AF0603FR-13287KL [YAGEO]
Fixed Resistor, 0.1W, 287000ohm, 75V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0603, CHIP;型号: | AF0603FR-13287KL |
厂家: | YAGEO CORPORATION |
描述: | Fixed Resistor, 0.1W, 287000ohm, 75V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0603, CHIP 电阻器 |
文件: | 总8页 (文件大小:425K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
ANTI-SULFURATED CHIP RESISTORS
AF series
5%, 1%
sizes 0402/0603/0805/1206
RoHS compliant & Halogen free
Product specification
2
8
SERIES
0402 to 1206
AF
Chip Resistor Surface Mount
SCOPE
ORDERING INFORMATION - GLOBAL PART NUMBER
This specification describes
AF0402 to AF1206 chip resistors
with anti-sulfuration capabilities.
Part number is identified by the series name, size, tolerance, packaging
type, temperature coefficient, taping reel and resistance value.
GLOBAL PART NUMBER
AF XXXX X X X XX XXXX L
APPLICATIONS
( )
( ) ( ) ( ) ( )
( )
6
( )
7
1
2
3
4
5
Environments exposed to high
levels of contamination, such
as industrial control systems
( )
1 SIZE
0402 / 0603 / 0805 / 1206
Car electronics, sensors,
electric instrumentation and
communication base stations
( )
2 TOLERANCE
F = ±1%
J = ±5%
FEATURES
( )
3 PACKAGING TYPE
Superior resistance against
R = Paper taping reel
sulfur containing atmosphere
( )
4 TEMPERATURE COEFFICIENT OF RESISTANCE
Halogen free product and
production
– = Base on spec
RoHS compliant
( )
5 TAPING REEL
-
-
Products with lead free
terminations meet RoHS
requirements
07 = 7 inch dia. Reel
13 = 13 inch dia. Reel
10 = 10 inch dia. Reel
7D = 7 inch Dia. Reel with double quantity
Pb-glass contained in electrodes,
resistor element and glass are
exempted by RoHS
( )
6 RESISTANCE VALUE
1 Ω to 22 MΩ
There are 2~4 digits indicated the resistance value. Letter R/K/M is decimal point, no
need to mention the last zero after R/K/M, e.g.1K2, not 1K20.
Reduces environmentally
hazardous waste
Detailed resistance rules are displayed in the table of “Resistance rule of global part
number”.
High component and equipment
reliability
(7) DEFAULT CODE
Saving of PCB space
Letter L is system default code for ordering only (Note)
Resistance rule of global part
number
O
RDERING EXAMPLE
The ordering code for an AF0402
chip resistor, value 100 KX with
±1% tolerance, supplied in 7-inch
tape reel with 10Kpcs quantity is:
AF0402FR-07100KL.
Resistance coding rule
Example
1R = 1 Ω
1R5 = 1.5 Ω
9R76 = 9.76 Ω
XRXX
(1 to 9.76 Ω)
XXRX
(10 to 97.6 Ω)
10R = 10 Ω
97R6 = 97.6 Ω
NOTE
1. All our RSMD products are RoHS
compliant and Halogen free. "LFP" of the
internal 2D reel label states "Lead-Free
Process"
XXXR
(100 to 976 Ω)
100R = 100 Ω
XKXX
1K = 1,000 Ω
(1 to 9.76 KΩ)
9K76 = 9760 Ω
2. On customized label, "LFP" or specific
symbol can be printed
XMXX
(1 to 9.76 MΩ)
1M = 1,000,000 Ω
9M76= 9,760,000 Ω
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Jan 07, 2011 V.0
Product specification
3
8
SERIES
0402 to 1206
AF
Chip Resistor Surface Mount
MARKING
AF0402
No marking
ynsc007
Fig. 1
AF0603 / AF0805 / AF1206
E-24 series: 3 digits, ±5%, ≥10 X
First two digits for significant figure and 3rd digit for number of zeros
03
YNSC001
Fig. 2 Value=10 KΩ
AF0603
0
E-24 series: 3 digits, ±1%
One short bar under marking letter
YNSC
Fig. 3
Value = 24 Ω
E-96 series: 3 digits, ±1%
First two digits for E-96 marking rule and 3rd letter for number of zeros
Fig. 4
Value = 12.4 KΩ
AF0805 / AF1206
Both E-24 and E-96 series: 4 digits, ±1%
First three digits for significant figure and 4th digit for number of zeros
00
YNSC004
Fig. 5 Value = 10 KΩ
NOTE
For further marking information, please see special data sheet “Chip resistors marking”. Marking of AF series is the same as RC series
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Jan 07, 2011 V.0
Product specification
4
8
SERIES
0402 to 1206
AF
Chip Resistor Surface Mount
CONSTRUCTION
The resistors are constructed on top of a high grade
ceramic body. Internal metal electrodes are added at
each end and connected by a resistive glaze. The
resistive glaze is covered by a lead-free glass.
The composition of the glaze is adjusted to give the
approximate required resistance value and laser trimming
of this resistive glaze achieves the value within tolerance.
The whole element is covered by a protective overcoat.
Size 0603 and bigger is marked with the resistance value
on top. Finally, the two external terminations (Ni / matte
tin) are added. See fig.6
OUTLINES
For dimensions see Table 1
marking layer
overcoat
primary glass layer
resistive layer
(Jumper chip is a conductor)
inner electrode
termination(Ni/matte tin)
inner electrode
H
ceramic substrate
I
2
overcoat
I
1
DIMENSIONS
Table 1 For outlines see fig. 6
W
TYPE
L (mm) W (mm) H (mm) I1 (mm) I2 (mm)
1.00 ±0.05 0.50 ±0.05 0.32 ±0.05 0.20 ±0.10 0.25 ±0.10
1.60 ±0.10 0.80 ±0.10 0.45 ±0.10 0.25 ±0.15 0.25 ±0.15
2.00 ±0.10 1.25 ±0.10 0.50 ±0.10 0.35 ±0.20 0.35 ±0.20
3.10 ±0.10 1.60 ±0.10 0.55 ±0.10 0.45 ±0.20 0.40 ±0.20
AF0402
AF0603
AF0805
AF1206
YNSC086
L
Fig. 6 Chip resistor outlines
ELECTRICAL CHARACTERISTICS
Table 2
CHARACTERISTICS
Max.
Max.
Dielectric
TYPE
RESISTANCE RANGE
Operating
Temperature Range
Temperature Coefficient
of Resistance
Working Overload Withstanding
Voltage
Voltage
Voltage
AF0402
AF0603
AF0805
AF1206
50 V
50 V
100 V
100 V
300 V
400 V
100 V
100 V
300 V
500 V
±5% (E24), 1 Ω to 22 MΩ
±1% (E24/E96), 1 Ω to 10 MΩ
Zero Ohm Jumper < 0.05 Ω
1 Ω≤ R ≤ 10 Ω, ±200 ppm/°C
10 Ω< R ≤ 10 MΩ, ±100 ppm/°C
10 MΩ< R ≤ 22 MΩ, ±200 ppm/°C
–55 °C to +155 °C
150 V
200 V
FOOTPRINT AND SOLDERING PROFILES
For recommended footprint and soldering profiles of AF-series is the same as RC-series. Please see the special
data sheet “Chip resistors mounting”.
PACKING STYLE AND PACKAGING QUANTITY
Table 3 Packing style and packaging quantity
PACKING STYLE
REEL DIMENSION
7" (178 mm)
AF0402
10,000/20,000
20,000
AF0603
5,000
AF0805
5,000
AF1206
5,000
Paper taping reel (R)
10" (254 mm)
13" (330 mm)
10,000
20,000
10,000
20,000
10,000
20,000
50,000
NOTE
1. For paper/embossed tape and reel specification/dimensions, please see the special data sheet “Chip resistors packing”.
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Jan 07, 2011 V.0
Product specification
5
8
SERIES
0402 to 1206
AF
Chip Resistor Surface Mount
FUNCTIONAL DESCRIPTION
,
OPERATING TEMPERATURE RANGE
P
MLB206_2
Range: –55 °C to +155 °C
(%P
rated
)
100
50
0
POWER RATING
Each type rated power at 70 °C:
AF0402=1/16 W (0.0625W)
AF0603=1/10 W (0.1W)
AF0805=1/8 W (0.125W)
AF1206=1/4 W (0.25W)
55
0
50 70
100
155
o
( C)
T
R
ATED VOLTAGE
amb
The DC or AC (rms) continuous working voltage
corresponding to the rated power is determined by
the following formula:
Fig. 7 Maximum dissipation (P ) in percentage of rated power
max
as a function of the operating ambient temperature (T
)
amb
(
)
V = √ P X R
Where
(
)
( )
V = Continuous rated DC or AC rms working voltage V
(
)
P = Rated power W
( )
R = Resistance value X
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Jan 07, 2011 V.0
Product specification
6
8
SERIES
0402 to 1206
AF
Chip Resistor Surface Mount
TESTS AND REQUIREMENTS
Table 4 Test condition, procedure and requirements
TEST
TEST METHOD
IEC 60115-1 4.8
PROCEDURE
REQUIREMENTS
Temperature
Coefficient of
Resistance
(T.C.R.)
At +25/–55 °C and +25/+125 °C
Refer to table 2
Formula:
R2–R1
T.C.R= ------------------------- ×106 (ppm/°C)
R1(t2–t1)
Where
t1=+25 °C or specified room temperature
t2=–55 °C or +125 °C test temperature
R1=resistance at reference temperature in ohms
R2=resistance at test temperature in ohms
IEC 60115-1 4.25
MIL-STD-202 Method 108
Life/Endurance
At 70±2 °C for 1,000 hours, RCWV applied for
1.5 hours on, 0.5 hour off, still air required
±(1.0%+0.05 Ω)
<100 mΩ for Jumper
MIL-STD-202 Method 108
High
Temperature
Exposure/
Endurance at
Upper Category
Temperature
1,000 hours at 155±5 °C, unpowered
±(1.0%+0.05 Ω) for 1% tol.
±(1.0%+0.05 Ω) for 5% tol.
<100 mΩ for Jumper
MIL-STD-202 Method 106
Moisture
Resistance
Each temperature / humidity cycle is defined at 8
hours, 3 cycles / 24 hours for 10d. with 25 °C /
65 °C 95% R.H, without steps 7a & 7b,
unpowered
±(0.5%+0.05 Ω) for 1% tol.
±(1.0%+0.05 Ω) for 5% tol.
<100 mΩ for Jumper
Parts mounted on test-boards, without
condensation on parts
MIL-STD-202 Method 107
Thermal Shock
–55 / +125 °C
±(0.5%+0.05 Ω) for 1% tol.
±(1%+0.05 Ω) for 5% tol.
<100 mΩ for Jumper
Number of cycles required is 300. Devices
unmounted
Maximum transfer time is 20 seconds. Dwell time
is 15 minutes
IEC60115-1 4.13
Short Time
Overload
2.5 times of rated voltage or maximum overload
voltage whichever is less for 5 seconds at room
temperature
±(1.0%+0.05 Ω)
No visible damage
IEC 60115-1 4.33
IEC 60068-2-21
Bending
Chips mounted on a 90 mm glass epoxy resin
PCB (FR4)
±(1.0%+0.05 Ω)
<100 mΩ for Jumper
No visible damage
Bending: 0402: 5 mm
0603/0805: 3 mm
1206: 2 mm
Bending time: 60±5 seconds
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Jan 07, 2011 V.0
Product specification
7
8
SERIES
0402 to 1206
AF
Chip Resistor Surface Mount
TEST
TEST METHOD
PROCEDURE
REQUIREMENTS
±(3.0%+0.05 Ω)
IEC 60115-1 4.37
MIL-STD-202 Method 103
Biased Humidity
(steady state)
1,000 hours at 85 °C / 85% R.H.
10% operating power
Measurement at 24±2 hours after test
conclusion
Solderability
IEC 60115-1 4.18
MIL-STD-202 Method 215
- Resistance to
Soldering Heat
Condition B, no pre-heat of samples
±(0.5%+0.05 Ω) for 1% tol.
±(1.0%+0.05 Ω) for 5% tol.
<50 mΩ for Jumper
Lead-free solder, 260±5 °C, 10±1 seconds
immersion time
Procedure 2 for SMD: devices fluxed and
cleaned with isopropanol
No visible damage
J-STD-002
- Wetting
Electrical test not required
Magnification 10X
Well tinned (≥95% covered)
No visible damage
SMD conditions:
(a) Method B, aging 4 hours at 155 °C
dry heat, lead-free solder bath at 245 °C
(b) Method B, dipping at 215 °C for 3 seconds
AEC-Q200-002
ESD
Human body model,
±(3.0%+0.05 Ω)
1 pos. + 1 neg. discharges:
0402/0603: 1 KV
0805/1206: 2 KV
IEC 60115-1 4.32
IEC 60068-2-21
Terminal Strength
FOS
A force of 5N applied for 10±1 seconds
±(1.0%+0.05 Ω)
±(1.0%+0.05 Ω)
ASTM-B-809-95
Sulfur (saturated vapor) 1,000 hours, 60±2 °C,
91-93% R.H., unpowered
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Jan 07, 2011 V.0
Product specification
8
8
SERIES
0402 to 1206
AF
Chip Resistor Surface Mount
REVISION HISTORY
REVISION DATE
CHANGE NOTIFICATION DESCRIPTION
- First issue of this specification
Version 0
Jan 07, 2011
-
“ Yageo reserves all the rights for revising the content of this datasheet without further notification, as long as the products are unchanged. Any
product change will be announced by PCN.”
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Jan 07, 2011 V.0
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