AF162FR-1310R [YAGEO]
ANTI-SULFURATED CHIP RESISTORS;型号: | AF162FR-1310R |
厂家: | YAGEO CORPORATION |
描述: | ANTI-SULFURATED CHIP RESISTORS |
文件: | 总8页 (文件大小:555K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
ANTI-SULFURATED CHIP RESISTORS
AF122 (4Pin/2R) / AF124 (8Pin/4R) /
AF162 (4Pin/ 2R)/ AF164 (8Pin/ 4R)
5%, 1%
sizes 2 × 0402, 4 x 0402, 2 x 0603, 4 x 0603
RoHS compliant
Product specification
2
8
SERIES
122/124/162/164 (RoHS Compliant)
AF
Chip Resistor Surface Mount
SCOPE
ORDERING INFORMATION - GLOBAL PART NUMBER & 12NC
This specification describes
AF122/AF124/AF162/AF164
(convex)series chip resistor arrays
with lead-free terminations made
by thick film process.
Both part numbers are identified by the series, size, tolerance, packing
type, temperature coefficient, taping reel and resistance value.
YAGEO BRAND ordering code
(
)
GLOBAL PART NUMBER PREFERRED
AF XX X - X X X XX XXXX L
(1) (2) (3)(4) (5) (6)
(7)
APPLICATIONS
(1)
(2)
SIZE
Terminal for SDRAM and
DDRAM
12 = 0402 x 2 (0404)
12 = 0402 x 4 (0408)
16 = 0603 x 2 (0606)
16 = 0603 x 4 (0612)
NUMBER OF RESISTORS
High-end Computer &
Multimedia Electronics in high
sulfur environment
Consume electronic
equipments: PDAs, PNDs
2 = 2 resistors
4 = 4 resistors
Mobile phone, telecom…
(3) TOLERANCE
FEATURES
F = ±1%
AEC-Q200 qualified
J = ±5% (for Jumper ordering, use code of J)
RoHS compliant
(4) PACKAGING TYPE
Reducing environmentally
hazardous wastes
R = Paper taping reel
High component and equipment
reliability
(5) TEMPERATURE COEFFICIENT OF RESISTANCE
– = Base on spec
Saving of PCB space
(6) TAPING REEL
None forbidden-materials used
in products/production
07 = 7 inch dia. Reel
13 = 13 inch dia. Reel
Halogen Free Epoxy
Moisture sensitivity level: MSL 1
(7) RESISTANCE VALUE
There are 2~4 digits indicated the resistor value. Letter R/K/M is decimal point, no need
to mention the last zero after R/K/M, e.g.1K2, not 1K20.
Detailed resistance rules show in table of “Resistance rule of global part number”.
Resistance rule of global part
number
ORDERING EXAMPLE
The ordering code of a AF122
convex chip resistor array, value
1,000Ω with ±5% tolerance,
supplied in 7-inch tape reel is:
AF122-JR-071KL.
Resistance code rule
Example
0R
0R = Jumper
1R = 1 Ω
1R5 = 1.5 Ω
9R76 = 9.76 Ω
XRXX
(1 to 9.76 Ω)
NOTE
XXRX
(10 to 97.6 Ω)
10R = 10 Ω
97R6 = 97.6 Ω
1. All our R-Chip products meet RoHS
compliant. "LFP" of the internal 2D reel
label mentions "Lead Free Process"
XXXR
(100 to 976 Ω)
100R = 100 Ω
2. On customized label, "LFP" or specific
symbol printed and the optional "L" at
the end of GLOBAL PART NUMBER
XKXX
(1 to 9.76 KΩ)
1K = 1,000 Ω
9K76 = 9760 Ω
XM
1M = 1,000,000 Ω
(1 MΩ)
www.yageo.com
Jun. 28, 2016 V.4
Product specification
3
8
SERIES
122/124/162/164 (RoHS Compliant)
AF
Chip Resistor Surface Mount
MARKING
AF122 / 162
No marking
Fig. 1
AF124 / 164
0
I-Digit marking
Fig. 2 Value = 0Ω
1% E-24/E-96: R≧ 100Ω 4digits
First three digits for significant figure and 4th digit for number of zeros
3 60
Fig. 3 Value = 316KΩ
5% E-24: R≧ 10Ω
First two digits for significant figure and 3rd digit for number of zeros
Fig. 3 Value = 240KΩ
For further marking information, please refer to data sheet “Chip resistors marking”.
CONSTRUCTION
The resistor is constructed on top
of a high-grade ceramic body.
OUTLINES
Internal metal electrodes are added
on each end to make the contacts to
the thick film resistive element. The
composition of the resistive element
is a noble metal embedded into a
glass and covered by a glass. The
resistor is laser trimmed to the
rated resistance value. The resistor
is covered with a protective epoxy
coat, finally the external
Fig. 4 Chip resistor outlines
terminations (matte tin on Ni-
barrier) are added as shown in Fig.4.
DIMENSIONS
Table 1
For dimension, please refer to Table 1
AF122 / 162
TYPE
AF122
0.24±0.10
0.30+0.10/-0.05
---
AF124
0.25±0.15
0.45±0.05
0.30±0.05
0.50±0.05
2.00±0.10
0.45±0.10
0.30±0.15
1.00±0.10
AF162
0.35±0.10
0.30±0.10
--
AF164
0.35±0.15
0.65±0.05
0.50±0.15
0.80±0.05
3.20±0.15
0.60±0.10
0.30± 0.15
1.60±0.15
AF124 / 164
B (mm)
H (mm)
H1 (mm)
P (mm)
L (mm)
T (mm)
0.80±0.05
1.60±0.10
0.40±0.10
0.30±0.10
1.60±0.10
0.67±0.05
1.00±0.10
0.30±0.10
0.25±0.10
1.00±0.10
Fig. 5 AF122/124/162/164 series chip resistors dimension
W1 (mm)
W2 (mm)
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Jun. 28, 2016 V.4
Product specification
4
8
SERIES
122/124/162/164 (RoHS Compliant)
AF
Chip Resistor Surface Mount
SCHEMATIC
For dimension, please refer to Fig. 5 and Table 1
Fig. 6 Equivalent circuit diagram
ELECTRICAL CHARACTERISTICS
Table 2
AF122
AF124
AF162
AF164
CHARACTERISTICS
Operating Temperature
Rated Power
–55 °C to +155 °C
1/16 W
–55 °C to +155 °C
–55 °C to +155 °C
–55 °C to +155 °C
1/16W
1/16W
1/16 W
25 V
Maximum Working Voltage
Maximum Overload Voltage
Dielectric Withstanding
50V
50V
50 V
100V
100V
100 V
50 V
100V
100V
100 V
100 V
5% (E24) 1 Ω to 1 MΩ
5% (E24) 1 Ω to 1 MΩ
5% (E24) 1 Ω to 1 MΩ
5% (E24) 1 Ω to 1 MΩ
1% (E24/E96) 10 Ω to 1 MΩ 1% (E24/E96) 1 Ω to 1 MΩ 1% (E24/E96) 1 Ω to 1 MΩ 1% (E24/E96) 1 Ω to 1 MΩ
Resistance Range
Jumper < 50 mΩ
Jumper < 50 mΩ
Jumper < 50 mΩ
Jumper < 50 mΩ
1 Ω ≤ R ≤ 10 Ω ±250 ppm/°C
10 Ω ≤ R ≤ 1 MΩ ±200 ppm/°C
Temperature Coefficient
Jumper Criteria
±250 ppm/°C
Rated Current 1.0A
Rated Current
Maximum Current
0.5 A
Rated Current
1.0 A
Rated Current
1.0 A
2.0 A
Maximum Current 2.0A
1.0 A Maximum Current
2.0 A Maximum Current
FOOTPRINT AND SOLDERING PROFILES
For recommended footprint and soldering profiles, please refer to data sheet
“Chip resistors mounting”.
PACKING STYLE AND PACKAGING QUANTITY
Table 3 Packing style and packaging quantity
PACKING STYLE
REEL DIMENSION
7" (178 mm)
AF122
10,000 units
50,000 units
AF124
10,000 units
40,000 units
AF162
AF164
5,000 units
20,000 units
Paper Taping Reel (R)
5,000 units
---
13" (330 mm)
NOTE
1. For paper tape and reel specification/dimensions, please refer to data sheet “Chip resistors packing”.
www.yageo.com
Jun. 28, 2016 V.4
Product specification
5
8
SERIES
122/124/162/164 (RoHS Compliant)
AF
Chip Resistor Surface Mount
FUNCTIONAL DESCRIPTION
POWER RATING
AF122 / AF124 / AF162 / AF164 rated power at
70 °C is 1/16 W
RATED VOLTAGE
The DC or AC (rms) continuous working voltage
corresponding to the rated power is determined by
the following formula:
V= (P XR)
or max. working voltage whichever is less
Fig. 7 Maximum dissipation (P) in percentage of rated power as a
function of the operating ambient temperature (T
Where
)
amb
V=Continuous rated DC or
AC (rms) working voltage (V)
P=Rated power (W)
R=Resistance value (Ω)
www.yageo.com
Jun. 28, 2016 V.4
Product specification
6
8
SERIES
122/124/162/164 (RoHS Compliant)
AF
Chip Resistor Surface Mount
TESTS AND REQUIREMENTS
Table 4 Test condition, procedure and requirements
TEST
TEST METHOD
PROCEDURE
REQUIREMENTS
MIL-STD-202-method 108
IEC 60115-1 4.25
1,000 hours at 70± 2 °C applied RCWV
1.5 hours on, 0.5 hour off, still air required
±(2%+0.05 Ω )
Life/
Endurance
<100 mΩ for Jumper
MIL-STD-202-method 108
MIL-STD-202-method 106
1,000 hours at maximum operating
temperature depending on specification,
unpowered
±(1%+0.05 Ω)
<50 mΩ for Jumper
High Temperature
Exposure
Tolerances: 155±3 °C
Each temperature / humidity cycle is defined at ±(2%+0.05 Ω)
Moisture
8 hours (method 106G), 3 cycles / 24 hours
for 10d with 25 °C / 65 °C 95% R.H, without
steps 7a & 7b, unpowered
Resistance
<100 mΩ for Jumper
Parts mounted on test-boards, without
condensation on parts
Measurement at 24±2 hours after
test conclusion
MIL-STD-202-method 107
-55/+125 °C
±(1%+0.05 Ω)
Thermal Shock
Note: Number of cycles required is 300.
Devices mounted
<50 mΩ for Jumper
Maximum transfer time is 20 seconds. Dwell
time is 15 minutes. Air – Air
IEC60115-1 4.13
IEC60115-1 4.33
2.5 times RCWV or maximum overload
voltage whichever is less for 5 sec at room
temperature
±(2%+0.05 Ω)
Short Time
Overload
<50 mΩ for Jumper
No visible damage
Device mounted on PCB test board as
described, only 1 board bending required
±(1%+0.05 Ω)
Board Flex/
Bending
<50 mΩ for Jumper
No visible damage
3 mm bending
Bending time: 60±5 seconds
Ohmic value checked during bending
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Jun. 28, 2016 V.4
Product specification
7
8
SERIES
122/124/162/164 (RoHS Compliant)
AF
Chip Resistor Surface Mount
TEST
TEST METHOD
J-STD-002 test B
PROCEDURE
REQUIREMENTS
Solderability
- Wetting
Well tinned (≥95% covered)
No visible damage
Electrical Test not required
Magnification 50X
SMD conditions:
1st step: method B, aging 4 hours at 155 °C
dry heat
2nd step: leadfree solder bath at 245±3 °C
Dipping time: 3±0.5 seconds
J-STD-002 test D
IEC 60115-1 4.18
Leadfree solder, 260 °C, 30 seconds
immersion time
No visible damage
- Leaching
Condition B, no pre-heat of samples
±(1%+0.05Ω)
- Resistance to
Soldering Heat
MIL-STD-202 Method 215
Leadfree solder, 260 °C, 10 seconds
immersion time
<50 mΩ for Jumper
No visible damage
Procedure 2 for SMD: devices fluxed and
cleaned with isopropanol
ASTM-B-809-95*
*Modified
±(4.0%+0.05Ω)
FOS
Sulfur 750 hours, 105℃, unpowered
<100mΩ for Jumper
www.yageo.com
Jun. 28, 2016 V.4
Product specification
8
8
SERIES
122/124/162/164 (RoHS Compliant)
AF
Chip Resistor Surface Mount
REVISION HISTORY
REVISION DATE
CHANGE NOTIFICATION DESCRIPTION
-
-
-
-
-
Version 4
Version 3
Version 2
Version 1
Version 0
Jun. 23, 2016
Nov. 17, 2015
May 29,2015
Aug. 15, 2014
Oct. 02, 2013
- AEC-Q200 qualified
- Add in AF162
- Add in AF164
- Update AF124 dimensions
- First issue of this specification
“ Yageo reserves all the rights for revising the content of this datasheet without further notification, as long as the products itself are unchanged. Any
product change will be announced by PCN.”
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Jun. 28, 2016 V.4
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