ZL70008

更新时间:2024-09-18 05:36:23
品牌:ZARLINK
描述:Medical Surge Protection Devices

ZL70008 概述

Medical Surge Protection Devices 医疗浪涌保护器件

ZL70008 数据手册

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ZL70002/08/09/10  
Medical Surge Protection Devices  
Data Sheet  
July 2003  
Features  
Extremely fast turn-on  
Ordering Information  
Very small size and very low leakage  
5, 6 and 7 terminals available  
ZL70002/UDJ Bumped Die, Waffle Tray  
ZL70008/UDJ Bumped Die, Waffle Tray  
ZL70009/UDJ Bumped Die, Waffle Tray  
ZL70010/UDJ Bumped Die, Waffle Tray  
0 to +55°C  
Standard delivery form: solder bumped die  
Facilitates compliance with EN-45502 and EN-  
50061  
Description  
Superior Quality  
The ZL70002/08/09/10 family are high performance  
surge protection devices targeted for medical  
applications.  
QA procedures based on MIL-PRF-38535  
Traceability for every chip to lot and wafer  
number  
100% burn-in capability  
Applications  
Pacemakers, Implantable Cardioverter  
Defibrillators (ICDs), Neurostimulators, Bladder  
Control Devices  
Medical devices with electronics requiring  
protection against a high voltage surge  
Rb  
Rb  
Rb  
Rb  
Rb  
Rb  
T4  
T3  
T1  
T2  
T5  
T6  
Figure 1 - ZL70010 Block Diagram  
1
Zarlink Semiconductor Inc.  
ZL70002/08/09/10  
Data Sheet  
Rb  
Rb  
Rb  
Rb  
Rb  
Rb  
Rb  
T4  
T7  
T3  
T1  
T2  
T5  
T6  
Figure 2 - ZL70002 Block Diagram  
Pin Description Table - ZL70010 and ZL70002  
Pin # In/Output  
Name  
Description  
Transient Surge Protection Terminal 1  
1
2
3
4
5
6
7
I
I
I
I
I
I
I
T1  
T2  
T3  
T4  
T5  
T6  
T7  
Transient Surge Protection Terminal 2  
Transient Surge Protection Terminal 3  
Transient Surge Protection Terminal 4  
Transient Surge Protection Terminal 5  
Transient Surge Protection Terminal 6  
Transient Surge Protection Terminal 7 (ZL70002 only)  
ZL70010  
ZL70002  
T1  
T2  
T3  
T4  
T5  
T6  
T1  
T2  
T3  
T4  
T5  
T6  
T7  
Figure 3 - ZL70010 and ZL70002 Bumped Chip Appearance  
2
Zarlink Semiconductor Inc.  
Data Sheet  
ZL70002/08/09/10  
Rb  
Rb  
Rb  
Rb  
Rb  
T1  
T2  
SUB1  
T3  
SUB2  
T5  
T4  
Figure 4 - ZL0008/ZL0009 Block Diagram  
Pin Description Table - ZL0008 and ZL0009  
Pin # In/Output  
Name  
Description  
Transient Surge Protection Terminal 1  
1
2
3
4
5
6
7
I
T1  
T2  
I
Transient Surge Protection Terminal 2  
I/O  
SUB1  
T3  
Transient Surge Protection Substrate Connection 1  
Transient Surge Protection Terminal 3 Doubled Area  
Transient Surge Protection Substrate Connection 2  
Transient Surge Protection Terminal 4  
I
I/O  
I
SUB2  
T4  
I
T5  
Transient Surge Protection Terminal 5  
ZL70008  
ZL70009  
T1  
T2  
SUB1 T3  
SUB2  
T4  
T5  
T1 T2  
SUB1  
T3  
SUB2  
T4  
T5  
Figure 5 - ZL70008 and ZL70009 Bumped Chip Appearance  
3
Zarlink Semiconductor Inc.  
ZL70002/08/09/10  
Data Sheet  
1.0  
Functional Description  
The ZL70002/08/09/10 is a family of transient surge suppressing devices designed specifically for implanted medical  
devices. The device terminals have an extremely low leakage during normal voltages and can therefore be  
connected in parallel with the pins of the device it protects. When the voltage rises to dangerous level it then rapidly  
turns on and limits the voltage by shunting the current through its thyristors. This makes the ZL70002/08/09/10  
family an effective means of compliance with international regulations EN-45502, “Active implantable” and the EN-  
50061 “Safety of Implantable Cardiac Pacemakers”.  
1.1  
ZL70010  
ZL70010 is a six-branch device.The suppression is achieved by a self-triggering thyristor-diode device in parallel  
with a diode between each branch-input and a common node which also is the substrate of the device. The six  
branches of the device are reached through terminals T1, T2, T3, T4, T5 and T6. The electrical characteristic  
observed between any two of the terminals (T1, T2, T3, T4, T5 and T6) very much resembles that of a DIAC, see  
Figure 12.  
When a transient current is forced between two branch-input terminals, the positive terminal will be clamped to the  
common node by the diode of one branch and the negative terminal to the forward voltage of the thyristor-diode of  
the other branch. Due to the low on-state voltage of the thyristor that voltage will stay at a safe value during the  
transient.  
1.2  
ZL70002 is a seven-branch device with exactly the same electrical characteristics as ZL70010.  
1.3 ZL70008 and ZL70009  
ZL70002  
ZL70008 and ZL70009 are five-branch transient surge suppressing with the same functionality as ZL70010. The  
only functional difference is that the substrate of the device is accessible through the two terminals SUB1 and SUB2.  
4
Zarlink Semiconductor Inc.  
Data Sheet  
ZL70002/08/09/10  
2.0  
Application  
According to the EN-45502 standard, all active medical devices intended for implantation in a human torso should  
not be permanently affected by an external defibrillation of the patient. Compliance is confirmed if the implanted  
device continues to meet device specification after being subjected to a sequence of 140 Volt pulses in series with  
a 300 Ohm resistor between each conductive part of the device including the device case (see EN-45502 for  
details). Using the ZL70002/08/09/10 protects the implantable device and is an effective means of compliance with  
the EN-45502 standard where the electronics, in almost all cases, would be destroyed if not protected. The same  
compliance tests are also described in EN-50061.  
In the application example shown in Figure 6, each of the dual chamber pacemaker's terminals and case are  
connected to a terminal on the protection device. If a defibrillation pulse causes the ventricular tip to begin to go  
positive, relative to the case, the ZL70008/9 thyristor structure rapidly becomes active and forms a low impedance  
path between T2 and T3 to absorb the current and limit the voltage. This provides an effective means of protection  
to the pacemaker chip. In actuality, the voltages and currents the implanted device is subjected to in an actual  
defibrillation can be higher than described in EN-45502/EN-50061 and has been taken into account when designing  
the ZL70002/08/09/10 family.  
Surge Protection Device  
Typical Dual Chamber Pacemaker  
ZL70008/09  
T2  
T3  
T5  
T4  
T1  
Digital  
chip  
Analog chip  
Atrial tip lead  
Atrial ring lead  
Case  
Charge  
Pump  
Stimulation  
and  
Sensing  
block  
Ventricular tip lead  
Ventricular ring lead  
Voltage  
and  
Current  
Reference  
Figure 6 - Pacemaker Application Example  
Terminals placed most remotely to others should get special attention since they effectively form a large pick-up  
coil and could therefore be exposed to a large amount of current. When implanted, the pacemaker case is placed  
beneath the collarbone and all other terminals are placed together inside the heart. For this reason, the largest  
current will pass through the surge protection terminal connected to the case of the pacemaker. For ZL70008/9, we  
recommend that the case be connected to T3 of the protection device which is designed to be able to withstand the  
largest amount of current. If device ZL700010 is used in a 5 terminal application, we recommend that 2 pins of the  
protection device be connected to the implantable device terminal with the largest current flow (typically the terminal  
for the device case).  
5
Zarlink Semiconductor Inc.  
ZL70002/08/09/10  
Data Sheet  
2.1  
Mechanical Data - ZL70010  
185 + 5 um  
650 + 5 um  
300 + 25 um  
4064 + 20 um  
Figure 7 - Size and Bump Placement of ZL70010  
Mechanical Data - ZL70002  
2.2  
185 + 5 um  
650 + 5 um  
300 + 25 um  
4700 + 20 um  
Figure 8 - Size and Bump Placement of ZL70002  
6
Zarlink Semiconductor Inc.  
Data Sheet  
ZL70002/08/09/10  
2.3  
Mechanical Data - ZL70008 and ZL70009  
Note that the bump pattern for ZL70008 and ZL70009 differ slightly as shown in Figure 5. Figure 9 depicts ZL70008.  
186 + 5 um  
342 + 5 um  
559 + 5 um  
516 + 5 um  
372 + 35 um  
4454 + 20 um  
Figure 9 - Size and Bump Placement of ZL70008 and ZL70009  
Sn/Pb 63/37  
o 125 + 22 um  
AL  
Barrier layers  
Si3N4  
o 66 um  
o 92 um  
Figure 10 - Bump Appearance of ZL70002/08/09/10  
7
Zarlink Semiconductor Inc.  
ZL70002/08/09/10  
Absolute Maximum Ratings*  
Parameter  
Data Sheet  
Sym  
Min  
Max  
125  
125  
Units  
°C  
Test Conditions  
1
2
Storage Temperature range  
T
S
-40  
Maximum junction  
temperature  
T
°C  
j
3
Maximum surge current  
ITSM  
8
A
Test according to Figure 11.  
tp for flip mounted chips with underfill:  
10 ms  
4
Continuous power dissipation  
Pmax  
300  
mW  
t>1 s  
*Exceeding these values may cause permanent damage. Functional operations under these conditions is not implemented  
Recommended Operating Conditions  
1
Parameter  
Sym  
Min  
Typ  
Max  
Units  
Test Conditions  
5
Operating temperature  
range  
T
0
37  
55  
°C  
OP  
1) Typical figures are at 37 degrees C and are for design only.  
1
DC Electrical Characteristics  
2
Parameter  
Sym  
Min  
Typ  
Max  
Units  
Test Conditions  
6
Forward breakdown  
voltage, Zener diode,  
terminal to terminal  
ZL70002/10  
ZL70008  
Vfz  
Vfz  
Vfz  
9.0  
9.5  
9.0  
10.1  
10.5  
9.5  
11.0  
13.5  
12.2  
V
V
V
Iz=10µA  
Iz=10µA  
Iz=10µA  
ZL70009  
7
8
Forward breakdown  
voltage, Zener diode,  
terminal to substrate  
ZL70008  
ZL70009  
Vfz  
Vfz  
9.0  
8.5  
10.2  
9.2  
12.8  
11.5  
V
V
Iz=10µA  
Iz=10µA  
Breakover voltage,  
terminal to terminal  
ZL70002/10  
ZL70008  
Vbo  
Vbo  
Vbo  
9.0  
9.5  
9.0  
11.2  
11.6  
10.5  
12.2  
13.5  
12.2  
V
V
V
Figure 12  
Figure 12  
Figure 12  
ZL70009  
9
Breakover voltage,  
terminal to substrate  
ZL70008  
ZL70009  
Vbo  
Vbo  
9.0  
8.5  
11.0  
9.8  
12.8  
11.5  
V
V
Figure 12  
Figure 12  
8
Zarlink Semiconductor Inc.  
Data Sheet  
ZL70002/08/09/10  
2
Parameter  
Sym  
Min  
Typ  
Max  
Units  
Test Conditions  
10  
11  
Forward diode voltage  
drop, substrate to  
terminal  
ZL70008/09  
Vfwd  
2
V
Measured @2A  
Breakover current  
ZL70002/10  
Ibo  
Ibo  
Ibo  
15  
28  
15  
60  
60  
40  
mA  
mA  
mA  
Figure 12  
Figure 12  
Figure 12  
ZL70008  
ZL70009  
12  
Holding current  
ZL70002/08/09/10  
Ih  
1
mA  
Measured after a current pulse  
of Ip=0.2A for tp=1ms,  
RG<200 Ω  
Figure 13.  
13  
14  
15  
16  
On-state voltage  
terminal to terminal  
ZL70002/08/09/10  
Von  
Ron  
Von  
Id  
2.2  
0.4  
1.0  
10  
3.0  
1
V
Measured with a 300 µs pulse,  
IT=1 A  
On-state dynamic  
resistance  
ZL70002/08/09/10  
Measured with a 300 µs pulse,  
dIT=1-2 A  
On-state voltage  
terminal to substrate  
ZL70008/09  
3.0  
100  
V
Measured with a 300 µs pulse,  
IT=1 A  
Off-state current  
terminal to terminal  
ZL70002/08/09/10  
nA  
Measured at 8.5 V  
(ZL70002/09/10) and at 9.0 V  
(ZL70008)  
17  
Off-state current  
terminal to substrate  
ZL70008/09  
Id  
10  
100  
nA  
Measured at 8.5 V (ZL70008)  
and at 8.0 V (ZL70009)  
18  
19  
Parasitic capacitance  
ZL70002/10  
Cp  
Cp  
50  
pF  
pF  
Parasitic capacitance  
ZL70008/09  
200  
1) Electrical Characteristics are over Recommended Operating Conditions unless otherwise stated.  
2) Typical figures are at 37 degrees C and are for design only  
9
Zarlink Semiconductor Inc.  
ZL70002/08/09/10  
Data Sheet  
1
AC Electrical Characteristics  
2
Parameter  
Sym  
Min  
Typ  
Max  
Units  
Test Conditions  
20  
Turn-on delay  
ZL70002/10  
t ond  
500  
700  
ns  
Measured at 8.0 V (ZL70002/09/10)  
and at 8.5 V (ZL70008)  
and defined according to Figure 14.  
ZL70008  
ZL70009  
t ond  
t ond  
140  
60  
200  
100  
ns  
ns  
21  
Maximum voltage  
during surge  
ZL70002/08/10  
Vpeak  
Vpeak  
13  
11  
15  
13  
V
V
Measured at peak and defined  
according to Figure 14.  
ZL70009  
Measured at peak and defined  
according to Figure 14.  
1) Electrical Characteristics are over Recommended Operating Conditions unless otherwise stated.  
2) Typical figures are at 37 degrees C and are for design only.  
I
Slewrate= 4 A/µs  
ITSM  
0.9xITSM  
0.1xITSM  
t
tp  
Figure 11 - 10 ms Surge Current Waveform  
I
IT  
Ibo  
Ih  
Ifz  
Id  
U
V
bo  
Von  
Vfz  
Vd  
Figure 12 - Terminal to Terminal Characteristic  
10  
Zarlink Semiconductor Inc.  
Data Sheet  
ZL70002/08/09/10  
Rg  
Vg  
DUT  
Ip  
+
-
Figure 13 - Holding Current Circuit  
VT  
Vpeak  
Ip= 4 A  
Vfzmin  
dI/dt = 4A/us  
t ond  
t
Figure 14 - Turn-on Delay Definition  
11  
Zarlink Semiconductor Inc.  
For more information about all Zarlink products  
visit our Web Site at  
www.zarlink.com  
Information relating to products and services furnished herein by Zarlink Semiconductor Inc. or its subsidiaries (collectively “Zarlink”) is believed to be reliable.  
However, Zarlink assumes no liability for errors that may appear in this publication, or for liability otherwise arising from the application or use of any such  
information, product or service or for any infringement of patents or other intellectual property rights owned by third parties which may result from such application or  
use. Neither the supply of such information or purchase of product or service conveys any license, either express or implied, under patents or other intellectual  
property rights owned by Zarlink or licensed from third parties by Zarlink, whatsoever. Purchasers of products are also hereby notified that the use of product in  
certain ways or in combination with Zarlink, or non-Zarlink furnished goods or services may infringe patents or other intellectual property rights owned by Zarlink.  
This publication is issued to provide information only and (unless agreed by Zarlink in writing) may not be used, applied or reproduced for any purpose nor form part  
of any order or contract nor to be regarded as a representation relating to the products or services concerned. The products, their specifications, services and other  
information appearing in this publication are subject to change by Zarlink without notice. No warranty or guarantee express or implied is made regarding the  
capability, performance or suitability of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute  
any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user’s responsibility to fully determine the performance and  
suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. Manufacturing does  
not necessarily include testing of all functions or parameters. These products are not suitable for use in any medical products whose failure to perform may result in  
significant injury or death to the user. All products and materials are sold and services provided subject to Zarlink’s conditions of sale which are available on request.  
Purchase of Zarlink’s I2C components conveys a licence under the Philips I2C Patent rights to use these components in and I2C System, provided that the system  
conforms to the I2C Standard Specification as defined by Philips.  
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Copyright Zarlink Semiconductor Inc. All Rights Reserved.  
TECHNICAL DOCUMENTATION - NOT FOR RESALE  

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