•
•
•
•
•
64-bit Data Read Only bus (two instructions per cycle)
32-bit Data Write Only bus (through DCR)
Separate 21-bit address to ISBRAM
8-bit DCR Registers: ISCNTL, ISARC
32-bit DCR Registers: ISINIT, ISFILL
The CPM interface supports several methods of clock distri-
bution and power management. Three modes of operation
that reduce power consumption below the normal opera-
tional level are available.
Reset Interface
Two alternatives to write into ISBRAM: BRAM
initialization, DCR and write instruction
There are three user reset input pins (core, chip, and sys-
tem) and three user reset output pins for different levels of
reset, if required.
Clock/Control Interface Logic
The clock/control interface logic provides proper initializa-
tion and connections for PPC405 clock/power manage-
ment, resets, PLB cycle control, and OCM interfaces. It also
couples user signals between the FPGA fabric and the
embedded PPC405 CPU core.
Debug Interface
Debugging interfaces on the embedded PPC405 core, con-
sisting of the JTAG and Trace ports, offer access to
resources internal to the core and assist in software devel-
opment. The JTAG port provides basic JTAG chip testing
functionality as well as the ability for external debug tools to
gain control of the processor for debug purposes. The
Trace port furnishes programmers with a mechanism for
acquiring instruction execution traces.
The processor clock connectivity is similar to CLB clock
pins. It can connect either to global clock nets or general
routing resources. Therefore the processor clock source
can come from DCM, CLB, or user package pin.
The JTAG port complies with IEEE Std 1149.1, which
defines a test access port (TAP) and boundary scan
architecture. Extensions to the JTAG interface provide
DS083-2 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
9
R
Functional Description: Embedded PowerPC 405 Core
debuggers with processor control that includes stopping,
starting, and stepping the PPC405 core. These extensions
are compliant with the IEEE 1149.1 specifications for
vendor-specific extensions.
The CoreConnect architecture provides three buses for
interconnecting Processor Blocks, Xilinx soft IP, third party
IP, and custom logic, as shown in Figure 6:
The Trace port provides instruction execution trace informa-
tion to an external trace tool. The PPC405 core is capable
of back trace and forward trace. Back trace is the tracing of
instructions prior to a debug event while forward trace is the
tracing of instructions after a debug event.
DCR
Bus
System
Core
System
Core
System
Core
Peripheral
Core
Peripheral
Core
Bus
Bridge
Processor Local Bus
Instruction
On-Chip Peripheral Bus
The processor JTAG port and the FPGA JTAG port can be
accessed independently, or the two can be programmati-
cally linked together and accessed via the dedicated FPGA
JTAG pins.
CoreConnect Bus Architecture
Data
Processor
Block
DCR Bus
DS083-2_02a_010202
For detailed information on the PPC405 JTAG interface,
please refer to the "JTAG Interface" section of the PowerPC
405 Processor Block Reference Guide
Figure 6: CoreConnect Block Diagram
•
•
•
Processor Local Bus (PLB)
On-Chip Peripheral Bus (OPB)
Device Control Register (DCR) bus
CoreConnect™ Bus Architecture
The Processor Block is compatible with the CoreConnect™
bus architecture. Any CoreConnect compliant cores includ-
ing Xilinx soft IP can integrate with the Processor Block
through this high-performance bus architecture imple-
mented on FPGA fabric.
High-performance peripherals connect to the high-band-
width, low-latency PLB. Slower peripheral cores connect to
the OPB, which reduces traffic on the PLB, resulting in
greater overall system performance.
For more information, refer to:
http://www-3.ibm.com/chips/techlib/techlib.nfs/product
families/CoreConnect_Bus_Architecture/
Functional Description: Embedded PowerPC 405 Core
This section offers a brief overview of the various functional blocks shown in Figure 7.
PLB Master
Interface
Instruction
OCM
MMU
Fetch & Decode
Timers
3-Element
I-Cache
Array
I-Cache
Controller
(FIT,
PIT,
Watchdog)
Fetch
and
Decode
Logic
Fetch
Queue
(PFB1,
PFB0,
DCD)
Instruction Shadow
TLB
Instruction
Cache
Unit
(4 Entry)
Timers
&
Debug
Unified TLB
(64 Entry)
Cache Units
Data
Cache
Unit
Data Shadow
TLB
Debug Logic
Execution Unit (EXU)
(8 Entry)
D-Cache
Array
D-Cache
Controller
32 x 32
ALU MAC
GPR
Execution Unit
PLB Master
Interface
Data
OCM
JTAG
Instruction
Trace
DS083-2_01_062001
Figure 7: Embedded PPC405 Core Block Diagram
10
www.xilinx.com
DS083-2 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Functional Description
busy with a low-priority request while a subsequent storage
operation requested by the CPU is stalled; the DCU auto-
matically increases the priority of the current request to the
PLB.
Embedded PPC405 Core
The embedded PPC405 core is a 32-bit Harvard architec-
ture processor. Figure 7 illustrates its functional blocks:
•
•
•
•
•
•
Cache units
The DCU provides additional features that allow the pro-
grammer to tailor its performance for a given application.
The DCU can function in write-back or write-through mode,
as controlled by the Data Cache Write-through Register
(DCWR) or the Translation Look-aside Buffer (TLB); the
cache controller can be tuned for a balance of performance
and memory coherency. Write-on-allocate, controlled by
the store word on allocate (SWOA) field of the Core Config-
uration Register 0 (CCR0), can inhibit line fills caused by
store misses, to further reduce potential pipeline stalls and
unwanted external bus traffic.
Memory Management unit
Fetch Decode unit
Execution unit
Timers
Debug logic unit
It operates on instructions in a five stage pipeline consisting
of a fetch, decode, execute, write-back, and load write-back
stage. Most instructions execute in a single cycle, including
loads and stores.
Instruction and Data Cache
Fetch and Decode Logic
The embedded PPC405 core provides an instruction cache
unit (ICU) and a data cache unit (DCU) that allow concur-
rent accesses and minimize pipeline stalls. The instruction
and data cache array are 16 KB each. Both cache units are
two-way set associative. Each way is organized into 256
lines of 32 bytes (eight words). The instruction set provides
a rich assortment of cache control instructions, including
instructions to read tag information and data arrays.
The fetch/decode logic maintains a steady flow of instruc-
tions to the execution unit by placing up to two instructions
in the fetch queue. The fetch queue consists of three buff-
ers: pre-fetch buffer 1 (PFB1), pre-fetch buffer 0 (PFB0),
and decode (DCD). The fetch logic ensures that instructions
proceed directly to decode when the queue is empty.
Static branch prediction as implemented on the PPC405
core takes advantage of some standard statistical proper-
ties of code. Branches with negative address displacement
are by default assumed taken. Branches that do not test the
condition or count registers are also predicted as taken. The
PPC405 core bases branch prediction upon these default
conditions when a branch is not resolved and speculatively
fetches along the predicted path. The default prediction can
be overridden by software at assembly or compile time.
The PPC405 core accesses external memory through the
instruction (ICU) and data cache units (DCU). The cache
units each include a 64-bit PLB master interface, cache
arrays, and a cache controller. The ICU and DCU handle
cache misses as requests over the PLB to another PLB
device such as an external bus interface unit. Cache hits
are handled as single cycle memory accesses to the
instruction and data caches.
Branches are examined in the decode and pre-fetch buffer
0 fetch queue stages. Two branch instructions can be han-
dled simultaneously. If the branch in decode is not taken,
the fetch logic fetches along the predicted path of the
branch instruction in pre-fetch buffer 0. If the branch in
decode is taken, the fetch logic ignores the branch instruc-
tion in pre-fetch buffer 0.
Instruction Cache Unit (ICU)
The ICU provides one or two instructions per cycle to the
instruction queue over a 64-bit bus. A line buffer (built into
the output of the array for manufacturing test) enables the
ICU to be accessed only once for every four instructions, to
reduce power consumption by the array.
The ICU can forward any or all of the four or eight words of
a line fill to the EXU to minimize pipeline stalls caused by
cache misses. The ICU aborts speculative fetches aban-
doned by the EXU, eliminating unnecessary line fills and
enabling the ICU to handle the next EXU fetch. Aborting
abandoned requests also eliminates unnecessary external
bus activity, thereby increasing external bus utilization.
Execution Unit
The embedded PPC405 core has a single issue execution
unit (EXU) containing the register file, arithmetic logic unit
(ALU), and the multiply-accumulate (MAC) unit. The execu-
tion unit performs all 32-bit PowerPC integer instructions in
hardware.
The register file is comprised of thirty-two 32-bit general
purpose registers (GPR), which are accessed with three
read ports and two write ports. During the decode stage,
data is read out of the GPRs and fed to the execution unit.
Likewise, during the write-back stage, results are written to
the GPR. The use of the five ports on the register file
enables either a load or a store operation to execute in par-
allel with an ALU operation.
Data Cache Unit (DCU)
The DCU transfers one, two, three, four, or eight bytes per
cycle, depending on the number of byte enables presented
by the CPU. The DCU contains a single-element command
and store data queue to reduce pipeline stalls; this queue
enables the DCU to independently process load/store and
cache control instructions. Dynamic PLB request prioritiza-
tion reduces pipeline stalls even further. When the DCU is
DS083-2 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
11
R
Functional Description: Embedded PowerPC 405 Core
also help to avoid TLB contention between load/store and
instruction fetch operations. Hardware manages the
replacement and invalidation of shadow-TLB entries; no
system software action is required.
Memory Management Unit (MMU)
The embedded PPC405 core has a 4 GB address space,
which is presented as a flat address space.
The MMU provides address translation, protection func-
tions, and storage attribute control for embedded applica-
tions. The MMU supports demand-paged virtual memory
and other management schemes that require precise con-
trol of logical-to-physical address mapping and flexible
memory protection. Working with appropriate system-level
software, the MMU provides the following functions:
Memory Protection
When address translation is enabled, the translation mech-
anism provides a basic level of protection.
The Zone Protection Register (ZPR) enables the system
software to override the TLB access controls. For example,
the ZPR provides a way to deny read access to application
programs. The ZPR can be used to classify storage by type;
access by type can be changed without manipulating indi-
vidual TLB entries.
•
•
•
Translation of the 4 GB effective address space into
physical addresses
Independent enabling of instruction and data
translation/protection
Page-level access control using the translation
mechanism
The PowerPC Architecture provides WIU0GE (write-back /
write-through, cacheability, user-defined 0, guarded,
endian) storage attributes that control memory accesses,
using bits in the TLB or, when address translation is dis-
abled, storage attribute control registers.
•
•
•
Software control of page replacement strategy
Additional control over protection using zones
Storage attributes for cache policy and speculative
memory access control
When address translation is enabled, storage attribute con-
trol bits in the TLB control the storage attributes associated
with the current page. When address translation is disabled,
bits in each storage attribute control register control the
storage attributes associated with storage regions. Each
storage attribute control register contains 32 fields. Each
field sets the associated storage attribute for a 128 MB
memory region.
The MMU can be disabled under software control. If the
MMU is not used, the PPC405 core provides other storage
control mechanisms.
Translation Look-Aside Buffer (TLB)
The Translation Look-Aside Buffer (TLB) is the hardware
resource that controls translation and protection. It consists
of 64 entries, each specifying a page to be translated. The
TLB is fully associative; a given page entry can be placed
anywhere in the TLB. The translation function of the MMU
occurs pre-cache. Cache tags and indexing use physical
addresses.
Timers
The embedded PPC405 core contains a 64-bit time base
and three timers, as shown in Figure 8:
•
•
•
Programmable Interval Timer (PIT)
Fixed Interval Timer (FIT)
Watchdog Timer (WDT)
Software manages the establishment and replacement of
TLB entries. This gives system software significant flexibility
in implementing a custom page replacement strategy. For
example, to reduce TLB thrashing or translation delays,
software can reserve several TLB entries in the TLB for glo-
bally accessible static mappings. The instruction set pro-
vides several instructions used to manage TLB entries.
These instructions are privileged and require the software
to be executing in supervisor state. Additional TLB instruc-
tions are provided to move TLB entry fields to and from
GPRs.
The time base counter increments either by an internal sig-
nal equal to the CPU clock rate or by a separate external
timer clock signal. No interrupts are generated when the
time base rolls over. The three timers are synchronous with
the time base.
The PIT is a 32-bit register that decrements at the same
rate as the time base is incremented. The user loads the
PIT register with a value to create the desired delay. When
the register reaches zero, the timer stops decrementing and
generates a PIT interrupt. Optionally, the PIT can be pro-
grammed to auto-reload the last value written to the PIT
register, after which the PIT continues to decrement.
The MMU divides logical storage into pages. Eight page
sizes (1 KB, 4 KB, 16 KB, 64 KB, 256 KB, 1 MB, 4 MB, and
16 MB) are simultaneously supported, such that, at any
given time, the TLB can contain entries for any combination
of page sizes. In order for a logical to physical translation to
exist, a valid entry for the page containing the logical
address must be in the TLB. Addresses for which no TLB
entry exists cause TLB-Miss exceptions.
The FIT generates periodic interrupts based on one of four
selectable bits in the time base. When the selected bit
changes from 0 to 1, the PPC405 core generates a FIT
interrupt.
The WDT provides a periodic critical-class interrupt based
on a selected bit in the time base. This interrupt can be used
for system error recovery in the event of software or system
To improve performance, four instruction-side and eight
data-side TLB entries are kept in shadow arrays. The
shadow arrays allow single-cycle address translation and
12
www.xilinx.com
1-800-255-7778
DS083-2 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Functional Description
lockups. Users may select one of four time periods for the
interval and the type of reset generated if the WDT expires
twice without an intervening clear from software. If enabled,
the watchdog timer generates a reset unless an exception
handler updates the WDT status bit before the timer has
completed two of the selected timer intervals.
In internal debug mode, a debug event enables excep-
tion-handling software at a dedicated interrupt vector to
take over the CPU core and communicate with a debug
tool. The debug tool has read-write access to all registers
and can set hardware or software breakpoints. ROM moni-
tors typically use the internal debug mode.
In external debug mode, the CPU core enters stop state
(stops instruction execution) when a debug event occurs.
This mode offers a debug tool read-write access to all reg-
isters in the PPC405 core. Once the CPU core is in stop
state, the debug tool can start the CPU core, step an
instruction, freeze the timers, or set hardware or software
break points. In addition to CPU core control, the debug
logic is capable of writing instructions into the instruction
cache, eliminating the need for external memory during ini-
tial board bring-up. Communication to a debug tool using
external debug mode is through the JTAG port.
Time Base (Incrementer)
TBL (32 bits)
TBU (32 bits)
External
Clock
Source
0
31
0
31
Bit 3 (229 clocks)
Bit 7 (225 clocks)
Bit 11 (221 clocks)
Bit 15 (217 clocks)
WDT Events
Debug wait mode offers the same functionality as external
debug mode with one exception. In debug wait mode, the
CPU core goes into wait state instead of stop state after a
debug event. Wait state is identical to stop state until an
interrupt occurs. In wait state, the PPC405 core can vector
to an exception handler, service an interrupt and return to
wait state. This mode is particularly useful when debugging
real time control systems.
Bit 11 (221 clocks)
Bit 15 (217 clocks)
Bit 19 (213 clocks)
Bit 23 (29 clocks)
FIT Events
PIT (Decrementer)
(32 bits)
Real-time trace debug mode is always enabled. The debug
logic continuously broadcasts instruction trace information
to the trace port. When a debug event occurs, the debug
logic signals an external debug tool to save instruction trace
information before and after the event. The number of
instructions traced depends on the trace tool.
0
31
Zero Detect
PIT Events
DS083-2_06_062001
Figure 8: Relationship of Timer Facilities to Base Clock
Debug events signal the debug logic to stop the CPU core,
put the CPU core in debug wait state, cause a debug excep-
tion or save instruction trace information.
Interrupts
The PPC405 provides an interface to an interrupt controller
that is logically outside the PPC405 core. This controller
combines the asynchronous interrupt inputs and presents
them to the embedded core as a single interrupt signal. The
sources of asynchronous interrupts are external signals, the
JTAG/debug unit, and any implemented peripherals.
Big Endian and Little Endian Support
The embedded PPC405 core supports big endian or little
endian byte ordering for instructions stored in external
memory. Since the PowerPC architecture is big endian
internally, the ICU rearranges the instructions stored as little
endian into the big endian format. Therefore, the instruction
cache always contains instructions in big endian format so
that the byte ordering is correct for the execution unit. This
feature allows the 405 core to be used in systems designed
to function in a little endian environment.
Debug Logic
All architected resources on the embedded PPC405 core
can be accessed through the debug logic. Upon a debug
event, the PPC405 core provides debug information to an
external debug tool. Three different types of tools are sup-
ported depending on the debug mode: ROM monitors,
JTAG debuggers, and instruction trace tools.
DS083-2 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
13
R
Functional Description: FPGA
Functional Description: FPGA
Input/Output Blocks (IOBs)
Table 3: Supported Single-Ended I/O Standards
Virtex-II Pro I/O blocks (IOBs) are provided in groups of two
or four on the perimeter of each device. Each IOB can be
used as input and/or output for single-ended I/Os. Two
IOBs can be used as a differential pair. A differential pair is
always connected to the same switch matrix, as shown in
Figure 9.
Board
Termination
Voltage
I/O
Output
VCCO
Input
VCCO
Input
VREF
Standard
(VTT)
LVTTL(1)
3.3
3.3
3.3
3.3
N/R
N/R
N/R
N/R
N/R
N/R
N/R
N/R
0.8
N/R
N/R
N/R
N/R
N/R
N/R
N/R
N/R
1.2
LVCMOS33(1)
LVCMOS25
LVCMOS18
LVCMOS15
PCI33_3
IOB blocks are designed for high-performance I/O, support-
ing 22 single-ended standards, as well as differential sig-
naling with LVDS, LDT, bus LVDS, and LVPECL.
2.5
2.5
1.8
1.8
1.5
1.5
Note (2)
Note (2)
Note (2)
Note (3)
Note (3)
1.5
Note (2)
Note (2)
Note (2)
Note (3)
Note (3)
N/R
IOB
PAD4
PCI66_3
Differential Pair
IOB
PCI-X
PAD3
GTL
Switch
Matrix
IOB
GTLP
1.0
1.5
PAD2
HSTL_I
0.75
0.75
0.9
0.75
0.75
1.5
Differential Pair
IOB
HSTL_II
1.5
N/R
PAD1
DS083-2_30_010202
HSTL_III
1.5
N/R
Figure 9: Virtex-II Pro Input/Output Tile
HSTL_IV
HSTL_I_18
HSTL_II_18
HSTL_III _18
HSTL_IV_18
SSTL2_I
1.5
N/R
0.9
1.5
Note: Differential I/Os must use the same clock.
1.8
N/R
0.9
0.9
1.8
N/R
0.9
0.9
Supported I/O Standards
1.8
N/R
1.1
1.8
Virtex-II Pro IOB blocks feature SelectIO-Ultra inputs and out-
puts that support a wide variety of I/O signaling standards. In
addition to the internal supply voltage (VCCINT = 1.5V), out-
put driver supply voltage (VCCO) is dependent on the I/O stan-
dard (see Table 3 and Table 4). An auxiliary supply voltage
(VCCAUX = 2.5V) is required, regardless of the I/O standard
used. For exact supply voltage absolute maximum ratings,
see Virtex-II Pro™ Platform FPGAs: DC and Switching
Characteristics (Module 3).
1.8
N/R
1.1
1.8
2.5
N/R
1.25
1.25
0.9
1.25
1.25
0.9
SSTL2_II
SSTL18_I (4)
SSTL18_II
Notes:
2.5
N/R
1.8
N/R
1.8
N/R
0.9
0.9
1. Refer to XAPP659 for more details on interfacing to these 3.3V
standards.
All of the user IOBs have fixed-clamp diodes to VCCO and to
ground. The IOBs are not compatible or compliant with 5V
I/O standards (not 5V-tolerant).
2. For PCI and PCI-X standards, refer to XAPP653.
3.
V
of GTL or GTLP should not be lower than the termination
CCO
voltage or the voltage seen at the I/O pad.
Table 5 lists supported I/O standards with Digitally Con-
trolled Impedance. See Digitally Controlled Impedance
(DCI), page 20.
4. SSTL18_I is not a JEDEC-supported standard.
5. N/R = no requirement.
14
www.xilinx.com
1-800-255-7778
DS083-2 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Functional Description
Table 5: Supported DCI I/O Standards (Continued)
Table 4: Supported Differential Signal I/O Standards
I/O
Standard
Output
VCCO
Input
VCCO
Input
VREF
Termination
Type
I/O
Standard
Output
CCO
Input
CCO
Input
REF
Output
OD
V
V
V
V
LDT_25
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
N/R
N/R
N/R
N/R
N/R
N/R
2.5
N/R
N/R
N/R
N/R
N/R
N/R
N/R
N/R
N/R
0.500 – 0.740
0.247 – 0.454
0.330 – 0.700
0.250 – 0.450
0.500 – 0.740
0.345 – 1.185
0.500 – 0.740
0.247 – 0.454
0.330 – 0.700
LVDS_25_DCI
2.5
2.5
2.5
2.5
N/R
N/R
Split
Split
LVDS_25
LVDSEXT_25_DCI
Notes:
LVDSEXT_25
BLVDS_25
ULVDS_25
LVPECL_25
1. LVDCI_XX is LVCMOS output controlled impedance buffers,
matching all or half of the reference resistors.
2. These are SSTL compatible.
3. SSTL18_I is not a JEDEC-supported standard.
4. N/R = no requirement.
(1)
LDT_25_DT
Logic Resources
(1)
LVDS_25_DT
2.5
IOB blocks include six storage elements, as shown in
Figure 10.
(1
LVDSEXT_25_DT
)
2.5
(1)
ULVDS_25_DT
2.5
2.5
N/R
0.500 – 0.740
IOB
Notes:
1. These standards support on-chip 100Ω termination.
2. N/R = no requirement.
Input
DDR mux
Reg
OCK1
Reg
Table 5: Supported DCI I/O Standards
ICK1
I/O
Output
VCCO
Input
VCCO
Input
VREF
Termination
Type
Reg
Standard
3-State
LVDCI_33(1)
3.3
2.5
2.5
1.8
1.8
1.5
1.5
1.2
1.5
1.5
1.5
1.5
1.5
1.8
1.8
1.8
1.8
2.5
2.5
1.8
1.8
3.3
2.5
2.5
1.8
1.8
1.5
1.5
1.2
1.5
1.5
1.5
1.5
1.5
1.8
1.8
1.8
1.8
2.5
2.5
1.8
1.8
N/R
N/R
N/R
N/R
N/R
N/R
N/R
0.8
Series
Series
Series
Series
Series
Series
Series
Single
Single
Split
OCK2
Reg
ICK2
LVDCI_25
LVDCI_DV2_25
LVDCI_18
DDR mux
Reg
LVDCI_DV2_18
LVDCI_15
OCK1
PAD
LVDCI_DV2_15
GTL_DCI
Reg
Output
OCK2
GTLP_DCI
1.0
DS031_29_100900
HSTL_I_DCI
0.75
0.75
0.9
Figure 10: Virtex-II Pro IOB Block
HSTL_II_DCI
HSTL_III_DCI
HSTL_IV_DCI
HSTL_I_DCI_18
HSTL_II_DCI_18
HSTL_III_DCI_18
HSTL_IV_DCI_18
SSTL2_I_DCI(2)
SSTL2_II_DCI(2)
SSTL18_I_DCI (3)
SSTL18_II_DCI
Split
Single
Single
Split
Each storage element can be configured either as an
edge-triggered D-type flip-flop or as a level-sensitive latch.
On the input, output, and 3-state path, one or two DDR reg-
isters can be used.
0.9
0.9
0.9
Split
Double data rate is directly accomplished by the two regis-
ters on each path, clocked by the rising edges (or falling
edges) from two different clock nets. The two clock signals
are generated by the DCM and must be 180 degrees out of
phase, as shown in Figure 11. There are two input, output,
and 3-state data signals, each being alternately clocked
out.
1.1
Single
Single
Split
1.1
1.25
1.25
0.9
Split
Split
0.9
Split
DS083-2 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
15
R
Functional Description: FPGA
DCM
DCM
0°
180° 0°
FDDR
FDDR
D1
D1
Q1
CLK1
Q1
CLK1
Q
Q
DDR MUX
DDR MUX
D2
D2
Q2
CLK2
Q2
CLK2
DS083-2_26_122001
Figure 11: Double Data Rate Registers
This DDR mechanism can be used to mirror a copy of the
clock on the output. This is useful for propagating a clock
along the data that has an identical delay. It is also useful for
multiple clock generation, where there is a unique clock
driver for every clock load. Virtex-II Pro devices can pro-
duce many copies of a clock with very little skew.
(REV) forces the storage element into the opposite state. The
reset condition predominates over the set condition. The ini-
tial state after configuration or global initialization state is
defined by a separate INIT0 and INIT1 attribute. By default,
the SRLOW attribute forces INIT0, and the SRHIGH attribute
forces INIT1.
For each storage element, the SRHIGH, SRLOW, INIT0,
and INIT1 attributes are independent. Synchronous or
asynchronous set / reset is consistent in an IOB block.
Each group of two registers has a clock enable signal (ICE
for the input registers, OCE for the output registers, and
TCE for the 3-state registers). The clock enable signals are
active High by default. If left unconnected, the clock enable
for that storage element defaults to the active state.
All the control signals have independent polarity. Any
inverter placed on a control input is automatically absorbed.
Each IOB block has common synchronous or asynchro-
nous set and reset (SR and REV signals). Two neighboring
IOBs have a shared routing resource connecting the ICLK
and OTCLK pins on pairs of IOBs. If two adjacent IOBs
using DDR registers do not share the same clock signals on
their clock pins (ICLK1, ICLK2, OTCLK1, and OTCLK2),
one of the clock signals will be unroutable.
Each register or latch, independent of all other registers or
latches, can be configured as follows:
•
•
•
•
•
•
•
No set or reset
Synchronous set
Synchronous reset
Synchronous set and reset
Asynchronous set (preset)
Asynchronous reset (clear)
Asynchronous set and reset (preset and clear)
The IOB pairing is identical to the LVDS IOB pairs. Hence,
the package pin-out table can also be used for pin assign-
ment to avoid conflict.
The synchronous reset overrides a set, and an asynchro-
nous clear overrides a preset.
SR forces the storage element into the state specified by the
SRHIGH or SRLOW attribute. SRHIGH forces a logic 1.
SRLOW forces a logic “0”. When SR is used, a second input
Refer to Figure 12.
16
www.xilinx.com
1-800-255-7778
DS083-2 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Functional Description
(O/T) 1
Attribute
INIT1
INIT0
SRHIGH
SRLOW
FF
LATCH
Q1
D1
(O/T) CE
CE
(O/T) CLK1
CK1
SR REV
SR
Shared
by all
registers
FF1
(OQ or TQ)
DDR MUX
FF2
REV
FF
LATCH
D2
Q2
CE
Attribute
INIT1
INIT0
SRHIGH
SRLOW
(O/T) CLK2
(O/T) 2
CK2
SR REV
Reset Type
SYNC
ASYNC
DS031_25_110300
Figure 12: Register / Latch Configuration in an IOB Block
Input/Output Individual Options
V
CCO
Each device pad has optional pull-up/pull-down resistors
and weak-keeper circuit in the LVTTL, LVCMOS, and PCI
SelectIO-Ultra configurations, as illustrated in Figure 13.
Values of the optional pull-up and pull-down resistors fall
within a range of 40 KΩ to 120 KΩ when VCCO = 2.5V (from
2.38V to 2.63V only). The clamp diodes are always present,
even when power is not.
Clamp
Diode
OBUF
Weak
Keeper
V
CCO
Program
Current
40KΩ –
120KΩ
The optional weak-keeper circuit is connected to each user
I/O pad. When selected, the circuit monitors the voltage on
the pad and weakly drives the pin High or Low. If the pin is
connected to a multiple-source signal, the weak-keeper
holds the signal in its last state if all drivers are disabled.
Maintaining a valid logic level in this way eliminates bus
chatter. An enabled pull-up or pull-down overrides the
weak-keeper circuit.
PAD
V
CCO
40KΩ –
120KΩ
V
= 2.5V
= 1.5V
CCAUX
Program
Delay
V
CCINT
LVCMOS25 sinks and sources current up to 24 mA. The
current is programmable (see Table 6). Drive strength and
slew rate controls for each output driver minimize bus tran-
sients. For LVDCI and LVDCI_DV2 standards, drive
strength and slew rate controls are not available.
DS083-2_07_101801
IBUF
Figure 13: LVTTL, LVCMOS, or PCI SelectIO-Ultra
Standard
DS083-2 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
17
R
Functional Description: FPGA
Table 6: LVCMOS Programmable Currents (Sink and Source)
SelectIO-Ultra
LVTTL
Programmable Current (Worst-Case Guaranteed Minimum)
2 mA
2 mA
2 mA
2 mA
2 mA
4 mA
4 mA
4 mA
4 mA
4 mA
6 mA
6 mA
6 mA
6 mA
6 mA
8 mA
8 mA
8 mA
8 mA
8 mA
12 mA
12 mA
12 mA
12 mA
12 mA
16 mA
16 mA
16 mA
16 mA
16 mA
24 mA
24 mA
24 mA
n/a
LVCMOS33
LVCMOS25
LVCMOS18
LVCMOS15
n/a
Figure 14 shows the SSTL2, SSTL18, and HSTL configura-
tions. HSTL can sink current up to 48 mA. (HSTL IV)
Input Path
The Virtex-II Pro IOB input path routes input signals directly
to internal logic and / or through an optional input flip-flop or
latch, or through the DDR input registers. An optional delay
element at the D-input of the storage element eliminates
pad-to-pad hold time. The delay is matched to the internal
clock-distribution delay of the Virtex-II Pro device, and
when used, assures that the pad-to-pad hold time is zero.
V
CCO
Clamp
Diode
OBUF
Each input buffer can be configured to conform to any of the
low-voltage signaling standards supported. In some of
these standards the input buffer utilizes a user-supplied
threshold voltage, VREF. The need to supply VREF imposes
constraints on which standards can be used in the same
bank. See I/O banking description.
PAD
Output Path
The output path includes a 3-state output buffer that drives
the output signal onto the pad. The output and / or the
3-state signal can be routed to the buffer directly from the
internal logic or through an output / 3-state flip-flop or latch,
or through the DDR output / 3-state registers.
V
V
= 2.5V
= 1.5V
CCAUX
CCINT
V
REF
DS031_24_100900
Figure 14: SSTL or HSTL SelectIO-Ultra Standards
Each output driver can be individually programmed for a
wide range of low-voltage signaling standards. In most sig-
naling standards, the output High voltage depends on an
externally supplied VCCO voltage. The need to supply VCCO
imposes constraints on which standards can be used in the
same bank. See I/O banking description.
All pads are protected against damage from electrostatic
discharge (ESD) and from over-voltage transients.
Virtex-II Pro uses two memory cells to control the configura-
tion of an I/O as an input. This is to reduce the probability of
an I/O configured as an input from flipping to an output
when subjected to a single event upset (SEU) in space
applications.
I/O Banking
Some of the I/O standards described above require VCCO
and VREF voltages. These voltages are externally supplied
and connected to device pins that serve groups of IOB
blocks, called banks. Consequently, restrictions exist about
which I/O standards can be combined within a given bank.
Prior to configuration, all outputs not involved in configura-
tion are forced into their high-impedance state. The
pull-down resistors and the weak-keeper circuits are inac-
tive. The dedicated pin HSWAP_EN controls the pull-up
resistors prior to configuration. By default, HSWAP_EN is
set High, which disables the pull-up resistors on user I/O
pins. When HSWAP_EN is set Low, the pull-up resistors are
activated on user I/O pins.
Eight I/O banks result from dividing each edge of the FPGA
into two banks, as shown in Figure 15 and Figure 16. Each
bank has multiple VCCO pins, all of which must be con-
nected to the same voltage. This voltage is determined by
the output standards in use.
All Virtex-II Pro IOBs (except RocketIO transceiver pins)
support IEEE 1149.1 and IEEE 1532 compatible boundary
scan testing.
18
www.xilinx.com
1-800-255-7778
DS083-2 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Functional Description
All VREF pins for the largest device anticipated must be con-
nected to the VREF voltage and not used for I/O. In smaller
devices, some VCCO pins used in larger devices do not con-
nect within the package. These unconnected pins can be
left unconnected externally, or, if necessary, they can be
connected to VCCO to permit migration to a larger device.
Bank 0
Bank 1
Rules for Combining I/O Standards in the Same
Bank
The following rules must be obeyed to combine different
input, output, and bi-directional standards in the same bank:
1. Combining output standards only. Output standards
with the same output VCCO requirement can be
combined in the same bank.
Bank 5
Bank 4
ug002_c2_014_041403
Compatible example:
SSTL2_I and LVDS_25_DCI outputs
Figure 15: I/O Banks: Wire-Bond Packages (FG) Top
Incompatible example:
View
SSTL2_I (output VCCO = 2.5V) and
LVCMOS33 (output VCCO = 3.3V) outputs
2. Combining input standards only. Input standards
with the same input VCCO and input VREF requirements
can be combined in the same bank.
Bank 1
Bank 0
Compatible example:
LVCMOS15 and HSTL_IV inputs
Incompatible example:
LVCMOS15 (input VCCO = 1.5V) and
LVCMOS18 (input VCCO = 1.8V) inputs
Incompatible example:
HSTL_I_DCI_18 (VREF = 0.9V) and
HSTL_IV_DCI_18 (VREF = 1.1V) inputs
Bank 4
Bank 5
3. Combining input standards and output standards.
Input standards and output standards with the same
input VCCO and output VCCO requirement can be
combined in the same bank.
ds031_66_041403
Figure 16: I/O Banks: Flip-Chip Packages (FF) Top
Compatible example:
View
LVDS_25 output and HSTL_I input
Incompatible example:
Some input standards require a user-supplied threshold
voltage (VREF), and certain user-I/O pins are automatically
configured as VREF inputs. Approximately one in six of the
I/O pins in the bank assume this role.
LVDS_25 output (output VCCO = 2.5V) and
HSTL_I_DCI_18 input (input VCCO = 1.8V)
4. Combining bi-directional standards with input or
output standards. When combining bi-directional I/O
with other standards, make sure the bi-directional
standard can meet rules 1 through 3 above.
VREF pins within a bank are interconnected internally, and
thus only one VREF voltage can be used within each bank.
However, for correct operation, all VREF pins in the bank
must be connected to the external reference voltage
source.
5. Additional rules for combining DCI I/O standards.
a. No more than one Single Termination type (input or
output) is allowed in the same bank.
The VCCO and the VREF pins for each bank appear in the
device pinout tables. Within a given package, the number of
VREF and VCCO pins can vary depending on the size of
device. In larger devices, more I/O pins convert to VREF
pins. Since these are always a superset of the VREF pins
used for smaller devices, it is possible to design a PCB that
permits migration to a larger device if necessary.
Incompatible example:
HSTL_IV_DCI input and HSTL_III_DCI input
b. No more than one Split Termination type (input or
output) is allowed in the same bank.
Incompatible example:
HSTL_I_DCI input and HSTL_II_DCI input
The implementation tools will enforce the above design
rules.
DS083-2 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
19
R
Functional Description: FPGA
Table 7, page 20, summarizes all standards and voltage
supplies.
Table 7: Summary of Voltage Supply Requirements for
All Input and Output Standards (Continued)
V
V
Termination Type
CCO
REF
Table 7: Summary of Voltage Supply Requirements for
All Input and Output Standards
I/O Standard
HSTL_III_18
HSTL_IV_18
HSTL_I_18
HSTL_II_18
SSTL18_I
Output
Input
Input
1.1
1.1
0.9
0.9
0.9
0.9
N/R
N/R
N/R
1.1
1.1
0.9
0.9
0.9
0.9
0.9
0.9
0.75
0.75
N/R
N/R
N/R
1
Output
N/R
Input
N/R
V
V
Termination Type
CCO
REF
I/O Standard
Output
Input
Input
N/R
N/R
N/R
N/R
N/R
N/R
N/R
N/R
N/R
N/R
N/R
N/R
1.25
1.25
N/R
N/R
N/R
N/R
Output
N/R
Input
N/R
N/R
N/R
N/R
N/R
N/R
N/R
N/R
N/R
N/R
N/R
N/R
N/R
N/R
N/R
N/R
N/R
Split
N/R
N/R
(1)
LVTTL
N/R
N/R
Note (3)
(1)
LVCMOS33
N/R
N/R
N/R
(1)
LVDCI_33
Series
N/R
N/R
N/R
3.3
3.3
(2)
PCIX
SSTL18_II
N/R
N/R
(2)
PCI33_3
PCI66_3
N/R
LVCMOS18
LVDCI_18
N/R
N/R
(2)
N/R
1.8
Series
Series
N/R
N/R
LVDS_25
N/R
LVDCI_DV2_18
HSTL_III_DCI_18
HSTL_IV_DCI_18
HSTL_I_DCI_18
HSTL_II_DCI_18
SSTL18_I_DCI
SSTL18_II_DCI
HSTL_III
N/R
LVDSEXT_25
LDT_25
N/R
Single
Single
Split
Split
Split
Split
N/R
N/R
1.8
Single
N/R
ULVDS_25
BLVDS_25
LVPECL_25
SSTL2_I
N/R
Note (3)
N/R
Split
N/R
N/R
N/R
Split
N/R
SSTL2_II
N/R
LVCMOS25
LVDCI_25
N/R
HSTL_IV
N/R
N/R
Note (3)
Series
Series
N/R
HSTL_I
N/R
N/R
2.5
LVDCI_DV2_25
LVDS_25_DCI
HSTL_II
N/R
N/R
LVCMOS15
LVDCI_15
N/R
N/R
LVDSEXT_25_DC
I
Series
Series
Single
N/R
N/R
N/R
N/R
Split
1.5
LVDCI_DV2_15
GTLP_DCI
N/R
2.5
SSTL2_I_DCI
SSTL2_II_DCI
LVDS_25_DT
LVDSEXT_25_DT
LDT_25_DT
1.25
1.25
N/R
N/R
N/R
N/R
N/R
Split
N/R
N/R
N/R
N/R
Split
Split
N/R
N/R
N/R
N/R
Single
Single
Single
Split
Split
Single
N/R
1.5
HSTL_III_DCI
HSTL_IV_DCI
HSTL_I_DCI
HSTL_II_DCI
GTL_DCI
0.9
0.9
0.75
0.75
0.8
1
Single
N/R
Split
Single
N/R
ULVDS_25_DT
1.2
1.2
GTLP
N/R
Note (3)
GTL
0.8
N/R
N/R
Notes:
1. See application note XAPP659 for more detailed information.
2. See application note XAPP653 for more detailed information.
3. Pin voltage must not exceed V
4. N/R = no requirement.
.
CCO
Digitally Controlled Impedance (DCI)
Today’s chip output signals with fast edge rates require ter-
mination to prevent reflections and maintain signal integrity.
High pin count packages (especially ball grid arrays) can
not accommodate external termination resistors.
20
www.xilinx.com
1-800-255-7778
DS083-2 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Functional Description
Virtex-II Pro XCITE DCI provides controlled impedance
drivers and on-chip termination for single-ended and differ-
ential I/Os. This eliminates the need for external resistors
and improves signal integrity. The DCI feature can be used
on any IOB by selecting one of the DCI I/O standards.
match the transmission line impedance (Z0). Virtex-II Pro
input buffers also support LVDCI and LVDCI_DV2 I/O stan-
dards.
IOB
Z
When applied to inputs, DCI provides input parallel termina-
tion. When applied to outputs, DCI provides controlled
impedance drivers (series termination) or output parallel
termination.
Z
0
Virtex-II Pro DCI
V
= 3.3V, 2.5 V, 1.8 V, or 1.5 V
CCO
DS083-2_09_082902
DCI operates independently on each I/O bank. When a DCI
I/O standard is used in a particular I/O bank, external refer-
ence resistors must be connected to two dual-function pins
on the bank. These resistors, voltage reference of N transis-
tor (VRN) and the voltage reference of P transistor (VRP)
are shown in Figure 17.
Figure 18: Internal Series Termination
Table 8: SelectIO-Ultra Controlled Impedance Buffers
VCCO
3.3V
2.5V
1.8V
1.5V
DCI
DCI Half Impedance
N/A
LVDCI_33
LVDCI_25
LVDCI_18
LVDCI_15
LVDCI_DV2_25
LVDCI_DV2_18
LVDCI_DV2_15
1 Bank
DCI
Controlled Impedance Terminations
(Parallel Termination)
DCI
DCI
DCI
DCI also provides on-chip termination for SSTL2, SSTL18,
HSTL (Class I, II, III, or IV), LVDS_25, LVDSEXT_25, and
GTL/GTLP receivers or transmitters on bidirectional lines.
Table 9 and Table 10 list the on-chip parallel terminations
available in Virtex-II Pro devices. VCCO must be set accord-
ing to Table 5. There is a VCCO requirement for GTL_DCI
and GTLP_DCI, due to the on-chip termination resistor.
V
CCO
R
(1%)
(1%)
REF
REF
VRN
VRP
Table 9: SelectIO-Ultra Buffers With On-Chip Parallel
Termination
R
External
On-Chip
GND
I/O Standard
SSTL2 Class I
SSTL2 Class II
SSTL18 Class I
SSTL18 Class II
Termination
Termination
DS031_50_101200
SSTL2_I
SSTL2_II
SSTL18_I
SSTL18_II
HSTL_I
SSTL2_I_DCI(1)
SSTL2_II_DCI(1)
SSTL18_I_DCI
SSTL18_II_DCI
HSTL_I_DCI
Figure 17: DCI in a Virtex-II Pro Bank
When used with a terminated I/O standard, the value of the
resistors are specified by the standard (typically 50Ω).
When used with a controlled impedance driver, the resistors
set the output impedance of the driver within the specified
range (20Ω to 100Ω). For all series and parallel termina-
tions listed in Table 8 and Table 9, the reference resistors
must have the same value for any given bank. One percent
resistors are recommended.
HSTL Class I
HSTL Class II
HSTL Class III
HSTL Class IV
HSTL_I_18
HSTL_II
HSTL_I_DCI_18
HSTL_II_DCI
HSTL_II_18
HSTL_III
HSTL_III_18
HSTL_IV
HSTL_IV_18
GTL
HSTL_II_DCI_18
HSTL_III_DCI
HSTL_III_DCI_18
HSTL_IV_DCI
HSTL_IV_DCI_18
GTL_DCI
The DCI system adjusts the I/O impedance to match the
two external reference resistors, or half of the reference
resistors, and compensates for impedance changes due to
voltage and/or temperature fluctuations. The adjustment is
done by turning parallel transistors in the IOB on or off.
Controlled Impedance Drivers
(Series Termination)
GTL
GTLP
GTLP
GTLP_DCI
DCI can be used to provide a buffer with a controlled output
impedance. It is desirable for this output impedance to
Notes:
1. SSTL compatible.
DS083-2 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
21
R
Functional Description: FPGA
Table 10: SelectIO-Ultra Differential Buffers With
On-Chip Termination
External
I/O Standard
LVDS
Termination
On-Chip Termination
LVDS_25_DCI
LVDS_25
LVDSEXT
LVDSEXT_25
LVDSEXT_25_DCI
22
www.xilinx.com
1-800-255-7778
DS083-2 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Functional Description
Figure 19 provides examples illustrating the use of the HSTL_I_DCI, HSTL_II_DCI, HSTL_III_DCI, and HSTL_IV_DCI I/O
standards. For a complete list, see the Virtex-II Pro Platform FPGA User Guide.
HSTL_I
HSTL_II
HSTL_III
HSTL_IV
V
/2
CCO
V /2
CCO
V
/2
CCO
V
V
V
CCO
CCO
CCO
R
R
R
R
R
R
Conventional
Z
Z
Z
0
Z
0
0
0
V
/2
CCO
V
V
/2
CCO
CCO
V
V
V
CCO
CCO
CCO
DCI Transmit
Conventional
Receive
R
2R
R
R
R
R
Z
Z
0
0
Z
Z
0
0
2R
Virtex-II Pro
DCI
Virtex-II Pro
DCI
Virtex-II Pro
DCI
Virtex-II Pro
DCI
V
V
/2
CCO
V
CCO
CCO
2R
V
V
V
2R
CCO
CCO
R
CCO
R
R
Conventional
Transmit
DCI Receive
R
Z
Z
0
0
Z
Z
0
0
2R
2R
Virtex-II Pro
DCI
Virtex-II Pro
DCI
Virtex-II Pro
DCI
Virtex-II Pro
DCI
V
V
V
CCO
2R
CCO
CCO
2R
V
V
V
CCO
R
CCO
CCO
R
2R
R
DCI Transmit
DCI Receive
Z
Z
0
0
Z
Z
0
0
2R
2R
2R
Virtex-II Pro Virtex-II Pro
DCI DCI
Virtex-II Pro
DCI
Virtex-II Pro
DCI
Virtex-II Pro
DCI
Virtex-II Pro
DCI
V
V
CCO
CCO
2R
V
V
CCO
CCO
2R
R
R
Z
0
Z
0
N/A
Bidirectional
N/A
2R
2R
Virtex-II Pro
DCI
Virtex-II Pro
DCI
Virtex-II Pro
DCI
Virtex-II Pro
DCI
Reference
Resistor
VRN = VRP = R = Z
VRN = VRP = R = Z
VRN = VRP = R = Z
VRN = VRP = R = Z
0
0
0
0
Recommended
50Ω
50Ω
50Ω
50Ω
Z
0
DS083-2_65a_082102
Figure 19: HSTL DCI Usage Examples
Figure 20 provides examples illustrating the use of the SSTL2_I_DCI, SSTL2_II_DCI, SSTL18_I_DCI, and SSTL18_II_DCI
DS083-2 (v3.0) December 10, 2003
www.xilinx.com
23
Product Specification
1-800-255-7778
R
Functional Description: FPGA
I/O standards. For a complete list, see the Virtex-II Pro Platform FPGA User Guide.
SSTL2_I or SSTL18_I
SSTL2_II or SSTL18_II
V
/2
CCO
V
/2
CCO
V
/2
CCO
R
R
R
Z
Conventional
0
Z
0
R/2
R/2
V
/2
CCO
V
V
/2
CCO
CCO
(1)
(1)
25Ω
25Ω
R
DCI Transmit
Conventional
Receive
R
2R
Z
0
Z
0
2R
Virtex-II Pro
DCI
Virtex-II Pro
DCI
V
V
V
CCO/2
CCO
2R
CCO
2R
R
Conventional
Transmit
DCI Receive
Z
Z
0
0
R/2
R/2
2R
2R
Virtex-II Pro
DCI
Virtex-II Pro
DCI
V
V
V
CCO
CCO
CCO
(1)
25Ω
(1)
2R
25Ω
2R
2R
DCI Transmit
DCI Receive
Z
0
Z
0
2R
2R
2R
Virtex-II Pro
DCI
Virtex-II Pro
DCI
Virtex-II Pro
DCI
Virtex-II Pro
DCI
V
V
CCO
CCO
(1)
25Ω
2R
2R
Z
0
Bidirectional
N/A
2R
2R
25Ω
Virtex-II Pro
DCI
Virtex-II Pro
DCI
Reference
Resistor
VRN = VRP = R = Z
VRN = VRP = R = Z
0
0
Recommended
50Ω
50Ω
(2)
Z
0
DS083-2_65b_011603
Notes:
1. The SSTL-compatible 25Ω series resistor is accounted for in the DCI buffer,
and it is not DCI controlled.
2. Z is the recommended PCB trace impedance.
0
Figure 20: SSTL DCI Usage Examples
24
www.xilinx.com
DS083-2 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Functional Description
Figure 21 provides examples illustrating the use of the
LVDS_25_DCI and LVDSEXT_25_DCI I/O standards. For
a complete list, see the Virtex-II Pro Platform FPGA User
Guide.
The on-chip input differential termination in Virtex-II Pro pro-
vides major advantages over the external resistor or the
DCI termination solution:
•
Eliminates the stub at the receiver completely and
therefore greatly improve signal integrity
Consumes less power than DCI termination
Supports LDT (not supported by DCI termination)
Frees up VRP/VRN pins
LVDS_25_DCI and LVDSEXT_25_DCI Receiver
•
•
•
Figure 22 provides examples illustrating the use of the
LVDS_25_DT, LVDSEXT_25_DT, LDT_25_DT, and
ULVDS_25_DT I/O standards. For further details, refer to
Solution Record 17244. Also see the Virtex-II Pro Plat-
form FPGA User Guide for more design information.
Z
0
2R
Conventional
Z
LVDS_25_DT, LVDSEXT_25_DT,
0
LDT_25_DT, and ULVDS_25_DT Receiver
Virtex-II Pro
LVDS
Z
0
0
V
CCO
2R
2R
2R
Conventional
Z
Z
0
Conventional
Transmit
DCI Receive
Z
V
CCO
Virtex-II Pro
LVDS
2R
2R
0
Virtex-II Pro
LVDS DCI
Reference
Resistor
Z
Z
0
VRN = VRP = R = Z
0
Conventional
Transmit,
On-Chip
Differential
Termination
Receive
Recommended
50 Ω
100Ω
Z
0
NOTE: Only LVDS25_DCI is supported (V
= 2.5V only)
CCO
DS083-2_65c_022103
0
Virtex-II Pro
Figure 21: LVDS DCI Usage Examples
LVDS On-Chip
Differential
Termination
On-Chip Differential Termination
Virtex-II Pro provides a true 100Ω differential termination
(DT) across the input differential receiver terminals. The
LVDS_25_DT, LVDSEXT_25_DT, LDT_25_DT, and
ULVDS_25_DT standards support on-chip differential ter-
mination.
Recommended
50 Ω
Z
0
NOTE: Only 2.5V LVDS standards are supported (V
= 2.5V only)
CCO
DS083-2_65e_052703
Figure 22: LVDS Differential Termination Usage
Examples
DS083-2 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
25
R
Functional Description: FPGA
A CLB element comprises 4 similar slices, with fast local
feedback within the CLB. The four slices are split in two col-
umns of two slices with two independent carry logic chains
and one common shift chain.
Configurable Logic Blocks (CLBs)
The Virtex-II Pro configurable logic blocks (CLB) are orga-
nized in an array and are used to build combinatorial and
synchronous logic designs. Each CLB element is tied to a
switch matrix to access the general routing matrix, as
shown in Figure 23.
Slice Description
Each slice includes two 4-input function generators, carry
logic, arithmetic logic gates, wide function multiplexers and
two storage elements. As shown in Figure 24, each 4-input
function generator is programmable as a 4-input LUT, 16
bits of distributed SelectRAM+ memory, or a 16-bit vari-
able-tap shift register element.
COUT
TBUF
TBUF
Slice
X1Y1
Slice
X1Y0
COUT
Switch
ORCY
RAM16
Matrix
SHIFT
CIN
Slice
X0Y1
MUXFx
SRL16
Slice
Fast
Register/
Latch
CY
LUT
G
X0Y0
Connects
to neighbors
RAM16
CIN
DS083-2_32_122001
MUXF5
CY
Figure 23: Virtex-II Pro CLB Element
SRL16
Register/
Latch
LUT
F
Arithmetic Logic
DS083-2_31_122001
Figure 24: Virtex-II Pro Slice Configuration
26
www.xilinx.com
1-800-255-7778
DS083-2 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Functional Description
The output from the function generator in each slice drives both the slice output and the D input of the storage element.
Figure 25 shows a more detailed view of a single slice.
COUT
SHIFTIN
ORCY
SOPIN
SOPOUT
YB
0
Dual-Port
Shift-Reg
YBMUX
MUXCY
1
A4
A3
A2
A1
WG4
WG3
WG2
WG1
G4
G3
G2
1
0
LUT
RAM
ROM
G1
D
GYMUX
WG4
WG3
WG2
WG1
Y
G
DY
MC15
DI
XORG
FF
LATCH
WS
ALTDIG
DYMUX
CE
D
Q
G2
PROD
G1
Q
Y
MULTAND
CE
CLK CK
CYOG
BY
1
0
SR REV
BY
SLICEWE[2:0]
WSG
SR
SHIFTOUT
WE[2:0]
WE
DIG
CLK
MUXCY
1
0
WSF
CE
CLK
SR
Shared between
x & y Registers
CIN
DS031_01_112502
Figure 25: Virtex-II Pro Slice (Top Half)
In addition to the basic LUTs, the Virtex-II Pro slice contains
logic (MUXF5 and MUXFX multiplexers) that combines
function generators to provide any function of five, six,
seven, or eight inputs. The MUXFX is either MUXF6,
MUXF7, or MUXF8 according to the slice considered in the
CLB. Selected functions up to nine inputs (MUXF5 multi-
plexer) can be implemented in one slice. The MUXFX can
also be a MUXF6, MUXF7, or MUXF8 multiplexer to map
any function of six, seven, or eight inputs and selected wide
logic functions.
Configurations
Look-Up Table
Virtex-II Pro function generators are implemented as
4-input look-up tables (LUTs). Four independent inputs are
provided to each of the two function generators in a slice (F
and G). These function generators are each capable of
implementing any arbitrarily defined boolean function of four
inputs. The propagation delay is therefore independent of
the function implemented. Signals from the function gener-
ators can exit the slice (X or Y output), can input the XOR
dedicated gate (see arithmetic logic), or input the carry-logic
multiplexer (see fast look-ahead carry logic), or feed the D
input of the storage element, or go to the MUXF5 (not
shown in Figure 25).
Register/Latch
The storage elements in a Virtex-II Pro slice can be config-
ured either as edge-triggered D-type flip-flops or as
level-sensitive latches. The D input can be directly driven by
DS083-2 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
27
R
Functional Description: FPGA
the X or Y output via the DX or DY input, or by the slice
inputs bypassing the function generators via the BX or BY
input. The clock enable signal (CE) is active High by default.
If left unconnected, the clock enable for that storage ele-
ment defaults to the active state.
•
•
•
•
•
•
•
No set or reset
Synchronous set
Synchronous reset
Synchronous set and reset
Asynchronous set (preset)
Asynchronous reset (clear)
Asynchronous set and reset (preset and clear)
In addition to clock (CK) and clock enable (CE) signals,
each slice has set and reset signals (SR and BY slice
inputs). SR forces the storage element into the state speci-
fied by the attribute SRHIGH or SRLOW. SRHIGH forces a
logic 1 when SR is asserted. SRLOW forces a logic 0.
When SR is used, an optional second input (BY) forces the
storage element into the opposite state via the REV pin.
The reset condition is predominant over the set condition.
(See Figure 26.)
The synchronous reset has precedence over a set, and an
asynchronous clear has precedence over a preset.
Distributed SelectRAM+ Memory
Each function generator (LUT) can implement a 16 x 1-bit
synchronous RAM resource called
SelectRAM+ element. SelectRAM+ elements are config-
urable within a CLB to implement the following:
a
distributed
The initial state after configuration or global initial state is
defined by a separate INIT0 and INIT1 attribute. By default,
setting the SRLOW attribute sets INIT0, and setting the
SRHIGH attribute sets INIT1.
•
•
•
•
•
•
•
Single-Port 16 x 8-bit RAM
Single-Port 32 x 4-bit RAM
Single-Port 64 x 2-bit RAM
Single-Port 128 x 1-bit RAM
Dual-Port 16 x 4-bit RAM
Dual-Port 32 x 2-bit RAM
Dual-Port 64 x 1-bit RAM
For each slice, set and reset can be set to be synchronous
or asynchronous. Virtex-II Pro devices also have the ability
to set INIT0 and INIT1 independent of SRHIGH and
SRLOW.
The control signals clock (CLK), clock enable (CE) and
set/reset (SR) are common to both storage elements in one
slice. All of the control signals have independent polarity. Any
inverter placed on a control input is automatically absorbed.
Distributed SelectRAM+ memory modules are synchronous
(write) resources. The combinatorial read access time is
extremely fast, while the synchronous write simplifies
high-speed designs. A synchronous read can be imple-
mented with a storage element in the same slice. The dis-
tributed SelectRAM+ memory and the storage element
share the same clock input. A Write Enable (WE) input is
active High, and is driven by the SR input.
FFY
FF
LATCH
DY
YQ
Attribute
D
Q
Table 11 shows the number of LUTs (2 per slice) occupied
by each distributed SelectRAM+ configuration.
CE
CK
SR REV
INIT1
INIT0
SRHIGH
SRLOW
Table 11: Distributed SelectRAM+ Configurations
RAM
Number of LUTs
BY
16 x 1S
16 x 1D
32 x 1S
32 x 1D
64 x 1S
64 x 1D
128 x 1S
1
2
2
4
4
8
8
FFX
FF
LATCH
DX
D
XQ
Q
Attribute
CE
CLK
SR
CE
CK
INIT1
INIT0
SRHIGH
SRLOW
SR REV
Reset Type
BX
SYNC
ASYNC
Notes:
1. S = single-port configuration; D = dual-port configuration
DS083-2_22_122001
For single-port configurations, distributed SelectRAM+
memory has one address port for synchronous writes and
asynchronous reads.
Figure 26: Register / Latch Configuration in a Slice
The set and reset functionality of a register or a latch can be
configured as follows:
For dual-port configurations, distributed SelectRAM+ mem-
ory has one port for synchronous writes and asynchronous
28
www.xilinx.com
1-800-255-7778
DS083-2 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Functional Description
reads and another port for asynchronous reads. The func-
tion generator (LUT) has separated read address inputs
(A1, A2, A3, A4) and write address inputs (WG1/WF1,
WG2/WF2, WG3/WF3, WG4/WF4).
RAM 16x1D
dual_port
In single-port mode, read and write addresses share the
same address bus. In dual-port mode, one function genera-
tor (R/W port) is connected with shared read and write
addresses. The second function generator has the A inputs
(read) connected to the second read-only port address and
the W inputs (write) shared with the first read/write port
address.
RAM
4
DPRA[3:0]
A[3:0]
G[4:1]
DPO
D
4
WG[4:1]
WS
DI
(BY)
D
WSG
Figure 27, Figure 28, and Figure 29 illustrate various exam-
ple configurations.
WE
CK
RAM 16x1S
dual_port
RAM
4
A[3:0]
G[4:1]
SPO
D
RAM
4
WG[4:1]
WS
Output
D
A[3:0]
D
A[4:1]
4
DI
WG[4:1]
Registered
Output
D
Q
WS
DI
(BY)
WSG
(optional)
(SR)
WSG
WE
WCLK
WE
CK
(SR)
WE
CK
WE
WCLK
DS031_04_110100
DS031_02_100900
Figure 29: Dual-Port Distributed SelectRAM+
Figure 27: Distributed SelectRAM+ (RAM16x1S)
(RAM16x1D)
Similar to the RAM configuration, each function generator
(LUT) can implement a 16 x 1-bit ROM. Five configurations
RAM 32x1S
are
available:
ROM16x1,
ROM32x1,
ROM64x1,
(BX)
A[4]
ROM128x1, and ROM256x1. The ROM elements are cas-
cadable to implement wider or/and deeper ROM. ROM con-
tents are loaded at configuration. Table 12 shows the
number of LUTs occupied by each configuration.
RAM
4
D
A[3:0]
G[4:1]
WG[4:1]
WS
DI
(BY)
(SR)
D
WSG
WE0
WE
Table 12: ROM Configuration
Output
WE
WCLK
ROM
16 x 1
32 x 1
64 x 1
128 x 1
256 x 1
Number of LUTs
CK
Registered
Output
D
Q
F5MUX
WSF
1
WS
DI
RAM
2
(optional)
D
4
F[4:1]
WF[4:1]
4
8 (1 CLB)
16 (2 CLBs)
DS083-2_10_050901
Figure 28: Single-Port Distributed SelectRAM+
(RAM32x1S)
DS083-2 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
29
R
Functional Description: FPGA
Shift Registers
Each function generator can also be configured as a 16-bit
shift register. The write operation is synchronous with a
clock input (CLK) and an optional clock enable, as shown in
Figure 30. A dynamic read access is performed through the
4-bit address bus, A[3:0]. The configurable 16-bit shift reg-
ister cannot be set or reset. The read is asynchronous; how-
ever, the storage element or flip-flop is available to
implement a synchronous read. Any of the 16 bits can be
read out asynchronously by varying the address. The stor-
age element should always be used with a constant
address. For example, when building an 8-bit shift register
and configuring the addresses to point to the 7th bit, the 8th
bit can be the flip-flop. The overall system performance is
improved by using the superior clock-to-out of the flip-flops.
1 Shift Chain
in CLB
DI
SRLC16
MC15
D
IN
FF
DI
SRLC16
D
FF
MC15
SLICE S3
SHIFTOUT
SHIFTIN
D
DI
FF
SRLC16
MC15
SRLC16
SHIFTIN
SHIFT-REG
DI
D
FF
4
Output
D
A[3:0]
D(BY)
A[4:1]
SRLC16
MC15
MC15
Registered
Output
SLICE S2
D
Q
DI
WS
SHIFTOUT
(optional)
WSG
SHIFTIN
CE (SR)
CLK
WE
CK
DI
D
FF
FF
SRLC16
MC15
SHIFTOUT
DS031_05_110600
DI
SRLC16
Figure 30: Shift Register Configurations
D
MC15
An additional dedicated connection between shift registers
allows connecting the last bit of one shift register to the first
bit of the next, without using the ordinary LUT output. (See
Figure 31.) Longer shift registers can be built with dynamic
access to any bit in the chain. The shift register chaining
and the MUXF5, MUXF6, and MUXF7 multiplexers allow up
to a 128-bit shift register with addressable access to be
implemented in one CLB.
SLICE S1
SHIFTOUT
FF
SHIFTIN
D
SRLC16
MC15
DI
DI
D
FF
SRLC16
MC15
SLICE S0
CLB
OUT
CASCADABLE OUT
DS031_06_110200
Figure 31: Cascadable Shift Register
30
www.xilinx.com
1-800-255-7778
DS083-2 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Functional Description
Multiplexers
Each Virtex-II Pro slice has one MUXF5 multiplexer and
one MUXFX multiplexer. The MUXFX multiplexer imple-
ments the MUXF6, MUXF7, or MUXF8, as shown in
Figure 32. Each CLB element has two MUXF6 multiplexers,
one MUXF7 multiplexer and one MUXF8 multiplexer.
Examples of multiplexers are shown in the Virtex-II Pro
Platform FPGA User Guide. Any LUT can implement a 2:1
multiplexer.
Virtex-II Pro function generators and associated multiplex-
ers can implement the following:
•
•
•
•
4:1 multiplexer in one slice
8:1 multiplexer in two slices
16:1 multiplexer in one CLB element (4 slices)
32:1 multiplexer in two CLB elements (8 slices)
MUXF8 combines
the two MUXF7 outputs
(Two CLBs)
G
F
Slice S3
MUXF6 combines the two MUXF5
outputs from slices S2 and S3
G
F
Slice S2
MUXF7 combines the two MUXF6
outputs from slices S0 and S2
G
Slice S1
F
MUXF6 combines the two MUXF6
outputs from slices S0 and S1
G
F
Slice S0
CLB
DS031_08_110200
Figure 32: MUXF5 and MUXFX multiplexers
Fast Lookahead Carry Logic
The height of the carry chains is two bits per slice. The carry
chain in the Virtex-II Pro device is running upward. The ded-
icated carry path and carry multiplexer (MUXCY) can also
be used to cascade function generators for implementing
wide logic functions.
Dedicated carry logic provides fast arithmetic addition and
subtraction. The Virtex-II Pro CLB has two separate carry
chains, as shown in the Figure 33.
DS083-2 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
31
R
Functional Description: FPGA
COUT
COUT
to S0 of the next CLB
to CIN of S2 of the next CLB
MUXCY
FF
O
O
I
I
LUT
LUT
(First Carry Chain)
SLICE S3
MUXCY
FF
CIN
COUT
MUXCY
O
O
I
I
FF
FF
LUT
LUT
SLICE S2
MUXCY
MUXCY
FF
O
I
I
LUT
SLICE S1
MUXCY
FF
O
LUT
CIN
COUT
(Second Carry Chain)
MUXCY
FF
O
I
I
LUT
SLICE S0
MUXCY
FF
O
LUT
CIN
CIN
CLB
DS031_07_110200
Figure 33: Fast Carry Logic Path
Arithmetic Logic
a dedicated AND (MULT_AND) gate (shown in Figure 25)
improves the efficiency of multiplier implementation.
The arithmetic logic includes an XOR gate that allows a
2-bit full adder to be implemented within a slice. In addition,
32
www.xilinx.com
1-800-255-7778
DS083-2 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Functional Description
implementing large, flexible SOP chains. One input of each
ORCY is connected through the fast SOP chain to the output
of the previous ORCY in the same slice row. The second input
is connected to the output of the top MUXCY in the same slice,
as shown in Figure 34.
Sum of Products
Each Virtex-II Pro slice has a dedicated OR gate named
ORCY, ORing together outputs from the slices carryout and
the ORCY from an adjacent slice. The ORCY gate with the
dedicated Sum of Products (SOP) chain are designed for
ORCY
ORCY
ORCY
ORCY
SOP
4
4
4
4
4
4
4
4
LUT
LUT
LUT
LUT
LUT
LUT
LUT
LUT
MUXCY
MUXCY
MUXCY
MUXCY
Slice 1
Slice 3
Slice 1
Slice 3
MUXCY
MUXCY
MUXCY
MUXCY
4
4
4
4
4
4
4
4
LUT
LUT
LUT
LUT
LUT
LUT
LUT
LUT
MUXCY
MUXCY
MUXCY
MUXCY
Slice 0
Slice 2
Slice 0
Slice 2
MUXCY
V
MUXCY
V
MUXCY
V
MUXCY
V
CC
CC
CC
CC
CLB
CLB
ds031_64_110300
Figure 34: Horizontal Cascade Chain
LUTs and MUXCYs can implement large AND gates or
other combinatorial logic functions. Figure 35 illustrates
LUT and MUXCY resources configured as a 16-input AND
gate.
OUT
4
MUXCY
0
1
1
LUT
“0”
Slice
4
MUXCY
0
LUT
“0”
16
AND
OUT
4
MUXCY
0
1
1
LUT
“0”
Slice
4
MUXCY
0
LUT
VCC
DS031_41_110600
Figure 35: Wide-Input AND Gate (16 Inputs)
DS083-2 (v3.0) December 10, 2003
www.xilinx.com
33
Product Specification
1-800-255-7778
R
Functional Description: FPGA
Locations / Organization
3-State Buffers
Four horizontal routing resources per CLB are provided for
on-chip 3-state buses. Each 3-state buffer has access alter-
nately to two horizontal lines, which can be partitioned as
shown in Figure 37. The switch matrices corresponding to
SelectRAM+ memory and multiplier or I/O blocks are
skipped.
Introduction
Each Virtex-II Pro CLB contains two 3-state drivers
(TBUFs) that can drive on-chip buses. Each 3-state buffer
has its own 3-state control pin and its own input pin.
Each of the four slices have access to the two 3-state buff-
ers through the switch matrix, as shown in Figure 36.
TBUFs in neighboring CLBs can access slice outputs by
direct connects. The outputs of the 3-state buffers drive hor-
izontal routing resources used to implement 3-state buses.
Number of 3-State Buffers
Table 13 shows the number of 3-state buffers available in
each Virtex-II Pro device. The number of 3-state buffers is
twice the number of CLB elements.
Table 13: Virtex-II Pro 3-State Buffers
TBUF
3-State Buffers
per Row
Total Number
of 3-State Buffers
TBUF
Device
XC2VP2
Slice
S3
44
44
704
Switch
Matrix
Slice
S2
XC2VP4
1,760
2,720
5,152
6,848
9,696
11,808
16,544
22,048
27,808
Slice
S1
XC2VP7
68
XC2VP20
XC2VP30
XC2VP40
XC2VP50
XC2VP70
XC2VP100
XC2VP125
92
Slice
S0
92
116
140
164
188
212
DS031_37_060700
Figure 36: Virtex-II Pro 3-State Buffers
The 3-state buffer logic is implemented using AND-OR logic
rather than 3-state drivers, so that timing is more predict-
able and less load dependant especially with larger
devices.
3 - state lines
Programmable
connection
Switch
matrix
CLB-II
Switch
matrix
CLB-II
DS031_09_032700
Figure 37: 3-State Buffer Connection to Horizontal Lines
mented in one of the configurations listed. Table 15 shows
the available resources in all CLBs.
CLB/Slice Configurations
Table 14 summarizes the logic resources in one CLB. All of
the CLBs are identical and each CLB or slice can be imple-
Table 14: Logic Resources in One CLB
Arithmetic &
SOP
Distributed
Shift
Slices
LUTs
Flip-Flops MULT_ANDs Carry-Chains Chains SelectRAM+ Registers TBUF
4
8
8
8
2
2
128 bits
128 bits
2
34
www.xilinx.com
DS083-2 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Functional Description
Table 15: Virtex-II Pro Logic Resources Available in All CLBs
Max Distributed
SelectRAM+ or
Shift Register
(bits)
CLB Array: Number
Number
of SOP
Row x
of
Number
of LUTs
Numberof
Number of
Device
XC2VP2
Column
Slices
Flip-Flops Carry Chains(1) Chains(1)
16 x 22
40 x 22
40 x 34
56 x 46
80 x 46
88 x 58
88 x 70
104 x 82
120 x 94
136 x 106
1,408
3,008
2,816
6,016
45,056
96,256
2,816
6,016
44
44
32
80
XC2VP4
XC2VP7
4,928
9,856
157,696
296,960
438,272
620,544
755,712
1,058,816
1,411,072
1,779,712
9,856
68
80
XC2VP20
XC2VP30
XC2VP40
XC2VP50
XC2VP70
XC2VP100
XC2VP125
Notes:
9,280
18,560
27,392
38,784
47,232
66,176
88,192
111,232
18,560
27,392
38,784
47,232
66,176
88,192
111,232
92
112
160
176
176
208
240
272
13,696
19,392
23,616
33,088
44,096
55,616
92
116
140
164
188
212
1. The carry-chains and SOP chains can be split or cascaded.
tions for single- and dual-port modes are shown in
Table 16.
18 Kb Block SelectRAM+ Resources
Introduction
Table 16: Dual- and Single-Port Configurations
Virtex-II Pro devices incorporate large amounts of 18 Kb
block SelectRAM+ resources. These complement the dis-
tributed SelectRAM+ resources that provide shallow RAM
structures implemented in CLBs. Each Virtex-II Pro block
SelectRAM+ resource is an 18 Kb true dual-port RAM with
two independently clocked and independently controlled
synchronous ports that access a common storage area.
Both ports are functionally identical. CLK, EN, WE, and
SSR polarities are defined through configuration.
16K x 1 bit
8K x 2 bits
4K x 4 bits
2K x 9 bits
1K x 18 bits
512 x 36 bits
Single-Port Configuration
As a single-port RAM, the block SelectRAM+ has access to
the 18 Kb memory locations in any of the 2K x 9-bit,
1K x 18-bit, or 512 x 36-bit configurations and to 16 Kb
memory locations in any of the 16K x 1-bit, 8K x 2-bit, or
4K x 4-bit configurations. The advantage of the 9-bit, 18-bit
and 36-bit widths is the ability to store a parity bit for each
eight bits. Parity bits must be generated or checked exter-
nally in user logic. In such cases, the width is viewed as
8 + 1, 16 + 2, or 32 + 4. These extra parity bits are stored
and behave exactly as the other bits, including the timing
parameters. Video applications can use the 9-bit ratio of
Virtex-II Pro block SelectRAM+ memory to advantage.
Each port has the following types of inputs: Clock and Clock
Enable, Write Enable, Set/Reset, and Address, as well as
separate Data/parity data inputs (for write) and Data/parity
data outputs (for read).
Operation is synchronous; the block SelectRAM+ behaves
like a register. Control, address and data inputs must (and
need only) be valid during the set-up time window prior to a
rising (or falling, a configuration option) clock edge. Data
outputs change as a result of the same clock edge.
Configuration
Each block SelectRAM+ cell is a fully synchronous memory
as illustrated in Figure 38. Input data bus and output data
bus widths are identical.
Virtex-II Pro block SelectRAM+ supports various configura-
tions, including single- and dual-port RAM and various
data/address aspect ratios. Supported memory configura-
DS083-2 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
35
R
Functional Description: FPGA
Dual-Port Configuration
18-Kbit Block SelectRAM
As a dual-port RAM, each port of block SelectRAM+ has
access to a common 18 Kb memory resource. These are
fully synchronous ports with independent control signals for
each port. The data widths of the two ports can be config-
ured independently, providing built-in bus-width conversion.
DI
DIP
ADDR
WE
EN
Table 17 illustrates the different configurations available on
ports A and B.
SSR
CLK
DO
DOP
If both ports are configured in either 2K x 9-bit, 1K x 18-bit,
or 512 x 36-bit configurations, the 18 Kb block is accessible
from port A or B. If both ports are configured in either 16K x
1-bit, 8K x 2-bit. or 4K x 4-bit configurations, the 16 K-bit
block is accessible from Port A or Port B. All other configu-
rations result in one port having access to an 18 Kb memory
block and the other port having access to a 16 K-bit subset
of the memory block equal to 16 Kbs.
DS031_10_102000
Figure 38: 18 Kb Block SelectRAM+ Memory in
Single-Port Mode
Table 17: Dual-Port Mode Configurations
Port A
Port B
Port A
Port B
Port A
Port B
Port A
Port B
Port A
Port B
Port A
Port B
16K x 1
16K x 1
8K x 2
16K x 1
8K x 2
16K x 1
4K x 4
16K x 1
2K x 9
16K x 1
1K x 18
8K x 2
16K x 1
512 x 36
8K x 2
8K x 2
8K x 2
8K x 2
4K x 4
2K x 9
1K x 18
4K x 4
512 x 36
4K x 4
4K x 4
4K x 4
4K x 4
2K x 9
1K x 18
2K x 9
512 x 36
2K x 9
2K x 9
2K x 9
1K x 18
1K x 18
512 x 36
512 x 36
1K x 18
1K x 18
512 x 36
512 x 36
36
www.xilinx.com
DS083-2 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Functional Description
Each block SelectRAM+ cell is a fully synchronous memory,
as illustrated in Figure 39. The two ports have independent
inputs and outputs and are independently clocked.
ing or falling clock edge causes the data to be loaded into
the memory cell addressed.
A write operation performs a simultaneous read operation.
Three different options are available, selected by configura-
tion:
18-Kbit Block SelectRAM
DIA
1. WRITE_FIRST
DIPA
ADDRA
The WRITE_FIRST option is a transparent mode. The
same clock edge that writes the data input (DI) into the
memory also transfers DI into the output registers DO,
as shown in Figure 40.
WEA
ENA
SSRA
CLKA
DOA
DOPA
Internal
Memory
DIB
DO
Data_in
Data_out = Data_in
DI
DIPB
ADDRB
WEB
ENB
CLK
WE
SSRB
CLKB
DOB
DOPB
Data_in
New
DS031_11_102000
Address
aa
Figure 39: 18 Kb Block SelectRAM+ in Dual-Port Mode
RAM Contents
Data_out
Old
New
New
Port Aspect Ratios
Table 18 shows the depth and the width aspect ratios for the
18 Kb block SelectRAM+ resource. Virtex-II Pro block
SelectRAM+ also includes dedicated routing resources to
provide an efficient interface with CLBs, block SelectRAM+,
and multipliers.
DS083-2_14_050901
Figure 40: WRITE_FIRST Mode
2. READ_FIRST
The READ_FIRST option is a read-before-write mode.
Table 18: 18 Kb Block SelectRAM+ Port Aspect Ratio
The same clock edge that writes data input (DI) into the
memory also transfers the prior content of the memory cell
addressed into the data output registers DO, as shown in
Figure 41.
Width
Depth
16,384
8,192
4,096
2,048
1,024
512
Address Bus
ADDR[13:0]
ADDR[12:0]
ADDR[11:0]
ADDR[10:0]
ADDR[9:0]
Data Bus
DATA[0]
Parity Bus
N/A
1
2
DATA[1:0]
DATA[3:0]
DATA[7:0]
DATA[15:0]
DATA[31:0]
N/A
4
N/A
Internal
Memory
9
Parity[0]
Parity[1:0]
Parity[3:0]
DO
Data_in
Prior stored data
DI
18
36
ADDR[8:0]
CLK
WE
Read/Write Operations
Data_in
New
The Virtex-II Pro block SelectRAM+ read operation is fully
synchronous. An address is presented, and the read opera-
tion is enabled by control signal ENA or ENB. Then,
depending on clock polarity, a rising or falling clock edge
causes the stored data to be loaded into output registers.
Address
aa
RAM Contents
Data_out
Old
New
Old
The write operation is also fully synchronous. Data and
address are presented, and the write operation is enabled
by control signals WEA and WEB in addition to ENA or
ENB. Then, again depending on the clock input mode, a ris-
DS083-2_13_050901
Figure 41: READ_FIRST Mode
DS083-2 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
37
R
Functional Description: FPGA
3. NO_CHANGE
Table 20: Virtex-II Pro SelectRAM+ Memory Available
The NO_CHANGE option maintains the content of the out-
put registers, regardless of the write operation. The clock
edge during the write mode has no effect on the content of
the data output register DO. When the port is configured as
NO_CHANGE, only a read operation loads a new value in
the output register DO, as shown in Figure 42.
Total SelectRAM+ Memory
Device
XC2VP2
Columns Blocks in Kb
in Bits
221,184
4
4
12
28
216
504
XC2VP4
516,096
XC2VP7
6
44
792
811,008
Internal
Memory
XC2VP20
XC2VP30
XC2VP40
XC2VP50
XC2VP70
XC2VP100
XC2VP125
8
88
1,584
2,448
3,456
4,176
5,904
7,992
1,622,016
2,506,752
3,538,944
4,276,224
6,045,696
8,183,808
DO
Data_in
No change during write
DI
8
136
192
232
328
444
556
10
12
14
16
18
CLK
WE
Data_in
Address
New
aa
10,008 10,248,192
RAM Contents
Data_out
Old
New
Figure 43 shows the layout of the block RAM columns in the
XC2VP4 device.
Last Read Cycle Content (no change)
DS083-2_12_050901
RocketIOTM
Serial Transceivers
Figure 42: NO_CHANGE Mode
Control Pins and Attributes
DCM
DCM
Virtex-II Pro SelectRAM+ memory has two independent
ports with the control signals described in Table 19. All con-
trol inputs including the clock have an optional inversion.
BRAM
Multiplier
Blocks
CLBs
Table 19: Control Functions
Control Signal
Function
PPC405
CPU
CLK
EN
Read and Write Clock
CLBs
CLBs
Enable affects Read, Write, Set, Reset
Write Enable
WE
SSR
Set DO register to SRVAL (attribute)
Initial memory content is determined by the INIT_xx
attributes. Separate attributes determine the output register
value after device configuration (INIT) and SSR is asserted
(SRVAL). Both attributes (INIT_B and SRVAL) are available
for each port when a block SelectRAM+ resource is config-
ured as dual-port RAM.
RocketIOTM
DCM
DS083-2_11_010802
DCM
Serial Transceivers
Figure 43: XC2VP4 Block RAM Column Layout
Total Amount of SelectRAM+ Memory
18-Bit x 18-Bit Multipliers
Virtex-II Pro SelectRAM+ memory blocks are organized in
multiple columns. The number of blocks per column
depends on the row size, the number of Processor Blocks,
and the number of RocketIO transceivers.
Introduction
A Virtex-II Pro multiplier block is an 18-bit by 18-bit 2’s com-
plement signed multiplier. Virtex-II Pro devices incorporate
many embedded multiplier blocks. These multipliers can be
associated with an 18 Kb block SelectRAM+ resource or
can be used independently. They are optimized for
high-speed operations and have a lower power consump-
tion compared to an 18-bit x 18-bit multiplier in slices.
Table 20 shows the number of columns as well as the total
amount of block SelectRAM+ memory available for each
Virtex-II Pro device. The 18 Kb SelectRAM+ blocks are
cascadable to implement deeper or wider single- or dual-port
memory resources.
38
www.xilinx.com
1-800-255-7778
DS083-2 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Functional Description
Each SelectRAM+ memory and multiplier block is tied to
four switch matrices, as shown in Figure 44.
Locations / Organization
Multiplier organization is identical to the 18 Kb SelectRAM+
organization, because each multiplier is associated with an
18 Kb block SelectRAM+ resource.
Switch
Matrix
Table 21: Multiplier Resources
Device
XC2VP2
Columns
Total Multipliers
Switch
Matrix
4
4
12
28
XC2VP4
18-Kbit block
SelectRAM
XC2VP7
6
44
Switch
Matrix
XC2VP20
XC2VP30
XC2VP40
XC2VP50
XC2VP70
XC2VP100
XC2VP125
8
88
8
136
192
232
328
444
556
10
12
14
16
18
Switch
Matrix
DS031_33_101000
Figure 44: SelectRAM+ and Multiplier Blocks
Association With Block SelectRAM+ Memory
The interconnect is designed to allow SelectRAM+ memory
and multiplier blocks to be used at the same time, but some
interconnect is shared between the SelectRAM+ and the
multiplier. Thus, SelectRAM+ memory can be used only up
to 18 bits wide when the multiplier is used, because the mul-
tiplier shares inputs with the upper data bits of the
SelectRAM+ memory.
In addition to the built-in multiplier blocks, the CLB elements
have dedicated logic to implement efficient multipliers in
logic. (Refer to Configurable Logic Blocks (CLBs), page 26).
Global Clock Multiplexer Buffers
Virtex-II Pro devices have 16 clock input pins that can also
be used as regular user I/Os. Eight clock pads center on
both the top edge and the bottom edge of the device, as
illustrated in Figure 46.
This sharing of the interconnect is optimized for an
18-bit-wide block SelectRAM+ resource feeding the multi-
plier. The use of SelectRAM+ memory and the multiplier
with an accumulator in LUTs allows for implementation of a
digital signal processor (DSP) multiplier-accumulator
(MAC) function, which is commonly used in finite and infi-
nite impulse response (FIR and IIR) digital filters.
The global clock multiplexer buffer represents the input to
dedicated low-skew clock tree distribution in Virtex-II Pro
devices. Like the clock pads, eight global clock multiplexer
buffers are on the top edge of the device and eight are on
the bottom edge.
Configuration
The multiplier block is an 18-bit by 18-bit signed multiplier
(2's complement). Both A and B are 18-bit-wide inputs, and
the output is 36 bits. Figure 45 shows a multiplier block.
8 clock pads
Multiplier Block
A[17:0]
Virtex-II Pro
Device
MULT 18 x 18
P[35:0]
8 clock pads
B[17:0]
DS031_40_100400
DS083-2_42_052902
Figure 45: Multiplier Block
Figure 46: Virtex-II Pro Clock Pads
DS083-2 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
39
R
Functional Description: FPGA
Each global clock multiplexer buffer can be driven either by
the clock pad to distribute a clock directly to the device, or
by the Digital Clock Manager (DCM), discussed in Digital
Clock Manager (DCM), page 42. Each global clock multi-
plexer buffer can also be driven by local interconnects. The
DCM has clock output(s) that can be connected to global
clock multiplexer buffer inputs, as shown in Figure 47.
Clock
Pad
CLKIN
Local
Interconnect
Clock
Pad
DCM
CLKOUT
Clock Multiplexer
I
Clock
Buffer
O
Clock Distribution
DS083-2_43_122001
Figure 47: Virtex-II Pro Clock Multiplexer Buffer Configuration
Global clock buffers are used to distribute the clock to some
Figure 48 shows clock distribution in Virtex-II Pro devices.
or all synchronous logic elements (such as registers in
CLBs and IOBs, and SelectRAM+ blocks.
In each quadrant, up to eight clocks are organized in clock
rows. A clock row supports up to 16 CLB rows (eight up and
eight down).
Eight global clocks can be used in each quadrant of the
Virtex-II Pro device. Designers should consider the clock
distribution detail of the device prior to pin-locking and floor-
planning. (See the Virtex-II Pro Platform FPGA User
Guide.)
To reduce power consumption, any unused clock branches
remain static.
8 BUFGMUX
NE
NW
8
8
8 BUFGMUX
8
NW
SW
NE
SE
8 max
16 Clocks
16 Clocks
8
SE
8 BUFGMUX
SW
8 BUFGMUX
DS083-2_45_122001
Figure 48: Virtex-II Pro Clock Distribution
40
www.xilinx.com
DS083-2 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Functional Description
Global clocks are driven by dedicated clock buffers (BUFG),
which can also be used to gate the clock (BUFGCE) or to mul-
tiplex between two independent clock inputs (BUFGMUX).
Low time is never shorter than the shortest High or Low time
of either input clock. As long as the presently selected clock
is High, any level change of S has no effect.
The most common configuration option of this element is as
a buffer. A BUFG function in this (global buffer) mode, is
shown in Figure 49.
BUFGMUX
I0
O
BUFG
I1
I
O
S
DS083-2_63_121701
DS031_61_101200
Figure 49: Virtex-II Pro BUFG Function
Figure 51: Virtex-II Pro BUFGMUX Function
If the presently selected clock is Low while S changes, or if
it goes Low after S has changed, the output is kept Low until
the other ("to-be-selected") clock has made a transition
from High to Low. At that instant, the new clock starts driv-
ing the output.
The two clock inputs can be asynchronous with regard to
each other, and the S input can change at any time, except
for a short setup time prior to the rising edge of the presently
selected clock; that is, prior to the rising edge of the
BUFGMUX output O. Violating this setup time requirement
can result in an undefined runt pulse output.
The Virtex-II Pro global clock buffer BUFG can also be con-
figured as a clock enable/disable circuit (Figure 50), as well
as a two-input clock multiplexer (Figure 51). A functional
description of these two options is provided below. Each of
them can be used in either of two modes, selected by con-
figuration: rising clock edge or falling clock edge.
This section describes the rising clock edge option. For the
opposite option, falling clock edge, just change all "rising"
references to "falling" and all "High" references to "Low",
except for the description of the CE and S levels. The rising
clock edge option uses the BUFGCE and BUFGMUX prim-
itives. The falling clock edge option uses the BUFGCE_1
and BUFGMUX_1 primitives.
All Virtex-II Pro devices have 16 global clock multiplexer
buffers.
Figure 52 shows a switchover from CLK0 to CLK1.
BUFGCE
If the CE input is active (High) prior to the incoming rising
clock edge, this Low-to-High-to-Low clock pulse passes
through the clock buffer. Any level change of CE during the
incoming clock High time has no effect.
Wait for Low
S
CLK0
BUFGCE
Switch
CLK1
I
O
Out
CE
DS031_62_101200
Figure 50: Virtex-II Pro BUFGCE Function
DS083-2_46_121701
If the CE input is inactive (Low) prior to the incoming rising
clock edge, the following clock pulse does not pass through
the clock buffer, and the output stays Low. Any level change
of CE during the incoming clock High time has no effect. CE
must not change during a short setup window just prior to
the rising clock edge on the BUFGCE input I. Violating this
setup time requirement can result in an undefined runt pulse
output.
Figure 52: Clock Multiplexer Waveform Diagram
•
•
•
The current clock is CLK0.
S is activated High.
If CLK0 is currently High, the multiplexer waits for
CLK0 to go Low.
•
•
•
Once CLK0 is Low, the multiplexer output stays Low
until CLK1 transitions High to Low.
When CLK1 transitions from High to Low, the output
switches to CLK1.
BUFGMUX
BUFGMUX can switch between two unrelated, even asyn-
chronous clocks. Basically, a Low on S selects the I0 input,
a High on S selects the I1 input. Switching from one clock to
the other is done in such a way that the output High and
No glitches or short pulses can appear on the output.
DS083-2 (v3.0) December 10, 2003
www.xilinx.com
41
Product Specification
1-800-255-7778
R
Functional Description: FPGA
The DCM can be configured to delay the completion of the
Virtex-II Pro configuration process until after the DCM has
achieved lock. This guarantees that the chip does not begin
operating until after the system clocks generated by the
DCM have stabilized.
Local Clocking
In addition to global clocks, there are local clock resources
in the Virtex-II Pro devices. There are more than 72 local
clocks in the Virtex-II Pro family. These resources can be
used for many different applications, including but not lim-
ited to memory interfaces. For example, even using only
the left and right I/O banks, Virtex-II Pro FPGAs can support
up to 50 local clocks for DDR SDRAM. These interfaces can
operate beyond 200 MHz on Virtex-II Pro devices.
The DCM has the following general control signals:
•
•
RST input pin: resets the entire DCM
LOCKED output pin: asserted High when all enabled
DCM circuits have locked.
•
STATUS output pins (active High): shown in Table 22.
Digital Clock Manager (DCM)
The Virtex-II Pro DCM offers a wide range of powerful clock
management features.
Table 22: DCM Status Pins
Status Pin
Function
•
Clock De-skew: The DCM generates new system
clocks (either internally or externally to the FPGA),
which are phase-aligned to the input clock, thus
eliminating clock distribution delays.
0
1
2
3
4
5
6
7
Phase Shift Overflow
CLKIN Stopped
CLKFX Stopped
•
•
Frequency Synthesis: The DCM generates a wide
range of output clock frequencies, performing very
flexible clock multiplication and division.
N/A
N/A
N/A
N/A
N/A
Phase Shifting: The DCM provides both coarse phase
shifting and fine-grained phase shifting with dynamic
phase shift control.
The DCM utilizes fully digital delay lines allowing robust
high-precision control of clock phase and frequency. It also
utilizes fully digital feedback systems, operating dynami-
cally to compensate for temperature and voltage variations
during operation.
Clock De-skew
The DCM de-skews the output clocks relative to the input
clock by automatically adjusting a digital delay line. Addi-
tional delay is introduced so that clock edges arrive at inter-
nal registers and block RAMs simultaneously with the clock
edges arriving at the input clock pad. Alternatively, external
clocks, which are also de-skewed relative to the input clock,
can be generated for board-level routing. All DCM output
clocks are phase-aligned to CLK0 and, therefore, are also
phase-aligned to the input clock.
Up to four of the nine DCM clock outputs can drive inputs to
global clock buffers or global clock multiplexer buffers
simultaneously (see Figure 53). All DCM clock outputs can
simultaneously drive general routing resources, including
routes to output buffers.
DCM
To achieve clock de-skew, the CLKFB input must be con-
nected, and its source must be either CLK0 or CLK2X. Note
that CLKFB must always be connected, unless only the
CLKFX or CLKFX180 outputs are used and de-skew is not
required.
CLK0
CLK90
CLK180
CLKIN
CLKFB
CLK270
CLK2X
RST
Frequency Synthesis
CLK2X180
DSSEN
The DCM provides flexible methods for generating new
clock frequencies. Each method has a different operating
frequency range and different AC characteristics. The
CLK2X and CLK2X180 outputs double the clock frequency.
The CLKDV output creates divided output clocks with divi-
sion options of 1.5, 2, 2.5, 3, 3.5, 4, 4.5, 5, 5.5, 6, 6.5, 7, 7.5,
8, 9, 10, 11, 12, 13, 14, 15, and 16.
CLKDV
PSINCDEC
PSEN
CLKFX
CLKFX180
PSCLK
LOCKED
STATUS[7:0]
PSDONE
clock signal
The CLKFX and CLKFX180 outputs can be used to pro-
duce clocks at the following frequency:
control signal
DS031_67_112900
Figure 53: Digital Clock Manager
FREQCLKFX = (M ⁄ D) • FREQCLKIN
42
www.xilinx.com
1-800-255-7778
DS083-2 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Functional Description
where M and D are two integers. Specifications for M and D
are provided under DCM Timing Parameters in Data
Sheet Module 3. By default, M = 4 and D = 1, which results
in a clock output frequency four times faster than the clock
input frequency (CLKIN).
Phase Shifting
The DCM provides additional control over clock skew
through either coarse or fine-grained phase shifting. The
CLK0, CLK90, CLK180, and CLK270 outputs are each
phase shifted by ¼ of the input clock period relative to each
other, providing coarse phase control. Note that CLK90 and
CLK270 are not available in high-frequency mode.
CLK2X180 is phase shifted 180 degrees relative to CLK2X.
CLKFX180 is phase shifted 180 degrees relative to CLKFX.
All frequency synthesis outputs automatically have 50/50
duty cycles, with the exception of the CLKDV output when
performing a non-integer divide in high-frequency mode.
See Table 23 for more details.
Fine-phase adjustment affects all nine DCM output clocks.
When activated, the phase shift between the rising edges of
CLKIN and CLKFB is a specified fraction of the input clock
period.
Note that CLK2X and CLK2X180 are not available in
high-frequency mode.
In variable mode, the PHASE_SHIFT value can also be
dynamically incremented or decremented as determined by
PSINCDEC synchronously to PSCLK, when the PSEN
input is active. Figure 54 illustrates the effects of fine-phase
shifting. For more information on DCM features, see the
Virtex-II Pro Platform FPGA User Guide.
Table 23: CLKDV Duty Cycle for Non-integer Divides
CLKDV_DIVIDE
Duty Cycle
1/ 3
1.5
2.5
3.5
4.5
5.5
6.5
7.5
Table 24 lists fine-phase shifting control pins, when used in
variable mode.
2 / 5
3 / 7
Table 24: Fine Phase Shifting Control Pins
4 / 9
Control Pin
PSINCDEC
PSEN
Direction
Function
5 / 11
6 / 13
7 / 15
In
In
Increment or decrement
Enable phase shift
Clock for phase shift
Active when completed
PSCLK
In
PSDONE
Out
CLKIN
CLKFB
CLKOUT_PHASE_SHIFT
= NONE
CLKIN
CLKFB
CLKOUT_PHASE_SHIFT
= FIXED
(PS/256) x PERIOD
CLKIN
(PS/256) x PERIOD
(PS positive)
CLKIN
(PS negative)
CLKIN
CLKFB
CLKOUT_PHASE_SHIFT
= VARIABLE
(PS/256) x PERIOD
CLKIN
(PS/256) x PERIOD
CLKIN
(PS negative)
(PS positive)
DS031_48_110300
Figure 54: Fine-Phase Shifting Effects
Two separate components of the phase shift range must be
understood:
Phase Shift (ns) = (PHASE_SHIFT/256) * PERIODCLKIN
The full range of this attribute is always -255 to +255, but its
practical range varies with CLKIN frequency, as con-
strained by the FINE_SHIFT_RANGE component, which rep-
resents the total delay achievable by the phase shift delay
line. Total delay is a function of the number of delay taps
•
•
PHASE_SHIFT attribute range
FINE_SHIFT_RANGE DCM timing parameter range
The PHASE_SHIFT attribute is the numerator in the following
equation:
DS083-2 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
43
R
Functional Description: FPGA
used in the circuit. Across process, voltage, and tempera-
ture, this absolute range is guaranteed to be as specified
under DCM Timing Parameters in Data Sheet Module 3.
•
•
•
If PERIODCLKIN = 2 * FINE_SHIFT_RANGE, then
PHASE_SHIFT in fixed mode is limited to 128, and in
variable mode it is limited to 64.
Absolute range (fixed mode) = FINE_SHIFT_RANGE
Absolute range (variable mode) = FINE_SHIFT_RANGE/2
If PERIODCLKIN = FINE_SHIFT_RANGE, then
PHASE_SHIFT in fixed mode is limited to 255, and in
variable mode it is limited to 128.
The reason for the difference between fixed and variable
modes is as follows. For variable mode to allow symmetric,
dynamic sweeps from -255/256 to +255/256, the DCM sets
the "zero phase skew" point as the middle of the delay line,
thus dividing the total delay line range in half. In fixed mode,
since the PHASE_SHIFT value never changes after configu-
ration, the entire delay line is available for insertion into
either the CLKIN or CLKFB path (to create either positive or
negative skew).
If PERIODCLKIN ≤ 0.5 * FINE_SHIFT_RANGE, then
PHASE_SHIFT is limited to 255 in either mode.
Operating Modes
The frequency ranges of DCM input and output clocks
depend on the operating mode specified, either
low-frequency mode or high-frequency mode, according to
Table 25. For actual values, see Virtex-II Pro Switching
Characteristics (Module 3). The CLK2X, CLK2X180,
Taking both of these components into consideration, the fol-
lowing are some usage examples:
Table 25: DCM Frequency Ranges
Low-Frequency Mode
High-Frequency Mode
Output Clock
CLK0, CLK180
CLKIN Input
CLK Output
CLKIN Input
CLK Output
CLKIN_FREQ_DLL_LF CLKOUT_FREQ_1X_LF CLKIN_FREQ_DLL_HF CLKOUT_FREQ_1X_HF
CLK90, CLK270
CLK2X, CLK2X180
CLKDV
CLKIN_FREQ_DLL_LF CLKOUT_FREQ_1X_LF
CLKIN_FREQ_DLL_LF CLKOUT_FREQ_2X_LF
NA
NA
NA
NA
CLKIN_FREQ_DLL_LF CLKOUT_FREQ_DV_LF CLKIN_FREQ_DLL_HF CLKOUT_FREQ_DV_HF
CLKFX, CLKFX180
CLKIN_FREQ_FX_LF
CLKOUT_FREQ_FX_LF CLKIN_FREQ_FX_HF
CLKOUT_FREQ_FX_HF
CLK90, and CLK270 outputs are not available in high-fre-
quency mode.
As shown in Figure 55, page 45, Virtex-II Pro has fully buff-
ered programmable interconnections, with a number of
resources counted between any two adjacent switch matrix
rows or columns. Fanout has minimal impact on the perfor-
mance of each net.
High or low-frequency mode is selected by an attribute.
Routing
Table 26: DCM Organization
DCM and MGT Locations/Organization
Block RAM
Virtex-II Pro DCMs and serial transceivers (MGTs) are
placed on the top and bottom of each block RAM and multi-
plier column in some combination, as shown in Table 26.
The number of DCMs and RocketIO transceivers total twice
the number of block RAM columns in the device. Refer to
Figure 43, page 38 for an illustration of this in the XC2VP4
device.
Device
XC2VP2
Columns
DCMs
MGTs
4
4
4
4
4
XC2VP4
4
XC2VP7
6
4
8
XC2VP20
XC2VP30
XC2VP40
XC2VP50
XC2VP70
XC2VP100
XC2VP125
8
8
8
Place-and-route software takes advantage of this regular
array to deliver optimum system performance and fast com-
pile times. The segmented routing resources are essential
to guarantee IP cores portability and to efficiently handle an
incremental design flow that is based on modular imple-
mentations. Total design time is reduced due to fewer and
shorter design iterations.
8
8
8
10
12
14
16
18
8
12
16
20
20
24
8
8
12
12
Hierarchical Routing Resources
Most Virtex-II Pro signals are routed using the global rout-
ing resources, which are located in horizontal and vertical
routing channels between each switch matrix.
44
www.xilinx.com
1-800-255-7778
DS083-2 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Functional Description
Dedicated Routing
•
•
The long lines are bidirectional wires that distribute
signals across the device. Vertical and horizontal long
lines span the full height and width of the device.
The hex lines route signals to every third or sixth block
away in all four directions. Organized in a staggered
pattern, hex lines can only be driven from one end.
Hex-line signals can be accessed either at the
endpoints or at the midpoint (three blocks from the
source).
The double lines route signals to every first or second
block away in all four directions. Organized in a
staggered pattern, double lines can be driven only at
their endpoints. Double-line signals can be accessed
either at the endpoints or at the midpoint (one block
from the source).
In addition to the global and local routing resources, dedi-
cated signals are available.
•
There are eight global clock nets per quadrant. (See
Global Clock Multiplexer Buffers, page 39.)
•
Horizontal routing resources are provided for on-chip
3-state buses. Four partitionable bus lines are provided
per CLB row, permitting multiple buses within a row.
(See 3-State Buffers, page 34.)
•
•
Two dedicated carry-chain resources per slice column
(two per CLB column) propagate carry-chain MUXCY
output signals vertically to the adjacent slice. (See
CLB/Slice Configurations, page 34.)
•
•
One dedicated SOP chain per slice row (two per CLB
row) propagate ORCY output logic signals horizontally
to the adjacent slice. (See Sum of Products, page 33.)
One dedicated shift-chain per CLB connects the output
of LUTs in shift-register mode to the input of the next
LUT in shift-register mode (vertically) inside the CLB.
(See Shift Registers, page 30.)
•
•
The direct connect lines route signals to neighboring
blocks: vertically, horizontally, and diagonally.
The fast connect lines are the internal CLB local
interconnections from LUT outputs to LUT inputs.
•
24 Horizontal Long Lines
24 Vertical Long Lines
120 Horizontal Hex Lines
120 Vertical Hex Lines
40 Horizontal Double Lines
40 Vertical Double Lines
16 Direct Connections
(total in all four directions)
8 Fast Connects
DS031_60_110200
Figure 55: Hierarchical Routing Resources
be re-used as general purpose inputs and outputs once
Configuration
configuration is complete.
Virtex-II Pro devices are configured by loading application
specific configuration data into the internal configuration
memory. Configuration is carried out using a subset of the
device pins, some of which are dedicated, while others can
Depending on the system design, several configuration
modes are supported, selectable via mode pins. The mode
pins M2, M1, and M0 are dedicated pins. The M2, M1, and
M0 mode pins should be set at a constant DC voltage level,
DS083-2 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
45
R
Functional Description: FPGA
either through pull-up or pull-down resistors, or tied directly
to ground or VCCAUX. The mode pins should not be toggled
during and after configuration.
Slave-serial mode is selected by applying [111] to the mode
pins (M2, M1, M0). A weak pull-up on the mode pins makes
slave serial the default mode if the pins are left uncon-
nected.
An additional pin, HSWAP_EN is used in conjunction with
the mode pins to select whether user I/O pins have pull-ups
during configuration. By default, HSWAP_EN is tied High
(internal pull-up) which shuts off the pull-ups on the user I/O
pins during configuration. When HSWAP_EN is tied Low,
user I/Os have pull-ups during configuration. Other dedi-
cated pins are CCLK (the configuration clock pin), DONE,
PROG_B, and the boundary-scan pins: TDI, TDO, TMS,
and TCK. (The TDO pin is open-drain and does not have an
internal pull-up resistor.) Depending on the configuration
mode chosen, CCLK can be an output generated by the
FPGA, or an input accepting an externally generated clock.
The configuration pins and boundary scan pins are inde-
Master-Serial Mode
In master-serial mode, the CCLK pin is an output pin. It is the
Virtex-II Pro FPGA device that drives the configuration clock
on the CCLK pin to a Xilinx Serial PROM which in turn feeds
bit-serial data to the DIN input. The FPGA accepts this data
on each rising CCLK edge. After the FPGA has been loaded,
the data for the next device in a daisy-chain is presented on
the DOUT pin after the falling CCLK edge.
The interface is identical to slave serial except that an inter-
nal oscillator is used to generate the configuration clock
(CCLK). A wide range of frequencies can be selected for
CCLK which always starts at a slow default frequency. Con-
figuration bits then switch CCLK to a higher frequency for
the remainder of the configuration.
pendent of the VCCO. The auxiliary power supply (VCCAUX
)
of 2.5V is used for these pins. All configuration pins are
LVCMOS25 12mA. See Virtex-II Pro Switching Charac-
teristics (Module 3).
Slave SelectMAP Mode
Configuration Modes
The SelectMAP mode is the fastest configuration option.
Byte-wide data is written into the Virtex-II Pro FPGA device
with a BUSY flag controlling the flow of data. An external
data source provides a byte stream, CCLK, an active Low
Chip Select (CS_B) signal and a Write signal (RDWR_B). If
BUSY is asserted (High) by the FPGA, the data must be
held until BUSY goes Low. Data can also be read using the
SelectMAP mode. If RDWR_B is asserted, configuration
data is read out of the FPGA as part of a readback opera-
tion.
A "persist" option is available which can be used to force the
configuration pins to retain their configuration function even
after device configuration is complete. If the persist option is
not selected then the configuration pins with the exception
of CCLK, PROG_B, and DONE can be used as user I/O in
normal operation. The persist option does not apply to the
boundary-scan related pins. The persist feature is valuable
in applications which employ partial reconfiguration or
reconfiguration on the fly.
After configuration, the pins of the SelectMAP port can be
used as additional user I/O. Alternatively, the port can be
retained to permit high-speed 8-bit readback using the per-
sist option.
Virtex-II Pro supports the following five configuration
modes:
•
•
•
•
•
Slave-Serial Mode
Master-Serial Mode
Slave SelectMAP Mode
Master SelectMAP Mode
Boundary-Scan (JTAG, IEEE 1532) Mode
Multiple Virtex-II Pro FPGAs can be configured using the
SelectMAP mode, and be made to start-up simultaneously.
To configure multiple devices in this way, wire the individual
CCLK, Data, RDWR_B, and BUSY pins of all the devices in
parallel. The individual devices are loaded separately by
deasserting the CS_B pin of each device in turn and writing
the appropriate data.
Refer to Table 27, page 47.
A detailed description of configuration modes is provided in
the Virtex-II Pro Platform FPGA User Guide.
Master SelectMAP Mode
Slave-Serial Mode
This mode is a master version of the SelectMAP mode. The
device is configured byte-wide on a CCLK supplied by the
Virtex-II Pro FPGA device. Timing is similar to the Slave
SerialMAP mode except that CCLK is supplied by the
Virtex-II Pro FPGA.
In slave-serial mode, the FPGA receives configuration data
in bit-serial form from a serial PROM or other serial source
of configuration data. The CCLK pin on the FPGA is an
input in this mode. The serial bitstream must be setup at the
DIN input pin a short time before each rising edge of the
externally generated CCLK.
Boundary-Scan (JTAG, IEEE 1532) Mode
Multiple FPGAs can be daisy-chained for configuration from
a single source. After a particular FPGA has been config-
ured, the data for the next device is routed internally to the
DOUT pin. The data on the DOUT pin changes on the fall-
ing edge of CCLK.
In boundary-scan mode, dedicated pins are used for config-
uring the Virtex-II Pro device. The configuration is done
entirely through the IEEE 1149.1 Test Access Port (TAP).
Virtex-II Pro device configuration using Boundary scan is
compliant with IEEE 1149.1-1993 standard and the new
46
www.xilinx.com
1-800-255-7778
DS083-2 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Functional Description
IEEE 1532 standard for In-System Configurable (ISC)
devices. The IEEE 1532 standard is backward compliant
with the IEEE 1149.1-1993 TAP and state machine. The
IEEE Standard 1532 for In-System Configurable (ISC)
tested on the board via a physical and logical protocol. Con-
figuration through the boundary-scan port is always avail-
able, independent of the mode selection. Selecting the
boundary-scan mode simply turns off the other modes.
devices is intended to be programmed, reprogrammed, or
Table 27: Virtex-II Pro Configuration Mode Pin Settings
Configuration Mode(1)
M2
0
M1
0
M0
0
CCLK Direction
Data Width
Serial DOUT
(2)
Master Serial
Out
In
1
1
8
8
1
Yes
Yes
No
Slave Serial
1
1
1
Master SelectMAP
Slave SelectMAP
Boundary Scan
Notes:
0
1
1
Out
In
1
1
0
No
1
0
1
N/A
No
1. The HSWAP_EN pin controls the pull-ups. Setting M2, M1, and M0 selects the configuration mode, while the HSWAP_EN pin
controls whether or not the pull-ups are used.
2. Daisy chaining is possible only in modes where Serial DOUT is used. For example, in SelectMAP modes, the first device does NOT
support daisy chaining of downstream devices.
Table 28 lists the total number of bits required to configure
each device.
ration is delayed by preventing entry into the phase where
data is loaded.
The configuration process can also be initiated by asserting
the PROG_B pin. The end of the memory-clearing phase is
signaled by the INIT_B pin going High, and the completion
of the entire process is signaled by the DONE pin going
High. The Global Set/Reset (GSR) signal is pulsed after the
last frame of configuration data is written but before the
start-up sequence. The GSR signal resets all flip-flops on
the device.
Table 28: Virtex-II Pro Bitstream Lengths
Number of Configuration
Device
XC2VP2
Bits
1,305,440
3,006,560
4,485,472
8,214,624
11,589,984
15,868,256
19,021,408
26,099,040
34,292,832
43,602,784
XC2VP4
XC2VP7
The default start-up sequence is that one CCLK cycle after
DONE goes High, the global 3-state signal (GTS) is
released. This permits device outputs to turn on as neces-
sary. One CCLK cycle later, the Global Write Enable (GWE)
signal is released. This permits the internal storage ele-
ments to begin changing state in response to the logic and
the user clock.
XC2VP20
XC2VP30
XC2VP40
XC2VP50
XC2VP70
XC2VP100
XC2VP125
The relative timing of these events can be changed via con-
figuration options in software. In addition, the GTS and
GWE events can be made dependent on the DONE pins of
multiple devices all going High, forcing the devices to start
synchronously. The sequence can also be paused at any
stage, until lock has been achieved on any or all DCMs, as
well as DCI.
Configuration Sequence
The configuration of Virtex-II Pro devices is a three-phase
process. First, the configuration memory is cleared. Next,
configuration data is loaded into the memory, and finally,
the logic is activated by a start-up process.
Readback
In this mode, configuration data from the Virtex-II Pro FPGA
device can be read back. Readback is supported only in the
SelectMAP (master and slave) and Boundary Scan mode.
Configuration is automatically initiated on power-up unless
it is delayed by the user. The INIT_B pin can be held Low
using an open-drain driver. An open-drain is required since
INIT_B is a bidirectional open-drain pin that is held Low by a
Virtex-II Pro FPGA device while the configuration memory
is being cleared. Extending the time that the pin is Low
causes the configuration sequencer to wait. Thus, configu-
Along with the configuration data, it is possible to read back
the contents of all registers, distributed SelectRAM+, and
block RAM resources. This capability is used for real-time
debugging. For more detailed configuration information,
see the Virtex-II Pro Platform FPGA User Guide.
DS083-2 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
47
R
Revision History
Bitstream Encryption
Partial Reconfiguration
Virtex-II Pro devices have an on-chip decryptor using one
or two sets of three keys for triple-key Data Encryption
Standard (DES) operation. Xilinx software tools offer an
optional encryption of the configuration data (bitstream)
with a triple-key DES determined by the designer.
Partial reconfiguration of Virtex-II Pro devices can be
accomplished in either Slave SelectMAP mode or Bound-
ary-Scan mode. Instead of resetting the chip and doing a
full configuration, new data is loaded into a specified area of
the chip, while the rest of the chip remains in operation.
Data is loaded on a column basis, with the smallest load
unit being a configuration “frame” of the bitstream (device
size dependent).
The keys are stored in the FPGA by JTAG instruction and
retained by a battery connected to the VBATT pin, when the
device is not powered. Virtex-II Pro devices can be config-
ured with the corresponding encrypted bitstream, using any
of the configuration modes described previously.
Partial reconfiguration is useful for applications that require
different designs to be loaded into the same area of a chip,
or that require the ability to change portions of a design
without having to reset or reconfigure the entire chip.
A detailed description of how to use bitstream encryption is
provided in the Virtex-II Pro Platform FPGA User Guide.
Your local FAE can also provide specific information on this
feature.
For more information on Partial Reconfiguration in
Virtex-II Pro devices, please refer to Xilinx Application Note
XAPP290, Two Flows for Partial Reconfiguration.
Revision History
This section records the change history for this module of the data sheet.
Date
Version
1.0
Revision
01/31/02
06/13/02
09/03/02
Initial Xilinx release.
New Virtex-II Pro family members. New timing parameters per speedsfile v1.62.
2.0
2.1
•
•
•
Revised Reset and Power sections.
Updated Table 8, which lists compatible input standards. [Table deleted in v2.6.]
Added Figure 19, Figure 20, and Figure 21, which provide examples illustrating the
use of I/O standards.
09/27/02
11/20/02
2.2
2.3
•
•
In section Overview, corrected max number of MGTs from 16 to 24.
In section Input/Output Blocks (IOBs), added references to XAPP653 regarding
implementation of 3.3V I/O standards.
•
•
Table 3: Added rows for LVTTL, LVCMOS33, and PCI-X.
Table 8: Added LVTTL and LVCMOS33 to compatible 3.3V cells. [Table deleted in
v2.6.]
•
•
Table 28: Correct bitstream lengths.
12/03/02
01/20/03
2.4
2.5
Added mention of LVTTL and PCI with respect to SelectIO-Ultra configurations. See
section Input/Output Individual Options and Figure 13.
•
•
Added qualification to features vs. Virtex-II (open-drain output pin TDO does not have
internal pull-up resistor)
Table 7: Added HSTL18 (I, II, III, & IV) and HSTL18_DCI (I,II, III & IV) to 1.8V VCCO
row. [Table deleted in v2.6.]
•
•
Table 8: Numerous revisions. [Table deleted in v2.6.]
03/24/03
2.5.1
Table 5: Corrected I/O standard names SSTL18_I and SSTL18_II to SSTL18_I_DCI
and SSTL18_II_DCI respectively.
•
Figure 52, text below: Corrected wording of criteria for clock switching.
48
www.xilinx.com
DS083-2 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Functional Description
Revision
Date
Version
05/27/03
2.6
•
•
Removed Compatible Output Standards and Compatible Input Standards tables.
Added new Table 7, Summary of Voltage Supply Requirements for All Input and
Output Standards. This table replaces deleted I/O standards tables.
•
Corrected sentence in section Input/Output Individual Options, page 17, to read “The
optional weak-keeper circuit is connected to each user I/O pad.”
•
Added section Rules for Combining I/O Standards in the Same Bank, page 19.
06/02/03
2.7
•
•
Added four Differential Termination I/O standards to Table 4 and Table 7.
Added section On-Chip Differential Termination and Figure 22, page 25.
08/25/03
09/10/03
2.7.1
2.8
•
•
Added footnote referring to XAPP659 to 3.3V I/O callouts in Table 3 and Table 7.
Section Configuration, page 45: Added text indicating that the mode pins M0-M2 must
be held to a constant DC level during and after configuration.
10/14/03
2.9
•
•
Deleted section Power Sequencing, page 7. Added section Local Clocking, page 42.
Sections Slave-Serial Mode and Master-Serial Mode, page 46: Changed "rising" to
"falling" edge with respect to DOUT.
•
•
Table 3, page 14 and Table 5, page 15: Corrected Input VREF for HSTL_III-IV_18 from
1.08V to 1.1V.
12/10/03
3.0
XC2VP2 through XC2VP70 speed grades -5, -6, and -7, and XC2VP100 speed grades
-5 and -6, are released to Production status.
Virtex-II Pro Data Sheet
The Virtex-II Pro Data Sheet contains the following modules:
•
Virtex-II Pro™ Platform FPGAs: Introduction and
Overview (Module 1)
Virtex-II Pro™ Platform FPGAs: Functional Description
(Module 2)
•
•
Virtex-II Pro™ Platform FPGAs: DC and Switching
Characteristics (Module 3)
Virtex-II Pro™ Platform FPGAs: Pinout Information
(Module 4)
•
DS083-2 (v3.0) December 10, 2003
www.xilinx.com
49
Product Specification
1-800-255-7778
R
Virtex-II Pro Data Sheet
50
www.xilinx.com
DS083-2 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
`6
0
54
R
Virtex-II Pro™ Platform FPGAs:
DCandSwitchingCharacteristics
0
0
DS083-3 (v3.0) December 10, 2003
Product Specification
Virtex-II Pro Electrical Characteristics
Virtex-II Pro devices are provided in -7, -6, and -5 speed
grades, with -7 having the highest performance.
grades and/or devices might be available in the industrial
range.
Virtex-II Pro DC and AC characteristics are specified for
both commercial and industrial grades. Except the operat-
ing temperature range or unless otherwise noted, all the DC
and AC electrical parameters are the same for a particular
speed grade (that is, the timing characteristics of a -6 speed
grade industrial device are the same as for a -6 speed
grade commercial device). However, only selected speed
All supply voltage and junction temperature specifications
are representative of worst-case conditions. The parame-
ters included are common to popular designs and typical
applications. Contact Xilinx for design considerations
requiring more detailed information.
All specifications are subject to change without notice.
Virtex-II Pro DC Characteristics
Table 1: Absolute Maximum Ratings
Symbol
VCCINT
VCCAUX
VCCO
Description
Internal supply voltage relative to GND
Units
–0.5 to 1.6
–0.5 to 3.0
V
V
Auxiliary supply voltage relative to GND
Output drivers supply voltage relative to GND
–0.5 to 3.75
–0.5 to 3.0
V
VBATT
VREF
Key memory battery backup supply
V
Input reference voltage
–0.3 to 3.75
–0.3 to 4.05(3)
–0.5 to VCCO + 0.5
–0.3 to 4.05(3)
–0.5 to VCCO + 0.5
–0.5 to 3.0
V
3.3V I/O input voltage relative to GND (user and dedicated I/Os)
2.5V or below I/O input voltage relative to GND (user and dedicated I/Os)
Voltage applied to 3-state 3.3V output (user and dedicated I/Os)
Voltage applied to 3-state 2.5V or below output (user and dedicated I/Os)
V
VIN
V
V
VTS
V
VCCAUXRX Auxilliary supply voltage relative to analog ground, GNDA (RocketIO pins)
VCCAUXTX Auxilliary supply voltage relative to analog ground, GNDA (RocketIO pins)
V
–0.5 to 3.0
V
VTTX
VTRX
TSTG
TSOL
TJ
Terminal transmit supply voltage relative to GND (RocketIO pins)
Terminal receive supply voltage relative to GND (RocketIO pins)
Storage temperature (ambient)
–0.5 to 3.0
V
–0.5 to 3.0
V
–65 to +150
+220
°C
°C
°C
Maximum soldering temperature(2)
Maximum junction temperature(2)
+125
Notes:
1. Stresses beyond those listed under Absolute Maximum Ratings might cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions
is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time might affect device reliability.
2. For soldering guidelines and thermal considerations, see the Device Packaging information on the Xilinx website.
3. 3.3V I/O Absolute Maximum limit applied to DC and AC signals. Refer to XAPP659 for more details.
© 2003 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
DS083-3 (v3.0) December 10, 2003
www.xilinx.com
1
Product Specification
1-800-255-7778
R
Table 2: Recommended Operating Conditions
Symbol
Description
Min
1.425
1.425
2.375
2.375
1.2
Max
Units
V
Internal supply voltage relative to GND, TJ = 0 °C to +85°C
Internal supply voltage relative to GND, TJ = –40°C to +100°C
Auxiliary supply voltage relative to GND, TJ = 0 °C to +85°C
Auxiliary supply voltage relative to GND, TJ = –40°C to +100°C
Supply voltage relative to GND, TJ = 0 °C to +85°C
Supply voltage relative to GND, TJ = –40°C to +100°C
3.3V supply voltage relative to GND, TJ = 0 °C to +85°C
3.3V supply voltage relative to GND, TJ = –40°C to +100°C
2.5V and below supply voltage relative to GND, TJ = 0 °C to +85°C
2.5V and below supply voltage relative to GND, TJ = –40°C to +100°C
Battery voltage relative to GND, TJ = 0 °C to +85°C
Battery voltage relative to GND, TJ = –40°C to +100°C
Auxilliary supply voltage relative to GNDA
Commercial
Industrial
1.575
1.575
2.625
2.625
3.45(5)
3.45(5)
3.45(5)
3.45(5)
VCCINT
V
Commercial
Industrial
V
(1)
VCCAUX
V
Commercial
Industrial
V
(2,3)
VCCO
1.2
V
Commercial GND – 0.2
Industrial GND – 0.2
V
V
VIN
Commercial GND – 0.2 VCCO + 0.2
V
Industrial
Commercial
Industrial
GND – 0.2 VCCO + 0.2
V
1.0
1.0
2.63
2.63
V
(4)
VBATT
V
Commercial
Industrial
2.375
2.375
1.8
2.625
2.625
2.625
2.625
V
(6)
VCCAUXRX,
VCCAUXTX
(6)
Auxilliary supply voltage relative to GNDA
V
Terminal supply voltage relative to GND
Commercial
Industrial
V
VTTX, VTRX
Terminal supply voltage relative to GND
1.8
V
Notes:
1. Recommended maximum voltage droop for VCCAUX is 10 mV/ms.
2. Configuration data is retained even if VCCO drops to 0V.
3. For 3.3V I/O operation, refer to XAPP659, available on the Xilinx website at www.xilinx.com.
4. If battery is not used, do not connect VBATT
5. For PCI and PCI-X, refer to XAPP653, available on the Xilinx website at www.xilinx.com.
.
6. IMPORTANT! All unused RocketIO transceivers in the FPGA must be connected to power and ground. If RocketIO transceivers in the
FPGA are used, refer to the information on power filtering in the RocketIO Transceiver User Guide. Unused transceivers can be
powered by any 2.5V source, and passive filtering is not required.
2
www.xilinx.com
DS083-3 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: DC and Switching Characteristics
Table 3: DC Characteristics Over Recommended Operating Conditions
Symbol
Description
Min
Typ
Max
Units
Data retention VCCINT voltage
(below which configuration data might be lost)
1.25
V
VDRINT
Data retention VCCAUX voltage
(below which configuration data might be lost)
2.0
V
VDRI
IREF
IL
VREF current per pin
10
10
µA
µA
pF
µA
Input or output leakage current per pin (sample-tested)
Input capacitance (sample-tested)
CIN
10
Pad pull-up (when selected) @ Vin = 0V, VCCO = 2.5V
(sample tested)
150
IRPU
Pad pull-down (when selected) @ Vin = 2.5V
(sample-tested)
150
200
µA
IRPD
IBATT
Battery supply current
75
60
35
30
15
nA
mA
ICCAUXTX
ICCAUXRX
Operating VCCAUXTX supply current
Operating VCCAUXRX supply current
mA
Operating ITTX supply current when transmitter is AC coupled
Operating ITTX supply current when transmitter is DC coupled
Operating ITRX supply current when receiver is AC coupled
Operating ITRX supply current when receiver is DC coupled
Power dissipation of PowerPC® 405 processor block
Power dissipation of RocketIO @ 3.125 Gb/s per channel
Power dissipation of RocketIO @ 2.5 Gb/s per channel
Power dissipation of RocketIO @ 1.25 Gb/s per channel
mA
ITTX
mA
mA
ITRX
15
mA
PCPU
0.9
mW/MHz
mW
mW
mW
350
310
230
PRXTX
DS083-3 (v3.0) December 10, 2003
www.xilinx.com
3
Product Specification
1-800-255-7778
R
Table 4: Quiescent Supply Current
Symbol
Description
Device
XC2VP2
Typ
100
150
175
200
250
300
350
425
500
Max
300
Units
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
XC2VP4
400
XC2VP7
500
XC2VP20
XC2VP30
XC2VP40
XC2VP50
XC2VP70
XC2VP100
XC2VP125
XC2VP2
600
800
ICCINTQ
Quiescent VCCINT supply current
1050
1250
1700
2200
2
2
8
XC2VP4
8
XC2VP7
2
8
XC2VP20
XC2VP30
XC2VP40
XC2VP50
XC2VP70
XC2VP100
XC2VP125
XC2VP2
2.5
2.5
2.5
3
10
10
10
12
12
15
ICCOQ
Quiescent VCCO supply current
3
3.5
10
10
10
15
15
15
20
20
25
50
50
XC2VP4
XC2VP7
50
XC2VP20
XC2VP30
XC2VP40
XC2VP50
XC2VP70
XC2VP100
XC2VP125
75
75
ICCAUXQ
Quiescent VCCAUX supply current
75
100
100
125
Notes:
1. Quiescent current parameter values are specified for Commercial Grade. For Industrial Grade values, multiply Commercial Grade
values by 1.5.
2. With no output current loads, no active input pull-up resistors, all I/O pins are 3-state and floating.
3. If DCI or differential signaling is used, more accurate quiescent current estimates can be obtained by using the Power Estimator or
XPOWER™.
4
www.xilinx.com
DS083-3 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: DC and Switching Characteristics
Power-On Power Supply Requirements
Xilinx FPGAs require a certain amount of supply current
during power-on to insure proper device initialization. The
actual current consumed depends on the power-on ramp
rate of the power supply.
Table 5 shows the minimum current required by
Virtex-II Pro devices for proper power-on and configuration.
If the current minimums shown in Table 5 are met, the
device powers on properly after all three supplies have
passed through their power-on reset threshold voltages.
The VCCINT power supply must ramp on no faster than
200 µs and no slower than 50 ms. Ramp-on is defined as:
0 VDC to minimum supply voltages (see Table 2).
Once initialized and configured, use the power calculator to
estimate current drain on these supplies.
VCCAUX and VCCO can power on at any ramp rate. Power
supplies can be turned on in any sequence, though VCCAUX
must power on before or with VCCO for the specifications
shown in Table 5 to apply.
For more information on VCCAUX, VCCO, and configuration
mode, refer to Chapter 3 in the Virtex-II Pro Platform FPGA
User Guide.
Table 5: Power-On Current for Virtex-II Pro Devices
Device
XC2VP2 XC2VP4 XC2VP7 XC2VP20 XC2VP30 XC2VP40 XC2VP50 XC2VP70 XC2VP100 XC2VP125 Units
Symbol
ICCINTMIN
ICCAUXMIN
ICCOMIN
500
250
100
500
250
100
500
250
100
600
250
100
800
250
100
1050
1250
250
1700
250
2200
250
mA
mA
mA
250
100
100
100
100
Notes:
1. Power-on current parameter values are specified for Commercial Grade. For Industrial Grade values, multiply Commercial Grade
values by 1.5.
General Power Supply Requirements
Proper decoupling of all FPGA power supplies is essential.
Consult Xilinx Application Note XAPP623 for detailed infor-
mation on power distribution system design.
XAPP689, “Managing Ground Bounce in Large FPGAs,” to
determine the number of simultaneously switching outputs
allowed per bank at the package level.
VCCAUX powers critical resources in the FPGA. Therefore,
this supply voltage is especially susceptible to power supply
noise. VCCAUX can share a power plane with VCCO, but only
if VCCO does not have excessive noise. Staying within
simultaneously switching output (SSO) limits is essential for
keeping power supply noise to a minimum. Refer to
Changes in VCCAUX voltage beyond 200 mV peak-to-peak
should take place at a rate no faster than 10 mV per milli-
second.
Recommended practices that can help reduce jitter and
period distortion are described in Xilinx Answer Record
13756.
DS083-3 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
5
R
SelectIO-Ultra DC Input and Output Levels
Values for VIL and VIH are recommended input voltages.
Values for IOL and IOH are guaranteed over the recom-
mended operating conditions at the VOL and VOH test
points. Only selected standards are tested. These are cho-
sen to ensure that all standards meet their specifications.
The selected standards are tested at minimum VCCO with
the respective VOL and VOH voltage levels shown. Other
standards are sample tested.
Table 6: DC Input and Output Levels
VIL
VIH
VOL
V, max
0.4
VOH
V, min
2.4
IOL
mA
24
IOH
mA
–24
–24
–24
–16
–16
Input/Output
Standard
V, min
–0.2
–0.2
–0.2
–0.2
–0.2
–0.2
–0.2
–0.2
–0.2
–0.2
–0.2
–0.2
–0.2
–0.2
–0.2
–0.2
–0.2
–0.2
V, max
0.8
V, min
2.0
V, max
3.45
LVTTL
LVCMOS33
LVCMOS25
LVCMOS18
LVCMOS15
PCI33_3
PCI66_3
PCI-X
0.8
2.0
3.45
0.4
V
CCO – 0.4
24
0.7
1.7
V
CCO + 0.4
0.4
VCCO – 0.4
VCCO – 0.45
VCCO – 0.45
90% VCCO
90% VCCO
Note (1)
24
30% VCCO
30% VCCO
30% VCCO
30% VCCO
Note (1)
70% VCCO
70% VCCO
50% VCCO
50% VCCO
Note (1)
VCCO + 0.4
VCCO + 0.4
3.6
0.4
16
0.4
16
10% VCCO
10% VCCO
Note (1)
3.6
Note (1)
Note (1)
36
Note (1)
n/a
GTLP
VREF – 0.1
VREF + 0.1
VCCO + 0.4
VCCO + 0.4
VCCO + 0.4
VCCO + 0.4
VCCO + 0.4
VCCO + 0.4
VCCO + 0.3
VCCO + 0.3
VCCO + 0.3
VCCO + 0.3
0.6
0.4
n/a
GTL
VREF – 0.05
VREF + 0.05
VREF + 0.1
VREF + 0.1
VREF + 0.1
VREF + 0.1
VREF + 0.15
VREF + 0.15
VREF + 0.125
VREF + 0.125
n/a
40
n/a
HSTL I
V
REF – 0.1
VREF – 0.1
VREF – 0.1
VREF – 0.1
VREF – 0.15
0.4(2)
VCCO – 0.4
VCCO – 0.4
VCCO – 0.4
VCCO – 0.4
VTT + 0.61
VTT + 0.81
VTT + 0.61
VTT + 0.61
8(2)
–8(2)
–16(2)
–8(2)
–8(2)
–8.1
HSTL II
0.4(2)
16(2)
24(2)
48(2)
8.1
HSTL III
HSTL IV
SSTL2 I
SSTL2 II
SSTL18 I
SSTL18 II
0.4(2)
0.4(2)
VTT – 0.61
VTT – 0.81
VTT – 0.61
VTT – 0.61
V
REF – 0.15
REF – 0.125
VREF – 0.125
16.2
6.7
–16.2
–6.7
V
13.4
–13.4
Notes:
1. Tested according to relevant specifications.
2. This applies to 1.5V and 1.8V HSTL.
LDT DC Specifications (LDT_25)
Table 7: LDT DC Specifications
DC Parameter
Supply Voltage
Symbol
Conditions
Min
2.38
495
–15
495
–15
200
–15
440
–15
Typ
Max
Units
V
VCCO
VOD
2.5
2.63
715
15
Differential Output Voltage
Change in VOD Magnitude
Output Common Mode Voltage
Change in VOS Magnitude
Input Differential Voltage
Change in VID Magnitude
Input Common Mode Voltage
Change in VICM Magnitude
RT = 100 ohm across Q and Q signals
RT = 100 ohm across Q and Q signals
600
mV
mV
mV
mV
mV
mV
mV
mV
∆ VOD
VOCM
∆ VOCM
VID
600
600
600
715
15
1000
15
∆ VID
VICM
780
15
∆ VICM
6
www.xilinx.com
DS083-3 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: DC and Switching Characteristics
LVDS DC Specifications (LVDS_25)
Table 8: LVDS DC Specifications
DC Parameter
Supply Voltage
Symbol
VCCO
VOH
Conditions
Min
Typ
Max
2.63
Units
2.38
2.5
V
V
V
Output High Voltage for Q and Q
Output Low Voltage for Q and Q
RT = 100 Ω across Q and Q signals
RT = 100 Ω across Q and Q signals
1.602
VOL
0.898
247
Differential Output Voltage (Q – Q),
Q = High (Q – Q), Q = High
VODIFF
VOCM
VIDIFF
VICM
RT = 100 Ω across Q and Q signals
RT = 100 Ω across Q and Q signals
Common-mode input voltage = 1.25V
Differential input voltage = 350 mV
350
1.250
350
454
1.375
600
mV
V
Output Common-Mode Voltage
1.125
100
Differential Input Voltage (Q – Q),
Q = High (Q – Q), Q = High
mV
V
Input Common-Mode Voltage
0.3
1.2
2.2
Extended LVDS DC Specifications (LVDSEXT_25)
Table 9: Extended LVDS DC Specifications
DC Parameter
Supply Voltage
Symbol
VCCO
VOH
Conditions
Min
Typ
Max
2.63
Units
2.38
2.5
V
V
V
Output High Voltage for Q and Q
Output Low Voltage for Q and Q
RT = 100 Ω across Q and Q signals
RT = 100 Ω across Q and Q signals
1.785
VOL
0.715
440
Differential Output Voltage (Q – Q),
Q = High (Q – Q), Q = High
VODIFF
VOCM
VIDIFF
VICM
RT = 100 Ω across Q and Q signals
RT = 100 Ω across Q and Q signals
Common-mode input voltage = 1.25V
Differential input voltage = 350 mV
820
1.375
1000
2.2
mV
V
Output Common-Mode Voltage
1.125
100
1.250
1.2
Differential Input Voltage (Q – Q),
Q = High (Q – Q), Q = High
mV
V
Input Common-Mode Voltage
0.3
LVPECL DC Specifications (LVPECL_25)
These values are valid when driving a 100 Ω differential
load only, i.e., a 100 Ω resistor between the two receiver
pins. The VOH levels are 200 mV below standard LVPECL
levels and are compatible with devices tolerant of lower
common-mode ranges. Table 10 summarizes the DC out-
put specifications of LVPECL. For more information on
using LVPECL, see the Virtex-II Pro Platform FPGA User
Guide.
Table 10: LVPECL DC Specifications
VCCO = 2.375V
VCCO = 2.5V
Min
VCCO = 2.625V
DC Parameter
Min
1.35
0.565
0.8
Max
1.495
0.755
2.0
Max
1.62
0.88
2.0
1.7
-
Min
1.6
Max
Units
VOH
VOL
VIH
VIL
1.475
0.69
0.8
1.745
1.005
2.0
V
V
V
V
V
0.815
0.8
0.5
1.7
0.5
0.5
1.7
Differential Input Voltage
0.100
-
0.100
0.100
-
DS083-3 (v3.0) December 10, 2003
www.xilinx.com
7
Product Specification
1-800-255-7778
R
RocketIO DC Input and Output Levels
Table 11: RocketIO DC Specifications
DC Parameter
Symbol
Conditions
Min
Typ
Max
Units
mV
mV
mV
mV
mV
mV
mV
mV
mV
mV
mV
Peak-to-Peak Differential Input Voltage
Single-Ended Output Voltage Swing(1,2)
DVIN
175
2000
400
500
DVOUT
600
700
800
800
1000
1200
1400
1600
Peak-to-Peak Differential Output Voltage(1,2)
DVPPOUT
Notes:
1. Output swing levels are selectable using TX_DIFF_CTRL attribute. Refer to the RocketIO Transceiver User Guide for details.
2. Output preemphasis levels are selectable at 10% (default), 20%, 25%, and 33% using the TX_PREEMPHASIS attribute. Refer to the
RocketIO Transceiver User Guide or Chapter 2 in the Virtex-II Pro Platform FPGA User Guide for details.
+V
0
TXP
TXN
DVOUT
DS083-3_04_120302
Figure 1: Single-Ended Output Voltage Swing
+V
0
DVPPOUT
–V
TXP–TXN
DS083-3_05_120302
Figure 2: Peak-to-Peak Differential Output Voltage
8
www.xilinx.com
DS083-3 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: DC and Switching Characteristics
Virtex-II Pro Performance Characteristics
This section provides the performance characteristics of
some common functions and designs implemented in
Virtex-II Pro devices. The numbers reported here are fully
characterized worst-case values. Note that these values are
subject to the same guidelines as Virtex-II Pro Switching
Characteristics (speed files).
Table 12 provides pin-to-pin values (in nanoseconds)
including IOB delays; that is, delay through the device from
input pin to output pin. In the case of multiple inputs and out-
puts, the worst delay is reported.
Table 12: Pin-to-Pin Performance
Pin-to-Pin Performance
Description
Basic Functions:
Device Used & Speed Grade
(with I/O Delays)
Units
16-bit Address Decoder
32-bit Address Decoder
64-bit Address Decoder
4:1 MUX
XC2VP20FF1152-6
XC2VP20FF1152-6
XC2VP20FF1152-6
XC2VP20FF1152-6
XC2VP20FF1152-6
XC2VP20FF1152-6
XC2VP20FF1152-6
XC2VP20FF1152-6
7.20
8.08
8.15
3.85
7.24
7.30
7.64
3.26
ns
ns
ns
ns
ns
ns
ns
ns
8:1 MUX
16:1 MUX
32:1 MUX
Combinatorial (pad to LUT to pad)
Memory:
Block RAM
Pad to setup
Clock to Pad
Distributed RAM
Pad to setup
Clock to Pad
XC2VP20FF1152-6
XC2VP20FF1152-6
1.72
6.63
ns
ns
XC2VP20FF1152-6
XC2VP20FF1152-6
1.78
4.12
ns
ns
DS083-3 (v3.0) December 10, 2003
www.xilinx.com
9
Product Specification
1-800-255-7778
R
Virtex-II Pro Performance Characteristics
Table 13 shows internal (register-to-register) performance. Values are reported in MHz.
Table 13: Register-to-Register Performance
Register-to-Register
Performance
Description
Basic Functions:
Device Used & Speed Grade
Units
16-bit Address Decoder
32-bit Address Decoder
64-bit Address Decoder
4:1 MUX
XC2VP20FF1152-6
XC2VP20FF1152-6
XC2VP20FF1152-6
XC2VP20FF1152-6
XC2VP20FF1152-6
XC2VP20FF1152-6
XC2VP20FF1152-6
XC2VP20FF1152-6
XC2VP20FF1152-6
XC2VP20FF1152-6
XC2VP20FF1152-6
XC2VP20FF1152-6
XC2VP20FF1152-6
XC2VP20FF1152-6
XC2VP20FF1152-6
XC2VP20FF1152-6
XC2VP20FF1152-6
XC2VP20FF1152-6
547
392
310
710
609
472
400
1046
337
334
252
202
131
309
207
150
135
147
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
8:1 MUX
16:1 MUX
32:1 MUX
Register to LUT to Register
8-bit Adder
16-bit Adder
32-bit Adder
64-bit Adder
128-bit Adder
24-bit Counter
64-bit Counter
64-bit Accumulator
Multiplier 18x18 (with Block RAM inputs)
Multiplier 18x18 (with Register inputs)
Memory:
Block RAM
Single-Port 4096 x 4 bits
Single-Port 2048 x 9 bits
Single-Port 1024 x 18 bits
Single-Port 512 x 36 bits
Dual-Port A:4096 x 4 bits & B:1024 x 18 bits
Dual-Port A:1024 x 18 bits & B:1024 x 18 bits
Dual-Port A:2048 x 9 bits & B: 512 x 36 bits
Distributed RAM
XC2VP20FF1152-6
XC2VP20FF1152-6
XC2VP20FF1152-6
XC2VP20FF1152-6
XC2VP20FF1152-6
XC2VP20FF1152-6
XC2VP20FF1152-6
355
MHz
MHz
MHz
MHz
MHz
MHz
MHz
Single-Port 16 x 8-bit
XC2VP20FF1152-6
XC2VP20FF1152-6
XC2VP20FF1152-6
XC2VP20FF1152-6
XC2VP20FF1152-6
XC2VP20FF1152-6
XC2VP20FF1152-6
555
557
408
336
549
460
407
MHz
MHz
MHz
MHz
MHz
MHz
MHz
Single-Port 32 x 8-bit
Single-Port 64 x 8-bit
Single-Port 128 x 8-bit
Dual-Port 16 x 8-bit
Dual-Port 32 x 8-bit
Dual-Port 64 x 8-bit
10
www.xilinx.com
DS083-3 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: DC and Switching Characteristics
Table 13: Register-to-Register Performance (Continued)
Register-to-Register
Performance
Description
Dual-Port 128 x 8-bit
Device Used & Speed Grade
Units
XC2VP20FF1152-6
MHz
Shift Registers
128-bit SRL
XC2VP20FF1152-6
XC2VP20FF1152-6
MHz
MHz
256-bit SRL
FIFOs (Async. in Block RAM)
1024 x 18-bit
1024 x 18-bit
FIFOs (Sync. in SRL)
128 x 8-bit
XC2VP20FF1152-6
XC2VP20FF1152-6
MHz
MHz
XC2VP20FF1152-6
XC2VP20FF1152-6
MHz
MHz
128 x 16-bit
CAMs in Block RAM
32 x 9-bit
XC2VP20FF1152-6
XC2VP20FF1152-6
XC2VP20FF1152-6
XC2VP20FF1152-6
MHz
MHz
MHz
MHz
64 x 9-bit
128 x 9-bit
256 x 9-bit
CAMs in SRL
32 x 16-bit
XC2VP20FF1152-6
XC2VP20FF1152-6
XC2VP20FF1152-6
XC2VP20FF1152-6
XC2VP20FF1152-6
XC2VP20FF1152-6
MHz
MHz
MHz
MHz
MHz
MHz
64 x 32-bit
128 x 40-bit
256 x 48-bit
1024 x 16-bit
1024 x 72-bit
DS083-3 (v3.0) December 10, 2003
www.xilinx.com
11
Product Specification
1-800-255-7778
R
Virtex-II Pro Switching Characteristics
Virtex-II Pro Switching Characteristics
Switching
characteristics
are
specified
on
a
All specifications are always representative of worst-case
supply voltage and junction temperature conditions.
per-speed-grade basis and can be designated as Advance,
Preliminary, or Production. Note that Virtex-II Pro Perfor-
mance Characteristics are subject to these guidelines, as
well. Each designation is defined as follows:
Table 14: Virtex-II Pro Device Speed Grade
Designations
Speed Grade Designations
Advance: These speed files are based on simulations only
and are typically available soon after device design specifi-
cations are frozen. Although speed grades with this desig-
nation are considered relatively stable and conservative,
some under-reporting might still occur.
Device
XC2VP2
Advance
Preliminary Production
-7, -6, -5
XC2VP4
-7, -6, -5
XC2VP7
-7, -6, -5
Preliminary: These speed files are based on complete ES
(engineering sample) silicon characterization. Devices and
speed grades with this designation are intended to give a
better indication of the expected performance of production
silicon. The probability of under-reporting delays is greatly
reduced as compared to Advance data.
XC2VP20
XC2VP30
XC2VP40
XC2VP50
XC2VP70
XC2VP100
XC2VP125
-7, -6, -5
-7, -6, -5
-7, -6, -5
-7, -6, -5
-7, -6, -5
Production: These speed files are released once enough
production silicon of a particular device family member has
been characterized to provide full correlation between
speed files and devices over numerous production lots.
There is no under-reporting of delays, and customers
receive formal notification of any subsequent changes. Typ-
ically, the slowest speed grades transition to Production
before faster speed grades.
Since individual family members are produced at different
times, the migration from one category to another depends
completely on the status of the fabrication process for each
device. Table 14 correlates the current status of each
Virtex-II Pro device with a corresponding speed file desig-
nation.
-6, -5
Testing of Switching Characteristics
All devices are 100% functionally tested. Internal timing
parameters are derived from measuring internal test pat-
terns. Listed below are representative values. For more
specific, more precise, and worst-case guaranteed data,
use the values reported by the static timing analyzer (TRCE
in the Xilinx Development System) and back-annotate to
the simulation net list. Unless otherwise noted, values apply
to all Virtex-II Pro devices.
PowerPC Switching Characteristics
Table 15: Processor Clocks Absolute AC Characteristics
Speed Grade
-7
-6
-5
Description
CPMC405CLOCK frequency
JTAGC405TCK frequency(1)
PLBCLK(2)
Min
0
Max
400
200
400
400
400
Min
0
Max
350
175
350
350
350
Min
0
Max
300
150
300
300
300
Units
MHz
MHz
MHz
MHz
MHz
0
0
0
0
0
0
BRAMDSOCMCLK(2)
BRAMISOCMCLK(2)
Notes:
0
0
0
0
0
0
1. The theoretical maximum frequency of this clock is one-half the CPMC405CLOCK. However, the achievable maximum is dependent
on the system, and will be much less.
2. The theoretical maximum frequency of these clocks is equal to the CPMC405CLOCK. However, the achievable maximum is
dependent on the system. Please see PowerPC 405 Processor Block Reference Guide and XAPP640 for more information.
12
www.xilinx.com
DS083-3 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: DC and Switching Characteristics
Table 16: Processor Block Switching Characteristics
Speed Grade
-6
Description
Symbol
-7
-5
Units
Setup and Hold Relative to Clock
(CPMC405CLOCK)
Device Control Register Bus control inputs
Device Control Register Bus data inputs
Clock and Power Management control inputs
Reset control inputs
TPCCK_DCR/TPCKC_DCR 0.38/–0.18 0.44/–0.20 0.48/–0.23 ns, min
PDCK_DCR/TPCKD_DCR 0.65/–0.01 0.75/–0.01 0.82/–0.02 ns, min
T
TPCCK_CPM/TPCKC_CPM 0.16/ 0.03
0.19/ 0.03
0.19/ 0.03
0.31/ 0.35
0.20/ 0.03
0.20/ 0.03
0.34/ 0.38
ns, min
ns, min
ns, min
T
PCCK_RST/TPCKC_RST 0.16/ 0.03
Debug control inputs
TPCCK_DBG/TPCKC_DBG 0.27/ 0.30
Trace control inputs
TPCCK_TRC/TPCKC_TRC 1.37/–0.41 1.57/–0.48 1.73/–0.52 ns, min
External Interrupt Controller control inputs
Clock to Out
T
PCCK_EIC/TPCKC_EIC
0.57/–0.22 0.66/–0.25 0.72/–0.27 ns, min
Device Control Register Bus control outputs
Device Control Register Bus address outputs
Device Control Register Bus data outputs
Clock and Power Management control outputs
Reset control outputs
TPCKCO_DCR
TPCKAO_DCR
1.32
1.72
1.76
1.26
1.32
1.94
1.35
1.52
1.98
2.02
1.45
1.51
2.22
1.56
1.67
2.17
2.22
1.59
1.66
2.44
1.71
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
T
PCKDO_DCR
PCKCO_CPM
T
TPCKCO_RST
TPCKCO_DBG
Debug control outputs
Trace control outputs
TPCKCO_TRC
Clock
CPMC405CLOCK minimum pulse width, high
CPMC405CLOCK minimum pulse width, low
TCPWH
TCPWL
1.25
1.25
1.42
1.42
1.66
1.66
ns, min
ns, min
Table 17: Processor Block PLB Switching Characteristics
Speed Grade
-6
Description
Symbol
-7
-5
Units
Setup and Hold Relative to Clock (PLBCLK)
Processor Local Bus(ICU/DCU) control inputs
Processor Local Bus (ICU/DCU) data inputs
Clock to Out
TPCCK_PLB/TPCKC_PLB
0.98/ 0.18
0.62/ 0.16
1.12/ 0.21
0.71/ 0.18
1.23/ 0.23
0.78/ 0.20
ns, min
ns, min
TPDCK_PLB/TPCKD_PLB
Processor Local Bus(ICU/DCU) control outputs
Processor Local Bus(ICU/DCU) address bus outputs
Processor Local Bus(ICU/DCU) data bus outputs
TPCKCO_PLB
1.34
1.16
1.44
1.54
1.34
1.65
1.69
1.47
1.81
ns, max
ns, max
ns, max
T
PCKAO_PLB
PCKDO_PLB
T
DS083-3 (v3.0) December 10, 2003
www.xilinx.com
13
Product Specification
1-800-255-7778
R
Virtex-II Pro Switching Characteristics
Table 18: Processor Block JTAG Switching Characteristics
Speed Grade
-6
Description
Symbol
-7
-5
Units
Setup and Hold Relative to Clock (JTAGC405TCK)
TPCCK_JTAG/
PCKC_JTAG
JTAG control inputs
JTAG reset input
0.80/ 0.70
0.80/ 0.70
0.80/ 0.70
0.80/ 0.70
0.88/ 0.77
0.88/ 0.77
ns, min
ns, min
T
TPCCK_JTAGRST/
TPCKC_JTAGRST
Clock to Out
JTAG control outputs
TPCKCO_JTAG
1.34
1.54
1.69
ns, max
Table 19: PowerPC 405 Data-Side On-Chip Memory Switching Characteristics
Speed Grade
-6
Description
Symbol
-7
-5
Units
Setup and Hold Relative to Clock
(BRAMDSOCMCLK)
TPDCK_DSOCM/
TPCKD_DSOCM
Data-Side On-Chip Memory data bus inputs
0.73/ 0.83
0.84/ 0.95
0.92/ 1.05
ns, min
Clock to Out
Data-Side On-Chip Memory control outputs
Data-Side On-Chip Memory address bus outputs
Data-Side On-Chip Memory data bus outputs
TPCKCO_DSOCM
1.58
1.46
0.90
1.82
1.68
1.03
1.99
1.84
1.13
ns, max
ns, max
ns, max
T
PCKAO_DSOCM
PCKDO_DSOCM
T
Table 20: PowerPC 405 Instruction-Side On-Chip Memory Switching Characteristics
Speed Grade
Description
Symbol
-7
-6
-5
Units
Setup and Hold Relative to Clock (BRAMISOCMCLK)
TPDCK_ISOCM/
TPCKD_ISOCM
Instruction-Side On-Chip Memory data bus inputs
0.81/ 0.68
0.93/ 0.78
1.02/ 0.86
ns, min
Clock to Out
Instruction-Side On-Chip Memory control outputs
Instruction-Side On-Chip Memory address bus outputs
Instruction-Side On-Chip Memory data bus outputs
TPCKCO_ISOCM
1.33
1.52
1.35
1.53
1.75
1.55
1.68
1.92
1.70
ns, max
ns, max
ns, max
T
PCKAO_ISOCM
PCKDO_ISOCM
T
14
www.xilinx.com
DS083-3 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: DC and Switching Characteristics
RocketIO Switching Characteristics
Table 21: RocketIO Reference Clock Switching Characteristics
All Speed Grades
Description
Symbol
Conditions
Min
Typ
Max
Units
MHz
MHz
ppm
ps
Full rate operation
Half rate operation
50
60
156.25
100
100
1000
1000
55
Reference Clock frequency range(1)
FGCLK
Reference Clock frequency tolerance
Reference Clock rise time
FGTOL
TRCLK
TFCLK
20% – 80%
20% – 80%
600
600
50
Reference Clock fall time
ps
Reference Clock duty cycle
TDCREF
45
%
3.125 Gbps operation
2.5 Gbps operation
1.06 Gbps operation
40
ps
Reference Clock total jitter, peak-peak(2)
TGJTT
50
ps
120
ps
Clock recovery frequency acquisition time
Clock recovery phase acquisition time
Notes:
TLOCK
10
µs
TPHASE
960
bits
1. BREFCLK/BREFCLK2 can be used for all serial bit rates up to the maximum shown. REFCLK/REFCLK2 can be used for serial bit
rates up to 2.5 Gb/s (REFCLK = 125 MHz). All other parameters apply equally to REFCLK, REFCLK2, BREFCLK, and BREFCLK2
except as noted.
2. Measured at the package pin. For reference clock frequencies equal to or above 125 MHz, BREFCLK/BREFCLK2 must be used.
TRCLK
80%
20%
TFCLK
DS083-3_01_120302
Figure 3: Reference Clock Timing Parameters
DS083-3 (v3.0) December 10, 2003
www.xilinx.com
15
Product Specification
1-800-255-7778
R
Virtex-II Pro Switching Characteristics
Table 22: RocketIO Receiver Switching Characteristics
Description
Receive total jitter tolerance
Receive deterministic jitter tolerance
Receive latency(2)
Symbol
TJTOL
Conditions
Min
Typ
Max
0.65
0.41
42(3)
55
Units
UI(1)
TDJTOL
TRXLAT
TRXDC
TRX2DC
BER
UI
RXUSRCLK cycles
25
50
50
RXUSRCLK duty cycle
RXUSRCLK2 duty cycle
Bit error rate
45
45
%
%
55
10–12
Notes:
1. UI = Unit Interval
2. Receive latency delay RXP/RXN to RXDATA. Refer to RocketIO Transceiver User Guide for more information on calculating
latency.
3. This maximum may occur when certain conditions are present and clock correction and channel bonding are enabled. If these
functions are both disabled, the maximum will be near the typical values.
DATA ORIGINATES
. . . . .
. . . . .
. . . . .
. . . .
1
2
20 21 22
820 821 822
840 841 842
RXP/RXN
TRXLAT
DATA ARRIVES
RXDATA[16:0]
RXUSRCLK2
0
1
41
42
DS083-3_02_082301
Figure 4: Receive Latency (Maximum)
16
www.xilinx.com
DS083-3 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: DC and Switching Characteristics
Table 23: RocketIO Transmitter Switching Characteristics
Description
Symbol
Conditions
Min
1.0
Typ
Max
3.125(1)
2.5(1)
1.0
Units
Gb/s
Gb/s
Gb/s
Gb/s
UI(2)
UI
Flipchip packages
Wirebond packages
Flipchip packages
Wirebond packages
Serial data rate, full-speed clock
1.0
FGTX
0.600
0.600
Serial data rate, half-speed clock
1.0
Serial data output deterministic jitter
Serial data output random jitter
TX rise time
TDJ
TRJ
0.17
0.18
TRTX
TFTX
120
120
14
8
ps
20% – 80%
TX fall time
ps
Including CRC
Excluding CRC
17
11
55
55
TXUSR
CLK
cycles
Transmit latency(3)
TTXLAT
%
%
TXUSRCLK duty cycle
TXUSRCLK2 duty cycle
Notes:
TTXDC
45
45
50
50
TTX2DC
1. Serial data rate in the -5 speed grade is limited to 2.0 Gb/s in both wirebond and flipchip packages.
2. UI = Unit Interval
3. Transmit latency delay TXDATA to TXP/TXN. Refer to RocketIO Transceiver User Guide for more information on calculating
latency.
. . . . .
. . . . .
. . . . .
. . . .
1
2
20 21 22
320 321 322
340 341 342
TXP/TXN
TTXLAT
DATA ARRIVES
DATA ORIGINATES
TXDATA[16:0]
TXUSRCLK2
0
1
16
17
DS083-3_03_082301
Figure 5: Transmit Latency (Maximum, Including CRC)
DS083-3 (v3.0) December 10, 2003
www.xilinx.com
17
Product Specification
1-800-255-7778
R
Virtex-II Pro Switching Characteristics
Table 24: RocketIO RXUSRCLK Switching Characteristics
Speed Grade
-6
Description
Symbol
-7
-5
Units
Setup and Hold Relative to Clock
(RXUSRCLK)
CHBONDI control inputs
Clock to Out
TGCCK_CHBI/TGCKC_CHBI
TGCKCO_CHBO
0.00/ 0.12
0.50
0.00/ 0.12
0.50
0.00/ 0.14
0.55
ns, min
ns, max
CHBONDO control outputs
Clock
RXUSRCLK minimum pulse width, High
RXUSRCLK minimum pulse width, Low
TGPWH_RX
0.80
0.40
0.80
0.40
0.88
0.44
ns, min
ns, min
T
GPWL_RX
Table 25: RocketIO RXUSRCLK2 Switching Characteristics
Speed Grade
-6
Description
Symbol
-7
-5
Units
Setup and Hold Relative to Clock
(RXUSRCLK2)
RXRESET control input
RXPOLARITY control input
ENCHANSYNC control input
Clock to Out
TGCCK_RRST/TGCKC_RRST
TGCCK_RPOL/TGCKC_RPOL
TGCCK_ECSY/TGCKC_ECSY
0.02/ 0.00
0.02/ 0.00
0.02/ 0.00
0.02/ 0.00
0.02/ 0.00
0.02/ 0.00
0.02/ 0.00
0.02/ 0.00
0.02/ 0.00
ns, min
ns, min
ns, min
RXNOTINTABLE status outputs
RXDISPERR status outputs
RXCHARISCOMMA status outputs
RXREALIGN status output
RXCOMMADET status output
RXLOSSOFSYNC status outputs
RXCLKCORCNT status outputs
RXBUFSTATUS status outputs
RXCHECKINGCRC status output
RXCRCERR status output
CHBONDDONE status output
RXCHARISK status outputs
RXRUNDISP status outputs
RXDATA data outputs
TGCKST_RNIT
0.50
0.50
0.50
0.41
0.41
0.50
0.41
0.45
0.36
0.36
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.41
0.41
0.50
0.41
0.45
0.40
0.40
0.50
0.50
0.50
0.50
0.55
0.55
0.55
0.46
0.46
0.55
0.46
0.50
0.44
0.44
0.55
0.55
0.55
0.55
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
T
GCKST_RDERR
GCKST_RCMCH
TGCKST_ALIGN
GCKST_CMDT
GCKST_RLOS
TGCKST_RCCCNT
GCKST_RBSTA
GCKST_RCCRC
TGCKST_RCRCE
T
T
T
T
T
T
GCKST_CHBD
GCKST_RKCH
T
TGCKST_RRDIS
GCKDO_RDAT
T
Clock
RXUSRCLK2 minimum pulse width, High
RXUSRCLK2 minimum pulse width, Low
TGPWH_RX2
GPWL_RX2
1.44
0.72
1.44
0.72
2.25
1.13
ns, min
ns, min
T
18
www.xilinx.com
DS083-3 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: DC and Switching Characteristics
Table 26: RocketIO TXUSRCLK Switching Characteristics
Speed Grade
-6
Description
Symbol
-7
-5
Units
Setup and Hold Relative to Clock
(TXUSRCLK2)
CONFIGENABLE control input
TXBYPASS8B10B control inputs
TXFORCECRCERR control input
TXPOLARITY control input
TXINHIBIT control inputs
TGCCK_CFGEN/TGCKC_CFGEN
0.35/ 0.10
0.02/ 0.00
0.39/ 0.12
0.02/ 0.00
0.02/ 0.00
0.02/ 0.00
0.02/ 0.10
0.02/ 0.00
0.02/ 0.00
0.02/ 0.00
0.35/ 0.10
0.00/ 0.70
0.35/ 0.10
0.02/ 0.00
0.44/ 0.14
0.02/ 0.00
0.02/ 0.00
0.02/ 0.00
0.02/ 0.10
0.02/ 0.00
0.02/ 0.00
0.02/ 0.00
0.35/ 0.10
0.00/ 0.70
0.39/ 0.11
0.02/ 0.00
0.49/ 0.15
0.02/ 0.00
0.02/ 0.00
0.02/ 0.00
0.02/ 0.11
0.02/ 0.00
0.02/ 0.00
0.02/ 0.00
0.39/ 0.11
0.00/ 0.70
ns, min
ns, min
ns, min
ns, min
ns, min
ns, min
ns, min
ns, min
ns, min
ns, min
ns, min
ns, min
T
GCCK_TBYP/TGCKC_TBYP
GCCK_TCRCE/TGCKC_TCRCE
T
T
GCCK_TPOL/TGCKC_TPOL
GCCK_TINH/TGCKC_TINH
T
LOOPBACK control inputs
TXRESET control input
TGCCK_LBK/TGCKC_LBK
TGCCK_TRST/TGCKC_TRST
TXCHARISK control inputs
TXCHARDISPMODE control inputs
TXCHARDISPVAL control inputs
CONFIGIN data input
T
GCCK_TKCH/TGCKC_TKCH
GCCK_TCDM/TGCKC_TCDM
TGCCK_TCDV/TGCKC_TCDV
GDCK_CFGIN/TGCKD_CFGIN
T
T
TXDATA data inputs
TGDCK_TDAT/TGCKD_TDAT
Clock to Out
TXBUFERR status output
TXKERR status outputs
TGCKST_TBERR
0.54
0.41
0.41
0.25
0.54
0.41
0.41
0.25
0.60
0.46
0.46
0.28
ns, max
ns, max
ns, max
ns, max
TGCKST_TKERR
TXRUNDISP status outputs
CONFIGOUT data output
TGCKST_TRDIS
TGCKDO_CFGOUT
Clock
TXUSRCLK minimum pulse width, High
TXUSRCLK minimum pulse width, Low
TXUSRCLK2 minimum pulse width, High
TXUSRCLK2 minimum pulse width, Low
TGPWH_TX
2.88
1.44
1.44
0.72
2.88
1.44
1.44
0.72
4.50
2.25
2.25
1.13
ns, min
ns, min
ns, min
ns, min
TGPWL_TX
TGPWH_TX2
TGPWL_TX2
DS083-3 (v3.0) December 10, 2003
www.xilinx.com
19
Product Specification
1-800-255-7778
R
Virtex-II Pro Switching Characteristics
IOB Input Switching Characteristics
Input delays associated with the pad are specified for LVCMOS 2.5V levels. For other standards, adjust the delays with the
values shown in IOB Input Switching Characteristics Standard Adjustments.
Table 27: IOB Input Switching Characteristics
Speed Grade
Description
Propagation Delays
Symbol
Device
-5
Units
-7
-6
Pad to I output, no delay
Pad to I output, with delay
TIOPI
All
0.84
1.91
1.91
1.91
2.10
1.60
1.76
1.95
2.10
0.87
2.07
2.07
2.07
2.32
1.72
1.89
2.07
2.21
3.52
0.91
2.26
2.26
2.26
2.54
1.83
2.02
2.17
2.33
3.82
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
TIOPID
XC2VP2
XC2VP4
XC2VP7
XC2VP20
XC2VP30
XC2VP40
XC2VP50
XC2VP70
XC2VP100
XC2VP125
Propagation Delays
Pad to output IQ via transparent latch,
no delay
TIOPLI
All
0.86
0.89
0.93
ns, max
Pad to output IQ via transparent latch,
with delay
TIOPLID
XC2VP2
XC2VP4
XC2VP7
XC2VP20
XC2VP30
XC2VP40
XC2VP50
XC2VP70
XC2VP100
XC2VP125
All
2.46
2.73
2.64
2.80
2.76
3.34
3.93
4.19
2.77
3.04
2.96
3.20
3.19
3.67
4.16
4.42
6.61
3.11
3.38
3.29
3.60
3.57
4.06
4.49
4.74
7.16
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
Clock CLK to output IQ
TIOCKIQ
0.60
0.60
0.67
20
www.xilinx.com
DS083-3 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: DC and Switching Characteristics
Table 27: IOB Input Switching Characteristics (Continued)
Speed Grade
-6
Description
Symbol
Device
-5
Units
-7
Setup and Hold Times With Respect to
Clock at IOB Input Register
Pad, no delay
TIOPICK/TIOICKP
All
2.44/–1.45
2.71/–1.67
2.62/–1.60
2.78/–1.72
2.74/–1.69
3.32/–2.15
3.91/–2.63
4.17/–2.83
2.44/–1.45
2.75/–1.68 3.09/–1.93
3.02/–1.90 3.36/–2.15
2.94/–1.83 3.27/–2.07
3.18/–2.03 3.58/–2.32
3.17/–2.02 3.54/–2.30
3.65/–2.40 4.04/–2.69
4.14/–2.80 4.47/–3.04
4.40/–3.00 4.72/–3.23
2.75/–1.68 3.09/–1.93
6.59/–4.76 7.14/–5.17
ns, min
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, min
ns, min
Pad, with delay
TIOPICKD/TIOICKPD
XC2VP2
XC2VP4
XC2VP7
XC2VP20
XC2VP30
XC2VP40
XC2VP50
XC2VP70
XC2VP100
XC2VP125
All
ICE input
TIOICECK/TIOCKICE
TIOSRCKI
0.39/ 0.01
0.52
0.44/ 0.01
0.57
0.49/ 0.01
0.75
SR input (IFF, synchronous)
Set/Reset Delays
SR input to IQ (asynchronous)
GSR to output IQ
Notes:
All
TIOSRIQ
TGSRQ
All
All
1.13
5.87
1.27
6.75
1.42
7.43
ns, max
ns, max
1. Input timing for LVCMOS25 is measured at 1.25V. For other I/O standards, see Table 31.
DS083-3 (v3.0) December 10, 2003
www.xilinx.com
21
Product Specification
1-800-255-7778
R
Virtex-II Pro Switching Characteristics
IOB Input Switching Characteristics Standard Adjustments
Table 28: IOB Input Switching Characteristics Standard Adjustments
Speed Grade
-6
Description
Symbol
Standard
-5
Units
-7
Data Input Delay Adjustments
Standard-specific data input delay
adjustments
TILVTTL
TILVCMOS33
TILVCMOS25
TILVCMOS18
TILVCMOS15
TILVDS_25
TILVDS_25_DT
TIPCI33_3
LVTTL
LVCMOS
0.07
0.04
0.00
0.29
0.36
0.31
0.31
0.14
0.15
0.12
0.59
0.63
0.59
0.59
0.57
0.58
0.57
0.55
0.56
0.57
0.62
0.64
–0.05
0.00
0.07
0.13
0.00
0.07
0.13
0.49
0.27
0.27
0.27
0.27
0.08
0.05
0.00
0.33
0.41
0.36
0.36
0.16
0.17
0.13
0.68
0.72
0.68
0.68
0.66
0.67
0.65
0.63
0.64
0.65
0.72
0.73
0.09
0.05
0.00
0.36
0.45
0.40
0.40
0.18
0.19
0.15
0.74
0.79
0.75
0.75
0.72
0.74
0.72
0.69
0.70
0.71
0.79
0.81
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
LVCMOS25
LVCMOS18
LVCMOS15
LVDS_25
LVDS_25_DT
PCI, 33 MHz, 3.3V
PCI, 66 MHz, 3.3V
PCI-X
TIPCI66_3
TIPCIX
TIGTL
GTL
TIGTLP
GTLP
TIHSTL_I
HSTL_I
TIHSTL_II
HSTL_II
TIHSTL_III
HSTL_III
TIHSTL_IV
HSTL_IV
TIHSTL_I_18
TIHSTL_II_18
TIHSTL_III_18
TIHSTL_IV_18
TISSTL2_I
HSTL_I_18
HSTL_II_18
HSTL_III_18
HSTL_IV_18
SSTL2_I
TISSTL2_II
SSTL2_II
TILVDCI33
LVDCI_33
LVDCI_25
LVDCI_18
LVDCI_15
LVDCI_DV2_25
LVDCI_DV2_18
LVDCI_DV2_15
GTL_DCI
–0.05
0.00
0.09
0.15
0.00
0.09
0.15
0.57
0.31
0.31
0.31
0.31
–0.06
0.00
0.09
0.17
0.00
0.09
0.17
0.62
0.35
0.35
0.35
0.35
TILVDCI25
TILVDCI18
TILVDCI15
TILVDCI_DV2_25
TILVDCI_DV2_18
TILVDCI_DV2_15
TIGTL_DCI
TIGTLP_DCI
TIHSTL_I_DCI
TIHSTL_II_DCI
TIHSTL_III_DCI
GTLP_DCI
HSTL_I_DCI
HSTL_II_DCI
HSTL_III_DCI
22
www.xilinx.com
1-800-255-7778
DS083-3 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: DC and Switching Characteristics
Table 28: IOB Input Switching Characteristics Standard Adjustments (Continued)
Speed Grade
Description
Symbol
TIHSTL_IV_DCI
TIHSTL_I_DCI_18
TIHSTL_II_DCI_18
TIHSTL_III_DCI_18
TIHSTL_IV_DCI_18
TISSTL2_I_DCI
TISSTL2_II_DCI
TILVDSEXT_25
TILVDSEXT_25_DT
TILDT_25
Standard
HSTL_IV_DCI
HSTL_I_DCI_18
HSTL_II_DCI_18
HSTL_III_DCI_18
HSTL_IV_DCI_18
SSTL2_I_DCI
SSTL2_II_DCI
LVDSEXT_25
LVDSEXT_25_DT
LDT_25
-5
Units
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
-7
-6
Standard-specific data input delay
adjustments (continued)
0.27
0.27
0.27
0.27
0.27
0.17
0.17
0.33
0.33
0.31
0.31
0.00
0.31
0.31
0.31
0.33
0.69
0.62
0.64
0.62
0.64
0.31
0.31
0.31
0.31
0.31
0.20
0.20
0.37
0.37
0.36
0.36
0.00
0.36
0.36
0.36
0.37
0.80
0.72
0.73
0.72
0.73
0.35
0.35
0.35
0.35
0.35
0.22
0.22
0.41
0.41
0.40
0.40
0.00
0.40
0.40
0.40
0.41
0.88
0.79
0.81
0.79
0.81
TILDT_25_DT
LDT_25_DT
TIBLVDS_25
BLVDS_25
TIULVDS_25
ULVDS_25
TIULVDS_25_DT
TILVDS_25_DCI
TILVDSEXT_25_DCI
TILVPECL_25
ULVDS_25_DT
LVDS_25_DCI
LVDSEXT_25_DCI
LVPECL_25
TISSTL18_I
SSTL18_I
TISSTL18_II
SSTL18_II
TISSTL18_I_DCI
TISSTL18_II_DCI
SSTL18_I_DCI
SSTL18_II_DCI
DS083-3 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
23
R
Virtex-II Pro Switching Characteristics
IOB Output Switching Characteristics
Output delays terminating at a pad are specified for LVCMOS25 with 12 mA drive and fast slew rate. For other standards,
adjust the delays with the values shown in IOB Output Switching Characteristics Standard Adjustments.
Table 29: IOB Output Switching Characteristics
Speed Grade
Description
Propagation Delays
Symbol
-5
Units
-7
-6
O input to Pad
TIOOP
1.58
1.65
1.68
1.82
1.85
1.99
ns, max
ns, max
O input to Pad via transparent latch
3-State Delays
TIOOLP
T input to Pad high-impedance(2)
T input to valid data on Pad
TIOTHZ
TIOTP
1.23
1.51
1.08
1.35
1.63
1.22
1.51
1.78
1.36
ns, max
ns, max
T input to Pad high-impedance via
transparent latch(2)
TIOTLPHZ
ns, max
T input to valid data on Pad via transparent latch
GTS to Pad high-impedance(2)
Sequential Delays
TIOTLPON
TGTS
1.56
4.11
1.69
4.73
1.85
5.20
ns, max
ns, max
Clock CLK to Pad
TIOCKP
TIOCKHZ
TIOCKON
1.59
1.39
1.67
1.76
1.55
1.82
1.93
1.73
2.00
ns, max
ns, max
ns, max
Clock CLK to Pad high-impedance (synchronous)(2)
Clock CLK to valid data on Pad (synchronous)
Setup and Hold Times Before/After Clock CLK
O input
TIOOCK/TIOCKO
0.23/ 0.12
0.39/ 0.01
0.52/ 0.00
0.23/ 0.12
0.39/ 0.01
0.52/ 0.00
0.26/ 0.14
0.44/ 0.01
0.57/ 0.00
0.26/ 0.14
0.44/ 0.01
0.57/ 0.00
0.29/ 0.15
0.49/ 0.01
0.75/ 0.00
0.29/ 0.15
0.49/ 0.01
0.75/ 0.00
ns, min
ns, min
ns, min
ns, min
ns, min
ns, min
OCE input
T
IOOCECK/TIOCKOCE
SR input (OFF)
TIOSRCKO/TIOCKOSR
IOTCK/TIOCKT
IOTCECK/TIOCKTCE
3–State Setup Times, T input
3-State Setup Times, TCE input
3-State Setup Times, SR input (TFF)
Set/Reset Delays
T
T
TIOSRCKT/TIOCKTSR
SR input to Pad (asynchronous)
SR input to Pad high-impedance (asynchronous)(2)
SR input to valid data on Pad (asynchronous)
GSR to Pad
TIOSRP
TIOSRHZ
TIOSRON
TIOGSRQ
2.33
1.97
2.24
5.87
2.56
2.16
2.44
6.75
2.83
2.41
2.69
7.43
ns, max
ns, max
ns, max
ns, max
Notes:
1. A Zero “0” Hold Time listing indicates no hold time or a negative hold time. Negative values can not be guaranteed “best-case”, but
if a “0” is listed, there is no positive hold time.
2. The 3-state turn-off delays should not be adjusted.
24
www.xilinx.com
DS083-3 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: DC and Switching Characteristics
IOB Output Switching Characteristics Standard Adjustments
Output delays terminating at a pad are specified for LVCMOS25 with 12 mA drive and fast slew rate. For other standards,
adjust the delays by the values shown.
Table 30: IOB Output Switching Characteristics Standard Adjustments
Output Delay Adjustments
Symbol
Speed Grade
-6
Description
Standard
LVDS
-7
-5
Units
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Standard-specific adjustments for
output delays terminating at pads
(based on standard capacitive load,
Csl)
TOLVDS_25
TOLVDSEXT_25
TOLDT_25
0.01
0.13
0.13
0.00
0.13
0.65
0.69
0.69
1.23
2.34
0.56
0.30
0.31
0.15
0.56
0.30
0.36
0.19
0.63
0.22
5.42
3.09
2.26
1.47
1.02
0.46
0.37
4.42
1.95
1.10
0.40
0.24
0.05
–0.01
5.42
0.01
0.15
0.14
0.00
0.14
0.75
0.79
0.79
1.41
2.69
0.64
0.35
0.35
0.17
0.64
0.35
0.41
0.22
0.72
0.25
6.24
3.55
2.60
1.69
1.18
0.53
0.42
5.09
2.24
1.26
0.46
0.27
0.06
–0.01
6.23
0.01
0.16
0.16
0.00
0.16
0.83
0.87
0.87
1.55
2.96
0.70
0.38
0.39
0.19
0.70
0.38
0.45
0.24
0.79
0.27
6.86
3.91
2.86
1.86
1.29
0.58
0.47
5.59
2.46
1.39
0.51
0.30
0.07
–0.01
6.86
LVDSEXT
LDT
TOBLVDS_25
TOULVDS_25
TOPCI33_3
BLVDS
ULVDS
PCI, 33 MHz, 3.3V
PCI, 66 MHz, 3.3V
PCI-X
TOPCI66_3
TOPCIX
TOGTL
GTL
TOGTLP
GTLP
TOHSTL_I
HSTL_I
TOHSTL_II
HSTL_II
TOHSTL_IIII
TOHSTL_IV
HSTL_III
HSTL_IV
HSTL_I_18
HSTL_II_18
HSTL_III_18
HSTL_IV_18
SSTL2_I
SSTL2_II
LVTTL, Slow, 2 mA
4 mA
TOHSTL_I_18
TOHSTL_II_18
TOHSTL_IIII_18
TOHSTL_IV_18
TOSSTL2_I
TOSSTL2_II
TOLVTTL_S2
TOLVTTL_S4
TOLVTTL_S6
TOLVTTL_S8
TOLVTTL_S12
TOLVTTL_S16
TOLVTTL_S24
TOLVTTL_F2
TOLVTTL_F4
TOLVTTL_F6
TOLVTTL_F8
TOLVTTL_F12
TOLVTTL_F16
TOLVTTL_F24
TOLVCMOS33_S2
6 mA
8 mA
12 mA
16 mA
24 mA
LVTTL, Fast, 2 mA
4 mA
6 mA
8 mA
12 mA
16 mA
24 mA
LVCMOS33, Slow, 2 mA
DS083-3 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
25
R
Virtex-II Pro Switching Characteristics
Table 30: IOB Output Switching Characteristics Standard Adjustments (Continued)
Output Delay Adjustments
Speed Grade
-6
Description
Symbol
Standard
-7
-5
Units
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Standard-specific adjustments for
output delays terminating at pads
(based on standard capacitive load,
Csl)
TOLVCMOS33_S4
TOLVCMOS33_S6
TOLVCMOS33_S8
TOLVCMOS33_S12
TOLVCMOS33_S16
TOLVCMOS33_S24
TOLVCMOS33_F2
TOLVCMOS33_F4
TOLVCMOS33_F6
TOLVCMOS33_F8
TOLVCMOS33_F12
TOLVCMOS33_F16
TOLVCMOS33_F24
TOLVCMOS25_S2
TOLVCMOS25_S4
TOLVCMOS25_S6
TOLVCMOS25_S8
TOLVCMOS25_S12
TOLVCMOS25_S16
TOLVCMOS25_S24
TOLVCMOS25_F2
TOLVCMOS25_F4
TOLVCMOS25_F6
TOLVCMOS25_F8
TOLVCMOS25_F12
TOLVCMOS25_F16
TOLVCMOS25_F24
TOLVCMOS18_S2
TOLVCMOS18_S4
TOLVCMOS18_S6
TOLVCMOS18_S8
TOLVCMOS18_S12
TOLVCMOS18_S16
TOLVCMOS18_F2
TOLVCMOS18_F4
TOLVCMOS18_F6
TOLVCMOS18_F8
TOLVCMOS18_F12
4 mA
3.14
2.26
1.47
1.03
0.45
0.39
4.46
1.96
1.11
0.41
0.23
0.02
–0.07
4.12
2.43
1.76
1.04
0.76
0.41
0.23
3.29
1.31
0.62
0.20
0.00
–0.03
–0.16
4.20
2.76
1.91
1.92
1.58
0.76
2.34
0.71
0.50
0.48
0.30
3.61
2.60
1.69
1.18
0.52
0.44
5.13
2.25
1.28
0.47
0.26
0.02
–0.08
4.74
2.80
2.02
1.19
0.87
0.47
0.26
3.78
1.50
0.71
0.23
0.00
–0.03
–0.18
4.83
3.18
2.20
2.20
1.81
0.87
2.69
0.81
0.57
0.55
0.34
3.97
2.86
1.86
1.30
0.57
0.49
5.64
2.48
1.40
0.52
0.28
0.03
–0.09
5.21
3.07
2.22
1.31
0.96
0.52
0.28
4.16
1.65
0.78
0.25
0.00
–0.04
–0.20
5.31
3.49
2.41
2.42
1.99
0.96
2.95
0.89
0.63
0.61
0.38
6 mA
8 mA
12 mA
16 mA
24 mA
LVCMOS33, Fast, 2 mA
4 mA
6 mA
8 mA
12 mA
16 mA
24 mA
LVCMOS25, Slow, 2 mA
4 mA
6 mA
8 mA
12 mA
16 mA
24 mA
LVCMOS25, Fast, 2 mA
4 mA
6 mA
8 mA
12 mA
16 mA
24 mA
LVCMOS18, Slow, 2 mA
4 mA
6 mA
8 mA
1 mA
16 mA
LVCMOS18, Fast, 2 mA
4 mA
6 mA
8 mA
12 mA
26
www.xilinx.com
1-800-255-7778
DS083-3 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: DC and Switching Characteristics
Table 30: IOB Output Switching Characteristics Standard Adjustments (Continued)
Output Delay Adjustments
Speed Grade
-6
Description
Symbol
Standard
16 mA
-7
-5
Units
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Standard-specific adjustments for
output delays terminating at pads
(based on standard capacitive load,
Csl)
TOLVCMOS18_F16
TOLVCMOS15_S2
TOLVCMOS15_S4
TOLVCMOS15_S6
TOLVCMOS15_S8
TOLVCMOS15_S12
TOLVCMOS15_S16
TOLVCMOS15_F2
TOLVCMOS15_F4
TOLVCMOS15_F6
TOLVCMOS15_F8
TOLVCMOS15_F12
TOLVCMOS15_F16
TOLVDCI33
0.11
6.19
4.28
2.81
2.55
1.31
1.28
2.26
1.66
0.65
0.94
0.25
0.28
0.72
0.56
0.65
1.00
0.06
0.30
0.60
1.21
2.35
0.55
0.47
0.31
1.81
0.55
0.24
0.35
1.48
0.48
0.48
0.17
0.80
0.45
0.54
0.24
0.12
7.12
4.93
3.24
2.93
1.51
1.47
2.60
1.90
0.75
1.08
0.29
0.32
0.83
0.64
0.75
1.15
0.07
0.34
0.69
1.39
2.71
0.63
0.54
0.36
2.08
0.63
0.28
0.40
1.70
0.56
0.56
0.19
0.92
0.51
0.62
0.28
0.13
7.83
5.42
3.56
3.23
1.66
1.62
2.86
2.09
0.82
1.19
0.32
0.35
0.91
0.71
0.82
1.26
0.08
0.38
0.76
1.53
2.98
0.69
0.60
0.40
2.29
0.70
0.31
0.44
1.87
0.61
0.61
0.21
1.01
0.56
0.68
0.31
LVCMOS15, Slow, 2 mA
4 mA
6 mA
8 mA
12 mA
16 mA
LVCMOS15, Fast, 2 mA
4 mA
6 mA
8 mA
12 mA
16 mA
LVDCI_33
TOLVDCI25
LVDCI_25
TOLVDCI18
LVDCI_18
TOLVDCI15
LVDCI_15
TOLVDCI_DV2_25
TOLVDCI_DV2_18
TOLVDCI_DV2_15
TOGTL_DCI
LVDCI_DV2_25
LVDCI_DV2_18
LVDCI_DV2_15
GTL_DCI
TOGTLP_DCI
GTLP_DCI
TOHSTL_I_DCI
HSTL_I_DCI
HSTL_II_DCI
HSTL_III_DCI
HSTL_IV_DCI
HSTL_I_DCI_18
HSTL_II_DCI_18
HSTL_III_DCI_18
HSTL_IV_DCI_18
SSTL2_I_DCI
SSTL2_II_DCI
LVPECL_25
SSTL18_I
TOHSTL_II_DCI
TOHSTL_III_DCI
TOHSTL_IV_DCI
TOHSTL_I_DCI_18
TOHSTL_II_DCI_18
TOHSTL_III_DCI_18
TOHSTL_IV_DCI_18
TOSSTL2_I_DCI
TOSSTL2_II_DCI
TOLVPECL_25
TOSSTL18_I
TOSSTL18_II
SSTL18_II
TOSSTL18_I_DCI
TOSSTL18_II_DCI
SSTL18_I_DCI
SSTL18_II_DCI
DS083-3 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
27
R
Virtex-II Pro Switching Characteristics
I/O Standard Adjustment Measurement Methodology
Input Delay Measurements
Output Delay Measurements
Table 31 shows the test setup parameters used for measur-
ing Input standard adjustments (see Table 28, page 22).
Output delays are measured using a Tektronix P6245
TDS500/600 probe (< 1 pf) across approximately 4" of FR4
microstrip trace. Standard termination was used for all test-
ing. (See Virtex-II Pro Platform FPGA User Guide for
details.) The propagation delay of the 4" trace is character-
ized separately and subtracted from the final measurement,
and is therefore not included in the generalized test setup
shown in Figure 6.
Table 31: Input Delay Measurement Methodology
VREF
(2,4)
V
MEAS
(1)
(1)
Standard
VL
VH
3.3
(3,4)
LVTTL
0
1.65
1.65
1.25
0.9
–
–
LVCMOS33
LVCMOS25
LVCMOS18
LVCMOS15
PCI33_3
0
0
0
0
3.3
Measurements and test conditions are reflected in the IBIS
models except where the IBIS format precludes it. (IBIS
models can be found on the web at http://support.xil-
2.5
1.8
–
–
inx.com/support/sw_ibis.htm.) Parameters VREF , RREF
,
CREF , and VMEAS fully describe the test conditions for each
I/O standard. The most accurate prediction of propagation
delay in any given application can be obtained through IBIS
simulation, using the following method:
1.5
0.75
–
Per PCI Specification
Per PCI Specification
–
PCI66_3
–
1. Simulate the output driver of choice into the generalized
test setup, using values from Table 32.
PCI-X
Per PCI-X Specification
–
GTL
V
REF – 0.2
VREF + 0.2
VREF + 0.2
VREF + 0.5
VREF + 0.5
VREF + 0.5
VREF + 0.5
VREF
VREF
VREF
VREF
VREF
VREF
0.80
1.0
0.75
0.75
0.90
0.90
2. Record the time to VMEAS
.
GTLP
VREF – 0.2
3. Simulate the output driver of choice into the actual PCB
trace and load, using the appropriate IBIS model or
capacitance value to represent the load.
HSTL Class I
HSTL Class II
HSTL Class III
HSTL Class IV
V
REF – 0.5
REF – 0.5
V
4. Record the time to VMEAS
.
VREF – 0.5
5. Compare the results of steps 2 and 4. The increase or
decrease in delay should be added to or subtracted
from the I/O Output Standard Adjustment value
(Table 30) to yield the actual worst-case propagation
delay (clock-to-input) of the PCB trace.
V
REF – 0.5
REF – 0.5
HSTL18
Class I
V
VREF + 0.5
VREF + 0.5
VREF + 0.5
VREF + 0.5
VREF
VREF
VREF
VREF
VREF
VREF
0.90
0.90
1.08
1.08
1.25
0.9
HSTL18
Class II
VREF – 0.5
VREF – 0.5
VREF – 0.5
VREF
HSTL18
Class III
HSTL18
Class IV
FPGA Output
RREF
SSTL2
Class I & II
VREF – 0.75 VREF + 0.75
VREF – 0.5 VREF + 0.5
VMEAS
SSTL18
Class I & II
(voltage level at which
delay measurement is taken)
CREF
LVDS25
LVDSEXT25
ULVDS25
LDT25
1.2 – 0.125 1.2 + 0.125
1.2 – 0.125 1.2 + 0.125
0.6 – 0.125 0.6 + 0.125
0.6 – 0.125 0.6 + 0.125
1.2
1.2
0.6
0.6
(probe capacitance)
ds083-3_06a_092503
Figure 6: Generalized Test Setup
Notes:
1. Input waveform switches between V and V .
L
H
2. Measurements are made at typical, minimum, and maximum V
REF
values. Reported delays reflect worst case of these measurements.
V
values listed are typical. See Virtex-II Pro Platform FPGA
REF
User Guide for min/max specifications.
3. Input voltage level from which measurement starts.
4. Note that this is an input voltage reference that bears no relation to
the V
/ V
parameters found in IBIS models and/or noted in
REF
MEAS
Figure 6.
28
www.xilinx.com
1-800-255-7778
DS083-3 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: DC and Switching Characteristics
Table 32: Output Delay Measurement Methodology
Table 32: Output Delay Measurement Methodology
(1)
(1)
RREF
(ohms)
CREF
(pF)
VMEAS
(V)
VREF
(V)
RREF
(ohms)
CREF
(pF)
VMEAS
(V)
VREF
(V)
Standard
LVDS25
Standard
LVTTL (all)
50
50
1M
50
1M
1M
1M
1M
1M
50
50
50
50
50
50
50
50
50
50
50
50
50
50
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
VREF
VREF
1.2
1.2
1.2
0
1M
1M
1M
1M
1M
25
25
25
25
25
25
25
25
50
25
50
25
50
25
50
25
50
25
50
25
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1.4
1.65
1.25
0.9
0
0
LVDSEXT25
BLVDS
LVCMOS33
LVCMOS25
0
LDT25
VREF
1.23
1.65
1.25
0.9
0.6
0
LVCMOS18
0
LVPECL25
LVCMOS15
0.75
0.94
2.03
0.94
2.03
0.94
2.03
0.8
0
LVDCI33
0
PCI33_3 - rising edge
PCI33_3 - falling edge
PCI66_3 - rising edge
PCI66_3 - falling edge
PCI-X - rising edge
PCI-X - falling edge
GTL
0
LVDCI25
0
3.3
0
LVDCI18
0
LVDCI15
0.75
VREF
VREF
0.9
0
3.3
0
HSTL DCI Class I
HSTL DCI Class II
HSTL DCI Class III
HSTL DCI Class IV
HSTL18 DCI Class I
HSTL18 DCI Class II
HSTL18 DCI Class III
HSTL18 DCI Class IV
SSTL2 DCI Class I
SSTL2 DCI Class II
SSTL DCI Class I
SSTL DCI Class II
GTL DCI
0.75
0.75
1.5
1.5
0.9
0.9
1.8
1.8
1.25
1.25
0.9
0.9
1.2
1.5
3.3
1.2
1.5
0.75
0.75
1.5
1.5
0.9
0.9
1.8
1.8
1.25
1.25
0.9
0.9
0.9
GTLP
1.0
VREF
VREF
1.1
HSTL Class I
VREF
VREF
0.9
HSTL Class II
HSTL Class III
HSTL Class IV
HSTL18 Class I
HSTL18 Class II
HSTL18 Class III
HSTL18 Class IV
SSTL2 Class I
SSTL2 Class II
SSTL18 Class I
SSTL18 Class II
1.1
0.9
VREF
VREF
VREF
VREF
0.8
VREF
VREF
1.1
1.1
VREF
VREF
VREF
VREF
GTLP DCI
1.0
Notes:
1.
C
is the capacitance of the probe, nominally 0 pF.
REF
DS083-3 (v3.0) December 10, 2003
www.xilinx.com
29
Product Specification
1-800-255-7778
R
Virtex-II Pro Switching Characteristics
CLB Switching Characteristics
Delays originating at F/G inputs vary slightly according to the input used (see Figure 25 in Module 2). The values listed
below are worst-case. Precise values are provided by the timing analyzer.
Table 33: CLB Switching Characteristics
Speed Grade
Description
Symbol
-7
-6
-5
Units
Combinatorial Delays
4-input function: F/G inputs to X/Y outputs
5-input function: F/G inputs to F5 output
5-input function: F/G inputs to X output
FXINA or FXINB inputs to Y output via MUXFX
FXINA input to FX output via MUXFX
FXINB input to FX output via MUXFX
SOPIN input to SOPOUT output via ORCY
TILO
TIF5
0.28
0.59
0.63
0.29
0.29
0.29
0.11
0.32
0.65
0.70
0.32
0.32
0.32
0.13
0.36
0.73
0.79
0.36
0.36
0.36
0.14
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
TIF5X
TIFXY
TINAFX
TINBFX
TSOPSOP
Incremental delay routing through transparent latch to XQ/YQ
outputs
TIFNCTL
0.23
0.24
0.27
ns, max
Sequential Delays
FF Clock CLK to XQ/YQ outputs
Latch Clock CLK to XQ/YQ outputs
Setup and Hold Times Before/After Clock CLK
BX/BY inputs
TCKO
0.37
0.54
0.38
0.57
0.42
0.64
ns, max
ns, max
TCKLO
TDICK/TCKDI
TDYCK/TCKDY
TDXCK/TCKDX
0.21/–0.04 0.24/–0.05 0.27/–0.06 ns, min
DY inputs
0.00/ 0.12
0.00/ 0.12
0.27/ 0.01
0.00/ 0.14
0.00/ 0.14
0.34/ 0.01
0.00/ 0.15
0.00/ 0.15
0.47/ 0.01
ns, min
ns, min
ns, min
DX inputs
CE input
TCECK/TCKCE
SR/BY inputs (synchronous)
Clock CLK
TRCK/TCKR
0.55/–0.01 0.60/–0.01 0.78/–0.01 ns, min
Minimum Pulse Width, High
Minimum Pulse Width, Low
Set/Reset
TCH
TCL
0.37
0.37
0.40
0.40
0.45
0.45
ns, min
ns, min
Minimum Pulse Width, SR/BY inputs
TRPW
TRQ
0.37
1.09
1350
0.40
1.25
1200
0.45
1.40
1050
ns, min
ns, max
MHz
Delay from SR/BY inputs to XQ/YQ outputs
(asynchronous)
Toggle Frequency (MHz) (for export control)
FTOG
Notes:
1. A Zero “0” Hold Time listing indicates no hold time or a negative hold time. Negative values can not be guaranteed “best-case”, but
if a “0” is listed, there is no positive hold time.
30
www.xilinx.com
DS083-3 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: DC and Switching Characteristics
CLB Distributed RAM Switching Characteristics
Table 34: CLB Distributed RAM Switching Characteristics
Speed Grade
-6
Description
Sequential Delays
Symbol
-7
-5
Units
Clock CLK to X/Y outputs (WE active) in 16 x 1 mode
Clock CLK to X/Y outputs (WE active) in 32 x 1 mode
Clock CLK to F5 output
TSHCKO16
TSHCKO32
TSHCKOF5
1.25
1.57
1.52
1.38
1.75
1.68
1.54
1.95
1.88
ns, max
ns, max
ns, max
Setup and Hold Times Before/After Clock CLK
BX/BY data inputs (DIN)
TDS/TDH
0.38/–0.07 0.41/–0.07 0.46/–0.08 ns, min
F/G address inputs
T
AS/TAH
0.42/ 0.00
0.22/ 0.04
0.47/ 0.00
0.24/ 0.05
0.52/ 0.00
0.26/ 0.05
ns, min
ns, min
SR input
T
WES/TWEH
Clock CLK
Minimum Pulse Width, High
Minimum Pulse Width, Low
Minimum clock period to meet address write cycle time
Notes:
TWPH
TWPL
TWC
0.63
0.63
1.25
0.72
0.72
1.44
0.79
0.79
1.58
ns, min
ns, min
ns, min
1. A Zero “0” Hold Time listing indicates no hold time or a negative hold time. Negative values cannot be guaranteed “best-case”, but if
a “0” is listed, there is no positive hold time.
CLB Shift Register Switching Characteristics
Table 35: CLB Shift Register Switching Characteristics
Speed Grade
Description
Symbol
-7
-6
-5
Units
Sequential Delays
Clock CLK to X/Y outputs
Clock CLK to X/Y outputs
Clock CLK to XB output via MC15 LUT output
Clock CLK to YB output via MC15 LUT output
Clock CLK to Shiftout
TREG
2.78
3.10
2.84
2.55
2.50
3.05
3.12
3.49
3.18
2.88
2.83
3.42
3.49
3.90
3.55
3.21
3.15
3.83
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
TREG32
TREGXB
TREGYB
TCKSH
Clock CLK to F5 output
TREGF5
Setup and Hold Times Before/After Clock CLK
BX/BY data inputs (DIN)
SR input
TSRLDS/TSRLDH 0.70/–0.16 0.77/–0.18 0.98/–0.21
ns, min
ns, min
TWSS/TWSH
0.27/ 0.01
0.34/ 0.01
0.47/ 0.01
Clock CLK
Minimum Pulse Width, High
Minimum Pulse Width, Low
Notes:
TSRPH
TSRPL
0.63
0.63
0.72
0.72
0.79
0.79
ns, min
ns, min
1. A Zero “0” Hold Time listing indicates no hold time or a negative hold time. Negative values cannot be guaranteed “best-case”, but if
a “0” is listed, there is no positive hold time.
DS083-3 (v3.0) December 10, 2003
www.xilinx.com
31
Product Specification
1-800-255-7778
R
Virtex-II Pro Switching Characteristics
Multiplier Switching Characteristics
Table 36: Multiplier Switching Characteristics
Speed Grade
-6
Description
Propagation Delay to Output Pin
Input to Pin35
Input to Pin34
Input to Pin33
Input to Pin32
Input to Pin31
Input to Pin30
Input to Pin29
Input to Pin28
Input to Pin27
Input to Pin26
Input to Pin25
Input to Pin24
Input to Pin23
Input to Pin22
Input to Pin21
Input to Pin20
Input to Pin19
Input to Pin18
Input to Pin17
Input to Pin16
Input to Pin15
Input to Pin14
Input to Pin13
Input to Pin12
Input to Pin11
Input to Pin10
Input to Pin9
Symbol
-7
-5
Units
TMULT_P35
TMULT_P34
TMULT_P33
TMULT_P32
TMULT_P31
TMULT_P30
TMULT_P29
TMULT_P28
TMULT_P27
TMULT_P26
TMULT_P25
TMULT_P24
TMULT_P23
TMULT_P22
TMULT_P21
TMULT_P20
TMULT_P19
TMULT_P18
TMULT_P17
TMULT_P16
TMULT_P15
TMULT_P14
TMULT_P13
TMULT_P12
TMULT_P11
TMULT_P10
TMULT_P9
TMULT_P8
TMULT_P7
TMULT_P6
TMULT_P5
TMULT_P4
TMULT_P3
TMULT_P2
TMULT_P1
TMULT_P0
4.08
3.99
3.90
3.80
3.71
3.62
3.53
3.43
3.34
3.25
3.16
3.06
2.97
2.88
2.79
2.70
2.60
2.51
2.42
2.34
2.27
2.19
2.12
2.04
1.96
1.89
1.81
1.74
1.66
1.59
1.51
1.44
1.36
1.28
1.21
1.13
4.64
4.55
4.45
4.36
4.27
4.17
4.08
3.99
3.89
3.80
3.71
3.61
3.52
3.43
3.34
3.24
3.15
3.06
2.96
2.86
2.76
2.67
2.57
2.47
2.37
2.27
2.17
2.07
1.97
1.87
1.77
1.67
1.57
1.47
1.37
1.27
5.19
5.09
4.99
4.88
4.78
4.67
4.57
4.46
4.36
4.26
4.15
4.05
3.94
3.84
3.73
3.63
3.53
3.42
3.32
3.21
3.09
2.98
2.87
2.76
2.65
2.54
2.43
2.32
2.21
2.09
1.98
1.87
1.76
1.65
1.54
1.43
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
Input to Pin8
Input to Pin7
Input to Pin6
Input to Pin5
Input to Pin4
Input to Pin3
Input to Pin2
Input to Pin1
Input to Pin0
32
www.xilinx.com
1-800-255-7778
DS083-3 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: DC and Switching Characteristics
Table 37: Pipelined Multiplier Switching Characteristics
Speed Grade
-6
Description
Setup and Hold Times Before/After Clock
Data Inputs
Symbol
-7
-5
Units
TMULIDCK/TMULCKID
1.86/ 0.00
0.23/ 0.00
2.06/ 0.00
0.25/ 0.00
2.31/ 0.00
0.28/ 0.00
ns, max
ns, max
Clock Enable
T
MULIDCK_CE/TMULCKID_CE
Reset
TMULIDCK_RST/TMULCKID_RST
0.21/–0.09 0.24/–0.09 0.26/–0.10 ns, max
Clock to Output Pin
Clock to Pin35
Clock to Pin34
Clock to Pin33
Clock to Pin32
Clock to Pin31
Clock to Pin30
Clock to Pin29
Clock to Pin28
Clock to Pin27
Clock to Pin26
Clock to Pin25
Clock to Pin24
Clock to Pin23
Clock to Pin22
Clock to Pin21
Clock to Pin20
Clock to Pin19
Clock to Pin18
Clock to Pin17
Clock to Pin16
Clock to Pin15
Clock to Pin14
Clock to Pin13
Clock to Pin12
Clock to Pin11
Clock to Pin10
Clock to Pin9
TMULTCK_P35
TMULTCK_P34
TMULTCK_P33
TMULTCK_P32
TMULTCK_P31
TMULTCK_P30
TMULTCK_P29
TMULTCK_P28
TMULTCK_P27
TMULTCK_P26
TMULTCK_P25
TMULTCK_P24
TMULTCK_P23
TMULTCK_P22
TMULTCK_P21
TMULTCK_P20
TMULTCK_P19
TMULTCK_P18
TMULTCK_P17
TMULTCK_P16
TMULTCK_P15
TMULTCK_P14
TMULTCK_P13
TMULTCK_P12
TMULTCK_P11
TMULTCK_P10
TMULTCK_P9
TMULTCK_P8
TMULTCK_P7
TMULTCK_P6
TMULTCK_P5
TMULTCK_P4
TMULTCK_P3
TMULTCK_P2
TMULTCK_P1
TMULTCK_P0
2.45
2.36
2.28
2.20
2.12
2.03
1.95
1.87
1.79
1.70
1.62
1.54
1.46
1.37
1.29
1.21
1.13
1.04
0.96
0.88
0.80
0.71
0.63
0.63
0.63
0.63
0.63
0.63
0.63
0.63
0.63
0.63
0.63
0.63
0.63
0.63
2.92
2.82
2.72
2.62
2.52
2.42
2.32
2.22
2.12
2.02
1.92
1.82
1.71
1.61
1.51
1.41
1.31
1.21
1.11
1.01
0.91
0.81
0.71
0.71
0.71
0.71
0.71
0.71
0.71
0.71
0.71
0.71
0.71
0.71
0.71
0.71
3.27
3.16
3.05
2.93
2.82
2.71
2.60
2.48
2.37
2.26
2.15
2.03
1.92
1.81
1.69
1.58
1.47
1.36
1.24
1.13
1.02
0.91
0.79
0.79
0.79
0.79
0.79
0.79
0.79
0.79
0.79
0.79
0.79
0.79
0.79
0.79
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
ns, max
Clock to Pin8
Clock to Pin7
Clock to Pin6
Clock to Pin5
Clock to Pin4
Clock to Pin3
Clock to Pin2
Clock to Pin1
Clock to Pin0
DS083-3 (v3.0) December 10, 2003
www.xilinx.com
33
Product Specification
1-800-255-7778
R
Virtex-II Pro Switching Characteristics
Block SelectRAM+ Switching Characteristics
Table 38: Block SelectRAM+ Switching Characteristics
Speed Grade
-6
Description
Sequential Delays
Symbol
-7
-5
Units
Clock CLK to DOUT output
TBCKO
1.41
1.50
1.68
ns, max
Setup and Hold Times Before Clock CLK
ADDR inputs
DIN inputs
TBACK/TBCKA
BDCK/TBCKD
BECK/TBCKE
BRCK/TBCKR
0.27/ 0.22
0.20/ 0.22
0.28/ 0.00
0.28/ 0.00
0.33/ 0.00
0.31/ 0.25
0.23/ 0.25
0.32/ 0.00
0.32/ 0.00
0.35/ 0.00
0.35/ 0.28
0.26/ 0.28
0.35/ 0.00
0.35/ 0.00
0.39/ 0.00
ns, min
ns, min
ns, min
ns, min
ns, min
T
EN input
T
RST input
T
WEN input
T
BWCK/TBCKW
Clock CLK
Minimum Pulse Width, High
Minimum Pulse Width, Low
Notes:
TBPWH
TBPWL
1.17
1.17
1.30
1.30
1.50
1.50
ns, min
ns, min
1. A Zero “0” Hold Time listing indicates no hold time or a negative hold time. Negative values can not be guaranteed “best-case”, but
if a “0” is listed, there is no positive hold time.
TBUF Switching Characteristics
Table 39: TBUF Switching Characteristics
Speed Grade
Description
Symbol
-7
-6
-5
Units
Combinatorial Delays
IN input to OUT output
TIO
TOFF
TON
0.88
0.48
0.48
1.01
0.55
0.55
1.12
0.61
0.61
ns, max
ns, max
ns, max
TRI input to OUT output high-impedance
TRI input to valid data on OUT output
34
www.xilinx.com
1-800-255-7778
DS083-3 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: DC and Switching Characteristics
Configuration Timing
Configuration Memory Clearing Parameters
Power-up timing of configuration signals is shown in Figure 7; corresponding timing characteristics are listed in Table 40.
Vcc
TPOR
PROG_B
TPL
INIT_B
TICCK
CCLK OUTPUT or INPUT
M0, M1, M2*
(Required)
*Can be either 0 or 1, but must not toggle during and after configuration.
ds083-3_07_091003
Figure 7: Power-Up Timing Configuration Signals
Table 40: Power-Up Timing Characteristics
Description
Symbol
TPL
Value
4
Units
µs per frame, max
ms, max
Program Latency
Power-on-Reset
TPOR
TICCK
TPL + 2
CCLK (output) Delay
µs, min
µs, max
Program Pulse Width
TPROGRAM
300
ns, min
Notes:
1. The M2, M1, and M0 mode pins should be set at a constant DC voltage level, either through pull-up or pull-down resistors, or tied
directly to ground or VCCAUX. The mode pins should not be toggled during and after configuration.
DS083-3 (v3.0) December 10, 2003
www.xilinx.com
35
Product Specification
1-800-255-7778
R
Virtex-II Pro Switching Characteristics
Master/Slave Serial Mode Parameters
For Slave configurations, a free running CCLK can be used, as shown in Figure 8.
PROG_B
INIT_B
CCLK
DIN
BIT 0
BIT 1
BIT n
BIT n+1
DOUT
BIT n-64 BIT n-63
ug002_c3_028_112900
Figure 8: Serial Configuration Clocking Sequence
.
Table 41: Master/Slave Serial Mode Programming Switching
Description
Symbol
Values
5.0/0.0
5.0/0.0
12.0
Units
ns, min
ns, min
ns, max
ns, min
ns, min
MHz, max
CCLK
DIN setup/hold, slave mode
T
DCC/TCCD
DIN setup/hold, master mode
T
DSCK/TSCKD
TCCO
DOUT
High time
Low time
TCCH
5.0
TCCL
5.0
Maximum Frequency
FCC_SERIAL
66
Frequency Tolerance, master mode with respect to nominal
+45% –30%
36
www.xilinx.com
DS083-3 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: DC and Switching Characteristics
Master/Slave SelectMAP Parameters
Figure 9 is a generic diagram for data loading using SelectMAP. For other data loading diagrams, refer to the Virtex-II Pro
Platform FPGA User Guide.
PROGRAM
INIT
CCLK
CS
WRITE
DATA[0:7]
BUSY
Byte 0
Byte 1
Byte n
BUSY
Byte n
Byte n+1
Device
Ready
Byte 0
Loaded
Byte n
Ignored
Byte n
Loaded
x138_06_022400
Figure 9: Data Loading in SelectMAP
Table 42: SelectMAP Write Timing Characteristics
Description
Symbol
Value
5.0/0.0
7.0/0.0
7.0/0.0
12.0
Units
ns, min
CCLK
D
0-7 Setup/Hold
TSMDCC/TSMCCD
CS_B Setup/Hold
RDWR_B Setup/Hold
T
SMCSCC/TSMCCCS
TSMCCW/TSMWCC
TSMCKBY
ns, min
ns, min
BUSY Propagation Delay
Maximum Frequency
ns, max
MHz, max
MHz, max
F
CC_SelectMAP
FCCNH
50
Maximum Frequency with No Handshake
50
DS083-3 (v3.0) December 10, 2003
www.xilinx.com
37
Product Specification
1-800-255-7778
R
Virtex-II Pro Switching Characteristics
JTAG Test Access Port Switching Characteristics
Characterization data for some of the most commonly requested timing parameters shown in Figure 10 is listed in Table 43.
TMS
TDI
TTCKTAP
TTAPTCK
TCK
TDO
TTCKTDO
Data Valid
Data to be captured
Data to be driven out
Data Valid
x139_05_020300
Figure 10: Virtex-II Pro Boundary Scan Port Timing Waveforms
Table 43: Boundary-Scan Port Timing Specifications
Symbol
TTAPTCK
TTCKTAP
TTCKTDO
FTCK
Parameter
Value
5.5
Units
ns, min
ns, min
ns, min
MHz, max
TMS and TDI setup time before TCK
TMS and TDI hold times after TCK
TCK falling edge to TDO output valid
Maximum TCK clock frequency
2.0
11.0
33.0
38
www.xilinx.com
DS083-3 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: DC and Switching Characteristics
Virtex-II Pro Pin-to-Pin Output Parameter Guidelines
All devices are 100% functionally tested. Listed below are representative values for typical pin locations and normal clock
loading. Values are expressed in nanoseconds unless otherwise noted.
Global Clock Input to Output Delay for LVCMOS25, 12 mA, Fast Slew Rate,
With DCM
Table 44: Global Clock Input to Output Delay for LVCMOS25, 12 mA, Fast Slew Rate,
With DCM
Speed Grade
Description
Symbol
Device
-7
-6
-5
Units
LVCMOS25 Global Clock Input to Output
Delay using Output Flip-flop, 12 mA, Fast
Slew Rate, with DCM.
For data output with different standards,
adjust the delays with the values shown in
IOB Output Switching Characteristics
Standard Adjustments, page 25.
Global Clock and OFF with DCM
TICKOFDCM
XC2VP2
XC2VP4
1.55
1.58
1.63
1.68
1.68
1.71
1.80
1.87
1.59
1.61
1.68
1.74
1.75
1.86
2.00
2.07
2.38
1.62
1.65
1.72
1.79
1.80
1.92
2.07
2.24
2.45
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
XC2VP7
XC2VP20
XC2VP30
XC2VP40
XC2VP50
XC2VP70
XC2VP100
XC2VP125
Notes:
1. Listed above are representative values where one global clock input drives one vertical clock line in each accessible column, and
where all accessible IOB and CLB flip-flops are clocked by the global clock net.
2. Output timing is measured at 50% VCC threshold with test setup shown in Figure 6. For other I/O standards, see Table 32.
3. DCM output jitter is already included in the timing calculation.
DS083-3 (v3.0) December 10, 2003
www.xilinx.com
39
Product Specification
1-800-255-7778
R
Virtex-II Pro Pin-to-Pin Output Parameter Guidelines
Global Clock Input to Output Delay for LVCMOS25, 12 mA, Fast Slew Rate,
Without DCM
Table 45: Global Clock Input to Output Delay for LVCMOS25, 12 mA, Fast Slew Rate,
Without DCM
Speed Grade
-6
Description
Symbol
Device
-7
-5
Units
LVCMOS25 Global Clock Input to Output
Delay using Output Flip-flop, 12 mA, Fast
Slew Rate, without DCM.
For data output with different standards,
adjust the delays with the values shown in
IOB Output Switching Characteristics
Standard Adjustments, page 25.
Global Clock and OFF without DCM
TICKOF
XC2VP2
XC2VP4
3.19
3.39
3.59
3.62
3.73
3.89
4.00
4.38
3.52
3.91
4.00
4.08
4.12
4.28
4.43
4.87
5.32
3.82
4.27
4.36
4.46
4.50
4.67
4.84
5.33
5.82
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
XC2VP7
XC2VP20
XC2VP30
XC2VP40
XC2VP50
XC2VP70
XC2VP100
XC2VP125
Notes:
1. Listed above are representative values where one global clock input drives one vertical clock line in each accessible column, and
where all accessible IOB and CLB flip-flops are clocked by the global clock net.
2. Output timing is measured at 50% VCC threshold with test setup shown in Figure 6. For other I/O standards, see Table 32.
3. DCM output jitter is already included in the timing calculation.
40
www.xilinx.com
DS083-3 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: DC and Switching Characteristics
Virtex-II Pro Pin-to-Pin Input Parameter Guidelines
All devices are 100% functionally tested. Listed below are representative values for typical pin locations and normal clock
loading. Values are expressed in nanoseconds unless otherwise noted
Global Clock Set-Up and Hold for LVCMOS25 Standard, With DCM
Table 46: Global Clock Set-Up and Hold for LVCMOS25 Standard, With DCM
Speed Grade
Description
Symbol
Device
-5
Units
-7
-6
Input Setup and Hold Time Relative to
Global Clock Input Signal for LVCMOS25
Standard.(1)
For data input with different standards,
adjust the setup time delay by the values
shown in IOB Input Switching
Characteristics Standard Adjustments,
page 22.
No Delay
Global Clock and IFF(2) with DCM
TPSDCM/TPHDCM
XC2VP2
XC2VP4
1.53/–0.59
1.59/–0.59
1.66/–0.61
1.67/–0.54
1.80/–0.75
1.85/–0.65
1.85/–0.58
1.86/–0.45
1.53/–0.57
1.59/–0.59
1.66/–0.59
1.67/–0.53
1.80/–0.75
1.85/–0.64
1.85/–0.55
1.86/–0.4
1.54/–0.57
1.59/–0.58
1.66/–0.57
1.67/–0.5
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
XC2VP7
XC2VP20
XC2VP30
XC2VP40
XC2VP50
XC2VP70
XC2VP100
XC2VP125
1.80/–0.72
1.85/–0.61
1.85/–0.5
1.86/–0.31
1.86/–0.28
1.86/–0.36
Notes:
1. Setup time is measured relative to the Global Clock input signal with the fastest route and the lightest load. Hold time is measured
relative to the Global Clock input signal with the slowest route and heaviest load.
2. These measurements include:
-
-
CLK0 and CLK180 DCM jitter
Worst-case duty-cycle distortion using CLK0 and CLK180, TDCD_CLK180
.
3. IFF = Input Flip-Flop or Latch
DS083-3 (v3.0) December 10, 2003
www.xilinx.com
41
Product Specification
1-800-255-7778
R
Virtex-II Pro Pin-to-Pin Input Parameter Guidelines
Global Clock Set-Up and Hold for LVCMOS25 Standard, Without DCM
,
Table 47: Global Clock Set-Up and Hold for LVCMOS25 Standard, Without DCM
Speed Grade
-6
Description
Symbol
Device
-5
Units
-7
Input Setup and Hold Time Relative to
Global Clock Input Signal for LVCMOS25
Standard.
For data input with different standards,
adjust the setup time delay by the values
shown in IOB Input Switching
Characteristics Standard Adjustments,
page 22.
Full Delay
ns
Global Clock and IFF without DCM
TPSFD/TPHFD
XC2VP2
XC2VP4
1.80/–0.44
1.95/–0.53
1.83/–0.34
1.76/–0.24
1.75/–0.22
2.25/–0.54
2.93/–1.02
2.79/–0.72
1.85/–0.41
1.83/–0.31
1.81/–0.24
1.83/–0.17
1.92/–0.26
2.40/–0.56
2.98/–0.93
2.79/–0.55
5.58/–2.35
1.96/–0.43
1.90/–0.29
1.88/–0.19
1.92/–0.15
1.99/–0.23
2.49/–0.54
3.00/–0.83
2.78/–0.41
5.60/–2.35
ns
ns
ns
ns
ns
ns
ns
ns
ns
XC2VP7
XC2VP20
XC2VP30
XC2VP40
XC2VP50
XC2VP70
XC2VP100
XC2VP125
Notes:
1. IFF = Input Flip-Flop or Latch
2. Setup time is measured relative to the Global Clock input signal with the fastest route and the lightest load. Hold time is measured
relative to the Global Clock input signal with the slowest route and heaviest load.
3. A Zero “0” Hold Time listing indicates no hold time or a negative hold time. Negative values can not be guaranteed “best-case”, but
if a “0” is listed, there is no positive hold time.
42
www.xilinx.com
DS083-3 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: DC and Switching Characteristics
DCM Timing Parameters
All devices are 100% functionally tested. Because of the dif-
ficulty in directly measuring many internal timing parame-
ters, those parameters are derived from benchmark timing
patterns. The following guidelines reflect worst-case values
across the recommended operating conditions. All output
jitter and phase specifications are determined through sta-
tistical measurement at the package pins.
Operating Frequency Ranges
e
Table 48: Operating Frequency Ranges
Speed Grade
Description
Symbol
Constraints
-7
-6
-5
Units
Output Clocks (Low Frequency Mode)
CLK0, CLK90, CLK180, CLK270
CLK2X, CLK2X180
CLKDV
CLKOUT_FREQ_1X_LF_MIN
CLKOUT_FREQ_1X_LF_MAX
CLKOUT_FREQ_2X_LF_MIN
CLKOUT_FREQ_2X_LF_MAX
CLKOUT_FREQ_DV_LF_MIN
CLKOUT_FREQ_DV_LF_MAX
CLKOUT_FREQ_FX_LF_MIN
CLKOUT_FREQ_FX_LF_MAX
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
24.00
210.00
48.00
24.00
210.00
48.00
24.00
180.00
48.00
450.00
1.50
420.00
1.50
360.00
1.50
140.00
24.00
140.00
24.00
120.00
24.00
CLKFX, CLKFX180
240.00
240.00
210.00
Input Clocks (Low Frequency Mode)
(1)
CLKIN (using DLL outputs)
CLKIN (using CLKFX outputs)
PSCLK
CLKIN_FREQ_DLL_LF_MIN
MHz
MHz
MHz
MHz
MHz
MHz
24.00
210.00
1.00
24.00
210.00
1.00
24.00
180.00
1.00
CLKIN_FREQ_DLL_LF_MAX
CLKIN_FREQ_FX_LF_MIN
CLKIN_FREQ_FX_LF_MAX
PSCLK_FREQ_LF_MIN
(2)
240.00
0.01
240.00
0.01
210.00
0.01
PSCLK_FREQ_LF_MAX
450.00
420.00
360.00
Output Clocks (High Frequency Mode)
CLK0, CLK180
CLKOUT_FREQ_1X_HF_MIN
MHz
MHz
MHz
MHz
MHz
MHz
48.00
450.00
3.00
48.00
420.00
3.00
48.00
360.00
3.00
CLKOUT_FREQ_1X_HF_MAX
CLKOUT_FREQ_DV_HF_MIN
CLKOUT_FREQ_DV_HF_MAX
CLKOUT_FREQ_FX_HF_MIN
CLKOUT_FREQ_FX_HF_MAX
CLKDV
280.00
210.00
320.00
280.00
210.00
320.00
240.00
210.00
270.00
CLKFX, CLKFX180
Input Clocks (High Frequency Mode)
(1)
CLKIN (using DLL outputs)
CLKIN (using CLKFX outputs)
PSCLK
CLKIN_FREQ_DLL_HF_MIN
MHz
MHz
MHz
MHz
MHz
MHz
48.00
450.00
50.00
48.00
420.00
50.00
48.00
360.00
50.00
CLKIN_FREQ_DLL_HF_MAX
CLKIN_FREQ_FX_HF_MIN
CLKIN_FREQ_FX_HF_MAX
PSCLK_FREQ_HF_MIN
PSCLK_FREQ_HF_MAX
(2)
320.00
0.01
320.00
0.01
270.00
0.01
450.00
420.00
360.00
Notes:
1. “DLL outputs” is used here to describe the outputs: CLK0, CLK90, CLK180, CLK270, CLK2X, CLK2X180, and CLKDV.
2. If both DLL and CLKFX outputs are used, follow the more restrictive specification.
3. If the CLKIN_DIVIDE_BY_2 attribute of the DCM is used, then double these values.
DS083-3 (v3.0) December 10, 2003
www.xilinx.com
43
Product Specification
1-800-255-7778
R
DCM Timing Parameters
Input Clock Tolerances
Table 49: Input Clock Tolerances
Speed Grade
–6
–7
–5
Constraints
FCLKIN
Description
Symbol
Min Max Min Max Min Max Units
Input Clock Low/High Pulse Width
PSCLK
PSCLK_PULSE
< 1MHz
25.00
25.00
10.00
5.00
3.00
2.40
2.00
1.80
1.50
1.30
1.15
1.05
25.00
25.00
10.00
5.00
3.00
2.40
2.00
1.80
1.50
1.30
1.15
1.05
25.00
25.00
10.00
5.00
3.00
2.40
2.00
1.80
1.50
1.30
1.15
1.05
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
1 – 10 MHz
10 – 25 MHz
25 – 50 MHz
50 – 100 MHz
100 – 150 MHz
150 – 200 MHz
200 – 250 MHz
250 – 300 MHz
300 – 350 MHz
350 – 400 MHz
> 400 MHz
PSCLK_PULSE and
CLKIN_PULSE
(3)
PSCLK and CLKIN
Input Clock Cycle-Cycle Jitter (Low Frequency Mode)
(1)
CLKIN (using DLL outputs)
CLKIN_CYC_JITT_DLL_LF
CLKIN_CYC_JITT_FX_LF
300
300
300
300
300
300
ps
ps
(2)
CLKIN (using CLKFX outputs)
Input Clock Cycle-Cycle Jitter (High Frequency Mode)
(1)
CLKIN (using DLL outputs)
CLKIN_CYC_JITT_DLL_HF
CLKIN_CYC_JITT_FX_HF
150
150
150
150
150
150
ps
ps
(2)
CLKIN (using CLKFX outputs)
Input Clock Period Jitter (Low Frequency Mode)
(1)
CLKIN (using DLL outputs)
CLKIN_PER_JITT_DLL_LF
CLKIN_PER_JITT_FX_LF
1
1
1
1
1
1
ns
ns
(2)
CLKIN (using CLKFX outputs)
Input Clock Period Jitter (High Frequency Mode)
(1)
CLKIN (using DLL outputs)
CLKIN_PER_JITT_DLL_HF
CLKIN_PER_JITT_FX_HF
1
1
1
1
1
1
ns
ns
(2)
CLKIN (using CLKFX outputs)
Feedback Clock Path Delay Variation
CLKFB off-chip feedback
CLKFB_DELAY_VAR_EXT
1
1
1
ns
Notes:
1. “DLL outputs” is used here to describe the outputs: CLK0, CLK90, CLK180, CLK270, CLK2X, CLK2X180, and CLKDV.
2. If both DLL and CLKFX outputs are used, follow the more restrictive specification.
3. If DCM phase shift feature is used and CLKIN frequency > 200 Mhz, CLKIN duty cycle must be within 5% (45/55 to 55/45).
44
www.xilinx.com
DS083-3 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: DC and Switching Characteristics
Output Clock Jitter
Table 50: Output Clock Jitter
Speed Grade
Description
Clock Synthesis Period Jitter
CLK0
Symbol
Constraints
–7
–6
–5
Units
CLKOUT_PER_JITT_0
CLKOUT_PER_JITT_90
CLKOUT_PER_JITT_180
CLKOUT_PER_JITT_270
CLKOUT_PER_JITT_2X
CLKOUT_PER_JITT_DV1
CLKOUT_PER_JITT_DV2
CLKOUT_PER_JITT_FX
100
150
150
150
200
150
300
100
150
150
150
200
150
300
100
150
150
150
200
150
300
ps
ps
ps
ps
ps
ps
ps
ps
CLK90
CLK180
CLK270
CLK2X, CLK2X180
CLKDV (integer division)
CLKDV (non-integer division)
CLKFX, CLKFX180
Notes:
Note (1) Note (1) Note (1)
1. Use the Jitter Calculator on the Xilinx website (http://www.xilinx.com/applications/web_ds_v2/jitter_calc.htm) for CLKFX and
CLKFX180 output jitter.
Output Clock Phase Alignment
Table 51: Output Clock Phase Alignment
Speed Grade
Description
Symbol
Constraints
–7
50
–6
–5
50
Units
ps
Phase Offset Between CLKIN and CLKFB
CLKIN/CLKFB
CLKIN_CLKFB_PHASE
50
Phase Offset Between Any DCM Outputs
All CLK* outputs
Duty Cycle Precision
DLL outputs(1)
CLKFX outputs
Notes:
CLKOUT_PHASE
140
140
140
ps
(2)
ps
ps
CLKOUT_DUTY_CYCLE_DLL
150
100
150
100
150
100
CLKOUT_DUTY_CYCLE_FX
1. “DLL outputs” is used here to describe the outputs: CLK0, CLK90, CLK180, CLK270, CLK2X, CLK2X180, and CLKDV.
2. CLKOUT_DUTY_CYCLE_DLL applies to the 1X clock outputs (CLK0, CLK90, CLK180, and CLK270) only if
DUTY_CYCLE_CORRECTION = TRUE.
3. Specification also applies to PSCLK.
DS083-3 (v3.0) December 10, 2003
www.xilinx.com
45
Product Specification
1-800-255-7778
R
DCM Timing Parameters
Miscellaneous Timing Parameters
Table 52: Miscellaneous Timing Parameters
Speed Grade
-6
Constraints
FCLKIN
Description
Time Required to Achieve LOCK
Using DLL outputs(1)
Symbol
-7
-5
Units
LOCK_DLL:
LOCK_DLL_60
> 60MHz
20.00
25.00
50.00
90.00
120.00
10.00
10.00
20.00
25.00
50.00
90.00
120.00
10.00
10.00
20.00
25.00
50.00
90.00
120.00
10.00
10.00
us
us
us
us
us
ms
ms
LOCK_DLL_50_60
LOCK_DLL_40_50
LOCK_DLL_30_40
LOCK_DLL_24_30
LOCK_FX_MIN
50 - 60 MHz
40 - 50 MHz
30 - 40 MHz
24 - 30 MHz
Using CLKFX outputs
LOCK_FX_MAX
Additional lock time with fine phase
shifting
LOCK_DLL_FINE_SHIFT
50.00
50.00
50.00
us
Fine Phase Shifting
Absolute shifting range
Delay Lines
10.00
10.00
10.00
ns
FINE_SHIFT_RANGE
Tap delay resolution
30.00
50.00
30.00
50.00
30.00
50.00
ps
ps
DCM_TAP_MIN
DCM_TAP_MAX
Notes:
1. “DLL outputs” is used here to describe the outputs: CLK0, CLK90, CLK180, CLK270, CLK2X, CLK2X180, and CLKDV.
Frequency Synthesis
Table 53: Frequency Synthesis
Attribute
CLKFX_MULTIPLY
CLKFX_DIVIDE
Min
2
Max
32
1
32
Parameter Cross-Reference
Table 54: Parameter Cross-Reference
Libraries Guide
Data Sheet
CLKOUT_FREQ_{1X|2X|DV}_LF
DLL_CLKOUT_{MIN|MAX}_LF
DFS_CLKOUT_{MIN|MAX}_LF
DLL_CLKIN_{MIN|MAX}_LF
DFS_CLKIN_{MIN|MAX}_LF
DLL_CLKOUT_{MIN|MAX}_HF
DFS_CLKOUT_{MIN|MAX}_HF
DLL_CLKIN_{MIN|MAX}_HF
DFS_CLKIN_{MIN|MAX}_HF
CLKOUT_FREQ_FX_LF
CLKIN_FREQ_DLL_LF
CLKIN_FREQ_FX_LF
CLKOUT_FREQ_{1X|DV}_HF
CLKOUT_FREQ_FX_HF
CLKIN_FREQ_DLL_HF
CLKIN_FREQ_FX_HF
46
www.xilinx.com
1-800-255-7778
DS083-3 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: DC and Switching Characteristics
Source-Synchronous Switching Characteristics
The parameters in this section provide the necessary values for calculating timing budgets for Virtex-II Pro
source-synchronous transmitter and receiver data-valid windows.
Table 55: Duty Cycle Distortion and Clock-Tree Skew
Speed Grade
Description
Symbol
Device
–7
–6
–5
Units
ns
Duty Cycle Distortion(1)
TDCD_LOCAL
0.10
0.10
0.13
0.13
0.13
0.20
0.20
0.33
0.40
0.54
0.10
0.11
0.13
0.13
0.13
0.21
0.22
0.34
0.41
0.59
0.79
0.20
0.13
0.13
0.13
0.13
0.22
0.24
0.35
0.42
0.64
0.87
(3)
All
TDCD_CLK180
TCKSKEW
ns
Clock Tree Skew(2)
XC2VP2
XC2VP4
ns
ns
XC2VP7
ns
XC2VP20
XC2VP30
XC2VP40
XC2VP50
XC2VP70
XC2VP100
XC2VP125
ns
ns
ns
ns
ns
ns
ns
Notes:
1. These parameters represent the worst-case duty cycle distortion observable at the pins of the device using LVDS output buffers. For
cases where other I/O standards are used, IBIS can be used to calculate any additional duty cycle distortion that might be caused by
asymmetrical rise/fall times.
T
DCD_LOCAL applies to cases where the dedicated path from the DCM to the BUFG is bypassed and where local (IOB) inversion is
used to provide the negative-edge clock to the DDR element in the I/O.
T
DCD_CLK180 applies to cases where the CLK180 output of the DCM is used to provide the negative-edge clock to the DDR element
in the I/O.
2. This value represents the worst-case clock-tree skew observable between sequential I/O elements. Significantly less clock-tree skew
exists for I/O registers that are close to each other and fed by the same or adjacent clock-tree branches. Use the Xilinx FPGA_Editor
and Timing Analyzer tools to evaluate clock skew specific to your application.
3. Refer to XAPP685 for more information.
DS083-3 (v3.0) December 10, 2003
www.xilinx.com
47
Product Specification
1-800-255-7778
R
Source-Synchronous Switching Characteristics
Table 56: Package Skew
Description
Package Skew(1)
Symbol
TPKGSKEW
Device/Package
XC2VP2FF672
Value
104
102
92
Units
ps
ps
ps
ps
ps
ps
ps
ps
ps
ps
ps
ps
ps
ps
ps
ps
ps
ps
ps
ps
XC2VP4FF672
XC2VP7FF672
XC2VP7FF896
101
93
XC2VP20FF896
XC2VP20FF1152
XC2VP30FF896
XC2VP30FF1152
XC2VP40FF1152
XC2VP40FF1148
XC2VP40FF1517
XC2VP50FF1152
XC2VP50FF1148
XC2VP50FF1517
XC2VP70FF1517
XC2VP70FF1704
XC2VP100FF1704
XC2VP100FF1696
XC2VP125FF1704
XC2VP125FF1696
106
86
112
92
100
104
88
101
97
95
101
86
100
Notes:
1. These values represent the worst-case skew between any two balls of the package: shortest flight time to longest flight time from Pad
to Ball (7.1ps per mm).
2. Package trace length information is available for these device/package combinations. This information can be used to deskew the
package.
Table 57: Sample Window
Speed Grade
Description
Sampling Error at Receiver Pins(1)
Notes:
Symbol
Device
–7
–6
–5
Units
TSAMP
All
0.50
0.50
0.50
ns
1. This parameter indicates the total sampling error of Virtex-II Pro DDR input registers across voltage, temperature, and process. The
characterization methodology uses the DCM to capture the DDR input registers’ edges of operation.
2. These measurements include:
-
-
-
-
CLK0 and CLK180 DCM jitter
Worst-case duty-cycle distortion, TDCD_CLK180
DCM accuracy (phase offset)
DCM phase shift resolution
These measurements do not include package or clock tree skew.
48
www.xilinx.com
1-800-255-7778
DS083-3 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: DC and Switching Characteristics
Table 58: Example Pin-to-Pin Setup/Hold: Source-Synchronous Configuration
Speed Grade
–6
Description
Symbol
Device
–7
–5
Units
Example Data Input Set-Up and Hold Times
Relative to a Forwarded Clock Input Pin,(1)
Using DCM and Global Clock Buffer.
Values represent an 18-bit bus located in Banks
2, 3, 6, or 7 and grouped to one Horizontal
Global Clock Line. TRACE must be used to
determine the actual values for any given
design.
For situations where clock and data inputs
conform to different standards, adjust the setup
and hold values accordingly using the values
shown inIOB Input Switching Characteristics
Standard Adjustments, page 22.
No Delay
Global Clock and IFF(2) with DCM
XC2VP2
XC2VP4
0.23/0.38 0.20/0.42 0.20/0.42
0.25/0.37 0.23/0.4 0.23/0.40
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
T
/T
PSDCM_0 PHDCM_0
XC2VP7
0.18/0.35 0.18/0.39 0.17/0.41
0.14/0.40 0.13/0.42 0.11/0.44
0.29/0.25 0.31/0.24 0.31/0.24
0.25/0.29 0.26/0.29 0.26/0.29
0.18/0.36 0.17/0.37 0.17/0.38
0.17/0.37 0.17/0.38 0.17/0.38
0.18/0.33 0.19/0.36
XC2VP20
XC2VP30
XC2VP40
XC2VP50
XC2VP70
XC2VP100
XC2VP125
Notes:
1. The timing values were measured using the fine-phase adjustment feature of the DCM. These measurements include:
-
-
CLK0 and CLK180 DCM jitter
Worst-case duty-cycle distortion using CLK0 and CLK180, T
DCD_CLK180
Package skew is not included in these measurements.
2. IFF = Input Flip-Flop
Source Synchronous Timing Budgets
Notes:
This section describes how to use the parameters provided
in the Source-Synchronous Switching Characteristics sec-
tion to develop system-specific timing budgets. The follow-
ing analysis provides information necessary for determining
Virtex-II Pro contributions to an overall system timing analy-
sis; no assumptions are made about the effects of
Inter-Symbol Interference or PCB skew.
1. Jitter values and accumulation methodology to be provided in
a future release of this document. The absolute period jitter
values found in the DCM Timing Parameters section of the
particular DCM output clock used to clock the IOB FF can be
used for a best case analysis.
2. This value depends on the clocking methodology used. See
Note1 for Table 55.
3. This value represents the worst-case clock-tree skew
observable between sequential I/O elements. Significantly
less clock-tree skew exists for I/O registers that are close to
each other and fed by the same or adjacent clock-tree
branches. Use the Xilinx FPGA_Editor and Timing Analyzer
tools to evaluate clock skew specific to your application.
Virtex-II Pro Transmitter Data-Valid Window (T )
X
TX is the minimum aggregate valid data period for a
source-synchronous data bus at the pins of the device and
is calculated as follows:
4. These values represent the worst-case skew between any two
balls of the package: shortest flight time to longest flight time
from Pad to Ball.
TX = Data Period - [Jitter(1) + Duty Cycle Distortion(2)
+
TCKSKEW(3) + TPKGSKEW(4)
]
DS083-3 (v3.0) December 10, 2003
www.xilinx.com
49
Product Specification
1-800-255-7778
R
Revision History
-
-
-
Worst-case duty-cycle distortion
DCM accuracy (phase offset)
DCM phase shift resolution.
Virtex-II Pro Receiver Data-Valid Window (R )
X
RX is the required minimum aggregate valid data period for
a source-synchronous data bus at the pins of the device
and is calculated as follows:
These measurements do not include package or clock tree
skew.
RX = [TSAMP(1) + TCKSKEW(2) + TPKGSKEW(3)
]
2. This value represents the worst-case clock-tree skew
observable between sequential I/O elements. Significantly
less clock-tree skew exists for I/O registers that are close to
each other and fed by the same or adjacent clock-tree
branches. Use the Xilinx FPGA_Editor and Timing Analyzer
tools to evaluate clock skew specific to your application.
3. These values represent the worst-case skew between any two
balls of the package: shortest flight time to longest flight time
from Pad to Ball.
Notes:
1. This parameter indicates the total sampling error of
Virtex-II Pro DDR input registers across voltage, temperature,
and process. The characterization methodology uses the
DCM to capture the DDR input registers’ edges of operation.
These measurements include:
-
CLK0 and CLK180 DCM jitter in a quiet system
Revision History
This section records the change history for this module of the data sheet.
Date
Version
1.0
Revision
01/31/02
06/17/02
Initial Xilinx release.
•
•
•
•
•
•
•
Added new Virtex-II Pro family members.
Added timing parameters from speedsfile v1.62.
2.0
Added Table 37, Pipelined Multiplier Switching Characteristics.
Added 3.3V-vs-2.5V table entries for some parameters.
Added Source-Synchronous Switching Characteristics section.
Added absolute max ratings for 3.3V-vs-2.5V parameters in Table 1.
Added recommended operating conditions for VIN and RocketIO footnote to Table 2.
09/03/02
2.1
•
Updated SSTL2 values in Table 6. Added SSTL18 values: Table 6, Table 31, Table 32.
[Table 32 removed in v2.8.]
•
Added Table 10, which contains LVPECL DC specifications.
09/27/02
11/20/02
2.2
2.3
Added section General Power Supply Requirements.
Updated parametric information in:
•
•
•
Table 1: Increase Absolute Max Rating for VCCO, VREF, VIN, and VTS from 3.6V to
3.75V. Delete cautionary footnotes related to voltage overshoot/undershoot.
Table 2: Delete VCCO specifications for 2.5V and below operation. Delete footnote
referencing special information for 3.3V operation. Add footnote for PCI/PCI-X.
Table 3: Add IBATT. Delete IL specifications for 2.5V and below operation.
•
•
Table 4: Add Typical Quiescent Supply Currents for XC2VP4 and XC2VP7 only
Table 6: Correct IOL and IOH for SSTL2 I. Add rows for LVTTL, LVCMOS33, and
PCI-X. Correct max VIH from VCCO to 3.6V.
•
Table 7: Correct Min/Max VOD, VOCM, and VICM
•
•
Table 10: Reformat LVPECL DC Specifications to match Virtex-II data sheet format
Table 11: Correct parameter name from Differential Output Voltage to Single-Ended
Output Voltage Swing.
•
•
•
•
Table 15: Add CPMC405CLOCK max frequencies
Table 23: Add footnote regarding serial data rate limitation in -5 part.
Table 31: Add rows for LVTTL, LVCMOS33, and PCI-X.
Table 32: Add LVTTL, LVCMOS33, and PCI-X. Correct all capacitive load values
(except PCI/PCI-X) to 0 pF. [Table 32 removed in v2.8.]
Table 42: Correct CCLK max frequencies
•
11/25/02
2.4
Table 1: Correct lower limit of voltage range of VIN and VTS from –0.3V to –0.5V for 3.3V.
50
www.xilinx.com
DS083-3 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: DC and Switching Characteristics
Revision
Date
Version
12/03/02
2.5
Updated parametric information in:
•
Table 1: Correct lower limit of voltage range of VIN and VTS from –0.5V to –0.3V for
3.3V.
•
•
Table 2: Add footnote (2) regarding VCCAUX voltage droop. Renumbered other notes.
Table 11: Add waveform diagrams (Figure 1 and Figure 2) illustrating DVOUT
(single-ended) and DVPPOUT (differential).
•
Table 21: Indicate REFCLK upper frequency limitation; relate REFCLK parameters to
REFCLK2, BREFCLK, and BREFCLK2; correct TRCLK and TFCLK values and unit of
measurement.
•
Table 51: Add qualifying footnote to CLKOUT_DUTY_CYCLE_DLL.
01/20/03
03/24/03
2.6
2.7
Updated parametric information in:
•
Table 11: Correct DVIN Min (200 mV to 175 mV) and DVIN Max (1000 mV to
2000 mV).
•
Table 21: Correct TRCLK /TFCLK Typ (400 ps to 600 ps) and Max (600 ps to 1000 ps).
Add footnote (2) to qualify Max TGJTT parameter.
•
•
Table 50: Correct hyperlink in footnote (1) to point directly to Answer Record 13645.
Move clock parameters from Table 17, Table 18, Table 19, and Table 20 to Table 15.
•
•
•
Added/updated timing parameters from speedsfile v1.76.
Table 2: Delete first table footnote and renumber all others.
Table 3: Add "sample-tested" to IL. Remove "Device" column, unnecessary.
•
Table 8: Update VOCM (Typ) to 1.250V.
•
•
Table 10: Update LVPECL_25 DC parameters.
Table 21: Update FGCLK frequency ranges. Break out TGJTT by operating speed.
•
•
Table 23: Update FGTX frequency ranges. Correct TDJ to 0.17 UI, TRJ to o.18 UI.
Table 31: Update VREF (Typ) for HSTL Class I/II from 1.08V to 0.90V.
•
•
Table 34, Table 35: Correct parameter name "CE input (WS)" to "SR input".
Table 55: Break out TDCD_CLK0 by device type.
DS083-3 (v3.0) December 10, 2003
www.xilinx.com
51
Product Specification
1-800-255-7778
R
Revision History
Date
Version
Revision
05/27/03
2.8
•
•
Updated time and frequency parameters as per speedsfile v1.78.
Table 3: Added values for IREF, IL, IRPU, IRPD
•
•
Corrected ICCINTQ (Table 4) and ICCINTMIN (Table 5) for XC2VP20 to 600 mA.
Table 4: Updated/Added Typ and Max quiescent current values for XC2VP7 and
XC2VP20. Added footnote specifying parameters are for Commercial Grade parts.
Table 5: Added footnote specifying parameters are for Commercial Grade parts.
Table 6: Corrected VIH (Max) for LVTTL and LVCMOS33 standards from 3.6V to
•
•
3.45V. Changed VIL (Min) for all standards to –0.2V. Corrected VIL (Max) for
LVCMOS15 and LVCMOS18 from 20% VCCO to 30% VCCO
.
•
Table 10: Corrected LVPECL_25 Min and Max values for VIH and VIL. Added
explanatory text above table.
•
•
Table 12 and Table 13 (pin-pin and reg-reg performance): Changed device specified
from XC2VP7FF672-6 to XC2VP20FF1152-6.
Table 14: Updated to show devices XC2VP7 and XC2VP20 as Preliminary for the -6
speed grade and Production for the -5 speed grade.
Removed former Table 32, Standard Capacitive Loads.
Table 43: Updated TTAPTCK from 4.0 ns to 5.5 ns.
•
•
•
Table 50: Modified footnote referenced at CLKFX/CLKFX180 to point to the online
Jitter Calculator.
•
•
•
Added Figure 6 and accompanying procedure for measuring standard adjustments.
Table 1: Footnote (2) rewritten to specify “one or more banks.”
Table 48: Some DCM parameters were erroneously missing from v2.8 (single-module
version) due to a document compilation error. The concatenated full data sheet
version was not affected. These parameters have been restored.
08/25/03
2.9
•
•
•
•
Updated time and frequency parameters as per speedsfile v1.81.
Table 1: Footnote (2) rewritten to specify “one or more banks.”
Table 2: Added footnote referring to XAPP659 for 3.3V I/O operation.
Table 44 and Table 45: Revised test setup footnote to refer to Figure 6. Previously
specified a capacitive load parameter.
•
Table 48: Due to a document compilation error in v2.8, some DCM parameters were
erroneously omitted from the full data sheet file (all four modules concatenated),
though not from the stand-alone Module 3 file. The omitted parameters have been
restored.
•
Table 55 and Table 57: Corrected parameters to expression in picoseconds, as
labeled. Previously expressed in nanoseconds, but labeled picoseconds.
Figure 6: Added note to figure regarding termination resistors.
Table 5: Added ICCINTMIN for XC2VP30 device.
•
•
09/10/03
2.10
•
•
Figure 7: Changed representation of mode pins M0, M1, and M2 indicating that they
must be held to a constant DC level during and after configuration.
Table 40: Added footnote indicating that mode pins M0, M1, and M2 must be held to a
constant DC level during and after configuration.
52
www.xilinx.com
DS083-3 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: DC and Switching Characteristics
Revision
Date
Version
10/14/03
2.11
•
Table 1: Deleted Footnote (2), which had derated the absolute maximum TJ when one
or more banks operated at 3.3V. Changed TJ description from “Operating junction
temperature” to “Maximum junction temperature”. Added new Footnote (2) linking to
website for package thermal data.
•
•
•
Table 4 and Table 5: Filled in power-on and quiescent current parameters for all
devices through XC2VP70. Added Industrial Grade multiplier specification to Footnote
(1) in both tables.
In section General Power Supply Requirements, replaced reference to Answer Record
11713 with reference to XAPP689 regarding handling of simultaneously switching
outputs (SSO).
In section I/O Standard Adjustment Measurement Methodology:
-
-
-
-
Table 31 renamed Input Delay Measurement Methodology. Added footnotes.
Added new Table 32, Output Delay Measurement Methodology.
Replaced Figure 6, Generalized Test Setup, with new drawing.
Revised and extended text describing output delay measurement procedure.
•
•
Table 49: For Input Clock Low/High Pulse Width, PSCLK and CLKIN, changed
existing Footnote (2) to new Footnote (3).
11/10/03
12/05/03
2.12
3.0
Table 1: Changed 3.3V absolute max VIN and VTS from 3.75V to 4.05V. Added
footnote referring to XAPP659.
Table 4: Removed MIN column from table.
•
•
XC2VP2 through XC2VP70 speed grades -5, -6, and -7, and XC2VP100 speed grades
-5 and -6, updated and released to Production status as per speedsfile v1.83.
Featured changes:
-
-
-
-
Speedsfile parameter values for -7 speed grade added for devices
XC2VP2-XC2VP70.
Table 12 and Table 13: Pin-to-pin and register-to_register performance parameter
values added.
Table 55: New parameter TDCD_LOCAL (and explanatory footnote) replaces
TDCD_CLK0
.
All remaining source-synchronous parameter values added (Table 55 and
following).
•
Non-speedsfile parameter values added or updated:
-
-
-
-
Table 3: IBATT
Table 4: For XC2VP100, ICCINTQ, ICCOQ, and ICCAUXQ
Table 5: For XC2VP100, ICCINTMIN
Table 16: TCPWL and TCPWH
.
.
.
.
•
•
Table 22: Added explanatory footnote to TRXLAT (MGT receiver latency) max value.
Table 48: Added Footnote (3) regarding use of CLKIN_DIVIDE_BY_2 attribute.
Virtex-II Pro Data Sheet
The Virtex-II Pro Data Sheet contains the following modules:
•
Virtex-II Pro™ Platform FPGAs: Introduction and
Overview (Module 1)
•
•
Virtex-II Pro™ Platform FPGAs: DC and Switching
Characteristics (Module 3)
Virtex-II Pro™ Platform FPGAs: Pinout Information
(Module 4)
•
Virtex-II Pro™ Platform FPGAs: Functional Description
(Module 2)
DS083-3 (v3.0) December 10, 2003
www.xilinx.com
53
Product Specification
1-800-255-7778
R
Virtex-II Pro Data Sheet
54
www.xilinx.com
DS083-3 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
0
298 Virtex-II Pro™ Platform FPGAs:
Pinout Information
R
0
0
DS083-4 (v3.0) December 10, 2003
Product Specification
This document provides Virtex-II Pro Device/Package
Combinations and Maximum I/Os and Virtex-II Pro Pin Def-
initions, followed by pinout tables, for these packages:
•
•
•
•
•
FF1152 Flip-Chip Fine-Pitch BGA Package
FF1148 Flip-Chip Fine-Pitch BGA Package
FF1517 Flip-Chip Fine-Pitch BGA Package
FF1704 Flip-Chip Fine-Pitch BGA Package
FF1696 Flip-Chip Fine-Pitch BGA Package
•
•
•
•
•
FG256 Fine-Pitch BGA Package
FG456 Fine-Pitch BGA Package
FG676 Fine-Pitch BGA Package
FF672 Flip-Chip Fine-Pitch BGA Package
FF896 Flip-Chip Fine-Pitch BGA Package
For device pinout diagrams and layout guidelines, refer to
the Virtex-II Pro Platform FPGA User Guide. ASCII pack-
age pinout files are also available for download from the Xil-
inx website (www.xilinx.com).
Virtex-II Pro Device/Package Combinations and Maximum I/Os
.
Wire-bond and flip-chip packages are available. Table 1
and Table 2 show the maximum number of user I/Os possi-
ble in wire-bond and flip-chip packages, respectively.
Table 1: Wire-Bond Packages Information
Package
Pitch (mm)
FG256
1.00
FG456
1.00
FG676
1.00
•
•
FG denotes wire-bond fine-pitch BGA (1.00 mm pitch).
FF denotes flip-chip fine-pitch BGA (1.00 mm pitch)
Size (mm)
17 x 17
140
23 x 23
248
26 x 26
412
Maximum I/Os
Table 2: Flip-Chip Packages Information
Package
Pitch (mm)
FF672
1.00
FF896
1.00
FF1152
1.00
FF1148
1.00
FF1517
FF1704
1.00
FF1696
1.00
1.00
40 x 40
964
Size (mm)
27 x 27
396
31 x 31
556
35 x 35
644
35 x 35
812
42.5 x 42.5
1040
42.5 x 42.5
1200
Maximum I/Os
Table 3 shows the number of available I/Os, the number of RocketIO™ multi-gigabit transceiver (MGT) pins, and the
number of differential I/O pairs for each Virtex-II Pro device/package combination. The number of I/Os per package includes
all user I/Os except the fifteen control pins (CCLK, DONE, M0, M1, M2, PROG_B, PWRDWN_B, TCK, TDI, TDO, TMS,
HSWAP_EN, DXN, DXP, AND RSVD) and the nine (per transceiver) RocketIO MGT pins (TXP, TXN, RXP, RXN,
AVCCAUXTX, AVCCAUXRX, VTTX, VTRX, and GNDA). The number of transceivers in the device is the number of
RocketIO MGT pins in Table 3 divided by nine.
Table 3: Virtex-II Pro Available I/Os and RocketIO MGT Pins per Device/Package Combination
User I/Os &
RocketIO
MGT Pins
Virtex-II Pro Package
Virtex-II Pro
Device
FG256 FG456 FG676 FF672
FF896 FF1152 FF1148 FF1517 FF1704 FF1696
Available
User I/Os
140
36
156
36
-
-
-
204
36
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
RocketIO
MGT Pins
XC2VP2
Differential
I/O Pairs
68
76
100
© 2003 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
1
Product Specification
1-800-255-7778
R
Virtex-II Pro Device/Package Combinations and Maximum I/Os
Table 3: Virtex-II Pro Available I/Os and RocketIO MGT Pins per Device/Package Combination (Continued)
User I/Os &
RocketIO
MGT Pins
Virtex-II Pro Package
Virtex-II Pro
Device
FG256 FG456 FG676 FF672
FF896 FF1152 FF1148 FF1517 FF1704 FF1696
Available
User I/Os
140
248
-
-
348
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
RocketIO
MGT Pins
XC2VP4
XC2VP7
36
68
-
36
36
-
-
-
-
Differential
I/O Pairs
122
-
172
-
396
72
196
556
72
272
556
72
272
-
-
-
-
-
Available
User I/Os
248
-
396
-
-
-
-
RocketIO
MGT Pins
-
72
-
72
-
-
-
-
Differential
I/O Pairs
-
122
-
196
-
-
-
-
Available
User I/Os
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
404
72
196
416
72
202
416
72
202
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
564
72
276
644
72
340
692
108
340
692
144
340
-
-
-
-
RocketIO
MGT Pins
XC2VP20
XC2VP30
XC2VP40
XC2VP50
XC2VP70
-
-
-
-
Differential
I/O Pairs
-
-
-
-
-
Available
User I/Os
-
-
-
RocketIO
MGT Pins
-
-
-
-
-
Differential
I/O Pairs
-
-
-
Available
User I/Os
-
804
0
-
-
RocketIO
MGT Pins
-
-
-
-
Differential
I/O Pairs
-
-
396
812
0
-
-
-
Available
User I/Os
-
-
852
144
420
964
144
476
RocketIO
MGT Pins
-
-
-
Differential
I/O Pairs
-
-
400
-
-
Available
User I/Os
-
-
996
180
492
RocketIO
MGT Pins
-
-
-
-
Differential
I/O Pairs
-
-
-
-
2
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
Table 3: Virtex-II Pro Available I/Os and RocketIO MGT Pins per Device/Package Combination (Continued)
User I/Os &
RocketIO
MGT Pins
Virtex-II Pro Package
Virtex-II Pro
Device
FG256 FG456 FG676 FF672
FF896 FF1152 FF1148 FF1517 FF1704 FF1696
Available
User I/Os
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
1040
180
1164
0
RocketIO
MGT Pins
XC2VP100
XC2VP125
Differential
I/O Pairs
512
572
1200
0
Available
User I/Os
1040
180
RocketIO
MGT Pins
Differential
I/O Pairs
512
590
Virtex-II Pro Pin Definitions
This section describes the pinouts for Virtex-II Pro devices
in the following packages:
table per package). Pins that are not available for smaller
devices are listed in right-hand columns.
•
•
FG256, FG456, and FG676: wire-bond fine-pitch BGA
of 1.00 mm pitch
Each device is split into eight I/O banks to allow for flexibility
in the choice of I/O standards. Global pins, including JTAG,
configuration, and power/ground pins, are listed at the end
of each table. Table 4 provides definitions for all pin types.
FF672, FF896, FF1148, FF1152, FF1517, FF1696, and
FF1704: flip-chip fine-pitch BGA of 1.00 mm pitch
All Virtex-II Pro pinout tables are available on the distribu-
tion CD-ROM, or on the web (at http://www.xilinx.com).
All of the devices supported in a particular package are
pinout-compatible and are listed in the same table (one
Pin Definitions
Table 4 provides a description of each pin type listed in Virtex-II Pro pinout tables.
Table 4: Virtex-II Pro Pin Definitions
Pin Name
User I/O Pins
IO_LXXY_#
Direction
Description
Input/Output All user I/O pins are capable of differential signalling and can implement LVDS,
ULVDS, BLVDS, LVPECL, or LDT pairs. Each user I/O is labeled “IO_LXXY_#”, where:
IO indicates a user I/O pin.
LXXY indicates a differential pair, with XX a unique pair in the bank and Y = P/N for
the positive and negative sides of the differential pair.
# indicates the bank number (0 through 7)
Dual-Function Pins
IO_LXXY_#/ZZZ
The dual-function pins are labelled “IO_LXXY_#/ZZZ”, where ZZZ can be one of the
following pins:
Per Bank - VRP, VRN, or VREF
Globally - GCLKX(S/P), BUSY/DOUT, INIT_B, D0/DIN – D7, RDWR_B, or CS_B
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
3
Product Specification
1-800-255-7778
R
Virtex-II Pro Pin Definitions
Table 4: Virtex-II Pro Pin Definitions (Continued)
Pin Name
With /ZZZ:
Direction
Description
•
•
In SelectMAP mode, D0 through D7 are configuration data pins. These pins
become user I/Os after configuration, unless the SelectMAP port is retained.
D0/DIN, D1, D2, Input/Output
D3, D4, D5, D6,
D7
In bit-serial modes, DIN (D0) is the single-data input. This pin becomes a user I/O
after configuration.
CS_B
Input
Input
In SelectMAP mode, this is the active-low Chip Select signal. The pin becomes a user
I/O after configuration, unless the SelectMAP port is retained.
RDWR_B
BUSY/DOUT
In SelectMAP mode, this is the active-low Write Enable signal. The pin becomes a user
I/O after configuration, unless the SelectMAP port is retained.
•
In SelectMAP mode, BUSY controls the rate at which configuration data is loaded.
The pin becomes a user I/O after configuration, unless the SelectMAP port is
retained.
Output
•
In bit-serial modes, DOUT provides preamble and configuration data to
downstream devices in a daisy-chain. The pin becomes a user I/O after
configuration.
INIT_B
Bidirectional When Low, this pin indicates that the configuration memory is being cleared. When
(open-drain) held Low, the start of configuration is delayed. During configuration, a Low on this
output indicates that a configuration data error has occurred. The pin becomes a user
I/O after configuration.
GCLKx (S/P)
Input/Output These are clock input pins that connect to Global Clock Buffers. These pins become
regular user I/Os when not needed for clocks.
VRP
VRN
VREF
Input
Input
Input
This pin is for the DCI voltage reference resistor of P transistor (per bank).
This pin is for the DCI voltage reference resistor of N transistor (per bank).
These are input threshold voltage pins. They become user I/Os when an external
threshold voltage is not needed (per bank).
Dedicated Pins(1)
CCLK
Input/Output Configuration clock. Output in Master mode or Input in Slave mode.
PROG_B
Input
Active Low asynchronous reset to configuration logic. This pin has a permanent weak
pull-up resistor.
DONE
Input/Output DONE is a bidirectional signal with an optional internal pull-up resistor. As an output,
this pin indicates completion of the configuration process. As an input, a Low level on
DONE can be configured to delay the start-up sequence.
M2, M1, M0
HSWAP_EN
TCK
Input
Input
Input
Input
Configuration mode selection.
Enable I/O pull-ups during configuration.
Boundary Scan Clock.
TDI
Boundary Scan Data Input.
Boundary Scan Data Output.
TDO
Output
(open-drain)
TMS
Input
Boundary Scan Mode Select.
PWRDWN_B
Input
Active Low power-down pin (unsupported). Driving this pin Low can adversely affect
(unsupported) device operation and configuration. PWRDWN_B is internally pulled High, which is its
default state. It does not require an external pull-up.
4
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
Description
Table 4: Virtex-II Pro Pin Definitions (Continued)
Pin Name
Other Pins
Direction
DXN, DXP
VBATT
N/A
Input
N/A
Temperature-sensing diode pins (Anode: DXP, Cathode: DXN).
Decryptor key memory backup supply. (Do not connect if battery is not used.)
Reserved pin - do not connect.
RSVD
VCCO
Input
Input
Input
Input
Input
Power-supply pins for the output drivers (per bank).
Power-supply pins for auxiliary circuits.
Power-supply pins for the internal core logic.
Ground.
VCCAUX
VCCINT
GND
AVCCAUXRX#
Analog power supply for receive circuitry of the RocketIO multi-gigabit transceiver
(2.5V).
AVCCAUXTX#
Input
Analog power supply for transmit circuitry of the RocketIO multi-gigabit transceiver
(2.5V).
VTRXPAD#
VTTXPAD#
GNDA# (2)
RXPPAD#
RXNPAD#
TXPPAD#
TXNPAD#
Notes:
Input
Input
Receive termination supply for the RocketIO multi-gigabit transceiver (1.8V - 2.8V).
Transmit termination supply for the RocketIO multi-gigabit transceiver (1.8V - 2.8V).
Ground for the analog circuitry of the RocketIO multi-gigabit transceiver.
Positive differential receive port of the RocketIO multi-gigabit transceiver.
Negative differential receive port of the RocketIO multi-gigabit transceiver.
Positive differential transmit port of the RocketIO multi-gigabit transceiver.
Negative differential transmit port of the RocketIO multi-gigabit transceiver.
Input
Input
Input
Output
Output
1. All dedicated pins (JTAG and configuration) are powered by VCCAUX (independent of the bank VCCO voltage).
BREFCLK Pin Definitions
These dedicated clocks use the same clock inputs for all packages:
P
N
P
GCLK4S
GCLK5P
GCLK2S
GCLK3P
P
N
P
GCLK6P
GCLK7S
GCLK0P
GCLK1S
BREFCLK
BREFCLK
Top
Bottom
BREFCLK2
BREFCLK2
N
N
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
5
Product Specification
1-800-255-7778
R
FG256 Fine-Pitch BGA Package
FG256 Fine-Pitch BGA Package
As shown in Table 5, XC2VP2 and XC2VP4 Virtex-II Pro devices are available in the FG256 fine-pitch BGA package. The
pins in each of these devices are identical. Following this table are the FG256 Fine-Pitch BGA Package Specifications
(1.00mm pitch).
Table 5: FG256 — XC2VP2 and XC2VP4
Bank
Pin Description
IO_L01N_0/VRP_0
IO_L01P_0/VRN_0
IO_L02N_0
Pin Number
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
C2
C3
B3
C4
A2
A3
D5
C5
D6
E6
E7
D7
C7
D8
C8
B8
A8
IO_L02P_0
IO_L03N_0
IO_L03P_0/VREF_0
IO_L06N_0
IO_L06P_0
IO_L07P_0
IO_L09N_0
IO_L09P_0/VREF_0
IO_L69N_0
IO_L69P_0/VREF_0
IO_L74N_0/GCLK7P
IO_L74P_0/GCLK6S
IO_L75N_0/GCLK5P
IO_L75P_0/GCLK4S
1
1
1
1
1
1
1
1
1
1
1
1
1
IO_L75N_1/GCLK3P
IO_L75P_1/GCLK2S
IO_L74N_1/GCLK1P
IO_L74P_1/GCLK0S
IO_L69N_1/VREF_1
IO_L69P_1
A9
B9
C9
D9
C10
D10
E10
E11
D11
C12
D12
A14
A15
IO_L09N_1/VREF_1
IO_L09P_1
IO_L07N_1
IO_L06N_1
IO_L06P_1
IO_L03N_1/VREF_1
IO_L03P_1
6
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
Table 5: FG256 — XC2VP2 and XC2VP4
Bank
Pin Description
IO_L02N_1
Pin Number
C13
1
1
1
1
IO_L02P_1
B14
IO_L01N_1/VRP_1
IO_L01P_1/VRN_1
C14
C15
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
IO_L01N_2/VRP_2
IO_L01P_2/VRN_2
IO_L02N_2
E14
E15
E13
F12
F13
F14
F15
F16
G13
G14
G15
G16
G12
H13
H14
H15
H16
J16
IO_L02P_2
IO_L03N_2
IO_L03P_2
IO_L04N_2/VREF_2
IO_L04P_2
IO_L06N_2
IO_L06P_2
IO_L85N_2
IO_L85P_2
IO_L86N_2
IO_L86P_2
IO_L88N_2/VREF_2
IO_L88P_2
IO_L90N_2
IO_L90P_2
3
3
3
3
3
3
3
3
3
3
3
IO_L90N_3
IO_L90P_3
J15
J14
J13
K12
K16
K15
K14
K13
L16
L15
L14
IO_L89N_3
IO_L89P_3
IO_L87N_3/VREF_3
IO_L87P_3
IO_L85N_3
IO_L85P_3
IO_L06N_3
IO_L06P_3
IO_L05N_3
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
7
Product Specification
1-800-255-7778
R
FG256 Fine-Pitch BGA Package
Table 5: FG256 — XC2VP2 and XC2VP4
Bank
Pin Description
IO_L05P_3
Pin Number
L13
3
3
3
3
3
3
3
IO_L03N_3/VREF_3
IO_L03P_3
L12
M13
IO_L02N_3
M16
IO_L02P_3
N16
IO_L01N_3/VRP_3
IO_L01P_3/VRN_3
M15
M14
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
IO_L01N_4/BUSY/DOUT(1)
IO_L01P_4/INIT_B
IO_L02N_4/D0/DIN(1)
IO_L02P_4/D1
P15
P14
R14
P13
T15
T14
N12
P12
N11
M11
M10
N10
P10
N9
IO_L03N_4/D2
IO_L03P_4/D3
IO_L06N_4/VRP_4
IO_L06P_4/VRN_4
IO_L07P_4/VREF_4
IO_L09N_4
IO_L09P_4/VREF_4
IO_L69N_4
IO_L69P_4/VREF_4
IO_L74N_4/GCLK3S
IO_L74P_4/GCLK2P
IO_L75N_4/GCLK1S
IO_L75P_4/GCLK0P
P9
R9
T9
5
5
5
5
5
5
5
5
5
IO_L75N_5/GCLK7S
IO_L75P_5/GCLK6P
IO_L74N_5/GCLK5S
IO_L74P_5/GCLK4P
IO_L69N_5/VREF_5
IO_L69P_5
T8
R8
P8
N8
P7
N7
M7
M6
N6
IO_L09N_5/VREF_5
IO_L09P_5
IO_L07N_5/VREF_5
8
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
Table 5: FG256 — XC2VP2 and XC2VP4
Bank
Pin Description
IO_L06N_5/VRP_5
IO_L06P_5/VRN_5
IO_L03N_5/D4
Pin Number
5
5
5
5
5
5
5
5
P5
N5
T3
T2
P4
R3
IO_L03P_5/D5
IO_L02N_5/D6
IO_L02P_5/D7
IO_L01N_5/RDWR_B
IO_L01P_5/CS_B
P3
P2
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
IO_L01P_6/VRN_6
IO_L01N_6/VRP_6
IO_L02P_6
M3
M2
N1
M1
M4
L5
L4
L3
L2
L1
K4
K3
K2
K1
K5
J4
IO_L02N_6
IO_L03P_6
IO_L03N_6/VREF_6
IO_L05P_6
IO_L05N_6
IO_L06P_6
IO_L06N_6
IO_L85P_6
IO_L85N_6
IO_L87P_6
IO_L87N_6/VREF_6
IO_L89P_6
IO_L89N_6
IO_L90P_6
J3
IO_L90N_6
J2
7
7
7
7
7
7
7
IO_L90P_7
IO_L90N_7
J1
H1
H2
H3
H4
G5
G1
IO_L88P_7
IO_L88N_7/VREF_7
IO_L86P_7
IO_L86N_7
IO_L85P_7
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
9
Product Specification
1-800-255-7778
R
FG256 Fine-Pitch BGA Package
Table 5: FG256 — XC2VP2 and XC2VP4
Bank
Pin Description
IO_L85N_7
Pin Number
7
7
7
7
7
7
7
7
7
7
7
G2
G3
G4
F1
F2
F3
F4
F5
E4
E2
E3
IO_L06P_7
IO_L06N_7
IO_L04P_7
IO_L04N_7/VREF_7
IO_L03P_7
IO_L03N_7
IO_L02P_7
IO_L02N_7
IO_L01P_7/VRN_7
IO_L01N_7/VRP_7
0
0
0
1
1
1
2
2
2
3
3
3
4
4
4
5
5
5
6
6
6
7
7
VCCO_0
VCCO_0
VCCO_0
VCCO_1
VCCO_1
VCCO_1
VCCO_2
VCCO_2
VCCO_2
VCCO_3
VCCO_3
VCCO_3
VCCO_4
VCCO_4
VCCO_4
VCCO_5
VCCO_5
VCCO_5
VCCO_6
VCCO_6
VCCO_6
VCCO_7
VCCO_7
F8
F7
E8
F9
F10
E9
H12
H11
G11
K11
J12
J11
M9
L9
L10
M8
L8
L7
K6
J6
J5
H6
H5
10
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
Table 5: FG256 — XC2VP2 and XC2VP4
Bank
Pin Description
Pin Number
7
VCCO_7
G6
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
CCLK
PROG_B
DONE
N15
D1
P16
N3
M0
M1
N2
M2
P1
TCK
D16
E1
TDI
TDO
E16
C16
N14
C1
TMS
PWRDWN_B
HSWAP_EN
RSVD
D14
D15
D2
VBATT
DXP
DXN
D3
AVCCAUXTX6
VTTXPAD6
TXNPAD6
TXPPAD6
GNDA6
B5
B4
A4
A5
C6
RXPPAD6
RXNPAD6
VTRXPAD6
AVCCAUXRX6
AVCCAUXTX7
VTTXPAD7
TXNPAD7
TXPPAD7
GNDA7
A6
A7
B6
B7
B11
B10
A10
A11
C11
A12
A13
B12
RXPPAD7
RXNPAD7
VTRXPAD7
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
11
Product Specification
1-800-255-7778
R
FG256 Fine-Pitch BGA Package
Table 5: FG256 — XC2VP2 and XC2VP4
Bank
Pin Description
AVCCAUXRX7
AVCCAUXRX18
VTRXPAD18
RXNPAD18
RXPPAD18
Pin Number
B13
R13
R12
T13
T12
P11
T11
T10
R10
R11
R7
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
GNDA18
TXPPAD18
TXNPAD18
VTTXPAD18
AVCCAUXTX18
AVCCAUXRX19
VTRXPAD19
RXNPAD19
RXPPAD19
R6
T7
T6
GNDA19
P6
TXPPAD19
T5
TXNPAD19
T4
VTTXPAD19
AVCCAUXTX19
R4
R5
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCAUX
VCCAUX
VCCAUX
VCCAUX
GND
N4
N13
M5
M12
E5
E12
D4
D13
R16
R1
B16
B1
T16
T1
GND
GND
R2
12
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
Table 5: FG256 — XC2VP2 and XC2VP4
Bank
Pin Description
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Pin Number
R15
L6
N/A
N/A
N/A
L11
K9
N/A
N/A
K8
N/A
K7
N/A
K10
J9
N/A
N/A
J8
N/A
J7
N/A
J10
H9
N/A
N/A
H8
N/A
H7
N/A
H10
G9
N/A
N/A
G8
N/A
G7
N/A
G10
F6
N/A
N/A
F11
B2
N/A
N/A
B15
A16
A1
N/A
N/A
Notes:
1. See Table 4 for an explanation of the signals available on this pin.
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
13
R
FG256 Fine-Pitch BGA Package
FG256 Fine-Pitch BGA Package Specifications (1.00mm pitch)
Figure 1: FG256 Fine-Pitch BGA Package Specifications
14
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
FG456 Fine-Pitch BGA Package
As shown in Table 6, XC2VP2, XC2VP4, and XC2VP7 Virtex-II Pro devices are available in the FG456 fine-pitch BGA
package. The pins in these devices are same, except for the differences shown in the "No Connects" column. Following this
table are the FG456 Fine-Pitch BGA Package Specifications (1.00mm pitch).
Table 6: FG456 — XC2VP2, XC2VP4, and XC2VP7
No Connects
Bank
0
Pin Description
IO_L01N_0/VRP_0
IO_L01P_0/VRN_0
IO_L02N_0
Pin Number
D5
XC2VP2
XC2VP4
XC2VP7
0
D6
0
E6
0
IO_L02P_0
E7
0
IO_L03N_0
D7
0
IO_L03P_0/VREF_0
IO_L05_0/No_Pair
IO_L06N_0
C7
0
E8
0
D8
0
IO_L06P_0
C8
0
IO_L07N_0
F9
0
IO_L07P_0
E9
0
IO_L09N_0
D9
0
IO_L09P_0/VREF_0
IO_L67N_0
D10
F10
E10
C10
B11
F11
E11
D11
C11
0
0
IO_L67P_0
0
IO_L69N_0
0
IO_L69P_0/VREF_0
IO_L74N_0/GCLK7P
IO_L74P_0/GCLK6S
IO_L75N_0/GCLK5P
IO_L75P_0/GCLK4S
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
IO_L75N_1/GCLK3P
IO_L75P_1/GCLK2S
IO_L74N_1/GCLK1P
IO_L74P_1/GCLK0S
IO_L69N_1/VREF_1
IO_L69P_1
C12
D12
E12
F12
B12
C13
E13
F13
D13
D14
E14
IO_L67N_1
IO_L67P_1
IO_L09N_1/VREF_1
IO_L09P_1
IO_L07N_1
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
15
R
FG456 Fine-Pitch BGA Package
Table 6: FG456 — XC2VP2, XC2VP4, and XC2VP7
No Connects
XC2VP4
Bank
Pin Description
IO_L07P_1
Pin Number
F14
XC2VP2
XC2VP7
1
1
1
1
1
1
1
1
1
1
IO_L06N_1
C15
IO_L06P_1
D15
IO_L05_1/No_Pair
IO_L03N_1/VREF_1
IO_L03P_1
E15
C16
D16
IO_L02N_1
E16
IO_L02P_1
E17
IO_L01N_1/VRP_1
IO_L01P_1/VRN_1
D17
D18
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
IO_L01N_2/VRP_2
IO_L01P_2/VRN_2
IO_L02N_2
C21
C22
D21
D22
E19
E20
E21
E22
F19
F20
F21
F22
F18
G18
G19
G20
G21
G22
H19
H20
H21
H22
H18
J17
IO_L02P_2
IO_L03N_2
IO_L03P_2
IO_L04N_2/VREF_2
IO_L04P_2
IO_L06N_2
IO_L06P_2
IO_L43N_2
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
IO_L43P_2
IO_L46N_2/VREF_2
IO_L46P_2
IO_L48N_2
IO_L48P_2
IO_L49N_2
IO_L49P_2
IO_L50N_2
IO_L50P_2
IO_L52N_2/VREF_2
IO_L52P_2
IO_L54N_2
IO_L54P_2
IO_L55N_2
J19
IO_L55P_2
J20
16
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 6: FG456 — XC2VP2, XC2VP4, and XC2VP7
Bank
Pin Description
IO_L56N_2
Pin Number
J21
XC2VP2
NC
XC2VP4
XC2VP7
2
2
2
2
2
2
2
2
2
2
2
2
2
2
IO_L56P_2
J22
NC
IO_L58N_2/VREF_2
IO_L58P_2
J18
NC
K18
NC
IO_L60N_2
K19
NC
IO_L60P_2
K20
NC
IO_L85N_2
K21
IO_L85P_2
K22
IO_L86N_2
K17
IO_L86P_2
L17
IO_L88N_2/VREF_2
IO_L88P_2
L18
L19
IO_L90N_2
L20
IO_L90P_2
L21
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
IO_L90N_3
IO_L90P_3
M21
M20
M19
M18
M17
N17
N22
N21
N20
N19
N18
P18
P22
P21
P20
P19
P17
R18
R22
R21
R20
R19
IO_L89N_3
IO_L89P_3
IO_L87N_3/VREF_3
IO_L87P_3
IO_L85N_3
IO_L85P_3
IO_L60N_3
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
IO_L60P_3
IO_L59N_3
IO_L59P_3
IO_L57N_3/VREF_3
IO_L57P_3
IO_L55N_3
IO_L55P_3
IO_L54N_3
IO_L54P_3
IO_L53N_3
IO_L53P_3
IO_L51N_3/VREF_3
IO_L51P_3
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
17
R
FG456 Fine-Pitch BGA Package
Table 6: FG456 — XC2VP2, XC2VP4, and XC2VP7
No Connects
XC2VP4
Bank
3
Pin Description
IO_L49N_3
Pin Number
T22
XC2VP2
NC
XC2VP7
3
IO_L49P_3
T21
NC
3
IO_L48N_3
T20
NC
3
IO_L48P_3
T19
NC
3
IO_L47N_3
T18
NC
3
IO_L47P_3
U18
NC
3
IO_L45N_3/VREF_3
IO_L45P_3
U22
NC
3
U21
NC
3
IO_L43N_3
U20
NC
3
IO_L43P_3
U19
NC
3
IO_L06N_3
V22
3
IO_L06P_3
V21
3
IO_L05N_3
V20
3
IO_L05P_3
V19
3
IO_L03N_3/VREF_3
IO_L03P_3
W22
W21
Y22
3
3
IO_L02N_3
3
IO_L02P_3
Y21
3
IO_L01N_3/VRP_3
IO_L01P_3/VRN_3
AA22
AB21
3
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
IO_L01N_4/BUSY/DOUT(1)
IO_L01P_4/INIT_B
IO_L02N_4/D0/DIN(1)
IO_L02P_4/D1
W18
W17
V17
V16
W16
Y16
V15
W15
Y15
U14
V14
W14
W13
U13
V13
Y13
IO_L03N_4/D2
IO_L03P_4/D3
IO_L05_4/No_Pair
IO_L06N_4/VRP_4
IO_L06P_4/VRN_4
IO_L07N_4
IO_L07P_4/VREF_4
IO_L09N_4
IO_L09P_4/VREF_4
IO_L67N_4
IO_L67P_4
IO_L69N_4
18
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 6: FG456 — XC2VP2, XC2VP4, and XC2VP7
Bank
Pin Description
Pin Number
AA12
U12
XC2VP2
XC2VP4
XC2VP7
4
4
4
4
4
IO_L69P_4/VREF_4
IO_L74N_4/GCLK3S
IO_L74P_4/GCLK2P
IO_L75N_4/GCLK1S
IO_L75P_4/GCLK0P
V12
W12
Y12
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
IO_L75N_5/GCLK7S
IO_L75P_5/GCLK6P
IO_L74N_5/GCLK5S
IO_L74P_5/GCLK4P
IO_L69N_5/VREF_5
IO_L69P_5
Y11
W11
V11
U11
AA11
Y10
V10
U10
W10
W9
V9
IO_L67N_5
IO_L67P_5
IO_L09N_5/VREF_5
IO_L09P_5
IO_L07N_5/VREF_5
IO_L07P_5
U9
IO_L06N_5/VRP_5
IO_L06P_5/VRN_5
IO_L05_5/No_Pair
IO_L03N_5/D4
Y8
W8
V8
Y7
IO_L03P_5/D5
W7
V7
IO_L02N_5/D6
IO_L02P_5/D7
V6
IO_L01N_5/RDWR_B
IO_L01P_5/CS_B
W6
W5
6
6
6
6
6
6
6
6
6
IO_L01P_6/VRN_6
IO_L01N_6/VRP_6
IO_L02P_6
AB2
AA1
Y2
IO_L02N_6
Y1
IO_L03P_6
W2
W1
V4
IO_L03N_6/VREF_6
IO_L05P_6
IO_L05N_6
V3
IO_L06P_6
V2
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
19
R
FG456 Fine-Pitch BGA Package
Table 6: FG456 — XC2VP2, XC2VP4, and XC2VP7
No Connects
XC2VP4
Bank
6
Pin Description
IO_L06N_6
Pin Number
V1
XC2VP2
XC2VP7
6
IO_L43P_6
U4
U3
U2
U1
U5
T5
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
6
IO_L43N_6
6
IO_L45P_6
6
IO_L45N_6/VREF_6
IO_L47P_6
6
6
IO_L47N_6
6
IO_L48P_6
T4
6
IO_L48N_6
T3
6
IO_L49P_6
T2
6
IO_L49N_6
T1
6
IO_L51P_6
R4
R3
R2
R1
R5
P6
6
IO_L51N_6/VREF_6
IO_L53P_6
6
6
IO_L53N_6
6
IO_L54P_6
6
IO_L54N_6
6
IO_L55P_6
P4
6
IO_L55N_6
P3
6
IO_L57P_6
P2
6
IO_L57N_6/VREF_6
IO_L59P_6
P1
6
P5
6
IO_L59N_6
N5
N4
N3
N2
N1
N6
M6
M5
M4
M3
M2
6
IO_L60P_6
6
IO_L60N_6
6
IO_L85P_6
6
IO_L85N_6
6
IO_L87P_6
6
IO_L87N_6/VREF_6
IO_L89P_6
6
6
IO_L89N_6
6
IO_L90P_6
6
IO_L90N_6
7
7
7
IO_L90P_7
IO_L90N_7
IO_L88P_7
L2
L3
L4
20
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 6: FG456 — XC2VP2, XC2VP4, and XC2VP7
Bank
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
Pin Description
IO_L88N_7/VREF_7
IO_L86P_7
Pin Number
L5
XC2VP2
XC2VP4
XC2VP7
L6
IO_L86N_7
K6
K1
K2
K3
K4
K5
J5
IO_L85P_7
IO_L85N_7
IO_L60P_7
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
IO_L60N_7
IO_L58P_7
IO_L58N_7/VREF_7
IO_L56P_7
J1
IO_L56N_7
J2
IO_L55P_7
J3
IO_L55N_7
J4
IO_L54P_7
J6
IO_L54N_7
H5
H1
H2
H3
H4
G1
G2
G3
G4
G5
F5
IO_L52P_7
IO_L52N_7/VREF_7
IO_L50P_7
IO_L50N_7
IO_L49P_7
IO_L49N_7
IO_L48P_7
IO_L48N_7
IO_L46P_7
IO_L46N_7/VREF_7
IO_L43P_7
F1
IO_L43N_7
F2
IO_L06P_7
F3
IO_L06N_7
F4
IO_L04P_7
E1
E2
E3
E4
D1
D2
C1
C2
IO_L04N_7/VREF_7
IO_L03P_7
IO_L03N_7
IO_L02P_7
IO_L02N_7
IO_L01P_7/VRN_7
IO_L01N_7/VRP_7
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
21
R
FG456 Fine-Pitch BGA Package
Table 6: FG456 — XC2VP2, XC2VP4, and XC2VP7
No Connects
XC2VP4
Bank
Pin Description
Pin Number
XC2VP2
XC2VP7
0
0
0
0
0
1
1
1
1
1
2
2
2
2
2
3
3
3
3
3
4
4
4
4
4
5
5
5
5
5
6
6
6
6
6
7
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_7
G9
G11
G10
F8
F7
G14
G13
G12
F16
F15
L16
K16
J16
H17
G17
T17
R17
P16
N16
M16
U16
U15
T14
T13
T12
U8
U7
T9
T11
T10
T6
R6
P7
N7
M7
L7
22
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 6: FG456 — XC2VP2, XC2VP4, and XC2VP7
Bank
Pin Description
VCCO_7
Pin Number
XC2VP2
XC2VP4
XC2VP7
7
7
7
7
K7
J7
VCCO_7
VCCO_7
H6
G6
VCCO_7
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
CCLK
PROG_B
DONE
W20
B1
Y18
Y4
M0
M1
W3
Y5
M2
TCK
B22
D3
TDI
TDO
D20
A21
Y19
A2
TMS
PWRDWN_B
HSWAP_EN
RSVD
C18
C19
C4
VBATT
DXP
DXN
C5
AVCCAUXTX4
VTTXPAD4
TXNPAD4
TXPPAD4
GNDA4
B4
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
B3
A3
A4
C6
RXPPAD4
RXNPAD4
VTRXPAD4
AVCCAUXRX4
AVCCAUXTX6
VTTXPAD6
TXNPAD6
TXPPAD6
GNDA6
A5
A6
B5
B6
B8
B7
A7
A8
C9
RXPPAD6
RXNPAD6
A9
A10
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
23
R
FG456 Fine-Pitch BGA Package
Table 6: FG456 — XC2VP2, XC2VP4, and XC2VP7
No Connects
XC2VP4
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
VTRXPAD6
AVCCAUXRX6
AVCCAUXTX7
VTTXPAD7
TXNPAD7
Pin Number
B9
XC2VP2
XC2VP7
B10
B14
B13
A13
TXPPAD7
A14
GNDA7
C14
RXPPAD7
A15
RXNPAD7
A16
VTRXPAD7
AVCCAUXRX7
AVCCAUXTX9
VTTXPAD9
TXNPAD9
B15
B16
B18
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
B17
A17
TXPPAD9
A18
GNDA9
C17
RXPPAD9
A19
RXNPAD9
A20
VTRXPAD9
AVCCAUXRX9
AVCCAUXRX16
VTRXPAD16
RXNPAD16
RXPPAD16
GNDA16
B19
B20
AA20
AA19
AB20
AB19
Y17
TXPPAD16
TXNPAD16
VTTXPAD16
AVCCAUXTX16
AVCCAUXRX18
VTRXPAD18
RXNPAD18
RXPPAD18
GNDA18
AB18
AB17
AA17
AA18
AA16
AA15
AB16
AB15
Y14
TXPPAD18
TXNPAD18
VTTXPAD18
AB14
AB13
AA13
24
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 6: FG456 — XC2VP2, XC2VP4, and XC2VP7
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
AVCCAUXTX18
AVCCAUXRX19
VTRXPAD19
RXNPAD19
RXPPAD19
Pin Number
AA14
AA10
AA9
XC2VP2
XC2VP4
XC2VP7
AB10
AB9
GNDA19
Y9
TXPPAD19
AB8
TXNPAD19
AB7
VTTXPAD19
AVCCAUXTX19
AVCCAUXRX21
VTRXPAD21
RXNPAD21
RXPPAD21
AA7
AA8
AA6
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
AA5
AB6
AB5
GNDA21
Y6
TXPPAD21
AB4
TXNPAD21
AB3
VTTXPAD21
AVCCAUXTX21
AA3
AA4
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCAUX
U6
U17
T8
T7
T16
T15
R7
R16
H7
H16
G8
G7
G16
G15
F6
F17
M22
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
25
R
FG456 Fine-Pitch BGA Package
Table 6: FG456 — XC2VP2, XC2VP4, and XC2VP7
No Connects
XC2VP4
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
GND
Pin Number
L1
XC2VP2
XC2VP7
B21
B2
AB11
AA21
AA2
A12
Y3
GND
Y20
W4
GND
GND
W19
V5
GND
GND
V18
P9
GND
GND
P14
P13
P12
P11
P10
N9
GND
GND
GND
GND
GND
GND
N14
N13
N12
N11
N10
M9
GND
GND
GND
GND
GND
GND
M14
M13
M12
M11
M10
M1
GND
GND
GND
GND
GND
GND
L9
GND
L22
L14
L13
L12
GND
GND
GND
26
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 6: FG456 — XC2VP2, XC2VP4, and XC2VP7
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Pin Number
L11
XC2VP2
XC2VP4
XC2VP7
L10
K9
K14
K13
K12
K11
K10
J9
J14
J13
J12
J11
J10
E5
E18
D4
D19
C3
C20
AB22
AB12
AB1
A22
A11
A1
Notes:
1. See Table 4 for an explanation of the signals available on this pin.
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
27
R
FG456 Fine-Pitch BGA Package
FG456 Fine-Pitch BGA Package Specifications (1.00mm pitch)
Figure 2: FG456 Fine-Pitch BGA Package Specifications
28
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
FG676 Fine-Pitch BGA Package
As shown in Table 7, XC2VP20, XC2VP30, and XC2VP40 Virtex-II Pro devices are available in the FG676 fine-pitch BGA
package. The pins in these devices are the same, except for the differences shown in the "No Connects" column. Following
this table are the FG676 Fine-Pitch BGA Package Specifications (1.00mm pitch).
Table 7: FG676 — XC2VP20, XC2VP30, and XC2VP40
No Connects
Bank
0
Pin Description
IO_L01N_0/VRP_0
IO_L01P_0/VRN_0
IO_L02N_0
Pin Number
E5
XC2VP20
XC2VP30
XC2VP40
0
D5
0
E6
0
IO_L02P_0
D6
0
IO_L03N_0
G7
0
IO_L03P_0/VREF_0
IO_L05_0/No_Pair
IO_L06N_0
F7
0
E7
0
D7
0
IO_L06P_0
C7
0
IO_L07N_0
H8
0
IO_L07P_0
G8
0
IO_L09N_0
F8
0
IO_L09P_0/VREF_0
IO_L37N_0
E8
0
B8
0
IO_L37P_0
A8
0
IO_L39N_0
H9
0
IO_L39P_0
G9
0
IO_L43N_0
F9
0
IO_L43P_0
E9
0
IO_L45N_0
D9
0
IO_L45P_0/VREF_0
IO_L46N_0
C9
0
H10
H11
E10
E11
D10
C10
G11
F11
J12
H12
0
IO_L46P_0
0
IO_L48N_0
0
IO_L48P_0
0
IO_L49N_0
0
IO_L49P_0
0
IO_L50_0/No_Pair
IO_L53_0/No_Pair
IO_L54N_0
0
0
0
IO_L54P_0
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
29
R
FG676 Fine-Pitch BGA Package
Table 7: FG676 — XC2VP20, XC2VP30, and XC2VP40
No Connects
XC2VP30 XC2VP40
Bank
Pin Description
IO_L55N_0
Pin Number
G12
F12
XC2VP20
0
0
0
0
0
0
0
0
0
0
0
0
IO_L55P_0
IO_L57N_0
E12
IO_L57P_0/VREF_0
IO_L67N_0
F13
D12
IO_L67P_0
C12
IO_L69N_0
J13
IO_L69P_0/VREF_0
IO_L74N_0/GCLK7P
IO_L74P_0/GCLK6S
IO_L75N_0/GCLK5P
IO_L75P_0/GCLK4S
H13
E13
D13
C13
B13
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
IO_L75N_1/GCLK3P
IO_L75P_1/GCLK2S
IO_L74N_1/GCLK1P
IO_L74P_1/GCLK0S
IO_L69N_1/VREF_1
IO_L69P_1
B14
C14
D14
E14
H14
J14
IO_L67N_1
C15
D15
F14
E15
F15
G15
H15
J15
IO_L67P_1
IO_L57N_1/VREF_1
IO_L57P_1
IO_L55N_1
IO_L55P_1
IO_L54N_1
IO_L54P_1
IO_L53_1/No_Pair
IO_L50_1/No_Pair
IO_L49N_1
F16
G16
C17
D17
E16
E17
H16
H17
IO_L49P_1
IO_L48N_1
IO_L48P_1
IO_L46N_1
IO_L46P_1
30
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 7: FG676 — XC2VP20, XC2VP30, and XC2VP40
Bank
1
Pin Description
IO_L45N_1/VREF_1
IO_L45P_1
Pin Number
C18
D18
E18
XC2VP20
XC2VP30
XC2VP40
1
1
IO_L43N_1
1
IO_L43P_1
F18
1
IO_L39N_1
G18
H18
A19
1
IO_L39P_1
1
IO_L37N_1
1
IO_L37P_1
B19
1
IO_L09N_1/VREF_1
IO_L09P_1
E19
1
F19
1
IO_L07N_1
G19
H19
C20
D20
E20
1
IO_L07P_1
1
IO_L06N_1
1
IO_L06P_1
1
IO_L05_1/No_Pair
IO_L03N_1/VREF_1
IO_L03P_1
1
F20
1
G20
D21
E21
1
IO_L02N_1
1
IO_L02P_1
1
IO_L01N_1/VRP_1
IO_L01P_1/VRN_1
D22
E22
1
2
2
2
2
2
2
2
2
2
2
2
2
2
IO_L01N_2/VRP_2
IO_L01P_2/VRN_2
IO_L02N_2
C25
C26
D25
D26
E23
F22
E25
E26
F21
G21
F23
F24
F25
IO_L02P_2
IO_L03N_2
IO_L03P_2
IO_L04N_2/VREF_2
IO_L04P_2
IO_L06N_2
IO_L06P_2
IO_L24N_2
NC
NC
IO_L24P_2
IO_L31N_2
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
31
R
FG676 Fine-Pitch BGA Package
Table 7: FG676 — XC2VP20, XC2VP30, and XC2VP40
No Connects
XC2VP30 XC2VP40
Bank
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
Pin Description
IO_L31P_2
Pin Number
F26
G22
H22
G23
G24
G25
G26
H20
H21
H25
H26
J19
XC2VP20
IO_L32N_2
IO_L32P_2
IO_L34N_2/VREF_2
IO_L34P_2
IO_L36N_2
IO_L36P_2
IO_L37N_2
IO_L37P_2
IO_L38N_2
IO_L38P_2
IO_L40N_2/VREF_2
IO_L40P_2
J20
IO_L42N_2
J21
IO_L42P_2
J22
IO_L43N_2
J23
IO_L43P_2
J24
IO_L44N_2
J25
IO_L44P_2
J26
IO_L46N_2/VREF_2
IO_L46P_2
K19
L19
IO_L48N_2
K22
K23
K24
L24
IO_L48P_2
IO_L49N_2
IO_L49P_2
IO_L50N_2
K25
K26
L20
IO_L50P_2
IO_L52N_2/VREF_2
IO_L52P_2
M20
L21
IO_L54N_2
IO_L54P_2
L22
IO_L55N_2
L25
IO_L55P_2
L26
IO_L56N_2
M18
M19
IO_L56P_2
32
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 7: FG676 — XC2VP20, XC2VP30, and XC2VP40
Bank
Pin Description
IO_L58N_2/VREF_2
IO_L58P_2
Pin Number
M21
XC2VP20
XC2VP30
XC2VP40
2
2
2
2
2
2
2
2
2
2
2
2
N21
IO_L60N_2
M22
IO_L60P_2
M23
IO_L85N_2
M25
IO_L85P_2
M26
IO_L86N_2
N18
IO_L86P_2
N19
IO_L88N_2/VREF_2
IO_L88P_2
N22
N23
IO_L90N_2
N24
IO_L90P_2
N25
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
IO_L90N_3
IO_L90P_3
P25
P24
P23
P22
P19
P18
R26
R25
R23
R22
P21
R21
R19
R18
T26
T25
T22
T21
R20
T20
U26
U25
IO_L89N_3
IO_L89P_3
IO_L87N_3/VREF_3
IO_L87P_3
IO_L85N_3
IO_L85P_3
IO_L60N_3
IO_L60P_3
IO_L59N_3
IO_L59P_3
IO_L57N_3/VREF_3
IO_L57P_3
IO_L55N_3
IO_L55P_3
IO_L54N_3
IO_L54P_3
IO_L53N_3
IO_L53P_3
IO_L51N_3/VREF_3
IO_L51P_3
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
33
R
FG676 Fine-Pitch BGA Package
Table 7: FG676 — XC2VP20, XC2VP30, and XC2VP40
No Connects
XC2VP30 XC2VP40
Bank
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
Pin Description
IO_L49N_3
Pin Number
T24
XC2VP20
IO_L49P_3
U24
IO_L48N_3
U23
IO_L48P_3
U22
IO_L47N_3
T19
IO_L47P_3
U19
IO_L45N_3/VREF_3
IO_L45P_3
V26
V25
IO_L43N_3
V24
IO_L43P_3
V23
IO_L42N_3
V22
IO_L42P_3
V21
IO_L41N_3
V20
IO_L41P_3
V19
IO_L39N_3/VREF_3
IO_L39P_3
W26
W25
W21
W20
Y26
IO_L37N_3
IO_L37P_3
IO_L36N_3
IO_L36P_3
Y25
IO_L35N_3
Y24
IO_L35P_3
Y23
IO_L33N_3/VREF_3
IO_L33P_3
W22
Y22
IO_L31N_3
AA26
AA25
AA24
AA23
Y21
IO_L31P_3
IO_L24N_3
NC
NC
NC
NC
IO_L24P_3
IO_L23N_3
IO_L23P_3
AA21
AB26
AB25
AA22
AB23
AC26
IO_L06N_3
IO_L06P_3
IO_L05N_3
IO_L05P_3
IO_L03N_3/VREF_3
34
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 7: FG676 — XC2VP20, XC2VP30, and XC2VP40
Bank
Pin Description
IO_L03P_3
Pin Number
AC25
XC2VP20
XC2VP30
XC2VP40
3
3
3
3
3
IO_L02N_3
AC24
IO_L02P_3
AD25
IO_L01N_3/VRP_3
IO_L01P_3/VRN_3
AD26
AE26
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
IO_L01N_4/BUSY/DOUT(1)
IO_L01P_4/INIT_B
IO_L02N_4/D0/DIN(1)
IO_L02P_4/D1
IO_L03N_4/D2
IO_L03P_4/D3
IO_L05_4/No_Pair
IO_L06N_4/VRP_4
IO_L06P_4/VRN_4
IO_L07N_4
AB22
AC22
AB21
AC21
Y20
AA20
AB20
AC20
AD20
W19
IO_L07P_4/VREF_4
IO_L09N_4
Y19
AA19
AB19
AE19
AF19
W18
IO_L09P_4/VREF_4
IO_L37N_4
IO_L37P_4
IO_L39N_4
IO_L39P_4
Y18
IO_L43N_4
AA18
AB18
AC18
AD18
W17
IO_L43P_4
IO_L45N_4
IO_L45P_4/VREF_4
IO_L46N_4
IO_L46P_4
W16
IO_L48N_4
AB17
AB16
AC17
AD17
Y16
IO_L48P_4
IO_L49N_4
IO_L49P_4
IO_L50_4/No_Pair
IO_L53_4/No_Pair
AA16
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
35
R
FG676 Fine-Pitch BGA Package
Table 7: FG676 — XC2VP20, XC2VP30, and XC2VP40
No Connects
XC2VP30 XC2VP40
Bank
Pin Description
IO_L54N_4
Pin Number
V15
XC2VP20
4
4
4
4
4
4
4
4
4
4
4
4
4
4
IO_L54P_4
W15
IO_L55N_4
Y15
IO_L55P_4
AA15
AB15
AA14
AC15
AD15
V14
IO_L57N_4
IO_L57P_4/VREF_4
IO_L67N_4
IO_L67P_4
IO_L69N_4
IO_L69P_4/VREF_4
IO_L74N_4/GCLK3S
IO_L74P_4/GCLK2P
IO_L75N_4/GCLK1S
IO_L75P_4/GCLK0P
W14
AB14
AC14
AD14
AE14
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
IO_L75N_5/GCLK7S
IO_L75P_5/GCLK6P
IO_L74N_5/GCLK5S
IO_L74P_5/GCLK4P
IO_L69N_5/VREF_5
IO_L69P_5
AE13
AD13
AC13
AB13
W13
V13
IO_L67N_5
AD12
AC12
AA13
AB12
AA12
Y12
IO_L67P_5
IO_L57N_5/VREF_5
IO_L57P_5
IO_L55N_5
IO_L55P_5
IO_L54N_5
W12
IO_L54P_5
V12
IO_L53_5/No_Pair
IO_L50_5/No_Pair
IO_L49N_5
AA11
Y11
AD10
AC10
AB11
AB10
IO_L49P_5
IO_L48N_5
IO_L48P_5
36
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 7: FG676 — XC2VP20, XC2VP30, and XC2VP40
Bank
5
Pin Description
IO_L46N_5
Pin Number
W11
W10
AD9
AC9
AB9
AA9
Y9
XC2VP20
XC2VP30
XC2VP40
5
IO_L46P_5
5
IO_L45N_5/VREF_5
IO_L45P_5
5
5
IO_L43N_5
5
IO_L43P_5
5
IO_L39N_5
5
IO_L39P_5
W9
5
IO_L37N_5
AF8
AE8
AB8
AA8
Y8
5
IO_L37P_5
5
IO_L09N_5/VREF_5
IO_L09P_5
5
5
IO_L07N_5/VREF_5
IO_L07P_5
5
W8
5
IO_L06N_5/VRP_5
IO_L06P_5/VRN_5
IO_L05_5/No_Pair
IO_L03N_5/D4
IO_L03P_5/D5
IO_L02N_5/D6
IO_L02P_5/D7
IO_L01N_5/RDWR_B
IO_L01P_5/CS_B
AD7
AC7
AB7
AA7
Y7
5
5
5
5
5
AC6
AB6
AC5
AB5
5
5
5
6
6
6
6
6
6
6
6
6
6
6
IO_L01P_6/VRN_6
IO_L01N_6/VRP_6
IO_L02P_6
AE1
AD1
AD2
AC3
AC2
AC1
AB4
AA5
AB2
AB1
AA6
IO_L02N_6
IO_L03P_6
IO_L03N_6/VREF_6
IO_L05P_6
IO_L05N_6
IO_L06P_6
IO_L06N_6
IO_L23P_6
NC
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
37
R
FG676 Fine-Pitch BGA Package
Table 7: FG676 — XC2VP20, XC2VP30, and XC2VP40
No Connects
XC2VP30 XC2VP40
Bank
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Pin Description
IO_L23N_6
Pin Number
Y6
XC2VP20
NC
IO_L24P_6
AA4
AA3
AA2
AA1
Y5
NC
IO_L24N_6
NC
IO_L31P_6
IO_L31N_6
IO_L33P_6
IO_L33N_6/VREF_6
IO_L35P_6
W5
Y4
IO_L35N_6
Y3
IO_L36P_6
Y2
IO_L36N_6
Y1
IO_L37P_6
W7
W6
W2
W1
V8
IO_L37N_6
IO_L39P_6
IO_L39N_6/VREF_6
IO_L41P_6
IO_L41N_6
V7
IO_L42P_6
V6
IO_L42N_6
V5
IO_L43P_6
V4
IO_L43N_6
V3
IO_L45P_6
V2
IO_L45N_6/VREF_6
IO_L47P_6
V1
U8
IO_L47N_6
T8
IO_L48P_6
U5
IO_L48N_6
IO_L49P_6
U4
U3
IO_L49N_6
T3
IO_L51P_6
U2
IO_L51N_6/VREF_6
IO_L53P_6
U1
T7
IO_L53N_6
IO_L54P_6
R7
T6
IO_L54N_6
T5
38
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 7: FG676 — XC2VP20, XC2VP30, and XC2VP40
Bank
Pin Description
IO_L55P_6
Pin Number
XC2VP20
XC2VP30
XC2VP40
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
T2
T1
R9
R8
R6
P6
R5
R4
R2
R1
P9
P8
P5
P4
P3
P2
IO_L55N_6
IO_L57P_6
IO_L57N_6/VREF_6
IO_L59P_6
IO_L59N_6
IO_L60P_6
IO_L60N_6
IO_L85P_6
IO_L85N_6
IO_L87P_6
IO_L87N_6/VREF_6
IO_L89P_6
IO_L89N_6
IO_L90P_6
IO_L90N_6
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
IO_L90P_7
IO_L90N_7
N2
N3
N4
N5
N8
N9
M1
M2
M4
M5
N6
M6
M8
M9
L1
IO_L88P_7
IO_L88N_7/VREF_7
IO_L86P_7
IO_L86N_7
IO_L85P_7
IO_L85N_7
IO_L60P_7
IO_L60N_7
IO_L58P_7
IO_L58N_7/VREF_7
IO_L56P_7
IO_L56N_7
IO_L55P_7
IO_L55N_7
L2
IO_L54P_7
L5
IO_L54N_7
L6
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
39
R
FG676 Fine-Pitch BGA Package
Table 7: FG676 — XC2VP20, XC2VP30, and XC2VP40
No Connects
XC2VP30 XC2VP40
Bank
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
Pin Description
IO_L52P_7
Pin Number
M7
L7
XC2VP20
IO_L52N_7/VREF_7
IO_L50P_7
K1
K2
L3
IO_L50N_7
IO_L49P_7
IO_L49N_7
K3
K4
K5
L8
IO_L48P_7
IO_L48N_7
IO_L46P_7
IO_L46N_7/VREF_7
IO_L44P_7
K8
J1
IO_L44N_7
J2
IO_L43P_7
J3
IO_L43N_7
J4
IO_L42P_7
J5
IO_L42N_7
J6
IO_L40P_7
J7
IO_L40N_7/VREF_7
IO_L38P_7
J8
H1
H2
H6
H7
G1
G2
G3
G4
H5
G5
F1
IO_L38N_7
IO_L37P_7
IO_L37N_7
IO_L36P_7
IO_L36N_7
IO_L34P_7
IO_L34N_7/VREF_7
IO_L32P_7
IO_L32N_7
IO_L31P_7
IO_L31N_7
F2
IO_L24P_7
F3
NC
NC
IO_L24N_7
F4
IO_L06P_7
G6
F6
IO_L06N_7
IO_L04P_7
E1
40
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 7: FG676 — XC2VP20, XC2VP30, and XC2VP40
Bank
Pin Description
IO_L04N_7/VREF_7
IO_L03P_7
Pin Number
XC2VP20
XC2VP30
XC2VP40
7
7
7
7
7
7
7
E2
F5
E4
D1
D2
C1
C2
IO_L03N_7
IO_L02P_7
IO_L02N_7
IO_L01P_7/VRN_7
IO_L01N_7/VRP_7
0
0
0
0
0
0
0
1
1
1
1
1
1
1
2
2
2
2
2
2
2
3
3
3
3
3
3
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
C5
C8
D11
J10
J11
K12
K13
C19
C22
D16
J16
J17
K14
K15
E24
H24
K18
L18
L23
M17
N17
P17
R17
T18
T23
U18
W24
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
41
R
FG676 Fine-Pitch BGA Package
Table 7: FG676 — XC2VP20, XC2VP30, and XC2VP40
No Connects
XC2VP30 XC2VP40
Bank
3
Pin Description
VCCO_3
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
Pin Number
AB24
U14
U15
V16
V17
AC16
AD19
AD22
U12
U13
V10
V11
XC2VP20
4
4
4
4
4
4
4
5
5
5
5
5
AC11
AD5
AD8
P10
R10
T4
5
5
6
6
6
6
T9
6
U9
6
W3
6
AB3
E3
7
7
H3
7
K9
7
L4
7
L9
7
M10
N10
7
N/A
N/A
N/A
N/A
N/A
PROG_B
HSWAP_EN
DXP
B1
B3
A3
C4
B5
DXN
AVCCAUXTX4
42
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 7: FG676 — XC2VP20, XC2VP30, and XC2VP40
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
VTTXPAD4
TXNPAD4
Pin Number
B4
XC2VP20
XC2VP30
XC2VP40
A4
TXPPAD4
A5
GNDA4
C6
RXPPAD4
RXNPAD4
VTRXPAD4
AVCCAUXRX4
AVCCAUXTX6
VTTXPAD6
TXNPAD6
A6
A7
B6
B7
B10
B9
A9
TXPPAD6
A10
C11
A11
A12
B11
B12
B16
B15
A15
A16
C16
A17
A18
B17
B18
B21
B20
A20
A21
C21
A22
A23
B22
B23
GNDA6
RXPPAD6
RXNPAD6
VTRXPAD6
AVCCAUXRX6
AVCCAUXTX7
VTTXPAD7
TXNPAD7
TXPPAD7
GNDA7
RXPPAD7
RXNPAD7
VTRXPAD7
AVCCAUXRX7
AVCCAUXTX9
VTTXPAD9
TXNPAD9
TXPPAD9
GNDA9
RXPPAD9
RXNPAD9
VTRXPAD9
AVCCAUXRX9
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
43
R
FG676 Fine-Pitch BGA Package
Table 7: FG676 — XC2VP20, XC2VP30, and XC2VP40
No Connects
XC2VP30 XC2VP40
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
RSVD
Pin Number
C23
XC2VP20
VBATT
A24
TMS
B24
TCK
B26
TDO
D24
CCLK
AE24
AF24
AD23
AE23
AE22
AF23
AF22
AD21
AF21
AF20
AE20
AE21
AE18
AE17
AF18
AF17
AD16
AF16
AF15
AE15
AE16
AE12
AE11
AF12
AF11
AD11
AF10
AF9
PWRDWN_B
DONE
AVCCAUXRX16
VTRXPAD16
RXNPAD16
RXPPAD16
GNDA16
TXPPAD16
TXNPAD16
VTTXPAD16
AVCCAUXTX16
AVCCAUXRX18
VTRXPAD18
RXNPAD18
RXPPAD18
GNDA18
TXPPAD18
TXNPAD18
VTTXPAD18
AVCCAUXTX18
AVCCAUXRX19
VTRXPAD19
RXNPAD19
RXPPAD19
GNDA19
TXPPAD19
TXNPAD19
VTTXPAD19
AVCCAUXTX19
AE9
AE10
44
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 7: FG676 — XC2VP20, XC2VP30, and XC2VP40
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
AVCCAUXRX21
VTRXPAD21
RXNPAD21
RXPPAD21
GNDA21
Pin Number
AE7
AE6
AF7
XC2VP20
XC2VP30
XC2VP40
AF6
AD6
AF5
TXPPAD21
TXNPAD21
VTTXPAD21
AVCCAUXTX21
M2
AF4
AE4
AE5
AD4
AF3
M0
M1
AE3
D3
TDI
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
G10
G13
G14
G17
J9
J18
K7
K10
K11
K16
K17
K20
L10
L17
N7
N20
P7
P20
T10
T17
U7
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
45
R
FG676 Fine-Pitch BGA Package
Table 7: FG676 — XC2VP20, XC2VP30, and XC2VP40
No Connects
XC2VP30 XC2VP40
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
GND
Pin Number
U10
U11
U16
U17
U20
V9
XC2VP20
V18
Y10
Y13
Y14
Y17
A2
A13
A14
A25
N1
N26
P1
P26
AF2
AF13
AF14
AF25
A1
GND
A26
B2
GND
GND
B25
C3
GND
GND
C24
D4
GND
GND
D8
GND
D19
D23
F10
F17
GND
GND
GND
46
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 7: FG676 — XC2VP20, XC2VP30, and XC2VP40
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Pin Number
H4
XC2VP20
XC2VP30
XC2VP40
H23
K6
K21
L11
L12
L13
L14
L15
L16
M3
M11
M12
M13
M14
M15
M16
M24
N11
N12
N13
N14
N15
N16
P11
P12
P13
P14
P15
P16
R3
R11
R12
R13
R14
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
47
R
FG676 Fine-Pitch BGA Package
Table 7: FG676 — XC2VP20, XC2VP30, and XC2VP40
No Connects
XC2VP30 XC2VP40
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Pin Number
R15
XC2VP20
R16
R24
T11
T12
T13
T14
T15
T16
U6
U21
W4
W23
AA10
AA17
AC4
AC8
AC19
AC23
AD3
AD24
AE2
AE25
AF1
AF26
Notes:
1. See Table 4 for an explanation of the signals available on this pin.
48
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
FG676 Fine-Pitch BGA Package Specifications (1.00mm pitch)
Figure 3: FG676 Fine-Pitch BGA Package Specifications
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
49
Product Specification
1-800-255-7778
R
FF672 Flip-Chip Fine-Pitch BGA Package
FF672 Flip-Chip Fine-Pitch BGA Package
As shown in Table 8, XC2VP2, XC2VP4, and XC2VP7 Virtex-II Pro devices are available in the FF672 flip-chip fine-pitch
BGA package. Pins in each of these devices are the same, except for differences shown in the "No Connects" column.
Following this table are the FF672 Flip-Chip Fine-Pitch BGA Package Specifications (1.00mm pitch).
Table 8: FF672 — XC2VP2, XC2VP4, and XC2VP7
No Connects
Pin
Bank
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Pin Description
IO_L01N_0/VRP_0
IO_L01P_0/VRN_0
IO_L02N_0
Number
B24
A24
D21
C21
E20
D20
F19
E19
E18
D19
C19
B19
A19
G18
F18
D18
C18
G17
H16
F17
F16
E17
D17
G16
G15
E16
D16
F15
E15
D15
C15
H15
H14
XC2VP2
XC2VP4
XC2VP7
IO_L02P_0
IO_L03N_0
IO_L03P_0/VREF_0
IO_L05_0/No_Pair
IO_L06N_0
IO_L06P_0
IO_L07N_0
IO_L07P_0
IO_L08N_0
IO_L08P_0
IO_L09N_0
IO_L09P_0/VREF_0
IO_L37N_0
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
IO_L37P_0
IO_L38N_0
IO_L38P_0
IO_L39N_0
IO_L39P_0
IO_L43N_0
IO_L43P_0
IO_L44N_0
IO_L44P_0
IO_L45N_0
IO_L45P_0/VREF_0
IO_L67N_0
IO_L67P_0
IO_L68N_0
IO_L68P_0
IO_L69N_0
IO_L69P_0/VREF_0
50
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 8: FF672 — XC2VP2, XC2VP4, and XC2VP7
Pin
Bank
Pin Description
IO_L73N_0
Number
XC2VP2
XC2VP4
XC2VP7
0
0
0
0
0
0
G14
F14
E14
D14
C14
B14
IO_L73P_0
IO_L74N_0/GCLK7P
IO_L74P_0/GCLK6S
IO_L75N_0/GCLK5P
IO_L75P_0/GCLK4S
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
IO_L75N_1/GCLK3P
IO_L75P_1/GCLK2S
IO_L74N_1/GCLK1P
IO_L74P_1/GCLK0S
IO_L73N_1
B13
C13
D13
E13
F13
G13
H13
H12
C12
D12
E12
F12
D11
E11
G12
G11
D10
E10
F11
F10
H11
G10
C9
IO_L73P_1
IO_L69N_1/VREF_1
IO_L69P_1
IO_L68N_1
IO_L68P_1
IO_L67N_1
IO_L67P_1
IO_L45N_1/VREF_1
IO_L45P_1
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
IO_L44N_1
IO_L44P_1
IO_L43N_1
IO_L43P_1
IO_L39N_1
IO_L39P_1
IO_L38N_1
IO_L38P_1
IO_L37N_1
IO_L37P_1
D9
IO_L09N_1/VREF_1
IO_L09P_1
F9
G9
IO_L08N_1
A8
IO_L08P_1
B8
IO_L07N_1
C8
IO_L07P_1
D8
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
51
Product Specification
1-800-255-7778
R
FF672 Flip-Chip Fine-Pitch BGA Package
Table 8: FF672 — XC2VP2, XC2VP4, and XC2VP7
No Connects
XC2VP4
Pin
Number
Bank
Pin Description
IO_L06N_1
XC2VP2
XC2VP7
1
1
1
1
1
1
1
1
1
E9
E8
F8
D7
E7
C6
D6
A3
B3
IO_L06P_1
IO_L05_1/No_Pair
IO_L03N_1/VREF_1
IO_L03P_1
IO_L02N_1
IO_L02P_1
IO_L01N_1/VRP_1
IO_L01P_1/VRN_1
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
IO_L01N_2/VRP_2
IO_L01P_2/VRN_2
IO_L02N_2
C4
D3
A2
B1
C2
C1
D2
D1
E4
E3
E2
E1
F5
F4
F3
F2
G6
G5
G4
G3
F1
G1
H6
H5
H4
H3
H2
IO_L02P_2
IO_L03N_2
IO_L03P_2
IO_L04N_2/VREF_2
IO_L04P_2
IO_L05N_2
IO_L05P_2
IO_L06N_2
IO_L06P_2
IO_L40N_2/VREF_2
IO_L40P_2
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
IO_L42N_2
IO_L42P_2
IO_L43N_2
IO_L43P_2
IO_L44N_2
IO_L44P_2
IO_L45N_2
IO_L45P_2
IO_L46N_2/VREF_2
IO_L46P_2
IO_L47N_2
IO_L47P_2
IO_L48N_2
52
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 8: FF672 — XC2VP2, XC2VP4, and XC2VP7
Pin
Bank
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
Pin Description
IO_L48P_2
IO_L49N_2
IO_L49P_2
IO_L50N_2
IO_L50P_2
IO_L51N_2
IO_L51P_2
IO_L52N_2/VREF_2
IO_L52P_2
IO_L53N_2
IO_L53P_2
IO_L54N_2
IO_L54P_2
IO_L55N_2
IO_L55P_2
IO_L56N_2
IO_L56P_2
IO_L57N_2
IO_L57P_2
IO_L58N_2/VREF_2
IO_L58P_2
IO_L59N_2
IO_L59P_2
IO_L60N_2
IO_L60P_2
IO_L85N_2
IO_L85P_2
IO_L86N_2
IO_L86P_2
IO_L87N_2
IO_L87P_2
IO_L88N_2/VREF_2
IO_L88P_2
IO_L89N_2
IO_L89P_2
IO_L90N_2
IO_L90P_2
Number
XC2VP2
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
XC2VP4
XC2VP7
H1
J7
J6
J5
J4
J3
J2
K6
K5
K4
K3
J1
K1
K7
L8
L7
M7
L6
L5
L4
L3
L2
L1
M8
N8
M6
M5
M4
M3
M2
M1
N7
N6
N5
N4
N3
N2
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
53
Product Specification
1-800-255-7778
R
FF672 Flip-Chip Fine-Pitch BGA Package
Table 8: FF672 — XC2VP2, XC2VP4, and XC2VP7
No Connects
XC2VP4
Pin
Number
Bank
Pin Description
XC2VP2
XC2VP7
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
IO_L90N_3
IO_L90P_3
IO_L89N_3
IO_L89P_3
IO_L88N_3
IO_L88P_3
IO_L87N_3/VREF_3
IO_L87P_3
IO_L86N_3
IO_L86P_3
IO_L85N_3
IO_L85P_3
IO_L60N_3
IO_L60P_3
IO_L59N_3
IO_L59P_3
IO_L58N_3
IO_L58P_3
IO_L57N_3/VREF_3
IO_L57P_3
IO_L56N_3
IO_L56P_3
IO_L55N_3
IO_L55P_3
IO_L54N_3
IO_L54P_3
IO_L53N_3
IO_L53P_3
IO_L52N_3
IO_L52P_3
IO_L51N_3/VREF_3
IO_L51P_3
IO_L50N_3
IO_L50P_3
IO_L49N_3
IO_L49P_3
P2
P3
P4
P5
P6
P7
R1
R2
R3
R4
R5
R6
P8
R8
T1
T2
T3
T4
T5
T6
R7
T7
T8
U7
U1
V1
U3
U4
U5
U6
V2
V3
V4
V5
V6
V7
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
54
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 8: FF672 — XC2VP2, XC2VP4, and XC2VP7
Pin
Bank
3
Pin Description
IO_L48N_3
Number
XC2VP2
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
XC2VP4
XC2VP7
W1
W2
3
IO_L48P_3
3
IO_L47N_3
W3
3
IO_L47P_3
W4
3
IO_L46N_3
W5
3
IO_L46P_3
W6
3
IO_L45N_3/VREF_3
IO_L45P_3
Y1
3
AA1
Y3
3
IO_L44N_3
3
IO_L44P_3
Y4
3
IO_L43N_3
Y5
3
IO_L43P_3
Y6
3
IO_L42N_3
AA2
AA3
AA4
AA5
AB1
AB2
AB3
AB4
AC1
AC2
AD1
AD2
AE1
AF2
AC3
AD4
AE3
AF3
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
3
IO_L42P_3
3
IO_L41N_3
3
IO_L41P_3
3
IO_L39N_3/VREF_3
IO_L39P_3
3
3
IO_L06N_3
3
IO_L06P_3
3
IO_L05N_3
3
IO_L05P_3
3
IO_L04N_3
3
IO_L04P_3
3
IO_L03N_3/VREF_3
IO_L03P_3
3
3
IO_L02N_3
3
IO_L02P_3
3
IO_L01N_3/VRP_3
IO_L01P_3/VRN_3
3
4
4
4
4
4
4
IO_L01N_4/BUSY/DOUT(1)
IO_L01P_4/INIT_B
IO_L02N_4/D0/DIN(1)
IO_L02P_4/D1
AC6
AD6
AB7
AC7
AA7
AA8
IO_L03N_4/D2
IO_L03P_4/D3
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
55
Product Specification
1-800-255-7778
R
FF672 Flip-Chip Fine-Pitch BGA Package
Table 8: FF672 — XC2VP2, XC2VP4, and XC2VP7
No Connects
XC2VP4
Pin
Number
Bank
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
Pin Description
IO_L05_4/No_Pair
IO_L06N_4/VRP_4
IO_L06P_4/VRN_4
IO_L07N_4
XC2VP2
XC2VP7
Y8
AB8
AB9
AC8
AD8
AE8
IO_L07P_4/VREF_4
IO_L08N_4
IO_L08P_4
AF8
IO_L09N_4
Y9
IO_L09P_4/VREF_4
IO_L37N_4
AA9
AC9
AD9
Y10
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
IO_L37P_4
IO_L38N_4
IO_L38P_4
W11
AA10
AA11
AB10
AC10
Y11
IO_L39N_4
IO_L39P_4
IO_L43N_4
IO_L43P_4
IO_L44N_4
IO_L44P_4
Y12
IO_L45N_4
AB11
AC11
AA12
AB12
AC12
AD12
W12
W13
Y13
IO_L45P_4/VREF_4
IO_L67N_4
IO_L67P_4
IO_L68N_4
IO_L68P_4
IO_L69N_4
IO_L69P_4/VREF_4
IO_L73N_4
IO_L73P_4
AA13
AB13
AC13
AD13
AE13
IO_L74N_4/GCLK3S
IO_L74P_4/GCLK2P
IO_L75N_4/GCLK1S
IO_L75P_4/GCLK0P
5
5
5
IO_L75N_5/GCLK7S
IO_L75P_5/GCLK6P
IO_L74N_5/GCLK5S
AE14
AD14
AC14
56
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 8: FF672 — XC2VP2, XC2VP4, and XC2VP7
Pin
Bank
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
Pin Description
IO_L74P_5/GCLK4P
IO_L73N_5
Number
XC2VP2
XC2VP4
XC2VP7
AB14
AA14
Y14
IO_L73P_5
IO_L69N_5/VREF_5
IO_L69P_5
W14
W15
IO_L68N_5
AD15
AC15
AB15
AA15
AC16
AB16
Y15
IO_L68P_5
IO_L67N_5
IO_L67P_5
IO_L45N_5/VREF_5
IO_L45P_5
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
IO_L44N_5
IO_L44P_5
Y16
IO_L43N_5
AC17
AB17
AA16
AA17
W16
IO_L43P_5
IO_L39N_5
IO_L39P_5
IO_L38N_5
IO_L38P_5
Y17
IO_L37N_5
AD18
AC18
AA18
Y18
IO_L37P_5
IO_L09N_5/VREF_5
IO_L09P_5
IO_L08N_5
AF19
AE19
AD19
AC19
AB18
AB19
Y19
IO_L08P_5
IO_L07N_5/VREF_5
IO_L07P_5
IO_L06N_5/VRP_5
IO_L06P_5/VRN_5
IO_L05_5/No_Pair
IO_L03N_5/D4
IO_L03P_5/D5
IO_L02N_5/D6
IO_L02P_5/D7
IO_L01N_5/RDWR_B
IO_L01P_5/CS_B
AA19
AA20
AC20
AB20
AD21
AC21
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
57
Product Specification
1-800-255-7778
R
FF672 Flip-Chip Fine-Pitch BGA Package
Table 8: FF672 — XC2VP2, XC2VP4, and XC2VP7
No Connects
XC2VP4
Pin
Number
Bank
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Pin Description
IO_L01P_6/VRN_6
IO_L01N_6/VRP_6
IO_L02P_6
XC2VP2
XC2VP7
AF24
AE24
AD23
AC24
AE26
AF25
AD25
AD26
AC25
AC26
AB23
AB24
AB25
AB26
AA22
AA23
AA24
AA25
Y21
IO_L02N_6
IO_L03P_6
IO_L03N_6/VREF_6
IO_L04P_6
IO_L04N_6
IO_L05P_6
IO_L05N_6
IO_L06P_6
IO_L06N_6
IO_L39P_6
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
IO_L39N_6/VREF_6
IO_L41P_6
IO_L41N_6
IO_L42P_6
IO_L42N_6
IO_L43P_6
IO_L43N_6
Y22
IO_L44P_6
Y23
IO_L44N_6
Y24
IO_L45P_6
AA26
Y26
IO_L45N_6/VREF_6
IO_L46P_6
W21
W22
W23
W24
W25
W26
V20
IO_L46N_6
IO_L47P_6
IO_L47N_6
IO_L48P_6
IO_L48N_6
IO_L49P_6
IO_L49N_6
V21
IO_L50P_6
V22
IO_L50N_6
V23
IO_L51P_6
V24
IO_L51N_6/VREF_6
IO_L52P_6
V25
U21
58
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 8: FF672 — XC2VP2, XC2VP4, and XC2VP7
Pin
Bank
6
Pin Description
IO_L52N_6
IO_L53P_6
IO_L53N_6
IO_L54P_6
IO_L54N_6
IO_L55P_6
IO_L55N_6
IO_L56P_6
IO_L56N_6
IO_L57P_6
IO_L57N_6/VREF_6
IO_L58P_6
IO_L58N_6
IO_L59P_6
IO_L59N_6
IO_L60P_6
IO_L60N_6
IO_L85P_6
IO_L85N_6
IO_L86P_6
IO_L86N_6
IO_L87P_6
IO_L87N_6/VREF_6
IO_L88P_6
IO_L88N_6
IO_L89P_6
IO_L89N_6
IO_L90P_6
IO_L90N_6
Number
XC2VP2
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
XC2VP4
XC2VP7
U22
U23
U24
V26
U26
U20
T19
T20
R20
T21
T22
T23
T24
T25
T26
R19
P19
R21
R22
R23
R24
R25
R26
P20
P21
P22
P23
P24
P25
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
7
7
7
7
7
7
7
IO_L90P_7
IO_L90N_7
N25
N24
N23
N22
N21
N20
M26
IO_L89P_7
IO_L89N_7
IO_L88P_7
IO_L88N_7/VREF_7
IO_L87P_7
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
59
Product Specification
1-800-255-7778
R
FF672 Flip-Chip Fine-Pitch BGA Package
Table 8: FF672 — XC2VP2, XC2VP4, and XC2VP7
No Connects
XC2VP4
Pin
Number
Bank
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
Pin Description
IO_L87N_7
IO_L86P_7
IO_L86N_7
IO_L85P_7
IO_L85N_7
IO_L60P_7
IO_L60N_7
IO_L59P_7
IO_L59N_7
IO_L58P_7
IO_L58N_7/VREF_7
IO_L57P_7
IO_L57N_7
IO_L56P_7
IO_L56N_7
IO_L55P_7
IO_L55N_7
IO_L54P_7
IO_L54N_7
IO_L53P_7
IO_L53N_7
IO_L52P_7
IO_L52N_7/VREF_7
IO_L51P_7
IO_L51N_7
IO_L50P_7
IO_L50N_7
IO_L49P_7
IO_L49N_7
IO_L48P_7
IO_L48N_7
IO_L47P_7
IO_L47N_7
IO_L46P_7
IO_L46N_7/VREF_7
IO_L45P_7
IO_L45N_7
XC2VP2
XC2VP7
M25
M24
M23
M22
M21
N19
M19
L26
L25
L24
L23
L22
L21
M20
L20
L19
K20
K26
J26
K24
K23
K22
K21
J25
J24
J23
J22
J21
J20
H26
H25
H24
H23
H22
H21
G26
F26
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
60
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 8: FF672 — XC2VP2, XC2VP4, and XC2VP7
Pin
Bank
7
Pin Description
IO_L44P_7
Number
XC2VP2
NC
XC2VP4
XC2VP7
G24
G23
G22
G21
F25
F24
F23
F22
E26
E25
E24
E23
D26
D25
C26
C25
B26
A25
D24
C23
7
IO_L44N_7
NC
7
IO_L43P_7
NC
7
IO_L43N_7
NC
7
IO_L42P_7
NC
NC
NC
NC
NC
NC
NC
NC
NC
7
IO_L42N_7
NC
7
IO_L40P_7
NC
7
IO_L40N_7/VREF_7
IO_L06P_7
NC
7
7
IO_L06N_7
7
IO_L05P_7
7
IO_L05N_7
7
IO_L04P_7
7
IO_L04N_7/VREF_7
IO_L03P_7
7
7
IO_L03N_7
7
IO_L02P_7
7
IO_L02N_7
7
IO_L01P_7/VRN_7
IO_L01N_7/VRP_7
7
0
0
0
0
0
0
0
1
1
1
1
1
1
1
2
2
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_2
VCCO_2
C17
C20
H17
H18
J14
J15
J16
C7
H9
C10
H10
J11
J12
J13
G2
J8
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
61
Product Specification
1-800-255-7778
R
FF672 Flip-Chip Fine-Pitch BGA Package
Table 8: FF672 — XC2VP2, XC2VP4, and XC2VP7
No Connects
XC2VP4
Pin
Number
Bank
2
2
2
2
2
3
3
3
3
3
3
3
4
4
4
4
4
4
4
5
5
5
5
5
5
5
6
6
6
6
6
6
6
7
7
7
7
Pin Description
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_7
VCCO_7
VCCO_7
VCCO_7
XC2VP2
XC2VP7
K2
K8
L9
M9
N9
P9
R9
T9
U2
U8
V8
Y2
W9
AD7
V11
V12
V13
W10
AD10
V14
V15
V16
W17
W18
AD17
AD20
P18
R18
T18
U19
U25
V19
Y25
G25
J19
K19
K25
62
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 8: FF672 — XC2VP2, XC2VP4, and XC2VP7
Pin
Bank
Pin Description
VCCO_7
Number
XC2VP2
XC2VP4
XC2VP7
7
7
7
L18
M18
N18
VCCO_7
VCCO_7
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
CCLK
PROG_B
DONE
W7
D22
AB6
AC22
W20
AB21
G8
M0
M1
M2
TCK
TDI
H20
H7
TDO
TMS
F7
PWRDWN_B
HSWAP_EN
RSVD
AC5
E21
D5
VBATT
E6
DXP
F20
G19
B11
B12
A12
A11
C11
A10
A9
DXN
AVCCAUXTX7
VTTXPAD7
TXNPAD7
TXPPAD7
GNDA7
RXPPAD7
RXNPAD7
VTRXPAD7
AVCCAUXRX7
AVCCAUXTX9
VTTXPAD9
TXNPAD9
TXPPAD9
GNDA9
B10
B9
B6
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
B7
A7
A6
C5
RXPPAD9
RXNPAD9
VTRXPAD9
A5
A4
B5
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
63
Product Specification
1-800-255-7778
R
FF672 Flip-Chip Fine-Pitch BGA Package
Table 8: FF672 — XC2VP2, XC2VP4, and XC2VP7
No Connects
Pin
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
AVCCAUXRX9
AVCCAUXRX16
VTRXPAD16
RXNPAD16
RXPPAD16
GNDA16
Number
XC2VP2
NC
XC2VP4
NC
XC2VP7
B4
AE4
AE5
AF4
AF5
AD5
AF6
AF7
AE7
AE6
AE9
AE10
AF9
AF10
AD11
AF11
AF12
AE12
AE11
B22
B23
A23
A22
C22
A21
A20
B21
B20
B17
B18
A18
A17
C16
A16
A15
B16
B15
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
TXPPAD16
TXNPAD16
VTTXPAD16
AVCCAUXTX16
AVCCAUXRX18
VTRXPAD18
RXNPAD18
RXPPAD18
GNDA18
NC
NC
NC
NC
NC
NC
NC
NC
TXPPAD18
TXNPAD18
VTTXPAD18
AVCCAUXTX18
AVCCAUXTX4
VTTXPAD4
TXNPAD4
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
TXPPAD4
GNDA4
RXPPAD4
RXNPAD4
VTRXPAD4
AVCCAUXRX4
AVCCAUXTX6
VTTXPAD6
TXNPAD6
TXPPAD6
GNDA6
RXPPAD6
RXNPAD6
VTRXPAD6
AVCCAUXRX6
64
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 8: FF672 — XC2VP2, XC2VP4, and XC2VP7
Pin
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
AVCCAUXRX19
VTRXPAD19
RXNPAD19
RXPPAD19
GNDA19
Number
XC2VP2
XC2VP4
XC2VP7
AE15
AE16
AF15
AF16
AD16
AF17
AF18
AE18
AE17
AE20
AE21
AF20
AF21
AD22
AF22
AF23
AE23
AE22
TXPPAD19
TXNPAD19
VTTXPAD19
AVCCAUXTX19
AVCCAUXRX21
VTRXPAD21
RXNPAD21
RXPPAD21
GNDA21
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
TXPPAD21
TXNPAD21
VTTXPAD21
AVCCAUXTX21
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
H8
J9
K9
U9
V9
W8
H19
J10
J17
J18
K11
K16
K18
L10
L17
T10
T17
U11
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
65
Product Specification
1-800-255-7778
R
FF672 Flip-Chip Fine-Pitch BGA Package
Table 8: FF672 — XC2VP2, XC2VP4, and XC2VP7
No Connects
XC2VP4
Pin
Number
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
GND
XC2VP2
XC2VP7
U16
U18
V10
V17
V18
W19
B2
N1
P1
A13
A14
AE2
B25
N26
P26
AE25
AF13
AF14
C3
GND
D4
GND
E5
GND
F6
GND
G7
GND
Y7
GND
AA6
AB5
AC4
AD3
C24
D23
E22
F21
G20
K10
K12
K13
K14
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
66
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 8: FF672 — XC2VP2, XC2VP4, and XC2VP7
Pin
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Number
XC2VP2
XC2VP4
XC2VP7
K15
K17
L11
L12
L13
L14
L15
L16
M10
M11
M12
M13
M14
M15
M16
M17
N10
N11
N12
N13
N14
N15
N16
N17
P10
P11
P12
P13
P14
P15
P16
P17
R10
R11
R12
R13
R14
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
67
Product Specification
1-800-255-7778
R
FF672 Flip-Chip Fine-Pitch BGA Package
Table 8: FF672 — XC2VP2, XC2VP4, and XC2VP7
No Connects
XC2VP4
Pin
Number
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
GND
XC2VP2
XC2VP7
R15
R16
R17
T11
GND
GND
GND
GND
T12
GND
T13
GND
T14
GND
T15
GND
T16
GND
U10
U12
U13
U14
U15
U17
Y20
AA21
AB22
AC23
AD24
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Notes:
1. See Table 4 for an explanation of the signals available on this pin.
68
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
FF672 Flip-Chip Fine-Pitch BGA Package Specifications (1.00mm pitch)
Figure 4: FF672 Flip-Chip Fine-Pitch BGA Package Specifications
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
69
Product Specification
1-800-255-7778
R
FF896 Flip-Chip Fine-Pitch BGA Package
FF896 Flip-Chip Fine-Pitch BGA Package
As shown in Table 9, XC2VP7, XC2VP20, and XC2VP30 Virtex-II Pro devices are available in the FF896 flip-chip fine-pitch
BGA package. Pins in each of these devices are the same, except for differences shown in the "No Connects" column.
Following this table are the FF896 Flip-Chip Fine-Pitch BGA Package Specifications (1.00mm pitch).
Table 9: FF896 — XC2VP7, XC2VP20, and XC2VP30
No Connects
Bank
0
Pin Description
IO_L01N_0/VRP_0
IO_L01P_0/VRN_0
IO_L02N_0
Pin Number
E25
E24
F24
XC2VP7
XC2VP20
XC2VP30
0
0
0
IO_L02P_0
F23
0
IO_L03N_0
E23
E22
G23
H22
G22
F22
0
IO_L03P_0/VREF_0
IO_L05_0/No_Pair
IO_L06N_0
0
0
0
IO_L06P_0
0
IO_L07N_0
0
IO_L07P_0
F21
0
IO_L08N_0
D24
C24
H21
G21
E21
D21
D23
C23
H20
G20
E20
D20
B23
A23
H19
G19
E19
E18
C22
B22
F20
0
IO_L08P_0
0
IO_L09N_0
0
IO_L09P_0/VREF_0
IO_L37N_0
0
0
IO_L37P_0
0
IO_L38N_0
0
IO_L38P_0
0
IO_L39N_0
0
IO_L39P_0
0
IO_L43N_0
0
IO_L43P_0
0
IO_L44N_0
0
IO_L44P_0
0
IO_L45N_0
0
IO_L45P_0/VREF_0
IO_L46N_0
0
NC
NC
NC
NC
NC
NC
0
IO_L46P_0
0
IO_L47N_0
0
IO_L47P_0
0
IO_L48N_0
0
IO_L48P_0
F19
70
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 9: FF896 — XC2VP7, XC2VP20, and XC2VP30
Bank
0
Pin Description
IO_L49N_0
Pin Number
G17
F17
XC2VP7
NC
XC2VP20
XC2VP30
0
IO_L49P_0
NC
0
IO_L50_0/No_Pair
IO_L53_0/No_Pair
IO_L54N_0
B21
NC
0
A21
NC
0
H18
G18
C21
C20
J17
NC
0
IO_L54P_0
NC
0
IO_L56N_0
NC
0
IO_L56P_0
NC
0
IO_L57N_0
NC
0
IO_L57P_0/VREF_0
IO_L67N_0
H17
E17
NC
0
0
IO_L67P_0
D17
D18
C18
J16
0
IO_L68N_0
0
IO_L68P_0
0
IO_L69N_0
0
IO_L69P_0/VREF_0
IO_L73N_0
H16
E16
0
0
IO_L73P_0
D16
C16
B16
0
IO_L74N_0/GCLK7P
IO_L74P_0/GCLK6S
IO_L75N_0/GCLK5P
IO_L75P_0/GCLK4S
0
0
G16
F16
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
IO_L75N_1/GCLK3P
IO_L75P_1/GCLK2S
IO_L74N_1/GCLK1P
IO_L74P_1/GCLK0S
IO_L73N_1
F15
G15
B15
C15
D15
E15
H15
J15
IO_L73P_1
IO_L69N_1/VREF_1
IO_L69P_1
IO_L68N_1
C13
D13
D14
E14
H14
J14
IO_L68P_1
IO_L67N_1
IO_L67P_1
IO_L57N_1/VREF_1
IO_L57P_1
NC
NC
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
71
R
FF896 Flip-Chip Fine-Pitch BGA Package
Table 9: FF896 — XC2VP7, XC2VP20, and XC2VP30
No Connects
XC2VP20
Bank
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Pin Description
IO_L56N_1
Pin Number
C11
C10
G13
H13
A10
B10
F14
G14
F12
F11
B9
XC2VP7
NC
XC2VP30
IO_L56P_1
NC
IO_L54N_1
NC
IO_L54P_1
NC
IO_L53_1/No_Pair
IO_L50_1/No_Pair
IO_L49N_1
NC
NC
NC
IO_L49P_1
NC
IO_L48N_1
NC
IO_L48P_1
NC
IO_L47N_1
NC
IO_L47P_1
C9
NC
IO_L46N_1
E13
E12
G12
H12
A8
NC
IO_L46P_1
NC
IO_L45N_1/VREF_1
IO_L45P_1
IO_L44N_1
IO_L44P_1
B8
IO_L43N_1
D11
E11
G11
H11
C8
IO_L43P_1
IO_L39N_1
IO_L39P_1
IO_L38N_1
IO_L38P_1
D8
IO_L37N_1
D10
E10
G10
H10
C7
IO_L37P_1
IO_L09N_1/VREF_1
IO_L09P_1
IO_L08N_1
IO_L08P_1
D7
IO_L07N_1
F10
F9
IO_L07P_1
IO_L06N_1
G9
IO_L06P_1
H9
IO_L05_1/No_Pair
IO_L03N_1/VREF_1
IO_L03P_1
G8
E9
E8
72
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 9: FF896 — XC2VP7, XC2VP20, and XC2VP30
Bank
Pin Description
IO_L02N_1
Pin Number
XC2VP7
XC2VP20
XC2VP30
1
1
1
1
F8
F7
E7
E6
IO_L02P_1
IO_L01N_1/VRP_1
IO_L01P_1/VRN_1
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
IO_L01N_2/VRP_2
IO_L01P_2/VRN_2
IO_L02N_2
A3
B3
G6
G5
C5
D5
C2
C1
J8
IO_L02P_2
IO_L03N_2
IO_L03P_2
IO_L04N_2/VREF_2
IO_L04P_2
IO_L05N_2
IO_L05P_2
J7
IO_L06N_2
C4
D3
D2
D1
H6
H5
E4
E3
E2
E1
K8
K7
F4
F3
F2
F1
J6
IO_L06P_2
IO_L31N_2
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
IO_L31P_2
IO_L32N_2
IO_L32P_2
IO_L33N_2
IO_L33P_2
IO_L34N_2/VREF_2
IO_L34P_2
IO_L35N_2
IO_L35P_2
IO_L36N_2
IO_L36P_2
IO_L37N_2
IO_L37P_2
IO_L38N_2
IO_L38P_2
J5
IO_L39N_2
G4
G3
G2
G1
IO_L39P_2
IO_L40N_2/VREF_2
IO_L40P_2
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
73
R
FF896 Flip-Chip Fine-Pitch BGA Package
Table 9: FF896 — XC2VP7, XC2VP20, and XC2VP30
No Connects
XC2VP20
Bank
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
Pin Description
IO_L41N_2
IO_L41P_2
IO_L42N_2
IO_L42P_2
IO_L43N_2
IO_L43P_2
IO_L44N_2
IO_L44P_2
IO_L45N_2
IO_L45P_2
IO_L46N_2/VREF_2
IO_L46P_2
IO_L47N_2
IO_L47P_2
IO_L48N_2
IO_L48P_2
IO_L49N_2
IO_L49P_2
IO_L50N_2
IO_L50P_2
IO_L51N_2
IO_L51P_2
IO_L52N_2/VREF_2
IO_L52P_2
IO_L53N_2
IO_L53P_2
IO_L54N_2
IO_L54P_2
IO_L55N_2
IO_L55P_2
IO_L56N_2
IO_L56P_2
IO_L57N_2
IO_L57P_2
IO_L58N_2/VREF_2
IO_L58P_2
IO_L59N_2
Pin Number
L8
XC2VP7
NC
XC2VP30
L7
NC
H4
H3
H2
J2
NC
NC
M8
M7
K6
K5
J1
K1
M6
M5
J4
J3
K2
L2
N8
N7
K4
K3
L1
M1
N6
N5
L5
L4
M2
N2
P9
R9
M4
M3
N1
P1
P8
74
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 9: FF896 — XC2VP7, XC2VP20, and XC2VP30
Bank
Pin Description
IO_L59P_2
IO_L60N_2
IO_L60P_2
IO_L85N_2
IO_L85P_2
IO_L86N_2
IO_L86P_2
IO_L87N_2
IO_L87P_2
IO_L88N_2/VREF_2
IO_L88P_2
IO_L89N_2
IO_L89P_2
IO_L90N_2
IO_L90P_2
Pin Number
XC2VP7
XC2VP20
XC2VP30
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
P7
N4
N3
P3
P2
R8
R7
P5
P4
R2
T2
R6
R5
R4
R3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
IO_L90N_3
IO_L90P_3
U1
V1
T5
T6
T3
T4
U2
U3
T7
T8
U4
U5
V2
W2
T9
U9
V3
V4
W1
Y1
U7
IO_L89N_3
IO_L89P_3
IO_L88N_3
IO_L88P_3
IO_L87N_3/VREF_3
IO_L87P_3
IO_L86N_3
IO_L86P_3
IO_L85N_3
IO_L85P_3
IO_L60N_3
IO_L60P_3
IO_L59N_3
IO_L59P_3
IO_L58N_3
IO_L58P_3
IO_L57N_3/VREF_3
IO_L57P_3
IO_L56N_3
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
75
R
FF896 Flip-Chip Fine-Pitch BGA Package
Table 9: FF896 — XC2VP7, XC2VP20, and XC2VP30
No Connects
XC2VP20
Bank
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
Pin Description
IO_L56P_3
IO_L55N_3
IO_L55P_3
IO_L54N_3
IO_L54P_3
IO_L53N_3
IO_L53P_3
IO_L52N_3
IO_L52P_3
IO_L51N_3/VREF_3
IO_L51P_3
IO_L50N_3
IO_L50P_3
IO_L49N_3
IO_L49P_3
IO_L48N_3
IO_L48P_3
IO_L47N_3
IO_L47P_3
IO_L46N_3
IO_L46P_3
IO_L45N_3/VREF_3
IO_L45P_3
IO_L44N_3
IO_L44P_3
IO_L43N_3
IO_L43P_3
IO_L42N_3
IO_L42P_3
IO_L41N_3
IO_L41P_3
IO_L40N_3
IO_L40P_3
IO_L39N_3/VREF_3
IO_L39P_3
IO_L38N_3
IO_L38P_3
Pin Number
U8
XC2VP7
XC2VP30
V5
V6
Y2
AA2
V7
V8
W3
W4
AA1
AB1
W5
W6
Y4
Y5
AA3
AA4
W7
W8
AB3
AB4
AB2
AC2
AA5
AA6
AC3
AC4
AD1
AD2
Y7
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
Y8
AB5
AB6
AE1
AE2
AA7
AA8
76
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 9: FF896 — XC2VP7, XC2VP20, and XC2VP30
Bank
3
Pin Description
IO_L37N_3
Pin Number
AD3
AD4
AF1
XC2VP7
NC
XC2VP20
XC2VP30
3
IO_L37P_3
NC
3
IO_L36N_3
NC
3
IO_L36P_3
AF2
NC
3
IO_L35N_3
AC5
AC6
AF3
NC
3
IO_L35P_3
NC
3
IO_L34N_3
NC
3
IO_L34P_3
AF4
NC
3
IO_L33N_3/VREF_3
IO_L33P_3
AE3
AE4
AB7
AB8
AE5
AF6
NC
3
NC
3
IO_L32N_3
NC
3
IO_L32P_3
NC
3
IO_L31N_3
NC
3
IO_L31P_3
NC
3
IO_L06N_3
AG1
AG2
AD5
AD6
AG3
AH4
AH1
AH2
AG5
AH5
AJ3
3
IO_L06P_3
3
IO_L05N_3
3
IO_L05P_3
3
IO_L04N_3
3
IO_L04P_3
3
IO_L03N_3/VREF_3
IO_L03P_3
3
3
IO_L02N_3
3
IO_L02P_3
3
IO_L01N_3/VRP_3
IO_L01P_3/VRN_3
3
AK3
4
4
4
4
4
4
4
4
4
4
IO_L01N_4/BUSY/DOUT(1)
IO_L01P_4/INIT_B
IO_L02N_4/D0/DIN(1)
IO_L02P_4/D1
AG6
AF7
AC9
AD9
AG7
AH7
AD8
AG8
AH8
AC10
IO_L03N_4/D2
IO_L03P_4/D3
IO_L05_4/No_Pair
IO_L06N_4/VRP_4
IO_L06P_4/VRN_4
IO_L07N_4
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
77
R
FF896 Flip-Chip Fine-Pitch BGA Package
Table 9: FF896 — XC2VP7, XC2VP20, and XC2VP30
No Connects
XC2VP20
Bank
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
Pin Description
IO_L07P_4/VREF_4
IO_L08N_4
Pin Number
AD10
AE7
XC2VP7
XC2VP30
IO_L08P_4
AE8
IO_L09N_4
AJ8
IO_L09P_4/VREF_4
IO_L37N_4
AK8
AC11
AD11
AF8
IO_L37P_4
IO_L38N_4
IO_L38P_4
AF9
IO_L39N_4
AF10
AG10
AC12
AD12
AE9
IO_L39P_4
IO_L43N_4
IO_L43P_4
IO_L44N_4
IO_L44P_4
AE10
AH9
IO_L45N_4
IO_L45P_4/VREF_4
IO_L46N_4
AJ9
AC13
AD13
AE11
AE12
AH10
AH11
AB14
AC14
AF11
AG11
AJ10
AK10
AF12
AF13
AG13
AH13
AB15
AC15
AD14
AE14
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
IO_L46P_4
IO_L47N_4
IO_L47P_4
IO_L48N_4
IO_L48P_4
IO_L49N_4
IO_L49P_4
IO_L50_4/No_Pair
IO_L53_4/No_Pair
IO_L54N_4
IO_L54P_4
IO_L56N_4
IO_L56P_4
IO_L57N_4
IO_L57P_4/VREF_4
IO_L67N_4
IO_L67P_4
IO_L68N_4
IO_L68P_4
78
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 9: FF896 — XC2VP7, XC2VP20, and XC2VP30
Bank
Pin Description
IO_L69N_4
Pin Number
AF14
XC2VP7
XC2VP20
XC2VP30
4
4
4
4
4
4
4
4
IO_L69P_4/VREF_4
IO_L73N_4
AG14
AD15
IO_L73P_4
AE15
IO_L74N_4/GCLK3S
IO_L74P_4/GCLK2P
IO_L75N_4/GCLK1S
IO_L75P_4/GCLK0P
AF15
AG15
AH15
AJ15
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
IO_L75N_5/GCLK7S
IO_L75P_5/GCLK6P
IO_L74N_5/GCLK5S
IO_L74P_5/GCLK4P
IO_L73N_5
AJ16
AH16
AG16
AF16
AE16
AD16
AG17
AF17
AE17
AD17
AC16
AB16
AH18
AG18
AF18
AF19
AK21
AJ21
AG20
AF20
AC17
AB17
AH20
AH21
AE19
AE20
AD18
AC18
IO_L73P_5
IO_L69N_5/VREF_5
IO_L69P_5
IO_L68N_5
IO_L68P_5
IO_L67N_5
IO_L67P_5
IO_L57N_5/VREF_5
IO_L57P_5
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
IO_L56N_5
IO_L56P_5
IO_L54N_5
IO_L54P_5
IO_L53_5/No_Pair
IO_L50_5/No_Pair
IO_L49N_5
IO_L49P_5
IO_L48N_5
IO_L48P_5
IO_L47N_5
IO_L47P_5
IO_L46N_5
IO_L46P_5
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
79
R
FF896 Flip-Chip Fine-Pitch BGA Package
Table 9: FF896 — XC2VP7, XC2VP20, and XC2VP30
No Connects
XC2VP20
Bank
5
Pin Description
IO_L45N_5/VREF_5
IO_L45P_5
Pin Number
AJ22
XC2VP7
XC2VP30
5
AH22
AE21
AE22
AD19
AC19
AG21
AF21
5
IO_L44N_5
5
IO_L44P_5
5
IO_L43N_5
5
IO_L43P_5
5
IO_L39N_5
5
IO_L39P_5
5
IO_L38N_5
AF22
5
IO_L38P_5
AF23
5
IO_L37N_5
AD20
AC20
AK23
AJ23
5
IO_L37P_5
5
IO_L09N_5/VREF_5
IO_L09P_5
5
5
IO_L08N_5
AE23
AE24
AD21
AC21
AH23
AG23
AD23
AH24
AG24
AD22
AC22
AF24
5
IO_L08P_5
5
IO_L07N_5/VREF_5
IO_L07P_5
5
5
IO_L06N_5/VRP_5
IO_L06P_5/VRN_5
IO_L05_5/No_Pair
IO_L03N_5/D4
IO_L03P_5/D5
IO_L02N_5/D6
IO_L02P_5/D7
IO_L01N_5/RDWR_B
IO_L01P_5/CS_B
5
5
5
5
5
5
5
5
AG25
6
6
6
6
6
6
6
6
6
IO_L01P_6/VRN_6
IO_L01N_6/VRP_6
IO_L02P_6
AK28
AJ28
AH26
AG26
AH29
AH30
AH27
AG28
AD25
IO_L02N_6
IO_L03P_6
IO_L03N_6/VREF_6
IO_L04P_6
IO_L04N_6
IO_L05P_6
80
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 9: FF896 — XC2VP7, XC2VP20, and XC2VP30
Bank
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Pin Description
IO_L05N_6
IO_L06P_6
IO_L06N_6
IO_L31P_6
IO_L31N_6
IO_L32P_6
IO_L32N_6
IO_L33P_6
IO_L33N_6/VREF_6
IO_L34P_6
IO_L34N_6
IO_L35P_6
IO_L35N_6
IO_L36P_6
IO_L36N_6
IO_L37P_6
IO_L37N_6
IO_L38P_6
IO_L38N_6
IO_L39P_6
IO_L39N_6/VREF_6
IO_L40P_6
IO_L40N_6
IO_L41P_6
IO_L41N_6
IO_L42P_6
IO_L42N_6
IO_L43P_6
IO_L43N_6
IO_L44P_6
IO_L44N_6
IO_L45P_6
IO_L45N_6/VREF_6
IO_L46P_6
IO_L46N_6
IO_L47P_6
IO_L47N_6
Pin Number
AD26
AG29
AG30
AF25
AE26
AB23
AB24
AE27
AE28
AF27
AF28
AC25
AC26
AF29
AF30
AD27
AD28
AA23
AA24
AE29
AE30
AB25
AB26
Y23
XC2VP7
XC2VP20
XC2VP30
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
Y24
AD29
AD30
AC27
AC28
AA25
AA26
AC29
AB29
AB27
AB28
W23
W24
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
81
R
FF896 Flip-Chip Fine-Pitch BGA Package
Table 9: FF896 — XC2VP7, XC2VP20, and XC2VP30
No Connects
XC2VP20
Bank
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Pin Description
IO_L48P_6
IO_L48N_6
IO_L49P_6
IO_L49N_6
IO_L50P_6
IO_L50N_6
IO_L51P_6
IO_L51N_6/VREF_6
IO_L52P_6
IO_L52N_6
IO_L53P_6
IO_L53N_6
IO_L54P_6
IO_L54N_6
IO_L55P_6
IO_L55N_6
IO_L56P_6
IO_L56N_6
IO_L57P_6
IO_L57N_6/VREF_6
IO_L58P_6
IO_L58N_6
IO_L59P_6
IO_L59N_6
IO_L60P_6
IO_L60N_6
IO_L85P_6
IO_L85N_6
IO_L86P_6
IO_L86N_6
IO_L87P_6
IO_L87N_6/VREF_6
IO_L88P_6
IO_L88N_6
IO_L89P_6
IO_L89N_6
IO_L90P_6
Pin Number
AA27
AA28
Y26
XC2VP7
XC2VP30
Y27
W25
W26
AB30
AA30
W27
W28
V23
V24
AA29
Y29
V25
V26
U23
U24
Y30
W30
V27
V28
U22
T22
W29
V29
U26
U27
T23
T24
U28
U29
T27
T28
T25
T26
V30
82
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 9: FF896 — XC2VP7, XC2VP20, and XC2VP30
Bank
Pin Description
Pin Number
XC2VP7
XC2VP20
XC2VP30
6
IO_L90N_6
U30
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
IO_L90P_7
IO_L90N_7
IO_L89P_7
IO_L89N_7
IO_L88P_7
IO_L88N_7/VREF_7
IO_L87P_7
IO_L87N_7
IO_L86P_7
IO_L86N_7
IO_L85P_7
IO_L85N_7
IO_L60P_7
IO_L60N_7
IO_L59P_7
IO_L59N_7
IO_L58P_7
IO_L58N_7/VREF_7
IO_L57P_7
IO_L57N_7
IO_L56P_7
IO_L56N_7
IO_L55P_7
IO_L55N_7
IO_L54P_7
IO_L54N_7
IO_L53P_7
IO_L53N_7
IO_L52P_7
IO_L52N_7/VREF_7
IO_L51P_7
IO_L51N_7
IO_L50P_7
IO_L50N_7
IO_L49P_7
R28
R27
R26
R25
T29
R29
P27
P26
R24
R23
P29
P28
N28
N27
P24
P23
P30
N30
M28
M27
R22
P22
N29
M29
L27
L26
N26
N25
M30
L30
K28
K27
N24
N23
L29
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
83
R
FF896 Flip-Chip Fine-Pitch BGA Package
Table 9: FF896 — XC2VP7, XC2VP20, and XC2VP30
No Connects
XC2VP20
Bank
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
Pin Description
IO_L49N_7
IO_L48P_7
IO_L48N_7
IO_L47P_7
IO_L47N_7
IO_L46P_7
IO_L46N_7/VREF_7
IO_L45P_7
IO_L45N_7
IO_L44P_7
IO_L44N_7
IO_L43P_7
IO_L43N_7
IO_L42P_7
IO_L42N_7
IO_L41P_7
IO_L41N_7
IO_L40P_7
IO_L40N_7/VREF_7
IO_L39P_7
IO_L39N_7
IO_L38P_7
IO_L38N_7
IO_L37P_7
IO_L37N_7
IO_L36P_7
IO_L36N_7
IO_L35P_7
IO_L35N_7
IO_L34P_7
IO_L34N_7/VREF_7
IO_L33P_7
IO_L33N_7
IO_L32P_7
IO_L32N_7
IO_L31P_7
IO_L31N_7
Pin Number
K29
J28
XC2VP7
XC2VP30
J27
M26
M25
K30
J30
K26
K25
M24
M23
J29
H29
H28
H27
L24
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
L23
G30
G29
G28
G27
J26
J25
F30
F29
F28
F27
K24
K23
E30
E29
E28
E27
H26
H25
D30
D29
84
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 9: FF896 — XC2VP7, XC2VP20, and XC2VP30
Bank
Pin Description
IO_L06P_7
Pin Number
D28
XC2VP7
XC2VP20
XC2VP30
7
7
7
7
7
7
7
7
7
7
7
7
IO_L06N_7
C27
IO_L05P_7
J24
IO_L05N_7
J23
IO_L04P_7
C30
IO_L04N_7/VREF_7
IO_L03P_7
C29
D26
IO_L03N_7
C26
IO_L02P_7
G26
IO_L02N_7
G25
IO_L01P_7/VRN_7
IO_L01N_7/VRP_7
B28
A28
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
2
2
2
2
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_2
VCCO_2
VCCO_2
VCCO_2
K21
K20
K19
K18
K17
K16
J21
J20
J19
J18
K15
K14
K13
K12
K11
K10
J13
J12
J11
J10
R10
P10
N10
N9
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
85
R
FF896 Flip-Chip Fine-Pitch BGA Package
Table 9: FF896 — XC2VP7, XC2VP20, and XC2VP30
No Connects
XC2VP20
Bank
2
2
2
2
2
2
3
3
3
3
3
3
3
3
3
3
4
4
4
4
4
4
4
4
4
4
5
5
5
5
5
5
5
5
5
5
6
Pin Description
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_6
Pin Number
M10
XC2VP7
XC2VP30
M9
L10
L9
K9
J9
AB9
AA9
Y10
Y9
W10
W9
V10
V9
U10
T10
AB13
AB12
AB11
AB10
AA15
AA14
AA13
AA12
AA11
AA10
AB21
AB20
AB19
AB18
AA21
AA20
AA19
AA18
AA17
AA16
AB22
86
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 9: FF896 — XC2VP7, XC2VP20, and XC2VP30
Bank
6
Pin Description
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
Pin Number
AA22
Y22
XC2VP7
XC2VP20
XC2VP30
6
6
Y21
6
W22
W21
V22
6
6
6
V21
6
U21
6
T21
7
R21
7
P21
7
N22
7
N21
7
M22
M21
L22
7
7
7
L21
7
K22
7
J22
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
CCLK
PROG_B
DONE
M0
AC7
G24
AC8
AD24
AC24
AC23
G7
M1
M2
TCK
TDI
F26
F5
TDO
TMS
H8
PWRDWN_B
HSWAP_EN
RSVD
VBATT
DXP
AD7
H23
D6
H7
H24
D25
B26
DXN
AVCCAUXTX4
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
87
R
FF896 Flip-Chip Fine-Pitch BGA Package
Table 9: FF896 — XC2VP7, XC2VP20, and XC2VP30
No Connects
XC2VP20
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
VTTXPAD4
TXNPAD4
Pin Number
B27
A27
A26
C25
A25
A24
B25
B24
B19
B20
A20
A19
C19
A18
A17
B18
B17
B13
B14
A14
A13
C12
A12
A11
B12
B11
B6
XC2VP7
XC2VP30
TXPPAD4
GNDA4
RXPPAD4
RXNPAD4
VTRXPAD4
AVCCAUXRX4
AVCCAUXTX6
VTTXPAD6
TXNPAD6
TXPPAD6
GNDA6
RXPPAD6
RXNPAD6
VTRXPAD6
AVCCAUXRX6
AVCCAUXTX7
VTTXPAD7
TXNPAD7
TXPPAD7
GNDA7
RXPPAD7
RXNPAD7
VTRXPAD7
AVCCAUXRX7
AVCCAUXTX9
VTTXPAD9
TXNPAD9
B7
A7
TXPPAD9
A6
GNDA9
C6
RXPPAD9
A5
RXNPAD9
VTRXPAD9
AVCCAUXRX9
AVCCAUXRX16
VTRXPAD16
A4
B5
B4
AJ4
AJ5
88
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 9: FF896 — XC2VP7, XC2VP20, and XC2VP30
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
RXNPAD16
RXPPAD16
GNDA16
Pin Number
AK4
XC2VP7
XC2VP20
XC2VP30
AK5
AH6
TXPPAD16
TXNPAD16
VTTXPAD16
AVCCAUXTX16
AVCCAUXRX18
VTRXPAD18
RXNPAD18
RXPPAD18
GNDA18
AK6
AK7
AJ7
AJ6
AJ11
AJ12
AK11
AK12
AH12
AK13
AK14
AJ14
AJ13
AJ17
AJ18
AK17
AK18
AH19
AK19
AK20
AJ20
AJ19
AJ24
AJ25
AK24
AK25
AH25
AK26
AK27
AJ27
AJ26
TXPPAD18
TXNPAD18
VTTXPAD18
AVCCAUXTX18
AVCCAUXRX19
VTRXPAD19
RXNPAD19
RXPPAD19
GNDA19
TXPPAD19
TXNPAD19
VTTXPAD19
AVCCAUXTX19
AVCCAUXRX21
VTRXPAD21
RXNPAD21
RXPPAD21
GNDA21
TXPPAD21
TXNPAD21
VTTXPAD21
AVCCAUXTX21
N/A
N/A
VCCAUX
VCCAUX
AK29
AK16
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
89
R
FF896 Flip-Chip Fine-Pitch BGA Package
Table 9: FF896 — XC2VP7, XC2VP20, and XC2VP30
No Connects
XC2VP20
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
Pin Number
AK15
AK2
AJ30
AJ1
T30
T1
XC2VP7
XC2VP30
R30
R1
B30
B1
A29
A16
A15
A2
Y19
Y18
Y17
Y16
Y15
Y14
Y13
Y12
W20
W11
V20
V11
U20
U11
T20
T11
R20
R11
P20
P11
N20
N11
M20
90
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 9: FF896 — XC2VP7, XC2VP20, and XC2VP30
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
GND
Pin Number
M11
XC2VP7
XC2VP20
XC2VP30
L19
L18
L17
L16
L15
L14
L13
L12
AK22
AK9
GND
GND
AJ29
AJ2
GND
GND
AH28
AH17
AH14
AH3
AG27
AG22
AG19
AG12
AG9
AG4
AF26
AF5
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
AE25
AE18
AE13
AE6
GND
GND
GND
GND
AC30
AC1
Y28
GND
GND
GND
Y25
GND
Y20
GND
Y11
GND
Y6
GND
Y3
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
91
R
FF896 Flip-Chip Fine-Pitch BGA Package
Table 9: FF896 — XC2VP7, XC2VP20, and XC2VP30
No Connects
XC2VP20
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Pin Number
W19
W18
W17
W16
W15
W14
W13
W12
V19
V18
V17
V16
V15
V14
V13
V12
U25
U19
U18
U17
U16
U15
U14
U13
U12
U6
XC2VP7
XC2VP30
T19
T18
T17
T16
T15
T14
T13
T12
R19
R18
R17
92
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 9: FF896 — XC2VP7, XC2VP20, and XC2VP30
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Pin Number
R16
R15
R14
R13
R12
P25
P19
P18
P17
P16
P15
P14
P13
P12
P6
XC2VP7
XC2VP20
XC2VP30
N19
N18
N17
N16
N15
N14
N13
N12
M19
M18
M17
M16
M15
M14
M13
M12
L28
L25
L20
L11
L6
L3
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
93
R
FF896 Flip-Chip Fine-Pitch BGA Package
Table 9: FF896 — XC2VP7, XC2VP20, and XC2VP30
No Connects
XC2VP20
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
GND
Pin Number
H30
H1
XC2VP7
XC2VP30
GND
GND
F25
F18
F13
F6
GND
GND
GND
GND
E26
E5
GND
GND
D27
D22
D19
D12
D9
GND
GND
GND
GND
GND
D4
GND
C28
C17
C14
C3
GND
GND
GND
GND
B29
B2
GND
GND
A22
A9
GND
Notes:
1. See Table 4 for an explanation of the signals available on this pin.
94
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
FF896 Flip-Chip Fine-Pitch BGA Package Specifications (1.00mm pitch)
Figure 5: FF896 Flip-Chip Fine-Pitch BGA Package Specifications
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
95
Product Specification
1-800-255-7778
R
FF1152 Flip-Chip Fine-Pitch BGA Package
FF1152 Flip-Chip Fine-Pitch BGA Package
As shown in Table 10, XC2VP20, XC2VP30, XC2VP40, and XC2VP50 Virtex-II Pro devices are available in the FF1152
flip-chip fine-pitch BGA package. Pins in each of these devices are the same, except for the differences shown in the No
Connect column. Following this table are the FF1152 Flip-Chip Fine-Pitch BGA Package Specifications (1.00mm pitch).
Table 10: FF1152 — XC2VP20, XC2VP30, XC2VP40, and XC2VP50
No Connects
Pin
Bank
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Pin Description
IO_L01N_0/VRP_0
IO_L01P_0/VRN_0
IO_L02N_0
Number
E29
E28
H26
G26
H25
G25
J25
XC2VP20
XC2VP30
XC2VP40
XC2VP50
IO_L02P_0
IO_L03N_0
IO_L03P_0/VREF_0
IO_L05_0/No_Pair
IO_L06N_0
K24
J24
IO_L06P_0
IO_L07N_0
F26
E26
D30
D29
K23
J23
IO_L07P_0
IO_L08N_0
IO_L08P_0
IO_L09N_0
IO_L09P_0/VREF_0
IO_L19N_0
F24
E24
D28
C28
H24
G24
G23
F23
E27
D27
K22
J22
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
IO_L19P_0
IO_L20N_0
IO_L20P_0
IO_L21N_0
IO_L21P_0
IO_L25N_0
IO_L25P_0
IO_L26N_0
IO_L26P_0
IO_L27N_0
IO_L27P_0/VREF_0
IO_L37N_0
H22
G22
D26
C26
K21
J21
IO_L37P_0
IO_L38N_0
IO_L38P_0
IO_L39N_0
IO_L39P_0
IO_L43N_0
F22
96
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
Table 10: FF1152 — XC2VP20, XC2VP30, XC2VP40, and XC2VP50
No Connects
XC2VP30 XC2VP40
Pin
Bank
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Pin Description
IO_L43P_0
Number
E22
E25
D25
H21
G21
D22
D23
D24
C24
K20
J20
XC2VP20
XC2VP50
IO_L44N_0
IO_L44P_0
IO_L45N_0
IO_L45P_0/VREF_0
IO_L46N_0
IO_L46P_0
IO_L47N_0
IO_L47P_0
IO_L48N_0
IO_L48P_0
IO_L49N_0
F21
E21
C21
C22
L19
IO_L49P_0
IO_L50_0/No_Pair
IO_L53_0/No_Pair
IO_L54N_0
IO_L54P_0
K19
G20
F20
D21
D20
J19
IO_L55N_0
IO_L55P_0
IO_L56N_0
IO_L56P_0
IO_L57N_0
IO_L57P_0/VREF_0
IO_L67N_0
H19
G19
F19
E19
D19
L18
IO_L67P_0
IO_L68N_0
IO_L68P_0
IO_L69N_0
IO_L69P_0/VREF_0
IO_L73N_0
K18
G18
F18
E18
D18
J18
IO_L73P_0
IO_L74N_0/GCLK7P
IO_L74P_0/GCLK6S
IO_L75N_0/GCLK5P
IO_L75P_0/GCLK4S
H18
1
1
IO_L75N_1/GCLK3P
IO_L75P_1/GCLK2S
H17
J17
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
97
Product Specification
1-800-255-7778
R
FF1152 Flip-Chip Fine-Pitch BGA Package
Table 10: FF1152 — XC2VP20, XC2VP30, XC2VP40, and XC2VP50
No Connects
XC2VP30 XC2VP40
Pin
Bank
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Pin Description
IO_L74N_1/GCLK1P
IO_L74P_1/GCLK0S
IO_L73N_1
Number
D17
E17
F17
G17
K17
L17
D16
E16
F16
G16
H16
J16
XC2VP20
XC2VP50
IO_L73P_1
IO_L69N_1/VREF_1
IO_L69P_1
IO_L68N_1
IO_L68P_1
IO_L67N_1
IO_L67P_1
IO_L57N_1/VREF_1
IO_L57P_1
IO_L56N_1
D15
D14
F15
G15
K16
L16
C13
C14
E14
F14
J15
IO_L56P_1
IO_L55N_1
IO_L55P_1
IO_L54N_1
IO_L54P_1
IO_L53_1/No_Pair
IO_L50_1/No_Pair
IO_L49N_1
IO_L49P_1
IO_L48N_1
IO_L48P_1
K15
C11
D11
D12
D13
G14
H14
D10
E10
E13
F13
J14
IO_L47N_1
IO_L47P_1
IO_L46N_1
IO_L46P_1
IO_L45N_1/VREF_1
IO_L45P_1
IO_L44N_1
IO_L44P_1
IO_L43N_1
IO_L43P_1
IO_L39N_1
IO_L39P_1
K14
C9
IO_L38N_1
IO_L38P_1
D9
98
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
Table 10: FF1152 — XC2VP20, XC2VP30, XC2VP40, and XC2VP50
No Connects
XC2VP30 XC2VP40
Pin
Bank
1
Pin Description
IO_L37N_1
Number
G13
H13
J13
K13
D8
XC2VP20
XC2VP50
1
IO_L37P_1
1
IO_L27N_1/VREF_1
IO_L27P_1
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
1
1
IO_L26N_1
1
IO_L26P_1
E8
1
IO_L25N_1
F12
G12
G11
H11
C7
1
IO_L25P_1
1
IO_L21N_1
1
IO_L21P_1
1
IO_L20N_1
1
IO_L20P_1
D7
1
IO_L19N_1
E11
F11
J12
K12
D6
1
IO_L19P_1
1
IO_L09N_1/VREF_1
IO_L09P_1
1
1
IO_L08N_1
1
IO_L08P_1
D5
1
IO_L07N_1
E9
1
IO_L07P_1
F9
1
IO_L06N_1
J11
K11
J10
G10
H10
G9
1
IO_L06P_1
1
IO_L05_1/No_Pair
IO_L03N_1/VREF_1
IO_L03P_1
1
1
1
IO_L02N_1
1
IO_L02P_1
H9
1
IO_L01N_1/VRP_1
IO_L01P_1/VRN_1
E7
1
E6
2
2
2
2
2
2
2
2
IO_L01N_2/VRP_2
IO_L01P_2/VRN_2
IO_L02N_2
D2
D1
F8
F7
E4
E3
E2
E1
IO_L02P_2
IO_L03N_2
IO_L03P_2
IO_L04N_2/VREF_2
IO_L04P_2
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
99
Product Specification
1-800-255-7778
R
FF1152 Flip-Chip Fine-Pitch BGA Package
Table 10: FF1152 — XC2VP20, XC2VP30, XC2VP40, and XC2VP50
No Connects
XC2VP30 XC2VP40
Pin
Number
Bank
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
Pin Description
IO_L05N_2
IO_L05P_2
IO_L06N_2
IO_L06P_2
IO_L15N_2
IO_L15P_2
IO_L16N_2/VREF_2
IO_L16P_2
IO_L17N_2
IO_L17P_2
IO_L18N_2
IO_L18P_2
IO_L19N_2
IO_L19P_2
IO_L20N_2
IO_L20P_2
IO_L21N_2
IO_L21P_2
IO_L22N_2/VREF_2
IO_L22P_2
IO_L23N_2
IO_L23P_2
IO_L24N_2
IO_L24P_2
IO_L31N_2
IO_L31P_2
IO_L32N_2
IO_L32P_2
IO_L33N_2
IO_L33P_2
IO_L34N_2/VREF_2
IO_L34P_2
IO_L35N_2
IO_L35P_2
IO_L36N_2
IO_L36P_2
IO_L37N_2
IO_L37P_2
XC2VP20
XC2VP50
J8
J7
F5
F4
G4
G3
G6
G5
F2
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
F1
L10
L9
H6
H5
G2
G1
J6
J5
J4
J3
K8
K7
H4
H3
H2
H1
M10
M9
K5
K4
J2
K2
L8
L7
L6
L5
K1
L1
100
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
Table 10: FF1152 — XC2VP20, XC2VP30, XC2VP40, and XC2VP50
No Connects
XC2VP30 XC2VP40
Pin
Bank
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
Pin Description
IO_L38N_2
IO_L38P_2
IO_L39N_2
IO_L39P_2
IO_L40N_2/VREF_2
IO_L40P_2
IO_L41N_2
IO_L41P_2
IO_L42N_2
IO_L42P_2
IO_L43N_2
IO_L43P_2
IO_L44N_2
IO_L44P_2
IO_L45N_2
IO_L45P_2
IO_L46N_2/VREF_2
IO_L46P_2
IO_L47N_2
IO_L47P_2
IO_L48N_2
IO_L48P_2
IO_L49N_2
IO_L49P_2
IO_L50N_2
IO_L50P_2
IO_L51N_2
IO_L51P_2
IO_L52N_2/VREF_2
IO_L52P_2
IO_L53N_2
IO_L53P_2
IO_L54N_2
IO_L54P_2
IO_L55N_2
IO_L55P_2
IO_L56N_2
IO_L56P_2
Number
N10
N9
XC2VP20
XC2VP50
M7
M6
L2
M2
N8
N7
L4
L3
M4
M3
P10
P9
N6
N5
M1
N1
P8
P7
N4
N3
N2
P2
R10
R9
P6
P5
P4
P3
T11
U11
R7
R6
P1
R1
T10
T9
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
101
Product Specification
1-800-255-7778
R
FF1152 Flip-Chip Fine-Pitch BGA Package
Table 10: FF1152 — XC2VP20, XC2VP30, XC2VP40, and XC2VP50
No Connects
XC2VP30 XC2VP40
Pin
Bank
2
Pin Description
IO_L57N_2
IO_L57P_2
Number
R4
R3
R2
T2
XC2VP20
XC2VP50
2
2
IO_L58N_2/VREF_2
IO_L58P_2
2
2
IO_L59N_2
IO_L59P_2
T8
2
T7
2
IO_L60N_2
IO_L60P_2
T6
2
T5
2
IO_L85N_2
IO_L85P_2
T4
2
T3
2
IO_L86N_2
IO_L86P_2
U10
U9
U6
U5
U2
V2
2
2
IO_L87N_2
IO_L87P_2
2
2
IO_L88N_2/VREF_2
IO_L88P_2
2
2
IO_L89N_2
IO_L89P_2
U8
U7
U4
U3
2
2
IO_L90N_2
IO_L90P_2
2
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
IO_L90N_3
IO_L90P_3
IO_L89N_3
IO_L89P_3
IO_L88N_3
IO_L88P_3
IO_L87N_3/VREF_3
IO_L87P_3
IO_L86N_3
IO_L86P_3
IO_L85N_3
IO_L85P_3
IO_L60N_3
IO_L60P_3
IO_L59N_3
IO_L59P_3
IO_L58N_3
V3
V4
V7
V8
V5
V6
W2
Y2
V9
V10
W3
W4
Y1
AA1
V11
W11
W5
102
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
Table 10: FF1152 — XC2VP20, XC2VP30, XC2VP40, and XC2VP50
No Connects
XC2VP30 XC2VP40
Pin
Number
Bank
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
Pin Description
IO_L58P_3
XC2VP20
XC2VP50
W6
IO_L57N_3/VREF_3
IO_L57P_3
Y3
Y4
IO_L56N_3
IO_L56P_3
W7
W8
IO_L55N_3
IO_L55P_3
Y6
Y7
IO_L54N_3
IO_L54P_3
AA2
AB2
W9
IO_L53N_3
IO_L53P_3
W10
AA3
AA4
AB1
AC1
Y9
IO_L52N_3
IO_L52P_3
IO_L51N_3/VREF_3
IO_L51P_3
IO_L50N_3
IO_L50P_3
Y10
AA5
AA6
AB3
AB4
AA7
AA8
AB5
AB6
AC2
AD2
AA9
AA10
AC3
AC4
AD1
AE1
AB7
AB8
AC6
AC7
AD3
IO_L49N_3
IO_L49P_3
IO_L48N_3
IO_L48P_3
IO_L47N_3
IO_L47P_3
IO_L46N_3
IO_L46P_3
IO_L45N_3/VREF_3
IO_L45P_3
IO_L44N_3
IO_L44P_3
IO_L43N_3
IO_L43P_3
IO_L42N_3
IO_L42P_3
IO_L41N_3
IO_L41P_3
IO_L40N_3
IO_L40P_3
IO_L39N_3/VREF_3
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
103
Product Specification
1-800-255-7778
R
FF1152 Flip-Chip Fine-Pitch BGA Package
Table 10: FF1152 — XC2VP20, XC2VP30, XC2VP40, and XC2VP50
No Connects
XC2VP30 XC2VP40
Pin
Bank
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
Pin Description
IO_L39P_3
IO_L38N_3
IO_L38P_3
IO_L37N_3
IO_L37P_3
IO_L36N_3
IO_L36P_3
IO_L35N_3
IO_L35P_3
IO_L34N_3
IO_L34P_3
IO_L33N_3/VREF_3
IO_L33P_3
IO_L32N_3
IO_L32P_3
IO_L31N_3
IO_L31P_3
IO_L24N_3
IO_L24P_3
IO_L23N_3
IO_L23P_3
IO_L22N_3
IO_L22P_3
IO_L21N_3/VREF_3
IO_L21P_3
IO_L20N_3
IO_L20P_3
IO_L19N_3
IO_L19P_3
IO_L18N_3
IO_L18P_3
IO_L17N_3
IO_L17P_3
IO_L16N_3
IO_L16P_3
IO_L15N_3/VREF_3
IO_L15P_3
IO_L06N_3
Number
AD4
AB9
AB10
AD5
AD6
AE2
AF2
XC2VP20
XC2VP50
AD7
AD8
AE4
AE5
AG1
AG2
AC9
AC10
AF3
AF4
AH1
AH2
AE7
AE8
AF5
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
AF6
AG3
AG4
AD9
AD10
AH3
AH4
AJ1
AJ2
AF7
AF8
AK1
AK2
AG5
AG6
AL1
104
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
Table 10: FF1152 — XC2VP20, XC2VP30, XC2VP40, and XC2VP50
No Connects
XC2VP30 XC2VP40
Pin
Number
Bank
Pin Description
IO_L06P_3
XC2VP20
XC2VP50
3
3
3
3
3
3
3
3
3
3
3
AL2
IO_L05N_3
AG7
AH8
AH5
AH6
AK3
AK4
AJ7
IO_L05P_3
IO_L04N_3
IO_L04P_3
IO_L03N_3/VREF_3
IO_L03P_3
IO_L02N_3
IO_L02P_3
AJ8
IO_L01N_3/VRP_3
IO_L01P_3/VRN_3
AJ4
AJ5
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
IO_L01N_4/BUSY/DOUT(1)
IO_L01P_4/INIT_B
IO_L02N_4/D0/DIN(1)
IO_L02P_4/D1
IO_L03N_4/D2
IO_L03P_4/D3
IO_L05_4/No_Pair
IO_L06N_4/VRP_4
IO_L06P_4/VRN_4
IO_L07N_4
AL5
AL6
AG9
AH9
AK6
AK7
AF10
AL7
AM7
AE11
AF11
AG10
AH10
AK8
IO_L07P_4/VREF_4
IO_L08N_4
IO_L08P_4
IO_L09N_4
IO_L09P_4/VREF_4
IO_L19N_4
AL8
AE12
AF12
AJ9
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
IO_L19P_4
IO_L20N_4
IO_L20P_4
AK9
IO_L21N_4
AL9
IO_L21P_4
AM9
AG11
AH11
AH12
AJ12
AK10
IO_L25N_4
IO_L25P_4
IO_L26N_4
IO_L26P_4
IO_L27N_4
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
105
Product Specification
1-800-255-7778
R
FF1152 Flip-Chip Fine-Pitch BGA Package
Table 10: FF1152 — XC2VP20, XC2VP30, XC2VP40, and XC2VP50
No Connects
XC2VP30 XC2VP40
NC
Pin
Bank
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
Pin Description
IO_L27P_4/VREF_4
IO_L37N_4
Number
AL10
AE13
AF13
AG13
AH13
AJ11
XC2VP20
XC2VP50
NC
IO_L37P_4
IO_L38N_4
IO_L38P_4
IO_L39N_4
IO_L39P_4
AK11
AE14
AF14
AJ13
AK13
AL11
AM11
AE15
AF15
AG14
AH14
AL13
AL12
AD16
AE16
AJ14
AK14
AM14
AM13
AF16
AG16
AH15
AJ15
AL14
AL15
AD17
AE17
AH16
AJ16
AK16
AL16
AF17
IO_L43N_4
IO_L43P_4
IO_L44N_4
IO_L44P_4
IO_L45N_4
IO_L45P_4/VREF_4
IO_L46N_4
IO_L46P_4
IO_L47N_4
IO_L47P_4
IO_L48N_4
IO_L48P_4
IO_L49N_4
IO_L49P_4
IO_L50_4/No_Pair
IO_L53_4/No_Pair
IO_L54N_4
IO_L54P_4
IO_L55N_4
IO_L55P_4
IO_L56N_4
IO_L56P_4
IO_L57N_4
IO_L57P_4/VREF_4
IO_L67N_4
IO_L67P_4
IO_L68N_4
IO_L68P_4
IO_L69N_4
IO_L69P_4/VREF_4
IO_L73N_4
106
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
Table 10: FF1152 — XC2VP20, XC2VP30, XC2VP40, and XC2VP50
No Connects
XC2VP30 XC2VP40
Pin
Bank
Pin Description
IO_L73P_4
Number
AG17
AH17
AJ17
XC2VP20
XC2VP50
4
4
4
4
4
IO_L74N_4/GCLK3S
IO_L74P_4/GCLK2P
IO_L75N_4/GCLK1S
IO_L75P_4/GCLK0P
AK17
AL17
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
IO_L75N_5/GCLK7S
IO_L75P_5/GCLK6P
IO_L74N_5/GCLK5S
IO_L74P_5/GCLK4P
IO_L73N_5
AL18
AK18
AJ18
AH18
AG18
AF18
AL19
AK19
AJ19
AH19
AE18
AD18
AL20
AL21
AJ20
AH20
AG19
AF19
AM22
AM21
AK21
AJ21
AE19
AD19
AL23
AL22
AH21
AG21
AF20
AE20
AM24
AL24
IO_L73P_5
IO_L69N_5/VREF_5
IO_L69P_5
IO_L68N_5
IO_L68P_5
IO_L67N_5
IO_L67P_5
IO_L57N_5/VREF_5
IO_L57P_5
IO_L56N_5
IO_L56P_5
IO_L55N_5
IO_L55P_5
IO_L54N_5
IO_L54P_5
IO_L53_5/No_Pair
IO_L50_5/No_Pair
IO_L49N_5
IO_L49P_5
IO_L48N_5
IO_L48P_5
IO_L47N_5
IO_L47P_5
IO_L46N_5
IO_L46P_5
IO_L45N_5/VREF_5
IO_L45P_5
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
107
Product Specification
1-800-255-7778
R
FF1152 Flip-Chip Fine-Pitch BGA Package
Table 10: FF1152 — XC2VP20, XC2VP30, XC2VP40, and XC2VP50
No Connects
XC2VP30 XC2VP40
Pin
Bank
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
Pin Description
IO_L44N_5
Number
AK22
AJ22
AF21
AE21
AK24
AJ24
AH22
AG22
AF22
AE22
AL25
AK25
AJ23
AH23
AH24
AG24
AM26
AL26
AK26
AJ26
AF23
AE23
AL27
AK27
AH25
AG25
AF24
AE24
AM28
AL28
AF25
AK28
AK29
AH26
AG26
AL29
AL30
XC2VP20
XC2VP50
IO_L44P_5
IO_L43N_5
IO_L43P_5
IO_L39N_5
IO_L39P_5
IO_L38N_5
IO_L38P_5
IO_L37N_5
IO_L37P_5
IO_L27N_5/VREF_5
IO_L27P_5
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
IO_L26N_5
IO_L26P_5
IO_L25N_5
IO_L25P_5
IO_L21N_5
IO_L21P_5
IO_L20N_5
IO_L20P_5
IO_L19N_5
IO_L19P_5
IO_L09N_5/VREF_5
IO_L09P_5
IO_L08N_5
IO_L08P_5
IO_L07N_5/VREF_5
IO_L07P_5
IO_L06N_5/VRP_5
IO_L06P_5/VRN_5
IO_L05_5/No_Pair
IO_L03N_5/D4
IO_L03P_5/D5
IO_L02N_5/D6
IO_L02P_5/D7
IO_L01N_5/RDWR_B
IO_L01P_5/CS_B
108
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
Table 10: FF1152 — XC2VP20, XC2VP30, XC2VP40, and XC2VP50
No Connects
XC2VP30 XC2VP40
Pin
Bank
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Pin Description
IO_L01P_6/VRN_6
IO_L01N_6/VRP_6
IO_L02P_6
Number
AJ30
AJ31
AJ27
AJ28
AK31
AK32
AH29
AH30
AH27
AG28
AL33
AL34
AG29
AG30
AK33
AK34
AF27
AF28
AJ33
AJ34
AH31
AH32
AD25
AD26
AG31
AG32
AF29
AF30
AE27
AE28
AH33
AH34
AF31
AF32
AC25
AC26
AG33
AG34
XC2VP20
XC2VP50
IO_L02N_6
IO_L03P_6
IO_L03N_6/VREF_6
IO_L04P_6
IO_L04N_6
IO_L05P_6
IO_L05N_6
IO_L06P_6
IO_L06N_6
IO_L15P_6
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
IO_L15N_6/VREF_6
IO_L16P_6
IO_L16N_6
IO_L17P_6
IO_L17N_6
IO_L18P_6
IO_L18N_6
IO_L19P_6
IO_L19N_6
IO_L20P_6
IO_L20N_6
IO_L21P_6
IO_L21N_6/VREF_6
IO_L22P_6
IO_L22N_6
IO_L23P_6
IO_L23N_6
IO_L24P_6
IO_L24N_6
IO_L31P_6
IO_L31N_6
IO_L32P_6
IO_L32N_6
IO_L33P_6
IO_L33N_6/VREF_6
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
109
Product Specification
1-800-255-7778
R
FF1152 Flip-Chip Fine-Pitch BGA Package
Table 10: FF1152 — XC2VP20, XC2VP30, XC2VP40, and XC2VP50
No Connects
XC2VP30 XC2VP40
Pin
Bank
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Pin Description
IO_L34P_6
IO_L34N_6
IO_L35P_6
IO_L35N_6
IO_L36P_6
IO_L36N_6
IO_L37P_6
IO_L37N_6
IO_L38P_6
IO_L38N_6
IO_L39P_6
IO_L39N_6/VREF_6
IO_L40P_6
IO_L40N_6
IO_L41P_6
IO_L41N_6
IO_L42P_6
IO_L42N_6
IO_L43P_6
IO_L43N_6
IO_L44P_6
IO_L44N_6
IO_L45P_6
IO_L45N_6/VREF_6
IO_L46P_6
IO_L46N_6
IO_L47P_6
IO_L47N_6
IO_L48P_6
IO_L48N_6
IO_L49P_6
IO_L49N_6
IO_L50P_6
IO_L50N_6
IO_L51P_6
IO_L51N_6/VREF_6
IO_L52P_6
IO_L52N_6
Number
AE30
AE31
AD27
AD28
AF33
AE33
AD29
AD30
AB25
AB26
AD31
AD32
AC28
AC29
AB27
AB28
AE34
AD34
AC31
AC32
AA25
AA26
AD33
AC33
AB29
AB30
AA27
AA28
AB31
AB32
AA29
AA30
Y25
XC2VP20
XC2VP50
Y26
AC34
AB34
AA31
AA32
110
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
Table 10: FF1152 — XC2VP20, XC2VP30, XC2VP40, and XC2VP50
No Connects
XC2VP30 XC2VP40
Pin
Bank
6
Pin Description
IO_L53P_6
IO_L53N_6
IO_L54P_6
IO_L54N_6
IO_L55P_6
IO_L55N_6
IO_L56P_6
IO_L56N_6
IO_L57P_6
IO_L57N_6/VREF_6
IO_L58P_6
IO_L58N_6
IO_L59P_6
IO_L59N_6
IO_L60P_6
IO_L60N_6
IO_L85P_6
IO_L85N_6
IO_L86P_6
IO_L86N_6
IO_L87P_6
IO_L87N_6/VREF_6
IO_L88P_6
IO_L88N_6
IO_L89P_6
IO_L89N_6
IO_L90P_6
IO_L90N_6
Number
W25
W26
AB33
AA33
Y28
XC2VP20
XC2VP50
6
6
6
6
6
Y29
6
W27
W28
Y31
6
6
6
Y32
6
W29
W30
W24
V24
6
6
6
6
AA34
Y34
6
6
W31
W32
V25
6
6
6
V26
6
Y33
6
W33
V29
6
6
V30
6
V27
6
V28
6
V31
6
V32
7
7
7
7
7
7
7
7
7
IO_L90P_7
IO_L90N_7
U32
U31
U28
U27
V33
U33
U30
U29
U26
IO_L89P_7
IO_L89N_7
IO_L88P_7
IO_L88N_7/VREF_7
IO_L87P_7
IO_L87N_7
IO_L86P_7
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
111
Product Specification
1-800-255-7778
R
FF1152 Flip-Chip Fine-Pitch BGA Package
Table 10: FF1152 — XC2VP20, XC2VP30, XC2VP40, and XC2VP50
No Connects
XC2VP30 XC2VP40
Pin
Bank
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
Pin Description
IO_L86N_7
IO_L85P_7
IO_L85N_7
IO_L60P_7
IO_L60N_7
IO_L59P_7
IO_L59N_7
IO_L58P_7
IO_L58N_7/VREF_7
IO_L57P_7
IO_L57N_7
IO_L56P_7
IO_L56N_7
IO_L55P_7
IO_L55N_7
IO_L54P_7
IO_L54N_7
IO_L53P_7
IO_L53N_7
IO_L52P_7
IO_L52N_7/VREF_7
IO_L51P_7
IO_L51N_7
IO_L50P_7
IO_L50N_7
IO_L49P_7
IO_L49N_7
IO_L48P_7
IO_L48N_7
IO_L47P_7
IO_L47N_7
IO_L46P_7
IO_L46N_7/VREF_7
IO_L45P_7
IO_L45N_7
IO_L44P_7
IO_L44N_7
IO_L43P_7
Number
U25
T32
T31
T30
T29
T28
T27
T33
R33
R32
R31
T26
T25
R34
P34
R29
R28
U24
T24
P32
P31
P30
P29
R26
R25
P33
N33
N32
N31
P28
P27
N34
M34
N30
N29
P26
P25
M32
XC2VP20
XC2VP50
112
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
Table 10: FF1152 — XC2VP20, XC2VP30, XC2VP40, and XC2VP50
No Connects
XC2VP30 XC2VP40
Pin
Bank
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
Pin Description
IO_L43N_7
IO_L42P_7
IO_L42N_7
IO_L41P_7
IO_L41N_7
IO_L40P_7
IO_L40N_7/VREF_7
IO_L39P_7
IO_L39N_7
IO_L38P_7
IO_L38N_7
IO_L37P_7
IO_L37N_7
IO_L36P_7
IO_L36N_7
IO_L35P_7
IO_L35N_7
IO_L34P_7
IO_L34N_7/VREF_7
IO_L33P_7
IO_L33N_7
IO_L32P_7
IO_L32N_7
IO_L31P_7
IO_L31N_7
IO_L24P_7
IO_L24N_7
IO_L23P_7
IO_L23N_7
IO_L22P_7
IO_L22N_7/VREF_7
IO_L21P_7
IO_L21N_7
IO_L20P_7
IO_L20N_7
IO_L19P_7
IO_L19N_7
IO_L18P_7
Number
M31
L32
L31
N28
N27
M33
L33
M29
M28
N26
N25
L34
K34
L30
L29
L28
L27
K33
J33
XC2VP20
XC2VP50
K31
K30
M26
M25
H34
H33
H32
H31
K28
K27
J32
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
J31
J30
J29
G34
G33
H30
H29
L26
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
113
Product Specification
1-800-255-7778
R
FF1152 Flip-Chip Fine-Pitch BGA Package
Table 10: FF1152 — XC2VP20, XC2VP30, XC2VP40, and XC2VP50
No Connects
XC2VP30 XC2VP40
Pin
Number
Bank
7
Pin Description
IO_L18N_7
XC2VP20
NC
XC2VP50
L25
7
IO_L17P_7
F34
F33
G30
G29
G32
G31
F31
F30
J28
NC
7
IO_L17N_7
NC
7
IO_L16P_7
NC
7
IO_L16N_7/VREF_7
IO_L15P_7
NC
7
NC
7
IO_L15N_7
NC
7
IO_L06P_7
7
IO_L06N_7
7
IO_L05P_7
7
IO_L05N_7
J27
7
IO_L04P_7
E34
E33
E32
E31
F28
F27
D34
D33
7
IO_L04N_7/VREF_7
IO_L03P_7
7
7
IO_L03N_7
7
IO_L02P_7
7
IO_L02N_7
7
IO_L01P_7/VRN_7
IO_L01N_7/VRP_7
7
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
C29
E20
F25
L20
L21
L22
L23
M18
M19
M20
M21
M22
C6
E15
F10
L12
L13
L14
114
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
Table 10: FF1152 — XC2VP20, XC2VP30, XC2VP40, and XC2VP50
No Connects
XC2VP30 XC2VP40
Pin
Number
Bank
1
1
1
1
1
1
2
2
2
2
2
2
2
2
2
2
2
2
3
3
3
3
3
3
3
3
3
3
3
3
4
4
4
4
4
4
4
4
Pin Description
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
XC2VP20
XC2VP50
L15
M13
M14
M15
M16
M17
F3
K6
M11
N11
N12
P11
P12
R5
R11
R12
T12
U12
V12
W12
Y5
Y11
Y12
AA11
AA12
AB11
AB12
AC11
AE6
AJ3
AC13
AC14
AC15
AC16
AC17
AD12
AD13
AD14
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
115
Product Specification
1-800-255-7778
R
FF1152 Flip-Chip Fine-Pitch BGA Package
Table 10: FF1152 — XC2VP20, XC2VP30, XC2VP40, and XC2VP50
No Connects
XC2VP30 XC2VP40
Pin
Bank
4
4
4
4
5
5
5
5
5
5
5
5
5
5
5
5
6
6
6
6
6
6
6
6
6
6
6
6
7
7
7
7
7
7
7
7
7
7
Pin Description
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
Number
AD15
AJ10
AK15
AM6
AC18
AC19
AC20
AC21
AC22
AD20
AD21
AD22
AD23
AJ25
AK20
AM29
V23
XC2VP20
XC2VP50
W23
Y23
Y24
Y30
AA23
AA24
AB23
AB24
AC24
AE29
AJ32
F32
K29
M24
N23
N24
P23
P24
R23
R24
R30
116
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
Table 10: FF1152 — XC2VP20, XC2VP30, XC2VP40, and XC2VP50
No Connects
Pin
Bank
Pin Description
VCCO_7
Number
XC2VP20
XC2VP30
XC2VP40
XC2VP50
7
7
T23
VCCO_7
U23
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
CCLK
PROG_B
DONE
AE9
J26
AE10
AF26
AE26
AE25
J9
M0
M1
M2
TCK
TDI
H28
H7
TDO
TMS
K10
AF9
K25
G8
PWRDWN_B
HSWAP_EN
RSVD
VBATT
K9
DXP
K26
G27
B32
B33
A33
A32
C30
A31
A30
B31
B30
B28
B29
A29
A28
C27
A27
A26
B27
B26
B24
DXN
AVCCAUXTX2
VTTXPAD2
TXNPAD2
TXPPAD2
GNDA2
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
RXPPAD2
RXNPAD2
VTRXPAD2
AVCCAUXRX2
AVCCAUXTX4
VTTXPAD4
TXNPAD4
TXPPAD4
GNDA4
RXPPAD4
RXNPAD4
VTRXPAD4
AVCCAUXRX4
AVCCAUXTX5
NC
NC
NC
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
117
Product Specification
1-800-255-7778
R
FF1152 Flip-Chip Fine-Pitch BGA Package
Table 10: FF1152 — XC2VP20, XC2VP30, XC2VP40, and XC2VP50
No Connects
Pin
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
VTTXPAD5
TXNPAD5
Number
B25
A25
A24
C23
A23
A22
B23
B22
B20
B21
A21
A20
C20
A19
A18
B19
B18
B16
B17
A17
A16
C15
A15
A14
B15
B14
B12
B13
A13
A12
C12
A11
A10
B11
B10
B8
XC2VP20
NC
XC2VP30
XC2VP40
NC
XC2VP50
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
TXPPAD5
NC
NC
GNDA5
NC
NC
RXPPAD5
NC
NC
RXNPAD5
VTRXPAD5
AVCCAUXRX5
AVCCAUXTX6
VTTXPAD6
TXNPAD6
NC
NC
NC
NC
NC
NC
TXPPAD6
GNDA6
RXPPAD6
RXNPAD6
VTRXPAD6
AVCCAUXRX6
AVCCAUXTX7
VTTXPAD7
TXNPAD7
TXPPAD7
GNDA7
RXPPAD7
RXNPAD7
VTRXPAD7
AVCCAUXRX7
AVCCAUXTX8
VTTXPAD8
TXNPAD8
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
TXPPAD8
GNDA8
RXPPAD8
RXNPAD8
VTRXPAD8
AVCCAUXRX8
AVCCAUXTX9
VTTXPAD9
TXNPAD9
B9
A9
118
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
Table 10: FF1152 — XC2VP20, XC2VP30, XC2VP40, and XC2VP50
No Connects
Pin
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
TXPPAD9
Number
XC2VP20
XC2VP30
XC2VP40
XC2VP50
A8
GNDA9
C8
RXPPAD9
A7
RXNPAD9
A6
VTRXPAD9
AVCCAUXRX9
AVCCAUXTX11
VTTXPAD11
TXNPAD11
TXPPAD11
GNDA11
B7
B6
B4
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
B5
A5
A4
C5
RXPPAD11
RXNPAD11
VTRXPAD11
AVCCAUXRX11
AVCCAUXRX14
VTRXPAD14
RXNPAD14
RXPPAD14
GNDA14
A3
A2
B3
B2
AN2
AN3
AP2
AP3
AM5
AP4
AP5
AN5
AN4
AN6
AN7
AP6
AP7
AM8
AP8
AP9
AN9
AN8
AN10
AN11
AP10
AP11
AM12
TXPPAD14
TXNPAD14
VTTXPAD14
AVCCAUXTX14
AVCCAUXRX16
VTRXPAD16
RXNPAD16
RXPPAD16
GNDA16
TXPPAD16
TXNPAD16
VTTXPAD16
AVCCAUXTX16
AVCCAUXRX17
VTRXPAD17
RXNPAD17
RXPPAD17
GNDA17
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
119
Product Specification
1-800-255-7778
R
FF1152 Flip-Chip Fine-Pitch BGA Package
Table 10: FF1152 — XC2VP20, XC2VP30, XC2VP40, and XC2VP50
No Connects
Pin
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
TXPPAD17
Number
AP12
AP13
AN13
AN12
AN14
AN15
AP14
AP15
AM15
AP16
AP17
AN17
AN16
AN18
AN19
AP18
AP19
AM20
AP20
AP21
AN21
AN20
AN22
AN23
AP22
AP23
AM23
AP24
AP25
AN25
AN24
AN26
AN27
AP26
AP27
AM27
AP28
AP29
XC2VP20
NC
XC2VP30
XC2VP40
NC
XC2VP50
NC
NC
NC
NC
TXNPAD17
VTTXPAD17
AVCCAUXTX17
AVCCAUXRX18
VTRXPAD18
RXNPAD18
RXPPAD18
GNDA18
NC
NC
NC
NC
NC
NC
TXPPAD18
TXNPAD18
VTTXPAD18
AVCCAUXTX18
AVCCAUXRX19
VTRXPAD19
RXNPAD19
RXPPAD19
GNDA19
TXPPAD19
TXNPAD19
VTTXPAD19
AVCCAUXTX19
AVCCAUXRX20
VTRXPAD20
RXNPAD20
RXPPAD20
GNDA20
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
TXPPAD20
TXNPAD20
VTTXPAD20
AVCCAUXTX20
AVCCAUXRX21
VTRXPAD21
RXNPAD21
RXPPAD21
GNDA21
TXPPAD21
TXNPAD21
120
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
Table 10: FF1152 — XC2VP20, XC2VP30, XC2VP40, and XC2VP50
No Connects
XC2VP30 XC2VP40
Pin
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
VTTXPAD21
AVCCAUXTX21
AVCCAUXRX23
VTRXPAD23
RXNPAD23
Number
AN29
AN28
AN30
AN31
AP30
AP31
AM30
AP32
AP33
AN33
AN32
XC2VP20
XC2VP50
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
RXPPAD23
GNDA23
TXPPAD23
TXNPAD23
VTTXPAD23
AVCCAUXTX23
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
L11
L24
M12
M23
N13
N14
N15
N16
N17
N18
N19
N20
N21
N22
P13
P22
R13
R22
T13
T22
U13
U22
V13
V22
W13
W22
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
121
Product Specification
1-800-255-7778
R
FF1152 Flip-Chip Fine-Pitch BGA Package
Table 10: FF1152 — XC2VP20, XC2VP30, XC2VP40, and XC2VP50
No Connects
XC2VP30 XC2VP40
Pin
Number
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
XC2VP20
XC2VP50
Y13
Y22
AA13
AA22
AB13
AB14
AB15
AB16
AB17
AB18
AB19
AB20
AB21
AB22
AC12
AC23
AD11
AD24
C3
C4
C17
C18
C31
C32
D3
D32
U1
V1
U34
V34
AL3
AL32
AM3
AM4
AM17
AM18
AM31
AM32
122
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
Table 10: FF1152 — XC2VP20, XC2VP30, XC2VP40, and XC2VP50
No Connects
XC2VP30 XC2VP40
Pin
Number
Bank
Pin Description
XC2VP20
XC2VP50
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
AF34
B34
C1
C2
C10
C16
C19
C25
C33
C34
D4
D31
E5
E12
E23
E30
F6
F29
G7
G28
B1
H8
H12
H15
H20
J1
H27
AF1
K3
K32
M5
M8
M27
M30
P14
P15
P16
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
123
Product Specification
1-800-255-7778
R
FF1152 Flip-Chip Fine-Pitch BGA Package
Table 10: FF1152 — XC2VP20, XC2VP30, XC2VP40, and XC2VP50
No Connects
XC2VP30 XC2VP40
Pin
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Number
P17
P18
P19
P20
P21
R8
XC2VP20
XC2VP50
R14
R15
R16
R17
R18
R19
R20
R21
R27
T1
T14
T15
T16
T17
T18
T19
T20
T21
T34
U14
U15
U16
U17
U18
U19
U20
U21
V14
V15
V16
V17
V18
124
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
Table 10: FF1152 — XC2VP20, XC2VP30, XC2VP40, and XC2VP50
No Connects
XC2VP30 XC2VP40
Pin
Number
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
XC2VP20
XC2VP50
V19
V20
V21
W1
W14
W15
W16
W17
W18
W19
W20
W21
W34
Y8
Y14
Y15
Y16
Y17
Y18
Y19
Y20
Y21
Y27
AA14
AA15
AA16
AA17
AA18
AA19
AA20
AA21
AC5
AC8
AC27
AC30
AE3
AE32
H23
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
125
Product Specification
1-800-255-7778
R
FF1152 Flip-Chip Fine-Pitch BGA Package
Table 10: FF1152 — XC2VP20, XC2VP30, XC2VP40, and XC2VP50
No Connects
XC2VP30 XC2VP40
Pin
Number
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Notes:
Pin Description
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
XC2VP20
XC2VP50
AG8
AG12
AG15
AG20
AG23
AG27
J34
AH7
AH28
AJ6
AJ29
AK5
AK12
AK23
AK30
AL4
AL31
AM1
AM2
AM10
AM16
AM19
AM25
AM33
AM34
AN1
AN34
1. See Table 4 for an explanation of the signals available on this pin.
126
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
FF1152 Flip-Chip Fine-Pitch BGA Package Specifications (1.00mm pitch)
Figure 6: FF1152 Flip-Chip Fine-Pitch BGA Package Specifications
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
127
Product Specification
1-800-255-7778
R
FF1148 Flip-Chip Fine-Pitch BGA Package
FF1148 Flip-Chip Fine-Pitch BGA Package
As shown in Table 11, XC2VP40 and XC2VP50 Virtex-II Pro devices are available in the FF1148 flip-chip fine-pitch BGA
package. Pins in each of these devices are the same, except for the differences shown in the No Connect column. Following
this table are the FF1148 Flip-Chip Fine-Pitch BGA Package Specifications (1.00mm pitch).
Table 11: FF1148 — XC2VP40 and XC2VP50
No Connects
Bank
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Pin Description
IO_L01N_0/VRP_0
IO_L01P_0/VRN_0
IO_L02N_0
Pin Number
E25
F25
J24
XC2VP40
XC2VP50
IO_L02P_0
K24
C25
D25
G25
A25
B25
G24
G23
H23
H22
E24
F24
C24
C23
J23
IO_L03N_0
IO_L03P_0/VREF_0
IO_L05_0/No_Pair
IO_L06N_0
IO_L06P_0
IO_L07N_0
IO_L07P_0
IO_L08N_0
IO_L08P_0
IO_L09N_0
IO_L09P_0/VREF_0
IO_L19N_0
IO_L19P_0
IO_L20N_0
IO_L20P_0
K23
A24
B24
E23
F23
K22
L22
IO_L21N_0
IO_L21P_0
IO_L25N_0
IO_L25P_0
IO_L26N_0
IO_L26P_0
IO_L27N_0
D23
D22
A23
B23
J21
IO_L27P_0/VREF_0
IO_L37N_0
IO_L37P_0
IO_L38N_0
IO_L38P_0
J20
IO_L39N_0
F22
G22
IO_L39P_0
128
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 11: FF1148 — XC2VP40 and XC2VP50
Bank
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Pin Description
IO_L43N_0
Pin Number
B22
C22
K21
L21
XC2VP40
XC2VP50
IO_L43P_0
IO_L44N_0
IO_L44P_0
IO_L45N_0
G21
H21
E21
F21
K20
L20
IO_L45P_0/VREF_0
IO_L46N_0
IO_L46P_0
IO_L47N_0
IO_L47P_0
IO_L48N_0
C21
D21
A21
B21
G20
H19
E20
F20
C20
D19
K19
L19
IO_L48P_0
IO_L49N_0
IO_L49P_0
IO_L50_0/No_Pair
IO_L53_0/No_Pair
IO_L54N_0
IO_L54P_0
IO_L55N_0
IO_L55P_0
IO_L56N_0
IO_L56P_0
IO_L57N_0
A20
B20
F19
G19
B19
C19
H18
J18
IO_L57P_0/VREF_0
IO_L66N_0
NC
NC
IO_L66P_0/VREF_0
IO_L67N_0
IO_L67P_0
IO_L68N_0
IO_L68P_0
IO_L69N_0
F18
G18
D18
E18
K18
L18
IO_L69P_0/VREF_0
IO_L73N_0
IO_L73P_0
IO_L74N_0/GCLK7P
IO_L74P_0/GCLK6S
IO_L75N_0/GCLK5P
IO_L75P_0/GCLK4S
B18
C18
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
129
R
FF1148 Flip-Chip Fine-Pitch BGA Package
Table 11: FF1148 — XC2VP40 and XC2VP50
No Connects
XC2VP40 XC2VP50
Bank
Pin Description
Pin Number
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
IO_L75N_1/GCLK3P
IO_L75P_1/GCLK2S
IO_L74N_1/GCLK1P
IO_L74P_1/GCLK0S
IO_L73N_1
C17
B17
L17
K17
E17
D17
G17
F17
J17
IO_L73P_1
IO_L69N_1/VREF_1
IO_L69P_1
IO_L68N_1
IO_L68P_1
H17
C16
B16
G16
F16
B15
A15
L16
K16
D16
C15
F15
E15
H16
G15
B14
A14
D14
C14
L15
K15
F14
E14
H14
G14
L14
K14
C13
IO_L67N_1
IO_L67P_1
IO_L66N_1/VREF_1
IO_L66P_1
NC
NC
IO_L57N_1/VREF_1
IO_L57P_1
IO_L56N_1
IO_L56P_1
IO_L55N_1
IO_L55P_1
IO_L54N_1
IO_L54P_1
IO_L53_1/No_Pair
IO_L50_1/No_Pair
IO_L49N_1
IO_L49P_1
IO_L48N_1
IO_L48P_1
IO_L47N_1
IO_L47P_1
IO_L46N_1
IO_L46P_1
IO_L45N_1/VREF_1
IO_L45P_1
IO_L44N_1
IO_L44P_1
IO_L43N_1
130
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 11: FF1148 — XC2VP40 and XC2VP50
Bank
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Pin Description
IO_L43P_1
Pin Number
B13
G13
F13
J15
XC2VP40
XC2VP50
IO_L39N_1
IO_L39P_1
IO_L38N_1
IO_L38P_1
J14
IO_L37N_1
B12
A12
D13
D12
L13
IO_L37P_1
IO_L27N_1/VREF_1
IO_L27P_1
IO_L26N_1
IO_L26P_1
K13
F12
E12
B11
A11
K12
J12
IO_L25N_1
IO_L25P_1
IO_L21N_1
IO_L21P_1
IO_L20N_1
IO_L20P_1
IO_L19N_1
C12
C11
F11
IO_L19P_1
IO_L09N_1/VREF_1
IO_L09P_1
E11
H13
H12
G12
G11
B10
A10
G10
D10
C10
K11
J11
IO_L08N_1
IO_L08P_1
IO_L07N_1
IO_L07P_1
IO_L06N_1
IO_L06P_1
IO_L05_1/No_Pair
IO_L03N_1/VREF_1
IO_L03P_1
IO_L02N_1
IO_L02P_1
IO_L01N_1/VRP_1
IO_L01P_1/VRN_1
F10
E10
2
2
2
IO_L01N_2/VRP_2
IO_L01P_2/VRN_2
IO_L02N_2
B8
B9
C9
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
131
R
FF1148 Flip-Chip Fine-Pitch BGA Package
Table 11: FF1148 — XC2VP40 and XC2VP50
No Connects
XC2VP40 XC2VP50
Bank
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
Pin Description
IO_L02P_2
IO_L03N_2
IO_L03P_2
IO_L04N_2/VREF_2
IO_L04P_2
IO_L05N_2
IO_L05P_2
IO_L06N_2
IO_L06P_2
IO_L07N_2
IO_L07P_2
IO_L08N_2
IO_L08P_2
IO_L09N_2
IO_L09P_2
IO_L10N_2/VREF_2
IO_L10P_2
IO_L11N_2
IO_L11P_2
IO_L12N_2
IO_L12P_2
IO_L13N_2
IO_L13P_2
IO_L14N_2
IO_L14P_2
IO_L15N_2
IO_L15P_2
IO_L16N_2/VREF_2
IO_L16P_2
IO_L17N_2
IO_L17P_2
IO_L18N_2
IO_L18P_2
IO_L19N_2
IO_L19P_2
IO_L20N_2
IO_L20P_2
IO_L21N_2
Pin Number
D9
B7
A7
B6
A6
E8
D8
B4
A4
B3
A3
H7
H8
C6
C7
C5
B5
K8
J8
C1
C2
E7
D7
J6
J7
D5
D6
E4
D4
L9
K9
E3
D3
D1
D2
K7
L7
F6
132
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 11: FF1148 — XC2VP40 and XC2VP50
Bank
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
Pin Description
IO_L21P_2
Pin Number
E6
XC2VP40
XC2VP50
IO_L22N_2/VREF_2
IO_L22P_2
F7
F8
IO_L23N_2
IO_L23P_2
M10
L10
G5
F5
IO_L24N_2
IO_L24P_2
IO_L25N_2
IO_L25P_2
F3
F4
IO_L26N_2
IO_L26P_2
M8
M9
F1
IO_L27N_2
IO_L27P_2
F2
IO_L28N_2/VREF_2
IO_L28P_2
G6
G7
M7
N8
IO_L29N_2
IO_L29P_2
IO_L30N_2
IO_L30P_2
G3
H4
IO_L31N_2
IO_L31P_2
G1
G2
N10
N11
H5
IO_L32N_2
IO_L32P_2
IO_L33N_2
IO_L33P_2
H6
IO_L34N_2/VREF_2
IO_L34P_2
H2
H3
IO_L35N_2
IO_L35P_2
N6
N7
IO_L36N_2
IO_L36P_2
K4
J4
IO_L37N_2
IO_L37P_2
J2
J3
IO_L38N_2
IO_L38P_2
P10
P11
K5
IO_L39N_2
IO_L39P_2
K6
IO_L40N_2/VREF_2
L3
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
133
R
FF1148 Flip-Chip Fine-Pitch BGA Package
Table 11: FF1148 — XC2VP40 and XC2VP50
No Connects
XC2VP40 XC2VP50
Bank
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
Pin Description
IO_L40P_2
IO_L41N_2
IO_L41P_2
IO_L42N_2
IO_L42P_2
IO_L43N_2
IO_L43P_2
IO_L44N_2
IO_L44P_2
IO_L45N_2
IO_L45P_2
IO_L46N_2/VREF_2
IO_L46P_2
IO_L47N_2
IO_L47P_2
IO_L48N_2
IO_L48P_2
IO_L49N_2
IO_L49P_2
IO_L50N_2
IO_L50P_2
IO_L51N_2
IO_L51P_2
IO_L52N_2/VREF_2
IO_L52P_2
IO_L53N_2
IO_L53P_2
IO_L54N_2
IO_L54P_2
IO_L55N_2
IO_L55P_2
IO_L56N_2
IO_L56P_2
IO_L57N_2
IO_L57P_2
IO_L58N_2/VREF_2
IO_L58P_2
IO_L59N_2
Pin Number
K3
R9
P9
K1
K2
L5
L6
P7
P8
L1
L2
M5
M6
R10
R11
M3
M4
M1
M2
R7
T8
P4
N4
N2
N3
T10
T11
P5
P6
R3
P3
T6
T7
P1
P2
R5
R6
U10
134
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 11: FF1148 — XC2VP40 and XC2VP50
Bank
Pin Description
IO_L59P_2
IO_L60N_2
IO_L60P_2
IO_L85N_2
IO_L85P_2
IO_L86N_2
IO_L86P_2
IO_L87N_2
IO_L87P_2
IO_L88N_2/VREF_2
IO_L88P_2
IO_L89N_2
IO_L89P_2
IO_L90N_2
IO_L90P_2
Pin Number
XC2VP40
XC2VP50
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
U11
R1
R2
T3
T4
U8
U9
U2
T2
U4
U5
U6
U7
V3
U3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
IO_L90N_3
IO_L90P_3
IO_L89N_3
IO_L89P_3
IO_L88N_3
IO_L88P_3
IO_L87N_3/VREF_3
IO_L87P_3
IO_L86N_3
IO_L86P_3
IO_L85N_3
IO_L85P_3
IO_L60N_3
IO_L60P_3
IO_L59N_3
IO_L59P_3
IO_L58N_3
IO_L58P_3
IO_L57N_3/VREF_3
IO_L57P_3
IO_L56N_3
IO_L56P_3
V6
V7
V10
V11
V4
V5
V2
W2
V8
V9
W6
W7
W3
W4
W10
W11
Y5
Y6
Y3
AA3
W8
Y7
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
135
R
FF1148 Flip-Chip Fine-Pitch BGA Package
Table 11: FF1148 — XC2VP40 and XC2VP50
No Connects
XC2VP40 XC2VP50
Bank
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
Pin Description
IO_L55N_3
IO_L55P_3
IO_L54N_3
IO_L54P_3
IO_L53N_3
IO_L53P_3
IO_L52N_3
IO_L52P_3
IO_L51N_3/VREF_3
IO_L51P_3
IO_L50N_3
IO_L50P_3
IO_L49N_3
IO_L49P_3
IO_L48N_3
IO_L48P_3
IO_L47N_3
IO_L47P_3
IO_L46N_3
IO_L46P_3
IO_L45N_3/VREF_3
IO_L45P_3
IO_L44N_3
IO_L44P_3
IO_L43N_3
IO_L43P_3
IO_L42N_3
IO_L42P_3
IO_L41N_3
IO_L41P_3
IO_L40N_3
IO_L40P_3
IO_L39N_3/VREF_3
IO_L39P_3
IO_L38N_3
IO_L38P_3
IO_L37N_3
IO_L37P_3
Pin Number
Y1
Y2
AA5
AA6
Y10
Y11
AA4
AB4
AA1
AA2
Y9
AA9
AB6
AB7
AB2
AB3
AA10
AA11
AC5
AC6
AC3
AC4
AA7
AA8
AC1
AC2
AD5
AD6
AB10
AB11
AD3
AE3
AD1
AD2
AB8
AC7
AE5
AE6
136
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 11: FF1148 — XC2VP40 and XC2VP50
Bank
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
Pin Description
IO_L36N_3
IO_L36P_3
IO_L35N_3
IO_L35P_3
IO_L34N_3
IO_L34P_3
IO_L33N_3/VREF_3
IO_L33P_3
IO_L32N_3
IO_L32P_3
IO_L31N_3
IO_L31P_3
IO_L30N_3
IO_L30P_3
IO_L29N_3
IO_L29P_3
IO_L28N_3
IO_L28P_3
IO_L27N_3/VREF_3
IO_L27P_3
IO_L26N_3
IO_L26P_3
IO_L25N_3
IO_L25P_3
IO_L24N_3
IO_L24P_3
IO_L23N_3
IO_L23P_3
IO_L22N_3
IO_L22P_3
IO_L21N_3/VREF_3
IO_L21P_3
IO_L20N_3
IO_L20P_3
IO_L19N_3
IO_L19P_3
IO_L18N_3
IO_L18P_3
Pin Number
AE4
AF4
XC2VP40
XC2VP50
AC10
AD10
AE1
AE2
AF6
AF7
AC8
AC9
AF2
AF3
AG5
AG6
AD9
AE9
AG4
AH3
AG2
AG3
AD7
AE7
AH6
AH7
AH5
AJ5
AE8
AF8
AH1
AH2
AJ6
AK6
AG7
AG8
AJ3
AJ4
AJ1
AJ2
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
137
R
FF1148 Flip-Chip Fine-Pitch BGA Package
Table 11: FF1148 — XC2VP40 and XC2VP50
No Connects
XC2VP40 XC2VP50
Bank
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
Pin Description
IO_L17N_3
Pin Number
AH9
AJ9
IO_L17P_3
IO_L16N_3
AK7
AL7
IO_L16P_3
IO_L15N_3/VREF_3
IO_L15P_3
AK4
AL4
IO_L14N_3
AJ7
IO_L14P_3
AJ8
IO_L13N_3
AK3
AL3
IO_L13P_3
IO_L12N_3
AL5
IO_L12P_3
AL6
IO_L11N_3
AK8
AL8
IO_L11P_3
IO_L10N_3
AL1
IO_L10P_3
AL2
IO_L09N_3/VREF_3
IO_L09P_3
AM6
AM7
AL9
IO_L08N_3
IO_L08P_3
AM9
AM5
AN5
AM1
AM2
AN8
AN9
AN6
AP6
AN4
AP4
AN7
AP7
AN3
AP3
IO_L07N_3
IO_L07P_3
IO_L06N_3
IO_L06P_3
IO_L05N_3
IO_L05P_3
IO_L04N_3
IO_L04P_3
IO_L03N_3/VREF_3
IO_L03P_3
IO_L02N_3
IO_L02P_3
IO_L01N_3/VRP_3
IO_L01P_3/VRN_3
4
4
4
IO_L01N_4/BUSY/DOUT(1)
IO_L01P_4/INIT_B
AK10
AJ10
AF11
IO_L02N_4/D0/DIN(1)
138
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 11: FF1148 — XC2VP40 and XC2VP50
Bank
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
Pin Description
IO_L02P_4/D1
IO_L03N_4/D2
IO_L03P_4/D3
IO_L05_4/No_Pair
IO_L06N_4/VRP_4
IO_L06P_4/VRN_4
IO_L07N_4
Pin Number
AE11
AM10
AL10
AH10
AP10
AN10
AH11
AH12
AG12
AG13
AK11
AJ11
XC2VP40
XC2VP50
IO_L07P_4/VREF_4
IO_L08N_4
IO_L08P_4
IO_L09N_4
IO_L09P_4/VREF_4
IO_L19N_4
AM11
AM12
AF12
AE12
AP11
AN11
AK12
AJ12
IO_L19P_4
IO_L20N_4
IO_L20P_4
IO_L21N_4
IO_L21P_4
IO_L25N_4
IO_L25P_4
IO_L26N_4
AE13
AD13
AL12
AL13
AP12
AN12
AF14
AF15
AJ13
IO_L26P_4
IO_L27N_4
IO_L27P_4/VREF_4
IO_L37N_4
IO_L37P_4
IO_L38N_4
IO_L38P_4
IO_L39N_4
IO_L39P_4
AH13
AN13
AM13
AE14
AD14
AH14
AG14
AK14
AJ14
IO_L43N_4
IO_L43P_4
IO_L44N_4
IO_L44P_4
IO_L45N_4
IO_L45P_4/VREF_4
IO_L46N_4
IO_L46P_4
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
139
R
FF1148 Flip-Chip Fine-Pitch BGA Package
Table 11: FF1148 — XC2VP40 and XC2VP50
No Connects
XC2VP40 XC2VP50
Bank
4
Pin Description
IO_L47N_4
Pin Number
AE15
AD15
AM14
AL14
AP14
AN14
AH15
AG16
AK15
AJ15
4
IO_L47P_4
4
IO_L48N_4
4
IO_L48P_4
4
IO_L49N_4
4
IO_L49P_4
4
IO_L50_4/No_Pair
IO_L53_4/No_Pair
IO_L54N_4
4
4
4
IO_L54P_4
4
IO_L55N_4
AM15
AL16
AE16
AD16
AP15
AN15
AJ16
4
IO_L55P_4
4
IO_L56N_4
4
IO_L56P_4
4
IO_L57N_4
4
IO_L57P_4/VREF_4
IO_L66N_4
4
NC
NC
4
IO_L66P_4/VREF_4
IO_L67N_4
AH16
AN16
AM16
AG17
AF17
AJ17
4
4
IO_L67P_4
4
IO_L68N_4
4
IO_L68P_4
4
IO_L69N_4
4
IO_L69P_4/VREF_4
IO_L73N_4
AH17
AL17
AK17
AE17
AD17
AN17
AM17
4
4
IO_L73P_4
4
IO_L74N_4/GCLK3S
IO_L74P_4/GCLK2P
IO_L75N_4/GCLK1S
IO_L75P_4/GCLK0P
4
4
4
5
5
5
5
5
5
5
IO_L75N_5/GCLK7S
IO_L75P_5/GCLK6P
IO_L74N_5/GCLK5S
IO_L74P_5/GCLK4P
IO_L73N_5
AM18
AN18
AD18
AE18
AK18
AL18
AH18
IO_L73P_5
IO_L69N_5/VREF_5
140
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 11: FF1148 — XC2VP40 and XC2VP50
Bank
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
Pin Description
IO_L69P_5
Pin Number
AJ18
XC2VP40
XC2VP50
IO_L68N_5
AF18
AG18
AM19
AN19
AH19
AJ19
IO_L68P_5
IO_L67N_5
IO_L67P_5
IO_L66N_5/VREF_5
IO_L66P_5
NC
NC
IO_L57N_5/VREF_5
IO_L57P_5
AN20
AP20
AD19
AE19
AL19
AM20
AJ20
IO_L56N_5
IO_L56P_5
IO_L55N_5
IO_L55P_5
IO_L54N_5
IO_L54P_5
AK20
AG19
AH20
AN21
AP21
AL21
AM21
AD20
AE20
AJ21
IO_L53_5/No_Pair
IO_L50_5/No_Pair
IO_L49N_5
IO_L49P_5
IO_L48N_5
IO_L48P_5
IO_L47N_5
IO_L47P_5
IO_L46N_5
IO_L46P_5
AK21
AG21
AH21
AD21
AE21
AM22
AN22
AH22
AJ22
IO_L45N_5/VREF_5
IO_L45P_5
IO_L44N_5
IO_L44P_5
IO_L43N_5
IO_L43P_5
IO_L39N_5
IO_L39P_5
IO_L38N_5
AF20
AF21
AN23
AP23
AL22
IO_L38P_5
IO_L37N_5
IO_L37P_5
IO_L27N_5/VREF_5
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
141
R
FF1148 Flip-Chip Fine-Pitch BGA Package
Table 11: FF1148 — XC2VP40 and XC2VP50
No Connects
XC2VP40 XC2VP50
Bank
5
Pin Description
IO_L27P_5
Pin Number
AL23
AD22
AE22
AJ23
5
IO_L26N_5
5
IO_L26P_5
5
IO_L25N_5
5
IO_L25P_5
AK23
AN24
AP24
AE23
AF23
AM23
AM24
AJ24
5
IO_L21N_5
5
IO_L21P_5
5
IO_L20N_5
5
IO_L20P_5
5
IO_L19N_5
5
IO_L19P_5
5
IO_L09N_5/VREF_5
IO_L09P_5
5
AK24
AG22
AG23
AH23
AH24
AN25
AP25
AH25
AL25
AM25
AE24
AF24
AJ25
5
IO_L08N_5
5
IO_L08P_5
5
IO_L07N_5/VREF_5
IO_L07P_5
5
5
IO_L06N_5/VRP_5
IO_L06P_5/VRN_5
IO_L05_5/No_Pair
IO_L03N_5/D4
IO_L03P_5/D5
IO_L02N_5/D6
IO_L02P_5/D7
IO_L01N_5/RDWR_B
IO_L01P_5/CS_B
5
5
5
5
5
5
5
5
AK25
6
6
6
6
6
6
6
6
6
6
6
IO_L01P_6/VRN_6
IO_L01N_6/VRP_6
IO_L02P_6
AP32
AN32
AP28
AN28
AP31
AN31
AP29
AN29
AN26
AN27
AM33
IO_L02N_6
IO_L03P_6
IO_L03N_6/VREF_6
IO_L04P_6
IO_L04N_6
IO_L05P_6
IO_L05N_6
IO_L06P_6
142
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 11: FF1148 — XC2VP40 and XC2VP50
Bank
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Pin Description
IO_L06N_6
IO_L07P_6
IO_L07N_6
IO_L08P_6
IO_L08N_6
IO_L09P_6
IO_L09N_6/VREF_6
IO_L10P_6
IO_L10N_6
IO_L11P_6
IO_L11N_6
IO_L12P_6
IO_L12N_6
IO_L13P_6
IO_L13N_6
IO_L14P_6
IO_L14N_6
IO_L15P_6
IO_L15N_6/VREF_6
IO_L16P_6
IO_L16N_6
IO_L17P_6
IO_L17N_6
IO_L18P_6
IO_L18N_6
IO_L19P_6
IO_L19N_6
IO_L20P_6
IO_L20N_6
IO_L21P_6
IO_L21N_6/VREF_6
IO_L22P_6
IO_L22N_6
IO_L23P_6
IO_L23N_6
IO_L24P_6
IO_L24N_6
IO_L25P_6
Pin Number
AM34
AN30
AM30
AM26
AL26
AM28
AM29
AL33
AL34
AL27
AK27
AL29
AL30
AL32
AK32
AJ27
AJ28
AL31
AK31
AL28
AK28
AJ26
AH26
AJ33
AJ34
AJ31
AJ32
AG27
AG28
AK29
AJ29
AH33
AH34
AF27
AE27
AJ30
AH30
AH28
XC2VP40
XC2VP50
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
143
R
FF1148 Flip-Chip Fine-Pitch BGA Package
Table 11: FF1148 — XC2VP40 and XC2VP50
No Connects
XC2VP40 XC2VP50
Bank
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Pin Description
IO_L25N_6
IO_L26P_6
IO_L26N_6
IO_L27P_6
IO_L27N_6/VREF_6
IO_L28P_6
IO_L28N_6
IO_L29P_6
IO_L29N_6
IO_L30P_6
IO_L30N_6
IO_L31P_6
IO_L31N_6
IO_L32P_6
IO_L32N_6
IO_L33P_6
IO_L33N_6/VREF_6
IO_L34P_6
IO_L34N_6
IO_L35P_6
IO_L35N_6
IO_L36P_6
IO_L36N_6
IO_L37P_6
IO_L37N_6
IO_L38P_6
IO_L38N_6
IO_L39P_6
IO_L39N_6/VREF_6
IO_L40P_6
IO_L40N_6
IO_L41P_6
IO_L41N_6
IO_L42P_6
IO_L42N_6
IO_L43P_6
IO_L43N_6
IO_L44P_6
Pin Number
AH29
AE28
AD28
AG32
AG33
AH32
AG31
AE26
AD26
AG29
AG30
AF32
AF33
AC26
AC27
AF28
AF29
AE33
AE34
AD25
AC25
AF31
AE31
AE29
AE30
AC28
AB27
AD33
AD34
AE32
AD32
AB24
AB25
AD29
AD30
AC33
AC34
AA27
144
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 11: FF1148 — XC2VP40 and XC2VP50
Bank
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Pin Description
IO_L44N_6
IO_L45P_6
IO_L45N_6/VREF_6
IO_L46P_6
IO_L46N_6
IO_L47P_6
IO_L47N_6
IO_L48P_6
IO_L48N_6
IO_L49P_6
IO_L49N_6
IO_L50P_6
IO_L50N_6
IO_L51P_6
IO_L51N_6/VREF_6
IO_L52P_6
IO_L52N_6
IO_L53P_6
IO_L53N_6
IO_L54P_6
IO_L54N_6
IO_L55P_6
IO_L55N_6
IO_L56P_6
IO_L56N_6
IO_L57P_6
IO_L57N_6/VREF_6
IO_L58P_6
IO_L58N_6
IO_L59P_6
IO_L59N_6
IO_L60P_6
IO_L60N_6
IO_L85P_6
IO_L85N_6
IO_L86P_6
IO_L86N_6
IO_L87P_6
Pin Number
AA28
AC31
AC32
AC29
AC30
AA24
AA25
AB32
AB33
AB28
AB29
AA26
Y26
XC2VP40
XC2VP50
AA33
AA34
AB31
AA31
Y24
Y25
AA29
AA30
Y33
Y34
Y28
W27
AA32
Y32
Y29
Y30
W24
W25
W31
W32
W28
W29
V26
V27
W33
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
145
R
FF1148 Flip-Chip Fine-Pitch BGA Package
Table 11: FF1148 — XC2VP40 and XC2VP50
No Connects
XC2VP40 XC2VP50
Bank
Pin Description
IO_L87N_6/VREF_6
IO_L88P_6
Pin Number
V33
6
6
6
6
6
6
6
V30
IO_L88N_6
V31
IO_L89P_6
V24
IO_L89N_6
V25
IO_L90P_6
V28
IO_L90N_6
V29
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
IO_L90P_7
IO_L90N_7
IO_L89P_7
IO_L89N_7
IO_L88P_7
IO_L88N_7/VREF_7
IO_L87P_7
IO_L87N_7
IO_L86P_7
IO_L86N_7
IO_L85P_7
IO_L85N_7
IO_L60P_7
IO_L60N_7
IO_L59P_7
IO_L59N_7
IO_L58P_7
IO_L58N_7/VREF_7
IO_L57P_7
IO_L57N_7
IO_L56P_7
IO_L56N_7
IO_L55P_7
IO_L55N_7
IO_L54P_7
IO_L54N_7
IO_L53P_7
IO_L53N_7
IO_L52P_7
IO_L52N_7/VREF_7
U32
V32
U28
U29
U30
U31
T33
U33
U26
U27
T31
T32
R33
R34
U24
U25
R29
R30
P33
P34
T28
T29
P32
R32
P29
P30
T24
T25
N32
N33
146
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 11: FF1148 — XC2VP40 and XC2VP50
Bank
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
Pin Description
IO_L51P_7
IO_L51N_7
IO_L50P_7
IO_L50N_7
IO_L49P_7
IO_L49N_7
IO_L48P_7
IO_L48N_7
IO_L47P_7
IO_L47N_7
IO_L46P_7
IO_L46N_7/VREF_7
IO_L45P_7
IO_L45N_7
IO_L44P_7
IO_L44N_7
IO_L43P_7
IO_L43N_7
IO_L42P_7
IO_L42N_7
IO_L41P_7
IO_L41N_7
IO_L40P_7
IO_L40N_7/VREF_7
IO_L39P_7
IO_L39N_7
IO_L38P_7
IO_L38N_7
IO_L37P_7
IO_L37N_7
IO_L36P_7
IO_L36N_7
IO_L35P_7
IO_L35N_7
IO_L34P_7
IO_L34N_7/VREF_7
IO_L33P_7
IO_L33N_7
Pin Number
N31
P31
T27
R28
M33
M34
M31
M32
R24
R25
M29
M30
L33
XC2VP40
XC2VP50
L34
P27
P28
L29
L30
K33
K34
P26
R26
K32
L32
K29
K30
P24
P25
J32
J33
J31
K31
N28
N29
H32
H33
H29
H30
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
147
R
FF1148 Flip-Chip Fine-Pitch BGA Package
Table 11: FF1148 — XC2VP40 and XC2VP50
No Connects
XC2VP40 XC2VP50
Bank
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
Pin Description
IO_L32P_7
IO_L32N_7
IO_L31P_7
IO_L31N_7
IO_L30P_7
IO_L30N_7
IO_L29P_7
IO_L29N_7
IO_L28P_7
IO_L28N_7/VREF_7
IO_L27P_7
IO_L27N_7
IO_L26P_7
IO_L26N_7
IO_L25P_7
IO_L25N_7
IO_L24P_7
IO_L24N_7
IO_L23P_7
IO_L23N_7
IO_L22P_7
IO_L22N_7/VREF_7
IO_L21P_7
IO_L21N_7
IO_L20P_7
IO_L20N_7
IO_L19P_7
IO_L19N_7
IO_L18P_7
IO_L18N_7
IO_L17P_7
IO_L17N_7
IO_L16P_7
IO_L16N_7/VREF_7
IO_L15P_7
IO_L15N_7
IO_L14P_7
IO_L14N_7
Pin Number
N24
N25
G33
G34
H31
G32
N27
M28
G28
G29
F33
F34
M26
M27
F31
F32
F30
G30
L25
M25
F27
F28
E29
F29
L28
K28
D33
D34
D32
E32
K26
L26
D31
E31
D29
D30
J28
J29
148
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 11: FF1148 — XC2VP40 and XC2VP50
Bank
7
Pin Description
IO_L13P_7
Pin Number
D28
E28
C33
C34
J27
XC2VP40
XC2VP50
7
IO_L13N_7
7
IO_L12P_7
7
IO_L12N_7
7
IO_L11P_7
7
IO_L11N_7
K27
B30
C30
C28
C29
H27
H28
A32
B32
A31
B31
D27
E27
A29
B29
A28
B28
D26
C26
B26
B27
7
IO_L10P_7
7
IO_L10N_7/VREF_7
IO_L09P_7
7
7
IO_L09N_7
7
IO_L08P_7
7
IO_L08N_7
7
IO_L07P_7
7
IO_L07N_7
7
IO_L06P_7
7
IO_L06N_7
7
IO_L05P_7
7
IO_L05N_7
7
IO_L04P_7
7
IO_L04N_7/VREF_7
IO_L03P_7
7
7
IO_L03N_7
7
IO_L02P_7
7
IO_L02N_7
7
IO_L01P_7/VRN_7
IO_L01N_7/VRP_7
7
7
7
7
7
7
7
7
7
7
7
7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
E33
R31
L31
G31
C31
R27
L27
G27
C27
J26
M24
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
149
R
FF1148 Flip-Chip Fine-Pitch BGA Package
Table 11: FF1148 — XC2VP40 and XC2VP50
No Connects
XC2VP40 XC2VP50
Bank
7
7
7
7
7
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
5
5
5
5
5
5
5
5
5
5
4
4
4
4
4
4
4
Pin Description
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
Pin Number
U23
T23
R23
P23
N23
AK33
AM31
AH31
AD31
Y31
AM27
AH27
AD27
Y27
AF26
AC24
AB23
AA23
Y23
W23
V23
AL24
AG24
AD23
AC22
AC21
AL20
AG20
AC20
AC19
AC18
AC17
AC16
AL15
AG15
AC15
AC14
AC13
150
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 11: FF1148 — XC2VP40 and XC2VP50
Bank
4
4
4
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
1
1
1
Pin Description
VCCO_4
VCCO_4
VCCO_4
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_1
VCCO_1
VCCO_1
Pin Number
AD12
AL11
AG11
AB12
AA12
Y12
W12
V12
AC11
AF9
AM8
AH8
AD8
Y8
XC2VP40
XC2VP50
AM4
AH4
AD4
Y4
AK2
U12
T12
R12
P12
N12
M11
J9
R8
L8
G8
C8
R4
L4
G4
C4
E2
M17
M16
M15
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
151
R
FF1148 Flip-Chip Fine-Pitch BGA Package
Table 11: FF1148 — XC2VP40 and XC2VP50
No Connects
XC2VP40 XC2VP50
Bank
Pin Description
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
Pin Number
H15
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
D15
M14
M13
L12
H11
D11
H24
D24
L23
M22
M21
M20
H20
D20
M19
M18
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
CCLK
PROG_B
DONE
M0
AG9
G26
AF10
AG25
AG26
AF25
G9
M1
M2
TCK
TDI
F26
TDO
F9
TMS
H10
AG10
H25
H9
PWRDWN_B
HSWAP_EN
RSVD
VBATT
DXP
J10
J25
DXN
H26
N/A
N/A
N/A
VCCINT
VCCINT
VCCINT
AD24
L24
AC23
152
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 11: FF1148 — XC2VP40 and XC2VP50
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
Pin Number
M23
AB22
AA22
Y22
XC2VP40
XC2VP50
W22
V22
U22
T22
R22
P22
N22
AB21
N21
AB20
N20
AB19
N19
AB18
N18
AB17
N17
AB16
N16
AB15
N15
AB14
N14
AB13
AA13
Y13
W13
V13
U13
T13
R13
P13
N13
AC12
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
153
R
FF1148 Flip-Chip Fine-Pitch BGA Package
Table 11: FF1148 — XC2VP40 and XC2VP50
No Connects
XC2VP40 XC2VP50
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
VCCINT
VCCINT
VCCINT
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
GND
Pin Number
M12
AD11
L11
AN34
AG34
U34
H34
B34
AP33
A33
AP27
A27
AP17
A17
AP8
A8
AP2
A2
AN1
AG1
U1
H1
B1
AK34
AF34
AB34
W34
V34
GND
GND
GND
GND
GND
T34
GND
N34
GND
J34
GND
E34
GND
AN33
B33
GND
GND
AM32
C32
GND
GND
AP30
AK30
GND
154
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 11: FF1148 — XC2VP40 and XC2VP50
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Pin Number
AF30
AB30
W30
T30
XC2VP40
XC2VP50
N30
J30
E30
A30
AP26
AK26
AB26
W26
T26
N26
E26
A26
AE25
K25
AP22
AK22
AF22
J22
E22
A22
Y21
W21
V21
U21
T21
R21
AA20
Y20
W20
V20
U20
T20
R20
P20
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
155
R
FF1148 Flip-Chip Fine-Pitch BGA Package
Table 11: FF1148 — XC2VP40 and XC2VP50
No Connects
XC2VP40 XC2VP50
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Pin Number
AP19
AK19
AF19
AA19
Y19
W19
V19
U19
T19
R19
P19
J19
E19
A19
AP18
AA18
Y18
W18
V18
U18
T18
R18
P18
A18
AA17
Y17
W17
V17
U17
T17
R17
P17
AP16
AK16
AF16
AA16
Y16
W16
156
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 11: FF1148 — XC2VP40 and XC2VP50
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Pin Number
V16
U16
T16
XC2VP40
XC2VP50
R16
P16
J16
E16
A16
AA15
Y15
W15
V15
U15
T15
R15
P15
Y14
W14
V14
U14
T14
R14
AP13
AK13
AF13
J13
E13
A13
AE10
K10
AP9
AK9
AB9
W9
T9
N9
E9
A9
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
157
R
FF1148 Flip-Chip Fine-Pitch BGA Package
Table 11: FF1148 — XC2VP40 and XC2VP50
No Connects
XC2VP40 XC2VP50
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Pin Number
AP5
AK5
AF5
AB5
W5
T5
N5
J5
E5
A5
AM3
C3
AN2
B2
AK1
AF1
AB1
W1
V1
T1
N1
J1
E1
Notes:
1. See Table 4 for an explanation of the signals available on this pin.
158
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
FF1148 Flip-Chip Fine-Pitch BGA Package Specifications (1.00mm pitch)
Figure 7: FF1148 Flip-Chip Fine-Pitch BGA Package Specifications
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
159
Product Specification
1-800-255-7778
R
FF1517 Flip-Chip Fine-Pitch BGA Package
FF1517 Flip-Chip Fine-Pitch BGA Package
As shown in Table 12, XC2VP50 and XC2VP70 Virtex-II Pro devices are available in the FF1517 flip-chip fine-pitch BGA
package. Following this table are the FF1517 Flip-Chip Fine-Pitch BGA Package Specifications (1.00mm pitch).
Table 12: FF1517 — XC2VP50 and XC2VP70
No Connects
Pin
Bank
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Pin Description
IO_L01N_0/VRP_0
IO_L01P_0/VRN_0
IO_L02N_0
Number
D31
E31
K30
J30
XC2VP50
XC2VP70
IO_L02P_0
IO_L03N_0
G30
H30
K28
E30
F30
C30
D30
J29
IO_L03P_0/VREF_0
IO_L05_0/No_Pair
IO_L06N_0
IO_L06P_0
IO_L07N_0
IO_L07P_0
IO_L08N_0
IO_L08P_0
K29
G29
H29
E29
F29
L28
IO_L09N_0
IO_L09P_0/VREF_0
IO_L19N_0
IO_L19P_0
IO_L20N_0
IO_L20P_0
L27
IO_L21N_0
C29
D29
H28
J28
IO_L21P_0
IO_L25N_0
IO_L25P_0
IO_L26N_0
M27
M26
D28
E28
H27
J27
IO_L26P_0
IO_L27N_0
IO_L27P_0/VREF_0
IO_L28N_0
NC
NC
NC
NC
NC
NC
NC
IO_L28P_0
IO_L29N_0
J26
IO_L29P_0
K26
F28
G27
D27
IO_L30N_0
IO_L30P_0
IO_L34N_0
160
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 12: FF1517 — XC2VP50 and XC2VP70
Pin
Bank
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Pin Description
IO_L34P_0
Number
E27
L26
XC2VP50
NC
XC2VP70
IO_L35N_0
NC
IO_L35P_0
L25
NC
IO_L36N_0
G26
H26
E26
F26
K25
K24
C26
D26
H25
J25
NC
IO_L36P_0/VREF_0
IO_L37N_0
NC
IO_L37P_0
IO_L38N_0
IO_L38P_0
IO_L39N_0
IO_L39P_0
IO_L43N_0
IO_L43P_0
IO_L44N_0
M25
M24
F25
G25
C25
D25
L23
IO_L44P_0
IO_L45N_0
IO_L45P_0/VREF_0
IO_L46N_0
IO_L46P_0
IO_L47N_0
IO_L47P_0
M22
H24
J24
IO_L48N_0
IO_L48P_0
IO_L49N_0
E25
E24
N23
M23
H23
J23
IO_L49P_0
IO_L50_0/No_Pair
IO_L53_0/No_Pair
IO_L54N_0
IO_L54P_0
IO_L55N_0
F24
G23
K22
L22
IO_L55P_0
IO_L56N_0
IO_L56P_0
IO_L57N_0
C23
D23
H22
J22
IO_L57P_0/VREF_0
IO_L58N_0
IO_L58P_0
IO_L59N_0
N22
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
161
Product Specification
1-800-255-7778
R
FF1517 Flip-Chip Fine-Pitch BGA Package
Table 12: FF1517 — XC2VP50 and XC2VP70
No Connects
Pin
Bank
0
Pin Description
IO_L59P_0
Number
XC2VP50
XC2VP70
N21
E23
F22
D22
E22
H21
H20
G22
G21
D21
E21
J21
0
IO_L60N_0
0
IO_L60P_0
0
IO_L64N_0
0
IO_L64P_0
0
IO_L65N_0
0
IO_L65P_0
0
IO_L66N_0
0
IO_L66P_0/VREF_0
IO_L67N_0
0
0
IO_L67P_0
0
IO_L68N_0
0
IO_L68P_0
K21
C22
C21
F21
F20
L21
M21
D20
E20
0
IO_L69N_0
0
IO_L69P_0/VREF_0
IO_L73N_0
0
0
IO_L73P_0
0
IO_L74N_0/GCLK7P
IO_L74P_0/GCLK6S
IO_L75N_0/GCLK5P
IO_L75P_0/GCLK4S
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
IO_L75N_1/GCLK3P
IO_L75P_1/GCLK2S
IO_L74N_1/GCLK1P
IO_L74P_1/GCLK0S
IO_L73N_1
K20
J20
N20
M20
E19
D19
G19
F19
L19
K19
J19
IO_L73P_1
IO_L69N_1/VREF_1
IO_L69P_1
IO_L68N_1
IO_L68P_1
IO_L67N_1
IO_L67P_1
H19
C19
C18
N19
M19
IO_L66N_1/VREF_1
IO_L66P_1
IO_L65N_1
IO_L65P_1
162
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 12: FF1517 — XC2VP50 and XC2VP70
Pin
Bank
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Pin Description
IO_L64N_1
IO_L64P_1
IO_L60N_1
IO_L60P_1
IO_L59N_1
IO_L59P_1
IO_L58N_1
IO_L58P_1
IO_L57N_1/VREF_1
IO_L57P_1
IO_L56N_1
IO_L56P_1
IO_L55N_1
IO_L55P_1
IO_L54N_1
IO_L54P_1
IO_L53_1/No_Pair
IO_L50_1/No_Pair
IO_L49N_1
IO_L49P_1
IO_L48N_1
IO_L48P_1
IO_L47N_1
IO_L47P_1
IO_L46N_1
IO_L46P_1
IO_L45N_1/VREF_1
IO_L45P_1
IO_L44N_1
IO_L44P_1
IO_L43N_1
IO_L43P_1
IO_L39N_1
IO_L39P_1
IO_L38N_1
IO_L38P_1
IO_L37N_1
IO_L37P_1
Number
E18
D18
G18
F18
L18
XC2VP50
XC2VP70
K18
J18
H18
D17
C17
N18
M18
E17
E16
G17
F16
J17
H17
J16
H16
D15
C15
L17
K16
F15
E15
H15
G15
N17
M17
D14
C14
F14
E14
M16
M15
H14
G14
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
163
Product Specification
1-800-255-7778
R
FF1517 Flip-Chip Fine-Pitch BGA Package
Table 12: FF1517 — XC2VP50 and XC2VP70
No Connects
Pin
Bank
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Pin Description
IO_L36N_1/VREF_1
IO_L36P_1
Number
XC2VP50
NC
XC2VP70
E13
D13
K15
J15
G13
F12
J13
H13
L15
L14
E12
D12
J12
H12
K14
J14
D11
C11
F11
E11
M14
M13
H11
G11
J11
NC
IO_L35N_1
NC
IO_L35P_1
NC
IO_L34N_1
NC
IO_L34P_1
NC
IO_L30N_1
NC
IO_L30P_1
NC
IO_L29N_1
NC
IO_L29P_1
NC
IO_L28N_1
NC
IO_L28P_1
NC
IO_L27N_1/VREF_1
IO_L27P_1
IO_L26N_1
IO_L26P_1
IO_L25N_1
IO_L25P_1
IO_L21N_1
IO_L21P_1
IO_L20N_1
IO_L20P_1
IO_L19N_1
IO_L19P_1
IO_L09N_1/VREF_1
IO_L09P_1
J10
L13
L12
D10
C10
F10
E10
K10
H10
G10
K12
K11
E9
IO_L08N_1
IO_L08P_1
IO_L07N_1
IO_L07P_1
IO_L06N_1
IO_L06P_1
IO_L05_1/No_Pair
IO_L03N_1/VREF_1
IO_L03P_1
IO_L02N_1
IO_L02P_1
IO_L01N_1/VRP_1
164
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 12: FF1517 — XC2VP50 and XC2VP70
Pin
Bank
Pin Description
Number
XC2VP50
XC2VP70
1
IO_L01P_1/VRN_1
D9
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
IO_L01N_2/VRP_2
IO_L01P_2/VRN_2
IO_L02N_2
C7
D7
G9
H9
C5
D5
D6
E6
H8
J9
IO_L02P_2
IO_L03N_2
IO_L03P_2
IO_L04N_2/VREF_2
IO_L04P_2
IO_L05N_2
IO_L05P_2
IO_L06N_2
E7
F7
D1
D2
E2
E3
F5
G5
F3
F4
F1
F2
G6
G7
G3
G4
G1
G2
H6
H7
K8
K9
H2
H3
J6
IO_L06P_2
IO_L73N_2
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
IO_L73P_2
IO_L75N_2
IO_L75P_2
IO_L76N_2/VREF_2
IO_L76P_2
IO_L78N_2
IO_L78P_2
IO_L79N_2
IO_L79P_2
IO_L81N_2
IO_L81P_2
IO_L82N_2/VREF_2
IO_L82P_2
IO_L84N_2
IO_L84P_2
IO_L07N_2
IO_L07P_2
IO_L08N_2
IO_L08P_2
IO_L09N_2
IO_L09P_2
IO_L10N_2/VREF_2
IO_L10P_2
J7
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
165
Product Specification
1-800-255-7778
R
FF1517 Flip-Chip Fine-Pitch BGA Package
Table 12: FF1517 — XC2VP50 and XC2VP70
No Connects
Pin
Bank
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
Pin Description
IO_L11N_2
IO_L11P_2
IO_L12N_2
IO_L12P_2
IO_L13N_2
IO_L13P_2
IO_L14N_2
IO_L14P_2
IO_L15N_2
IO_L15P_2
IO_L16N_2/VREF_2
IO_L16P_2
IO_L17N_2
IO_L17P_2
IO_L18N_2
IO_L18P_2
IO_L19N_2
IO_L19P_2
IO_L20N_2
IO_L20P_2
IO_L21N_2
IO_L21P_2
IO_L22N_2/VREF_2
IO_L22P_2
IO_L23N_2
IO_L23P_2
IO_L24N_2
IO_L24P_2
IO_L25N_2
IO_L25P_2
IO_L26N_2
IO_L26P_2
IO_L27N_2
IO_L27P_2
IO_L28N_2/VREF_2
IO_L28P_2
IO_L29N_2
IO_L29P_2
Number
XC2VP50
XC2VP70
L9
M10
H4
J5
J1
J2
M8
N9
K6
K7
K4
K5
P10
N10
K3
J3
K1
K2
M11
N11
L7
L8
L5
L6
P8
P9
L3
L4
L1
L2
P11
P12
M6
M7
M2
M3
R9
R10
166
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 12: FF1517 — XC2VP50 and XC2VP70
Pin
Bank
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
Pin Description
IO_L30N_2
IO_L30P_2
IO_L31N_2
IO_L31P_2
IO_L32N_2
IO_L32P_2
IO_L33N_2
IO_L33P_2
IO_L34N_2/VREF_2
IO_L34P_2
IO_L35N_2
IO_L35P_2
IO_L36N_2
IO_L36P_2
IO_L37N_2
IO_L37P_2
IO_L38N_2
IO_L38P_2
IO_L39N_2
IO_L39P_2
IO_L40N_2/VREF_2
IO_L40P_2
IO_L41N_2
IO_L41P_2
IO_L42N_2
IO_L42P_2
IO_L43N_2
IO_L43P_2
IO_L44N_2
IO_L44P_2
IO_L45N_2
IO_L45P_2
IO_L46N_2/VREF_2
IO_L46P_2
IO_L47N_2
IO_L47P_2
IO_L48N_2
IO_L48P_2
Number
N6
XC2VP50
XC2VP70
N7
M4
N5
R11
R12
N1
N2
P6
P7
R13
T13
P4
P5
P3
N3
T10
T11
P1
P2
R7
R8
T12
U12
R5
R6
R3
R4
U8
T8
R1
R2
T6
T7
U9
U10
T2
T3
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
167
Product Specification
1-800-255-7778
R
FF1517 Flip-Chip Fine-Pitch BGA Package
Table 12: FF1517 — XC2VP50 and XC2VP70
No Connects
Pin
Bank
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
Pin Description
IO_L49N_2
IO_L49P_2
IO_L50N_2
IO_L50P_2
IO_L51N_2
IO_L51P_2
IO_L52N_2/VREF_2
IO_L52P_2
IO_L53N_2
IO_L53P_2
IO_L54N_2
IO_L54P_2
IO_L55N_2
IO_L55P_2
IO_L56N_2
IO_L56P_2
IO_L57N_2
IO_L57P_2
IO_L58N_2/VREF_2
IO_L58P_2
IO_L59N_2
IO_L59P_2
IO_L60N_2
IO_L60P_2
IO_L85N_2
IO_L85P_2
IO_L86N_2
IO_L86P_2
IO_L87N_2
IO_L87P_2
IO_L88N_2/VREF_2
IO_L88P_2
IO_L89N_2
IO_L89P_2
IO_L90N_2
IO_L90P_2
Number
XC2VP50
XC2VP70
U5
U6
U13
V13
U4
T4
U1
U2
V9
V10
V7
V8
V5
V6
V11
V12
V3
V4
V1
V2
W10
W11
W7
W8
W5
W6
W12
W13
W3
W4
Y7
Y8
W9
Y9
Y3
Y4
3
IO_L90N_3
AA7
168
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 12: FF1517 — XC2VP50 and XC2VP70
Pin
Bank
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
Pin Description
IO_L90P_3
IO_L89N_3
IO_L89P_3
IO_L88N_3
IO_L88P_3
IO_L87N_3/VREF_3
IO_L87P_3
IO_L86N_3
IO_L86P_3
IO_L85N_3
IO_L85P_3
IO_L60N_3
IO_L60P_3
IO_L59N_3
IO_L59P_3
IO_L58N_3
IO_L58P_3
IO_L57N_3/VREF_3
IO_L57P_3
IO_L56N_3
IO_L56P_3
IO_L55N_3
IO_L55P_3
IO_L54N_3
IO_L54P_3
IO_L53N_3
IO_L53P_3
IO_L52N_3
IO_L52P_3
IO_L51N_3/VREF_3
IO_L51P_3
IO_L50N_3
IO_L50P_3
IO_L49N_3
IO_L49P_3
IO_L48N_3
IO_L48P_3
IO_L47N_3
Number
AA8
Y11
XC2VP50
XC2VP70
Y12
AA5
AA6
AA3
AA4
Y13
AA13
AB7
AB8
AB5
AB6
AA9
AA10
AB3
AB4
AB1
AB2
AA11
AA12
AC5
AC6
AC1
AC2
AB9
AB10
AC8
AD8
AC4
AD4
AB11
AB12
AD6
AD7
AD2
AD3
AC9
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
169
Product Specification
1-800-255-7778
R
FF1517 Flip-Chip Fine-Pitch BGA Package
Table 12: FF1517 — XC2VP50 and XC2VP70
No Connects
Pin
Bank
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
Pin Description
IO_L47P_3
IO_L46N_3
IO_L46P_3
IO_L45N_3/VREF_3
IO_L45P_3
IO_L44N_3
IO_L44P_3
IO_L43N_3
IO_L43P_3
IO_L42N_3
IO_L42P_3
IO_L41N_3
IO_L41P_3
IO_L40N_3
IO_L40P_3
IO_L39N_3/VREF_3
IO_L39P_3
IO_L38N_3
IO_L38P_3
IO_L37N_3
IO_L37P_3
IO_L36N_3
IO_L36P_3
IO_L35N_3
IO_L35P_3
IO_L34N_3
IO_L34P_3
IO_L33N_3/VREF_3
IO_L33P_3
IO_L32N_3
IO_L32P_3
IO_L31N_3
IO_L31P_3
IO_L30N_3
IO_L30P_3
IO_L29N_3
IO_L29P_3
IO_L28N_3
Number
XC2VP50
XC2VP70
AC10
AE7
AE8
AE5
AE6
AB13
AC13
AE3
AE4
AE1
AE2
AD10
AD11
AF6
AF7
AF4
AF5
AC12
AD12
AF1
AF2
AG6
AG7
AE9
AE10
AF3
AG3
AG1
AG2
AE11
AE12
AH6
AH7
AG5
AH4
AD13
AE13
AH2
170
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 12: FF1517 — XC2VP50 and XC2VP70
Pin
Bank
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
Pin Description
IO_L28P_3
Number
AH3
AJ7
XC2VP50
XC2VP70
IO_L27N_3/VREF_3
IO_L27P_3
AJ8
IO_L26N_3
IO_L26P_3
AF8
AF9
IO_L25N_3
IO_L25P_3
AJ5
AJ6
IO_L24N_3
IO_L24P_3
AJ3
AJ4
IO_L23N_3
IO_L23P_3
AF10
AG10
AJ1
IO_L22N_3
IO_L22P_3
AJ2
IO_L21N_3/VREF_3
IO_L21P_3
AK6
AK7
AF11
AF12
AK4
AK5
AK1
AK2
AG9
AH8
AL6
IO_L20N_3
IO_L20P_3
IO_L19N_3
IO_L19P_3
IO_L18N_3
IO_L18P_3
IO_L17N_3
IO_L17P_3
IO_L16N_3
IO_L16P_3
AL7
IO_L15N_3/VREF_3
IO_L15P_3
AK3
AL3
IO_L14N_3
IO_L14P_3
AG11
AH11
AL1
IO_L13N_3
IO_L13P_3
AL2
IO_L12N_3
IO_L12P_3
AM6
AM7
AH10
AJ9
IO_L11N_3
IO_L11P_3
IO_L10N_3
IO_L10P_3
AL5
AM4
AM2
IO_L09N_3/VREF_3
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
171
Product Specification
1-800-255-7778
R
FF1517 Flip-Chip Fine-Pitch BGA Package
Table 12: FF1517 — XC2VP50 and XC2VP70
No Connects
Pin
Bank
3
Pin Description
IO_L09P_3
Number
XC2VP50
XC2VP70
AM3
AK8
AK9
AN6
AN7
AN3
AN4
AN1
AN2
AN5
AP5
AP3
AP4
AP1
AP2
AR2
AR3
AT1
AT2
AT5
AU5
AR6
AT6
AL9
AM8
AP7
AR7
AM9
AN9
AR8
AT8
AT7
AU7
3
IO_L08N_3
3
IO_L08P_3
3
IO_L07N_3
3
IO_L07P_3
3
IO_L84N_3
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
3
IO_L84P_3
3
IO_L82N_3
3
IO_L82P_3
3
IO_L81N_3/VREF_3
IO_L81P_3
3
3
IO_L79N_3
3
IO_L79P_3
3
IO_L78N_3
3
IO_L78P_3
3
IO_L76N_3
3
IO_L76P_3
3
IO_L75N_3/VREF_3
IO_L75P_3
3
3
IO_L73N_3
3
IO_L73P_3
3
IO_L06N_3
3
IO_L06P_3
3
IO_L05N_3
3
IO_L05P_3
3
IO_L04N_3
3
IO_L04P_3
3
IO_L03N_3/VREF_3
IO_L03P_3
3
3
IO_L02N_3
3
IO_L02P_3
3
IO_L01N_3/VRP_3
IO_L01P_3/VRN_3
3
4
4
4
4
IO_L01N_4/BUSY/DOUT(1)
IO_L01P_4/INIT_B
IO_L02N_4/D0/DIN(1)
IO_L02P_4/D1
AT9
AR9
AK11
AK12
172
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 12: FF1517 — XC2VP50 and XC2VP70
Pin
Bank
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
Pin Description
IO_L03N_4/D2
IO_L03P_4/D3
IO_L05_4/No_Pair
IO_L06N_4/VRP_4
IO_L06P_4/VRN_4
IO_L07N_4
Number
AN10
AM10
AK10
AR10
AP10
AU10
AT10
AJ12
AJ13
AL10
AL11
AN11
AM11
AH13
AH14
AR11
AP11
AU11
AT11
AL14
AK14
AM12
AL12
AT12
AR12
AJ14
AJ15
AM13
AL13
AP12
AN13
AL15
AK15
AT13
AR13
AN14
AM14
AH15
XC2VP50
XC2VP70
IO_L07P_4/VREF_4
IO_L08N_4
IO_L08P_4
IO_L09N_4
IO_L09P_4/VREF_4
IO_L19N_4
IO_L19P_4
IO_L20N_4
IO_L20P_4
IO_L21N_4
IO_L21P_4
IO_L25N_4
IO_L25P_4
IO_L26N_4
IO_L26P_4
IO_L27N_4
IO_L27P_4/VREF_4
IO_L28N_4
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
IO_L28P_4
IO_L29N_4
IO_L29P_4
IO_L30N_4
IO_L30P_4
IO_L34N_4
IO_L34P_4
IO_L35N_4
IO_L35P_4
IO_L36N_4
IO_L36P_4/VREF_4
IO_L37N_4
IO_L37P_4
IO_L38N_4
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
173
Product Specification
1-800-255-7778
R
FF1517 Flip-Chip Fine-Pitch BGA Package
Table 12: FF1517 — XC2VP50 and XC2VP70
No Connects
Pin
Bank
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
Pin Description
IO_L38P_4
IO_L39N_4
IO_L39P_4
IO_L43N_4
IO_L43P_4
IO_L44N_4
IO_L44P_4
IO_L45N_4
IO_L45P_4/VREF_4
IO_L46N_4
IO_L46P_4
IO_L47N_4
IO_L47P_4
IO_L48N_4
IO_L48P_4
IO_L49N_4
IO_L49P_4
IO_L50_4/No_Pair
IO_L53_4/No_Pair
IO_L54N_4
IO_L54P_4
IO_L55N_4
IO_L55P_4
IO_L56N_4
IO_L56P_4
IO_L57N_4
IO_L57P_4/VREF_4
IO_L58N_4
IO_L58P_4
IO_L59N_4
IO_L59P_4
IO_L60N_4
IO_L60P_4
IO_L64N_4
IO_L64P_4
IO_L65N_4
IO_L65P_4
IO_L66N_4
Number
XC2VP50
XC2VP70
AH16
AR14
AP14
AU14
AT14
AH17
AG17
AN15
AM15
AR15
AP15
AK16
AJ17
AU15
AT15
AM16
AL16
AM17
AL17
AP16
AN17
AR16
AR17
AH18
AG18
AU17
AT17
AM18
AL18
AK18
AJ18
AP18
AN18
AT18
AR18
AH19
AG19
AU18
174
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 12: FF1517 — XC2VP50 and XC2VP70
Pin
Bank
Pin Description
IO_L66P_4/VREF_4
IO_L67N_4
Number
AU19
AM19
AL19
AK19
AJ19
XC2VP50
XC2VP70
4
4
4
4
4
4
4
4
4
4
4
4
4
IO_L67P_4
IO_L68N_4
IO_L68P_4
IO_L69N_4
AP19
AN19
AT19
AR19
AH20
AG20
AL20
AK20
IO_L69P_4/VREF_4
IO_L73N_4
IO_L73P_4
IO_L74N_4/GCLK3S
IO_L74P_4/GCLK2P
IO_L75N_4/GCLK1S
IO_L75P_4/GCLK0P
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
IO_L75N_5/GCLK7S
IO_L75P_5/GCLK6P
IO_L74N_5/GCLK5S
IO_L74P_5/GCLK4P
IO_L73N_5
AR20
AT20
AH21
AJ21
AP20
AP21
AU21
AU22
AK21
AL21
AR21
AT21
AN21
AN22
AM20
AM21
AR22
AT22
AP22
AR23
AG21
AG22
AL22
AM22
IO_L73P_5
IO_L69N_5/VREF_5
IO_L69P_5
IO_L68N_5
IO_L68P_5
IO_L67N_5
IO_L67P_5
IO_L66N_5/VREF_5
IO_L66P_5
IO_L65N_5
IO_L65P_5
IO_L64N_5
IO_L64P_5
IO_L60N_5
IO_L60P_5
IO_L59N_5
IO_L59P_5
IO_L58N_5
IO_L58P_5
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
175
Product Specification
1-800-255-7778
R
FF1517 Flip-Chip Fine-Pitch BGA Package
Table 12: FF1517 — XC2VP50 and XC2VP70
No Connects
Pin
Bank
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
Pin Description
IO_L57N_5/VREF_5
IO_L57P_5
Number
XC2VP50
XC2VP70
AT23
AU23
AJ22
AK22
AN23
AP24
AL23
AM23
AH23
AG23
AR24
AR25
AL24
AM24
AH22
AJ23
AT25
AU25
AN25
AP25
AH24
AH25
AL25
AM25
AT26
AU26
AK24
AK25
AP26
AR26
AM26
AN26
AJ25
AJ26
AR27
AT27
AN27
AP28
IO_L56N_5
IO_L56P_5
IO_L55N_5
IO_L55P_5
IO_L54N_5
IO_L54P_5
IO_L53_5/No_Pair
IO_L50_5/No_Pair
IO_L49N_5
IO_L49P_5
IO_L48N_5
IO_L48P_5
IO_L47N_5
IO_L47P_5
IO_L46N_5
IO_L46P_5
IO_L45N_5/VREF_5
IO_L45P_5
IO_L44N_5
IO_L44P_5
IO_L43N_5
IO_L43P_5
IO_L39N_5
IO_L39P_5
IO_L38N_5
IO_L38P_5
IO_L37N_5
IO_L37P_5
IO_L36N_5/VREF_5
IO_L36P_5
NC
NC
NC
NC
NC
NC
NC
NC
IO_L35N_5
IO_L35P_5
IO_L34N_5
IO_L34P_5
IO_L30N_5
IO_L30P_5
176
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 12: FF1517 — XC2VP50 and XC2VP70
Pin
Bank
5
Pin Description
IO_L29N_5
Number
AK26
AL26
AL27
AM27
AR28
AT28
AH26
AH27
AL28
AM28
AT29
AU29
AJ27
AJ28
AP29
AR29
AM29
AN29
AK29
AL29
AT30
AU30
AP30
AR30
AK28
AM30
AN30
AL30
AK30
AR31
AT31
XC2VP50
NC
XC2VP70
5
IO_L29P_5
NC
5
IO_L28N_5
NC
5
IO_L28P_5
NC
5
IO_L27N_5/VREF_5
IO_L27P_5
5
5
IO_L26N_5
5
IO_L26P_5
5
IO_L25N_5
5
IO_L25P_5
5
IO_L21N_5
5
IO_L21P_5
5
IO_L20N_5
5
IO_L20P_5
5
IO_L19N_5
5
IO_L19P_5
5
IO_L09N_5/VREF_5
IO_L09P_5
5
5
IO_L08N_5
5
IO_L08P_5
5
IO_L07N_5/VREF_5
IO_L07P_5
5
5
IO_L06N_5/VRP_5
IO_L06P_5/VRN_5
IO_L05_5/No_Pair
IO_L03N_5/D4
IO_L03P_5/D5
IO_L02N_5/D6
IO_L02P_5/D7
IO_L01N_5/RDWR_B
IO_L01P_5/CS_B
5
5
5
5
5
5
5
5
6
6
6
6
6
6
IO_L01P_6/VRN_6
IO_L01N_6/VRP_6
IO_L02P_6
AU33
AT33
AT32
AR32
AN31
AM31
IO_L02N_6
IO_L03P_6
IO_L03N_6/VREF_6
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
177
Product Specification
1-800-255-7778
R
FF1517 Flip-Chip Fine-Pitch BGA Package
Table 12: FF1517 — XC2VP50 and XC2VP70
No Connects
Pin
Bank
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Pin Description
IO_L04P_6
IO_L04N_6
IO_L05P_6
IO_L05N_6
IO_L06P_6
IO_L06N_6
IO_L73P_6
IO_L73N_6
IO_L75P_6
IO_L75N_6/VREF_6
IO_L76P_6
IO_L76N_6
IO_L78P_6
IO_L78N_6
IO_L79P_6
IO_L79N_6
IO_L81P_6
IO_L81N_6/VREF_6
IO_L82P_6
IO_L82N_6
IO_L84P_6
IO_L84N_6
IO_L07P_6
IO_L07N_6
IO_L08P_6
IO_L08N_6
IO_L09P_6
IO_L09N_6/VREF_6
IO_L10P_6
IO_L10N_6
IO_L11P_6
IO_L11N_6
IO_L12P_6
IO_L12N_6
IO_L13P_6
IO_L13N_6
IO_L14P_6
IO_L14N_6
Number
XC2VP50
XC2VP70
AR33
AP33
AM32
AL31
AT34
AR34
AU35
AT35
AT38
AT39
AR37
AR38
AP38
AP39
AP36
AP37
AP35
AN35
AN38
AN39
AN36
AN37
AN33
AN34
AK31
AK32
AM37
AM38
AM36
AL35
AJ31
AH30
AM33
AM34
AL38
AL39
AH29
AG29
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
178
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 12: FF1517 — XC2VP50 and XC2VP70
Pin
Bank
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Pin Description
IO_L15P_6
Number
AL37
AK37
AL33
AL34
AH32
AG31
AK38
AK39
AK35
AK36
AF28
AF29
AK33
AK34
AJ38
AJ39
AG30
AF30
AJ36
AJ37
AJ34
AJ35
AF31
AF32
AJ32
AJ33
AH37
AH38
AE27
AD27
AH36
AG35
AH33
AH34
AE28
AE29
AG38
AG39
XC2VP50
XC2VP70
IO_L15N_6/VREF_6
IO_L16P_6
IO_L16N_6
IO_L17P_6
IO_L17N_6
IO_L18P_6
IO_L18N_6
IO_L19P_6
IO_L19N_6
IO_L20P_6
IO_L20N_6
IO_L21P_6
IO_L21N_6/VREF_6
IO_L22P_6
IO_L22N_6
IO_L23P_6
IO_L23N_6
IO_L24P_6
IO_L24N_6
IO_L25P_6
IO_L25N_6
IO_L26P_6
IO_L26N_6
IO_L27P_6
IO_L27N_6/VREF_6
IO_L28P_6
IO_L28N_6
IO_L29P_6
IO_L29N_6
IO_L30P_6
IO_L30N_6
IO_L31P_6
IO_L31N_6
IO_L32P_6
IO_L32N_6
IO_L33P_6
IO_L33N_6/VREF_6
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
179
Product Specification
1-800-255-7778
R
FF1517 Flip-Chip Fine-Pitch BGA Package
Table 12: FF1517 — XC2VP50 and XC2VP70
No Connects
Pin
Bank
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Pin Description
IO_L34P_6
IO_L34N_6
IO_L35P_6
IO_L35N_6
IO_L36P_6
IO_L36N_6
IO_L37P_6
IO_L37N_6
IO_L38P_6
IO_L38N_6
IO_L39P_6
IO_L39N_6/VREF_6
IO_L40P_6
IO_L40N_6
IO_L41P_6
IO_L41N_6
IO_L42P_6
IO_L42N_6
IO_L43P_6
IO_L43N_6
IO_L44P_6
IO_L44N_6
IO_L45P_6
IO_L45N_6/VREF_6
IO_L46P_6
IO_L46N_6
IO_L47P_6
IO_L47N_6
IO_L48P_6
IO_L48N_6
IO_L49P_6
IO_L49N_6
IO_L50P_6
IO_L50N_6
IO_L51P_6
IO_L51N_6/VREF_6
IO_L52P_6
IO_L52N_6
Number
XC2VP50
XC2VP70
AG37
AF37
AE30
AE31
AG33
AG34
AF38
AF39
AD28
AC28
AF35
AF36
AF33
AF34
AD29
AD30
AE38
AE39
AE36
AE37
AC27
AB27
AE34
AE35
AE32
AE33
AC30
AC31
AD37
AD38
AD33
AD34
AB28
AB29
AD36
AC36
AD32
AC32
180
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 12: FF1517 — XC2VP50 and XC2VP70
Pin
Bank
6
Pin Description
IO_L53P_6
IO_L53N_6
IO_L54P_6
IO_L54N_6
IO_L55P_6
IO_L55N_6
IO_L56P_6
IO_L56N_6
IO_L57P_6
IO_L57N_6/VREF_6
IO_L58P_6
IO_L58N_6
IO_L59P_6
IO_L59N_6
IO_L60P_6
IO_L60N_6
IO_L85P_6
IO_L85N_6
IO_L86P_6
IO_L86N_6
IO_L87P_6
IO_L87N_6/VREF_6
IO_L88P_6
IO_L88N_6
IO_L89P_6
IO_L89N_6
IO_L90P_6
IO_L90N_6
Number
AB30
AB31
AC38
AC39
AC34
AC35
AA28
AA29
AB38
AB39
AB36
AB37
AA30
AA31
AB34
AB35
AB32
AB33
AA27
Y27
XC2VP50
XC2VP70
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
AA36
AA37
AA34
AA35
Y28
6
6
6
6
6
Y29
6
AA32
AA33
6
7
7
7
7
7
7
7
7
7
IO_L90P_7
IO_L90N_7
Y36
Y37
Y31
W31
Y32
Y33
W36
W37
W27
IO_L89P_7
IO_L89N_7
IO_L88P_7
IO_L88N_7/VREF_7
IO_L87P_7
IO_L87N_7
IO_L86P_7
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
181
Product Specification
1-800-255-7778
R
FF1517 Flip-Chip Fine-Pitch BGA Package
Table 12: FF1517 — XC2VP50 and XC2VP70
No Connects
Pin
Bank
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
Pin Description
IO_L86N_7
IO_L85P_7
IO_L85N_7
IO_L60P_7
IO_L60N_7
IO_L59P_7
IO_L59N_7
IO_L58P_7
IO_L58N_7/VREF_7
IO_L57P_7
IO_L57N_7
IO_L56P_7
IO_L56N_7
IO_L55P_7
IO_L55N_7
IO_L54P_7
IO_L54N_7
IO_L53P_7
IO_L53N_7
IO_L52P_7
IO_L52N_7/VREF_7
IO_L51P_7
IO_L51N_7
IO_L50P_7
IO_L50N_7
IO_L49P_7
IO_L49N_7
IO_L48P_7
IO_L48N_7
IO_L47P_7
IO_L47N_7
IO_L46P_7
IO_L46N_7/VREF_7
IO_L45P_7
IO_L45N_7
IO_L44P_7
IO_L44N_7
IO_L43P_7
Number
XC2VP50
XC2VP70
W28
W34
W35
W32
W33
W29
W30
V38
V39
V36
V37
V28
V29
V34
V35
V32
V33
V30
V31
U38
U39
T36
U36
V27
U27
U34
U35
T37
T38
U30
U31
T33
T34
R38
R39
T32
U32
R36
182
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 12: FF1517 — XC2VP50 and XC2VP70
Pin
Bank
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
Pin Description
IO_L43N_7
IO_L42P_7
IO_L42N_7
IO_L41P_7
IO_L41N_7
IO_L40P_7
IO_L40N_7/VREF_7
IO_L39P_7
IO_L39N_7
IO_L38P_7
IO_L38N_7
IO_L37P_7
IO_L37N_7
IO_L36P_7
IO_L36N_7
IO_L35P_7
IO_L35N_7
IO_L34P_7
IO_L34N_7/VREF_7
IO_L33P_7
IO_L33N_7
IO_L32P_7
IO_L32N_7
IO_L31P_7
IO_L31N_7
IO_L30P_7
IO_L30N_7
IO_L29P_7
IO_L29N_7
IO_L28P_7
IO_L28N_7/VREF_7
IO_L27P_7
IO_L27N_7
IO_L26P_7
IO_L26N_7
IO_L25P_7
IO_L25N_7
IO_L24P_7
Number
R37
R34
R35
U28
T28
R32
R33
P38
P39
T29
T30
N37
P37
P35
P36
T27
R27
P33
P34
N38
N39
R28
R29
N35
M36
N33
N34
R30
R31
M37
M38
M33
M34
P28
P29
L38
XC2VP50
XC2VP70
L39
L36
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
183
Product Specification
1-800-255-7778
R
FF1517 Flip-Chip Fine-Pitch BGA Package
Table 12: FF1517 — XC2VP50 and XC2VP70
No Connects
Pin
Bank
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
Pin Description
IO_L24N_7
IO_L23P_7
IO_L23N_7
IO_L22P_7
IO_L22N_7/VREF_7
IO_L21P_7
IO_L21N_7
IO_L20P_7
IO_L20N_7
IO_L19P_7
IO_L19N_7
IO_L18P_7
IO_L18N_7
IO_L17P_7
IO_L17N_7
IO_L16P_7
IO_L16N_7/VREF_7
IO_L15P_7
IO_L15N_7
IO_L14P_7
IO_L14N_7
IO_L13P_7
IO_L13N_7
IO_L12P_7
IO_L12N_7
IO_L11P_7
IO_L11N_7
IO_L10P_7
IO_L10N_7/VREF_7
IO_L09P_7
IO_L09N_7
IO_L08P_7
IO_L08N_7
IO_L07P_7
IO_L07N_7
IO_L84P_7
IO_L84N_7
IO_L82P_7
Number
XC2VP50
XC2VP70
L37
P31
P32
L34
L35
L32
L33
N29
M29
K38
K39
J37
K37
N30
P30
K35
K36
K34
K33
N31
M32
J38
J39
J35
H36
M30
L31
J33
J34
H37
H38
K31
K32
H33
H34
G38
G39
G36
NC
NC
NC
184
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 12: FF1517 — XC2VP50 and XC2VP70
Pin
Bank
7
Pin Description
IO_L82N_7/VREF_7
IO_L81P_7
Number
G37
G33
G34
F38
F39
F36
F37
G35
F35
E37
E38
D38
D39
F33
E33
J31
XC2VP50
NC
XC2VP70
7
NC
7
IO_L81N_7
NC
7
IO_L79P_7
NC
7
IO_L79N_7
NC
7
IO_L78P_7
NC
7
IO_L78N_7
NC
7
IO_L76P_7
NC
7
IO_L76N_7/VREF_7
IO_L75P_7
NC
7
NC
7
IO_L75N_7
NC
7
IO_L73P_7
NC
7
IO_L73N_7
NC
7
IO_L06P_7
7
IO_L06N_7
7
IO_L05P_7
7
IO_L05N_7
H32
E34
D34
D35
C35
H31
G31
D33
C33
7
IO_L04P_7
7
IO_L04N_7/VREF_7
IO_L03P_7
7
7
IO_L03N_7
7
IO_L02P_7
7
IO_L02N_7
7
IO_L01P_7/VRN_7
IO_L01N_7/VRP_7
7
7
7
7
7
7
7
7
7
7
7
7
7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
E39
U37
N36
J36
E36
Y35
U33
N32
J32
F32
U29
N28
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
185
Product Specification
1-800-255-7778
R
FF1517 Flip-Chip Fine-Pitch BGA Package
Table 12: FF1517 — XC2VP50 and XC2VP70
No Connects
Pin
Bank
7
7
7
7
7
7
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
5
5
5
5
5
5
5
5
5
5
5
5
4
4
Pin Description
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_4
VCCO_4
Number
XC2VP50
XC2VP70
P27
W26
V26
U26
T26
R26
AR39
AC37
AR36
AL36
AG36
AC33
AP32
AL32
AG32
AC29
AG28
AF27
AE26
AD26
AC26
AB26
AA26
Y26
AP27
AK27
AG26
AG25
AF25
AG24
AF24
AP23
AK23
AF23
AF22
AF21
AF19
AF18
186
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 12: FF1517 — XC2VP50 and XC2VP70
Pin
Bank
4
4
4
4
4
4
4
4
4
4
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
2
2
2
2
2
2
2
2
2
2
Pin Description
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
Number
AP17
AK17
AF17
AG16
AF16
AG15
AF15
AG14
AP13
AK13
AE14
AD14
AC14
AB14
AA14
Y14
XC2VP50
XC2VP70
AF13
AG12
AC11
AP8
AL8
AG8
AC7
AR4
AL4
AG4
AC3
AR1
W14
V14
U14
T14
R14
P13
N12
U11
N8
J8
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
187
Product Specification
1-800-255-7778
R
FF1517 Flip-Chip Fine-Pitch BGA Package
Table 12: FF1517 — XC2VP50 and XC2VP70
No Connects
Pin
Bank
2
Pin Description
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
Number
XC2VP50
XC2VP70
F8
U7
2
2
Y5
2
N4
2
J4
2
E4
2
U3
2
E1
1
N14
K13
F13
P19
P18
P17
K17
F17
P16
N16
P15
N15
K27
F27
N26
P25
N25
P24
N24
P23
K23
F23
P22
P21
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
N/A
N/A
N/A
N/A
N/A
CCLK
PROG_B
DONE
M0
AJ10
D32
AJ11
AP31
AJ30
M1
188
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 12: FF1517 — XC2VP50 and XC2VP70
Pin
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
M2
Number
AJ29
E8
XC2VP50
XC2VP70
TCK
TDI
L30
L10
F9
TDO
TMS
PWRDWN_B
HSWAP_EN
RSVD
AP9
E32
D8
VBATT
L11
DXP
L29
F31
B35
B36
A36
A35
C34
A34
A33
B34
B33
B31
B32
A32
A31
C31
A30
A29
B30
B29
B27
B28
A28
A27
C27
A26
A25
B26
B25
DXN
AVCCAUXTX2
VTTXPAD2
TXNPAD2
TXPPAD2
GNDA2
RXPPAD2
RXNPAD2
VTRXPAD2
AVCCAUXRX2
AVCCAUXTX4
VTTXPAD4
TXNPAD4
TXPPAD4
GNDA4
RXPPAD4
RXNPAD4
VTRXPAD4
AVCCAUXRX4
AVCCAUXTX5
VTTXPAD5
TXNPAD5
TXPPAD5
GNDA5
RXPPAD5
RXNPAD5
VTRXPAD5
AVCCAUXRX5
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
189
Product Specification
1-800-255-7778
R
FF1517 Flip-Chip Fine-Pitch BGA Package
Table 12: FF1517 — XC2VP50 and XC2VP70
No Connects
Pin
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
AVCCAUXTX6
VTTXPAD6
TXNPAD6
Number
XC2VP50
XC2VP70
B23
B24
A24
A23
C24
A22
A21
B22
B21
B18
B19
A19
A18
C16
A17
A16
B17
B16
B14
B15
A15
A14
C13
A13
A12
B13
B12
B10
B11
A11
A10
C9
TXPPAD6
GNDA6
RXPPAD6
RXNPAD6
VTRXPAD6
AVCCAUXRX6
AVCCAUXTX7
VTTXPAD7
TXNPAD7
TXPPAD7
GNDA7
RXPPAD7
RXNPAD7
VTRXPAD7
AVCCAUXRX7
AVCCAUXTX8
VTTXPAD8
TXNPAD8
TXPPAD8
GNDA8
RXPPAD8
RXNPAD8
VTRXPAD8
AVCCAUXRX8
AVCCAUXTX9
VTTXPAD9
TXNPAD9
TXPPAD9
GNDA9
RXPPAD9
A9
RXNPAD9
A8
VTRXPAD9
AVCCAUXRX9
AVCCAUXTX11
VTTXPAD11
B9
B8
B6
B7
190
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 12: FF1517 — XC2VP50 and XC2VP70
Pin
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
TXNPAD11
Number
A7
XC2VP50
XC2VP70
TXPPAD11
A6
GNDA11
C6
RXPPAD11
RXNPAD11
VTRXPAD11
AVCCAUXRX11
AVCCAUXRX14
VTRXPAD14
RXNPAD14
RXPPAD14
GNDA14
A5
A4
B5
B4
AV4
AV5
AW4
AW5
AU6
AW6
AW7
AV7
TXPPAD14
TXNPAD14
VTTXPAD14
AVCCAUXTX14
AVCCAUXRX16
VTRXPAD16
RXNPAD16
RXPPAD16
GNDA16
AV6
AV8
AV9
AW8
AW9
AU9
AW10
AW11
AV11
AV10
AV12
AV13
AW12
AW13
AU13
AW14
AW15
AV15
AV14
AV16
AV17
AW16
AW17
TXPPAD16
TXNPAD16
VTTXPAD16
AVCCAUXTX16
AVCCAUXRX17
VTRXPAD17
RXNPAD17
RXPPAD17
GNDA17
TXPPAD17
TXNPAD17
VTTXPAD17
AVCCAUXTX17
AVCCAUXRX18
VTRXPAD18
RXNPAD18
RXPPAD18
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
191
Product Specification
1-800-255-7778
R
FF1517 Flip-Chip Fine-Pitch BGA Package
Table 12: FF1517 — XC2VP50 and XC2VP70
No Connects
Pin
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
GNDA18
Number
XC2VP50
XC2VP70
AU16
AW18
AW19
AV19
AV18
AV21
AV22
AW21
AW22
AU24
AW23
AW24
AV24
AV23
AV25
AV26
AW25
AW26
AU27
AW27
AW28
AV28
AV27
AV29
AV30
AW29
AW30
AU31
AW31
AW32
AV32
AV31
AV33
AV34
AW33
AW34
AU34
AW35
TXPPAD18
TXNPAD18
VTTXPAD18
AVCCAUXTX18
AVCCAUXRX19
VTRXPAD19
RXNPAD19
RXPPAD19
GNDA19
TXPPAD19
TXNPAD19
VTTXPAD19
AVCCAUXTX19
AVCCAUXRX20
VTRXPAD20
RXNPAD20
RXPPAD20
GNDA20
TXPPAD20
TXNPAD20
VTTXPAD20
AVCCAUXTX20
AVCCAUXRX21
VTRXPAD21
RXNPAD21
RXPPAD21
GNDA21
TXPPAD21
TXNPAD21
VTTXPAD21
AVCCAUXTX21
AVCCAUXRX23
VTRXPAD23
RXNPAD23
RXPPAD23
GNDA23
TXPPAD23
192
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 12: FF1517 — XC2VP50 and XC2VP70
Pin
Bank
N/A
Pin Description
TXNPAD23
Number
AW36
AV36
XC2VP50
XC2VP70
N/A
VTTXPAD23
N/A
AVCCAUXTX23
AV35
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
AH28
M28
AG27
N27
AF26
P26
AE25
AD25
AC25
AB25
AA25
Y25
W25
V25
U25
T25
R25
AE24
AD24
T24
R24
AE23
R23
AE22
R22
AE21
R21
AE20
R20
AE19
R19
AE18
R18
AE17
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
193
Product Specification
1-800-255-7778
R
FF1517 Flip-Chip Fine-Pitch BGA Package
Table 12: FF1517 — XC2VP50 and XC2VP70
No Connects
Pin
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
Number
XC2VP50
XC2VP70
R17
AE16
AD16
T16
R16
AE15
AD15
AC15
AB15
AA15
Y15
W15
V15
U15
T15
R15
AF14
P14
AG13
N13
AH12
M12
AV39
AA39
Y39
W39
B39
AW38
Y38
A38
AR35
E35
AP34
F34
AW20
AV20
B20
A20
194
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 12: FF1517 — XC2VP50 and XC2VP70
Pin
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
Number
AP6
F6
XC2VP50
XC2VP70
AR5
E5
AW2
Y2
A2
AV1
AA1
Y1
W1
B1
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
A3
AV2
AU2
AA2
W2
C2
B2
AU1
AM1
AH1
AD1
T1
M1
H1
C1
AD5
T5
M5
H5
AU4
AT4
D4
C4
AW3
AV3
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
195
Product Specification
1-800-255-7778
R
FF1517 Flip-Chip Fine-Pitch BGA Package
Table 12: FF1517 — XC2VP50 and XC2VP70
No Connects
Pin
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Number
XC2VP50
XC2VP70
AU3
AT3
D3
C3
B3
AN12
G12
C12
Y10
AH9
AD9
T9
M9
AU8
AN8
G8
C8
Y6
AM5
AH5
T17
AT16
AN16
AJ16
AC16
AB16
AA16
Y16
W16
V16
U16
L16
G16
D16
AU12
AB18
AA18
Y18
196
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 12: FF1517 — XC2VP50 and XC2VP70
Pin
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Number
W18
V18
XC2VP50
XC2VP70
U18
T18
AD17
AC17
AB17
AA17
Y17
W17
V17
U17
P20
L20
G20
C20
AD19
AC19
AB19
AA19
Y19
W19
V19
U19
T19
AD18
AC18
U21
T21
AU20
AN20
AJ20
AF20
AD20
AC20
AB20
AA20
Y20
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
197
Product Specification
1-800-255-7778
R
FF1517 Flip-Chip Fine-Pitch BGA Package
Table 12: FF1517 — XC2VP50 and XC2VP70
No Connects
Pin
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Number
XC2VP50
XC2VP70
W20
V20
U20
T20
AC22
AB22
AA22
Y22
W22
V22
U22
T22
AD21
AC21
AB21
AA21
Y21
W21
V21
B38
AW37
AV37
AU37
AT37
D37
C37
B37
A37
AU36
AT36
D36
C36
AM35
AH35
AD35
T35
M35
H35
198
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 12: FF1517 — XC2VP50 and XC2VP70
Pin
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Number
Y34
XC2VP50
XC2VP70
AU32
AN32
G32
C32
AH31
AD31
T31
M31
Y30
AU28
AN28
G28
C28
AT24
AN24
AJ24
AC24
AB24
AA24
Y24
W24
V24
U24
L24
G24
D24
AD23
AC23
AB23
AA23
Y23
W23
V23
U23
T23
AD22
AU39
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
199
Product Specification
1-800-255-7778
R
FF1517 Flip-Chip Fine-Pitch BGA Package
Table 12: FF1517 — XC2VP50 and XC2VP70
No Connects
Pin
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
GND
Number
XC2VP50
XC2VP70
AM39
AH39
AD39
T39
GND
GND
GND
GND
M39
GND
H39
GND
C39
GND
AV38
AU38
AA38
W38
C38
GND
GND
GND
GND
Notes:
1. See Table 4 for an explanation of the signals available on this pin.
200
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
FF1517 Flip-Chip Fine-Pitch BGA Package Specifications (1.00mm pitch)
Figure 8: FF1517 Flip-Chip Fine-Pitch BGA Package Specifications
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
201
Product Specification
1-800-255-7778
R
FF1704 Flip-Chip Fine-Pitch BGA Package
FF1704 Flip-Chip Fine-Pitch BGA Package
As shown in Table 13, XC2VP70, XC2VP100, and XC2VP125 Virtex-II Pro devices are available in the FF1704 flip-chip
fine-pitch BGA package. Following this table are the FF1704 Flip-Chip Fine-Pitch BGA Package Specifications (1.00mm
pitch).
Table 13: FF1704 — XC2VP70, XC2VP100, and XC2VP125
No Connects
Bank
0
Pin Description
IO_L01N_0/VRP_0
IO_L01P_0/VRN_0
IO_L02N_0
Pin Number
G34
H34
F34
XC2VP70
XC2VP100
XC2VP125
0
0
0
IO_L02P_0
E34
C34
D34
K32
H33
J33
0
IO_L03N_0
0
IO_L03P_0/VREF_0
IO_L05_0/No_Pair
IO_L06N_0
0
0
0
IO_L06P_0
0
IO_L07N_0
F33
0
IO_L07P_0
G33
E33
D33
H32
J32
0
IO_L08N_0
0
IO_L08P_0
0
IO_L09N_0
0
IO_L09P_0/VREF_0
IO_L19N_0
0
E32
F32
0
IO_L19P_0
0
IO_L20N_0
C33
C32
K31
L31
0
IO_L20P_0
0
IO_L21N_0
0
IO_L21P_0
0
IO_L25N_0
H31
J31
0
IO_L25P_0
0
IO_L26N_0
G31
F31
0
IO_L26P_0
0
IO_L27N_0
D31
E31
L30
0
IO_L27P_0/VREF_0
IO_L28N_0
0
0
IO_L28P_0
M30
J30
0
IO_L29N_0
0
IO_L29P_0
K30
G30
H30
0
IO_L30N_0
0
IO_L30P_0
202
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 13: FF1704 — XC2VP70, XC2VP100, and XC2VP125
Bank
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Pin Description
IO_L34N_0
IO_L34P_0
Pin Number
E30
F30
D30
C30
M28
M29
K29
L29
XC2VP70
XC2VP100
XC2VP125
IO_L35N_0
IO_L35P_0
IO_L36N_0
IO_L36P_0/VREF_0
IO_L78N_0
IO_L78P_0
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
IO_L83_0/No_Pair
IO_L84N_0
IO_L84P_0
H29
F29
G29
D29
E29
L28
IO_L85N_0
IO_L85P_0
IO_L86N_0
IO_L86P_0
K28
H28
J28
IO_L87N_0
IO_L87P_0/VREF_0
IO_L37N_0
IO_L37P_0
E28
F28
C29
C28
L27
IO_L38N_0
IO_L38P_0
IO_L39N_0
IO_L39P_0
M27
J27
IO_L43N_0
IO_L43P_0
K27
H27
G27
E27
F27
M25
M26
L26
IO_L44N_0
IO_L44P_0
IO_L45N_0
IO_L45P_0/VREF_0
IO_L46N_0
IO_L46P_0
IO_L47N_0
IO_L47P_0
K26
H26
J26
IO_L48N_0
IO_L48P_0
IO_L49N_0
IO_L49P_0
F26
G26
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
203
Product Specification
1-800-255-7778
R
FF1704 Flip-Chip Fine-Pitch BGA Package
Table 13: FF1704 — XC2VP70, XC2VP100, and XC2VP125
No Connects
XC2VP100
Bank
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Pin Description
IO_L50_0/No_Pair
IO_L53_0/No_Pair
IO_L54N_0
Pin Number
D27
D26
K25
L25
XC2VP70
XC2VP125
IO_L54P_0
IO_L55N_0
G25
H25
E26
E25
C25
C26
L24
IO_L55P_0
IO_L56N_0
IO_L56P_0
IO_L57N_0
IO_L57P_0/VREF_0
IO_L58N_0
IO_L58P_0
M24
J24
IO_L59N_0
IO_L59P_0
K24
G24
H24
E24
F24
IO_L60N_0
IO_L60P_0
IO_L64N_0
IO_L64P_0
IO_L65N_0
D24
C24
M22
M23
K23
L23
IO_L65P_0
IO_L66N_0
IO_L66P_0/VREF_0
IO_L67N_0
IO_L67P_0
IO_L68N_0
J23
IO_L68P_0
H23
E23
F23
IO_L69N_0
IO_L69P_0/VREF_0
IO_L73N_0
C23
D23
K22
J22
IO_L73P_0
IO_L74N_0/GCLK7P
IO_L74P_0/GCLK6S
IO_L75N_0/GCLK5P
IO_L75P_0/GCLK4S
F22
G22
1
1
IO_L75N_1/GCLK3P
IO_L75P_1/GCLK2S
G21
F21
204
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 13: FF1704 — XC2VP70, XC2VP100, and XC2VP125
Bank
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Pin Description
IO_L74N_1/GCLK1P
IO_L74P_1/GCLK0S
IO_L73N_1
Pin Number
J21
XC2VP70
XC2VP100
XC2VP125
K21
D20
C20
F20
E20
H20
J20
IO_L73P_1
IO_L69N_1/VREF_1
IO_L69P_1
IO_L68N_1
IO_L68P_1
IO_L67N_1
L20
IO_L67P_1
K20
M20
M21
C19
D19
F19
E19
H19
G19
K19
J19
IO_L66N_1/VREF_1
IO_L66P_1
IO_L65N_1
IO_L65P_1
IO_L64N_1
IO_L64P_1
IO_L60N_1
IO_L60P_1
IO_L59N_1
IO_L59P_1
IO_L58N_1
M19
L19
IO_L58P_1
IO_L57N_1/VREF_1
IO_L57P_1
C17
C18
E18
E17
H18
G18
L18
IO_L56N_1
IO_L56P_1
IO_L55N_1
IO_L55P_1
IO_L54N_1
IO_L54P_1
K18
D17
D16
G17
F17
J17
IO_L53_1/No_Pair
IO_L50_1/No_Pair
IO_L49N_1
IO_L49P_1
IO_L48N_1
IO_L48P_1
H17
K17
IO_L47N_1
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
205
Product Specification
1-800-255-7778
R
FF1704 Flip-Chip Fine-Pitch BGA Package
Table 13: FF1704 — XC2VP70, XC2VP100, and XC2VP125
No Connects
XC2VP100
Bank
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Pin Description
IO_L47P_1
Pin Number
L17
XC2VP70
XC2VP125
IO_L46N_1
IO_L46P_1
M17
M18
F16
IO_L45N_1/VREF_1
IO_L45P_1
E16
G16
H16
K16
J16
IO_L44N_1
IO_L44P_1
IO_L43N_1
IO_L43P_1
IO_L39N_1
IO_L39P_1
M16
L16
IO_L38N_1
IO_L38P_1
C15
C14
F15
IO_L37N_1
IO_L37P_1
E15
J15
IO_L87N_1/VREF_1
IO_L87P_1
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
H15
K15
L15
IO_L86N_1
IO_L86P_1
IO_L85N_1
IO_L85P_1
E14
D14
G14
F14
IO_L84N_1
IO_L84P_1
IO_L83_1/No_Pair
IO_L78N_1
IO_L78P_1
H14
L14
K14
M14
M15
C13
D13
F13
IO_L36N_1/VREF_1
IO_L36P_1
IO_L35N_1
IO_L35P_1
IO_L34N_1
IO_L34P_1
E13
H13
G13
K13
J13
IO_L30N_1
IO_L30P_1
IO_L29N_1
IO_L29P_1
IO_L28N_1
M13
206
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 13: FF1704 — XC2VP70, XC2VP100, and XC2VP125
Bank
1
Pin Description
IO_L28P_1
Pin Number
L13
E12
D12
F12
G12
J12
XC2VP70
XC2VP100
XC2VP125
1
IO_L27N_1/VREF_1
IO_L27P_1
1
1
IO_L26N_1
1
IO_L26P_1
1
IO_L25N_1
1
IO_L25P_1
H12
L12
K12
C11
C10
F11
E11
J11
1
IO_L21N_1
1
IO_L21P_1
1
IO_L20N_1
1
IO_L20P_1
1
IO_L19N_1
1
IO_L19P_1
1
IO_L09N_1/VREF_1
IO_L09P_1
1
H11
D10
E10
G10
F10
J10
1
IO_L08N_1
1
IO_L08P_1
1
IO_L07N_1
1
IO_L07P_1
1
IO_L06N_1
1
IO_L06P_1
H10
K11
D9
1
IO_L05_1/No_Pair
IO_L03N_1/VREF_1
IO_L03P_1
1
1
C9
1
IO_L02N_1
E9
1
IO_L02P_1
F9
1
IO_L01N_1/VRP_1
IO_L01P_1/VRN_1
H9
1
G9
2
2
2
2
2
2
2
2
IO_L01N_2/VRP_2
IO_L01P_2/VRN_2
IO_L02N_2
C5
C6
E7
D7
E6
D6
G6
F7
IO_L02P_2
IO_L03N_2
IO_L03P_2
IO_L04N_2/VREF_2
IO_L04P_2
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
207
Product Specification
1-800-255-7778
R
FF1704 Flip-Chip Fine-Pitch BGA Package
Table 13: FF1704 — XC2VP70, XC2VP100, and XC2VP125
No Connects
XC2VP100
Bank
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
Pin Description
IO_L05N_2
IO_L05P_2
IO_L06N_2
IO_L06P_2
IO_L73N_2
IO_L73P_2
IO_L74N_2
IO_L74P_2
IO_L75N_2
IO_L75P_2
IO_L76N_2/VREF_2
IO_L76P_2
IO_L77N_2
IO_L77P_2
IO_L78N_2
IO_L78P_2
IO_L79N_2
IO_L79P_2
IO_L80N_2
IO_L80P_2
IO_L81N_2
IO_L81P_2
IO_L82N_2/VREF_2
IO_L82P_2
IO_L83N_2
IO_L83P_2
IO_L84N_2
IO_L84P_2
IO_L07N_2
IO_L07P_2
IO_L08N_2
IO_L08P_2
IO_L09N_2
IO_L09P_2
IO_L10N_2/VREF_2
IO_L10P_2
IO_L11N_2
Pin Number
D3
E3
D1
D2
E1
E2
F4
XC2VP70
XC2VP125
F3
F1
F2
G3
G4
G2
G1
G5
H6
H4
H5
H3
H2
H7
J8
J6
J7
J5
J4
J1
J2
K9
L10
K6
K5
K8
K7
K2
K1
L8
208
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 13: FF1704 — XC2VP70, XC2VP100, and XC2VP125
Bank
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
Pin Description
IO_L11P_2
IO_L12N_2
IO_L12P_2
IO_L13N_2
IO_L13P_2
IO_L14N_2
IO_L14P_2
IO_L15N_2
IO_L15P_2
IO_L16N_2/VREF_2
IO_L16P_2
IO_L17N_2
IO_L17P_2
IO_L18N_2
IO_L18P_2
IO_L19N_2
IO_L19P_2
IO_L20N_2
IO_L20P_2
IO_L21N_2
IO_L21P_2
IO_L22N_2/VREF_2
IO_L22P_2
IO_L23N_2
IO_L23P_2
IO_L24N_2
IO_L24P_2
IO_L25N_2
IO_L25P_2
IO_L26N_2
IO_L26P_2
IO_L27N_2
IO_L27P_2
IO_L28N_2/VREF_2
IO_L28P_2
IO_L29N_2
IO_L29P_2
Pin Number
L9
XC2VP70
XC2VP100
XC2VP125
L6
L7
K3
L3
L5
L4
L1
L2
M7
M8
M11
M12
M9
M10
M2
M3
M4
M5
N7
N8
N5
N6
N9
N10
N3
N4
N1
N2
N11
N12
P9
P10
P7
P8
P11
P12
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
209
Product Specification
1-800-255-7778
R
FF1704 Flip-Chip Fine-Pitch BGA Package
Table 13: FF1704 — XC2VP70, XC2VP100, and XC2VP125
No Connects
XC2VP100
Bank
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
Pin Description
IO_L30N_2
IO_L30P_2
IO_L31N_2
IO_L31P_2
IO_L32N_2
IO_L32P_2
IO_L33N_2
IO_L33P_2
IO_L34N_2/VREF_2
IO_L34P_2
IO_L35N_2
IO_L35P_2
IO_L36N_2
IO_L36P_2
IO_L37N_2
IO_L37P_2
IO_L38N_2
IO_L38P_2
IO_L39N_2
IO_L39P_2
IO_L40N_2/VREF_2
IO_L40P_2
IO_L41N_2
IO_L41P_2
IO_L42N_2
IO_L42P_2
IO_L43N_2
IO_L43P_2
IO_L44N_2
IO_L44P_2
IO_L45N_2
IO_L45P_2
IO_L46N_2/VREF_2
IO_L46P_2
IO_L47N_2
IO_L47P_2
IO_L48N_2
Pin Number
P5
XC2VP70
XC2VP125
P6
P1
P2
R9
R10
R5
R6
P3
R3
R1
R2
R11
R12
T6
T7
T8
R8
T4
T5
T2
T3
T10
T11
U7
U8
U5
U6
U9
U10
U3
U4
U1
U2
T12
U12
V10
210
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 13: FF1704 — XC2VP70, XC2VP100, and XC2VP125
Bank
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
Pin Description
IO_L48P_2
IO_L49N_2
IO_L49P_2
IO_L50N_2
IO_L50P_2
IO_L51N_2
IO_L51P_2
IO_L52N_2/VREF_2
IO_L52P_2
IO_L53N_2
IO_L53P_2
IO_L54N_2
IO_L54P_2
IO_L55N_2
IO_L55P_2
IO_L56N_2
IO_L56P_2
IO_L57N_2
IO_L57P_2
IO_L58N_2/VREF_2
IO_L58P_2
IO_L59N_2
IO_L59P_2
IO_L60N_2
IO_L60P_2
IO_L85N_2
IO_L85P_2
IO_L86N_2
IO_L86P_2
IO_L87N_2
IO_L87P_2
IO_L88N_2/VREF_2
IO_L88P_2
IO_L89N_2
IO_L89P_2
IO_L90N_2
IO_L90P_2
Pin Number
V11
V7
XC2VP70
XC2VP100
XC2VP125
V8
U11
V12
V4
V5
V1
V2
W9
W10
W7
W8
W5
W6
W11
W12
W3
W4
W1
W2
Y9
Y10
Y6
Y7
Y3
Y4
Y11
Y12
AA9
AA10
AA6
AA7
AA12
AB12
AA3
AA4
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
211
Product Specification
1-800-255-7778
R
FF1704 Flip-Chip Fine-Pitch BGA Package
Table 13: FF1704 — XC2VP70, XC2VP100, and XC2VP125
No Connects
XC2VP100
Bank
Pin Description
Pin Number
XC2VP70
XC2VP125
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
IO_L90N_3
IO_L90P_3
IO_L89N_3
IO_L89P_3
IO_L88N_3
IO_L88P_3
IO_L87N_3/VREF_3
IO_L87P_3
IO_L86N_3
IO_L86P_3
IO_L85N_3
IO_L85P_3
IO_L60N_3
IO_L60P_3
IO_L59N_3
IO_L59P_3
IO_L58N_3
IO_L58P_3
IO_L57N_3/VREF_3
IO_L57P_3
IO_L56N_3
IO_L56P_3
IO_L55N_3
IO_L55P_3
IO_L54N_3
IO_L54P_3
IO_L53N_3
IO_L53P_3
IO_L52N_3
IO_L52P_3
IO_L51N_3/VREF_3
IO_L51P_3
IO_L50N_3
IO_L50P_3
IO_L49N_3
IO_L49P_3
AB3
AB4
AB6
AB7
AB9
AB10
AC3
AC4
AC11
AC12
AC6
AC7
AC9
AC10
AD9
AD10
AD1
AD2
AD3
AD4
AD11
AD12
AD5
AD6
AD7
AD8
AE10
AE11
AE1
AE2
AE4
AE5
AF11
AE12
AE7
AE8
212
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 13: FF1704 — XC2VP70, XC2VP100, and XC2VP125
Bank
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
Pin Description
IO_L48N_3
IO_L48P_3
IO_L47N_3
IO_L47P_3
IO_L46N_3
IO_L46P_3
IO_L45N_3/VREF_3
IO_L45P_3
IO_L44N_3
IO_L44P_3
IO_L43N_3
IO_L43P_3
IO_L42N_3
IO_L42P_3
IO_L41N_3
IO_L41P_3
IO_L40N_3
IO_L40P_3
IO_L39N_3/VREF_3
IO_L39P_3
IO_L38N_3
IO_L38P_3
IO_L37N_3
IO_L37P_3
IO_L36N_3
IO_L36P_3
IO_L35N_3
IO_L35P_3
IO_L34N_3
IO_L34P_3
IO_L33N_3/VREF_3
IO_L33P_3
IO_L32N_3
IO_L32P_3
IO_L31N_3
IO_L31P_3
IO_L30N_3
Pin Number
AF1
XC2VP70
XC2VP100
XC2VP125
AF2
AG12
AF12
AF3
AF4
AF5
AF6
AF7
AF8
AF9
AF10
AG2
AG3
AG10
AG11
AG4
AG5
AG6
AG7
AG8
AH8
AH1
AH2
AH3
AJ3
AH11
AH12
AH5
AH6
AH9
AH10
AJ11
AJ12
AJ1
AJ2
AJ5
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
213
Product Specification
1-800-255-7778
R
FF1704 Flip-Chip Fine-Pitch BGA Package
Table 13: FF1704 — XC2VP70, XC2VP100, and XC2VP125
No Connects
XC2VP100
Bank
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
Pin Description
IO_L30P_3
IO_L29N_3
IO_L29P_3
IO_L28N_3
IO_L28P_3
IO_L27N_3/VREF_3
IO_L27P_3
IO_L26N_3
IO_L26P_3
IO_L25N_3
IO_L25P_3
IO_L24N_3
IO_L24P_3
IO_L23N_3
IO_L23P_3
IO_L22N_3
IO_L22P_3
IO_L21N_3/VREF_3
IO_L21P_3
IO_L20N_3
IO_L20P_3
IO_L19N_3
IO_L19P_3
IO_L18N_3
IO_L18P_3
IO_L17N_3
IO_L17P_3
IO_L16N_3
IO_L16P_3
IO_L15N_3/VREF_3
IO_L15P_3
IO_L14N_3
IO_L14P_3
IO_L13N_3
IO_L13P_3
IO_L12N_3
IO_L12P_3
Pin Number
AJ6
XC2VP70
XC2VP125
AJ9
AJ10
AJ7
AJ8
AK1
AK2
AK11
AK12
AK3
AK4
AK5
AK6
AK9
AK10
AK7
AK8
AL2
AL3
AL11
AL12
AL4
AL5
AL7
AL8
AL9
AL10
AM1
AM2
AM3
AN3
AM8
AM9
AM4
AM5
AM6
AM7
214
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 13: FF1704 — XC2VP70, XC2VP100, and XC2VP125
Bank
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
Pin Description
IO_L11N_3
IO_L11P_3
IO_L10N_3
IO_L10P_3
IO_L09N_3/VREF_3
IO_L09P_3
IO_L08N_3
IO_L08P_3
IO_L07N_3
IO_L07P_3
IO_L84N_3
IO_L84P_3
IO_L83N_3
IO_L83P_3
IO_L82N_3
IO_L82P_3
IO_L81N_3/VREF_3
IO_L81P_3
IO_L80N_3
IO_L80P_3
IO_L79N_3
IO_L79P_3
IO_L78N_3
IO_L78P_3
IO_L77N_3
IO_L77P_3
IO_L76N_3
IO_L76P_3
IO_L75N_3/VREF_3
IO_L75P_3
IO_L74N_3
IO_L74P_3
IO_L73N_3
IO_L73P_3
IO_L06N_3
IO_L06P_3
IO_L05N_3
Pin Number
AN9
AM10
AN1
AN2
AN5
AN6
AN7
AN8
AP1
XC2VP70
XC2VP100
XC2VP125
AP2
AP4
AP5
AR7
AP8
AP6
AP7
AR2
AR3
AT5
AR6
AR4
AR5
AT1
AT2
AT3
AT4
AU1
AU2
AU3
AU4
AV3
AW3
AV1
AV2
AW1
AW2
AT8
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
215
Product Specification
1-800-255-7778
R
FF1704 Flip-Chip Fine-Pitch BGA Package
Table 13: FF1704 — XC2VP70, XC2VP100, and XC2VP125
No Connects
XC2VP100
Bank
Pin Description
IO_L05P_3
Pin Number
AU8
XC2VP70
XC2VP125
3
3
3
3
3
3
3
3
3
IO_L04N_3
AT6
IO_L04P_3
AU7
IO_L03N_3/VREF_3
IO_L03P_3
AY5
AY6
IO_L02N_3
AV7
IO_L02P_3
AW7
AV6
IO_L01N_3/VRP_3
IO_L01P_3/VRN_3
AW6
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
IO_L01N_4/BUSY/DOUT(1)
IO_L01P_4/INIT_B
IO_L02N_4/D0/DIN(1)
IO_L02P_4/D1
IO_L03N_4/D2
IO_L03P_4/D3
IO_L05_4/No_Pair
IO_L06N_4/VRP_4
IO_L06P_4/VRN_4
IO_L07N_4
AT9
AR9
AU9
AV9
AY9
AW9
AN11
AR10
AP10
AU10
AT10
AV10
AW10
AR11
AP11
AV11
AU11
AY10
AY11
AN12
AM12
AR12
AP12
AT12
AU12
AW12
AV12
IO_L07P_4/VREF_4
IO_L08N_4
IO_L08P_4
IO_L09N_4
IO_L09P_4/VREF_4
IO_L19N_4
IO_L19P_4
IO_L20N_4
IO_L20P_4
IO_L21N_4
IO_L21P_4
IO_L25N_4
IO_L25P_4
IO_L26N_4
IO_L26P_4
IO_L27N_4
IO_L27P_4/VREF_4
216
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 13: FF1704 — XC2VP70, XC2VP100, and XC2VP125
Bank
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
Pin Description
IO_L28N_4
IO_L28P_4
Pin Number
AM13
AL13
AP13
AN13
AT13
AR13
AV13
AU13
AW13
AY13
AL15
AL14
AN14
AM14
AR14
AU14
AT14
AW14
AV14
AM15
AN15
AR15
AP15
AV15
AU15
AY14
AY15
AM16
AL16
AP16
AN16
AR16
AT16
AV16
AU16
AL18
AL17
XC2VP70
XC2VP100
XC2VP125
IO_L29N_4
IO_L29P_4
IO_L30N_4
IO_L30P_4
IO_L34N_4
IO_L34P_4
IO_L35N_4
IO_L35P_4
IO_L36N_4
IO_L36P_4/VREF_4
IO_L78N_4
IO_L78P_4
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
IO_L83_4/No_Pair
IO_L84N_4
IO_L84P_4
IO_L85N_4
IO_L85P_4
IO_L86N_4
IO_L86P_4
IO_L87N_4
IO_L87P_4/VREF_4
IO_L37N_4
IO_L37P_4
IO_L38N_4
IO_L38P_4
IO_L39N_4
IO_L39P_4
IO_L43N_4
IO_L43P_4
IO_L44N_4
IO_L44P_4
IO_L45N_4
IO_L45P_4/VREF_4
IO_L46N_4
IO_L46P_4
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
217
Product Specification
1-800-255-7778
R
FF1704 Flip-Chip Fine-Pitch BGA Package
Table 13: FF1704 — XC2VP70, XC2VP100, and XC2VP125
No Connects
XC2VP100
Bank
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
Pin Description
IO_L47N_4
Pin Number
AM17
AN17
AR17
AP17
AU17
AT17
AW16
AW17
AN18
AM18
AT18
AR18
AV17
AV18
AY18
AY17
AM19
AL19
AP19
AN19
AT19
AR19
AV19
AU19
AW19
AY19
AL21
AL20
AN20
AM20
AP20
AR20
AV20
AU20
AY20
AW20
AN21
XC2VP70
XC2VP125
IO_L47P_4
IO_L48N_4
IO_L48P_4
IO_L49N_4
IO_L49P_4
IO_L50_4/No_Pair
IO_L53_4/No_Pair
IO_L54N_4
IO_L54P_4
IO_L55N_4
IO_L55P_4
IO_L56N_4
IO_L56P_4
IO_L57N_4
IO_L57P_4/VREF_4
IO_L58N_4
IO_L58P_4
IO_L59N_4
IO_L59P_4
IO_L60N_4
IO_L60P_4
IO_L64N_4
IO_L64P_4
IO_L65N_4
IO_L65P_4
IO_L66N_4
IO_L66P_4/VREF_4
IO_L67N_4
IO_L67P_4
IO_L68N_4
IO_L68P_4
IO_L69N_4
IO_L69P_4/VREF_4
IO_L73N_4
IO_L73P_4
IO_L74N_4/GCLK3S
218
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 13: FF1704 — XC2VP70, XC2VP100, and XC2VP125
Bank
Pin Description
Pin Number
AP21
XC2VP70
XC2VP100
XC2VP125
4
4
4
IO_L74P_4/GCLK2P
IO_L75N_4/GCLK1S
IO_L75P_4/GCLK0P
AU21
AT21
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
IO_L75N_5/GCLK7S
IO_L75P_5/GCLK6P
IO_L74N_5/GCLK5S
IO_L74P_5/GCLK4P
IO_L73N_5
AT22
AU22
AP22
AN22
AW23
AY23
AU23
AV23
AR23
AP23
AM23
AN23
AL23
AL22
AY24
AW24
AU24
AV24
AR24
AT24
AN24
AP24
AL24
AM24
AY26
AY25
AV25
AV26
AR25
AT25
AM25
AN25
AW26
IO_L73P_5
IO_L69N_5/VREF_5
IO_L69P_5
IO_L68N_5
IO_L68P_5
IO_L67N_5
IO_L67P_5
IO_L66N_5/VREF_5
IO_L66P_5
IO_L65N_5
IO_L65P_5
IO_L64N_5
IO_L64P_5
IO_L60N_5
IO_L60P_5
IO_L59N_5
IO_L59P_5
IO_L58N_5
IO_L58P_5
IO_L57N_5/VREF_5
IO_L57P_5
IO_L56N_5
IO_L56P_5
IO_L55N_5
IO_L55P_5
IO_L54N_5
IO_L54P_5
IO_L53_5/No_Pair
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
219
Product Specification
1-800-255-7778
R
FF1704 Flip-Chip Fine-Pitch BGA Package
Table 13: FF1704 — XC2VP70, XC2VP100, and XC2VP125
No Connects
XC2VP100
Bank
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
Pin Description
IO_L50_5/No_Pair
IO_L49N_5
Pin Number
AW27
AT26
AU26
AP26
AR26
AN26
AM26
AL26
AL25
AU27
AV27
AT27
AR27
AN27
AP27
AL27
AM27
AY28
AY29
AU28
AV28
AP28
AR28
AN28
AM28
AV29
AW29
AT29
AU29
AR29
AM29
AN29
AL29
AL28
AY30
AW30
AU30
XC2VP70
XC2VP125
IO_L49P_5
IO_L48N_5
IO_L48P_5
IO_L47N_5
IO_L47P_5
IO_L46N_5
IO_L46P_5
IO_L45N_5/VREF_5
IO_L45P_5
IO_L44N_5
IO_L44P_5
IO_L43N_5
IO_L43P_5
IO_L39N_5
IO_L39P_5
IO_L38N_5
IO_L38P_5
IO_L37N_5
IO_L37P_5
IO_L87N_5/VREF_5
IO_L87P_5
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
IO_L86N_5
IO_L86P_5
IO_L85N_5
IO_L85P_5
IO_L84N_5
IO_L84P_5
IO_L83_5/No_Pair
IO_L78N_5
IO_L78P_5
IO_L36N_5/VREF_5
IO_L36P_5
IO_L35N_5
IO_L35P_5
IO_L34N_5
220
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 13: FF1704 — XC2VP70, XC2VP100, and XC2VP125
Bank
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
Pin Description
IO_L34P_5
Pin Number
AV30
AR30
AT30
AN30
AP30
AL30
AM30
AV31
AW31
AU31
AT31
AP31
AR31
AM31
AN31
AY32
AY33
AU32
AV32
AP32
AR32
AW33
AV33
AT33
AU33
AP33
AR33
AN32
AW34
AY34
AV34
AU34
AR34
AT34
XC2VP70
XC2VP100
XC2VP125
IO_L30N_5
IO_L30P_5
IO_L29N_5
IO_L29P_5
IO_L28N_5
IO_L28P_5
IO_L27N_5/VREF_5
IO_L27P_5
IO_L26N_5
IO_L26P_5
IO_L25N_5
IO_L25P_5
IO_L21N_5
IO_L21P_5
IO_L20N_5
IO_L20P_5
IO_L19N_5
IO_L19P_5
IO_L09N_5/VREF_5
IO_L09P_5
IO_L08N_5
IO_L08P_5
IO_L07N_5/VREF_5
IO_L07P_5
IO_L06N_5/VRP_5
IO_L06P_5/VRN_5
IO_L05_5/No_Pair
IO_L03N_5/D4
IO_L03P_5/D5
IO_L02N_5/D6
IO_L02P_5/D7
IO_L01N_5/RDWR_B
IO_L01P_5/CS_B
6
6
IO_L01P_6/VRN_6
IO_L01N_6/VRP_6
AW37
AV37
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
221
Product Specification
1-800-255-7778
R
FF1704 Flip-Chip Fine-Pitch BGA Package
Table 13: FF1704 — XC2VP70, XC2VP100, and XC2VP125
No Connects
XC2VP100
Bank
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Pin Description
IO_L02P_6
IO_L02N_6
IO_L03P_6
IO_L03N_6/VREF_6
IO_L04P_6
IO_L04N_6
IO_L05P_6
IO_L05N_6
IO_L06P_6
IO_L06N_6
IO_L73P_6
IO_L73N_6
IO_L74P_6
IO_L74N_6
IO_L75P_6
IO_L75N_6/VREF_6
IO_L76P_6
IO_L76N_6
IO_L77P_6
IO_L77N_6
IO_L78P_6
IO_L78N_6
IO_L79P_6
IO_L79N_6
IO_L80P_6
IO_L80N_6
IO_L81P_6
IO_L81N_6/VREF_6
IO_L82P_6
IO_L82N_6
IO_L83P_6
IO_L83N_6
IO_L84P_6
IO_L84N_6
IO_L07P_6
IO_L07N_6
IO_L08P_6
Pin Number
AW36
AV36
AY37
AY38
AU36
AT37
AU35
AT35
AW41
AW42
AV41
AV42
AW40
AV40
AU39
AU40
AU41
AU42
AT39
AT40
AT41
AT42
AR38
AR39
AR37
AT38
AR40
AR41
AP36
AP37
AP35
AR36
AP38
AP39
AP41
AP42
AN35
XC2VP70
XC2VP125
222
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 13: FF1704 — XC2VP70, XC2VP100, and XC2VP125
Bank
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Pin Description
IO_L08N_6
IO_L09P_6
IO_L09N_6/VREF_6
IO_L10P_6
IO_L10N_6
IO_L11P_6
IO_L11N_6
IO_L12P_6
IO_L12N_6
IO_L13P_6
IO_L13N_6
IO_L14P_6
IO_L14N_6
IO_L15P_6
IO_L15N_6/VREF_6
IO_L16P_6
IO_L16N_6
IO_L17P_6
IO_L17N_6
IO_L18P_6
IO_L18N_6
IO_L19P_6
IO_L19N_6
IO_L20P_6
IO_L20N_6
IO_L21P_6
IO_L21N_6/VREF_6
IO_L22P_6
IO_L22N_6
IO_L23P_6
IO_L23N_6
IO_L24P_6
IO_L24N_6
IO_L25P_6
IO_L25N_6
IO_L26P_6
IO_L26N_6
Pin Number
AN36
AN37
AN38
AN41
AN42
AM33
AN34
AM36
AM37
AM38
AM39
AM34
AM35
AN40
AM40
AM41
AM42
AL33
AL34
AL35
AL36
AL38
AL39
AL31
AL32
AL40
AL41
AK35
AK36
AK33
AK34
AK37
AK38
AK39
AK40
AK31
AK32
XC2VP70
XC2VP100
XC2VP125
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
223
Product Specification
1-800-255-7778
R
FF1704 Flip-Chip Fine-Pitch BGA Package
Table 13: FF1704 — XC2VP70, XC2VP100, and XC2VP125
No Connects
XC2VP100
Bank
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Pin Description
IO_L27P_6
IO_L27N_6/VREF_6
IO_L28P_6
IO_L28N_6
IO_L29P_6
IO_L29N_6
IO_L30P_6
IO_L30N_6
IO_L31P_6
IO_L31N_6
IO_L32P_6
IO_L32N_6
IO_L33P_6
IO_L33N_6/VREF_6
IO_L34P_6
IO_L34N_6
IO_L35P_6
IO_L35N_6
IO_L36P_6
IO_L36N_6
IO_L37P_6
IO_L37N_6
IO_L38P_6
IO_L38N_6
IO_L39P_6
IO_L39N_6/VREF_6
IO_L40P_6
IO_L40N_6
IO_L41P_6
IO_L41N_6
IO_L42P_6
IO_L42N_6
IO_L43P_6
IO_L43N_6
IO_L44P_6
IO_L44N_6
IO_L45P_6
Pin Number
AK41
AK42
AJ35
XC2VP70
XC2VP125
AJ36
AJ33
AJ34
AJ37
AJ38
AJ41
AJ42
AJ31
AJ32
AH33
AH34
AH37
AH38
AH31
AH32
AJ40
AH40
AH41
AH42
AH35
AG35
AG36
AG37
AG38
AG39
AG32
AG33
AG40
AG41
AF33
AF34
AF35
AF36
AF37
224
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 13: FF1704 — XC2VP70, XC2VP100, and XC2VP125
Bank
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Pin Description
IO_L45N_6/VREF_6
IO_L46P_6
Pin Number
AF38
AF39
AF40
AF31
AG31
AF41
AF42
AE35
AE36
AE31
AF32
AE38
AE39
AE41
AE42
AE32
AE33
AD35
AD36
AD37
AD38
AD31
AD32
AD39
AD40
AD41
AD42
AD33
AD34
AC33
AC34
AC36
AC37
AC31
AC32
AC39
AC40
XC2VP70
XC2VP100
XC2VP125
IO_L46N_6
IO_L47P_6
IO_L47N_6
IO_L48P_6
IO_L48N_6
IO_L49P_6
IO_L49N_6
IO_L50P_6
IO_L50N_6
IO_L51P_6
IO_L51N_6/VREF_6
IO_L52P_6
IO_L52N_6
IO_L53P_6
IO_L53N_6
IO_L54P_6
IO_L54N_6
IO_L55P_6
IO_L55N_6
IO_L56P_6
IO_L56N_6
IO_L57P_6
IO_L57N_6/VREF_6
IO_L58P_6
IO_L58N_6
IO_L59P_6
IO_L59N_6
IO_L60P_6
IO_L60N_6
IO_L85P_6
IO_L85N_6
IO_L86P_6
IO_L86N_6
IO_L87P_6
IO_L87N_6/VREF_6
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
225
Product Specification
1-800-255-7778
R
FF1704 Flip-Chip Fine-Pitch BGA Package
Table 13: FF1704 — XC2VP70, XC2VP100, and XC2VP125
No Connects
XC2VP100
Bank
Pin Description
IO_L88P_6
IO_L88N_6
IO_L89P_6
IO_L89N_6
IO_L90P_6
IO_L90N_6
Pin Number
AB33
XC2VP70
XC2VP125
6
6
6
6
6
6
AB34
AB36
AB37
AB39
AB40
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
IO_L90P_7
IO_L90N_7
IO_L89P_7
IO_L89N_7
IO_L88P_7
IO_L88N_7/VREF_7
IO_L87P_7
IO_L87N_7
IO_L86P_7
IO_L86N_7
IO_L85P_7
IO_L85N_7
IO_L60P_7
IO_L60N_7
IO_L59P_7
IO_L59N_7
IO_L58P_7
IO_L58N_7/VREF_7
IO_L57P_7
IO_L57N_7
IO_L56P_7
IO_L56N_7
IO_L55P_7
IO_L55N_7
IO_L54P_7
IO_L54N_7
IO_L53P_7
IO_L53N_7
IO_L52P_7
IO_L52N_7/VREF_7
AA39
AA40
AB31
AA31
AA36
AA37
AA33
AA34
Y31
Y32
Y39
Y40
Y36
Y37
Y33
Y34
W41
W42
W39
W40
W31
W32
W37
W38
W35
W36
W33
W34
V41
V42
226
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 13: FF1704 — XC2VP70, XC2VP100, and XC2VP125
Bank
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
Pin Description
IO_L51P_7
IO_L51N_7
IO_L50P_7
IO_L50N_7
IO_L49P_7
IO_L49N_7
IO_L48P_7
IO_L48N_7
IO_L47P_7
IO_L47N_7
IO_L46P_7
IO_L46N_7/VREF_7
IO_L45P_7
IO_L45N_7
IO_L44P_7
IO_L44N_7
IO_L43P_7
IO_L43N_7
IO_L42P_7
IO_L42N_7
IO_L41P_7
IO_L41N_7
IO_L40P_7
IO_L40N_7/VREF_7
IO_L39P_7
IO_L39N_7
IO_L38P_7
IO_L38N_7
IO_L37P_7
IO_L37N_7
IO_L36P_7
IO_L36N_7
IO_L35P_7
IO_L35N_7
IO_L34P_7
IO_L34N_7/VREF_7
IO_L33P_7
Pin Number
V38
V39
V31
U32
V35
V36
V32
V33
U31
T31
XC2VP70
XC2VP100
XC2VP125
U41
U42
U39
U40
U33
U34
U37
U38
U35
U36
T32
T33
T40
T41
T38
T39
R35
T35
T36
T37
R31
R32
R41
R42
R40
P40
R37
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
227
Product Specification
1-800-255-7778
R
FF1704 Flip-Chip Fine-Pitch BGA Package
Table 13: FF1704 — XC2VP70, XC2VP100, and XC2VP125
No Connects
XC2VP100
Bank
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
Pin Description
IO_L33N_7
IO_L32P_7
IO_L32N_7
IO_L31P_7
IO_L31N_7
IO_L30P_7
IO_L30N_7
IO_L29P_7
IO_L29N_7
IO_L28P_7
IO_L28N_7/VREF_7
IO_L27P_7
IO_L27N_7
IO_L26P_7
IO_L26N_7
IO_L25P_7
IO_L25N_7
IO_L24P_7
IO_L24N_7
IO_L23P_7
IO_L23N_7
IO_L22P_7
IO_L22N_7/VREF_7
IO_L21P_7
IO_L21N_7
IO_L20P_7
IO_L20N_7
IO_L19P_7
IO_L19N_7
IO_L18P_7
IO_L18N_7
IO_L17P_7
IO_L17N_7
IO_L16P_7
IO_L16N_7/VREF_7
IO_L15P_7
IO_L15N_7
Pin Number
R38
R33
R34
P41
P42
P37
P38
P31
P32
P35
P36
P33
P34
N31
N32
N41
N42
N39
N40
N33
N34
N37
N38
N35
N36
M38
M39
M40
M41
M33
M34
M31
M32
M35
M36
L41
XC2VP70
XC2VP125
L42
228
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 13: FF1704 — XC2VP70, XC2VP100, and XC2VP125
Bank
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
Pin Description
IO_L14P_7
IO_L14N_7
IO_L13P_7
IO_L13N_7
IO_L12P_7
IO_L12N_7
IO_L11P_7
IO_L11N_7
IO_L10P_7
IO_L10N_7/VREF_7
IO_L09P_7
IO_L09N_7
IO_L08P_7
IO_L08N_7
IO_L07P_7
IO_L07N_7
IO_L84P_7
IO_L84N_7
IO_L83P_7
IO_L83N_7
IO_L82P_7
IO_L82N_7/VREF_7
IO_L81P_7
IO_L81N_7
IO_L80P_7
IO_L80N_7
IO_L79P_7
IO_L79N_7
IO_L78P_7
IO_L78N_7
IO_L77P_7
IO_L77N_7
IO_L76P_7
IO_L76N_7/VREF_7
IO_L75P_7
IO_L75N_7
IO_L74P_7
Pin Number
L39
XC2VP70
XC2VP100
XC2VP125
L38
L40
K40
L36
L37
L34
L35
K42
K41
K36
K35
K38
K37
L33
K34
J41
J42
J39
J38
J36
J37
J35
H36
H41
H40
H38
H39
H37
G38
G42
G41
G39
G40
F41
F42
F40
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
229
Product Specification
1-800-255-7778
R
FF1704 Flip-Chip Fine-Pitch BGA Package
Table 13: FF1704 — XC2VP70, XC2VP100, and XC2VP125
No Connects
XC2VP100
Bank
Pin Description
IO_L74N_7
Pin Number
F39
XC2VP70
XC2VP125
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
IO_L73P_7
E41
IO_L73N_7
E42
IO_L06P_7
D41
IO_L06N_7
D42
IO_L05P_7
E40
IO_L05N_7
D40
IO_L04P_7
F36
IO_L04N_7/VREF_7
IO_L03P_7
G37
D37
IO_L03N_7
E37
IO_L02P_7
D36
IO_L02N_7
E36
IO_L01P_7/VRN_7
IO_L01N_7/VRP_7
C37
C38
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
D25
G23
G28
G32
J25
J29
P22
P23
P24
P25
P26
R22
R23
R24
R25
R21
R20
R19
R18
P21
P20
230
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 13: FF1704 — XC2VP70, XC2VP100, and XC2VP125
Bank
1
1
1
1
1
1
1
1
1
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
3
3
3
3
3
3
3
Pin Description
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
Pin Number
P19
P18
P17
J18
XC2VP70
XC2VP100
XC2VP125
J14
G20
G15
G11
D18
AA15
AA14
Y15
Y14
Y8
Y5
W15
W14
V15
V14
V3
U15
U14
T15
T14
R14
T9
P4
M6
J3
F5
AU5
AP3
AL6
AJ4
AH14
AG15
AG14
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
231
Product Specification
1-800-255-7778
R
FF1704 Flip-Chip Fine-Pitch BGA Package
Table 13: FF1704 — XC2VP70, XC2VP100, and XC2VP125
No Connects
XC2VP100
Bank
3
3
3
3
3
3
3
3
3
3
3
3
3
3
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
5
5
5
5
5
5
5
5
Pin Description
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
Pin Number
AG9
XC2VP70
XC2VP125
AF15
AF14
AE15
AE14
AE3
AD15
AD14
AC15
AC14
AC8
AC5
AB15
AB14
AW18
AT20
AT15
AT11
AP18
AP14
AJ21
AJ20
AJ19
AJ18
AJ17
AH21
AH20
AH19
AH18
AW25
AT32
AT28
AT23
AP29
AP25
AJ26
AJ25
232
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 13: FF1704 — XC2VP70, XC2VP100, and XC2VP125
Bank
5
5
5
5
5
5
5
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
7
7
7
7
7
7
7
7
7
Pin Description
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
Pin Number
AJ24
AJ23
AJ22
AH25
AH24
AH23
AH22
AU38
AP40
AL37
AJ39
AH29
AG34
AG29
AG28
AF29
AF28
AE40
AE29
AE28
AD29
AD28
AC38
AC35
AC29
AC28
AB29
AB28
AA29
AA28
Y38
XC2VP70
XC2VP100
XC2VP125
Y35
Y29
Y28
W29
W28
V40
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
233
Product Specification
1-800-255-7778
R
FF1704 Flip-Chip Fine-Pitch BGA Package
Table 13: FF1704 — XC2VP70, XC2VP100, and XC2VP125
No Connects
XC2VP100
Bank
Pin Description
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
Pin Number
V29
XC2VP70
XC2VP125
7
7
7
7
7
7
7
7
7
7
7
7
V28
U29
U28
T34
T29
T28
R29
P39
M37
J40
F38
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
CCLK
PROG_B
DONE
AY7
G35
AW8
AV35
AY36
AW35
G8
M0
M1
M2
TCK
TDI
C36
C7
TDO
TMS
F8
PWRDWN_B
HSWAP_EN
RSVD
AV8
F35
D8
VBATT
E8
DXP
E35
D35
B40
B41
A41
A40
C39
A39
A38
B39
DXN
AVCCAUXTX2
VTTXPAD2
TXNPAD2
TXPPAD2
GNDA2
RXPPAD2
RXNPAD2
VTRXPAD2
234
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 13: FF1704 — XC2VP70, XC2VP100, and XC2VP125
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
AVCCAUXRX2
AVCCAUXTX3
VTTXPAD3
TXNPAD3
Pin Number
B38
B36
B37
A37
A36
C35
A35
A34
B35
B34
B32
B33
A33
A32
C31
A31
A30
B31
B30
B28
B29
A29
A28
C27
A27
A26
B27
B26
B24
B25
A25
A24
C22
A23
A22
B23
B22
XC2VP70
XC2VP100
XC2VP125
TXPPAD3
GNDA3
RXPPAD3
RXNPAD3
VTRXPAD3
AVCCAUXRX3
AVCCAUXTX4
VTTXPAD4
TXNPAD4
TXPPAD4
GNDA4
RXPPAD4
RXNPAD4
VTRXPAD4
AVCCAUXRX4
AVCCAUXTX5
VTTXPAD5
TXNPAD5
TXPPAD5
GNDA5
RXPPAD5
RXNPAD5
VTRXPAD5
AVCCAUXRX5
AVCCAUXTX6
VTTXPAD6
TXNPAD6
TXPPAD6
GNDA6
RXPPAD6
RXNPAD6
VTRXPAD6
AVCCAUXRX6
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
235
Product Specification
1-800-255-7778
R
FF1704 Flip-Chip Fine-Pitch BGA Package
Table 13: FF1704 — XC2VP70, XC2VP100, and XC2VP125
No Connects
XC2VP100
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
AVCCAUXTX7
VTTXPAD7
TXNPAD7
Pin Number
B20
B21
A21
A20
C21
A19
A18
B19
B18
B16
B17
A17
A16
C16
A15
A14
B15
B14
B12
B13
A13
A12
C12
A11
A10
B11
B10
B8
XC2VP70
XC2VP125
TXPPAD7
GNDA7
RXPPAD7
RXNPAD7
VTRXPAD7
AVCCAUXRX7
AVCCAUXTX8
VTTXPAD8
TXNPAD8
TXPPAD8
GNDA8
RXPPAD8
RXNPAD8
VTRXPAD8
AVCCAUXRX8
AVCCAUXTX9
VTTXPAD9
TXNPAD9
TXPPAD9
GNDA9
RXPPAD9
RXNPAD9
VTRXPAD9
AVCCAUXRX9
AVCCAUXTX10
VTTXPAD10
TXNPAD10
TXPPAD10
GNDA10
B9
A9
A8
C8
RXPPAD10
RXNPAD10
VTRXPAD10
AVCCAUXRX10
AVCCAUXTX11
A7
A6
B7
B6
B4
236
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 13: FF1704 — XC2VP70, XC2VP100, and XC2VP125
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
VTTXPAD11
TXNPAD11
Pin Number
B5
XC2VP70
XC2VP100
XC2VP125
A5
TXPPAD11
A4
GNDA11
C4
RXPPAD11
A3
RXNPAD11
VTRXPAD11
AVCCAUXRX11
AVCCAUXRX14
VTRXPAD14
RXNPAD14
RXPPAD14
GNDA14
A2
B3
B2
BA2
BA3
BB2
BB3
AY4
BB4
BB5
BA5
BA4
BA6
BA7
BB6
BB7
AY8
BB8
BB9
BA9
BA8
BA10
BA11
BB10
BB11
AY12
BB12
BB13
BA13
BA12
BA14
BA15
TXPPAD14
TXNPAD14
VTTXPAD14
AVCCAUXTX14
AVCCAUXRX15
VTRXPAD15
RXNPAD15
RXPPAD15
GNDA15
TXPPAD15
TXNPAD15
VTTXPAD15
AVCCAUXTX15
AVCCAUXRX16
VTRXPAD16
RXNPAD16
RXPPAD16
GNDA16
TXPPAD16
TXNPAD16
VTTXPAD16
AVCCAUXTX16
AVCCAUXRX17
VTRXPAD17
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
237
Product Specification
1-800-255-7778
R
FF1704 Flip-Chip Fine-Pitch BGA Package
Table 13: FF1704 — XC2VP70, XC2VP100, and XC2VP125
No Connects
XC2VP100
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
RXNPAD17
RXPPAD17
GNDA17
Pin Number
BB14
BB15
AY16
BB16
BB17
BA17
BA16
BA18
BA19
BB18
BB19
AY21
BB20
BB21
BA21
BA20
BA22
BA23
BB22
BB23
AY22
BB24
BB25
BA25
BA24
BA26
BA27
BB26
BB27
AY27
BB28
BB29
BA29
BA28
BA30
BA31
BB30
XC2VP70
XC2VP125
TXPPAD17
TXNPAD17
VTTXPAD17
AVCCAUXTX17
AVCCAUXRX18
VTRXPAD18
RXNPAD18
RXPPAD18
GNDA18
TXPPAD18
TXNPAD18
VTTXPAD18
AVCCAUXTX18
AVCCAUXRX19
VTRXPAD19
RXNPAD19
RXPPAD19
GNDA19
TXPPAD19
TXNPAD19
VTTXPAD19
AVCCAUXTX19
AVCCAUXRX20
VTRXPAD20
RXNPAD20
RXPPAD20
GNDA20
TXPPAD20
TXNPAD20
VTTXPAD20
AVCCAUXTX20
AVCCAUXRX21
VTRXPAD21
RXNPAD21
238
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 13: FF1704 — XC2VP70, XC2VP100, and XC2VP125
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
RXPPAD21
GNDA21
Pin Number
BB31
AY31
BB32
BB33
BA33
BA32
BA34
BA35
BB34
BB35
AY35
BB36
BB37
BA37
BA36
BA38
BA39
BB38
BB39
AY39
BB40
BB41
BA41
BA40
XC2VP70
XC2VP100
XC2VP125
TXPPAD21
TXNPAD21
VTTXPAD21
AVCCAUXTX21
AVCCAUXRX22
VTRXPAD22
RXNPAD22
RXPPAD22
GNDA22
TXPPAD22
TXNPAD22
VTTXPAD22
AVCCAUXTX22
AVCCAUXRX23
VTRXPAD23
RXNPAD23
RXPPAD23
GNDA23
TXPPAD23
TXNPAD23
VTTXPAD23
AVCCAUXTX23
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
AB27
AB16
AC27
AC16
AD27
AD16
AE27
AE16
AF27
AF26
AF17
AF16
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
239
Product Specification
1-800-255-7778
R
FF1704 Flip-Chip Fine-Pitch BGA Package
Table 13: FF1704 — XC2VP70, XC2VP100, and XC2VP125
No Connects
XC2VP100
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
Pin Number
AG27
AG26
AG25
AG24
AG23
AG22
AG21
AG20
AG19
AG18
AG17
AG16
AH28
AH27
AH26
AH17
AH16
AH15
AJ29
AJ28
AJ27
AJ16
AJ15
AJ14
AK30
AK13
AA27
AA16
Y27
XC2VP70
XC2VP125
Y16
W27
W16
V27
V16
U27
U26
U17
240
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 13: FF1704 — XC2VP70, XC2VP100, and XC2VP125
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
Pin Number
U16
T27
XC2VP70
XC2VP100
XC2VP125
T26
T25
T24
T23
T22
T21
T20
T19
T18
T17
T16
R28
R27
R26
R17
R16
R15
P29
P28
P27
P16
P15
P14
N30
N13
AB42
AB41
AB2
AB1
AC42
AC1
AM32
AM11
AN33
AN10
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
241
Product Specification
1-800-255-7778
R
FF1704 Flip-Chip Fine-Pitch BGA Package
Table 13: FF1704 — XC2VP70, XC2VP100, and XC2VP125
No Connects
XC2VP100
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
GND
Pin Number
AV39
AV4
XC2VP70
XC2VP125
AW38
AW22
AW21
AW5
AA42
AA41
AA2
AA1
Y42
Y1
L32
L11
K33
K10
E39
E4
D38
D22
D21
D5
AB38
AB35
AB32
AB26
AB25
AB24
AB23
AB22
AB21
AB20
AB19
AB18
AB17
AB11
AB8
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
242
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 13: FF1704 — XC2VP70, XC2VP100, and XC2VP125
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Pin Number
AB5
XC2VP70
XC2VP100
XC2VP125
AC41
AC26
AC25
AC24
AC23
AC22
AC21
AC20
AC19
AC18
AC17
AC2
AD26
AD25
AD24
AD23
AD22
AD21
AD20
AD19
AD18
AD17
AE37
AE34
AE26
AE25
AE24
AE23
AE22
AE21
AE20
AE19
AE18
AE17
AE9
AE6
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
243
Product Specification
1-800-255-7778
R
FF1704 Flip-Chip Fine-Pitch BGA Package
Table 13: FF1704 — XC2VP70, XC2VP100, and XC2VP125
No Connects
XC2VP100
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Pin Number
AF25
AF24
AF23
AF22
AF21
AF20
AF19
AF18
AG42
AG1
XC2VP70
XC2VP125
AH39
AH36
AH7
AH4
AL42
AL1
AM22
AM21
AN39
AN4
AP34
AP9
AR42
AR35
AR22
AR21
AR8
AR1
AT36
AT7
AU37
AU25
AU18
AU6
AV38
AV22
AV21
244
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 13: FF1704 — XC2VP70, XC2VP100, and XC2VP125
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Pin Number
AV5
XC2VP70
XC2VP100
XC2VP125
AW39
AW32
AW28
AW15
AW11
AW4
AY42
AY41
AY40
AY3
AY2
AY1
BA42
BA1
AA38
AA35
AA32
AA26
AA25
AA24
AA23
AA22
AA21
AA20
AA19
AA18
AA17
AA11
AA8
AA5
Y41
Y26
Y25
Y24
Y23
Y22
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
245
Product Specification
1-800-255-7778
R
FF1704 Flip-Chip Fine-Pitch BGA Package
Table 13: FF1704 — XC2VP70, XC2VP100, and XC2VP125
No Connects
XC2VP100
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Pin Number
Y21
Y20
Y19
Y18
Y17
Y2
XC2VP70
XC2VP125
W26
W25
W24
W23
W22
W21
W20
W19
W18
W17
V37
V34
V26
V25
V24
V23
V22
V21
V20
V19
V18
V17
V9
V6
U25
U24
U23
U22
U21
U20
U19
246
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 13: FF1704 — XC2VP70, XC2VP100, and XC2VP125
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Pin Number
U18
T42
T1
XC2VP70
XC2VP100
XC2VP125
R39
R36
R7
R4
M42
M1
L22
L21
K39
K4
J34
J9
H42
H35
H22
H21
H8
H1
G36
G7
F37
F25
F18
F6
E38
E22
E21
E5
D39
D32
D28
D15
D11
D4
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
247
Product Specification
1-800-255-7778
R
FF1704 Flip-Chip Fine-Pitch BGA Package
Table 13: FF1704 — XC2VP70, XC2VP100, and XC2VP125
No Connects
XC2VP100
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
GND
Pin Number
C42
XC2VP70
XC2VP125
GND
C41
GND
C40
GND
C3
GND
C2
GND
C1
GND
B42
GND
B1
GND
N14
GND
N29
GND
AK14
AK29
P13
GND
GND
GND
P30
GND
AJ13
AJ30
GND
Notes:
1. See Table 4 for an explanation of the signals available on this pin.
248
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
FF1704 Flip-Chip Fine-Pitch BGA Package Specifications (1.00mm pitch)
Figure 9: FF1704 Flip-Chip Fine-Pitch BGA Package Specifications
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
249
Product Specification
1-800-255-7778
R
FF1696 Flip-Chip Fine-Pitch BGA Package
FF1696 Flip-Chip Fine-Pitch BGA Package
As shown in Table 14, XC2VP100 and XC2VP125 Virtex-II Pro devices are available in the FF1696 flip-chip fine-pitch BGA
package. Following this table are the FF1696 Flip-Chip Fine-Pitch BGA Package Specifications (1.00mm pitch).
Table 14: FF1696 — XC2VP100 and XC2VP125
No Connects
Bank
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Pin Description
IO_L01N_0/VRP_0
IO_L01P_0/VRN_0
IO_L02N_0
Pin Number
E33
F33
K32
L32
XC2VP100
XC2VP125
IO_L02P_0
IO_L03N_0
C32
C33
G33
A33
B33
F32
G32
H32
J32
IO_L03P_0/VREF_0
IO_L05_0/No_Pair
IO_L06N_0
IO_L06P_0
IO_L07N_0
IO_L07P_0
IO_L08N_0
IO_L08P_0
IO_L09N_0
D32
E32
A32
B32
K31
L31
IO_L09P_0/VREF_0
IO_L19N_0
IO_L19P_0
IO_L20N_0
IO_L20P_0
IO_L21N_0
H30
G31
E31
F31
IO_L21P_0
IO_L25N_0
IO_L25P_0
IO_L26N_0
H31
J31
IO_L26P_0
IO_L27N_0
D30
D31
B31
C31
K30
L30
IO_L27P_0/VREF_0
IO_L28N_0
IO_L28P_0
IO_L29N_0
IO_L29P_0
IO_L30N_0
F30
G30
B30
IO_L30P_0
IO_L34N_0
250
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 14: FF1696 — XC2VP100 and XC2VP125
Bank
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Pin Description
IO_L34P_0
Pin Number
C30
L29
XC2VP100
XC2VP125
IO_L35N_0
IO_L35P_0
M29
H28
G29
E29
F29
IO_L36N_0
IO_L36P_0/VREF_0
IO_L76N_0
IO_L76P_0
IO_L77N_0
J29
IO_L77P_0
K29
D28
C29
A29
B29
L28
IO_L78N_0
IO_L78P_0
IO_L79N_0
IO_L79P_0
IO_L80_0/No_Pair
IO_L83_0/No_Pair
IO_L84N_0
M28
G27
G28
E28
F28
IO_L84P_0
IO_L85N_0
IO_L85P_0
IO_L86N_0
J28
IO_L86P_0
K28
C27
C28
A28
B28
L27
IO_L87N_0
IO_L87P_0/VREF_0
IO_L37N_0
IO_L37P_0
IO_L38N_0
IO_L38P_0
M27
H26
H27
E27
F27
IO_L39N_0
IO_L39P_0
IO_L43N_0
IO_L43P_0
IO_L44N_0
J27
IO_L44P_0
K27
D26
D27
A27
B27
IO_L45N_0
IO_L45P_0/VREF_0
IO_L10N_0
NC
NC
IO_L10P_0
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
251
R
FF1696 Flip-Chip Fine-Pitch BGA Package
Table 14: FF1696 — XC2VP100 and XC2VP125
No Connects
XC2VP100 XC2VP125
Bank
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Pin Description
IO_L11N_0
Pin Number
M25
M26
F26
G26
B26
C26
G24
G25
K26
L26
NC
NC
NC
NC
NC
NC
IO_L11P_0
IO_L12N_0
IO_L12P_0
IO_L18N_0
IO_L18P_0/VREF_0
IO_L46N_0
IO_L46P_0
IO_L47N_0
IO_L47P_0
IO_L48N_0
E25
F25
IO_L48P_0
IO_L49N_0
C24
C25
L24
IO_L49P_0
IO_L50_0/No_Pair
IO_L53_0/No_Pair
IO_L54N_0
L25
A25
B25
H23
H24
J25
IO_L54P_0
IO_L55N_0
IO_L55P_0
IO_L56N_0
IO_L56P_0
K25
E24
F24
IO_L57N_0
IO_L57P_0/VREF_0
IO_L58N_0
D23
D24
J24
IO_L58P_0
IO_L59N_0
IO_L59P_0
K24
A24
B24
F23
IO_L60N_0
IO_L60P_0
IO_L64N_0
IO_L64P_0
G23
M22
M23
B23
C23
H22
IO_L65N_0
IO_L65P_0
IO_L66N_0
IO_L66P_0/VREF_0
IO_L67N_0
252
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 14: FF1696 — XC2VP100 and XC2VP125
Bank
Pin Description
IO_L67P_0
Pin Number
J22
XC2VP100
XC2VP125
0
0
0
0
0
0
0
0
0
0
0
IO_L68N_0
K23
IO_L68P_0
L23
IO_L69N_0
F22
IO_L69P_0/VREF_0
IO_L73N_0
G22
D22
IO_L73P_0
E22
IO_L74N_0/GCLK7P
IO_L74P_0/GCLK6S
IO_L75N_0/GCLK5P
IO_L75P_0/GCLK4S
K22
L22
B22
C22
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
IO_L75N_1/GCLK3P
IO_L75P_1/GCLK2S
IO_L74N_1/GCLK1P
IO_L74P_1/GCLK0S
IO_L73N_1
C21
B21
L21
K21
E21
D21
G21
F21
L20
K20
J21
IO_L73P_1
IO_L69N_1/VREF_1
IO_L69P_1
IO_L68N_1
IO_L68P_1
IO_L67N_1
IO_L67P_1
H21
C20
B20
M20
M21
G20
F20
B19
A19
K19
J19
IO_L66N_1/VREF_1
IO_L66P_1
IO_L65N_1
IO_L65P_1
IO_L64N_1
IO_L64P_1
IO_L60N_1
IO_L60P_1
IO_L59N_1
IO_L59P_1
IO_L58N_1
D19
D20
F19
IO_L58P_1
IO_L57N_1/VREF_1
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
253
R
FF1696 Flip-Chip Fine-Pitch BGA Package
Table 14: FF1696 — XC2VP100 and XC2VP125
No Connects
XC2VP100 XC2VP125
Bank
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Pin Description
IO_L57P_1
IO_L56N_1
IO_L56P_1
IO_L55N_1
IO_L55P_1
IO_L54N_1
IO_L54P_1
IO_L53_1/No_Pair
IO_L50_1/No_Pair
IO_L49N_1
IO_L49P_1
IO_L48N_1
IO_L48P_1
IO_L47N_1
IO_L47P_1
IO_L46N_1
IO_L46P_1
IO_L18N_1/VREF_1
IO_L18P_1
IO_L12N_1
IO_L12P_1
IO_L11N_1
IO_L11P_1
Pin Number
E19
K18
J18
H19
H20
B18
A18
L18
L19
C18
C19
F18
E18
L17
K17
G18
G19
C17
B17
G17
F17
M17
M18
B16
A16
D16
D17
K16
J16
NC
NC
NC
NC
NC
NC
NC
NC
IO_L10N_1
IO_L10P_1
IO_L45N_1/VREF_1
IO_L45P_1
IO_L44N_1
IO_L44P_1
IO_L43N_1
IO_L43P_1
IO_L39N_1
IO_L39P_1
IO_L38N_1
IO_L38P_1
IO_L37N_1
IO_L37P_1
F16
E16
H16
H17
M16
L16
B15
A15
254
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 14: FF1696 — XC2VP100 and XC2VP125
Bank
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Pin Description
IO_L87N_1/VREF_1
IO_L87P_1
Pin Number
C15
C16
K15
J15
XC2VP100
XC2VP125
IO_L86N_1
IO_L86P_1
IO_L85N_1
F15
E15
G15
G16
M15
L15
IO_L85P_1
IO_L84N_1
IO_L84P_1
IO_L83_1/No_Pair
IO_L80_1/No_Pair
IO_L79N_1
B14
A14
C14
D15
K14
J14
IO_L79P_1
IO_L78N_1
IO_L78P_1
IO_L77N_1
IO_L77P_1
IO_L76N_1
F14
E14
G14
H15
M14
L14
IO_L76P_1
IO_L36N_1/VREF_1
IO_L36P_1
IO_L35N_1
IO_L35P_1
IO_L34N_1
C13
B13
G13
F13
L13
IO_L34P_1
IO_L30N_1
IO_L30P_1
IO_L29N_1
IO_L29P_1
K13
C12
B12
D12
D13
J12
IO_L28N_1
IO_L28P_1
IO_L27N_1/VREF_1
IO_L27P_1
IO_L26N_1
IO_L26P_1
H12
F12
E12
G12
IO_L25N_1
IO_L25P_1
IO_L21N_1
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
255
R
FF1696 Flip-Chip Fine-Pitch BGA Package
Table 14: FF1696 — XC2VP100 and XC2VP125
No Connects
XC2VP100 XC2VP125
Bank
1
Pin Description
IO_L21P_1
Pin Number
H13
L12
1
IO_L20N_1
1
IO_L20P_1
K12
B11
1
IO_L19N_1
1
IO_L19P_1
A11
1
IO_L09N_1/VREF_1
IO_L09P_1
E11
1
D11
J11
1
IO_L08N_1
1
IO_L08P_1
H11
G11
F11
1
IO_L07N_1
1
IO_L07P_1
1
IO_L06N_1
B10
A10
G10
C10
C11
L11
1
IO_L06P_1
1
IO_L05_1/No_Pair
IO_L03N_1/VREF_1
IO_L03P_1
1
1
1
IO_L02N_1
1
IO_L02P_1
K11
1
IO_L01N_1/VRP_1
IO_L01P_1/VRN_1
F10
1
E10
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
IO_L01N_2/VRP_2
IO_L01P_2/VRN_2
IO_L02N_2
B8
A8
C9
B9
B7
A7
B6
A6
D8
D9
B4
A4
C7
C8
G9
F9
IO_L02P_2
IO_L03N_2
IO_L03P_2
IO_L04N_2/VREF_2
IO_L04P_2
IO_L05N_2
IO_L05P_2
IO_L06N_2
IO_L06P_2
IO_L73N_2
IO_L73P_2
IO_L74N_2
IO_L74P_2
256
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 14: FF1696 — XC2VP100 and XC2VP125
Bank
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
Pin Description
IO_L75N_2
IO_L75P_2
IO_L76N_2/VREF_2
IO_L76P_2
IO_L77N_2
IO_L77P_2
IO_L78N_2
IO_L78P_2
IO_L79N_2
IO_L79P_2
IO_L80N_2
IO_L80P_2
IO_L81N_2
IO_L81P_2
IO_L82N_2/VREF_2
IO_L82P_2
IO_L83N_2
IO_L83P_2
IO_L84N_2
IO_L84P_2
IO_L61N_2
IO_L61P_2
IO_L62N_2
IO_L62P_2
IO_L63N_2
IO_L63P_2
IO_L64N_2/VREF_2
IO_L64P_2
IO_L65N_2
IO_L65P_2
IO_L66N_2
IO_L66P_2
IO_L67N_2
IO_L67P_2
IO_L68N_2
IO_L68P_2
IO_L69N_2
Pin Number
C5
XC2VP100
XC2VP125
B5
D7
C6
H8
H9
C3
C4
D1
D2
J8
K9
E6
D5
E4
D4
L8
L9
E3
D3
F8
E8
M8
M9
F7
E7
F3
E2
N12
P12
F1
F2
G7
G8
N10
N11
G6
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
257
R
FF1696 Flip-Chip Fine-Pitch BGA Package
Table 14: FF1696 — XC2VP100 and XC2VP125
No Connects
XC2VP100 XC2VP125
Bank
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
Pin Description
IO_L69P_2
IO_L70N_2/VREF_2
IO_L70P_2
IO_L71N_2
IO_L71P_2
IO_L72N_2
IO_L72P_2
IO_L07N_2
IO_L07P_2
IO_L08N_2
IO_L08P_2
IO_L09N_2
IO_L09P_2
IO_L10N_2/VREF_2
IO_L10P_2
IO_L11N_2
IO_L11P_2
IO_L12N_2
IO_L12P_2
IO_L13N_2
IO_L13P_2
IO_L14N_2
IO_L14P_2
IO_L15N_2
IO_L15P_2
IO_L16N_2/VREF_2
IO_L16P_2
IO_L17N_2
IO_L17P_2
IO_L18N_2
IO_L18P_2
IO_L19N_2
IO_L19P_2
IO_L20N_2
IO_L20P_2
IO_L21N_2
IO_L21P_2
Pin Number
F6
G5
F5
P10
P11
G3
G4
G1
G2
N8
P9
H6
H7
H4
H5
R12
T12
H2
H3
J6
J7
R10
R11
J3
J4
J2
H1
R8
R9
K5
K6
K1
K2
T10
T11
L7
K7
258
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 14: FF1696 — XC2VP100 and XC2VP125
Bank
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
Pin Description
IO_L22N_2/VREF_2
IO_L22P_2
Pin Number
L4
XC2VP100
XC2VP125
L5
IO_L23N_2
IO_L23P_2
T8
T9
IO_L24N_2
IO_L24P_2
L3
K3
IO_L25N_2
IO_L25P_2
L1
L2
IO_L26N_2
IO_L26P_2
U12
V12
M7
L6
IO_L27N_2
IO_L27P_2
IO_L28N_2/VREF_2
IO_L28P_2
M5
M6
U10
U11
M3
M4
N6
IO_L29N_2
IO_L29P_2
IO_L30N_2
IO_L30P_2
IO_L31N_2
IO_L31P_2
N7
IO_L32N_2
IO_L32P_2
U7
U8
IO_L33N_2
IO_L33P_2
N3
N4
IO_L34N_2/VREF_2
IO_L34P_2
N2
M2
V10
V11
P6
IO_L35N_2
IO_L35P_2
IO_L36N_2
IO_L36P_2
P7
IO_L37N_2
IO_L37P_2
P1
P2
IO_L38N_2
IO_L38P_2
V8
V9
IO_L39N_2
IO_L39P_2
R6
P5
IO_L40N_2/VREF_2
R4
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
259
R
FF1696 Flip-Chip Fine-Pitch BGA Package
Table 14: FF1696 — XC2VP100 and XC2VP125
No Connects
XC2VP100 XC2VP125
Bank
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
Pin Description
IO_L40P_2
IO_L41N_2
IO_L41P_2
IO_L42N_2
IO_L42P_2
IO_L43N_2
IO_L43P_2
IO_L44N_2
IO_L44P_2
IO_L45N_2
IO_L45P_2
IO_L46N_2/VREF_2
IO_L46P_2
IO_L47N_2
IO_L47P_2
IO_L48N_2
IO_L48P_2
IO_L49N_2
IO_L49P_2
IO_L50N_2
IO_L50P_2
IO_L51N_2
IO_L51P_2
IO_L52N_2/VREF_2
IO_L52P_2
IO_L53N_2
IO_L53P_2
IO_L54N_2
IO_L54P_2
IO_L55N_2
IO_L55P_2
IO_L56N_2
IO_L56P_2
IO_L57N_2
IO_L57P_2
IO_L58N_2/VREF_2
IO_L58P_2
Pin Number
R5
V6
V7
R3
P3
R1
R2
W10
W11
T7
R7
T4
T5
W9
Y10
T1
T2
U6
T6
W7
Y8
U4
T3
U2
U3
Y11
Y12
V4
V5
V1
V2
Y6
Y7
W5
W6
W3
V3
260
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 14: FF1696 — XC2VP100 and XC2VP125
Bank
Pin Description
IO_L59N_2
IO_L59P_2
IO_L60N_2
IO_L60P_2
IO_L85N_2
IO_L85P_2
IO_L86N_2
IO_L86P_2
IO_L87N_2
IO_L87P_2
IO_L88N_2/VREF_2
IO_L88P_2
IO_L89N_2
IO_L89P_2
IO_L90N_2
IO_L90P_2
Pin Number
AA11
AA12
W1
XC2VP100
XC2VP125
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
W2
Y2
Y3
AA9
AA10
AA5
AA6
AA4
Y4
AA7
AA8
AA2
AA3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
IO_L90N_3
IO_L90P_3
AB5
AB6
AB11
AB12
AB2
AB3
AB4
AC4
AB9
AB10
AC2
AC3
AD5
AD6
AB7
AB8
AD1
AD2
AE4
AE5
IO_L89N_3
IO_L89P_3
IO_L88N_3
IO_L88P_3
IO_L87N_3/VREF_3
IO_L87P_3
IO_L86N_3
IO_L86P_3
IO_L85N_3
IO_L85P_3
IO_L60N_3
IO_L60P_3
IO_L59N_3
IO_L59P_3
IO_L58N_3
IO_L58P_3
IO_L57N_3/VREF_3
IO_L57P_3
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
261
R
FF1696 Flip-Chip Fine-Pitch BGA Package
Table 14: FF1696 — XC2VP100 and XC2VP125
No Connects
XC2VP100 XC2VP125
Bank
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
Pin Description
IO_L56N_3
IO_L56P_3
IO_L55N_3
IO_L55P_3
IO_L54N_3
IO_L54P_3
IO_L53N_3
IO_L53P_3
IO_L52N_3
IO_L52P_3
IO_L51N_3/VREF_3
IO_L51P_3
IO_L50N_3
IO_L50P_3
IO_L49N_3
IO_L49P_3
IO_L48N_3
IO_L48P_3
IO_L47N_3
IO_L47P_3
IO_L46N_3
IO_L46P_3
IO_L45N_3/VREF_3
IO_L45P_3
IO_L44N_3
IO_L44P_3
IO_L43N_3
IO_L43P_3
IO_L42N_3
IO_L42P_3
IO_L41N_3
IO_L41P_3
IO_L40N_3
IO_L40P_3
IO_L39N_3/VREF_3
IO_L39P_3
IO_L38N_3
Pin Number
AC11
AC12
AD3
AE3
AE1
AE2
AC6
AC7
AF2
AF3
AF6
AG6
AD10
AD11
AG4
AG5
AF4
AG3
AC10
AD9
AG1
AG2
AG7
AH7
AC8
AD7
AH4
AH5
AH1
AH2
AE10
AE11
AJ6
AJ7
AH6
AJ5
AE8
262
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 14: FF1696 — XC2VP100 and XC2VP125
Bank
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
Pin Description
IO_L38P_3
IO_L37N_3
IO_L37P_3
IO_L36N_3
IO_L36P_3
IO_L35N_3
IO_L35P_3
IO_L34N_3
IO_L34P_3
IO_L33N_3/VREF_3
IO_L33P_3
IO_L32N_3
IO_L32P_3
IO_L31N_3
IO_L31P_3
IO_L30N_3
IO_L30P_3
IO_L29N_3
IO_L29P_3
IO_L28N_3
IO_L28P_3
IO_L27N_3/VREF_3
IO_L27P_3
IO_L26N_3
IO_L26P_3
IO_L25N_3
IO_L25P_3
IO_L24N_3
IO_L24P_3
IO_L23N_3
IO_L23P_3
IO_L22N_3
IO_L22P_3
IO_L21N_3/VREF_3
IO_L21P_3
IO_L20N_3
IO_L20P_3
Pin Number
AE9
AH3
AJ3
XC2VP100
XC2VP125
AJ1
AJ2
AE6
AE7
AK6
AK7
AK3
AK4
AE12
AF12
AL5
AL6
AL3
AL4
AF10
AF11
AK2
AL2
AL7
AM6
AF7
AF8
AM4
AM5
AM1
AM2
AG10
AG11
AM7
AN7
AN5
AN6
AG8
AG9
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
263
R
FF1696 Flip-Chip Fine-Pitch BGA Package
Table 14: FF1696 — XC2VP100 and XC2VP125
No Connects
XC2VP100 XC2VP125
Bank
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
Pin Description
IO_L19N_3
IO_L19P_3
IO_L18N_3
IO_L18P_3
IO_L17N_3
IO_L17P_3
IO_L16N_3
IO_L16P_3
IO_L15N_3/VREF_3
IO_L15P_3
IO_L14N_3
IO_L14P_3
IO_L13N_3
IO_L13P_3
IO_L12N_3
IO_L12P_3
IO_L11N_3
IO_L11P_3
IO_L10N_3
IO_L10P_3
IO_L09N_3/VREF_3
IO_L09P_3
IO_L08N_3
IO_L08P_3
IO_L07N_3
IO_L07P_3
IO_L72N_3
IO_L72P_3
IO_L71N_3
IO_L71P_3
IO_L70N_3
IO_L70P_3
IO_L69N_3/VREF_3
IO_L69P_3
IO_L68N_3
IO_L68P_3
IO_L67N_3
Pin Number
AM3
AN3
AN1
AN2
AG12
AH12
AP6
AP7
AP3
AP4
AH10
AH11
AR6
AR7
AR4
AR5
AH8
AH9
AR2
AR3
AP2
AR1
AJ10
AJ11
AT7
AT8
AT3
AT4
AJ12
AK12
AT1
AT2
AT6
AU6
AK10
AK11
AT5
264
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 14: FF1696 — XC2VP100 and XC2VP125
Bank
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
Pin Description
IO_L67P_3
IO_L66N_3
IO_L66P_3
IO_L65N_3
IO_L65P_3
IO_L64N_3
IO_L64P_3
IO_L63N_3/VREF_3
IO_L63P_3
IO_L62N_3
IO_L62P_3
IO_L61N_3
IO_L61P_3
IO_L84N_3
IO_L84P_3
IO_L83N_3
IO_L83P_3
IO_L82N_3
IO_L82P_3
IO_L81N_3/VREF_3
IO_L81P_3
IO_L80N_3
IO_L80P_3
IO_L79N_3
IO_L79P_3
IO_L78N_3
IO_L78P_3
IO_L77N_3
IO_L77P_3
IO_L76N_3
IO_L76P_3
IO_L75N_3/VREF_3
IO_L75P_3
IO_L74N_3
IO_L74P_3
IO_L73N_3
IO_L73P_3
Pin Number
AU5
AU1
AU2
AJ9
XC2VP100
XC2VP125
AK8
AU8
AV8
AU7
AV7
AL8
AL9
AU3
AV2
AV6
AW5
AM8
AM9
AV4
AW4
AV3
AW3
AN9
AP8
AW1
AW2
AY7
AY8
AR8
AR9
AW7
AY6
AY3
AY4
AT9
AU9
AY5
BA5
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
265
R
FF1696 Flip-Chip Fine-Pitch BGA Package
Table 14: FF1696 — XC2VP100 and XC2VP125
No Connects
XC2VP100 XC2VP125
Bank
Pin Description
IO_L06N_3
Pin Number
BA8
3
3
3
3
3
3
3
3
3
3
3
3
IO_L06P_3
BB8
IO_L05N_3
AW8
AW9
BA7
IO_L05P_3
IO_L04N_3
IO_L04P_3
BB7
IO_L03N_3/VREF_3
IO_L03P_3
BA6
BB6
IO_L02N_3
AY9
IO_L02P_3
BA9
IO_L01N_3/VRP_3
IO_L01P_3/VRN_3
BA4
BB4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
IO_L01N_4/BUSY/DOUT(1)
IO_L01P_4/INIT_B
IO_L02N_4/D0/DIN(1)
IO_L02P_4/D1
IO_L03N_4/D2
IO_L03P_4/D3
IO_L05_4/No_Pair
IO_L06N_4/VRP_4
IO_L06P_4/VRN_4
IO_L07N_4
AL11
AL12
AV10
AU10
AN11
AM11
AT10
AY11
AY10
BB10
BA10
AU11
AT11
AR11
AP11
AW11
AV11
BB11
BA11
AN12
AM12
AR13
AT12
AV12
IO_L07P_4/VREF_4
IO_L08N_4
IO_L08P_4
IO_L09N_4
IO_L09P_4/VREF_4
IO_L19N_4
IO_L19P_4
IO_L20N_4
IO_L20P_4
IO_L21N_4
IO_L21P_4
IO_L25N_4
IO_L25P_4
IO_L26N_4
266
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 14: FF1696 — XC2VP100 and XC2VP125
Bank
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
Pin Description
IO_L26P_4
Pin Number
AU12
AR12
AP12
AW13
AW12
BA12
AY12
AN13
AM13
AU13
AT13
BA13
AY13
AM14
AL14
AR15
AT14
AV14
AU14
AP14
AN14
AW15
AY14
BB14
BA14
AM15
AL15
AT16
AT15
AV15
AU15
AP15
AN15
AY16
AY15
BB15
BA15
XC2VP100
XC2VP125
IO_L27N_4
IO_L27P_4/VREF_4
IO_L28N_4
IO_L28P_4
IO_L29N_4
IO_L29P_4
IO_L30N_4
IO_L30P_4
IO_L34N_4
IO_L34P_4
IO_L35N_4
IO_L35P_4
IO_L36N_4
IO_L36P_4/VREF_4
IO_L76N_4
IO_L76P_4
IO_L77N_4
IO_L77P_4
IO_L78N_4
IO_L78P_4
IO_L79N_4
IO_L79P_4
IO_L80_4/No_Pair
IO_L83_4/No_Pair
IO_L84N_4
IO_L84P_4
IO_L85N_4
IO_L85P_4
IO_L86N_4
IO_L86P_4
IO_L87N_4
IO_L87P_4/VREF_4
IO_L37N_4
IO_L37P_4
IO_L38N_4
IO_L38P_4
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
267
R
FF1696 Flip-Chip Fine-Pitch BGA Package
Table 14: FF1696 — XC2VP100 and XC2VP125
No Connects
XC2VP100 XC2VP125
Bank
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
Pin Description
IO_L39N_4
Pin Number
AM16
AL16
AR17
AR16
AV16
AU16
AP16
AN16
AW17
AW16
BB16
BA16
AL18
AL17
AU17
AT17
IO_L39P_4
IO_L43N_4
IO_L43P_4
IO_L44N_4
IO_L44P_4
IO_L45N_4
IO_L45P_4/VREF_4
IO_L10N_4
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
IO_L10P_4
IO_L11N_4
IO_L11P_4
IO_L12N_4
IO_L12P_4
IO_L16N_4
IO_L16P_4
IO_L18N_4
BA17
AY17
AT19
AT18
AN17
AM17
AV18
AU18
AY19
AY18
AM19
AM18
BB18
BA18
AR20
AR19
AP18
AN18
AV19
AU19
AW20
IO_L18P_4/VREF_4
IO_L46N_4
IO_L46P_4
IO_L47N_4
IO_L47P_4
IO_L48N_4
IO_L48P_4
IO_L49N_4
IO_L49P_4
IO_L50_4/No_Pair
IO_L53_4/No_Pair
IO_L54N_4
IO_L54P_4
IO_L55N_4
IO_L55P_4
IO_L56N_4
IO_L56P_4
IO_L57N_4
IO_L57P_4/VREF_4
IO_L58N_4
268
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 14: FF1696 — XC2VP100 and XC2VP125
Bank
4
Pin Description
IO_L58P_4
Pin Number
AW19
AP19
AN19
BB19
BA19
AU20
AT20
XC2VP100
XC2VP125
4
IO_L59N_4
4
IO_L59P_4
4
IO_L60N_4
4
IO_L60P_4
4
IO_L64N_4
4
IO_L64P_4
4
IO_L65N_4
AL21
4
IO_L65P_4
AL20
4
IO_L66N_4
BA20
AY20
AR21
AP21
AN20
AM20
AU21
AT21
4
IO_L66P_4/VREF_4
IO_L67N_4
4
4
IO_L67P_4
4
IO_L68N_4
4
IO_L68P_4
4
IO_L69N_4
4
IO_L69P_4/VREF_4
IO_L73N_4
4
AW21
AV21
AN21
AM21
BA21
AY21
4
IO_L73P_4
4
IO_L74N_4/GCLK3S
IO_L74P_4/GCLK2P
IO_L75N_4/GCLK1S
IO_L75P_4/GCLK0P
4
4
4
5
5
5
5
5
5
5
5
5
5
5
5
5
IO_L75N_5/GCLK7S
IO_L75P_5/GCLK6P
IO_L74N_5/GCLK5S
IO_L74P_5/GCLK4P
IO_L73N_5
AY22
BA22
AM22
AN22
AV22
AW22
AT22
AU22
AM23
AN23
AP22
AR22
AY23
IO_L73P_5
IO_L69N_5/VREF_5
IO_L69P_5
IO_L68N_5
IO_L68P_5
IO_L67N_5
IO_L67P_5
IO_L66N_5/VREF_5
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
269
R
FF1696 Flip-Chip Fine-Pitch BGA Package
Table 14: FF1696 — XC2VP100 and XC2VP125
No Connects
XC2VP100 XC2VP125
Bank
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
Pin Description
IO_L66P_5
IO_L65N_5
IO_L65P_5
IO_L64N_5
IO_L64P_5
IO_L60N_5
IO_L60P_5
IO_L59N_5
IO_L59P_5
IO_L58N_5
IO_L58P_5
IO_L57N_5/VREF_5
IO_L57P_5
IO_L56N_5
IO_L56P_5
IO_L55N_5
IO_L55P_5
IO_L54N_5
IO_L54P_5
IO_L53_5/No_Pair
IO_L50_5/No_Pair
IO_L49N_5
IO_L49P_5
IO_L48N_5
IO_L48P_5
IO_L47N_5
IO_L47P_5
IO_L46N_5
IO_L46P_5
IO_L18N_5/VREF_5
IO_L18P_5
IO_L16N_5
IO_L16P_5
IO_L12N_5
IO_L12P_5
IO_L11N_5
IO_L11P_5
Pin Number
BA23
AL23
AL22
AT23
AU23
BA24
BB24
AN24
AP24
AW24
AW23
AU24
AV24
AN25
AP25
AR24
AR23
BA25
BB25
AM25
AM24
AY25
AY24
AU25
AV25
AM26
AN26
AT25
AT24
AY26
BA26
AT26
AU26
AL26
AL25
BA27
BB27
NC
NC
NC
NC
NC
NC
NC
NC
270
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 14: FF1696 — XC2VP100 and XC2VP125
Bank
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
Pin Description
IO_L10N_5
Pin Number
AW27
AW26
AN27
AP27
AU27
AV27
AR27
AR26
AL27
AM27
BA28
BB28
AY28
AY27
AN28
AP28
AU28
AV28
AT28
AT27
AL28
AM28
BA29
BB29
AY29
AW28
AN29
AP29
AU29
AV29
AT29
AR28
AL29
AM29
AY30
BA30
AT30
XC2VP100
NC
XC2VP125
IO_L10P_5
NC
IO_L45N_5/VREF_5
IO_L45P_5
IO_L44N_5
IO_L44P_5
IO_L43N_5
IO_L43P_5
IO_L39N_5
IO_L39P_5
IO_L38N_5
IO_L38P_5
IO_L37N_5
IO_L37P_5
IO_L87N_5/VREF_5
IO_L87P_5
IO_L86N_5
IO_L86P_5
IO_L85N_5
IO_L85P_5
IO_L84N_5
IO_L84P_5
IO_L83_5/No_Pair
IO_L80_5/No_Pair
IO_L79N_5
IO_L79P_5
IO_L78N_5
IO_L78P_5
IO_L77N_5
IO_L77P_5
IO_L76N_5
IO_L76P_5
IO_L36N_5/VREF_5
IO_L36P_5
IO_L35N_5
IO_L35P_5
IO_L34N_5
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
271
R
FF1696 Flip-Chip Fine-Pitch BGA Package
Table 14: FF1696 — XC2VP100 and XC2VP125
No Connects
XC2VP100 XC2VP125
Bank
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
Pin Description
IO_L34P_5
Pin Number
AU30
AM30
AN30
AY31
BA31
AW31
AW30
AP31
AR31
AU31
AV31
AT31
AR30
AM31
AN31
BA32
BB32
AV32
AW32
AP32
AR32
AT32
AU32
BA33
BB33
AY33
AY32
AT33
AM32
AN32
AU33
AV33
AL31
AL32
IO_L30N_5
IO_L30P_5
IO_L29N_5
IO_L29P_5
IO_L28N_5
IO_L28P_5
IO_L27N_5/VREF_5
IO_L27P_5
IO_L26N_5
IO_L26P_5
IO_L25N_5
IO_L25P_5
IO_L21N_5
IO_L21P_5
IO_L20N_5
IO_L20P_5
IO_L19N_5
IO_L19P_5
IO_L09N_5/VREF_5
IO_L09P_5
IO_L08N_5
IO_L08P_5
IO_L07N_5/VREF_5
IO_L07P_5
IO_L06N_5/VRP_5
IO_L06P_5/VRN_5
IO_L05_5/No_Pair
IO_L03N_5/D4
IO_L03P_5/D5
IO_L02N_5/D6
IO_L02P_5/D7
IO_L01N_5/RDWR_B
IO_L01P_5/CS_B
6
6
IO_L01P_6/VRN_6
IO_L01N_6/VRP_6
BB39
BA39
272
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 14: FF1696 — XC2VP100 and XC2VP125
Bank
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Pin Description
IO_L02P_6
IO_L02N_6
IO_L03P_6
IO_L03N_6/VREF_6
IO_L04P_6
IO_L04N_6
IO_L05P_6
IO_L05N_6
IO_L06P_6
IO_L06N_6
IO_L73P_6
IO_L73N_6
IO_L74P_6
IO_L74N_6
IO_L75P_6
IO_L75N_6/VREF_6
IO_L76P_6
IO_L76N_6
IO_L77P_6
IO_L77N_6
IO_L78P_6
IO_L78N_6
IO_L79P_6
IO_L79N_6
IO_L80P_6
IO_L80N_6
IO_L81P_6
IO_L81N_6/VREF_6
IO_L82P_6
IO_L82N_6
IO_L83P_6
IO_L83N_6
IO_L84P_6
IO_L84N_6
IO_L61P_6
IO_L61N_6
IO_L62P_6
Pin Number
BA34
AY34
BB37
BA37
BB36
BA36
AW34
AW35
BB35
BA35
BA38
AY38
AU34
AT34
XC2VP100
XC2VP125
AY39
AY40
AY37
AW36
AR34
AR35
AY35
AY36
AW41
AW42
AP35
AN34
AW40
AV40
AW39
AV39
AM34
AM35
AW38
AV37
AV41
AU40
AL34
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
273
R
FF1696 Flip-Chip Fine-Pitch BGA Package
Table 14: FF1696 — XC2VP100 and XC2VP125
No Connects
XC2VP100 XC2VP125
Bank
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Pin Description
IO_L62N_6
IO_L63P_6
IO_L63N_6/VREF_6
IO_L64P_6
IO_L64N_6
IO_L65P_6
IO_L65N_6
IO_L66P_6
IO_L66N_6
IO_L67P_6
IO_L67N_6
IO_L68P_6
IO_L68N_6
IO_L69P_6
IO_L69N_6/VREF_6
IO_L70P_6
IO_L70N_6
IO_L71P_6
IO_L71N_6
IO_L72P_6
IO_L72N_6
IO_L07P_6
IO_L07N_6
IO_L08P_6
IO_L08N_6
IO_L09P_6
IO_L09N_6/VREF_6
IO_L10P_6
IO_L10N_6
IO_L11P_6
IO_L11N_6
IO_L12P_6
IO_L12N_6
IO_L13P_6
IO_L13N_6
IO_L14P_6
IO_L14N_6
Pin Number
AL35
AV36
AU36
AV35
AU35
AK35
AJ34
AU41
AU42
AU38
AT38
AK32
AK33
AU37
AT37
AT41
AT42
AK31
AJ31
AT39
AT40
AT35
AT36
AJ32
AJ33
AR42
AP41
AR40
AR41
AH34
AH35
AR38
AR39
AR36
AR37
AH32
AH33
274
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 14: FF1696 — XC2VP100 and XC2VP125
Bank
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Pin Description
IO_L15P_6
IO_L15N_6/VREF_6
IO_L16P_6
IO_L16N_6
IO_L17P_6
IO_L17N_6
IO_L18P_6
IO_L18N_6
IO_L19P_6
IO_L19N_6
IO_L20P_6
IO_L20N_6
IO_L21P_6
IO_L21N_6/VREF_6
IO_L22P_6
IO_L22N_6
IO_L23P_6
IO_L23N_6
IO_L24P_6
IO_L24N_6
IO_L25P_6
IO_L25N_6
IO_L26P_6
IO_L26N_6
IO_L27P_6
IO_L27N_6/VREF_6
IO_L28P_6
IO_L28N_6
IO_L29P_6
IO_L29N_6
IO_L30P_6
IO_L30N_6
IO_L31P_6
IO_L31N_6
IO_L32P_6
IO_L32N_6
IO_L33P_6
Pin Number
AP39
AP40
AP36
AP37
AH31
AG31
AN41
AN42
AN40
AM40
AG34
AG35
AN37
AN38
AN36
AM36
AG32
AG33
AM41
AM42
AM38
AM39
AF35
AF36
AM37
AL36
AL41
AK41
AF32
AF33
AL39
AL40
AL37
AL38
AF31
AE31
AK39
XC2VP100
XC2VP125
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
275
R
FF1696 Flip-Chip Fine-Pitch BGA Package
Table 14: FF1696 — XC2VP100 and XC2VP125
No Connects
XC2VP100 XC2VP125
Bank
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Pin Description
IO_L33N_6/VREF_6
IO_L34P_6
Pin Number
AK40
AK36
AK37
AE36
AE37
AJ41
IO_L34N_6
IO_L35P_6
IO_L35N_6
IO_L36P_6
IO_L36N_6
IO_L37P_6
AJ42
AJ40
IO_L37N_6
IO_L38P_6
AH40
AE34
AE35
AJ38
IO_L38N_6
IO_L39P_6
IO_L39N_6/VREF_6
IO_L40P_6
AH37
AJ36
IO_L40N_6
IO_L41P_6
AJ37
AE32
AE33
AH41
AH42
AH38
AH39
AD36
AC35
AH36
AG36
AG41
AG42
AD34
AC33
AG40
AF39
AG38
AG39
AD32
AD33
AG37
AF37
IO_L41N_6
IO_L42P_6
IO_L42N_6
IO_L43P_6
IO_L43N_6
IO_L44P_6
IO_L44N_6
IO_L45P_6
IO_L45N_6/VREF_6
IO_L46P_6
IO_L46N_6
IO_L47P_6
IO_L47N_6
IO_L48P_6
IO_L48N_6
IO_L49P_6
IO_L49N_6
IO_L50P_6
IO_L50N_6
IO_L51P_6
IO_L51N_6/VREF_6
276
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 14: FF1696 — XC2VP100 and XC2VP125
Bank
6
Pin Description
IO_L52P_6
IO_L52N_6
IO_L53P_6
IO_L53N_6
IO_L54P_6
IO_L54N_6
IO_L55P_6
IO_L55N_6
IO_L56P_6
IO_L56N_6
IO_L57P_6
IO_L57N_6/VREF_6
IO_L58P_6
IO_L58N_6
IO_L59P_6
IO_L59N_6
IO_L60P_6
IO_L60N_6
IO_L85P_6
IO_L85N_6
IO_L86P_6
IO_L86N_6
IO_L87P_6
IO_L87N_6/VREF_6
IO_L88P_6
IO_L88N_6
IO_L89P_6
IO_L89N_6
IO_L90P_6
IO_L90N_6
Pin Number
AF40
AF41
AC36
AC37
AE41
AE42
AE40
AD40
AC31
AC32
AE38
AE39
AD41
AD42
AB35
AB36
AD37
AD38
AC40
AC41
AB33
AB34
AC39
AB39
AB40
AB41
AB31
AB32
AB37
AB38
XC2VP100
XC2VP125
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
7
7
7
7
7
7
IO_L90P_7
IO_L90N_7
AA40
AA41
AA35
AA36
Y39
IO_L89P_7
IO_L89N_7
IO_L88P_7
IO_L88N_7/VREF_7
AA39
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
277
R
FF1696 Flip-Chip Fine-Pitch BGA Package
Table 14: FF1696 — XC2VP100 and XC2VP125
No Connects
XC2VP100 XC2VP125
Bank
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
Pin Description
IO_L87P_7
IO_L87N_7
IO_L86P_7
IO_L86N_7
IO_L85P_7
IO_L85N_7
IO_L60P_7
IO_L60N_7
IO_L59P_7
IO_L59N_7
IO_L58P_7
IO_L58N_7/VREF_7
IO_L57P_7
IO_L57N_7
IO_L56P_7
IO_L56N_7
IO_L55P_7
IO_L55N_7
IO_L54P_7
IO_L54N_7
IO_L53P_7
IO_L53N_7
IO_L52P_7
IO_L52N_7/VREF_7
IO_L51P_7
IO_L51N_7
IO_L50P_7
IO_L50N_7
IO_L49P_7
IO_L49N_7
IO_L48P_7
IO_L48N_7
IO_L47P_7
IO_L47N_7
IO_L46P_7
IO_L46N_7/VREF_7
IO_L45P_7
Pin Number
AA37
AA38
AA33
AA34
Y40
Y41
W41
W42
AA31
AA32
V40
W40
W37
W38
Y36
Y37
V41
V42
V38
V39
Y31
Y32
U40
U41
T40
U39
Y35
W36
T37
U37
T41
T42
Y33
W34
T38
T39
R36
278
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 14: FF1696 — XC2VP100 and XC2VP125
Bank
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
Pin Description
IO_L45N_7
IO_L44P_7
IO_L44N_7
IO_L43P_7
IO_L43N_7
IO_L42P_7
IO_L42N_7
IO_L41P_7
IO_L41N_7
IO_L40P_7
IO_L40N_7/VREF_7
IO_L39P_7
IO_L39N_7
IO_L38P_7
IO_L38N_7
IO_L37P_7
IO_L37N_7
IO_L36P_7
IO_L36N_7
IO_L35P_7
IO_L35N_7
IO_L34P_7
IO_L34N_7/VREF_7
IO_L33P_7
IO_L33N_7
IO_L32P_7
IO_L32N_7
IO_L31P_7
IO_L31N_7
IO_L30P_7
IO_L30N_7
IO_L29P_7
IO_L29N_7
IO_L28P_7
IO_L28N_7/VREF_7
IO_L27P_7
IO_L27N_7
Pin Number
T36
XC2VP100
XC2VP125
W32
W33
R41
R42
P40
R40
V36
V37
R38
R39
P38
R37
V34
V35
P41
P42
P36
P37
V32
V33
M41
N41
N39
N40
U35
U36
N36
N37
M39
M40
U32
U33
M37
M38
L37
M36
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
279
R
FF1696 Flip-Chip Fine-Pitch BGA Package
Table 14: FF1696 — XC2VP100 and XC2VP125
No Connects
XC2VP100 XC2VP125
Bank
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
Pin Description
IO_L26P_7
IO_L26N_7
IO_L25P_7
IO_L25N_7
IO_L24P_7
IO_L24N_7
IO_L23P_7
IO_L23N_7
IO_L22P_7
IO_L22N_7/VREF_7
IO_L21P_7
IO_L21N_7
IO_L20P_7
IO_L20N_7
IO_L19P_7
IO_L19N_7
IO_L18P_7
IO_L18N_7
IO_L17P_7
IO_L17N_7
IO_L16P_7
IO_L16N_7/VREF_7
IO_L15P_7
IO_L15N_7
IO_L14P_7
IO_L14N_7
IO_L13P_7
IO_L13N_7
IO_L12P_7
IO_L12N_7
IO_L11P_7
IO_L11N_7
IO_L10P_7
IO_L10N_7/VREF_7
IO_L09P_7
IO_L09N_7
IO_L08P_7
Pin Number
V31
U31
L41
L42
K40
L40
T34
T35
L38
L39
K36
L36
T32
T33
K41
K42
K37
K38
R34
R35
H42
J41
J39
J40
R32
R33
J36
J37
H40
H41
T31
R31
H38
H39
H36
H37
P34
280
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 14: FF1696 — XC2VP100 and XC2VP125
Bank
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
Pin Description
IO_L08N_7
IO_L07P_7
IO_L07N_7
IO_L72P_7
IO_L72N_7
IO_L71P_7
IO_L71N_7
IO_L70P_7
IO_L70N_7/VREF_7
IO_L69P_7
IO_L69N_7
IO_L68P_7
IO_L68N_7
IO_L67P_7
IO_L67N_7
IO_L66P_7
IO_L66N_7
IO_L65P_7
IO_L65N_7
IO_L64P_7
IO_L64N_7/VREF_7
IO_L63P_7
IO_L63N_7
IO_L62P_7
IO_L62N_7
IO_L61P_7
IO_L61N_7
IO_L84P_7
IO_L84N_7
IO_L83P_7
IO_L83N_7
IO_L82P_7
IO_L82N_7/VREF_7
IO_L81P_7
IO_L81N_7
IO_L80P_7
IO_L80N_7
Pin Number
N35
G41
G42
G39
G40
P32
P33
F38
XC2VP100
XC2VP125
G38
F37
G37
N32
N33
G35
G36
F41
F42
P31
N31
E41
F40
E36
F36
M34
M35
E35
F35
D40
E40
L34
L35
D39
E39
D38
E37
K34
J35
DS083-4 (v3.0) December 10, 2003
Product Specification
www.xilinx.com
1-800-255-7778
281
R
FF1696 Flip-Chip Fine-Pitch BGA Package
Table 14: FF1696 — XC2VP100 and XC2VP125
No Connects
XC2VP100 XC2VP125
Bank
7
Pin Description
IO_L79P_7
Pin Number
D41
D42
C39
C40
H34
H35
C37
D36
B38
C38
F34
7
IO_L79N_7
7
IO_L78P_7
7
IO_L78N_7
7
IO_L77P_7
7
IO_L77N_7
7
IO_L76P_7
7
IO_L76N_7/VREF_7
IO_L75P_7
7
7
IO_L75N_7
7
IO_L74P_7
7
IO_L74N_7
G34
C35
C36
A39
B39
D34
D35
A37
B37
A36
B36
B34
C34
A35
B35
7
IO_L73P_7
7
IO_L73N_7
7
IO_L06P_7
7
IO_L06N_7
7
IO_L05P_7
7
IO_L05N_7
7
IO_L04P_7
7
IO_L04N_7/VREF_7
IO_L03P_7
7
7
IO_L03N_7
7
IO_L02P_7
7
IO_L02N_7
7
IO_L01P_7/VRN_7
IO_L01N_7/VRP_7
7
7
7
7
7
7
7
7
7
7
7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
W39
P39
K39
F39
D37
W35
P35
K35
M33
H33
282
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 14: FF1696 — XC2VP100 and XC2VP125
Bank
7
7
7
7
7
7
7
7
7
7
7
7
7
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
5
Pin Description
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_7
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_5
Pin Number
AA29
Y29
XC2VP100
XC2VP125
W29
V29
U29
T29
R29
AA28
Y28
W28
V28
U28
T28
AU39
AN39
AJ39
AD39
AW37
AN35
AJ35
AD35
AR33
AL33
AH29
AG29
AF29
AE29
AD29
AC29
AB29
AG28
AF28
AE28
AD28
AC28
AB28
AW33
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
283
Product Specification
1-800-255-7778
R
FF1696 Flip-Chip Fine-Pitch BGA Package
Table 14: FF1696 — XC2VP100 and XC2VP125
No Connects
XC2VP100 XC2VP125
Bank
5
5
5
5
5
5
5
5
5
5
5
5
5
5
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
3
3
3
3
3
3
3
3
Pin Description
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
Pin Number
AL30
AW29
AR29
AJ26
AW25
AR25
AJ25
AH25
AJ24
AH24
AJ23
AH23
AJ22
AH22
AJ21
AH21
AJ20
AH20
AJ19
AH19
AW18
AR18
AJ18
AH18
AJ17
AW14
AR14
AL13
AW10
AG15
AF15
AE15
AD15
AC15
AB15
AH14
AG14
284
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 14: FF1696 — XC2VP100 and XC2VP125
Bank
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
Pin Description
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
Pin Number
AF14
AE14
AD14
AC14
AB14
AR10
AL10
AN8
AJ8
XC2VP100
XC2VP125
AD8
AW6
AU4
AN4
AJ4
AD4
AA15
Y15
W15
V15
U15
T15
AA14
Y14
W14
V14
U14
T14
R14
M10
H10
W8
P8
K8
D6
W4
P4
K4
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
285
Product Specification
1-800-255-7778
R
FF1696 Flip-Chip Fine-Pitch BGA Package
Table 14: FF1696 — XC2VP100 and XC2VP125
No Connects
XC2VP100 XC2VP125
Bank
2
Pin Description
VCCO_2
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
Pin Number
F4
1
R21
P21
R20
P20
R19
P19
R18
P18
H18
D18
P17
H14
D14
M13
D10
D33
M30
H29
D29
P26
R25
P25
H25
D25
R24
P24
R23
P23
R22
P22
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
N/A
N/A
N/A
N/A
N/A
CCLK
PROG_B
DONE
M0
AM10
J33
AN10
AP33
AN33
M1
286
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 14: FF1696 — XC2VP100 and XC2VP125
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
M2
Pin Number
AM33
K10
XC2VP100
XC2VP125
TCK
TDI
M32
TDO
M11
TMS
L10
PWRDWN_B
HSWAP_EN
RSVD
AP10
K33
J10
VBATT
DXP
M12
M31
DXN
L33
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
AK30
N30
AJ29
P29
AJ28
AH28
R28
P28
AJ27
AH27
AG27
AF27
AE27
AD27
AC27
AB27
AA27
Y27
W27
V27
U27
T27
R27
P27
AH26
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
287
Product Specification
1-800-255-7778
R
FF1696 Flip-Chip Fine-Pitch BGA Package
Table 14: FF1696 — XC2VP100 and XC2VP125
No Connects
XC2VP100 XC2VP125
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
Pin Number
AG26
AF26
U26
T26
R26
AG25
T25
AG24
T24
AG23
T23
AG22
T22
AG21
T21
AG20
T20
AG19
T19
AG18
T18
AH17
AG17
AF17
U17
T17
R17
AJ16
AH16
AG16
AF16
AE16
AD16
AC16
AB16
AA16
Y16
288
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 14: FF1696 — XC2VP100 and XC2VP125
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
Pin Number
W16
V16
XC2VP100
XC2VP125
U16
T16
R16
P16
AJ15
AH15
R15
P15
AJ14
P14
AK13
N13
BA42
AY42
AL42
AB42
AA42
M42
C42
B42
BB41
A41
BB40
A40
BB31
A31
BB22
A22
BB21
A21
BB12
A12
BB3
A3
BB2
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
289
Product Specification
1-800-255-7778
R
FF1696 Flip-Chip Fine-Pitch BGA Package
Table 14: FF1696 — XC2VP100 and XC2VP125
No Connects
XC2VP100 XC2VP125
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
VCCAUX
GND
Pin Number
A2
BA1
AY1
AL1
AB1
AA1
M1
C1
B1
AV42
AP42
AK42
AF42
AC42
Y42
GND
GND
GND
GND
GND
GND
U42
GND
N42
GND
J42
GND
E42
GND
BA41
AY41
C41
GND
GND
GND
B41
GND
BA40
B40
GND
GND
BB38
AV38
AP38
AK38
AF38
AC38
Y38
GND
GND
GND
GND
GND
GND
GND
U38
GND
N38
GND
J38
GND
E38
GND
A38
290
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 14: FF1696 — XC2VP100 and XC2VP125
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Pin Number
BB34
AV34
AP34
AK34
AF34
AC34
Y34
XC2VP100
XC2VP125
U34
N34
J34
E34
A34
AD31
W31
BB30
AV30
AP30
J30
E30
A30
BB26
AV26
AP26
AE26
AD26
AC26
AB26
AA26
Y26
W26
V26
J26
E26
A26
AF25
AE25
AD25
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
291
Product Specification
1-800-255-7778
R
FF1696 Flip-Chip Fine-Pitch BGA Package
Table 14: FF1696 — XC2VP100 and XC2VP125
No Connects
XC2VP100 XC2VP125
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Pin Number
AC25
AB25
AA25
Y25
W25
V25
U25
AL24
AF24
AE24
AD24
AC24
AB24
AA24
Y24
W24
V24
U24
M24
BB23
AV23
AP23
AF23
AE23
AD23
AC23
AB23
AA23
Y23
W23
V23
U23
J23
E23
A23
AF22
AE22
292
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 14: FF1696 — XC2VP100 and XC2VP125
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Pin Number
AD22
AC22
AB22
AA22
Y22
XC2VP100
XC2VP125
W22
V22
U22
AF21
AE21
AD21
AC21
AB21
AA21
Y21
W21
V21
U21
BB20
AV20
AP20
AF20
AE20
AD20
AC20
AB20
AA20
Y20
W20
V20
U20
J20
E20
A20
AL19
AF19
AE19
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
293
Product Specification
1-800-255-7778
R
FF1696 Flip-Chip Fine-Pitch BGA Package
Table 14: FF1696 — XC2VP100 and XC2VP125
No Connects
XC2VP100 XC2VP125
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Pin Number
AD19
AC19
AB19
AA19
Y19
W19
V19
U19
M19
AF18
AE18
AD18
AC18
AB18
AA18
Y18
W18
V18
U18
BB17
AV17
AP17
AE17
AD17
AC17
AB17
AA17
Y17
W17
V17
J17
E17
A17
BB13
AV13
AP13
J13
294
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
No Connects
Table 14: FF1696 — XC2VP100 and XC2VP125
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Pin Number
E13
A13
AD12
W12
BB9
AV9
AP9
AK9
AF9
AC9
Y9
XC2VP100
XC2VP125
U9
N9
J9
E9
A9
BB5
AV5
AP5
AK5
AF5
AC5
Y5
U5
N5
J5
E5
A5
BA3
B3
BA2
AY2
C2
B2
AV1
AP1
AK1
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
295
Product Specification
1-800-255-7778
R
FF1696 Flip-Chip Fine-Pitch BGA Package
Table 14: FF1696 — XC2VP100 and XC2VP125
No Connects
XC2VP100 XC2VP125
Bank
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Pin Description
GND
Pin Number
AF1
AC1
Y1
GND
GND
GND
U1
GND
N1
GND
J1
GND
E1
Notes:
1. See Table 4 for an explanation of the signals available on this pin.
296
www.xilinx.com
1-800-255-7778
DS083-4 (v3.0) December 10, 2003
Product Specification
R
Virtex-II Pro™ Platform FPGAs: Pinout Information
FF1696 Flip-Chip Fine-Pitch BGA Package Specifications (1.00mm pitch)
Figure 10: FF1696 Flip-Chip Fine-Pitch BGA Package Specifications
DS083-4 (v3.0) December 10, 2003
www.xilinx.com
297
Product Specification
1-800-255-7778
R
Revision History
Revision History
This section records the change history for this module of the data sheet.
Date
Version
1.0
Revision
01/31/02
08/14/02
08/27/02
Initial Xilinx release.
Added package and pinout information for new devices.
2.0
2.1
•
•
Updated SelectIO-Ultra information in Table 4. (Table deleted in v2.3.)
Corrected direction for RXNPAD and TXPPAD in Table 4 (formerly Table 5).
09/27/02
2.2
Corrected Table 2 and Table 3 entries for XC2VP30, FF1152 package, maximum I/Os from
692 to 644.
11/20/02
12/03/02
2.3
2.4
Added Number of Differential Pairs data to Table 3. Removed former Table 4.
Corrections in Table 4:
•
Reclassified GCLKx (S/P) pins as Input/Output, since these pins can be used as
normal I/Os if not used as clocks.
•
Added cautionary note to PWRDWN_B pin, indicating that this function is not
supported.
01/20/03
2.5
Added and removed package/pinout information for existing devices:
•
•
•
•
•
In Table 1, added FG676 package information.
In Table 3, added FG676 package option for XC2VP20, XC2VP30, and XC2VP40.
In Table 12, removed FF1517 package option for XC2VP40.
Added FG676 package pinouts (Table 7) for XC2VP20, XC2VP30, and XC2VP40.
Added package diagram (Figure 3) for FG676 package.
05/19/03
06/19/03
2.5.1
2.5.3
•
•
Added section BREFCLK Pin Definitions, page 5.
Added clarification to Table 4 and all device pinout tables regarding the dual-use
nature of pins D0/DIN and BUSY/DOUT during configuration.
•
•
Added notation of "open-drain" to TDO pin in Table 4.
The final GND pin in each of six pinout tables was inadvertently deleted in v2.5.1. This
revision restores the deleted GND pins as follows:
-
-
-
-
-
-
Pin A1, Table 6, page 15 (FG456)
Pin AF26, Table 7, page 29 (FG676)
Pin AN34, Table 10, page 96 (FF1152)
Pin E1, Table 11, page 128 (FF1148)
Pin C38, Table 12, page 160 (FF1517)
Pin E1, Table 14, page 250 (FF1696)
08/25/03
12/10/03
2.5.5
3.0
•
•
Table 4: Deleted Note 2, obsolete. There is only one GNDA pin per MGT.
Table 4: Deleted pins ALT_VRP and ALT_VRN. Not used in Virtex-II Pro FPGAs.
•
XC2VP2 through XC2VP70 speed grades -5, -6, and -7, and XC2VP100 speed grades
-5 and -6, are released to Production status.
Virtex-II Pro Data Sheet
The Virtex-II Pro Data Sheet contains the following modules:
•
Virtex-II Pro™ Platform FPGAs: Introduction and
Overview (Module 1)
Virtex-II Pro™ Platform FPGAs: Functional Description
(Module 2)
•
•
Virtex-II Pro™ Platform FPGAs: DC and Switching
Characteristics (Module 3)
Virtex-II Pro™ Platform FPGAs: Pinout Information
(Module 4)
•
298
www.xilinx.com
DS083-4 (v3.0) December 10, 2003
1-800-255-7778
Product Specification
相关型号：
XC2VP125-7FFG1704C
Field Programmable Gate Array, 13904 CLBs, 1350MHz, CMOS, PBGA1704, 1 MM PITCH, FLIP CHIP, FBGA-1704
XILINX
XC2VP125-7FFG1704I
Field Programmable Gate Array, 13904 CLBs, 1350MHz, CMOS, PBGA1704, 1 MM PITCH, FLIP CHIP, FBGA-1704
XILINX
XC2VP2-5FF672C
Field Programmable Gate Array, 352 CLBs, 1050MHz, 3168-Cell, CMOS, PBGA672, 27 X 27 MM, 1 MM PITCH, MS-034AAL-1, FCBGA-672
XILINX
XC2VP2-5FFG672C
Field Programmable Gate Array, 352 CLBs, 1050MHz, 3168-Cell, CMOS, PBGA672, 27 X 27 MM, 1 MM PITCH, MS-034AAL-1, FCBGA-672
XILINX
XC2VP2-5FG256C
Field Programmable Gate Array, 352 CLBs, 1050MHz, 3168-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, MS-034AAF-1, FBGA-256
XILINX
XC2VP2-5FG256I
Field Programmable Gate Array, 352 CLBs, 1050MHz, 3168-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, MS-034AAF-1, FBGA-256
XILINX
XC2VP2-5FG456C
Field Programmable Gate Array, 352 CLBs, 1050MHz, 3168-Cell, CMOS, PBGA456, 23 X 23 MM, 1 MM PITCH, MS-034AAJ-1, FBGA-456
XILINX
XC2VP2-5FGG456C
Field Programmable Gate Array, 352 CLBs, 1050MHz, 3168-Cell, CMOS, PBGA456, 23 X 23 MM, 1 MM PITCH, LEAD FREE, MS-034AAJ-1, FBGA-456
XILINX
XC2VP2-6FF672I
Field Programmable Gate Array, 352 CLBs, 1200MHz, 3168-Cell, CMOS, PBGA672, 27 X 27 MM, 1 MM PITCH, MS-034AAL-1, FCBGA-672
XILINX
XC2VP2-6FFG672I
Field Programmable Gate Array, 352 CLBs, 1200MHz, 3168-Cell, CMOS, PBGA672, 27 X 27 MM, 1 MM PITCH, MS-034AAL-1, FCBGA-672
XILINX
XC2VP2-6FG256I
Field Programmable Gate Array, 352 CLBs, 1200MHz, 3168-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, MS-034AAF-1, FBGA-256
XILINX
©2020 ICPDF网 联系我们和版权申明