RC0805FRF101K58 [YAGEO]

Fixed Resistor, Metal Glaze/thick Film, 0.125W, 1580ohm, 150V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0805, CHIP;
RC0805FRF101K58
型号: RC0805FRF101K58
厂家: YAGEO CORPORATION    YAGEO CORPORATION
描述:

Fixed Resistor, Metal Glaze/thick Film, 0.125W, 1580ohm, 150V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0805, CHIP

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DATA SHEET  
CHIP RESISTORS  
RC0805  
5%; 1%  
2
7
SERIES  
0805  
RC  
Chip Resistor Surface Mount  
SCOPE  
This specification describes RC 0805 series chip resistors made by thick film process.  
ORDERING INFORMATION  
Part number is identified by the series, size, tolerance, packing style, temperature coefficient, special type and  
resistance value.  
MARKING  
RC0805 X X X XX XXXX  
( ) ( ) ( ) ( )  
( )  
5
1
2
3
4
RC0805  
( )  
1 TOLERANCE  
F = ±1%  
J = ±5%  
E-24 series: 3 digits  
ynsc001  
First two digits for significant figure and 3rd  
digit for number of zeros  
( )  
2 PACKAGING TYPE  
Fig. 1 Value=10 K  
R = Paper taping reel  
C = Bulk case  
Both E-24 and E-96 series: 4 digits  
( )  
3 TEMPERATURE  
ynsc004  
CHARACTERISTIC OF  
RESISTANCE  
First three digits for significant figure and  
4th digit for number of zeros  
Fig. 2 Value=10KΩ  
F = ±100ppm/°C  
G = ±200ppm/°C  
I = ±300ppm/°C  
– = Base on spec  
CONSTRUCTION  
( )  
4 SPECIAL TYPE  
The resistors are constructed out of a high-grade ceramic body. Internal  
metal electrodes are added at each end and connected by a resistive  
paste. The composition of the paste is adjusted to give the approximate  
required resistance and laser cutting of this resistive layer that achieves  
tolerance trims the value. The resistive layer is covered with a protective  
coat and printed with the resistance value. Finally, the two external  
terminations are added. See fig. 3  
07 = 7 inch dia. Reel  
10 = 10 inch dia. Reel  
13 = 13 inch dia. Reel  
( )  
5 RESISTANCE VALUE:  
5R6, 56R, 560R, 5K6, 56K, 22M.  
protective coat  
book, 4 columns  
resistor layer  
inner electrode  
H
end termination  
ceramic substrate MBE940_a  
I
2
Fig. 3 Chip resistor construction  
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Sep. 19, 2003 V.5  
3
7
SERIES  
0805  
RC  
Chip Resistor Surface Mount  
DIMENSION  
Table 1  
For dimension see Table 1  
TYPE  
RC0805  
protective coat  
I
1
L (mm)  
W (mm)  
H (mm)  
I1 (mm)  
I2 (mm)  
2.00±0.10  
1.25±0.10  
0.50±0.10  
0.35±0.20  
0.35±0.20  
W
MBE940_a  
L
Fig. 4 Chip resistor dimension  
POWER RATING  
RATED POWER AT 70°C,  
RC0805 1/8W  
ELECTRICAL CHARACTERISTICS  
Table 2  
RC0805 1/8 W  
CHARACTERISTICS  
Operating Temperature Range  
Maximum Working Voltage  
Maximum Overload Voltage  
Dielectric Withstanding Voltage  
–55°C to +155°C  
150V  
MRA632  
umns  
P
max  
(%P  
)
rated  
100  
50  
0
300V  
300V  
1to 22M(E24)  
1to 10M(E96)  
Resistance Range  
55  
0
50 70  
100  
155  
o
(
C)  
T
amb  
Zero Ohm Jumper<0.05Ω  
10< R 10M±100ppm/°C  
Temperature Coefficient  
Jumper Criteria  
Fig. 5 Maximum dissipation (Pmax) in  
percentage of rated power as  
a function of the operating  
1R 10; R>10M±200ppm/°C  
Rated Current  
2.0A  
5.0A  
ambient temperature (Tamb  
)
Maximum Current  
RATED VOLTAGE:  
The DC or AC (rms) continuous  
working voltage corresponding to  
the rated power is determined by  
the following formula:  
V=(P X R)  
Where  
V=Continuous rated DC  
or AC (rms) working voltage (V)  
P=Rated power (W)  
R=Resistance value (X)  
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Sep. 19, 2003 V.5  
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7
SERIES  
0805  
RC  
Chip Resistor Surface Mount  
TAPING REEL  
Table 3  
DIMENSION  
Tape Width  
ØA (mm)  
ØB (mm)  
ØC (mm)  
W (mm)  
For dimension see Table 3  
T
RC0805  
8mm  
180+0/–3  
60+1/–0  
13.0±0.2  
9.0±0.3  
21 0.8  
C
B
A
T (mm)  
11.4±1  
Fig. 6 Reel dimension  
W
MSA284_a  
PAPER TAPE SPECIFICATION  
Table 4  
P
0
DIMENSION  
A (mm)  
RC0805  
T
P
D
2
0
1.65±0.1  
2.4±0.1  
E
B (mm)  
W (mm)  
E (mm)  
8.0±0.2  
F
cover tape  
W
1.75±0.1  
3.5±0.05  
4.0±0.1  
B
P
F (mm)  
P0 (mm)  
P1 (mm)  
P2 (mm)  
ØD0 (mm)  
T (mm)  
4.0±0.05  
2.0±0.05  
1.5+0.1/–0  
0.85±0.10  
A
MBD123_a  
1
For dimension see Table 4  
Fig. 7 Paper tape dimension  
PACKING METHOD  
LEADER/TRAILER TAPE SPECIFICATION  
BULK CASSETTE  
slider  
shutter  
handbook,  
4 columns  
leader end  
coupled  
portion  
empty compartments  
trailer end  
with cover tape  
(min. 240 mm)  
cover tape only  
trailer (max. 260 mm)  
leader 400 mm  
MGB377  
CCB325  
Fig. 8 Leader and trailer tape dimension  
Fig. 9 Bulk case outline  
Table 5 Packing style and packaging quantity  
PACKING STYLE  
REEL DIMENSION  
7" (178 mm)  
RC0805  
Paper Taping Reel (R)  
5,000  
10" (254 mm)  
13" (330 mm)  
10,000  
20,000  
10,000  
Bulk Cassette (C)  
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Sep. 19, 2003 V.5  
5
7
SERIES  
0805  
RC  
Chip Resistor Surface Mount  
TYPE  
TEST METHOD  
ACCEPTANCE STANDARD  
Temperature  
Coefficient of  
Resistance  
(T.C.R.)  
Measure resistance at  
Formula  
Refer to table 2  
+25°C or specified room  
temperature as R1, then  
measure at –55°C or  
R2–R1  
T.C.R. = ------------------------- ×106 (ppm/°C)  
R1(t2–t1)  
+155°C respectively as R2  
Where  
Determine the  
t1=+25°C or specified room temperature  
t2=–55°C or +155°C test temperature  
R1=resistance at reference temperature in ohms  
R2=resistance at test temperature in ohms  
temperature coefficient of  
resistance from the  
following formula:  
Thermal  
Shock  
At –55±3°C for 2 minutes and at +155±2°C for 2 minutes as one cycle. After 5  
cycles, the specimen shall be stabilized at room temp.  
±(0.5%+0.05)  
Measure the resistance to determine ΔR/R(%) after one more hour.  
Low  
Temperature  
Operation  
Place the specimen in a test chamber maintained at –65 (+0/–5)°C. After one hour  
stabilization at this temperature, full rated working voltage shall be applied for 45  
(+5/–0) minutes. Have15 (+5/–0 ) minutes after remove the voltage, the specimen  
shall be removed from the chamber and stabilized at room temperature for 24 hrs.  
±(0.5%+0.05) for 1% tol .  
±(1.0%+0.05) for 5% tol.  
No visible damage  
Measure the resistance to determine ΔR/R(%).  
Short  
Time  
Overload  
Apply 2.5 times of rated voltage but not exceeding the maximum overload voltage  
for 5 seconds. Have the specimen stabilized at room temperature for 30 minutes  
minimum.  
±(1.0%+0.05)  
No visible damage  
Measure the resistance to determine ΔR/R(%).  
Insulation  
Resistance  
Place the specimen in the jig and apply a rated  
continues overload voltage (R.C.O.V) for one  
minute as shown.  
10,000MΩ  
Type  
RC0805  
Voltage (DC)  
300V  
Measure the insulation resistance.  
Dielectric  
Withstand  
Voltage  
Place the specimen in the jig and apply a  
specified value continuous overload voltage as  
shown for one minute.  
Breakdown voltage>  
specification and without  
open/short  
Type  
RC0805  
Voltage (AC)  
300Vrms  
Resistance  
To Soldering  
Heat  
Immerse the specimen in the solder pot at 260±5°C. for 10±1 seconds. Have the  
specimen stabilized at room temperature for 30 minutes minimum.  
±(0.5%+0.05) for 1% tol.  
±(1.0%+0.05) for 5% tol.  
No visible damage  
Measure the resistance to determine ΔR/R(%).  
www.yageo.com  
Sep. 19, 2003 V.5  
6
7
SERIES  
0805  
RC  
Chip Resistor Surface Mount  
TYPE  
Moisture  
Resistance  
TEST METHOD  
ACCEPTANCE STANDARD  
±(0.5%+0.05) for 1% tol.  
±(1.5%+0.05) for 5% tol.  
No visible damage  
Place the specimen in the test chamber and subject to 42 damp heat cycles. Each  
one of which consists of the steps 1 to 7 as figure 11. The total length of test is  
1,000 hours. Have the specimen stabilized at room temperature for 24 hours after  
testing.  
Measure the resistance to determine ΔR/R(%).  
Life  
Place the specimen in the oven at 70±2°C. Apply the rated voltage to the specimen  
at the 1.5 hours on and 0.5 hour off cycle. The total length of test is 1,000 hours.  
Have the specimen stabilized at room temperature for one hour minimum after  
testing.  
±(1%+0.05) for 1% tol.  
±(1.5%+0.05) for 5% tol.  
No visible damage  
Measure the ΔR/R(%).  
Solderability  
Immerse the specimen in the solder pot at 235±5°C for 5 sec.  
At least 95% solder coverage on  
the termination  
Bending  
Strength  
Mount the specimen on a test board as  
shown in the figure 10. Slowly apply the force  
till the board is bent for 5±1 sec.  
±(1.0%+0.05) for 1% tol.  
±(1.0%+0.05) for 5% tol.  
No visible damage  
Type  
RC0805  
Bent Distance (d)  
5mm  
Measure the ΔR/R(%) at this position.  
Fig. 10 Principle of the bending  
test  
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Sep. 19, 2003 V.5  
7
7
SERIES  
0805  
RC  
Chip Resistor Surface Mount  
80 98%  
RH  
80 98%  
RH  
75  
90 98% RH  
90 98% RH  
90 98% RH  
temperature  
[°C]  
initial drying  
24 hours  
rate of change of temperature is unspecified,  
however, specimens shall not be subjected to  
radiant heating from chamber conditioning processes  
50  
25  
0
end of final cycle;  
measurements  
as specified in 2.7  
+10 °C (+18 °F)  
2 °C (3.6 °F)  
initial measurements  
as specified in 2.2  
circulation of conditioning air shall be at a  
minimum cubic rate per minute equivalent to  
10 times the volume of the chamber  
optional sub-cycle if specified  
(2.3); sub-cycle performed during  
any 5 of the first 9 cycles; humidity  
uncontrolled during sub-cycle  
temperature  
tolerance  
±2 °C (±3.6 °F)  
unless otherwise  
specified  
voltage applied as specified in 2.4  
STEP1  
STEP2 STEP3  
one cycle 24 hours; repeat as specified in 2.5  
10 15  
STEP4  
STEP5 STEP6  
STEP7  
prior to first  
cycle only  
0
5
20  
25  
HBK073  
time [h]  
Fig. 11 Conditions of temperature changing  
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Sep. 19, 2003 V.5  

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