AF2512DK-1310R 概述
ANTI-SULFURATED CHIP RESISTORS
AF2512DK-1310R 数据手册
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PDF下载ANTI-SULFURATED CHIP RESISTORS
AF series
5%, 1%, 0.5%
sizes 0201/0402/0603/0805/1206/1210/1218/2010/2512
RoHS compliant & Halogen free
Product specification
2
9
SERIES
0201 to 2512
AF
Chip Resistor Surface Mount
SCOPE
ORDERING INFORMATION - GLOBAL PART NUMBER
This specification describes
AF0201 to AF2512 chip resistors
with anti-sulfuration capabilities.
Part number is identified by the series name, size, tolerance, packaging
type, temperature coefficient, taping reel and resistance value.
GLOBAL PART NUMBER
AF XXXX X X X XX XXXX L
APPLICATIONS
( )
( ) ( ) ( ) ( )
( )
6
( )
7
1
2
3
4
5
Industrial Equipment
Power Application
Networking Application
( )
1 SIZE
0201/0402/0603/0805/1206/1210/1218/2010/2512
High-end Computer &
Multimedia Electronics in high
sulfur environment
( )
2 TOLERANCE
D = ±0.5%
F = ±1%
Automotive electronics
J = ±5% (for jumper ordering, use code of J)
FEATURES
( )
3 PACKAGING TYPE
AEC-Q200 qualified
Superior resistance against
sulfur containing atmosphere
R = Paper taping reel
K = Embossed plastic tape reel
Halogen free product and
production
RoHS compliant
( )
4 TEMPERATURE COEFFICIENT OF RESISTANCE
– = Base on spec
( )
Reduces environmentally
5 TAPING REEL
hazardous waste
07 = 7 inch dia. Reel
13 = 13 inch dia. Reel
High component and
equipment reliability
Saving of PCB space
Moisture sensitivity level:
MSL 1
( )
6 RESISTANCE VALUE
There are 2~4 digits indicated the resistance value. Letter R/K/M is decimal point.
Detailed resistance rules are displayed in the table of “Resistance rule of global part
number”.
(7) DEFAULT CODE
Letter L is system default code for ordering only (Note)
Resistance rule of global part
number
ORDERING EXAMPLE
The ordering code for an AF0402
chip resistor, value 100 KΩ with
±1% tolerance, supplied in 7-inch
tape reel with 10Kpcs quantity is:
AF0402FR-07100KL.
Resistance coding rule
Example
1R = 1 Ω
1R5 = 1.5 Ω
9R76 = 9.76 Ω
XRXX
(1 to 9.76 Ω)
XXRX
10R = 10 Ω
NOTE
(10 to 97.6 Ω)
97R6 = 97.6 Ω
1. All our R-Chip products are RoHS
compliant and Halogen free. "LFP" of the
internal 2D reel label states "Lead-Free
Process"
XXXR
(100 to 976 Ω)
100R = 100 Ω
XKXX
1K = 1,000 Ω
2. On customized label, "LFP" or specific
symbol can be printed
(1 to 9.76 KΩ)
9K76 = 9760 Ω
XMXX
1M = 1,000,000 Ω
(1 to 9.76 MΩ)
9M76= 9,760,000 Ω
www.yageo.com
Jun. 21, 2016 V.5
Product specification
3
9
SERIES
0201 to 2512
AF
Chip Resistor Surface Mount
MARKING
AF0201 / AF0402
No marking
Fig. 1
AF0603 / AF0805 / AF1206 / AF1210 / AF2010 / AF2512
E-24 series: 3 digits, ±5%, ≥10Ω
First two digits for significant figure and 3rd digit for number of zeros
03
Fig. 2 Value=10 KΩ
AF0603
E-24 series: 3 digits, ±1%
One short bar under marking letter
0
Fig. 3
Value = 24 Ω
E-96 series: 3 digits, ±1%
First two digits for E-96 marking rule and 3rd letter for number of zeros
Fig. 4
Value = 12.4 KΩ
AF0805 / AF1206 / AF1210 / AF2010 / AF2512
Both E-24 and E-96 series: 4 digits, ±1%
First three digits for significant figure and 4th digit for number of zeros
Fig. 5 Value = 10 KΩ
AF1218
E-24 series: 3 digits, ±5%
First two digits for significant figure and 3rd digit for number of zeros
Fig. 6 Value = 10 KΩ
Both E-24 and E-96 series: 4 digits, ±1%
First three digits for significant figure and 4th digit for number of zeros
00
Fig. 7 Value = 10 KΩ
NOTE
For further marking information, please see special data sheet “Chip resistors marking”. Marking of AF series is the same as RC series
www.yageo.com
Jun. 21, 2016 V.5
Product specification
4
9
SERIES
0201 to 2512
AF
Chip Resistor Surface Mount
CONSTRUCTION
OUTLINES
The resistors are constructed on top of a high grade
ceramic body. Internal metal electrodes are added at
each end and connected by a resistive glaze. The
resistive glaze is covered by a glass.
For dimensions see Table 1
The composition of the glaze is adjusted to give the
approximate required resistance value and laser trimming
of this resistive glaze achieves the value within tolerance.
The whole element is covered by a protective overcoat.
Size 0603 and bigger is marked with the resistance value
on top. Finally, the two external terminations (Ni / matte
tin) are added. See fig.8
DIMENSIONS
Table 1 For outlines see fig. 8
TYPE
L (mm) W (mm) H (mm) I1 (mm) I2 (mm)
AF0201
0.60±0.03 0.30±0.03 0.23±0.03 0.12±0.05 0.15±0.05
AF0402
AF0603
AF0805
AF1206
AF1210
AF1218
AF2010
AF2512
1.00 ±0.05 0.50 ±0.05 0.32 ±0.05 0.20 ±0.10 0.25 ±0.10
1.60 ±0.10 0.80 ±0.10 0.45 ±0.10 0.25 ±0.15 0.25 ±0.15
2.00 ±0.10 1.25 ±0.10 0.50 ±0.10 0.35 ±0.20 0.35 ±0.20
Fig. 8 Chip resistor outlines
3.10 ±0.10 1.60 ±0.10 0.55 ±0.10 0.45 ±0.20 0.40 ±0.20
3.10±0.10 2.60±0.15 0.50±0.10 0.45±0.15 0.50±0.20
3.10±0.10 4.60±0.10 0.55±0.10 0.45±0.20 0.40±0.20
5.00±0.10 2.50±0.15 0.55±0.10 0.55±0.15 0.50±0.20
6.35±0.10 3.10±0.15 0.55±0.10 0.60±0.20 0.50±0.20
www.yageo.com
Jun. 21, 2016 V.5
Product specification
5
9
SERIES
0201 to 2512
AF
Chip Resistor Surface Mount
ELECTRICAL CHARACTERISTICS
Table 2
CHARACTERISTICS
Max. Dielectric
Temperature Working Overload Withstanding
Operating
Max.
Temperature Coefficient
of Resistance
Jumper
Criteria
TYPE
RESISTANCE RANGE
Range Voltage
Voltage
Voltage
Rated Current
0.5A
±5% (E24),
1Ωto 10MΩ
Max. Current
1.0A
1Ω≤ R ≤10Ω, -100/+350 ppm/°C
10Ω<R ≤ 10MΩ, ±200 ppm/°C
AF0201
±0.5%, ±1% (E24/E96),
1Ω to 10MΩ
25 V
50 V
50 V
Zero Ohm Jumper < 0.05Ω
Rated Current
1.0A
AF0402
AF0603
50 V
75 V
100 V
150 V
100 V
150 V
Max. Current
2.0A
±5% (E24),
1 Ω to 22 MΩ
Rated Current
2.0A
1 Ω≤ R ≤ 10 Ω, ±200 ppm/°C
10 Ω< R ≤ 10 MΩ, ±100 ppm/°C
10 MΩ< R ≤ 22 MΩ, ±200 ppm/°C
±0.5%, ±1% (E24/E96),
1 Ω to 10 MΩ
AF0805
AF1206
AF1210
AF1218
150 V
300 V
400 V
500 V
500 V
300 V
500 V
500 V
500 V
Max. Current
5.0A
Zero Ohm Jumper < 0.05 Ω
Rated Current
2.0A
–55 °C to +155 °C
200 V
200 V
200 V
Max. Current
10.0A
Rated Current
2.0A
±5% (E24),
1Ω to 10MΩ
± 0.5%, ±1% (E24/E96),
1Ω to 10M
Max. Current
10.0A
Zero Ohm Jumper < 0.05Ω
Rated Current
2.0A
±5% (E24),
1Ω to 1MΩ
± 0.5%, ±1% (E24/E96),
1Ω≤ R≤ 10Ω, ±200 ppm/°C
Max. Current
10.0A
1Ω to 1M
Zero Ohm Jumper < 0.05Ω
10Ω<R ≤ 10MΩ, ±100 ppm/°C
Rated Current
2.0A
±5% (E24),
1Ω to 10MΩ
± 0.5%, ±1% (E24/E96),
1Ω to 10M
AF2010
AF2512
200 V
200V
500 V
500V
500 V
500V
Max. Current
10.0A
Zero Ohm Jumper < 0.05Ω
www.yageo.com
Jun. 21, 2016 V.5
Product specification
6
9
SERIES
0201 to 2512
AF
Chip Resistor Surface Mount
FOOTPRINT AND SOLDERING PROFILES
For recommended footprint and soldering profiles of AF-series is the same as RC-series. Please see the special
data sheet “Chip resistors mounting”.
PACKING STYLE AND PACKAGING QUANTITY
Table 3 Packing style and packaging quantity
PACKING STYLE
REEL
DIMENSION
AF0201
AF0402 AF0603/0805/
1206
AF1210 AF1218/2010/
2512
Paper taping reel (R)
7" (178 mm) 10,000/20,000 10,000/20,000
5,000
20,000
--
5,000
20,000
--
--
--
13" (330 mm)
7" (178 mm)
50,000
--
50,000
--
Embossed taping reel (K)
4,000
NOTE
1. For paper/embossed tape and reel specification/dimensions, please see the special data sheet “Chip resistors packing”.
FUNCTIONAL DESCRIPTION
OPERATING TEMPERATURE RANGE
AF0201 - AF2512 Range:
-55 °C to + 155 °C (Fig. 7)
POWER RATING
Each type rated power at 70 °C:
AF0201=1/20W (0.05W)
AF0402=1/16 W (0.0625W)
AF0603=1/10 W (0.1W)
AF0805=1/8 W (0.125W)
AF1206=1/4 W (0.25W)
AF1210=1/2W (0.5W)
AF1218=1W
AF2010=3/4W (0.75W)
Fig. 7 Maximum dissipation (P ) in percentage of rated power as
AF2512=1W
max
a function of the operating ambient temperature (T
)
amb
RATED VOLTAGE
The DC or AC (rms) continuous working voltage
corresponding to the rated power is determined by
the following formula:
(
)
V = P X R
Where
(
)
V = Continuous rated DC or AC rms working
( )
voltage V
P = Rated power W
(
)
(
)
R = Resistance value Ω
www.yageo.com
Jun. 21, 2016 V.5
Product specification
7
9
SERIES
0201 to 2512
AF
Chip Resistor Surface Mount
TESTS AND REQUIREMENTS
Table 4 Test condition, procedure and requirements
TEST
TEST METHOD
PROCEDURE
REQUIREMENTS
Temperature
Coefficient of
Resistance
(T.C.R.)
IEC 60115-1 4.8
At +25/–55 °C and +25/+125 °C
Refer to table 2
MIL-STD-202 Method 304
Formula:
R2–R1
T.C.R= ------------------------- ×106 (ppm/°C)
R1(t2–t1)
Where
t1=+25 °C or specified room temperature
t2=–55 °C or +125 °C test temperature
R1=resistance at reference temperature in ohms
R2=resistance at test temperature in ohms
Life/Endurance
IEC 60115-1 4.25
MIL-STD-202 Method 108
At 70±2 °C for 1,000 hours, RCWV applied for
1.5 hours on, 0.5 hour off, still-air required
±(1.0%+0.05 Ω)
<100 mΩ for Jumper
High
Temperature
Exposure
MIL-STD-202 Method 108
±(1.0%+0.05 Ω)
1,000 hours at 155±3℃
unpowered
<100 mΩ for Jumper
Moisture
Resistance
MIL-STD-202 Method 106
Each temperature / humidity cycle is defined at 8
hours, 3 cycles / 24 hours for 10d. with 25 °C /
65 °C 95% R.H, without steps 7a & 7b,
unpowered
±(0.5%+0.05 Ω) for 0.5%, 1%
tol.
±(1.0%+0.05 Ω) for 5% tol.
<100 mΩ for Jumper
Parts mounted on test-boards, without
condensation on parts
Thermal Shock
MIL-STD-202 Method 107
–55 / +125 °C
±(0.5%+0.05 Ω) for 0.5%, 1%
tol.
Number of cycles required is 300. Devices
mounted
±(1%+0.05 Ω) for 5% tol.
Maximum transfer time is 20 seconds. Dwell time <100 mΩ for Jumper
is 15 minutes
Short Time
Overload
IEC60115-1 4.13
IEC 60115-1 4.33
2.5 times of rated voltage or maximum overload
voltage whichever is less for 5 seconds at room
temperature
±(1.0%+0.05 Ω)
No visible damage
Bending
Chips mounted on a 90 mm glass epoxy resin
PCB (FR4)
±(1.0%+0.05 Ω)
<100 mΩ for Jumper
No visible damage
Bending: 0201/0402: 5 mm
0603/0805: 3 mm
1206 & above: 2 mm
Bending time: 60±5 seconds
www.yageo.com
Jun. 21, 2016 V.5
Product specification
8
9
SERIES
0201 to 2512
AF
Chip Resistor Surface Mount
TEST
TEST METHOD
PROCEDURE
REQUIREMENTS
Biased Humidity
MIL-STD-202 method 103
1,000 hours; 85℃/85%R.H., 10% of operating 1Ω≤R≤1MΩ: ±(3%+0.05Ω)
power.
1MΩ<R≤10MΩ: ±(5%+0.05Ω)
Measurement at 24±4 hours after test
conclusion.
Solderability
- Resistance to
Soldering Heat
IEC 60115-1 4.18
MIL-STD-202 Method 215
Condition B, no pre-heat of samples
±(0.5%+0.05Ω) for 0.5%, 1% tol.
±(1.0%+0.05Ω) for 5% tol.
<50 mΩfor Jumper
Lead-free solder, 260±5 °C, 10±1 seconds
immersion time
Procedure 2 for SMD: devices fluxed and
cleaned with isopropanol
No visible damage
- Wetting
J-STD-002
Electrical test not required
Magnification 10X
Well tinned (≥95% covered)
No visible damage
SMD conditions:
(a) Method B, aging 4 hours at 155 °C
dry heat, lead-free solder bath at 245 °C
(b) Method B, dipping at 215 °C for 3 seconds
Sulfur 750 hours, 105 °C. unpowered
FOS
ASTM-B-809-95*
* Modified
±(4.0%+0.05Ω)
www.yageo.com
Jun. 21, 2016 V.5
Product specification
9
9
SERIES
0201 to 2512
AF
Chip Resistor Surface Mount
REVISION HISTORY
REVISION DATE
CHANGE NOTIFICATION DESCRIPTION
Version 5
Version 4
Version 3
Version 2
Version 1
Version 0
Jun. 21, 2016
Dec. 24, 2015
Apr. 01, 2015
Nov. 20, 2014
Sep. 27, 2013
Jan 07, 2011
-
-
-
-
-
-
- Update test and requirement
- Update Dielectric Withstanding Voltage& Resistance value
- Modified test and requirements
- Tests and requirement update
- Size 0201/1210/1218/2010/2512 extend
- First issue of this specification
“ Yageo reserves all the rights for revising the content of this datasheet without further notification, as long as the products are unchanged. Any
product change will be announced by PCN.”
www.yageo.com
Jun. 21, 2016 V.5
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