239040131784 [YAGEO]
Fixed Resistor, Thin Film, 0.125W, 178000ohm, 150V, 0.05% +/-Tol, 50ppm/Cel, 0805;
| 型号： | 239040131784 |
| 厂家： | 
YAGEO CORPORATION |
| 描述： | Fixed Resistor, Thin Film, 0.125W, 178000ohm, 150V, 0.05% +/-Tol, 50ppm/Cel, 0805 |
| 文件： | 总16页 (文件大小：175K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
THIN-FILM CHIP RESISTORS
TF×24 series, 0.05% TC50
10 Ω TO 1MΩ
sizes 1210, 1206, 0805, 0603 and 0402
Phycomp
Product specification
Thin-film chip resistors
TFx24 series, 0.05% TC50
sizes 1210, 1206, 0805, 0603 and 0402
10 Ω to 1 MΩ
FEATURES
DESCRIPTION
• High precision
The resistors are constructed on a high grade ceramic body (aluminium
oxide). Internal metal electrodes are added at each end and connected by
a resistive paste which is applied to the top surface of the substrate. The
composition of the paste is adjusted to give the approximate resistance
required and the value is trimmed to within tolerance by laser cutting of
this resistive layer.
• High long-tem stability
• Low temperature coefficient.
APPLICATIONS
The resistive layer is covered with a protective coating and printed with
the resistance value. Finally, the two external end terminations are added.
To guarantee optimum solderability the outer layer consists of a lead-tin
alloy.
• Converters
• Printer equipment
• Motherboards
• Telecom
• Consumer.
QUICK REFERENCE DATA
DESCRIPTION
VALUE
TF524
1210
TF024
TF124
TF224
TF324
Size code
1206
0805
0603
0402
Resistance range
10 Ω to 1 MΩ
10 Ω to 1 MΩ 10 Ω to 1 MΩ 10 Ω to 332 kΩ 10 Ω to 100 kΩ
Resistance tolerance
and series
±0.05%; E24 and E96 series
Temperature coefficient
50 10−6/K
≤ ±
×
Maximum dissipation at
0.25 W
200 V
0.125 W
200 V
0.125 W
150 V
0.1 W
75 V
0.0625 W
50 V
T
amb = 70 °C
Maximum permissible
voltage (DC or RMS)
Climatic category
(IEC 60068)
55/125/56
Basic specification
IEC 60115-8 and MIL-STD-202F
2003 Jul 10 Rev.1
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Phycomp
Product specification
Thin-film chip resistors
TFx24 series, 0.05% TC50
sizes 1210, 1206, 0805, 0603 and 0402
10 Ω to 1 MΩ
ORDERING INFORMATION
Table 1 Ordering code indicating resistor type and packing
SIZE
CODE
RESISTANCE
VALUE
TOL.
(%)
PAPER TAPE
ON REEL
TYPE
12NC ORDERING CODE
TF524
TF024
TF124
TF224
TF324
1210
1206
0805
0603
0402
10 Ω to 1 MΩ
10 Ω to 1 MΩ
10 Ω to 1 MΩ
10 Ω to 332 kΩ
10 Ω to 100 kΩ
±0.05
±0.05
±0.05
±0.05
±0.05
5000
5000
5000
5000
10000
2390 412 3xxxx
2390 411 3xxxx
2390 401 3xxxx
2390 404 3xxxx
2390 407 3xxxx
ORDERING EXAMPLE
Ordering code (12NC)
Table 2 Last digit of 12NC
RESISTANCE
DECADE
LAST DIGIT
The ordering code of a TF024
resistor, value 1000 Ω with
0.05% tolerance, supplied on paper
tape of 5000 units per reel is:
2390 411 31002.
• The resistors have a 12-digit
ordering code starting with 2390;
see Table 1.
10 Ω to 97.6 Ω
100 Ω to 976 Ω
1 kΩ to 9.76 kΩ
10 kΩ to 97.6 kΩ
100 kΩ to 976 kΩ
1 MΩ
9
1
2
3
4
5
• The subsequent 4 digits indicate
the resistor type and packing.
• The remaining 4 digits indicate
the resistance value:
− The first 3 digits indicate the
resistance value.
− The last digit indicates the
resistance decade in
accordance with Table 2.
2003 Jul 10 Rev.1
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Phycomp
Product specification
Thin-film chip resistors
TFx24 series, 0.05% TC50
sizes 1210, 1206, 0805, 0603 and 0402
10 Ω to 1 MΩ
DERATING
FUNCTIONAL DESCRIPTION
Product characterization
The rated power that the resistor can dissipate depends on the operating
temperature; see Fig.1.
Standard values of nominal
resistance are taken from the E24
and E96 series for resistors with a
tolerance of ±0.05%.
The values of the E24 and E96
series are in accordance with
“IEC publication 60063”.
MLB206
P
max
(%P
rated
)
100
50
0
Limiting values
TYPE
LIMITING
VOLTAGE(1)
(V)
LIMITING
POWER
(W)
55
0
50 70
100
T
125
TF524
TF024
TF124
TF224
TF324
200
200
150
75
0.25
o
( C)
amb
0.125
0.125
0.1
Fig.1 Maximum dissipation (Pmax) in percentage of rated power as a
function of the ambient temperature (Tamb).
50
0.0625
Note
1. The maximum voltage that may
be continuously applied to the
resistor element, see
“IEC publication 60115-8”.
2003 Jul 10 Rev.1
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Phycomp
Product specification
Thin-film chip resistors
TFx24 series, 0.05% TC50
sizes 1210, 1206, 0805, 0603 and 0402
10 Ω to 1 MΩ
OUTLINES
MECHANICAL DATA
Mass per 100 units
TYPE
MASS
(g)
protective coat
resistor layer
TF524
TF024
TF124
TF224
TF324
1.67
1
inner electrode
end termination
0.55
0.25
0.052
T
ceramic substrate
tb
Marking
protective coat
marking
TYPE
TF524
TF024
TF124
E24
E96
tt
4 digits
4 digits
4 digits
4 digits
4 digits
4 digits
W
3 digits
EIA-96
1001
TF224
TF324
3 digits
no marking
CCB633
L
4-DIGIT MARKING
For values up to 97.6 Ω the R is
used as a decimal point. For values
of 1 kΩ or greater the first 3 digits
apply to the resistance value and the
fourth indicates the number of zeros
to follow.
For dimensions see Table 3.
Fig.2 Outlines.
Example
Table 3 Chip resistor type and relevant physical dimensions; see Fig.2
L
(mm)
W
(mm)
T
(mm)
tt
tb
(mm)
MARKING
10R0
RESISTANCE
10 Ω
TYPE
(mm)
TF524
(1210)
10R2
1001
10.2 Ω
3.1 ±0.1
3.1 ±0.1
2.0 ±0.1
1.6 ±0.1
1.0 ±0.1
2.6 ±0.1
1.6 ±0.1
1.25 ±0.1
0.8 ±0.1
0.55 ±0.1
0.55 ±0.1
0.50 ±0.1
0.50 ±0.2
0.45 ±0.2
0.35 ±0.2
0.5 ±0.2
0.4 ±0.2
0.35 ±0.2
1 kΩ
TF024
(1206)
TF124
(0805)
TF224
(0603)
0.45 ±0.1 0.25 ±0.15 0.25 ±0.15
0.25 ±0.1
TF324
(0402)
0.50 ±0.05 0.30 ±0.05 0.20 ±0.1
2003 Jul 10 Rev.1
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Product specification
Thin-film chip resistors
TFx24 series, 0.05% TC50
sizes 1210, 1206, 0805, 0603 and 0402
10 Ω to 1 MΩ
3-DIGIT MARKING
3-DIGIT EIA-96 MARKING
MARKING OF PACKING MATERIAL
The first 2 digits apply to the
resistance value and the third
indicates the number of zeros to
follow.
The first 2 digits apply to the
resistance value and the third
character indicates the multiplier as
shown in Tables 4 and 5.
The packing material is also marked
and includes resistance value,
tolerance, catalogue number,
quantity, production period, batch
number and source code.
Example
Example
MARKING
120
RESISTANCE
12 Ω
MARKING
10X
RESISTANCE
12.4 Ω
123
124
12 kΩ
10C
10D
12.4 kΩ
120 kΩ
124 kΩ
Table 4 First two digits of the resistance code
CODE
VALUE
CODE
VALUE
CODE
VALUE
CODE
VALUE
01
02
03
04
05
06
07
08
09
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
100
102
105
107
110
113
115
118
121
124
127
130
133
137
140
143
147
150
154
158
162
165
169
174
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
178
182
187
191
196
200
205
210
215
221
226
232
237
243
249
255
261
267
274
280
287
294
301
309
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
63
65
66
67
68
69
70
71
72
316
324
332
340
348
357
365
374
383
392
402
412
422
432
442
453
464
475
487
499
511
523
536
549
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
562
576
590
604
619
634
649
665
681
698
715
732
750
768
787
806
825
845
866
887
909
931
953
976
Table 5 Multiplier codes
CODE
Y
X
A
B
C
D
E
F
Multiplier
10−2
10−1
1
10
102
103
104
105
2003 Jul 10 Rev.1
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Phycomp
Product specification
Thin-film chip resistors
TFx24 series, 0.05% TC50
sizes 1210, 1206, 0805, 0603 and 0402
10 Ω to 1 MΩ
TEST AND REQUIREMENTS
testing procedure for electronic
components” and under standard
atmospheric conditions in
accordance with “IEC 60068-1”,
subclause 5.3.
In Table 6 the tests and
requirements are listed with
reference to the relevant clauses of
“IEC publications 60115-8, 60068
and MIL-STD”; a short description of
the test procedure is also given. In
some instances deviations from the
IEC recommendations were
necessary for our method of
specifying.
Essentially all tests are carried out in
accordance with the schedule of
“IEC publication 60115-8”, category
55/125/56 (rated temperature range
−55 to +125 °C; damp heat, long
term, 56 days). The testing also
covers the requirements specified by
EIA and MIL-STD-202F.
Unless otherwise specified the
following values apply:
Temperature: 15 °C to 35 °C
Relative humidity: 25% to 75%
The tests are carried out in
All soldering tests are performed
with mildly activated flux.
Air pressure: 86 kPa to 106 kPa
(860 mbar to 1060 mbar).
accordance with IEC publication
60068, “Recommended basic
climatic and mechanical robustness
Table 6 Test procedures and requirements
IEC
IEC
60068-2
TEST
METHOD
60115-8
CLAUSE
MIL-STD
TEST
PROCEDURE
REQUIREMENTS
4.4.1
4.4.2
4.5
visual
examination
no holes; clean surface;
no damage
dimensions
(outline)
gauge
see Table 3
R − Rnom: max. ±0.05%
resistance
applied voltage (+0/−10%):
10 Ω ≤ R < 100 Ω: 0.3 V
100 Ω ≤ R < 1 kΩ: 1 V
1 kΩ ≤ R < 10 kΩ: 3 V
10 kΩ ≤ R < 100 kΩ: 10 V
100 kΩ ≤ R < 1 MΩ: 25 V
1 MΩ: 50 V
4.18
4.17
4.7
20 (Tb)
20 (Ta)
202F
method
210C
resistance to
soldering heat
unmounted chips;
10 ±1 s; 260 ±5 °C
no visible damage
∆R/R max.: ±(0.5% + 0.05 Ω)
202F
method
208G
solderability
unmounted chips completely
immersed for 5 ±0.5 s in a
solder bath at 230 ±5 °C
good tinning (≥95% covered);
no damage
202F
method
301
voltage proof on maximum voltage (RMS)
insulation
no breakdown or flashover
during 1 minute,
metal block method
4.13
MIL-R
55342D
para.
short time
overload
room temperature;
∆R/R max.: ±(0.5% + 0.05 Ω)
V = 2.5 × Vrated
;
5 s (voltage not more
4.7.5
than 2 × Vmax);
specimen stabilized at room
temperature for 30 minutes
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Product specification
Thin-film chip resistors
TFx24 series, 0.05% TC50
sizes 1210, 1206, 0805, 0603 and 0402
10 Ω to 1 MΩ
IEC
IEC
60068-2
TEST
METHOD
60115-8
CLAUSE
MIL-STD
TEST
PROCEDURE
REQUIREMENTS
4.33
bending
resistors mounted on a
90 mm glass epoxy resin PCB
(FR4); bending:
no visible damage
∆R/R max.: ±(0.25% + 0.05 Ω)
2 mm for 1210
2 mm for 1206
3 mm for 0805
3 mm for 0603
2 mm for 0402
MIL-R
55342D
para.
low temperature −65 +0/−5 °C for 1 hour;
no visible damage
loaded with Vrated for
operation
∆R/R max.: ±(0.5% + 0.05 Ω)
45 +5/−0 minutes ON, and
15 +5/−0 minutes OFF;
specimen stabilized at room
temperature for 24 hours after
test
4.7.4
4.19
14 (Na)
202F
method
107
thermal shock
endurance
2 minutes at LCT and
2 minutes at UCT; 5 cycles
no visible damage
∆R/R max.: ±(0.5% + 0.05 Ω)
4.25.1
202F
method
108A
1000 +48/−0 hours; 70 ±2 °C; ∆R/R max.: ±(0.5% + 0.05 Ω)
loaded with Pn or Vmax
;
1.5 hours on, 0.5 hours off;
specimen stabilized at room
temperature for 1 hour min.
after test
4.8.4.2
4.6.1.1
202F
method
304
temperature
coefficient
at 25/LCT/25 °C and
25/UCT/25 °C
≤ ±50 × 10−6/K
Rins min.: 104 MΩ
202F
method
302
insulation
resistance
after 1 minute,
metal block method
1210: 400 V (DC)
1206: 400 V (DC)
0805: 300 V (DC)
0603: 150 V (DC)
0402: 100 V (DC)
EIA 575
3.13
leaching
unmounted chips; 60 ±1 s;
260 ±5 °C
good tinning; no leaching
EIA/IS
703 4.6
202F
method
106
moisture
resistance
65 ±2 °C; 95 +3/−5% RH;
loaded with 0.01 Pn or Vmax
∆R/R max.: ±(0.5% + 0.05 Ω)
for 42 damp heat cycles.
(1 cycle consists of 7 steps;
see Fig.3)
2003 Jul 10 Rev.1
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Product specification
Thin-film chip resistors
TFx24 series, 0.05% TC50
sizes 1210, 1206, 0805, 0603 and 0402
10 Ω to 1 MΩ
80 − 98%
RH
80 − 98%
RH
75
90 − 98% RH
90 − 98% RH
90 − 98% RH
temperature
initial drying
24 hours
[°C]
rate of change of temperature is unspecified,
however, specimens shall not be subjected to
50
radiant heating from chamber conditioning processes
end of final cycle;
measurements
as specified in 2.7
+10 °C (+18 °F)
−2 °C (−3.6 °F)
25
0
initial measurements
as specified in 2.2
circulation of conditioning air shall be at a
minimum cubic rate per minute equivalent to
10 times the volume of the chamber
optional sub-cycle if specified
(2.3); sub-cycle performed during
any 5 of the first 9 cycles; humidity
uncontrolled during sub-cycle
temperature
tolerance
±2 °C (±3.6 °F)
unless otherwise
specified
voltage applied as specified in 2.4
STEP1
STEP2 STEP3
one cycle 24 hours; repeat as specified in 2.5
10 15
STEP4
STEP5 STEP6
STEP7
prior to first
cycle only
0
5
20
25
HBK073
time [h]
Fig.3 Moisture resistance test requirements.
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Product specification
Thin-film chip resistors
TFx24 series, 0.05% TC50
sizes 1210, 1206, 0805, 0603 and 0402
10 Ω to 1 MΩ
MOUNTING
Chip placement can be on ceramic substrates and
printed-circuit boards (PCBs). Electrical connection to the
circuit is by soldering. The finishing of the end
terminations guarantees a reliable contact.
Due to their rectangular shape and small dimensional
tolerances, surface-mounted resistors are suitable for
handling by automatic placement systems.
Footprint dimensions
solder land /
solder paste
pattern
solder resist
pattern
D
G
occupied area
E
C
B
A
tracks
MBG628
F
E AVAILABLE AREA FOR TRACKS
underneath the CHIP
For dimensions see Table 7.
Fig.4 Recommended footprint dimensions.
Table 7 Reflow soldering; for dimensions see also Fig.4
FOOTPRINT DIMENSIONS (mm)
PLACEMENT
ACCURACY
(mm)
SIZE
TYPE
PROCESSING
REMARKS
CODE
A
B
C
D
E
F
G
TFx324
TFx224
TFx124
TFx024
TFx524
0402
0603
0805
1206
1210
1.5
2.1
2.6
3.8
3.8
0.5
0.5
0.9
2.0
2.0
0.5
0.8
0.6
0.9
1.4
1.8
2.7
0.1
0.0
0.5
1.4
1.4
1.9
2.5
3.0
4.2
4.2
1.0
1.7
2.1
2.5
3.4
±0.15
±0.25
±0.25
±0.25
±0.25
IR soldering
0.85
0.9
0.9
Table 8 Wave soldering; for dimensions see also Fig.4
FOOTPRINT DIMENSIONS (mm)
PROPOSED NUMBER
AND DIMENSIONS OF
DUMMY TRACKS (mm)
PLACEMENT
ACCURACY
(mm)
SIZE
CODE
TYPE
A
B
C
D
E
F
G
TFx224
TFx124
TFx024
TFx524
0603
0805
1206
1210
2.7
3.3
4.5
5.3
0.9
1.3
2.5
2.3
0.9
1.0
1.0
1.5
0.8
1.3
1.7
2.6
0.15
0.34
1.25
1.25
3.2
3.9
3.9
6.3
1.9
2.4
2.4
4.2
1 × (0.15 × 0.8)
1 × (0.3 × 1.3)
3 × (0.25 × 1.7)
3 × (0.25 × 2.6)
±0.25
±0.25
±0.25
±0.25
2003 Jul 10 Rev.1
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Phycomp
Product specification
Thin-film chip resistors
TFx24 series, 0.05% TC50
sizes 1210, 1206, 0805, 0603 and 0402
10 Ω to 1 MΩ
SOLDERING CONDITIONS
Surface-mount resistors are tested for solderability at
235 °C during 2 seconds. The test condition for no
leaching is 260 °C for 60 seconds. Typical examples of
soldering processes that provide reliable joints without
any damage, are given in Figs 5 and 6.
The robust construction of chip resistors allows them to
be completely immersed in a solder bath of 260 °C for
one minute. Therefore, it is possible to mount surface-
mount resistors on one side of a PCB and other
components on the reverse side (mixed PCBs).
300
MLA859
10 s
T
(°C)
260 °C
245 °C
250
200
10 s
215 °C
40 s
180 °C
150
130 °C
100
2 K/s
50
0
0
50
100
150
200
250
t (s)
Typical values (solid line).
Process limits (dotted lines).
Fig.5 Infrared soldering.
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Product specification
Thin-film chip resistors
TFx24 series, 0.05% TC50
sizes 1210, 1206, 0805, 0603 and 0402
10 Ω to 1 MΩ
300
10 s
T
(°C)
MLA861
250
200
150
100
50
235 °C to 260 °C
second wave
5 K/s
2 K/s
first wave
200 K/s
100 °C to 130 °C
forced
cooling
2 K/s
0
0
50
100
150
200
250
t (s)
Typical values (solid line).
Process limits (dotted lines).
The resistors may be soldered twice in accordance with this method if desired.
Fig.6 Double wave soldering.
2003 Jul 10 Rev.1
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Product specification
Thin-film chip resistors
TFx24 series, 0.05% TC50
sizes 1210, 1206, 0805, 0603 and 0402
10 Ω to 1 MΩ
PACKING
Peel-off force
Tape and reel specifications
Peel-off forces of both paper and blister tapes are in
accordance with “IEC 60286-3” that is, at a peel-off
speed of 300 ±10 mm/minute, 0.1 N to 1.0 N for 8 mm
tape. The peel-off angle should be between 165° and
180°.
All tape and reel specifications are in accordance with
“IEC 60286-3”. Basic dimensions are given in Figs 7, 8
and 9 and Tables 9, and 10.
Paper tape specification
P
0
D
P
2
T
0
E
F
cover tape
W
B
0
MBG251
A
P
0
1
Cumulative tolerance over 10 holes: ±0.2 mm.
Bottom fixing tape thickness: 50 ±10 µm.
Top fixing tape thickness : 50 ±10 µm.
For dimensions see Table 9.
Fig.7 Paper tape.
Table 9 Dimensions of paper tape for relevant chip size; see Fig.7
TYPE AND SIZE CODE
TF124 (0805)
UNIT
SYMBOL
TF324 (0402)
TF224 (0603)
TF024 (1206)
TF524 (1210)
SIZE
0.65
1.15
8.0
TOL.
±0.1
SIZE
1.10
1.90
8.0
TOL.
±0.1
SIZE
1.65
2.40
8.0
TOL.
±0.1
SIZE
1.90
3.50
8.0
TOL.
±0.1
SIZE
2.80
3.50
8.0
TOL.
±0.1
A0
B0
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
±0.1
±0.1
±0.1
±0.1
±0.1
W
E
±0.2
±0.2
±0.2
±0.2
±0.2
1.75
3.50
1.5
±0.1
1.75
3.50
1.5
±0.1
1.75
3.50
1.50
4.0
±0.1
1.75
3.50
1.5
±0.1
1.75
3.50
1.5
±0.1
F
±0.05
+0.1/−0
±0.1
±0.05
+0.1/−0
±0.1
±0.05
+0.1/−0
±0.1
±0.05
+0.1/−0
±0.1
±0.05
+0.1/−0
±0.1
D0
P0
P1
P2
T
4.0
4.0
4.0
4.0
2.0
±0.05
±0.05
±0.1
4.0
±0.05
±0.05
±0.1
4.0
±0.05
±0.05
±0.1
4.0
±0.05
±0.05
±0.1
4.0
±0.05
±0.05
±0.1
2.0
2.0
2.0
2.0
2.0
0.53
0.7
0.85
0.85
0.85
2003 Jul 10 Rev.1
13
www.yageo.com
Phycomp
Product specification
Thin-film chip resistors
TFx24 series, 0.05% TC50
sizes 1210, 1206, 0805, 0603 and 0402
10 Ω to 1 MΩ
Tape leader/trailer specification
leader end
empty compartments
with cover tape
(min. 240 mm)
trailer end
cover tape only
trailer (max. 260 mm)
leader ≥400 mm
CCB325
Fig.8 Leader/trailer tape.
Taping requirements
Resistance side facing up.
Component is free and not sticking to top and/or bottom
tape.
Component should be easy to remove from the carrier
tape and the chip cavity should have no mechanical
damage.
2003 Jul 10 Rev.1
14
www.yageo.com
Phycomp
Product specification
Thin-film chip resistors
TFx24 series, 0.05% TC50
sizes 1210, 1206, 0805, 0603 and 0402
10 Ω to 1 MΩ
Reel specification
W
2
C
N
A
HBK039
W
1
Dimensions in mm.
For reel dimensions see Table 10.
Fig.9 Reel.
Table 10 Reel dimensions; see Fig.9
W2
MAX.
(mm)
UNITS
SIZE
TAPE
WIDTH
(mm)
W1
(mm)
A
(mm)
N
(mm)
C
(mm)
TYPE
TF324
PER
CODE
REEL
0402
0603
0508
1206
1210
10000
5000
5000
5000
5000
TF224
TF124
TF024
TF524
8
180 +0/−3
60 +1/−0
13.0 ±0.2
9.0 ±0.3
11.4 ±1
2003 Jul 10 Rev.1
15
www.yageo.com
Phycomp
Product specification
Thin-film chip resistors
TFx24 series, 0.05% TC50
sizes 1210, 1206, 0805, 0603 and 0402
10 Ω to 1 MΩ
REVISION HISTORY
Revision
Rev.0
Date
Change
Notification
Description
2001 Sep 10
2003 Jul 10
EBR-3240-
01177
- First issue of this specification
- Expansion of the thin-film low-TC product range
Rev.1
-
- Updated company logo
- Marking code revised
2003 Jul 10 Rev.1
16
www.yageo.com
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