AF0603FR-13287KL [YAGEO]

Fixed Resistor, 0.1W, 287000ohm, 75V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0603, CHIP;
AF0603FR-13287KL
型号: AF0603FR-13287KL
厂家: YAGEO CORPORATION    YAGEO CORPORATION
描述:

Fixed Resistor, 0.1W, 287000ohm, 75V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0603, CHIP

电阻器
文件: 总8页 (文件大小:425K)
中文:  中文翻译
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DATA SHEET  
ANTI-SULFURATED CHIP RESISTORS  
AF series  
5%, 1%  
sizes 0402/0603/0805/1206  
RoHS compliant & Halogen free  
Product specification  
2
8
SERIES  
0402 to 1206  
AF  
Chip Resistor Surface Mount  
SCOPE  
ORDERING INFORMATION - GLOBAL PART NUMBER  
This specification describes  
AF0402 to AF1206 chip resistors  
with anti-sulfuration capabilities.  
Part number is identified by the series name, size, tolerance, packaging  
type, temperature coefficient, taping reel and resistance value.  
GLOBAL PART NUMBER  
AF XXXX X X X XX XXXX L  
APPLICATIONS  
( )  
( ) ( ) ( ) ( )  
( )  
6
( )  
7
1
2
3
4
5
Environments exposed to high  
levels of contamination, such  
as industrial control systems  
( )  
1 SIZE  
0402 / 0603 / 0805 / 1206  
Car electronics, sensors,  
electric instrumentation and  
communication base stations  
( )  
2 TOLERANCE  
F = ±1%  
J = ±5%  
FEATURES  
( )  
3 PACKAGING TYPE  
Superior resistance against  
R = Paper taping reel  
sulfur containing atmosphere  
( )  
4 TEMPERATURE COEFFICIENT OF RESISTANCE  
Halogen free product and  
production  
– = Base on spec  
RoHS compliant  
( )  
5 TAPING REEL  
-
-
Products with lead free  
terminations meet RoHS  
requirements  
07 = 7 inch dia. Reel  
13 = 13 inch dia. Reel  
10 = 10 inch dia. Reel  
7D = 7 inch Dia. Reel with double quantity  
Pb-glass contained in electrodes,  
resistor element and glass are  
exempted by RoHS  
( )  
6 RESISTANCE VALUE  
1 to 22 MΩ  
There are 2~4 digits indicated the resistance value. Letter R/K/M is decimal point, no  
need to mention the last zero after R/K/M, e.g.1K2, not 1K20.  
Reduces environmentally  
hazardous waste  
Detailed resistance rules are displayed in the table of “Resistance rule of global part  
number”.  
High component and equipment  
reliability  
(7) DEFAULT CODE  
Saving of PCB space  
Letter L is system default code for ordering only (Note)  
Resistance rule of global part  
number  
O
RDERING EXAMPLE  
The ordering code for an AF0402  
chip resistor, value 100 KX with  
±1% tolerance, supplied in 7-inch  
tape reel with 10Kpcs quantity is:  
AF0402FR-07100KL.  
Resistance coding rule  
Example  
1R = 1 Ω  
1R5 = 1.5 Ω  
9R76 = 9.76 Ω  
XRXX  
(1 to 9.76 )  
XXRX  
(10 to 97.6 )  
10R = 10 Ω  
97R6 = 97.6 Ω  
NOTE  
1. All our RSMD products are RoHS  
compliant and Halogen free. "LFP" of the  
internal 2D reel label states "Lead-Free  
Process"  
XXXR  
(100 to 976 )  
100R = 100 Ω  
XKXX  
1K = 1,000 Ω  
(1 to 9.76 K)  
9K76 = 9760 Ω  
2. On customized label, "LFP" or specific  
symbol can be printed  
XMXX  
(1 to 9.76 M)  
1M = 1,000,000 Ω  
9M76= 9,760,000 Ω  
www.yageo.com  
Jan 07, 2011 V.0  
Product specification  
3
8
SERIES  
0402 to 1206  
AF  
Chip Resistor Surface Mount  
MARKING  
AF0402  
No marking  
ynsc007  
Fig. 1  
AF0603 / AF0805 / AF1206  
E-24 series: 3 digits, ±5%, 10 X  
First two digits for significant figure and 3rd digit for number of zeros  
03  
YNSC001  
Fig. 2 Value=10 K  
AF0603  
0
E-24 series: 3 digits, ±1%  
One short bar under marking letter  
YNSC  
Fig. 3  
Value = 24 Ω  
E-96 series: 3 digits, ±1%  
First two digits for E-96 marking rule and 3rd letter for number of zeros  
Fig. 4  
Value = 12.4 KΩ  
AF0805 / AF1206  
Both E-24 and E-96 series: 4 digits, ±1%  
First three digits for significant figure and 4th digit for number of zeros  
00  
YNSC004  
Fig. 5 Value = 10 KΩ  
NOTE  
For further marking information, please see special data sheet “Chip resistors marking”. Marking of AF series is the same as RC series  
www.yageo.com  
Jan 07, 2011 V.0  
Product specification  
4
8
SERIES  
0402 to 1206  
AF  
Chip Resistor Surface Mount  
CONSTRUCTION  
The resistors are constructed on top of a high grade  
ceramic body. Internal metal electrodes are added at  
each end and connected by a resistive glaze. The  
resistive glaze is covered by a lead-free glass.  
The composition of the glaze is adjusted to give the  
approximate required resistance value and laser trimming  
of this resistive glaze achieves the value within tolerance.  
The whole element is covered by a protective overcoat.  
Size 0603 and bigger is marked with the resistance value  
on top. Finally, the two external terminations (Ni / matte  
tin) are added. See fig.6  
OUTLINES  
For dimensions see Table 1  
marking layer  
overcoat  
primary glass layer  
resistive layer  
(Jumper chip is a conductor)  
inner electrode  
termination(Ni/matte tin)  
inner electrode  
H
ceramic substrate  
I
2
overcoat  
I
1
DIMENSIONS  
Table 1 For outlines see fig. 6  
W
TYPE  
L (mm) W (mm) H (mm) I1 (mm) I2 (mm)  
1.00 ±0.05 0.50 ±0.05 0.32 ±0.05 0.20 ±0.10 0.25 ±0.10  
1.60 ±0.10 0.80 ±0.10 0.45 ±0.10 0.25 ±0.15 0.25 ±0.15  
2.00 ±0.10 1.25 ±0.10 0.50 ±0.10 0.35 ±0.20 0.35 ±0.20  
3.10 ±0.10 1.60 ±0.10 0.55 ±0.10 0.45 ±0.20 0.40 ±0.20  
AF0402  
AF0603  
AF0805  
AF1206  
YNSC086  
L
Fig. 6 Chip resistor outlines  
ELECTRICAL CHARACTERISTICS  
Table 2  
CHARACTERISTICS  
Max.  
Max.  
Dielectric  
TYPE  
RESISTANCE RANGE  
Operating  
Temperature Range  
Temperature Coefficient  
of Resistance  
Working Overload Withstanding  
Voltage  
Voltage  
Voltage  
AF0402  
AF0603  
AF0805  
AF1206  
50 V  
50 V  
100 V  
100 V  
300 V  
400 V  
100 V  
100 V  
300 V  
500 V  
±5% (E24), 1 to 22 MΩ  
±1% (E24/E96), 1 to 10 MΩ  
Zero Ohm Jumper < 0.05 Ω  
1 R 10 , ±200 ppm/°C  
10 < R 10 M, ±100 ppm/°C  
10 M< R 22 M, ±200 ppm/°C  
–55 °C to +155 °C  
150 V  
200 V  
FOOTPRINT AND SOLDERING PROFILES  
For recommended footprint and soldering profiles of AF-series is the same as RC-series. Please see the special  
data sheet “Chip resistors mounting”.  
PACKING STYLE AND PACKAGING QUANTITY  
Table 3 Packing style and packaging quantity  
PACKING STYLE  
REEL DIMENSION  
7" (178 mm)  
AF0402  
10,000/20,000  
20,000  
AF0603  
5,000  
AF0805  
5,000  
AF1206  
5,000  
Paper taping reel (R)  
10" (254 mm)  
13" (330 mm)  
10,000  
20,000  
10,000  
20,000  
10,000  
20,000  
50,000  
NOTE  
1. For paper/embossed tape and reel specification/dimensions, please see the special data sheet “Chip resistors packing”.  
www.yageo.com  
Jan 07, 2011 V.0  
Product specification  
5
8
SERIES  
0402 to 1206  
AF  
Chip Resistor Surface Mount  
FUNCTIONAL DESCRIPTION  
,
OPERATING TEMPERATURE RANGE  
P
MLB206_2  
Range: –55 °C to +155 °C  
(%P  
rated  
)
100  
50  
0
POWER RATING  
Each type rated power at 70 °C:  
AF0402=1/16 W (0.0625W)  
AF0603=1/10 W (0.1W)  
AF0805=1/8 W (0.125W)  
AF1206=1/4 W (0.25W)  
55  
0
50 70  
100  
155  
o
( C)  
T
R
ATED VOLTAGE  
amb  
The DC or AC (rms) continuous working voltage  
corresponding to the rated power is determined by  
the following formula:  
Fig. 7 Maximum dissipation (P ) in percentage of rated power  
max  
as a function of the operating ambient temperature (T  
)
amb  
(
)
V = P X R  
Where  
(
)
( )  
V = Continuous rated DC or AC rms working voltage V  
(
)
P = Rated power W  
( )  
R = Resistance value X  
www.yageo.com  
Jan 07, 2011 V.0  
Product specification  
6
8
SERIES  
0402 to 1206  
AF  
Chip Resistor Surface Mount  
TESTS AND REQUIREMENTS  
Table 4 Test condition, procedure and requirements  
TEST  
TEST METHOD  
IEC 60115-1 4.8  
PROCEDURE  
REQUIREMENTS  
Temperature  
Coefficient of  
Resistance  
(T.C.R.)  
At +25/–55 °C and +25/+125 °C  
Refer to table 2  
Formula:  
R2–R1  
T.C.R= ------------------------- ×106 (ppm/°C)  
R1(t2–t1)  
Where  
t1=+25 °C or specified room temperature  
t2=–55 °C or +125 °C test temperature  
R1=resistance at reference temperature in ohms  
R2=resistance at test temperature in ohms  
IEC 60115-1 4.25  
MIL-STD-202 Method 108  
Life/Endurance  
At 70±2 °C for 1,000 hours, RCWV applied for  
1.5 hours on, 0.5 hour off, still air required  
±(1.0%+0.05 )  
<100 mfor Jumper  
MIL-STD-202 Method 108  
High  
Temperature  
Exposure/  
Endurance at  
Upper Category  
Temperature  
1,000 hours at 155±5 °C, unpowered  
±(1.0%+0.05 ) for 1% tol.  
±(1.0%+0.05 ) for 5% tol.  
<100 mfor Jumper  
MIL-STD-202 Method 106  
Moisture  
Resistance  
Each temperature / humidity cycle is defined at 8  
hours, 3 cycles / 24 hours for 10d. with 25 °C /  
65 °C 95% R.H, without steps 7a & 7b,  
unpowered  
±(0.5%+0.05 ) for 1% tol.  
±(1.0%+0.05 ) for 5% tol.  
<100 mfor Jumper  
Parts mounted on test-boards, without  
condensation on parts  
MIL-STD-202 Method 107  
Thermal Shock  
–55 / +125 °C  
±(0.5%+0.05 ) for 1% tol.  
±(1%+0.05 ) for 5% tol.  
<100 mfor Jumper  
Number of cycles required is 300. Devices  
unmounted  
Maximum transfer time is 20 seconds. Dwell time  
is 15 minutes  
IEC60115-1 4.13  
Short Time  
Overload  
2.5 times of rated voltage or maximum overload  
voltage whichever is less for 5 seconds at room  
temperature  
±(1.0%+0.05 )  
No visible damage  
IEC 60115-1 4.33  
IEC 60068-2-21  
Bending  
Chips mounted on a 90 mm glass epoxy resin  
PCB (FR4)  
±(1.0%+0.05 )  
<100 mfor Jumper  
No visible damage  
Bending: 0402: 5 mm  
0603/0805: 3 mm  
1206: 2 mm  
Bending time: 60±5 seconds  
www.yageo.com  
Jan 07, 2011 V.0  
Product specification  
7
8
SERIES  
0402 to 1206  
AF  
Chip Resistor Surface Mount  
TEST  
TEST METHOD  
PROCEDURE  
REQUIREMENTS  
±(3.0%+0.05 )  
IEC 60115-1 4.37  
MIL-STD-202 Method 103  
Biased Humidity  
(steady state)  
1,000 hours at 85 °C / 85% R.H.  
10% operating power  
Measurement at 24±2 hours after test  
conclusion  
Solderability  
IEC 60115-1 4.18  
MIL-STD-202 Method 215  
- Resistance to  
Soldering Heat  
Condition B, no pre-heat of samples  
±(0.5%+0.05 ) for 1% tol.  
±(1.0%+0.05 ) for 5% tol.  
<50 mfor Jumper  
Lead-free solder, 260±5 °C, 10±1 seconds  
immersion time  
Procedure 2 for SMD: devices fluxed and  
cleaned with isopropanol  
No visible damage  
J-STD-002  
- Wetting  
Electrical test not required  
Magnification 10X  
Well tinned (95% covered)  
No visible damage  
SMD conditions:  
(a) Method B, aging 4 hours at 155 °C  
dry heat, lead-free solder bath at 245 °C  
(b) Method B, dipping at 215 °C for 3 seconds  
AEC-Q200-002  
ESD  
Human body model,  
±(3.0%+0.05 )  
1 pos. + 1 neg. discharges:  
0402/0603: 1 KV  
0805/1206: 2 KV  
IEC 60115-1 4.32  
IEC 60068-2-21  
Terminal Strength  
FOS  
A force of 5N applied for 10±1 seconds  
±(1.0%+0.05 )  
±(1.0%+0.05 )  
ASTM-B-809-95  
Sulfur (saturated vapor) 1,000 hours, 60±2 °C,  
91-93% R.H., unpowered  
www.yageo.com  
Jan 07, 2011 V.0  
Product specification  
8
8
SERIES  
0402 to 1206  
AF  
Chip Resistor Surface Mount  
REVISION HISTORY  
REVISION DATE  
CHANGE NOTIFICATION DESCRIPTION  
- First issue of this specification  
Version 0  
Jan 07, 2011  
-
“ Yageo reserves all the rights for revising the content of this datasheet without further notification, as long as the products are unchanged. Any  
product change will be announced by PCN.”  
www.yageo.com  
Jan 07, 2011 V.0  

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