ZL60304 [ZARLINK]
Parallel Fiber Optic Transceiver (4 + 4) x 3.125 Gbps; 并行光纤收发器（ 4 + 4 ）× 3.125 Gbps的
| 型号： | ZL60304 |
| 厂家： | 
ZARLINK SEMICONDUCTOR INC |
| 描述： | Parallel Fiber Optic Transceiver (4 + 4) x 3.125 Gbps |
| 文件： | 总19页 (文件大小：383K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ZL60304
Parallel Fiber Optic Transceiver
(4 + 4) x 3.125 Gbps
Data Sheet
January 2006
Ordering Information
ZL60304MJDA
Transceiver
Additional heatsink and EMI shield options
are available upon request
0°C to +80°C
Features
•
•
Channel BER better than 10-12
•
•
•
•
•
•
Compatible with POP4 MSA usage
Industry standard MPO/MTP ribbon fiber
4 Transmit channels and 4 Receive channels
Data rate up to 3.125 Gbps per channel
850 nm VCSEL array
connector interface
•
•
•
•
Pluggable MegArray® connector
Laser class 1 M IEC 60825-1:2001 compliant
Low power consumption, < 1 W
Power supply 3.3 V
Data I/O is CML compatible
Link reach with 50/125 µm 500 MHz. km fiber,
300-m and 90-m at 2.5 and 3.125-Gbps,
respectively
VCCA Rx VCCB Rx VEE Rx
Rx_EN Rx_SD SQ_EN
RX0
Trans-
Impedance
and
DOUT0+
DOUT0-
RX1
PIN Array
RX2
Limiting
Amplifier
DOUT3+
DOUT3-
RX3
DIN3+
DIN3-
TX3
TX2
VCSEL
Driver
VCSEL
Array
TX1
DIN0+
DIN0-
TX0
VCSEL Driver Controller
VCC Tx
Tx_EN
Tx_DIS
RESET
FAULT
VEE TX
Figure 1 - Transceiver Block Diagram
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Zarlink Semiconductor Inc.
Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.
Copyright 2006, Zarlink Semiconductor Inc. All Rights Reserved.
ZL60304
Data Sheet
Applications
•
•
•
•
•
•
•
High-speed interconnects within and between switches, routers and transport equipment
Server-Server Clusters, Super-computing interconnections
InfiniBand 4x-SX compliant
Fibre Channel connections
XAUI based interconnections
Proprietary backplanes
Interconnects rack-to-rack, shelf-to-shelf, board-to-board, board-to-optical backplane
Description
The ZL60304 is a very high-speed transceiver for parallel fiber applications. This transceiver performs E/O and O/E
conversions for data transmission over multimode fiber ribbon.
The ZL60304 provides an effective solution for XAUI transmission of optical fibre, providing advantages in terms of
power consumption, edge and board density over competing solutions.
The transmit section converts parallel electrical input signals via a laser driver and a VCSEL array into parallel
optical output signals at a wavelength of 850 nm.
The receive section converts parallel optical input signals via a PIN photodiode array and a transimpedance and
limiting amplifier, into electrical output signals.
The module is fitted with two pluggable industry-standard connectors. For the electrical interface, a 100 position
FCI MegArray® receptacle (FCI PN: 84513-101) is used. For the optical interface, an industry-standard
MTPTM(MPO) connector is used, which is compliant with IEC 61754-7. This provides ease of assembly on the host
board and enables provisioning of bandwidth on demand.
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Zarlink Semiconductor Inc.
ZL60304
Data Sheet
Table of Contents
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Transmitter Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Transmitter Control and Status Signal Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Transmitter Control and Status Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Receiver Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Receiver Status Signal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Receiver Status Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Transceiver Module Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Transceiver Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Handling Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Cleaning the Optical Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
ESD Handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Link Reach . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Link Model Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Electrical Interface - Application Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
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Zarlink Semiconductor Inc.
ZL60304
Data Sheet
Absolute Maximum Ratings
Not necessarily applied together. Exceeding these values may cause permanent damage. Functional operation
under these conditions is not implied.
Parameter
Symbol
Min.
Max.
Unit
Supply voltage
Differential input voltage amplitude1
VCC
∆V
-0.3
4.0
2.4
V
V
Voltage on any pin
VPIN
MOS
TSTG
VESD
-0.3
5
VCC + 0.3
95
V
Relative humidity (non-condensing)
Storage temperature
%
°C
kV
-40
100
ESD resistance
±1
1. Differential input voltage amplitude are peak to peak values.
Recommended Operating Conditions
Parameter
Symbol
Min.
Max.
Unit
Power supply voltage
VCC
TCASE
fD
3.135
0
3.465
80
V
°C
Operating case temperature
Signalling rate (per channel)1
Link distance2
1.0
2
3.125
Gbps
m
LD
Data I/O DC blocking capacitors3
Power supply noise4
CBLK
VNPS
100
nF
200
mVp-p
1. Data patterns are to have maximum run lengths and DC balance shifts no worse than that of a Pseudo Random Bit Sequence of
length 223-1 (PRBS-23). Information on lower bit rates and longer run lengths are available on request.
2. For maximum distance, see Table 4.
3. For AC-coupling, DC blocking capacitors external to the module with a minimum value of 100 nF is recommended.
4. Power supply noise is defined at the supply side of the recommended filter for all VCC supplies over the frequency range of 500 Hz
to 3200 MHz with the recommended power supply filter in place.
HOST Vcc
1 µH
Module Vcc
10 µF
0.1 µF
Figure 2 - Recommended Power Supply Filter
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Zarlink Semiconductor Inc.
ZL60304
Data Sheet
Transmitter Specifications
All parameters apply over “Recommended Operating Conditions” on page 4, unless otherwise stated.
Parameter
Symbol
Min.
Max.
Unit
Optical Parameters
Launch power (50/125 mm MMF)1
Extinguished output power
Extinction ratio
POUT
POFF
ER
-8
-2
dBm
dBm
dB
-30
6
Optical modulation amplitude2
OMA
λC
0.19
830
mW
nm
Center wavelength
Spectral width3
860
0.85
-120
150
∆λ
nmrms
dB/Hz
ps
Relative intensity noise OMA
Optical output rise time (20 - 80%)
Optical output fall time (20 - 80%)
Total jitter contributed (peak to peak)4
Deterministic jitter contributed (peak to peak)4, 5
Channel to channel skew6
RIN12OMA
tRO
tFO
150
ps
TJ
0.30
0.125
150
UI
DJ
UI
tSK
ps
Electrical Parameters
Power dissipation
PD
ICC
∆VIN
ZIN
500
150
1600
120
140
140
mW
mA
mVp-p
Ω
Supply current
Differential input voltage amplitude (peak to peak)7
Differential input impedance8
Electrical input rise time (20 - 80%)
Electrical input fall time (20 - 80%)
200
80
tRE
ps
tFE
ps
1. The average output optical power is compliant with IEC 60825-1 Amendment 2, Class 1M Accessible Emission Limits.
2. Informative. Corresponds to POUT = -8 dBm and ER = 6 dB.
3. Spectral width is measured as defined in EIA/TIA-455-127 Spectral Characterization of Multimode Laser Diodes.
4. Total jitter is TP2 - TP1 as defined in IEEE 802.3 clause 38.6 (Gigabit Ethernet).
5. Deterministic jitter is informative. Combined random and deterministic jitter should be no higher than stated total jitter.
6. Channel skew is defined for the condition of equal amplitude, zero ps skew signals applied to the transmitter inputs.
7. Differential input voltage is defined as the peak to peak value of the differential voltage between DIN+ and DIN-. Data inputs are CML
compatible.
8. Differential input impedance is measured between DIN+ and DIN-.
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Zarlink Semiconductor Inc.
ZL60304
Data Sheet
Classified in accordance with IEC 60825-1/A2:2001, IEC 60825-2: 2000
Class 1M Laser Product
Emitted wavelength: 840 nm
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Zarlink Semiconductor Inc.
ZL60304
Data Sheet
Transmitter Control and Status Signal Requirements
The following table shows the timing relationships of the status and control signals of the transmit section.
Parameter
Symbol
Min.
Typ.
Max.
Unit
Control input voltage high1
Control input voltage low
Control pull-up resistor2
Control pull-down resistor3
Status output voltage low4, 5
Status pull-down resistor4
FAULT assert time
VIH
VIL
0.6VCC
-0.5
VCC+0.5
0.2VCC
50
V
V
RPU
RPD1
VOL
20
kΩ
kΩ
V
10
10
0.5
RPD2
TFA
kΩ
µs
µs
µs
µs
ms
ms
µs
µs
ms
100
100
FAULT lasers off
TFD
RESET duration
TTDD
TOFF
TON
TTEN
TTD
10
RESET assert time
5
10
100
1
RESET de-assert time
Tx_EN assert time
Tx_EN de-assert time
Tx_DIS assert time
5
5
10
10
1
TTD
Tx_DIS de-assert time
TTEN
1. Applies to control signals RESET, Tx_DIS and Tx_EN.
2. Applies to control signals RESET and Tx_EN. Internal pull-up resistor.
3. Applies to control signal Tx_DIS. Internal pull-down resistor.
4. Applies to status signal FAULT. Internal pull-down to VEE
5. With status output sink current max. 2 mA.
.
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Zarlink Semiconductor Inc.
ZL60304
Data Sheet
Transmitter Control and Status Timing Diagrams
The following figures show the timing relationships of the status and control signals of the transmit section.
VCC
TTEN
Tx Output [0:3]
Data [0:3]
Transmitter Not Ready
Normal operation
RESET: floating or high
Figure 3 - Transmitter Power-up Sequence
FAULT
TFA
TFD
Data [0:3]
Tx Output [0:3]
No Fault
Fault
Figure 4 - Transmitter Fault Signal Timing Diagram
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Zarlink Semiconductor Inc.
ZL60304
Data Sheet
RESET
FAULT
TTDD
TON
Data [0:3]
Tx Output [0:3]
Transmitter Not Ready
Normal operation
Figure 5 - Transmitter Reset Signal Timing Diagram
Tx_DIS
Tx_EN
TTD
TTD
Lasers
off
Lasers
off
Data [0:3]
Data [0:3]
Normal operation
Tx_EN
Tx Off
Normal operation
Tx Off
TTEN
Data [0:3]
Transmitter Not Ready
Normal operation
Figure 6 - Transmitter Enable and Disable Timing Diagram
Tx_DIS High
Tx_DIS Low
Normal operation
Transmitter disabled
Tx_EN High
Tx_EN Low
Transmitter disabled
Transmitter disabled
Table 1 - TruthTable for Transmitter Operation (Pre-condition: RESET floating or HIGH)
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Zarlink Semiconductor Inc.
ZL60304
Data Sheet
Receiver Specifications
All parameters apply over “Recommended Operating Conditions” on page 4, unless otherwise stated.
.
Parameter
Symbol
Min.
Max.
Unit
Optical Parameters
Unstressed receiver sensitivity1
PIN
λC
-14
830
12
-2
dBm
nm
Center wavelength
Return loss2
860
RL
dB
Stressed receiver sensitivity3
Total link jitter contribution4
Deterministic link jitter contribution5
Channel to channel skew6
Signal detect assert
PSS
TJL
DJL
tSK
-10.9
0.50
0.20
150
dBm
UI
UI
ps
PSA
PSD
-16
dBm
dBm
Signal detect de-assert
-31
Electrical Parameters
Power dissipation
PD
ICC
500
150
800
120
150
150
mW
mA
mVp-p
Ω
Supply current
Differential output voltage amplitude (peak to peak)7
Output differential load impedance8
Electrical output rise time (20 - 80%)
Electrical output fall time (20 - 80%)
∆VOUT
ZL
400
80
tRE
ps
tFE
ps
1. Receiver sensitivity is measured using a source that does not degrade the sensitivity measurement, i.e. an ideal source. Receive
sensitivity for a channel is measured for a BER of 10-12 and worst case extinction ratio. PIN (Min) is measured using a fast rise/fall
time source with low RIN and adjacent channel(s) operating with incident power of 6 dB above PIN (Min).
2. Return loss is measured as defined in TIA/EIA-455-107A Determination of Component Reflectance or Link/System Return Loss Us-
ing a Loss Test Set.
3. Based on specified Unstressed receiver sensitivity and Gigabit Ethernet link model,“Link Model Parameters” on page 15.
4. Total jitter is TP4-TP1 values.
5. Deterministic jitter is informative. Combined random and deterministic jitter should be no higher than stated total jitter.
6. Channel skew is defined for the condition of equal amplitude, zero ps skew signals applied to the receiver inputs.
7. Differential output voltage is defined as the peak to peak value of the differential voltage between DOUT+ and DOUT- and measured
with a 100 W differential load connected between DOUT+ and DOUT-. Data outputs are CML compatible.
8. See Figure 10.
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Zarlink Semiconductor Inc.
ZL60304
Data Sheet
Receiver Status Signal
The following table shows the timing relationships of the status and control signals of the receive section.
Parameter
Symbol
Min.
Typ.
Max.
Unit
Control input voltage high1
Control input voltage low1
VIH
VIL
2.0
V
V
0.9
100
0.4
Control input pull-up current1
Status output voltage low2, 3
Status output pull-up resistor2
Receiver signal detect assert time
Receiver signal detect de-assert time
Receiver enable assert time
Receiver enable de-assert time
IIN
VOL
10
µA
V
RPU
3.25
50
50
33
5
kΩ
µs
µs
ms
µs
TSD
200
200
TLOS
TRXEN
TRXD
1. Applies to control signals Rx_EN, SQ_EN.
2. Applies to status signal Rx_SD. Internal pull-up to VCC
3. With status output sink current max 2 mA.
.
Receiver Status Timing Diagrams
The following figures show the timing relationships of the status and control signals of the receive section.
Rx_EN
TRXD
ICC
Normal Operation
Rx Off
Figure 7 - Receiver Enable Signal Timing Diagram
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Zarlink Semiconductor Inc.
ZL60304
Data Sheet
Rx_SD
TLOS
Signal
No Signal
Figure 8 - Receiver Signal Detect Timing Diagram
Transceiver Module Signals
The pluggable parallel optical transceiver uses a 100 position FCI MegArray electrical connector
(FCI PN: 84513-101), and an industry standard MTP(MPO) optical receptacle compliant with
IEC 61754-7.
K
J
H
G
F
E
D
C
B
A
DOUT00-
VEE Rx
DOUT03+
VEE Rx
VEE Rx
VEE Tx
VEE Tx
DIN03-
VEE Tx
DIN00+
1
2
DOUT00+
VEE Rx
DOUT01+
DOUT01-
VEE Rx
VCCB Rx
NIC
VEE Rx
VEE Rx
VEE Rx
VEE Rx
VEE Rx
VCCB Rx
DNC
DOUT03-
VEE Rx
DOUT02-
DOUT02+
VEE Rx
VCCB Rx
DNC
VEE Rx
VEE Rx
NIC
VEE Rx
VEE Rx
NIC
VEE Tx
VEE Tx
NIC
VEE Tx
VEE Tx
NIC
DIN03+
VEE Tx
DIN02+
DIN02-
VEE Tx
VCC Tx
DNC
VEE Tx
VEE Tx
VEE Tx
VEE Tx
VEE Tx
VCC Tx
DNC
DIN00-
VEE Tx
DIN01-
DIN01+
VEE Tx
VCC Tx
DNC
3
4
NIC
NIC
NIC
NIC
5
NIC
NIC
NIC
NIC
6
NIC
NIC
NIC
NIC
7
DNC
SD
RX_EN
SQ_EN
NIC
TX_DIS
RESET
NIC
TX_EN
FAULT
NIC
8
NIC
DNC
DNC
DNC
DNC
DNC
9
VCCA Rx
VCCA Rx
VEE Rx
NIC
VEE Tx
VCC Tx
VCC Tx
10
Table 2 - Transceiver Pinout Assignments (Top view, toward MPO/MTP connector end)
(10x10 array, 1.27 mm pitch)
Module front view - MTP key up
Tx0
Tx1
Tx2
Tx3
−
−
−
−
Rx3
Rx2
Rx1
Rx0
Host printed circuit board
Table 3 - Transceiver Optical Channel Assignment
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Zarlink Semiconductor Inc.
ZL60304
Data Sheet
Transceiver Pin Description
The transceiver module case is electrically isolated from Transmitter signal common and Receiver signal common.
Connection through mounting screw holes or frontplate whichever is applicable. Make the appropriate electrical
connection for EMI shield integrity.
Signal Name
Type
Description
Comments
DIN[0:3] +/-
Data input Transmitter data in, channel 0 to 3
Internal differential
termination at 100 Ω.
VCC Tx
VEE Tx
Transmitter power supply rail
Transmitter signal common. All transmitter
voltages are referenced to this potential unless
otherwise stated.
Directly connect these pads
to the PC board transmitter
signal ground plane.
TX_EN
TX_DIS
Control
input
Transmitter enable.
Active high, internal pull-up.
See Table 1.
HIGH: normal operation
LOW: disable transmitter
Control
input
Transmitter disable.
Active high, internal pull-
down. See Table 1.
HIGH: disable transmitter
LOW: normal operation
FAULT
Status
output
Transmitter fault.
When active, all channels
are disabled. Clear by reset
HIGH: normal operation
LOW: laser fault detected on at least one channel signal. Internal pull-up.
RESET
Control
input
Transmitter reset.
Internal pull-up.
HIGH: normal operation
LOW:reset to clear fault signal
DOUT[0:3] +/-
Data
Receiver data out, channel 0 to 3.
output
V
CCA Rx
PIN preamplifier power supply rail.
Receiver quantizer power supply rail.
VCCB Rx
VEE Rx
Receiver signal common. All receiver voltages
are referenced to this potential unless otherwise
stated.
Directly connect these pads
to the PC board receiver
signal ground plane.
RX_EN
RX_SD
SQ_EN
Control
input
Receiver enable.
Internal pull-up.
Internal pull-up.
Internal pull-up.
HIGH: normal operation
LOW: disable receiver
Status
output
Receiver signal detect.
HIGH: valid optical input on all channels
LOW: loss of signal on at least one channel
Control
input
Squelch enable.
HIGH: squelch function enabled. Data OUT is
squelched on any channels that have loss of
signal
LOW: squelch function disabled
DNC
NIC
Do not connect to any potential, including ground.
No internal connection.
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Zarlink Semiconductor Inc.
ZL60304
Data Sheet
VCCA and VCCB Rx can be connected to the same power supply. However, to insure maximum receiver sensitivity
and minimize the impact of noise from the power supply, it is recommended to keep the power supplies separate
and to use the recommended power supply filtering network on VCCARx, see Figure 2.
Handling Instructions
Cleaning the Optical Interface
A protective connector plug is supplied with each module. This plug should remain in place whenever a fiber cable
is not inserted. This will keep the optical port free from dust or other contaminants, which may potentially degrade
the optical signal. Before reattaching the connector plug to the module, visually inspect the plug and remove any
contamination. If the module’s optical port becomes contaminated, it can be cleaned with high-pressure nitrogen
(the use of fluids, or physical contact, is not advised due to potential for damage).
Before a fiber cable connector is attached to the module, it is recommended to clean the fiber cable connector
using an optical connector cleaner, or according to the cable manufacturer's instructions. It is also recommended to
clean the optical port of the module with high-pressure nitrogen.
Connectors
For optimum performance, it is recommended that the number of insertions is limited to 50 for the electrical
MegArray connector and 200 for the optical MPO/MTP connector.
ESD Handling
When handling the modules, precautions for ESD sensitive devices should be taken. These include use of ESD
protected work areas with wrist straps, controlled work-benches, floors etc.
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Zarlink Semiconductor Inc.
ZL60304
Data Sheet
Link Reach
The following table lists the minimum reach distance of the pluggable parallel fiber optic transceiver for different
multi-mode fiber (MMF) types and bandwidths based on the Gigabit Ethernet link model version 2.3.5. Each case
allows for a maximum of 2 dB per channel connection loss for patch cables and other connectors and assumes
worst case on all input parameters.
Fiber Type
Modal Bandwidth ReachDistance ReachDistance ReachDistance
@ 850 nm
@ 2.5 Gbps
@ 2.7 Gbps
@ 3.125 Gbps
[core / cladding µm]
[MHz*km]
[m]
[m]
[m]
50/125 MMF
50/125 MMF
400
500
260
300
230
270
80
90
Table 4 - Link Reach for Different Fiber Types and Data Rates
Longer operating distance than the range specified here can be achieved using transmitters, receivers and / or
cables meeting specification but performing better than worst case.
Link Model Parameters
The link reaches above have been calculated using the following link model parameters and Gigabit Ethernet link
model version 2.3.5 (filename: 5pmd047.xls).
Parameter
Mode partition noise k-factor
Symbol
Value
Unit
k
0.3
0.3
Modal noise
MN
SO
UO
αdB
C1
Q
dB
ps/nm2*km
nm
Dispersion slope parameter
Wavelength of zero dispersion
Attenuation coefficient at 850 nm
Conversion factor
0.11
1320
3.5
dB/km
ns.MHz
480
7.04
0.3
Q-factor [BER 10-12
]
TP4 eye opening
UI
UI
DCD allocation at TP3
RMS baseline wander S.D.
RIN coefficient
DCD DJ
σBLW
kRIN
0.08
0.025
0.70
329
Conversion factor
c_rx
ns.MHz
15
Zarlink Semiconductor Inc.
ZL60304
Data Sheet
Electrical Interface - Application Examples
Recommended CML output
Transmitter CML input
Host PCB
100nF
100nF
ZOUT=100
Ω
ZIN=100
Ω
Z0=100
Ω
Differential
Differential
Differential
Figure 9 - Recommended Differential CML Input Interface
Receiver CML output
Recommended CML input
Host PCB
100nF
100nF
ZTERM=100
Ω
Z0=100
Ω
Differential
Differential
ZL
Figure 10 - Recommended Differential CML Output Interface
Trademarks
Infiniband is a registered trademark of the InfiniBand Trade Association.
MTP is a registered trademark of US Conec Ltd.
The MegArray is a registered trademark of FCI.
16
Zarlink Semiconductor Inc.
NOTES:-
A1
A10
n0,58
`0,05
n0,05
A B-C
j
1. All dimensions in mm.
A
C
2. Tolerancing per ASME Y14.5M-1994.
18,16
7,48
2-56 UNC-2B
n2,5
n0,15m
n0,15m
A B-C
A B-C
j
n3,63
n1,3
n0,15m
n0,15m
A
j
j
j
2-56 UNC-2B
B
3,50 Deep MIN
A B-C
36,87
27,64
FRONT VIEW ( 2 : 1 )
14,4
30,23
31,75
Projection Method
© Zarlink Semiconductor 2002. All rights reserved.
ISSUE
Package code
Drawing type
MJ
3
JS004296 rev.3
1
2
Previous package codes
JS004296R1A JS004296 rev.2
ACN
Package Drawing - Module Layout
12-JUN-03
DATE
APPRD.
24-JAN-04 24-JAN-05
Title
TD/BE MD/MA MD/MA
JS004296
17,5
14,4
(n2,69 `0,12 Hole)
n0,1 A B-C
j
Max product outline
Component keep-out area.
n1,70 `0,12 Holes
n0,1
A B-C
j
n3,00 MIN pads, Keep Out
n0,1 A B-C
j
K1
A1
n0,58 `0,05 Pads
n0,05
A B-C
j
A10
K10
n2,69 `0,12 Hole
n0,1 A
j
n4,30 MIN pads (3x), Keep Out
n0,1
A B-C
j
C
B
A
1,145
13,72
NOTES:-
1. All dimensions in mm.
2. Tolerancing per ASME Y14.5M-1994.
Projection Method
© Zarlink Semiconductor 2002. All rights reserved.
Package code
Drawing type
MJ
2
ISSUE
ACN
3
1
Previous package codes
Package Drawing,
JS004296R1A JS004296 rev.2
JS004296 rev.3
14-FEB-05
MD/MA
Host Circuit Board Footprint Layout
24-JAN-05
DATE
APPRD.
12-JUN-03
Title
TD/BE
MD/MA
JS004296
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