RT0201BCD309R [YAGEO]
Fixed Resistor, Thin Film, 0.05W, 309ohm, 15V, 0.1% +/-Tol, -25,25ppm/Cel, 0201;
| 型号： | RT0201BCD309R |
| 厂家： | 
YAGEO CORPORATION |
| 描述： | Fixed Resistor, Thin Film, 0.05W, 309ohm, 15V, 0.1% +/-Tol, -25,25ppm/Cel, 0201 电阻器 |
| 文件： | 总8页 (文件大小：243K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CHIP RESISTORS
RT Series
1%; 0.5%; 0.25%; 0.1%
2
8
SERIES
RT
Chip Resistor Surface Mount
SCOPE
This specification describes RT series chip resistors made by thin film process.
ORDERING INFORMATION
Part number is identified by the series, size, tolerance, packing style, temperature coefficient, special type and
resistance value.
MARKING
RT0805/RT1206/RT1210/RT2010/RT2512
RT XXXX X X X XX XXXX
( )
( ) ( ) ( ) ( )
( )
6
1
2
3
4
5
( )
1 SIZE
Either resistance in E-24 or E-96: 4 digits
First three digits for significant figure and 4th
ynsc004
0201=0.024×0.012
0402=0.040×0.020
0603=0.063×0.033
0805=0.083×0.051
1206=0.122×0.063
1210=0.122×0.102
2010=0.197×0.098
2512=0.250×0.126
Fig. 1 Value=10KΩ
digit for number of zeros
RT0603
E-24 series: 3 digits
ynsc015
First two digits for significant figure and 3rd
digit for number of zeros
Fig. 2 Value=12KΩ
( )
2 TOLERANCE
E-96 series: 3 digits for 0603±1% EIA-96
marking method. See Table 1
ynsc002
B= ±0.1%
Fig. 3 Value=12.4KΩ
C= ±0.25%
D= ±0.5%,
F = ±1%
RT0201/ RT0402/ RESISTANCE VALUE IS NOT IN E-24 / E96 SERIES
No value marking
ynsc007
( )
3 PACKAGING TYPE
Fig. 4
R = Paper taping reel
K = Embossed Plastic Tape Reel
C = Bulk case
EIA - 96 MARKING RULE
Table 1 shows the first two digits of the three-digit EIA-96 part-marking scheme.
( )
4 TEMPERATURE
CHARACTERISTIC OF
RESISTANCE
Code Value Code Value Code Value Code Value Code Value Code Value Code Value Code Value
100
102
105
107
110
113
115
118
121
124
127
130
133
137
140
143
147
150
154
158
162
165
169
174
178
182
187
191
196
200
205
210
215
221
226
232
237
243
249
255
261
267
274
280
287
294
301
309
316
324
332
340
348
357
365
374
383
392
402
412
422
432
442
453
464
475
487
499
511
523
536
549
562
576
590
604
619
634
649
665
681
698
715
732
750
768
787
806
825
845
866
887
909
931
953
976
01
02
03
04
05
06
07
08
09
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
55
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
D = ±25ppm/°C
E = ±50ppm/°C
F = ±100ppm/°C
– = Ignore
( )
5 SPECIAL TYPE
07 = 7 inch dia. Reel
10 = 10 inch dia. Reel
13 = 13 inch dia. Reel
( )
6 RESISTANCE VALUE:
R056, R56, 5R6, 56R, 560R, 5K6, 56K,
56M.
The third character is a letter multiplier:
X=10-1, Y=10-2, A=100, B=101, C=102, D=103, E=104, F=105
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Apr. 04, 2003 V.04
3
8
SERIES
RT
Chip Resistor Surface Mount
CONSTRUCTION
The resistors are constructed out of
a high-grade ceramic body. Internal
metal electrodes are added at each
end and connected by a resistive
material. The composition of the
resistive material is adjusted to give
the approximate required resistance
and laser cutting of this resistive
layer that achieves tolerance trims
the value. The resistive layer is
protective coat
resistive layer
handbook, 4 columns
inner electrode
H
end termination
ceramic substrate MBE940_d
I
2
Fig. 5 Chip resistor construction
covered with a protective coat and printed with the resistance value. Finally, the two external terminations are added. See
fig.5
DIMENSION
Table 2
For dimension see Table 2
TYPE
L (mm) W (mm) H (mm) I1 (mm) I2 (mm)
0.6±0.10 0.30±0.05 0.25±0.05 0.15±0.10 0.15±0.10
1.00±0.10 0.50±0.05 0.35±0.05 0.20±0.10 0.25±0.10
1.60±0.10 0.80±0.10 0.45±0.10 0.25±0.15 0.25±0.15
2.00±0.10 1.25±0.10 0.50±0.10 0.35±0.20 0.35±0.20
3.10±0.10 1.60±0.10 0.55±0.10 0.45±0.20 0.40±0.20
3.10±0.10 2.60±0.15 0.55±0.10 0.50±0.20 0.50±0.20
5.00±0.10 2.50±0.15 0.55±0.10 0.60±0.20 0.50±0.20
6.35±0.10 3.20±0.15 0.55±0.10 0.60±0.20 0.50±0.20
protective coat
I
1
RT0201
RT0402
RT0603
RT0805
RT1206
RT1210
RT2010
RT2512
W
MBE940_a
L
Fig. 6 Chip resistor dimension
POWER RATING
RATED POWER AT 70°C:
RATED VOLTAGE:
MLB206_a
P
handbook, halfpage
max
The DC or AC (rms) continuous working voltage
corresponding to the rated power is determined by the
following formula:
(%P
rated
)
100
V=√(P X R)
50
0
Where
V=Continuous rated DC
or AC (rms) working voltage (V)
P=Rated power (W)
R=Resistance value (X)
T
(°C)
amb
−55
0
50 70 85 100
Precision Standard Powr
155
125
Fig. 7 Maximum dissipation (Pmax) in percentage of rated
power as a function of the operating ambient
temperature (Tamb
)
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Apr. 04, 2003 V.04
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8
SERIES
RT
Chip Resistor Surface Mount
ELECTRICAL CHARACTERISTICS
Table 3
CHARACTERISTICS
OPERATION MODE
POWER RATING @ 70°C
RT0201
RT0402
RT0603
RT0805
Precision Standard Power Precision Standard Power Precision Standard Power Precision Standard Power*
1/64W 1/20W 1/16W 1/64W 1/16W 1/10W 1/32W 1/10W 1/8W 1/20W 1/8W 1/5W
OPERATING
TEMPERATURE RANGE
–10°C to +85°C for precision type; –55°C to +125°C for standard; –55°C to +155°C for power type
RESISTANCE RANGE
IN E-24/E-96
(E-192; special value on
Request)
33Ω~22KΩ
(<33Ω; 22~56KΩ
on Request)
10Ω~121KΩ
(<10Ω; 121~220KΩ
on Request)
3Ω~681KΩ
(<3Ω; 681~750KΩ
on Request)
3Ω~1.5MΩ
(<3Ω; 1.5~2MΩ
on Request)
MAXIMUM WORKING
VOLTAGE
5V
10V
50V
15V
50V
50V
15V
50V
50V
12.5V
50V 50V
100V 100V
75V 75V
25V
50V
75V
75V
35V
70V
150V 150V
300V 300V
200V 200V
MAXIMUM OVERTOAD
VOLTAGE
25V
75V
150V 150V
100V 100V
DIELECTRIC WITHSTAND
VOLTAGE
100V
200V
±0.1%; ±0.25%; ±0.5%; ±1.0% (±0.01%; ±0.05% on Request)
±25ppm/°C; ±50ppm/°C; (±10ppm/°C; ±15ppm/°C on Request)
RESISTANCE TOLERANCE
TEMPERATURE
COEFFICIENT
CHARACTERISTICS
OPERATION MODE
POWER RATING @ 70°C
RT1206
RT1210
Precision Standard Power
1/8W 1/4W 2/5W
RT2010
Standard Power
1/2W 3/4W
RT2512
Precision Standard Power
1/10W 1/8W 1/4W
Standard Power
3/4W
1W
OPERATING
TEMPERATURE RANGE
–10°C to +85°C for precision type; –55°C to +125°C for standard; –55°C to +155°C for power type
RESISTANCE RANGE
IN E-24/E-96
(E-192; special value
on Request)
10Ω~1MΩ
(<10Ω; 1M~2MΩ
on Request)
10Ω~1MΩ
(<10Ω; 1M~2MΩ
on Request)
3Ω~1.5MΩ
(<3Ω; 1.5~2MΩ on Request)
1Ω~1MΩ
(1M~2MΩ on Request)
MAXIMUM WORKING
VOLTAGE
50V
100V
300V
200V
400V
300V
200V
400V
300V
50V
100
400
200V 200V
400 400V
400V 400V
200V
400V
400V
200V
400V
400V
200V 200V
400V 400V
400V 400V
MAXIMUM OVERTOAD
VOLTAGE
DIELECTRIC WITHSTAND
VOLTAGE
±0.1%; ±0.25%; ±0.5%; ±1.0% (±0.01%; ±0.05% on Request)
±25ppm/°C; ±50ppm/°C; (±10ppm/°C; ±15ppm/°C on Request)
RESISTANCE TOLERANCE
TEMPERATURE
COEFFICIENT
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8
SERIES
RT
Chip Resistor Surface Mount
TAPING REEL
Table 4
DIMENSION
PACKAGING
TAPE WIDTH
ØA (mm)
For dimension see Table 4
RT0201 RT0402 RT0603 RT0805 RT1206 RT1210 RT2010 RT2512
T
d
Paper
8mm
Paper
8mm
Paper
8mm
Paper
8mm
Paper
8mm
Paper Embossed Embossed
8mm 12mm 12mm
21 0.8
C
B
A
180+0/–3 180+0/–3 180+0/–3 180+0/–3 180+0/–3 180+0/–3 180+0/–3 180+0/–3
60+1/–0 60+1/–0 60+1/–0 60+1/–0 60+1/–0 60+1/–0 60+1/–0 60+1/–0
13.0±0.2 13.0±0.2 13.0±0.2 13.0±0.2 13.0±0.2 13.0±0.2 13.0±0.2 13.0±0.2
ØB (mm)
ØC (mm)
MSA284_a
W
9.0±0.3
11.4±1
9.0±0.3
11.4±1
9.0±0.3
11.4±1
9.0±0.3
11.4±1
9.0±0.3
11.4±1
9.0±0.3 13.0±0.3 13.0±0.3
11.4±1 15.4±1 15.4±1
W (mm)
Tmax (mm)
Fig. 8 Reel dimension
PAPER TAPE SPECIFICATION
Table 5
For dimension see Table 5
DIMENSION RT0201
RT0402
0.65±0.1
1.15±0.1
8.0±0.2
RT0603
1.1±0.1
RT0805
RT1206
RT1210
P
0
0.45±0.1
0.75±0.1
8.0±0.2
1.65±0.1
2.40±0.1
8.0±0.2
1.90±0.1
3.50±0.1
8.0±0.2
2.80±0.1
3.50±0.1
8.0±0.2
P
2
A(mm)
B(mm)
D
0
1.90±0.1
8.0±0.2
E
F
W(mm)
E(mm)
W
1.75±0.1
3.5±0.05
4.0±0.1
1.75±0.1
3.5±0.05
4.0±0.1
1.75±0.1
3.5±0.05
4.0±0.1
1.75±0.1
3.5±0.05
4.0±0.1
1.75±0.1
3.5±0.05
4.0±0.1
1.75±0.1
3.5±0.05
4.0±0.1
B
P
F(mm)
T
P0(mm)
P1(mm)
P2(mm)
ØD0(mm)
Tmax(mm)
A
MBD123_a
1
2.0±0.05
2.0±0.05
4.0±0.05
2.0±0.05
4.0±0.05
2.0±0.05
4.0±0.05
2.0±0.05
4.0±0.05
2.0±0.05
4.0±0.05
2.0±0.05
1.5+0.1/–0 1.5+0.1/–0 1.5+0.1/–0 1.5+0.1/–0 1.5+0.1/–0 1.5+0.1/–0
0.35±0.10 0.53±0.10 0.70±0.10 0.85±0.10 0.85±0.10 0.85±0.10
Fig. 9 Paper tape dimension
EMBOSSED TAPE SPECIFICATION
Table 6
P
0
DIMENSION
RT2010
2.80±0.2
5.4±0.2
RT2512
3.5±0.2
6.7±0.2
12±0.3
D
P
2
0
A (mm)
E
B (mm)
12.0±0.3
1.75±0.1
5.5±0.05
4.0±0.1
W (mm)
E (mm)
F
cover tape
W
1.75±0.1
5.5±0.05
4.0±0.1
4.0±0.1
2.0±0.05
B
F (mm)
P0 (mm)
P1 (mm)
P2 (mm)
ØD0 (mm)
ØD1 (mm)
Tmax (mm)
MBG516_a
4.0±0.1
A
D
1
2.0±0.05
T
P
1
1.5+0.1/–0 1.5+0.1/–0
1.5+0.25/–0 1.5+0.25/–0
direction of unreeling
For dimension see Table 6
Fig. 10 Embossed tape dimension
4.5
4.5
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8
SERIES
RT
Chip Resistor Surface Mount
PACKING METHOD
LEADER/TRAILER TAPE SPECIFICATION
BULK CASSETTE
slider
shutter
handbook,
4 columns
leader end
coupled
portion
empty compartments
with cover tape
(min. 240 mm)
trailer end
cover tape only
trailer (max. 260 mm)
leader ≥400 mm
MGB377
CCB325
Fig. 11 Leader and trailer tape dimension
Fig.12 Bulk case outline
Table 7 Packing style and packaging quantity
PACKING STYLE
REEL DIMENSION RT0201 RT0402 RT0603 RT0805 RT1206 RT1210 RT2010 RT2512
7" (178 mm)
10" (254 mm)
13" (330 mm)
7" (178 mm)
10,000
20,000
40,000
---
10,000
20,000
40,000
---
5,000
10,000
20,000
---
5,000
10,000
20,000
---
5,000
10,000
20,000
---
5,000
10,000
20,000
---
---
---
---
---
Paper Taping Reel (R)
---
---
4,000
4,000
Embossed Taping Reel (K)
Bulk Cassette (C)
50,000
50,000
25,000
10,000
---
---
---
---
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Apr. 04, 2003 V.04
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8
SERIES
RT
Chip Resistor Surface Mount
TYPE
TEST METHOD
ACCEPTANCE STANDARD
Measure resistance at
Refer to table 3
Temperature
Coefficient of
Resistance
(T.C.R.)
Formula
+25°C or specified room
temperature as R1, then
measure at –55°C or
R2–R1
T.C.R.= ------------------------- ×106 (ppm/°C)
R1(t2–t1)
+125°C respectively as R2.
Where
Determine the
t1=+25°C or specified room temperature
t2=–55°C or +125°C test temperature
R1=resistance at reference temperature in ohms
R2=resistance at test temperature in ohms
temperature coefficient of
resistance from the
following formula:
At –55±3°C for 2 minutes and at +125±2°C for 2 minutes as one cycle. After 25
cycles, the specimen shall be stabilized at room temperature.
±(0.5%+0.05Ω)
Thermal
Shock
High stability, ±0.1% or ±0.25%
on Request
Measure the resistance to determine ∆R/R(%) after one more hour.
Place the specimen in a test chamber maintained at –65 (+0/–5)°C. After one hour
stabilization at this temperature, full rated working voltage shall be applied for 45
(+5/–0) minutes. Have15 (+5/–0 ) minutes after remove the voltage, the specimen
shall be removed from the chamber and stabilized at room temperature for 24 hrs.
±(0.5%+0.05Ω)
Low
Temperature
Operation
No mechanical damage
High stability, ±0.1% or ±0.25%
on Request
Measure the resistance to determine ΔR/R(%).
Apply 2.5 times of rated voltage but not exceeding the maximum overload voltage
for 5 seconds. Have the specimen stabilized at room temperature for 30 minutes
minimum.
±(0.5%+0.05Ω)
Short
Time
Overload
No evidence of mechanical
damage
Measure the resistance to determine ΔR/R(%).
High stability, ±0.1% or ±0.25%
on Request
Place the specimen in the jig and apply a rated continues overload voltage (R.C.O.V)
for one minute.
≥10,000MΩ
Insulation
Resistance
Measure the insulation resistance.
Place the specimen in the jig and apply a specified value continuous overload voltage
as shown for one minute.
Breakdown voltage>
specification and without
open/short
Dielectric
Withstand
Voltage
Immerse the specimen in the solder pot at 260±5°C. for 10±1 seconds. Have the
specimen stabilized at room temperature for 30 minutes minimum.
±(0.5%+0.05Ω)
Resistance
To Soldering
Heat
No visible damage
Measure the resistance to determine ΔR/R(%).
High stability, ±0.1% or ±0.25%
on Request
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8
SERIES
RT
Chip Resistor Surface Mount
TYPE
Moisture
Resistance
TEST METHOD
ACCEPTANCE STANDARD
±(0.5%+0.05Ω)
Place the specimen in the test chamber and subject to 42 damp heat cycles. Each
one of which consists of the steps 1 to 7 as figure 14. The total length of test is
1,000 hours. Have the specimen stabilized at room temperature for 24 hours after
testing.
No visible damage
High stability, ±0.1% or ±0.25%
on Request
Measure the resistance to determine ΔR/R(%).
Place the specimen in the oven at 70±2°C. Apply the rated voltage to the specimen at
the 1.5 hours on and 0.5 hour off cycle. The total length of test is 1,000 hours. Have
the specimen stabilized at room temperature for one hour minimum after testing.
±(0.5%+0.05Ω)
Life
High stability, ±0.1% or ±0.25%
on Request
Measure the ΔR/R(%).
Immerse the specimen in the solder pot at 230±5°C for 5 sec.
At least 95% solder coverage on
the termination
Solderability
Mount the specimen on a test board as
shown in the figure 13. Slowly apply the force
till the board is bent for 5±1 sec.
±(0.25%+0.05Ω)
Bending
Strength
No visible damage
High stability, ±0.1% on Request
Measure the ΔR/R(%) at this position.
Fig. 13 Principle of the bending
test
80 − 98%
RH
80 − 98%
RH
75
temperature
90 − 98% RH
90 − 98% RH
90 − 98% RH
initial drying
24 hours
[°C]
rate of change of temperature is unspecified,
however, specimens shall not be subjected to
radiant heating from chamber conditioning processes
50
25
0
end of final cycle;
measurements
as specified in 2.7
+10 °C (+18 °F)
−2 °C (−3.6 °F)
initial measurements
as specified in 2.2
circulation of conditioning air shall be at a
minimum cubic rate per minute equivalent to
10 times the volume of the chamber
optional sub-cycle if specified
(2.3); sub-cycle performed during
any 5 of the first 9 cycles; humidity
uncontrolled during sub-cycle
temperature
tolerance
±2 °C (±3.6 °F)
unless otherwise
specified
voltage applied as specified in 2.4
STEP1
STEP2 STEP3
one cycle 24 hours; repeat as specified in 2.5
10 15
STEP4
STEP5 STEP6
STEP7
prior to first
cycle only
HBK073
0
5
20
25
time [h]
Fig. 14 Conditions by change of temperature
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Apr. 04, 2003 V.04
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