YED210-32137-0BS4 [YAMAICHI]
SPGA - Interstitial (TH); SPGA - 间质（ TH ）
| 型号： | YED210-32137-0BS4 |
| 厂家： | 
YAMAICHI ELECTRONICS CO., LTD. |
| 描述： | SPGA - Interstitial (TH) |
| 文件： | 总1页 (文件大小：60K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
YED210 Series
SPGA – Interstitial (TH)
Specifications
Part Num ber (Details)
YED210 – 321 37 – 0 B S 4
Insulation Resistance:
Withstanding Voltage:
Contact Resistance:
Current Rating:
1012Ω m in.
1,000 VRMS for 1 m inute
10m Ω m ax. at 10m A / 20m V
1A m ax.
Series No.
Operating Tem perature Range: -55°C ~ +125°C
No. of Contact Pins
Grid
Acceptable Pin Diam eter:
Mating Cycles:
0.46 ±0.05
100 insertions m in.
Design No.
Materials and Finish
Housing: PCT, 30% glass filled Polyester, UL94V-0
RoHS
Inner Contact Plating B = Gold
Outer Sleeve Plating S = Solder
Term inal Style
Contact: Inner clip – Beryllium Copper (BeCu), Au over Ni (2-3µm )
Outer sleeve – Machined Brass, Sn (5µm ) over Ni (2-3µm )
Features
¼ Custom specific pin counts with grids to 41x41
¼ Pin-Grid-Array precision-IC-Sockets, with displaced contacts,
for picking up of ICs with high packing density.
¼ Contacts with 6-finger-clip, for low insertion and withdrawal force
.
Contact Position Detail
Outline Socket Dim ensions (Grid 37 x 37)
Without Stand-off pins (Standard)
With Stand-off pins
Stand-off pin
Sockets and Connectors
SPECIFICATIONS ARE SUBJ ECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER
相关型号：
©2020 ICPDF网 联系我们和版权申明