232275062439 [YAGEO]
RESISTOR, FUSIBLE, FILM, 0.125W, 5%, 200ppm, 24.3ohm, SURFACE MOUNT, 1206, CHIP;
| 型号： | 232275062439 |
| 厂家： | 
YAGEO CORPORATION |
| 描述： | RESISTOR, FUSIBLE, FILM, 0.125W, 5%, 200ppm, 24.3ohm, SURFACE MOUNT, 1206, CHIP 电阻器 |
| 文件： | 总9页 (文件大小：128K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
FUSIBLE CHIP RESISTORS
FRC01
5%
size 1206
Phycomp
Product specification
Fusible chip resistors
size 1206
FRC01
5%
FEATURES
QUICK REFERENCE DATA
DESCRIPTION
VALUE
• Overload protection without the
risk of fire
Resistance range
1 Ω to 510 Ω;
• Grey coating for ease of
E24/E96 series
recognition
Resistance tolerance
Temperature coefficient:
1 to 4.7 Ω
±5%
• Reduced size of final equipment
• Low assembly costs
≤±250 × 10−6/K
≤±200 × 10−6/K
0.125 W
• Higher component and equipment
5.1 to 510 Ω
reliability.
Absolute maximum dissipation at Tamb = 70 °C
Maximum permissible voltage
Operating temperature range
Climatic category (IEC 60068)
Basic specification
200 V (DC or RMS)
−55 to +125 °C
55/125/56
APPLICATIONS
• Power supplies in small sized
equipment
IEC 60115-8
• Car telephones
ORDERING INFORMATION
• Portable radio, CD and cassette
players.
Table 1 Ordering code indicating type and packing
ORDERING CODE 2322 750 …..
PAPER TAPE ON REEL
DESCRIPTION
TYPE
The resistors are constructed on a
high grade ceramic body (aluminium
oxide). Internal metal electrodes are
added at each end and connected
by a resistive paste which is applied
to the top surface of the substrate.
The composition of the paste is
adjusted to give the approximate
resistance required and the value is
trimmed to within tolerance by laser
cutting of this resistive layer.
5000 UNITS
FRC01
6….
Ordering code (12NC)
Table 2 Last digit of 12NC
RESISTANCE
DECADE
LAST DIGIT
• The resistors have a 12-digit
ordering code starting with 2322.
1 to 9.76 Ω
10 to 97.6 Ω
100 to 510 Ω
8
9
1
• The subsequent 4 digits indicate
the resistor type and packing;
see Table 1.
• The remaining 4 digits indicate the
The resistive layer is covered with a
protective coat and printed with the
resistance value. Finally, the two
external end terminations are added.
For ease of soldering the outer layer
of these end terminations is a
lead/tin alloy.
ORDERING EXAMPLE
resistance value:
− The first 3 digits indicate the
resistance value.
The ordering code of an FRC01
resistor, value 200 Ω, packed in
paper tape and supplied on a reel of
5000 units is: 2322 750 62001.
− The last digit indicates the
resistance decade in
accordance with Table 2.
To enable recognition of a fusible
device, the resistor should be
mounted face up.
2003 Jul 11 Rev.10
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Phycomp
Product specification
Fusible chip resistors
size 1206
FRC01
5%
FUNCTIONAL DESCRIPTION
Product characterization
with “IEC publication 60063”.
increases at least 100 times;
see Figs 1 and 2.
Fusing characteristics
The fusing characteristic is
measured under constant voltage
with resistors mounted on a ceramic
or glass epoxy (FR4) substrate;
see Fig.3.
Standard values of nominal
The resistors will fuse without the
risk of fire and within an indicated
range of overload. Fusing means
that the resistive value of the resistor
resistance are taken from the
E24/E96 series for resistors with a
tolerance of ±5%. The values of the
E24/E96 series are in accordance
CCA853
CCA852
2
2
10
10
t
t
(s)
(s)
10
1
10
1
−1
10
−1
10
−2
10
−2
10
−3
−3
10
10
0
2
4
6
8
10
0
2
4
6
8
10
P
(W)
P
(W)
overload
overload
This graph is based on measured data which may
deviate according to the application.
This graph is based on measured data which may
deviate according to the application.
Fig.2 Fusing characteristic: 1 Ω ≤ R < 510 Ω,
measured using glass epoxy
Fig.1 Fusing characteristic: 10 Ω ≤ R < 510 Ω,
measured using ceramic board material.
(FR4) board material.
resistor mount (FACE UP)
CCB649
conductor: NiCr Au 1.5 µm
Ni 0.5 µm
lead frame mount
Al O or FR4
Au 0.1 µm
1.7
× 1.0 mm
2
3
40.3 × 7.6 × 0.635 mm
Fig.3 Test substrate layout.
2003 Jul 11 Rev.10
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Phycomp
Product specification
Fusible chip resistors
size 1206
FRC01
5%
Limiting values
LIMITING
MBG605
LIMITING
POWER
(W)
50
VOLTAGE(1)
(V)
TYPE
V
max
(V)
FRC01
200(2)
0.125
40
Notes
1. The maximum voltage that may be continuously
applied to the resistor element, see
“IEC publication 60115-8”.
30
20
2. The maximum voltage that may be applied after
fusing is shown in Fig.4.
DERATING
10
2
3
1
10
10
10
R
(Ω)
n
The power that the resistor can dissipate depends on the
operating temperature; see Fig.5.
Fig.4 Maximum applied voltage after fusing.
PULSE LOADING CAPABILITIES
MBG607
2
10
MLB206
P
max
(%P
V
max
(V)
)
rated
100
50
0
1.2/50 µsec
10/700 µsec
10
55
0
50 70
100
T
125
( C)
o
amb
1
2
3
1
10
10
10
R
(Ω)
n
These pulses may not be applied on a regular basis.
Fig.5 Maximum dissipation (Pmax) in
Fig.6 Maximum permissible peak pulse voltage
without failing to ‘open circuit in
percentage of rated power as a function
of the ambient temperature (Tamb).
accordance with DIN IEC 60040 (CO) 533.
2003 Jul 11 Rev.10
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Phycomp
Product specification
Fusible chip resistors
size 1206
FRC01
5%
MBG606
3
10
P
max
(W)
2
10
10
single pulse
tp/ti = 1000
1
−1
10
−6
−5
−4
−3
−2
−1
10
10
10
10
10
10
1
t (s)
i
Fig.7 Pulse on a regular basis; maximum permissible peak pulse power (Pmax) as a
function of pulse duration, single pulse and repetitive pulse tp/tj = 1000.
MBG608
600
V
max
(V)
500
400
300
200
100
0
10
−6
−5
−4
−3
−2
−1
10
10
10
10
10
1
t (s)
i
Fig.8 Pulse on a regular basis; maximum permissible peak pulse power (Vmax) as
a function of pulse duration.
2003 Jul 11 Rev.10
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Phycomp
Product specification
Fusible chip resistors
size 1206
FRC01
5%
MECHANICAL DATA
Mass per 100 units
Outlines
TYPE
FRC01
Marking
MASS
(g)
protective coat
resistor layer
1.0
inner electrode
T
end termination
ceramic substrate
Each resistor is marked with a three
digit code on the protective coating
to designate the nominal resistance
value.
t
b
protective coat
marking
t
t
3-DIGIT MARKING
W
For values of 1 kΩ or greater the first
2 digits apply to the resistance value
and the third digit indicates the
number of zeros to follow.
121
SCR016
L
Example
MARKING
121
RESISTANCE
For dimensions see Table 3.
120 Ω
Fig.9 Outlines.
PACKAGE MARKING
The packing is also marked and
includes resistance value, tolerance,
catalogue number, quantity,
production period, batch number and
source code.
Table 3 Chip resistor type and relevant physical dimensions; see Fig.9
L
W
(mm)
T
(mm)
tt
tb
(mm)
TYPE
(mm)
(mm)
FRC01
3.20
1.6 ±0.15 0.55 ±0.10 0.45 ±0.25 0.50 ±0.25
±0.10/−0.20
2003 Jul 11 Rev.10
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Phycomp
Product specification
Fusible chip resistors
size 1206
FRC01
5%
TEST AND REQUIREMENTS
climatic and mechanical robustness
testing procedure for electronic
components” and under standard
atmospheric conditions according to
“IEC 60068-1”, subclause 5.3.
In Table 4 the tests and
requirements are listed with
Essentially all tests are carried out in
accordance with the schedule of
“IEC publication 60115-8”, category
55/155/56 (rated temperature range
−55 to +155 °C; damp heat, long
term, 56 days). The testing also
covers the requirements specified by
EIA and EIAJ.
reference to the relevant clauses of
“IEC publications 60115-8 and
60068”; a short description of the
test procedure is also given. In some
instances deviations from the IEC
recommendations were necessary
for our method of specifying.
Unless otherwise specified the
following values apply:
Temperature: 15 °C to 35 °C
Relative humidity: 45% to 75%
All soldering tests are performed
with mildly activated flux.
The tests are carried out in
accordance with IEC publication
60068, “Recommended basic
Air pressure: 86 kPa to 106 kPa
(860 mbar to 1060 mbar).
Table 4 Test procedures and requirements
IEC
IEC
60068-2
TEST
METHOD
60115-8
CLAUSE
TEST
PROCEDURE
REQUIREMENTS
Tests in accordance with the schedule of IEC publication 60115-8
4.4.1
visual
examination
no holes; clean surface;
no damage
4.4.2
dimensions
(outline)
gauge (mm)
0.45 ≤ T ≤ 0.65
1.45 ≤ W ≤ 1.75
3.0 ≤ L ≤ 3.3
R − Rnom: max. ±5%
4.5
resistance
applied voltage (+0/−10%):
R < 10 Ω: 0.1 V
10 Ω ≤ R < 100 Ω: 0.3 V
100 Ω ≤ R < 240 Ω: 1 V
4.18
4.29
20 (Tb)
45 (Xa)
resistance to
soldering heat
unmounted chips: 10 ±1 s;
260 ±5 °C
no visible damage
∆R/R max.: ±(1% + 0.05 Ω)
no visible damage
isopropyl alcohol or H2O followed by
component
solvent
brushing in accordance
resistance
with “MIL 202 F”
4.17
20 (Ta)
solderability
unmounted chips completely
immersed for 2 ±0.5 s in a solder
bath at 235 ±2 °C
good tinning (≥95% covered);
no damage
4.7
voltage proof
on insulation
maximum voltage (RMS) during
1 minute metal block method
no breakdown or flashover
room temperature; P = 6.25 × Pn;
4.13
short time
overload
∆R/R max.: ±(1% + 0.05 Ω)
5 s (V ≤ 2 × Vmax
)
2003 Jul 11 Rev.10
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Phycomp
Product specification
Fusible chip resistors
size 1206
FRC01
5%
IEC
IEC
60068-2
TEST
METHOD
60115-8
CLAUSE
TEST
PROCEDURE
REQUIREMENTS
4.33
bending
resistors mounted on a 90 mm glass no visible damage
epoxy resin PCB (FR4);
bending: 3 mm
∆R/R max.: ±(1% + 0.05 Ω)
4.19
14 (Na)
3 (Ca)
rapid change of 30 minutes at LCT and
no visible damage
temperature
30 minutes at UCT; 5 cycles
∆R/R max.: ±(1% + 0.05 Ω)
no visible damage
4.24.2
4.25.1
damp heat
56 days; 40 ±2 °C; 93 +2/−3% RH;
loaded with 0.01 Pn
(steady state)
∆R/R max.: ±(3% + 0.1 Ω)
no visible damage
endurance
1000 +48/−0 hours; 70 ±2 °C;
loaded with Pn or Vmax
;
∆R/R max.: ±(3% + 0.1 Ω)
1.5 hours on and 0.5 hours off
4.23.2
27 (Ba)
endurance at
upper category
temperature
1000 +48/−0 hours; no load
∆R/R max.: ±(3% + 0.1 Ω)
4.8.4.2
temperature
coefficient
at 20/LCT/20 °C and 20/UCT/20 °C:
R < 5 Ω
≤±250 × 10−6/K
R ≤ 510 Ω
200 10−6/K
≤±
×
Other tests in accordance with IEC 60115 clauses and IEC 60068 test method
4.17
20 (Ta)
solderability
(after ageing)
8 hours steam or 16 hours 155 °C;
unmounted chips completely
immersed for 2 ±0.5 s in a solder
bath at 235 ±2 °C
good tinning (≥95% covered);
no damage
R
ins min.: 103 MΩ
4.6.1.1
4.12
insulation
resistance
voltage (DC) after 1 minute, metal
block method: 100 V
noise
IEC publication 60195 (measured
with Quantech-equipment)
max. 2 µV/V
Other applicable tests
(JIS) C
5202 7.5
resistance to
damp heat
1000 +48/−0 hours; 40 ±2 °C;
93 +2/−3% RH;
∆R/R max.: ±(5% + 0.1 Ω)
loaded with Pn or Vmax
1.5 hours on and 0.5 hours off
unmounted chips 60 ±1 s; 260 ±5 °C good tinning; no leaching
;
(steady state)
leaching
trio damp heat
test
1000 +48/−0 hours; 85 ±2 °C;
85 ±5% RH;
∆R/R max.: ±(5% + 0.1 Ω)
loaded with 0.1 Pn or Vmax
2003 Jul 11 Rev.10
8
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Phycomp
Product specification
Fusible chip resistors
size 1206
FRC01
5%
REVISION HISTORY
Revision Date
Change
Description
Notification
Rev.9
2001 Apr 27
2003 Jul 11
-
-
- Converted to Phycomp brand
Rev.10
- Updated company logo
- Marking code revised
2003 Jul 11 Rev.10
9
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